DE102015116047B4 - Test device and control method for a test device - Google Patents

Abstract

Inspection device (1), comprising:an image recording device (110);a projection device (112) for projecting a sample image (51) into a field of view (41) of the image recording device (110);an information processing device (13) for carrying out an inspection of at least one object enclosed in the field of view (41) of the image recording device (110) using an image which was photographed by means of the image recording device (110) while projecting a sample image (51) through the projection device (112); and a control device (12) for controlling the image recording device (110) and the projection device (112); characterized in that the control device (12) is designed to, when a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), which can produce a secondary reflection caused by light reflected on a reflection surface of another object (43), carry out a control for changing the projection area of a pattern image (51) to be projected by the projection device (112) in such a way that no light hits the reflection surface, and for photographing the secondary reflection object (42a) by means of the image recording device (110) while projecting the pattern image (52-56) with the changed projection area, wherein the test device (1) further comprises a storage device (3) for storing a test program which contains information for determining a secondary reflection object (42a) among several to be objects to be checked;wherein the control device (12) is set up to judge on the basis of the test program whether a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), wherein the test program contains information about a recording condition when photographing a secondary reflection object (42a), wherein the control device (12) is set up to carry out the change in the projection area of the pattern image (51) to be projected when photographing the secondary reflection object (42a) on the basis of the information about the recording condition,wherein the control device is further set up, when a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), to carry out a control which changes the position of the secondary reflection object (42a) within the field of view (41) of the image recording device (110) such that the secondary reflection object (42a) has a predetermined position within the field of view (41) the image recording device (110) in order to then photograph the secondary reflection object (42a) by means of the image recording device (110) by projecting the pattern image (52-56) with the changed projection area, wherein the predetermined position is the center of the field of view (41) of the image recording device (110).

Description

TECHNICAL FIELD

The invention relates to an inspection apparatus for inspecting an object using an image taken in the state with a pattern image projected onto the object in question.

TECHNICAL BACKGROUND

Research into methods for measuring the three-dimensional shape of objects using images is state of the art. For example, in methods known as active triangulation methods or active stereo methods, photographs are taken while a pattern image (stripe pattern, dot pattern, etc.) is being projected onto an object using a projector in order to capture the three-dimensional information of the object by analyzing changes in the pattern or luminance that occur depending on the unevenness of the object's surface. Examples of active triangulation methods that have been practically implemented include the phase shift method, the spatial coding method, and others.

In these methods, the phenomenon can occur that light reflected from an object reduces the measurement accuracy for other objects in the surrounding area. This phenomenon is to be considered with reference to 12 be explained. 12 shows a measuring system using an image recording device 200 and a projector 201. Light 201L, which has a specific pattern, is projected from the projector 201 onto an object 202 and the projection pattern reflected on the surface of the object 202 is photographed with the image recording device 200. The distortion of the pattern resulting from the surface unevenness of the object 202 becomes visible in the image photographically recorded with the image recording device 200 in the form of luminance changes. This makes it possible to determine the positional relationship between the projector 201, a point on the surface of the object 202 and the image recording device 200 on the basis of the luminance changes in the image and to infer the height (three-dimensional position) of the surface of the object 202.

However, if, as in 12 shown, in the vicinity of the object 202 there is a tall object 203, it happens that side surfaces of the object 203 reflect the light 201L of the projector 201 in a specular or scattering manner, so that the resulting reflection light shines on the surface of the object 202. This then leads to the light that reaches the image recording device 200 from the surface of the object 202 not only containing reflection light 201R of the light 201L of the projector 201 (primary reflection light), but also reflection light 203R of the light 203L coming from the object 203 (secondary reflection light). Since this secondary reflection light 201R is superimposed on the projection pattern on the surface of the object 202 as a disturbance, it adversely affects the analysis of the projection pattern and causes measurement errors. In the present description, an object capable of producing a secondary reflection caused by light reflected from another object (eg, object 202 in 12 ) is referred to as a "secondary reflection object", while the object which produces the reflected light causing the secondary reflection (eg, the object 203) is referred to as a "cause object". Furthermore, luminance changes of the projection pattern caused by such secondary reflection are referred to as "secondary reflection disturbances".

As a measure against secondary reflection noise, Patent Document 1 proposes a method of performing more accurate measurement of a surface shape by irradiating pattern images from two or more directions to eliminate shadow defects, specular defects, etc. based on measurement accuracy (reliability) for each direction. However, this conventional method only attempts to reduce the influence of noise by combining measurement results from different directions, and does not fundamentally eliminate the occurrence of secondary reflection noise. Consequently, in environments where secondary reflection occurs, no matter which direction a pattern image is irradiated from (for example, when many tall objects exist around), it is difficult to eliminate the influence of secondary reflection noise using conventional methods.

The JP 2012 - 112952 A is an example of a prior art document.

WO 2014 / 149 701 A1 discloses a non-contact optical three-dimensional measuring device comprising: a projector, a first camera, and a second camera; a processor electrically coupled to the projector, the first camera, and the second camera; and a computer readable medium that, when executed by the processor, causes the first digital signal to be acquired at a first time and the second digital signal to be acquired at a second time different from the first time, and three-dimensional coordinates of a first point on the surface based at least in part on the first digital signal and the first distance is determined and three-dimensional coordinates of a second point on the surface are determined based at least in part on the second digital signal and the second distance.

US 5 815 275 A discloses a method and system for three-dimensional imaging of objects, including integrated circuit interconnections and many other microelectronic assemblies and miniature parts, used to significantly improve the efficiency of triangulation-based laser scanning systems. A scanning beam impinges on the X,Y inspection plane at a normal angle, with the scan line oriented at a 45° angle diagonal to an axis defining a first direction of motion. The motion of the imaging head along the axis is used to acquire line scan images in the non-orthogonal coordinate system having symmetry about the orthogonal axes of motion.

US 5 812 269 A discloses a triangulation-based method and system for rapid 3D and grayscale imaging and associated preprocessing of digitized information which enables estimation or filtering of height and grayscale values based on the confidence level of the information obtained from a pair of sensors and knowledge of the structure of the object and its reflective properties. A modulated laser beam is scanned across the object to produce a plurality of points which are viewed by a pair of well-matched receivers. Each receiver includes a light collection and transmission system, a position-dependent detector, and an associated ratiometric signal processor or similar means for extracting height and intensity information or data by triangulation. An optional automatic light control system provides greatly extended dynamic range with control inputs derived from a gain detector included in each receiver to maximize the occurrence of valid data points. Prior to image processing, each point in the digitized 3D and grayscale data is transformed based on the digital values of the grayscale and elevation values. Multi-channel point-wise transformation produces an improved estimate of intensity and elevation at a point of interest or is used to filter the data to achieve improvements in 3D and grayscale contrast prior to image processing and measurement analysis. Linear or non-linear transformations are used depending on the agreement between 3D and grayscale values and other conditions that determine the confidence level of the information.

DE 10 2008 036 710 A1 discloses a method and a measuring system for three-dimensional measurement of objects using a topometric measuring method, in which images of an object together with a projection pattern projected onto the object by a projector are recorded with an image recording unit and evaluated with an image evaluation unit. In the method, partial areas of the object are selected in such a way that reflections of the projection pattern on the surface of the object do not influence the projection pattern in this partial area and the projection pattern can be projected one after the other, limited to the selected partial areas of the object, by appropriately controlling an image projection unit of the projector and recording the object together with the projection pattern projected there, at least in the respective selected partial area.

US 2014/0 118 539 A1 discloses a system in which a dark region is set as a region onto which no light is projected from a light projection unit. Disturbing light projected onto a measurement object is estimated from the set dark region. A captured image is corrected based on the estimated disturbing light. The distance to the measurement object is calculated from the corrected captured image.

JP 2006 - 275 529 A discloses a grid pattern projection method for ensuring that the three-dimensional shape of the measurement object is always measured accurately and efficiently. With respect to a plane on which a plurality of measurement objects are arranged, the projection unit projects the grid pattern obliquely from the side. This pattern is then captured by the image acquisition unit, and the captured two-dimensional image is stored in the image memory. The data processing unit analyzes these images to measure the three-dimensional shape of the measurement objects. The projection unit masks areas outside the measurement areas of certain measurement objects on the plane to ensure that no grid pattern is projected in these areas while generating the grid pattern by liquid crystal grids.

US 2014 / 0 078 490 A1 discloses an information processing device comprising at least one projection unit configured to project a light pattern onto a measurement object, at least one image recording unit configured to record an image of the measurement object with the light pattern projected thereon, a measuring unit configured to determine a distance from the at least one projection unit or image recording unit to the measurement object based on the light pattern generated by the at least one image recording unit. measuring unit, a determination unit configured to determine whether a measured distance is valid, and a control unit configured to reduce the luminosity of a light pattern included in a projected light pattern projected onto an area for which the measured distance is determined to be valid by the determination unit.

The present invention has been made in view of the above-described facts, and aims to provide technology for suppressing secondary reflection noise in an inspection apparatus for inspecting an object using an image taken in the state with a pattern image projected onto the object in question, thereby enabling highly reliable measurements and inspections.

SUMMARY OF THE INVENTION

In order to achieve the above object, the following structure is adopted. A test apparatus according to the present invention comprises the features of claim 1.

According to this structure, when a secondary reflection object is present within the field of view of the image pickup device, the projection range of the pattern image is changed so that no light (pattern image) is incident on the reflection surface of the cause object causing the secondary reflection. This makes it possible to suppress the generation of secondary reflection noise, so that projection patterns on a test object can be correctly photographed (observed) and the accuracy of measurement and inspection of the test object can be improved.

Furthermore, a storage device is provided for storing an inspection program containing information for detecting a secondary reflection object among a plurality of objects to be inspected, wherein the control device judges whether a secondary reflection object is present in the field of view of the image pickup device based on the inspection program. By preparing such an inspection program in advance and setting it in the inspection device, the detection of a secondary reflection object in the field of view can be carried out easily and correctly, so that a shortening of the procedure time of measurement and inspection and an improvement in accuracy can be achieved.

The inspection program contains information on a shooting condition when photographing a secondary reflection object, and the control device carries out the change of the projection range of the pattern image to be projected when photographing the secondary reflection object based on the information on the shooting condition. By setting shooting conditions for individual secondary reflection objects in the inspection device in this way, the control of the change of the projection range to suppress secondary reflection can be carried out easily and correctly, so that a shortening of the procedure time of measurement and inspection and an improvement in accuracy can be achieved.

Preferably, there is further provided a pattern image storage unit which stores data for a plurality of pattern images having different projection ranges in advance, wherein the control means, when a secondary reflection object is present in the field of view of the image pickup means, selects a pattern image which includes the secondary reflection object in the projection range but does not include the reflection surface in the projection range from the plurality of pattern images stored in the pattern image storage unit, and changes the pattern image to be projected by the projection means to the selected pattern image. Holding the data of the pattern images makes it possible to simplify the switching procedure for the pattern images (compared to generating the pattern images each time).

For example, in a case where a secondary reflection object is located in the center of the field of view and a case where a secondary reflection object is located at the edge of the field of view, it can be said that the projection range of the pattern image must be changed. However, when it is a matter of preparing pattern images for each position within the field of view, the number of pattern images becomes enormous and a large storage capacity must also be secured in the pattern image storage unit, which leads to an increase in the cost of the device. When a secondary reflection object is present in the field of view of the image pickup device, control is performed by the control device which changes the position of the secondary reflection object within the field of view of the image pickup device so that the secondary reflection object assumes a predetermined position within the field of view of the image pickup device and then photographs the secondary reflection object by means of the image pickup device while projecting the pattern image with the changed projection range. If it is ensured in this way that a secondary reflection object is aligned with a predetermined position within the field of view, it is sufficient to create pattern images only for different Preparing sizes and different shapes - Preparing pattern images for different positions is unnecessary. In other words, the same pattern images can be uniformly used for secondary reflection objects having substantially the same size and shape. Consequently, the number of pattern images to be kept ready can be reduced greatly, which also enables a reduction in the storage capacity of the pattern image storage unit. The present structure is particularly effective when the number of pattern images that can be stored in advance in the projection device is limited.

The predetermined position is the center of the field of view of the image pickup device. At the center of the field of view of the image pickup device, the aberration of the optical system of the image pickup device is the smallest. In addition, since it is common to make the projection center of the projection device coincide with the area of the center of the field of view of the image pickup device, at the center of the field of view of the image pickup device, the distortion of the projection pattern (distortion due to the aberration of the optical system of the projection device) also becomes minimal. Consequently, further improvement in measurement and inspection accuracy can be expected by performing projection and image pickup after the secondary reflection object is coincident with the center of the field of view of the image pickup device.

Preferably, when a secondary reflection object is present in the field of view of the image pickup device, the control device generates a pattern image which includes the secondary reflection object in the projection area but does not include the reflection area in the projection area, based on information about the position and size of the secondary reflection object or the reflection surface, and changes the pattern image to be projected by the projection device into the selected pattern image. This structure makes it possible to realize the optimum projection area according to the position and size of the secondary reflection object, so that an improvement in measurement and inspection accuracy can be expected. Furthermore, a shortening of the procedure time can be achieved because it is not necessary to physically move the secondary reflection object or the pickup field of view.

It is preferable that the projection area of the pattern image projected by the projection device when a secondary reflection object is present in the field of view of the image pickup device is obtained by excluding the portion of the reflection surface from the projection area of an ordinary pattern image projected by the projection device when no secondary reflection object is present in the field of view of the image pickup device. This makes it possible to make the projection area as large as possible, so that the number of objects that can be measured with a single projection and image pickup can be made as large as possible. This makes it possible to achieve a shortening of the procedure time.

Another testing device according to the present invention comprises the features of claim 5.

According to this structure, in the case of photographing a secondary reflection object, the projection position of the pattern image is changed so that no light (pattern image) is incident on the reflection surface of the cause object causing the secondary reflection. This makes it possible to suppress the generation of secondary reflection noise, so that projection patterns on a test object can be correctly photographed (observed) and the accuracy of measurement and inspection of the test object can be improved.

Furthermore, a storage device is provided for storing an inspection program containing information for detecting a secondary reflection object among a plurality of objects to be inspected, wherein the control device judges whether an object to be photographed is a secondary reflection object based on the inspection program. By preparing such an inspection program in advance and setting it in the inspection device, the detection of a secondary reflection object can be carried out easily and correctly, so that a shortening of the procedure time of measurement and inspection and an improvement in accuracy can be achieved.

Further, the inspection program contains information on a shooting condition when photographing a secondary reflection object, and the control device adjusts the projection position of the pattern image when photographing the secondary reflection object based on the information on the shooting condition. By also setting shooting conditions for individual secondary reflection objects in the inspection device in this way, control of adjusting the projection position to suppress secondary reflection can be easily and correctly performed, so that a shortening of the procedure time of measurement and inspection and an improvement in accuracy can be achieved.

The test apparatus is preferably applicable to a circuit board test apparatus for testing components on a circuit board. In this case, the items to be tested are objects such as chip components or integrated circuits. The present invention enables highly reliable component measurement and testing by suppressing the generation of secondary reflection noise even when a secondary reflection causing object (eg a tall object such as a connector component) is present in the vicinity of the components to be tested.

It is noted that the present invention can be understood as a test device or circuit board test device that has at least some of the means or functions described above. The invention can also be understood as a test system that includes a test device or circuit board test device with at least some of the means or functions described above and a programming device for creating a test program that defines the operation of the test device or circuit board test device. Furthermore, the invention can also be understood as a test method or a control method for a test device, as a computer program for letting a computer carry out the steps of this method, or as a computer-readable storage medium on which the relevant computer program is stored in a non-volatile manner. All of the above structures and devices can be combined with one another to form the invention, as long as no technical contradiction arises.

The present invention makes it possible to realize highly reliable measurements and tests by suppressing secondary reflection noise in an inspection apparatus for inspecting an object using an image taken in the state with a pattern image projected onto the object in question.

SHORT DESCRIPTION OF THE CHARACTERS

• 1 Schematic diagram of the hardware structure of a printed circuit board test device
• 2 Flowchart of the sequence of a programming procedure
• 3 Flowchart of the measurement and testing process in a first embodiment
• 4 Diagram of the measurement and test procedure in the first embodiment
• 5 Example of a sample image in the first embodiment
• 6 Flowchart of the measurement and testing procedure in a second embodiment
• 7 Diagram of the measurement and test procedure in the second embodiment
• 8 Flowchart of the measurement and testing procedure in a third embodiment
• 9 Diagram of the measurement and test procedure in the third embodiment
• 10 Flowchart of the measurement and testing procedure in a fourth embodiment
• 11 Diagram of the measurement and test procedure in the fourth embodiment
• 12 Diagram explaining secondary reflection disturbances
• 13 Example of a phase image photographed after projecting a pattern image

EMBODIMENTS OF THE INVENTION

The present invention relates to technology for realizing highly reliable measurements and inspections by suppressing secondary reflection noise in an inspection apparatus for inspecting an object using an image taken in the state with a pattern image projected onto the object in question. The present invention is applicable to inspection apparatuses that use three-dimensional measurements based on active triangulation methods or active stereo methods, and is particularly preferably applicable to inspection apparatuses used in the field of FA (factory automation) or in the automotive field. Examples of inspections in the FA field include reject inspections, positioning inspections, label inspections, and visual inspections using image sensors (3D robot guides, 3D digitizers, industrial image sensors, etc.). Examples of inspections in the automotive field include tire geometry inspection using a shape measurement sensor.

Hereinafter, examples in which the invention was applied to a circuit board inspection apparatus in the FA field will be explained in detail as preferred forms of carrying out the present invention. However, the structure, operation, etc. of the apparatuses described in the following embodiments are not intended to limit the scope of the invention to only them, but are intended as examples.

<First Embodiment>

Hardware structure of a printed circuit board testing system

With reference to 1 The overall structure of a printed circuit board testing system according to a first embodiment of the invention will be explained. 1 shows a schematic view of the hardware structure of the circuit board inspection device. The circuit board inspection system comprises a circuit board inspection device 1 which uses photographed images to inspect the condition of components, solder, etc. on a circuit board, and a programming device or teaching device 2 for creating a program which the circuit board inspection device 1 uses at the time of inspection. The circuit board inspection device 1 is preferably used for visual inspection of circuit boards (eg for tombstone effect inspection after reflow) in a surface mounting assembly line.

The circuit board testing apparatus 1 comprises as main components a stage 10, a measuring unit 11, a control device 12, an information processing device 13, a display device 14 and a storage device (database) 3. The measuring unit 11 has an image recording device (image sensor) 110, an illumination device 111 and a projection device (projector) 112.

The stage 10 is a structure for holding a circuit board 15 and aligning solder 151 and a component 150 to be tested in a field of view of the image pickup device 110. With the X-axis and Y-axis parallel to the stage 10 and the Z-axis perpendicular to the stage 10, as shown in 1 As shown, the stage 10 is displaceable at least parallel to the two axes in the X and Y directions. The image recording device 110 is arranged with its optical axis parallel to the Z axis so that it photographs the circuit board 15 on the stage 10 from the normal direction. The image data recorded with the image recording device 110 are imported into the information processing device 13.

The lighting device 111 (111R, 111G, 111B) is a lighting means for irradiating illumination light (red light RL, green light GL, blue light BL) of different colors (wavelengths) onto the circuit board 15. 1 shows a schematic XZ section through the illumination device 111, which in reality has a circular or hemispherical shape in order to be able to illuminate with light of one and the same color from the full azimuth (all directions around the Z axis). The projection device 112 is a pattern projection means for projecting patterned light PL having a predetermined pattern onto the circuit board 15. The projection device 112 projects the patterned light PL through an opening provided downhill of the illumination device 111. A single projection device 112 is sufficient, but it is advantageous to provide several projection devices 112 in order to eliminate blind spots for the patterned light PL. In the present embodiment, two projection devices 112 are arranged in different azimuth directions (opposite positions). A DLP (Digital Light Processing) projector using a micromirror actuator can preferably be used as the projection device 112. The reason is that the projection pattern can be changed in a DLP projector. The illumination device 111 and the projection device 112 are both illumination systems for use in photographing the circuit board 15 using the image recording device 110, but the illumination device 111 is used as illumination for shape measurements according to a color light reflection illumination method and the projection device 112 is used as illumination for shape measurements according to an active triangulation method.

The controller 12 is a control means for controlling the operation of the circuit board inspection apparatus, and performs movement control of the stage 10, switching control of the illumination device 111, switching control and change of pattern and light intensity for the projection device 112, image pickup control for the image pickup device 110, and the like.

The information processing device 13 has functions to acquire various measurement values related to the component 150, the solder 151, etc., and to check the state of solder joints with respect to a terminal of the component 150, a pad (printed circuit board pad) on the printed circuit board, or the like by using the image data imported from the image acquisition device 110. The display device 14 serves to display the measurement values and inspection results obtained by the information processing device 13. The storage device 3 is a database for storing inspection programs used in the printed circuit board inspection apparatus, data (images, measurement results, inspection results, etc.) obtained by the printed circuit board inspection apparatus, and the like. The inspection programs are software that defines the operation of the printed circuit board inspection apparatus 1 and various computer programs executed by the control device 12 and the information processing device 13, and various parameter data used by these computer programs. The parameter data of the test programs defines, for example, information about the components present on the circuit board (article number, position, size, etc.), photographic recording conditions (setting values for the lighting device 111 and the projection device 112, etc.), test areas (fields of view) and their photographing sequence, test characteristics, assessment criteria (threshold values and value ranges for determining defects/no defects) and the like. In addition, the parameter data of the test programs also defines information for determining components that are subject to the influence of secondary reflection disturbances (secondary reflection objects), photographic recording conditions when photographing the components in question and the like. The test programs are created in advance before a test using the programming device 2 and registered in the storage device 3. (This work is called "programming" or "teaching").

Both the control device 12 and the information processing device 13 can be formed, for example, by a general-purpose computer having a CPU (central arithmetic and processing unit), a working memory, an auxiliary memory (hard disk drive or the like) and an input device (keyboard, mouse, touch pad or the like). Furthermore, the programming device can also be formed, for example, by a general-purpose computer having a CPU, a working memory, an auxiliary memory and an input device. It is noted that in 1 the control device 12, the information processing device 13, the display device 14, the programming device 2 and the storage device 3 are represented by different blocks, but can be constructed by means of discrete devices as well as by means of a single device.

phase-shifting method

Among the active triangulation methods, there are roughly divided into the time coding method and the space coding method, while among the time coding methods there are the light section method and the phase shift method. In the present embodiment, the phase shift method will be explained as an example.

The phase shift method is a method of measuring three-dimensional information (height information) for an object surface by analyzing the distortions of the pattern that occur when a pattern image is projected onto the object surface. Specifically, while a predetermined pattern (eg, a stripe pattern with sinusoidally varying luminance) is projected onto the circuit board using the projection device 112, a photograph is taken with the image recording device 110. In this case, as shown in 13 As shown, a distortion of the pattern on the object surface depends on its unevenness. By repeating this procedure several times (eg four times) while varying the phase of the luminance change of the pattern image, as shown in 13 shown, several images with different luminance markings (hereinafter referred to as "phase images") are obtained. Because the brightness (luminance) of identical pixels in the individual images must change with the same period with which the stripe pattern varies, the phase of each pixel can be determined by fitting a sine curve to the brightness change of the individual pixels. By determining the phase difference with respect to the phase of a predetermined reference position (table surface, circuit board surface, etc.), the distance (height) from this reference position can then be calculated.

In this way, the phase shift method is used to determine the height of the object surface based on periodic changes in luminance from image to image. The occurrence of secondary reflection disturbances, as can be seen from 12 explained, it therefore becomes difficult to correctly detect the phase of the stripe pattern, resulting in a deterioration in measurement accuracy. Therefore, in the circuit board inspection apparatus 1 of the present embodiment, if there is a component that has a possibility of being subjected to the influence of secondary reflection noise (secondary reflection object) in the field of view of the image pickup device, light is prevented from falling on a component that causes secondary reflection noise (cause object) by limiting the projection range of the pattern image. This suppresses the generation of secondary reflection noise, so that a deterioration in measurement accuracy is avoided.

In the following, as procedures dealing with measures against secondary reflection noise, (1) a programming procedure and (2) a measurement and inspection procedure based on phase shifting will be explained specifically. It should be noted that with the circuit board inspection system of the present embodiment, measurements and inspections can also be carried out using the color light reflection illumination method, but an explanation of these will be omitted since known methods can be used. Furthermore, it is assumed that before the programming procedure (eg during manufacture or installation of the circuit board inspection device 1), a field of view adjustment and focusing of the image pickup device 110, writing of a pattern image in a memory of the projection device 112, an adjustment of projection position, light intensity, sharpness and resolution of the projection device 112, a setting of usual (standard) recording conditions, etc. have been carried out.

(1) Programming (Teaching)

2 is a flow chart that shows the sequence of the programming procedure or teaching procedure.

When a test circuit board is placed in the stage 10 for programming and the command to start a programming procedure (test program creation start) is given to the programming device 2, the procedure is carried out by 2 started. The test board should preferably be a defect-free board on which the components to be tested are all mounted in the correct position. This serves to record the height/position of the correct answer for each test object in the test program and also to detect without exception those components on which secondary reflection disturbances may occur.

In step S200, the controller 12 controls the stage 10 to move an inspection area on the sample board into the field of view of the image pickup device 110. In step S201, the controller 12 turns on the illumination device 111 completely (or projects a uniform white light without a pattern from the projection device 112) and has the image pickup device 110 take a photograph. (The image acquired here is hereinafter referred to as a "patternless image"). Next, in step S202, the controller 12 has the projection device 112 project a pattern image having a stripe pattern to have the image pickup device 110 take phase images, wherein a plurality (e.g., four) phase images are taken while varying the phase of the stripe pattern. The patternless image and the phase images obtained in step S201 and step S202 are imported into the programming device 2.

The programming device 2 sets an inspection window for each inspection object present on the circuit board (step S203). The inspection windows, which are defined by the circumscribing rectangle of a component, for example, are information for determining the position and size of the inspection objects. The inspection windows can be set automatically using CAD information of the circuit board, or manually by an operator. In the case of manual setting, operation is simple and convenient if the patternless image is displayed on the screen and the areas for the inspection windows can be specified on the image using a mouse or the like. The prime example of an inspection object is a component, but objects other than components (e.g. wiring, solder, contact pads, parts of components such as terminals, etc.) can also be set as inspection objects. The programming device 2 then sets inspection parameters (inspection characteristics, evaluation criteria, etc.) for each inspection object (step S204). An explanation of how to set the test parameters is omitted, as it is the same as conventional programming.

Then, programming for secondary reflection suppression is carried out. First, in step S205, a procedure is carried out which judges whether there are secondary reflection objects among the inspection objects for which an inspection window has been set, and marks the detected secondary reflection objects with a flag. The procedure of step S205 may be that the programming device 2 automatically detects and sets, or that a worker visually detects and manually sets. For automatic detection, a method which evaluates the reliability, sharpness and luminance of the projection pattern in the phase images acquired in step S202, a method which evaluates the dispersion and error of the height information calculated from these phase images, or the like may be used. Or, the heights and positional relationships of all objects may be acquired from CAD information of the circuit board to detect the secondary reflection objects by a geometric calculation based on the incident angles of the projection pattern, the heights of the objects, and the distances between the objects. On the other hand, in case of manual adjustment, the patternless image of the circuit board can be displayed on the screen and it is possible to select the secondary reflection objects using a mouse or similar.

Subsequently, the programming device 2 sets photographic conditions for secondary reflection suppression (step S207) for the secondary reflection objects which have been flagged (step S206; YES). In the present embodiment, since a procedure of “moving the secondary reflection object to the visual field center of the image pickup device 110 and photographing while projecting a pattern image only onto an area including the secondary reflection object” is performed at the time of inspection, at least one of the visual field position during of photographing the secondary reflection object and a condition defining the projection range (or projection size) of the sample image. Note that if there are a plurality of secondary reflection objects in the image, the photographing conditions for secondary reflection suppression may be set separately for each secondary reflection object, or a plurality of adjacent secondary reflection objects may be treated as a group and the photographing conditions for secondary reflection suppression may be set group by group.

With the above, the programming for the inspection areas set in step S200 is completed. If the board is larger than the field of view of the image pickup device 110, the inspection area is changed to then repeat the procedure from step S200 to S207 (step S208). For example, if the size of the board is 210 mm × 210 mm and the image pickup device 110 has a field of view of 30 mm × 30 mm, the programming is performed for 7 × 7 = 49 inspection areas. Finally, the programming device 2 stores the inspection program in the storage device 3 to complete the procedure (step S209). Note that after the settings for all the inspection objects on the board are completed, a procedure can be performed which optimizes the positions and processing order of the inspection areas in the inspection so that the number of photographs and the distance to be traveled by the stage 10 in the inspection are minimized.

(2) Measurement and testing based on phase shifting

Using a flow chart in 3 An example of a test procedure in the printed circuit board test device 1 will be explained. 3 shows the procedure of phase shift-based measurement and inspection in the first embodiment. The procedures are carried out by having the information processing device 13 and the control device 12 control the stage 10, the image pickup device 110, the illumination device 111 and the projection device 112 following the inspection program.

If a circuit board to be tested is delivered to the stage 10, the control device 12 carries out a position adjustment of the circuit board based on registration marks on the circuit board (step S300) and then brings the first test area into line with the field of view of the image recording device 110 (step S301). In 4 (1) schematically shows a circuit board within the field of view 41. In this example, the field of view 41 includes two chip components 42a, 42b and a high connector component 43.

In order to first photograph the entire field of view (test area) 41, the control device 12 sets the pattern image of the projection device 112 to a "ordinary pattern image" (step S302). An ordinary pattern image is understood to mean a pattern image for projecting a stripe pattern onto substantially the entire field of view of the image recording device 110. An example of the state of the field of view when projecting an ordinary pattern image is shown in (2) in 4 .

5 schematically shows types of pattern images that can be projected by the projection device 112. In the present embodiment, a total of six data sets are stored in the memory (pattern image storage unit) of the projection device 112, which include, in addition to an ordinary pattern image 51, five secondary reflection suppression pattern images 52-56 of different sizes. The secondary reflection suppression pattern images 52, 53, 54, 55, 56 serve to project onto an area of 2 mm × 2 mm,
4 mm × 4 mm, 6 mm × 6 mm, 8 mm × 8 mm and 10 mm × 10 mm, respectively, to project a stripe pattern in the center of the field of view 41. In other words, the secondary reflection suppression pattern images 52-56 were obtained by restricting the projection area of a pattern image to a portion of the field of view 41. Note that in 5 Although only one image is shown for each projection size, in reality several (eg four) images of different phases are kept ready for each projection size. In order to extend the measuring range, images with a different period of the pattern can also be kept ready.

In step S303, the control device 12, while switching the phase of an ordinary pattern image 51 projected by the projection device 112, has the image pickup device 110 photograph, thereby obtaining a plurality of phase images. (The phase images acquired in step S303 are called “ordinary phase images”). The data of the acquired phase images are imported by the information processing device 13. Using the ordinary phase image data obtained in step S303, the information processing device 13 calculates a height for each pixel by analyzing the phase of the luminance change of each pixel in step S304. The calculated height information is displayed in the form of image data (referred to as height data) in which the pixel value represents the height above the PCB surface (Z position). An example of height data is shown in (3) in 4 The circuit board surface is shown in black (pixel value: 0), with the brightness (pixel value) increasing with increasing height above the circuit board surface.

Next, the controller 12 accesses the inspection program to judge whether an inspection object marked with the secondary reflection object flag exists in the current visual field 41 (step S305). If a secondary reflection object exists, the controller 12 moves the secondary reflection object in question to the visual field center of the image pickup device 110 according to the photographic shooting conditions for secondary reflection suppression in the inspection program (step S306) and changes the projection pattern of the projection device 112 to an appropriate "secondary reflection suppression pattern image" (step S307).

For example, it is assumed that the right side surface of the connector component 43 acts as a reflection surface, so that light from the projection device 112 is reflected to the top of the chip component 42a and secondary reflection disturbances occur on the chip component 42a. In this case, as in (4) in 4 shown the chip component 42a is moved such that the center of the chip component 42a coincides with the center of the field of view 41, and as in (5) in 4 As shown, the projection area is limited such that a stripe pattern only strikes the chip component 42a. If the size of the chip component 42a is 2 mm × 5 mm, for example, one of the secondary reflection suppression pattern images 54-56 whose projection size exceeds this component size is used, but care is taken that no stripe pattern strikes the reflection surface (right side surface) of the connector component 43.

Then, in step S308, the control device 12, while switching the phase of the secondary reflection suppression pattern image projected by the projection device 112, has the image pickup device 110 photograph to acquire a plurality of phase images. (The phase images acquired in step S308 are called "secondary reflection suppression phase images"). In step S309, the information processing device 13 performs the same procedure as in step S304 using the secondary reflection suppression phase image data obtained in step S308 to generate height data for the portion of the secondary reflection object. At this time, information extracted from the ordinary phase image data may be used instead of information missing from the secondary reflection suppression phase image data (e.g., height information for the board surface, height information for the vicinity of the secondary reflection object, or the like). If there are other secondary reflection objects in the field of view 41, the procedure of steps S306-S309 is repeated so that height data for all secondary reflection objects are obtained. An example of height data of a secondary reflection object is (6) in 4 .

In step S310, the information processing device 13 merges the height data for the entire field of view generated in step S304 with the height data for the secondary reflection object generated in step S309. Any image synthesis method can be used as the merging method, such as a method that replaces the data of the relevant section in the height data for the entire field of view with the height data for the secondary reflection object, or a method that calculates the average or a weighted average of the data of the relevant section in the height data for the entire field of view and the height data for the secondary reflection object. This enables, as shown in (7) in 4 shown to obtain elevation data in which secondary reflection disturbances are suppressed.

After the procedure in steps S301-S310 is carried out for all the inspection areas (step S311), the information processing device 13 carries out an inspection of the individual inspection objects (e.g., for the tombstone effect, solder fillet defects, etc.) using the merged height data obtained in step S310 and outputs the result (step S312). This completes the measurement and inspection procedure with respect to a printed circuit board.

Advantages of the embodiment

According to the present embodiment, when a secondary reflection object (example: the chip component 42a) is located within the field of view 41 of the image pickup device 110, the projection range of the pattern images is changed so that no light is incident on the reflection surface of the cause object causing the secondary reflection (example: the connector component 43). This makes it possible to suppress the generation of secondary reflection noise, so that projection patterns on an inspection object can be correctly photographed (observed) and the accuracy of measurement and inspection of the inspection object can be improved.

That in the present embodiment, data of various pattern images in the pattern image storage unit 50 of the projection device 112, also enables a simplification of the procedure for switching the pattern images.

Because photographing is performed after the secondary reflection object is moved to the visual field center, uniform use can be made of one and the same pattern images for objects having substantially the same size and shape, making it possible to considerably reduce the number of pattern images to be kept on hand. The ability to reduce the number of pattern images (the data volume) is of great practical use because the storage capacity of the pattern image storage unit (memory) 50 installed in the projection device 112 is usually limited. Furthermore, a further improvement in measurement and inspection accuracy can be expected because the optical system of the image pickup device 110 has the smallest aberration at the visual field center and the distortion of the projection pattern (distortion due to the aberration of the optical system of the projection device 112) is also the smallest.

Note that, although the secondary reflection object is moved to the visual field center in the present embodiment, the scope of the invention is not limited by this. If projection and photographing are performed after the secondary reflection object is moved to a predetermined position within the visual field of the image pickup device, at least the effects of suppressing secondary reflection, simplifying the switching procedure for the pattern images, and unifying the pattern images can be achieved.

<Second Embodiment>

Next, a second embodiment of the invention will be explained. While in the above first embodiment, the secondary reflection object was moved to the visual field center and then photographed, the second embodiment is characterized in that, without changing the position of the secondary reflection object in the visual field, a pattern image having an appropriate projection range is generated and projected in accordance with the position and size of the secondary reflection object. Since the basic structure of the circuit board inspection system is the same as in the first embodiment, the peculiarities in structure and operation will be mainly explained below.

Based on 6 and 7 The procedure for measuring and testing based on phase shifting in the second embodiment will be explained. 6 is a flow chart showing the process of measurement and testing while 7 the measurement and testing process is illustrated in a schematic diagram.

First, as in the first embodiment, the entire field of view is photographed using ordinary pattern images, and based on the ordinary phase images, height data for the entire field of view is calculated (steps S300-S304 in 6 , (1)-(3) in 7 ).

Thereafter, the controller 12 accesses the inspection program to judge whether an inspection object marked with the secondary reflection object flag exists in the current field of view 41 (step S305). If a secondary reflection object exists, the controller 12 generates secondary reflection suppression pattern images for use in photographing the secondary reflection object in question according to the photographing conditions for secondary reflection suppression in the inspection program (step S600). As the photographing conditions for secondary reflection suppression, information on the position and size of the secondary reflection object (e.g., coordinate values of the upper left and lower right points of the rectangle enclosing the secondary reflection object - in the case where a plurality of adjacent secondary reflection objects are photographed together as a group, the rectangle enclosing the secondary reflection objects belonging to the group) is given. Then, the controller 12 writes the data of the generated secondary reflection suppression pattern images into the memory of the projection device 112 to change the projection pattern of the projection device 112 (step S601). The procedure from this point (steps S308-S312) is the same as the procedure of the first embodiment.

According to the structure of the present embodiment, as shown in (4) in 7 shown, with the position of the chip component 42a within the field of view remaining unchanged, such secondary reflection suppression pattern images are automatically generated and projected so that the secondary reflection object (chip component 42a) is included in the projection area, but the reflection surface of the cause object (connector component 43) is excluded from the projection area. This makes it possible to suppress the generation of secondary reflection disturbances, so that projection patterns on a test object can be correctly photographed (observed) and the accuracy of measurement and testing of the test object can be improved.

The present embodiment makes it possible to realize the most suitable projection range according to the position and size of the secondary reflection object, and therefore the generation of noise can be suppressed as much as possible and an even greater improvement in measurement and inspection accuracy can be expected. In addition, the physical drive for stage movement, etc. can be reduced and a shortening of the procedure time can be achieved because there is no need to change the position of the secondary reflection object within the field of view.

Note that, although in the present embodiment the secondary reflection suppression pattern images are generated at the time of inspection, it is also possible to generate and store secondary reflection suppression pattern images for each secondary reflection object in advance at the time of programming. If the pattern image storage unit (memory) of the projection device 112 has sufficient storage capacity, it is sufficient to write the data of all the pattern images in advance into the projection device 112. If the storage capacity in the projection device 112 is insufficient, the data of the pattern images may be stored in a pattern image storage unit within the storage device 3 or the auxiliary memory of the information processing device 13, and the data of a required pattern image may be read and used by the control device 12 at the necessary time.

<Third Embodiment>

Next, a third embodiment of the invention will be explained. When a secondary reflection object exists within the visual field, in the first and second embodiments, photographing of the entire visual field is performed using ordinary pattern images and photographing of the secondary reflection object is performed using secondary reflection suppression pattern images. In contrast, the third embodiment is characterized in that the entire visual field is photographed using secondary reflection suppression pattern images in which no light is incident on the reflection surface of a cause object, instead of using ordinary pattern images. Since the basic structure of the circuit board inspection system is the same as that of the first embodiment, the peculiarities in structure and operation will be mainly explained below.

Based on 8 and 9 The procedure of a measurement and test based on phase shifting in the third embodiment will be explained. 8 is a flow chart showing the process of measurement and testing while 9 the measurement and testing process is illustrated in a schematic diagram.

First, as in the first embodiment, the circuit board to be tested is delivered and the first test area is brought into line with the field of view of the image pickup device 110 (steps S300-S301 in 8 , (1) in 9 ). The controller 12 accesses the inspection program to judge whether an inspection object marked with the secondary reflection object flag exists in the current field of view 41 (step S800). If no secondary reflection object exists (step S800; NO), the controller 12 sets the projection pattern of the projection device 112 to an ordinary pattern image (step S801).

On the other hand, if a secondary reflection object is present (step S800; YES), the control device 12 generates secondary reflection suppression pattern images based on the photographic shooting conditions for secondary reflection suppression in the check program (step S802). In the present embodiment, as the shooting conditions for secondary reflection suppression, information on the position and size of the reflection surface of the connector component 43 constituting the cause object (eg, coordinate values of the left upper and right lower points of a rectangular area to be excluded from the projection range so as not to allow light to fall on the reflection surface) is given. And as the secondary reflection suppression pattern images, as in (2) in 9 , images having a projection range obtained by removing a portion 90 including the cause object (connector component 43) from the projection range of an ordinary pattern image are generated. The controller 12 writes the data of the generated secondary reflection suppression pattern images into the memory of the projection device 112 and sets the projection pattern of the projection device 112 to the secondary reflection suppression pattern images (step S803).

Thereafter, using the pattern images set in step S801 or S803, photographing of phase images is performed (step S804), and height data is calculated in the information processing device 13 (step S805). The procedure from this point (step S311-S312) is the same as the procedure of the first embodiment.

According to the structure of the present embodiment, as shown in (2) in 9 As shown, when a secondary reflection object (chip component 42a) is present in the field of view 41, secondary reflection suppression pattern images are automatically generated and projected with such a projection range that no light is incident on a portion 90 including the reflection surface. This makes it possible to suppress the generation of secondary reflection noise, so that projection patterns on an inspection object can be correctly photographed (observed) and the accuracy of measurement and inspection of the inspection object can be improved.

In the present embodiment, since the pattern images are projected onto an area formed by removing the reflection surface, the projection area of the pattern images can be made as large as possible. As a result, the number of objects that can be measured by projecting and photographing once can be maximized, making it possible to achieve a reduction in the number of photographing shots and a shortening of the procedure time compared with the first and second embodiments.

Note that, although in the present embodiment the secondary reflection suppression pattern images are generated at the time of inspection, it is also possible to generate and store secondary reflection suppression pattern images for each inspection area in advance at the time of programming. If the pattern image storage unit (memory) of the projection device 112 has sufficient storage capacity, it is sufficient to write the data of all the pattern images in advance in the projection device 112. If the storage capacity in the projection device 112 is insufficient, the data of the pattern images may be stored in a pattern image storage unit within the storage device 3 or the auxiliary memory of the information processing device 13, and the data of a required pattern image may be read and used by the control device 12 at the necessary time.

<Fourth Embodiment>

Next, a fourth embodiment of the invention will be explained. In the first to third embodiments, when a secondary reflection object exists within the field of view, the projection range of the pattern images is changed to suppress secondary reflection noise, whereas the fourth embodiment is characterized in that the secondary reflection noise is suppressed by resetting the projection position for the pattern images. Since the basic structure of the circuit board inspection system is the same as that of the first embodiment, the peculiarities in structure and operation will be mainly explained below.

Based on 10 and 11 The procedure of a measurement and test based on phase shifting in the third embodiment will be explained. 10 is a flow chart showing the process of measurement and testing while 11 the measurement and testing process is illustrated in a schematic diagram.

First, as in the first embodiment, the entire field of view is photographed using ordinary pattern images, and based on the ordinary phase images, height data for the entire field of view is calculated (steps S300-S304 in 10 , (1)-(3) in 11 ).

Thereafter, the controller 12 accesses the inspection program to judge whether an inspection object marked with the secondary reflection object flag exists in the current field of view 41 (step S305). If a secondary reflection object exists, the controller 12 controls the stage 10 according to the photographic shooting conditions for secondary reflection suppression in the inspection program to move the secondary reflection object in question to a position where no secondary reflection occurs (step S1000). Specifically, as in (4), in 11 shown, the projection position of the pattern images is readjusted such that the secondary reflection object (chip component 42a) is included in the projection area, but the reflection surface of the cause object causing the secondary reflection (connector component 43) is excluded from the projection area. This can be expressed differently by replacing "projection position of the pattern images" with "visual field position" because in the present embodiment, the visual field 41 of the image pickup device 110 and the projection area of the pattern images are substantially the same and both move together. Information about the visual field position when photographing the secondary reflection object is given as the recording condition for the secondary reflection suppression. After the projection position for the pattern images has been readjusted, the control device 12 projects, as shown in (5) in 11 shown, the projection device 112 receives ordinary pattern images to photographically record phase images of the secondary reflection object (step S1001). The procedure from this point (step S309-S312, (6)-(7) in 11 ) is the same as the procedure of the first embodiment.

According to the present embodiment, when a secondary reflection object (example: the chip component 42a) is located within the field of view 41 of the image pickup device 110, the projection position of the pattern images (the field of view position) is changed so that no light is incident on the reflection surface of the cause object causing the secondary reflection (example: the connector component 43). This makes it possible to suppress the generation of secondary reflection noise, so that projection patterns on an inspection object can be correctly photographed (observed) and the accuracy of measurement and inspection of the inspection object can be improved.

The present embodiment also has the advantage that a projection device having a small storage capacity of the pattern image storage unit or a projection device of a type in which the pattern images cannot be changed can be used because there is no need to change the pattern images as in the first to third embodiments.

<Other embodiments>

The above descriptions of embodiments are intended to explain the present invention merely by way of example, without limiting the invention to the aforementioned concrete forms. The invention can be modified in many ways within the scope of its technical idea. For example, the phase shift method was used in the above embodiments, but the invention can also be preferably applied to methods other than the phase shift method if they include the operation of photographing an object in the state with a pattern image projected thereon. Furthermore, in the above embodiments, examples in which the invention is applied to the inspection of printed circuit boards were explained. However, the invention is not limited in its scope of application to this, but can be preferably applied to, for example, inspection devices used in the FA field, automotive field, or the like.

1: PCB test device, 2: programming device, 3: storage device
10: Stage, 11: Measuring unit, 12: Control device, 13: Information processing device, 14: Display device, 15: Circuit board
41: field of view, 42a, 42b: chip component, 43: connector component 50: pattern image storage unit, 51: ordinary pattern image, 52-56: secondary reflection suppression pattern image
90: Section enclosing the reflection surface of a reflective component
110: Image recording device, 111: Illumination device, 111R: Red light source, 111G: Green light source, 111B: Blue light source, 112: Projection device 150: Component, 151: Lot
200: image pickup device, 201: projector, 201L: patterned light, 201R: primary reflection light, 202: object, 203: high object, 203L: reflection light, 203R: secondary reflection light
RL: red light, GL: green light, BL: blue light, PL: patterned light

Claims (10)

Inspection device (1), comprising: an image recording device (110); a projection device (112) for projecting a sample image (51) into a field of view (41) of the image recording device (110); an information processing device (13) for carrying out an inspection of at least one object enclosed in the field of view (41) of the image recording device (110) using an image which was photographed by means of the image recording device (110) while projecting a sample image (51) through the projection device (112); and a control device (12) for controlling the image recording device (110) and the projection device (112); characterized in that the control device (12) is designed to carry out a control for changing the projection area of a pattern image (51) to be projected by the projection device (112) in such a way that no light hits the reflection surface, and for photographing the secondary reflection object (42a) by means of the image recording device (110) while projecting the pattern image (52-56) with the changed projection area, when a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), which secondary reflection object can produce a secondary reflection caused by light reflected on a reflection surface of another object (43), the control device (12) is designed to carry out a control for changing the projection area of a pattern image (51) to be projected by the projection device (112) in such a way that no light hits the reflection surface, and for photographing the secondary reflection object (42a) by means of the image recording device (110) while projecting the pattern image (52-56) with the changed projection area, the testing device (1) further comprising a storage device (3) for storing a testing program which contains information for determining a secondary reflection object (42a) among a plurality of objects to be tested; wherein the control device (12) is designed to judge, on the basis of the check program, whether a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), wherein the check program contains information about a recording condition when photographing a secondary reflection object (42a), wherein the control device (12) is designed to determine the change in the projection area of the pattern image (51) to be projected when photographing the secondary reflection object (42a) on the basis of location of the information on the recording condition, wherein the control device is further configured to carry out a control which changes the position of the secondary reflection object (42a) within the field of view (41) of the image recording device (110) in such a way that the secondary reflection object (42a) assumes a predetermined position within the field of view (41) of the image recording device (110), in order to then photograph the secondary reflection object (42a) by means of the image recording device (110) by projecting the pattern image (52-56) with the changed projection area, wherein the predetermined position is the center of the field of view (41) of the image recording device (110). Test device (1) according to claim 1 , further comprising a pattern image storage unit (50) which is configured to store data for a plurality of pattern images (52-56) with different projection areas in advance; wherein the control device (12) is configured, when a secondary reflection object (42a) is present in the field of view of the image recording device (110), to select a pattern image (52-56) from the plurality of pattern images (52-56) stored in the pattern image storage unit (50) which includes the secondary reflection object (42a) in the projection area but does not include the reflection surface in the projection area, and to change the pattern image (51) to be projected by the projection device (112) into the selected pattern image (52-56). Test device (1) according to claim 1 , wherein the control device (12) is configured, when a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), to generate a pattern image (52-56) based on information about the position and size of the secondary reflection object (42a) or the reflection surface, which pattern image includes the secondary reflection object (42a) in the projection area but does not include the reflection surface in the projection area, and to change the pattern image (51) to be projected by the projection device (112) into the selected pattern image (52-56). Test device (1) according to one of the Claims 1 until 3 , wherein the projection area of the pattern image (52-56) which is projected by the projection device (112) when a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110) is obtained by excluding the portion of the reflection surface from the projection area of an ordinary pattern image (51) which is projected by the projection device (112) when no secondary reflection object (42a) is present in the field of view (41) of the image recording device (110). Inspection device (1), comprising: an image recording device (110); a projection device (112) for projecting a sample image (51) into a field of view (41) of the image recording device (110); an information processing device (13) for carrying out an inspection of at least one object enclosed in the field of view (41) using an image which was photographed by means of the image recording device (110) while projecting a sample image (51) through the projection device (112); and a control device (12) for controlling the image recording device (110) and the projection device (112); characterized in that the control device (12) is arranged, when a photographic recording of a secondary reflection object (42a) is carried out which can produce a secondary reflection caused by light reflected on a reflection surface of another object (43), to carry out a control which sets the projection position of a pattern image (51) to be projected by the projection device (112) such that the reflection surface is excluded from the projection area, and to photograph the secondary reflection object (42a) by means of the image recording device (110) while projecting the pattern image (51), wherein the inspection device (1) further comprises a storage device (3) for storing an inspection program which contains information for determining a secondary reflection object (42a) among a plurality of objects to be inspected; wherein the control device (12) is designed to judge whether an object to be photographed is a secondary reflection object (42a) on the basis of the check program, wherein the check program contains information about a recording condition when photographing a secondary reflection object (42a), and the control device (12) sets the projection position of the pattern image (51) when photographing the secondary reflection object (42a) on the basis of the information about the recording condition; wherein the control device is further designed to, when a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), carry out a control which changes the position of the secondary reflection object (42a) within the field of view (41) of the image recording device (110) such that the secondary reflection object (42a) assumes a predetermined position within the field of view (41) of the image recording device (110), in order to then to photograph the secondary reflection object (42a) by means of the image recording device (110) by projecting the pattern image (52-56) with the changed projection area, wherein the predetermined position is the center of the field of view (41) of the image recording device (110). Test device (1) according to one of the Claims 1 until 5 , wherein the testing device (1) is a circuit board testing device for testing components on a circuit board. Inspection system comprising: an inspection device (1) having an image pickup device (110), a projection device (112) for projecting a pattern image (51) into a field of view (41) of the image pickup device (110), an information processing device (13) for carrying out an inspection of at least one object enclosed in the field of view (41) using an image photographed by means of the image pickup device (110) while projecting a pattern image (51) through the projection device (112), and a control device (12) for controlling the image pickup device (110) and the projection device (112); and a programming device (2) for creating a test program which defines the operation of the inspection device (1); characterized in that the programming device (2) is arranged to create a test program which contains information for determining a secondary reflection object (42a) which can produce a secondary reflection caused by light reflected on a reflection surface of another object (43), and information on a recording condition when photographing the secondary reflection object (42a); and that the control device (12) is designed, when a secondary reflection object (42a) is present in the field of view of the image recording device (110), which can produce a secondary reflection caused by light reflected on a reflection surface of another object (43), to carry out a control on the basis of the test program which changes the projection area of a pattern image (51) to be projected by the projection device so that no light hits the reflection surface, and to photograph the secondary reflection object (42a) by means of the image recording device (110) while projecting the pattern image (52-56) with the changed projection area, wherein the testing device (1) further comprises a storage device (3) for storing a test program which contains information for determining a secondary reflection object (42a) among a plurality of objects to be tested; wherein the control device (12) is designed to judge, on the basis of the check program, whether a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), wherein the check program contains information about a recording condition when photographing a secondary reflection object (42a), wherein the control device (12) is designed to carry out the change of the projection area of the pattern image (51) to be projected when photographing the secondary reflection object (42a) on the basis of the information about the recording condition, wherein the control device (12) is further designed, when a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), to carry out a control which changes the position of the secondary reflection object (42a) within the field of view (41) of the image recording device (110) in such a way that the secondary reflection object (42a) has a predetermined position within the field of view (41) of the Image recording device (110) in order to then photograph the secondary reflection object (42a) by means of the image recording device (110) by projecting the pattern image (52-56) with the changed projection area, wherein the predetermined position is the center of the field of view (41) of the image recording device (110). Inspection system comprising: an inspection device (1) having an image pickup device (110), a projection device (112) for projecting a pattern image (51) into a field of view (41) of the image pickup device (110), an information processing device (13) for carrying out an inspection of at least one object enclosed in the field of view (41) using an image photographed by means of the image pickup device (110) while projecting a pattern image (51) through the projection device (112), and a control device (12) for controlling the image pickup device (110) and the projection device (112); and a programming device (2) for creating a test program which defines the operation of the inspection device (1); characterized in that the programming device (2) is arranged to create a test program which contains information for determining a secondary reflection object (42a) which can produce a secondary reflection caused by light reflected on a reflection surface of another object (43), as well as information on a recording condition when photographing the secondary reflection object (42a); and that the control device (12) is configured, when a photographic recording of a secondary reflection object (42a) is carried out, to carry out a control which, on the basis of the inspection program, sets the projection position of a pattern image (51) to be projected by the projection device (112) such that the reflection surface is excluded from the projection area, and to photograph the secondary reflection object (42a) by means of the image recording device (110) while projecting the pattern image (51), wherein the inspection device (1) further comprises a storage device (3) for storing a inspection program which contains information for determining a secondary reflection object (42a) among a plurality of objects to be inspected; wherein the control device (12) is designed to judge on the basis of the check program whether an object to be photographed is a secondary reflection object (42a), wherein the check program contains information about a recording condition when photographing a secondary reflection object (42a) and the control device (12) sets the projection position of the pattern image (51) when photographing the secondary reflection object (42a) on the basis of the information about the recording condition, wherein the control device is further designed to carry out a control, when a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), which changes the position of the secondary reflection object (42a) within the field of view (41) of the image recording device (110) such that the secondary reflection object (42a) assumes a predetermined position within the field of view (41) of the image recording device (110), in order to then project the pattern image (52-56) to photograph the secondary reflection object (42a) with the changed projection area by means of the image recording device (110), wherein the predetermined position is the center of the field of view (41) of the image recording device (110). Control method for a test device (1) which has an image recording device (110) and a projection device (112) for projecting a sample image (51) into a field of view (41) of the image recording device (110), with the following steps: Changing (S307; S600, S601), when a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110) which can produce a secondary reflection caused by light reflected on a reflection surface of another object (43), the projection area of a sample image (51) to be projected by the projection device (112) so that no light hits the reflection surface; Photographing (S308), while projecting the sample image (52-56) with the changed projection area, the secondary reflection object (42a) by means of the image recording device (110); and performing (S312) an inspection of the secondary reflection object (42a) using the image photographed by means of the image pickup device (110), wherein the inspection device (1) further comprises a storage device (3) for storing an inspection program which contains information for determining a secondary reflection object (42a) among a plurality of objects to be inspected; and wherein it is judged on the basis of the check program whether a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), wherein the check program contains information about a recording condition when photographing a secondary reflection object (42a) and the change of the projection area for the pattern image (51) to be projected when photographing the secondary reflection object (42a) is carried out on the basis of the information about the recording condition, and if a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), a control is carried out which changes the position of the secondary reflection object (42a) within the field of view (41) of the image recording device (110) such that the secondary reflection object (42a) takes up a predetermined position within the field of view (41) of the image recording device (110) in order to then project the pattern image (52-56) with to photograph the secondary reflection object (42a) in the changed projection area by means of the image recording device (110), wherein the predetermined position is the center of the field of view (41) of the image recording device (110). Control method for an inspection device (1) which has an image pickup device (110) and a projection device (112) for projecting a pattern image (51) into a field of view (41) of the image pickup device (110), comprising the following steps: setting (S1000), when taking a photograph of a secondary reflection object (42a) which can produce a secondary reflection caused by light reflected on a reflection surface of another object (43), the projection position of a pattern image (51) to be projected by the projection device so that the reflection surface is excluded from the projection area; photographing (S1001), while projecting the pattern image (51), the secondary reflection object (42a) by means of the image pickup device (110); and carrying out (S312) an inspection of the secondary reflection object (42a). reflection object (42a) using the image photographed by means of the image pickup device (110), wherein the inspection apparatus (1) further comprises a storage device (3) for storing an inspection program which contains information for determining a secondary reflection object (42a) among a plurality of objects to be inspected; and wherein it is judged on the basis of the check program whether an object to be photographed is a secondary reflection object (42a), wherein the check program contains information about a recording condition when photographing a secondary reflection object (42a) and the projection position of the sample image (51) when photographing the secondary reflection object (42a) is set on the basis of the information about the recording condition, and when a secondary reflection object (42a) is present in the field of view (41) of the image recording device (110), a control is carried out which changes the position of the secondary reflection object (42a) within the field of view (41) of the image recording device (110) such that the secondary reflection object (42a) takes a predetermined position within the field of view (41) of the image recording device (110), in order to then project the sample image (52-56) with the changed projection area onto the secondary reflection object (42a) by means of the image recording device (110), wherein the predetermined position is the center of the field of view (41) of the image recording device (110).

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