DE102012219461A1 - SUPPORT FOR LIGHTING DEVICE WITH LIMIT STRUCTURE FOR SURFACE - Google Patents

Abstract

Support for Lighting Device with Limiting Structure for Support Surface A support (11) for a lighting device (10) has at least one support surface (13) for at least one semiconductor light source (14), which at least one support surface (13) laterally of a limiting structure (16) for a is surrounded on the support surface (13) to be abandoned filling compound (15), wherein the limiting structure (16) is a limiting structure (16) produced by means of a surface-processing method. A lighting device (10) has a carrier (11) with at least one support surface, wherein at least one semiconductor light source (14) is arranged on the at least one support surface and covers the at least one support surface up to the delimiting structure (16) with a filling compound (15) is which filling compound (15) covers the at least one semiconductor light source (14). A method is used to produce a carrier (11) and comprises at least the following steps: providing a carrier (11) for a lighting device (10) and generating a delimiting structure (16) which has a support surface (13) for at least one semiconductor light source (14 ) laterally limited to the carrier. The invention is particularly applicable to LED modules.

Description

Support for lighting device with boundary structure for supporting surface

The invention relates to a support for a lighting device, which support has at least one support surface for at least one semiconductor light source and which support surface is laterally surrounded by a delimiting structure for a filling compound to be dispensed onto the support surface. The invention is particularly applicable to LED modules.

There are known lighting modules with a plurality of applied on a common carrier light emitting diodes (LEDs), which LEDs are covered by a translucent potting compound. In order to limit a range covered by the potting compound, which defines the LEDs, this area has hitherto been circumscribed by means of a separately produced support applied to the carrier. For example, the overlay may be in the form of a separately made ring which is adhered to the backing. The disadvantage here is that the carrier in order to be handled after its preparation (eg., To be self-supporting) and to be applied to the carrier without ripple, having a comparatively high height.

It is the object of the present invention to at least partially overcome the disadvantages of the prior art.

This object is achieved according to the features of the independent claims. Preferred embodiments are in particular the dependent claims.

The object is achieved by a carrier for a lighting device, which carrier has at least one support surface for at least one semiconductor light source, which is surrounded at least one support surface laterally by a boundary structure for a rest mass to be discontinued on the support surface, wherein the limiting structure is a limiting structure produced by means of a surface processing method is.

The delimiting structure is therefore not manufactured separately and subsequently connected to the carrier, but produced directly on the carrier or from the carrier. As a result, even flat boundary structures can be formed with high accuracy on the carrier. An independent handling of the boundary structure or sufficient inherent rigidity is not required. As a result, thin, soft or even very brittle materials can be used for the delimiting structure.

The fact that the carrier is a carrier for a lighting device may include in particular that the carrier is specially designed and provided for this purpose.

Preferably, the at least one semiconductor light source comprises at least one light-emitting diode. If several LEDs are present, they can be lit in the same color or in different colors. A color can be monochrome (eg red, green, blue, etc.) or multichrome (eg, white). The light emitted by the at least one light-emitting diode can also be an infrared light (IR LED) or an ultraviolet light (UV LED). Several light emitting diodes can produce a mixed light; z. B. a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor (conversion LED). The phosphor can alternatively or additionally be arranged remotely from the light-emitting diode ("remote phosphor"). The at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, z. At least one Fresnel lens, collimator, and so on. Instead of or in addition to inorganic light emitting diodes, z. Based on InGaN or AlInGaP, organic LEDs (OLEDs, eg polymer OLEDs) can generally also be used. Alternatively, the at least one semiconductor light source z. B. have at least one diode laser.

The carrier may have one or more contact surfaces for at least one semiconductor light source. Several bearing surfaces may be laterally surrounded by a respective limiting structure. However, a limiting structure may also laterally limit several contact surfaces, for. B. by providing corresponding recesses. In the case of a plurality of contact surfaces, these may have the same semiconductor light sources, or at least two contact surfaces may have different semiconductor light sources or groups of semiconductor light sources. For example, different bearing surfaces may each comprise groups of semiconductor light sources emitting white mixed light.

The boundary structure provides a lateral boundary for the filling compound, in particular analogously to a side wall of a casting mold. A floor can be provided in particular by the support surface.

The translucent filling compound may in particular be a potting compound. The Potting compound may be transparent or translucent (eg, opaque or whitish). The potting compound may in particular be a (for example transparent) matrix material to which at least one additive may be added. The matrix material may be, for example, silicone or epoxy resin. The at least one additive may, for example, have diffuser particles, light-reflecting particles, color particles and / or phosphor particles for the at least partial wavelength conversion. For the case of several bearing surfaces, at least two contact surfaces may have different filling compounds.

A surface-processing method may, in particular, be understood as a method in which a predetermined area of the carrier for producing the delimiting structure is processed.

The carrier may in particular have a shaping base body (eg a solid body of metal, in particular of aluminum, plastic and / or ceramic, a circuit board, etc.). It is a development that the carrier has at least one layer, which is processed by means of the method.

It is an embodiment that the delimiting structure is a delimiting structure made of material. This enables a particularly precise, high-resolution limiting structure and allows easy production. By means of the removal of material, the base body and / or at least one layer applied to the base body may be processed.

It is still an embodiment that the material-removing process is or comprises a photolithographic process, which is basically known for example from semiconductor and microsystems technology for the production of integrated circuits and other products. In this way, fine structures can be formed in a short time using well-known, well-controlled processes. In photolithography, in particular, an image of a photomask may be transferred to a photosensitive photoresist by means of an exposure. For example, the photoresist may have been applied over a large area to the base body and thus form a carrier. Subsequently, the exposed areas of the photoresist are dissolved (alternatively, the resolution of the unexposed areas is also possible if the photoresist cures under light).

It is a development that the boundary structure is formed by means of the remaining photoresist. A bearing surface may then be present in particular at a recess in a layer of photoresist.

Alternatively or additionally, the removal of material may be carried out by a machining process. This is particularly advantageous if a not present as a layer material volume to edit, z. B. the main body.

It is a further embodiment that the delimiting structure has a groove or a trench surrounding the support surface. Because it has been shown that filling material, for. As silicone, can be brought to trenches to a halt. The groove or the trench is in particular introduced into a main body of the carrier. This embodiment enables particularly flat carrier.

It is also a development that the boundary structure by means of forming or displacing, in particular by means of embossing or rolling, is formed, so the process is a forming process.

It is a development that the method is or comprises a layer application method.

For example, the photoresist process may be preceded or followed by a photolithographic process in which, following formation of a photoresist mask, material is introduced into open windows in the photoresist and subsequently the mask is removed. The delimiting structure then has the material introduced into the window (s).

It is a development that the process is or comprises a positive coating application process.

In particular, the boundary structure is not achieved by a full-surface layer application and subsequent material removal, but by a direct application of at least one layer in the desired shape (positive form).

Such a method may include, for example, a planographic printing process, in particular screen printing, which is particularly easy to carry out. The method may in particular include a doctor blade. For example, metal pastes and metal inks are used. However, the method may also be a jetting method, in particular aerosol jets. The planographic printing process may already produce the positive boundary structure, z. B. by means of a suitable print mask. Alternatively, a layer or a stack of layers may be applied over a large area and the boundary structure of the applied layer or layer stack z. B. be formed chemically or galvanically.

It is a general configuration that the delimiting structure is a layered structure. The Limiting structure may have one or more layers. Due to the layers, a variety of material properties can be combined with fine structures. Also, such a particularly strong connection to a body is possible. In particular, the thickness of a layer may not exceed 100 micrometers.

It is also an embodiment that the delimiting structure has a ring surrounding the bearing surface, which is machined out of at least one layer or is such.

It is an alternative development that the limiting structure has a plurality of recesses, which are positioned on the bearing surfaces.

It is yet another embodiment that the delimiting structure has a surface which is different from the support surface and more repellent for the filling compound. As a result, spreading of the filling compound can be effectively stopped.

It is a development that the boundary structure has a surface which has a different material than the surface of the support surface, for. As a metallic surface or a surface of another metal.

It is still a development that the boundary structure has a microscopically differently shaped surface than the surface of the support surface, for. B. has another roughness or a surface structure, which shows a lotus effect with respect to the filling material.

This different surface may be present as an additional layer, or may have been applied by surface treatment (eg, roughening) of an existing layer.

The object is achieved by a lighting device comprising at least one carrier as described above. This lighting device has the same advantages as the carrier and can be configured in an analogous manner.

The lighting device may be a lamp, a light or a light module, in particular an LED module.

The lighting device may in particular be equipped with at least one support surface, wherein at least one semiconductor light source is arranged on the at least one support surface and the at least one bearing surface is covered up to the boundary structure with a filling material, which filling material covers the at least one semiconductor light source.

The object is also achieved by a method for producing a carrier, in particular as stated above, wherein the method has at least the following steps: providing a carrier for a lighting device; and generating a delimiting structure laterally defining a support surface for at least one semiconductor light source on the support.

The delimiting structure is therefore not manufactured separately and then connected to the carrier, but produced by material processing of the carrier and / or by forming (ie not preformed) material application to the carrier.

It is an embodiment that the step of generating a delimiting structure comprises generating the delimiting structure by means of a layer application on the carrier.

It is an alternative or additional embodiment that the step of generating the delimiting structure comprises generating the delimiting structure by means of a material removal on the carrier.

It is further an alternative or additional embodiment that the step of generating a delimiting structure comprises generating the delimiting structure by means of a surface treatment.

The above-described characteristics, features, and advantages of this invention, as well as the manner in which they will be achieved, will become clearer and more clearly understood in connection with the following schematic description of exemplary embodiments which will be described in detail in conjunction with the drawings. In this case, the same or equivalent elements may be provided with the same reference numerals for clarity.

1 shows a sectional side view of a lighting device according to a first embodiment;

2 shows a sectional side view of a lighting device according to a second embodiment; and

3 shows a sectional side view of a lighting device according to a third embodiment; and

4 shows a sectional view in side view of a lighting device according to a fourth embodiment.

1 shows a sectional view in side view of a lighting device in the form of an LED module 10 according to a first embodiment.

The LED module 10 has a carrier 11 with a plate-shaped body 12 on, z. B. a metallic body, for. As aluminum, or a board, z. B. metal core board. The main body 12 has on its front a support surface 13 on, on which several LEDs 14 , z. B. LED chips, applied and wired (o. Fig.) Are. The light-emitting diodes 14 are of a filling compound in the form of a potting compound 15 , z. As silicone, covered.

The bearing surface 13 is laterally encircling a boundary structure in the form of a layer 16 from, for example, photoresist, which layer 16 a recess 17 at the location of the bearing surface 13 having. The layer has a maximum thickness of one hundred microns, e.g. B. from twenty to fifty microns, which is less than the height of the LEDs 14 and thus the potting compound 15 , Nevertheless, the shift is enough 16 out, the potting compound 15 within the bearing surface 13 to keep.

The recess 17 can, for example, by a photolithographic material removal of a previously existing there area of the layer 16 be generated. The layer 16 but can also by a (positive) layer application outside the recess 17 have been generated, for. B. by a planographic printing process.

2 shows a sectional view in side view of a lighting device 20 according to a second embodiment. The lighting device 20 differs from the lighting device 10 in that at the associated carrier 21 the boundary structure in the form of an annular layer 22 present, z. B. of metal. The layer 22 For example, by means of a photolithographic process, a printing process or a jetting process, in particular Aerosoljettens on the body 12 be applied. The annular layer 22 is not higher than a hundred microns here too.

3 shows a sectional view in side view of a lighting device 30 with a carrier 31 according to a third embodiment. The lighting device 30 differs from the lighting devices 10 or 20 in that the boundary structure now no on the main body 12 of the carrier 31 applied layer or layer stack, but one by material removal, for. As micro-chips or etching, in the front of the body 12 introduced, annular groove-like recess or trench 32 , Also the ditch 32 is capable of spreading the potting compound 15 to prevent.

4 shows a sectional view in side view of a lighting device 40 according to a fourth embodiment. Here is a carrier 41 with a boundary structure 42 used, which one for the potting compound 15 more repellent surface 43 has as the bearing surface 13 , z. B. by roughening or producing a lotus effect surface facing structure. This surface 43 For example, by a surface treatment of the front of the body 12 Alternatively, by a layer application.

Although the invention has been further illustrated and described in detail by the illustrated embodiments, the invention is not so limited and other variations can be derived therefrom by those skilled in the art without departing from the scope of the invention.

Thus, the limiting structure may at least locally also have more than one layer, that is to say be configured in particular as a layer stack.

Generally, "on", "an", etc. may be taken to mean a singular or a plurality, in particular in the sense of "at least one" or "one or more", etc., as long as this is not explicitly excluded, e.g. B. by the expression "exactly one", etc.

Also, a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.

LIST OF REFERENCE NUMBERS

10

lighting device

11

carrier

12

body

13

bearing surface

14

led

15

potting compound

16

layer

17

recess

20

lighting device

21

carrier

22

layer

30

lighting device

31

carrier

32

dig

40

lighting device

41

carrier

42

limiting structure

43

surface

Claims (12)

Carrier ( 11 ; 21 ; 31 ; 41 ) for a lighting device ( 10 ; 20 ; 30 ; 40 ), - which carrier ( 11 ; 21 ; 31 ; 41 ) at least one bearing surface ( 13 ) for at least one semiconductor light source ( 14 ), - which at least one bearing surface ( 13 ) laterally of a boundary structure ( 16 ; 22 . 32 ; 43 ) for one on the support surface ( 13 ) to be applied filler ( 15 ), wherein - the boundary structure ( 16 ; 22 . 32 ; 43 ) a boundary structure produced by a surface-processing method ( 16 ; 22 . 32 ; 43 ). Carrier ( 11 ; 31 ) according to claim 1, wherein the boundary structure ( 16 ; 32 ) a material-removing or material-forming boundary structure ( 16 ; 32 ). Carrier ( 11 ) according to claim 2, wherein the process is a lithographic or a chemical process. Carrier ( 11 ; 21 ) according to one of the preceding claims, wherein the boundary structure ( 16 ; 22 ) is a layered structure. Carrier ( 21 ) according to one of the preceding claims, wherein the delimiting structure has a bearing surface ( 13 ) surrounding layered ring ( 22 ) having. Carrier ( 31 ) according to one of claims 2 to 5, wherein the delimiting structure a the bearing surface ( 13 ) surrounding groove ( 32 ) having. Carrier ( 41 ) according to one of the preceding claims, wherein the boundary structure ( 42 ) one to the support surface ( 13 ) different, for the filling material ( 15 ) more repellent surface ( 43 ) having. Lighting device ( 10 ; 20 ; 30 ; 40 ), comprising a carrier ( 11 ; 21 ; 31 ; 41 ) according to one of the preceding claims with at least one contact surface ( 13 ), wherein - at least one bearing surface ( 13 ) at least one semiconductor light source ( 14 ) is arranged and - the at least one bearing surface ( 13 ) to the boundary structure ( 16 ; 22 . 32 ; 43 ) with a filling material ( 15 ), which filling material ( 15 ) the at least one semiconductor light source ( 14 ) covered. Method for producing a carrier ( 11 ; 21 ; 31 ; 41 ) according to one of claims 1 to 7, wherein the method comprises at least the following steps: - providing a carrier ( 11 ; 21 ; 31 ; 41 ) for a lighting device ( 10 ; 20 ; 30 ; 40 ); - Create a boundary structure ( 16 ; 22 . 32 ; 43 ), which a bearing surface ( 13 ) for at least one semiconductor light source ( 14 ) laterally limited to the carrier ( 11 ; 21 ; 31 ; 41 ). The method of claim 9, wherein the step of generating the boundary structure ( 16 ; 22 ) generating the boundary structure ( 16 ; 22 ) by means of a layer application on the carrier ( 11 ; 21 ). Method according to one of claims 9 or 10, wherein the step of generating a delimiting structure ( 16 ; 22 . 32 ) generating the boundary structure ( 16 ; 22 . 32 ) by means of a material removal and / or a material displacement on the carrier ( 11 ; 21 ; 31 ). Method according to one of claims 9 to 11, wherein the step of generating a delimiting structure ( 43 ) generating the boundary structure ( 43 ) by means of a surface treatment.

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