DE102021113930A1 - Method for generating an image of an object and/or a representation of data about the object, computer program product and particle beam device for carrying out the method - Google Patents

Abstract

The invention relates to a method for generating an image of an object (125) and/or a representation of data about the object (125) using a particle beam device (100), a computer program product and a particle beam device (100) for carrying out the method. The method comprises a first group of method steps and a second group of method steps. In the first group of method steps, an imaging mode is selected and a first control parameter value of a control parameter for controlling a functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114 , 115, 116, 116A, 117, 118, 119, 121, 122) are loaded from a database (126) into a control unit (123). An image of the object (125) is generated and displayed with a display unit (124). In the second group of method steps, an analysis mode is selected and a second control parameter value of the control parameter for controlling the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114 , 115, 116, 116A, 117, 118, 119, 121, 122) are loaded from the database (126) into the control unit (123). A representation of data about the object (125) is generated and displayed with the display unit (124).

Description

The invention relates to a method for generating an image of an object and/or a representation of data about the object using a particle beam device, a computer program product and a particle beam device for carrying out the method. For example, the particle beam device is designed as an electron beam device or as an ion beam device.

Electron beam devices, in particular a scanning electron microscope (also referred to below as SEM) and/or a transmission electron microscope (also referred to below as TEM), are used to examine objects (also referred to below as samples) in order to obtain knowledge of the properties and behavior under certain conditions.

In an SEM, an electron beam (also referred to below as a primary electron beam) is generated by a beam generator and focused on an object to be examined by a beam guidance system. The primary electron beam is guided over a surface of the object to be examined by means of a deflection device in the form of a scanning device. The electrons of the primary electron beam interact with the object to be examined. As a result of the interaction, electrons in particular are emitted from the object (so-called secondary electrons) and electrons from the primary electron beam are scattered back (so-called backscattered electrons). The secondary electrons and the backscattered electrons are detected and used for image generation. An image of the object to be examined is thus obtained. Furthermore, during the interaction, interaction radiation is generated, for example X-rays or cathodoluminescence light, which is detected by a detector to analyze the object and then evaluated.

In the case of a TEM, a primary electron beam is also generated by means of a beam generator and guided onto an object to be examined by means of a beam guidance system. The primary electron beam radiates through the object to be examined. When the primary electron beam passes through the object to be examined, the electrons of the primary electron beam interact with the material of the object to be examined. The electrons passing through the object to be examined are imaged by a system consisting of a lens and a projective lens on a fluorescent screen or on a detector (e.g. a camera). The imaging can also take place in the scan mode of a TEM. Such a TEM is usually referred to as a STEM. In addition, it can be provided that electrons scattered back from the object to be examined and/or secondary electrons emitted by the object to be examined can be detected by means of a further detector in order to image an object to be examined.

It is known to combine the function of a STEM and a SEM in a single particle beam device. With this particle beam device, it is thus possible to examine objects with an SEM function and/or with a STEM function.

A particle beam device in the form of an ion beam column is also known. Ions, which are used to process an object, are generated by means of an ion beam generator arranged in the ion beam column. For example, material of the object is removed during processing or a material is applied to the object, for example with the supply of a gas. In addition or as an alternative to this, the ions are used for imaging.

It is also known from the prior art to use combination devices for examining objects in which both electrons and ions can be guided onto an object to be examined. For example, it is known to additionally equip an SEM with an ion beam column. By means of an ion beam generator arranged in the ion beam column, ions are generated which are used for the preparation of an object (for example removing material from the object or applying material to the object) or for imaging. For this purpose, the ions are scanned over the object with a deflection device in the form of a scanning device. The SEM is used here in particular for observing the preparation, but also for further examination of the prepared or unprepared object.

When generating an image of an object, an object can be imaged with a particle beam device with a high spatial resolution. This is achieved in particular by a very small diameter of the primary electron beam in the plane of the object. Furthermore, the spatial resolution can be all the better, the higher the electrons of the primary electron beam are first accelerated in the particle beam device and are finally decelerated to a desired energy (called landing energy) in the objective lens or in the area of the objective lens and the object. For example, the electrons of the primary electron beam are accelerated with an acceleration voltage of 2 kV to 30 kV and guided through an electron column of a particle beam device. Only in the area between the objective lens and the object, the electrons of the primary electron beam are decelerated to the desired landing energy with which they hit the object. The landing energy of the electrons of the primary electron beam is in the range from 10 eV to 30 keV, for example.

When creating an image of the object, a user of a particle beam device is concerned with achieving the optimal image quality of an image of the object required for examining an object. In other words, a user always wants to create an image of the object with such a good image quality that he can analyze the object to be examined well based on the image and the image information contained therein. In this case, the image quality can be determined, for example, by means of objective criteria. In particular, the image quality of an image is better the better the resolution in the image is or the better the contrast is. Alternatively, the image quality can be determined using subjective criteria. In this case, a user individually determines whether the image quality achieved is sufficient for him or not. However, it can happen that the image quality that a first user finds to be sufficiently good is not sufficient for a second user. For example, the image quality of an image of an object can also be determined using the signal-to-noise ratio of the detector signal. If the signal-to-noise ratio is between 0 and 5, the image quality is not good enough. For example, one speaks of a good signal-to-noise ratio (and thus also of good and sufficient image quality) when the signal-to-noise ratio is in the range of 20 to 40. The direction of the secondary particle beam (ie the particle beam that has secondary electrons and/or backscattered electrons) can also be a measure of the image quality. The secondary electrons can be emitted from the object in different solid angles. Furthermore, the backscattered electrons can be scattered back into different solid angles on the object. The direction of the secondary particle beam (ie the solid angle in which the secondary particle beam runs) can be influenced by tilting the primary electron beam and/or the object to the optical axis of the particle beam device. This makes it possible, on the one hand, to select the direction of the secondary particle beam in such a way that the secondary particle beam impinges on a desired detector. On the other hand, both the number of secondary electrons generated and the number of backscattered electrons can be influenced by the above-mentioned tilting. For example, if the primary electron beam enters the object parallel to a crystal lattice of an object, then the number of secondary electrons and/or backscattered electrons decreases. The detection signal becomes weaker. This leads to a reduction in picture quality. By adjusting the tilt of the primary electron beam, the number of secondary electrons and backscattered electrons can be increased. With such an adjustment it is possible to distinguish crystals with a first orientation from crystals with a second orientation based on the strength of the detection signal.

In order to generate a representation of data about the object, for example an energy spectrum or a wavelength spectrum for material analysis, X-ray radiation is detected which is generated when a primary electron beam interacts with the object. For example, an energy-dispersive X-ray spectroscopy (abbreviated to EDX in English) can be carried out with the detected X-ray radiation. When the primary electron beam impinges on the object, atoms of the object are excited by the primary electron beam and emit a characteristic X-ray radiation. The characteristic X-ray radiation is analyzed in energy-dispersive X-ray spectroscopy. It provides information about the material composition of the object. Furthermore, it is known to carry out wavelength-dispersive X-ray spectroscopy (abbreviated to WDX in English) with the detected X-ray radiation. Using wavelength-dispersive X-ray spectroscopy, characteristic X-rays, which are emitted by the object after the primary electron beam is incident, are also analyzed. The material composition of the object is also determined with wavelength-dispersive X-ray spectroscopy.

When detecting interaction radiation, a user of a particle beam device can definitely be concerned with achieving the quality of the representation of the detection signals of a radiation detector based on the detected alternating radiation that is required for examining an object. If, for example, X-ray radiation is detected with the radiation detector, then the quality of the display is determined, for example, by a good detection signal from the radiation detector. For example, this is designed as an EDX detector. The quality of the representation is then influenced, for example, on the one hand by the count rate of the detected X-ray quanta and on the other hand by the half-width of the measured peaks in the X-ray spectrum. The higher the count rate and the smaller the half-width, the better the quality of the representation of the detection signals. If, for example, cathodoluminescent light is detected with a radiation detector, then the quality of the display can also be determined by a good detection signal from the radiation detector, for example. The quality of the display is determined, for example, by the count rate of the detected Photons of cathodoluminescent light determined. The counting rate can be influenced by suitable light optics. Furthermore, the primary electron beam can be adjusted in such a way that the object emits as many photons as possible in total or in a specific wavelength interval.

In order to achieve good image quality of an image and/or a good representation of the detection signals based on the detected interaction radiation, which is generated with a particle beam device, a user of a particle beam device known from the prior art usually first selects a desired landing energy , with which electrons hit the object. The user then selects settings for further control parameters from at least one control unit for controlling functional units of the particle beam device. The control parameters are, for example, physical variables, in particular a control current or a control voltage, but also, for example, the ratio of physical variables, in particular an amplification of physical variables. The values of the physical variables can be set on or with the control units and control and/or supply the functional units of the particle beam device in such a way that desired physical effects, for example the generation of specific magnetic fields and/or electrostatic fields, are achieved.

Examples of control parameters of at least one control unit for controlling at least one functional unit of a particle beam device are explained in more detail below.

In order to achieve good quality of an image of the object, it is known to control a particle beam device with first control parameter values of control parameters from a control unit for controlling functional units of the particle beam device, the first control parameter values being different from second control parameter values of the control parameters of the control unit for controlling the functional units of the particle beam device are. The second control parameter values are used for good quality presentation of data about the object. In other words, the functional units of the particle beam device are controlled when generating an image on the one hand and when generating a representation of data about the object on the other, in particular using a control unit with different control parameter values of the control parameters. For example, when generating an image of the object, the object is arranged at a smaller distance from an objective lens of the particle beam device than when generating a representation of data about the object. The distance between the object and the objective lens is also known as the working distance. In other words, when generating an image of the object, the object is arranged at a smaller working distance from the objective lens of the particle beam device than when generating a representation of data about the object. In addition or as an alternative to this, it is known that a current of the primary electron beam in the range of a few nanoamperes is used to generate an image of the object. On the other hand, it is known that when generating a representation of data about the object, a current of the primary electron beam in the range of a few microamperes is used.

In order to achieve a desired quality of an image of the object on the one hand and a desired quality of a representation of data about the object on the other hand, it is known that a user can use the first control parameter values and the second control parameter values of the control parameters of the control unit for controlling the functional units of a particle beam device set manually on a control unit. This is time consuming. In addition, there is the risk that a field of view of the particle beam device changes when the first control parameter values and the second control parameter values are set manually, so that an area of the object to be analyzed and/or imaged that was previously in the field of view is no longer in the field of view of the particle beam device . In this case, the area to be analyzed and/or imaged must be searched again.

The invention is therefore based on the object of specifying a method and a particle beam device for carrying out the method, with which control parameter values of control parameters for control units for controlling functional units of a particle beam device can be easily set, the control parameter values of the control parameters having a desired image quality of an image of an object and /or ensure a desired representation of the detection signals based on the detected interaction radiation (ie data about the object).

According to the invention, this object is achieved with a method having the features of claim 1. A computer program product with a program code that controls a particle beam device for carrying out the method is given by the features of claim 16. Furthermore, a particle beam device for generating an image of an object and/or a representation of data about the object with the features of claim 17 is provided. Further features of the invention result are evident from the following description, the appended claims and/or the appended drawings.

The method according to the invention serves to generate an image of an object and/or a representation of data about the object (for example a radiation spectrum, in particular an X-ray spectrum) with a particle beam device. The particle beam device has at least one beam generator for generating a particle beam with charged particles. For example, the charged particles are electrons or ions.

The method according to the invention has a first group and a second group of method steps. The first group and the second group of method steps are explained in more detail below.

The first group of method steps includes selecting an imaging mode of the particle beam device using a control unit of the particle beam device. The imaging mode is the mode of the particle beam device with which at least one image of the object is generated with the particle beam of the particle beam device. The control unit of the particle beam device serves in particular to control at least one functional unit of the particle beam device. A functional unit is understood above and also below to mean a structural unit of the particle beam device, which can be adjusted in any way. For example, the position of the functional unit in the particle beam device can be adjusted. In addition or as an alternative, it is provided to set an electrostatic and/or magnetic configuration of the functional unit. The invention is not limited to the aforementioned adjustment options. Rather, the functional unit can be set up in any manner that is suitable for the invention.

In addition, the first group of method steps includes loading a first control parameter value of a control parameter of the control unit for controlling at least one functional unit of the particle beam device from a database into the control unit. The control parameter is, for example, a physical variable, in particular a control current or a control voltage, but also, for example, the ratio of physical variables, in particular an amplification of physical variables. The values of the physical variable can be set on or with the control unit and control and/or supply the functional unit of the particle beam device in such a way that desired physical effects, for example the generation of specific magnetic fields and/or electrostatic fields, are achieved.

Examples of control parameters of the control unit are explained in more detail below.

A first control parameter of the control unit serves to set the so-called landing energy of the charged particles of the particle beam on the object.

When they hit the object, the charged particles have this landing energy. In other words, the charged particle landing energy is the energy with which the object is examined and/or imaged. The landing energy of the charged particles can be different from the energy with which the charged particles are guided through a beam column of the particle beam device. In particular, provision is made for the charged particles to be accelerated very strongly at first and only to be decelerated to the landing energy shortly before they hit the object. This is explained in more detail below. The landing energy of the charged particles is, for example, in the range from 1 eV to 30 keV, including the range limits. In the imaging mode, a landing energy of 1 keV or less is preferably used. In the analysis mode, which is explained in more detail below, a landing energy in the range from 10 keV to 20 keV is preferably used. However, the invention is not limited to the aforementioned areas of landing energy. Rather, any range suitable for the invention may be used in the invention.

A second control parameter of the control unit adjusts the contrast in the generated image. Contrast is basically the difference in brightness (i.e. the difference in intensity) between the brightest pixel with maximum luminance Lmax and the darkest pixel with minimum luminance Lmin in an image. A small difference in brightness between the two pixels means a low contrast. A high difference in brightness between the two pixels means a high contrast. The contrast can be given, for example, as a Weber contrast or as a Michelson contrast. The following applies to the Weber contrast: $$K_w=\frac{L_{max}}{L_{min}}-1mit\text{0}\le K_W\le \infty$$

For the Michelson contrast applies: $$K_M=\frac{L_{max}-L_{min}}{L_{max}+L_{min}}mit\text{0}\le {\text{K}}_M\le 1$$

The contrast, which is essentially generated by secondary electrons, is determined by the topo graphy of the surface of the object is determined. In contrast, the contrast, which is essentially generated by backscattered electrons, is essentially determined by the material of the imaged object area. This is also called material contrast. The material contrast depends on the mean atomic number of the imaged area of the object. The contrast becomes greater, for example, the greater an amplification factor is set on an amplifier of the detector, with the detector detecting the secondary electrons and/or backscattered electrons. The amplifier amplifies the detection signal generated by the detector. Analogous to this, the contrast becomes smaller, for example, the smaller the amplification factor is set on the amplifier of the detector.

A third control parameter of the control unit sets the brightness (i.e. “brightness”) in the generated image. In an image, brightness is basically related to each pixel in the image. A first pixel with a higher brightness value than a second pixel appears brighter in the image than the second pixel. The brightness is set, for example, by setting an amplification factor of the detection signal of the detector. In this case, the brightness of each pixel in the image is increased or decreased identically, for example also using a color table stored in a memory unit, a specific brightness corresponding to a color recorded in the color table.

A fourth control parameter of the control unit is used, for example, to control an objective lens of the particle beam device, with which a focussing of the particle beam on the object is set.

A fifth control parameter of the control unit serves to center the particle beam in the objective lens. For example, the control unit serves to set electrostatic and/or magnetic units of the particle beam device, with which the centering of the particle beam in the objective lens is set.

In addition, the image quality of an image of the object and/or the quality of the representation of the detection signals based on the detected interaction radiation (i.e. data about the object) is influenced by a sixth control parameter of the control unit for controlling and adjusting electrostatic and/or magnetic deflection units, which be used in the particle beam device for a so-called "beam shift". This makes it possible to set the position of a scan area on the object and, if necessary, to move the scan area to a desired position. This can be done without using a sample table (also referred to below as an object holder) on which the object is arranged. If, for example, the scanning area moves out of the actual area of the object that is observed using the particle beam device due to a change in the settings on the particle beam device, the particle beam is shifted during a "beam shift" by translational movements in such a way that the grid area is again in the desired observed area .

A stigmator used in the particle beam device can also influence the image quality of the image of the object and/or the quality of the representation of the detection signals based on the detected interaction radiation. The stigmator, a magnetic and/or electrostatic multipole element, is used in particular to correct astigmatism. The stigmator can be adjusted with the control unit using a seventh control parameter.

However, the image quality of an image of the object and/or the quality of the representation of the detection signals based on the detected interaction radiation can/can also be influenced by the position of a mechanically displaceable unit of the particle beam device. The position of the mechanically displaceable unit of the particle beam device can be set, for example, with an eighth control parameter of the control unit. For example, the image quality is influenced by the position of an aperture stop, which is used to shape and limit the particle beam in the particle beam device. As an alternative or in addition to this, it is provided to change the position of an adjustable sample table on which the object is arranged. It is then possible, for example, to adjust the distance between the object and the objective lens of the particle beam device. This distance is called the working distance. If the object is imaged with the particle beam device (ie in imaging mode), then the working distance is, for example, in the range of 1 cm or less than 1 cm. If X-ray spectroscopy is to be carried out, then the working distance is in the range of greater than 1 cm, for example between 2 cm and 10 cm.

The image quality of an image of the object and/or the quality of the representation of the detection signals based on the detected alternating radiation can/can also be influenced by the so-called scan rotation. This is a rotation of the scanning area in the plane of the raster area around an optical axis of the particle beam device. The scan rotation can be set, for example, with a ninth control parameter of the control unit.

With a tenth control parameter of the control unit, functional units of the particle beam device can be adjusted in such a way that the current of the particle beam can be adjusted. For example, the functional units are designed as the objective lens, the aperture stop and/or a condenser lens. A current of the particle beam in the range of a few nanoamperes is used to generate an image of the object. Such a flow of the particle beam is preferred in the imaging mode. On the other hand, when generating a representation of data about the object, a current of the particle beam in the range of a few microamperes is used. Such a flow of the particle beam is preferred in an analysis mode which will be explained in more detail below.

With an eleventh control parameter of the control unit, functional units of the particle beam device can be set in such a way that a high vacuum or a pressure which almost corresponds to atmospheric pressure prevails in a sample chamber of the particle beam device. By setting the eleventh control parameter of the control unit, a pump arranged on the sample chamber is controlled, for example. In particular, the sample chamber is operated in a first pressure range or in a second pressure range. The first pressure range only includes pressures less than or equal to 10 ^-3 hPa, and the second pressure range only includes pressures greater than 10 ^-3 hPa. In order to ensure these pressure ranges, the sample chamber is sealed in terms of vacuum technology. If it is determined that the sample chamber is being operated in the first pressure range and the object is being charged due to the particle beam being fed onto the object, then the eleventh control parameter is changed such that the sample chamber is being operated in the second pressure range. In the second pressure range, for example, a gas with ions is then fed to the object, so that the charge of the object is neutralized on the surface of the object. A charging of the object is present, for example, when the image of the object is unstable, in particular when the brightness and/or the contrast of the image of the object changes/changes with multiple scans over the identical area of the object. The object is also charged, for example, if the same features are still recognizable in the image after a change in the direction of a scan due to a scan rotation and/or if the position of the object in the image changes. In addition or as an alternative to this, charging of the object is detected, for example, by comparing the image of the object with a further image of the object from a database, with the further image showing the object with charges. Machine learning in particular is used for the comparison.

The first group of method steps also includes driving the functional unit with the loaded first control parameter value of the control parameter using the control unit. In other words, the control unit is controlled with the loaded first control parameter value of the control parameter and for its part controls the functional unit again accordingly.

The first group of method steps also includes guiding the particle beam of the particle beam device onto the object using at least one guide unit of the particle beam device. A guidance unit is understood to mean any unit for guiding the particle beam onto the object, but also units for shaping the particle beam, which is then guided to the object. The guide unit is designed, for example, as an objective lens for focusing the particle beam on the object, as an electrostatic and/or magnetic unit for beam shaping or for beam guidance, as a stigmator, as a condenser lens or as a mechanically adjustable diaphragm unit with which the particle beam is limited. The guide unit is designed in particular as the functional unit already explained.

The first group of method steps also includes detecting interaction particles with at least one first detector of the particle beam device, the interaction particles resulting from an interaction of the particle beam with the object when the particle beam impinges on the object. The interaction particles are, for example, secondary particles emitted from the object, for example secondary electrons, particles scattered back from the object, which are also called backscatter particles, and/or scattered particles which transmit through the object, for example in the direction of the particle beam. The backscattered particles are, for example, backscattered electrons.

In addition, the first group of method steps includes generating first detection signals based on the detected interaction particles using the first detector. An image of the object is generated with the control unit using the first detection signals and displayed with a display unit of the particle beam device.

All of the aforementioned method steps of the first group of method steps can be carried out in the order described above. Alternatively, any order of the method steps of the first group of methods rensstufen usable, which is suitable for the invention.

The second group of method steps includes selecting an analysis mode of the particle beam device using the control unit of the particle beam device. The analysis mode is the mode of the particle beam device with which at least one representation of data about the object (for example a radiation spectrum, in particular an X-ray spectrum) is generated with the particle beam of the particle beam device.

In addition, the second group of method steps includes loading a second control parameter value of the control parameter of the control unit for controlling the functional unit of the particle beam device from the database into the control unit.

The second group of method steps also includes driving the functional unit with the loaded second control parameter value of the control parameter using the control unit. In other words, the control unit is controlled with the loaded second control parameter value of the control parameter and for its part controls the functional unit again accordingly. In particular, it is provided that a landing energy in the range from 10 keV to 20 keV is set with the second control parameter value of the control parameter. In addition or as an alternative to this, it is provided that a current of the particle beam in the range of a few microamperes is set with the second control parameter value of the control parameter. In addition or as an alternative to this, provision is made for the working distance to be set to a value in the range greater than 1 cm, for example in the range from 2 cm to 10 cm, with the second control parameter value of the control parameter.

The second group of method steps also includes guiding the particle beam of the particle beam device onto the object using the guide unit of the particle beam device.

The second group of method steps also includes detecting interaction radiation with at least one second detector of the particle beam device, the interaction radiation resulting from an interaction of the particle beam with the object when the particle beam impinges on the object. The interaction radiation is, for example, X-rays or cathodoluminescent light. For example, a radiation detector, in particular an EDX detector and/or a WDX detector, is used to detect the interaction radiation.

In addition, the second group of method steps includes generating second detection signals based on the detected interaction radiation using the second detector. A representation of data about the object (for example a radiation spectrum, in particular an X-ray spectrum) is generated with the control unit using the second detection signals and displayed with the display unit of the particle beam device. When X-ray radiation is detected, energy-dispersive X-ray spectroscopy or wavelength-dispersive X-ray spectroscopy can be carried out, for example. Both types of spectroscopy allow an analysis of the material composition of the object.

All of the aforementioned method steps of the second group of method steps can be carried out in the order described above. Alternatively, any order of the process steps of the second group of process steps suitable for the invention can be used.

The invention is based on the surprising finding that suitable values of the control parameter, which enable a desired quality of an image of the object on the one hand and a desired quality of a representation of data about the object on the other, are stored in a database of the particle beam device. For example, the first control parameter value and/or the second control parameter value of the control parameter are stored as a function of the object. This makes it possible to automatically load suitable values of the control parameters for the corresponding object from the database into the control unit for a desired quality of an image of the object and to control the functional unit of the particle beam device accordingly by means of the control unit. On the other hand, it is possible to automatically load suitable values of the control parameters for the corresponding object from the database into the control unit for a desired quality of a representation of data about the object and to control the functional unit of the particle beam device accordingly by means of the control unit. A manual setting of the control parameter values of the control parameter by a user of the particle beam device is therefore no longer absolutely necessary.

In one embodiment of the method according to the invention, it is additionally or alternatively provided to first determine suitable values for the first control parameter value and in the save database. In this embodiment of the method according to the invention, it is provided that before the first group of method steps is carried out, the following method steps are carried out: (a) Controlling the functional unit with a selectable control parameter value of the control parameter using the control unit, so that the image of the object with a desired image quality is achieved; and (b) storing the selectable control parameter value of the control parameter as the first control parameter value of the control parameter in the database. The desired image quality can be determined using objective criteria, for example. For example, the image quality of an image is better the better the resolution in the image is or the better the contrast is. Alternatively, the image quality can be determined using subjective criteria. In this case, a user individually determines whether the image quality achieved is sufficient for him or not. However, it can happen that the image quality that a first user finds to be sufficiently good is not sufficient for a second user. For example, the image quality of an image of an object can also be determined using the signal-to-noise ratio of the detector signal. If the signal-to-noise ratio is between 0 and 5, the image quality is not good enough. For example, one speaks of a good signal-to-noise ratio (and thus also of good and sufficient image quality) when the signal-to-noise ratio is in the range of 20 to 40. The direction of the secondary particle beam (ie the particle beam that has secondary electrons and/or backscattered electrons) can also be a measure of the image quality. The secondary electrons can be emitted from the object in different solid angles. Furthermore, the backscattered electrons can be scattered back into different solid angles on the object. The direction of the secondary particle beam (ie the solid angle in which the secondary particle beam runs) can be influenced by tilting the particle beam and/or the object to the optical axis of the particle beam device. This makes it possible, on the one hand, to select the direction of the secondary particle beam in such a way that the secondary particle beam impinges on a desired detector. On the other hand, both the number of generated secondary electrons and the number of backscattered electrons can be influenced by the above-mentioned tilting. If, for example, the particle beam enters the object parallel to a crystal lattice of an object, then the number of secondary electrons and/or backscattered electrons decreases. The detection signal becomes weaker. This leads to a reduction in image quality. The number of secondary electrons and backscattered electrons can be increased by adjusting the tilting of the particle beam. With such an adjustment it is possible to distinguish crystals with a first orientation from crystals with a second orientation based on the strength of the detection signal.

In a further embodiment of the method according to the invention, provision is additionally or alternatively made for further method steps to be carried out before the first group of method steps is carried out. The landing energy of the charged particles is thus set to a first value from a predefinable range of the landing energy. As explained above, the charged particles have this landing energy when they hit the object. In other words, the charged particle landing energy is the energy with which the object is examined and/or imaged. The landing energy of the charged particles can be different from the energy with which the charged particles are guided through a beam column of the particle beam device. In particular, provision is made for the charged particles to be accelerated very strongly at first and only to be decelerated to the landing energy shortly before they hit the object. This is explained in more detail below. The landing energy of the charged particles is, for example, in the range from 1 eV to 30 keV, including the range limits. However, the invention is not limited to the aforementioned range of landing energy. Rather, any range suitable for the invention may be used in the invention. In this embodiment of the method according to the invention, the functional unit is controlled with a selectable control parameter value of the control parameter, so that the image of the object is obtained with a desired image quality. With regard to the desired image quality, reference is made to the comments above, which also apply here. In addition, the landing energy is set to a second value from the predefinable range of the landing energy. The functional unit is controlled with a further selectable control parameter value of the control parameter, so that a further image of the object with a desired image quality is achieved. Here, too, reference is made to the comments above with regard to the desired image quality, which also apply here. Furthermore, a functional relationship between the selectable control parameter value and the further selectable control parameter value is determined as a function of the predefinable range of the landing energy. The functional relationship is stored in the database for calculating the first control parameter value before loading the first control parameter value from the database into the control unit.

In yet another embodiment of the method according to the invention, it is additionally or alternatively provided to first determine suitable values for the second control parameter value and store them in the database. In this embodiment of the method according to the invention, it is provided that before the second group of method steps is carried out, the following method steps are carried out: (a) Controlling the functional unit with an even further selectable control parameter value of the control parameter using the control unit, so that a desired representation of data about the object (e.g. a radiation spectrum, in particular an X-ray spectrum) is obtained; and (b) storing the still further selectable control parameter value of the control parameter as the second control parameter value of the control parameter in the database.

In one embodiment of the method according to the invention, it is additionally or alternatively provided to carry out further method steps before carrying out the second group of method steps. The landing energy of the charged particles is thus set to a further first value from a predefinable range of the landing energy. With regard to the landing energy and the range of the landing energy that can be specified, reference is made to the comments made above, which also apply here. In this embodiment of the method according to the invention, the functional unit is controlled with an even further selectable control parameter value of the control parameter, so that a first desired representation of data about the object is achieved. Regarding the desired presentation of data about the object, reference is made to the comments above, which also apply here. In addition, the landing energy is set to a further second value from the predefinable range of the landing energy. The functional unit is controlled with an in turn further selectable control parameter value of the control parameter, so that a second desired representation of data about the object is achieved. With regard to the desired presentation of data about the object, reference is also made here to the comments above, which also apply here. Furthermore, a functional relationship between the still further selectable control parameter value and the in turn further selectable control parameter value is determined as a function of the predefinable range of the landing energy. The functional relationship is stored in the database for calculating the second control parameter value before the second control parameter value is loaded from the database into the control unit.

In order to achieve a desired image quality of an image of an object and/or a desired quality of the representation of data about the object, it is provided in a further embodiment of the method according to the invention that a user as many as possible of the control parameters mentioned above and/or others are specified here non-mentioned control parameters are taken into account, with the physical effects achieved with the individual control parameters in turn influencing one another. The applicant is aware of the following further procedures for determining suitable values of the control parameters with which a desired image quality and/or quality of the presentation of data about the object can/can be achieved. For example, mathematical models can be used to determine suitable values for the individual control parameters in order to achieve a desired image quality and/or quality of the representation of data about the object. However, these calculated and theoretical values of the control parameters are often not suitable to achieve really good image quality and/or good representation of the data about the object. This can be because, for example, not all control parameters are taken into account in the mathematical models and/or the mathematical models are based on simplified assumptions that are more complex in reality. A further procedure provides for the values of the various control parameters to be determined experimentally, with a reference sample being used for the experimental determination, for example. The determined values of the control parameters are used to adjust the control unit of the particle beam device. The disadvantage, however, is that an object to be examined and imaged does not always match the reference sample, particularly with regard to the material composition and the topography. This can lead to imaging errors and thus to a deterioration in the image quality actually achieved. Another approach is to adjust the image quality and/or the representation of the data about the object by manually finding the desired image quality for an object to be imaged and/or the desired representation of the data about the object. First of all, the desired landing energy of the electrons is selected, with which the particles of the particle beam impinge on the object to be examined. Subsequently, the brightness, the contrast, the focusing, the centering of the particle beam in the objective lens, the beam shift and/or the position of the functional unit are varied and coordinated through experiments until the desired image quality and/or the desired representation of the Data about the object are/is obtained.

In yet another embodiment of the method according to the invention, it is additionally or alternatively provided that before carrying out the first group of method steps and/or the second group of method steps, a region on the object is determined to which the particle beam when carrying out the first group of method steps and/or the second group of method steps. In particular, it is provided that when the second group of method steps is carried out, before the interaction radiation is detected, interaction particles are initially detected again with the first detector of the particle beam device, further first detection signals are detected with the first detector, a further image of the object with the control unit below Using the first detection signals is generated and the particle beam is focused on the area using the further image of the object. Since it is quite possible that the previously selected area is no longer in the field of view of the particle beam device due to the change in the values of the control parameter, this ensures that when carrying out the second group of method steps, which have a different control parameter value than the method steps of the first Use group, the particle beam is always guided to the area to be analyzed. In particular, in one embodiment of the method according to the invention, a special feature on the surface of the object is identified in the image of the object. This special feature should also be visible in the further image of the object and is used as an orientation in such a way that the particle beam is guided to the previously selected area when carrying out the second group of method steps.

In yet another embodiment of the method according to the invention, provision is additionally or alternatively made for a first area on the object and a second area on the object to be determined before carrying out the first group of method steps and/or the second group of method steps. In other words, a first area on the object and a second area on the object are selected. When carrying out the first group of method steps and/or the second group of method steps, the particle beam is guided to the first area. In addition or as an alternative to this, the particle beam is guided to the second region when carrying out the first group of method steps and/or the second group of method steps. For example, when carrying out the method steps of the first group, the particle beam is first guided to the first area and then to the second area. Furthermore, for example, when the second group of method steps is carried out, the particle beam is first guided to the first area and then to the second area. As an alternative to this, provision is made for the particle beam to be guided to the first region when the first group of method steps is carried out and then again to the first region when the second group of method steps is carried out. Subsequently, when the first group of method steps is carried out again, the particle beam is guided to the second area and then when the second group of method steps is carried out again to the second area. However, the invention is not limited to this order. Rather, any order suitable for the invention can be used. Furthermore, it is provided, for example in one embodiment of the method according to the invention, to combine the image of the first area and the second area into a single image. The same applies analogously to the presentation of data about the object

In yet another embodiment of the method according to the invention, provision is additionally or alternatively made for at least one of the following method steps to be carried out: (a) storing the position of the first area in the database; (b) storing the location of the second region in the database; (c) determining for the first area whether the location of the origin of the interaction radiation is determined and storing the determination in the database; and (d) specifying for the second area whether the location of the origin of the interaction radiation is determined and storing the specification in the database. The aforementioned method steps (c) and (d) are advantageous because the location at which the interaction radiation occurs is also determined. This makes it possible to precisely determine the material composition at a specific location on the object.

As already stated above, in one embodiment of the method according to the invention it is additionally or alternatively provided that the first group of method steps and the second group of method steps are initially carried out for the first area and that the first group of method steps and the second Group of process steps are carried out for the second area.

• - Laden eines ersten Steuerparameterwertes des zweiten Steuerparameters der zweiten Steuereinheit zur Ansteuerung der zweiten Funktionseinheit des Teilchenstrahlgeräts aus einer Datenbank in die Steuereinheit. Hinsichtlich der Eigenschaften des zweiten Steuerparameters wird auf die Ausführungen zum Steuerparameter weiter oben verwiesen, die auch hier gelten;
• - Ansteuern der zweiten Funktionseinheit mit dem geladenen ersten Steuerparameterwert des zweiten Steuerparameters unter Verwendung der zweiten Steuereinheit. Mit anderen Worten ausgedrückt, wird die zweite Steuereinheit mit dem geladenen ersten Steuerparameterwert des zweiten Steuerparameters angesteuert und steuert ihrerseits wieder die zweite Funktionseinheit entsprechend an;
• - Erzeugen von dritten Detektionssignalen basierend auf den detektierten Wechselwirkungsteilchen unter Verwendung des ersten Detektors; sowie
• - Erzeugen des Bildes des Objekts mit der zweiten Steuereinheit unter Verwendung der dritten Detektionssignale.

In one embodiment of the method according to the invention, it is additionally or alternatively provided, in addition to that mentioned above Functional unit to use at least one other functional unit. In this embodiment of the method according to the invention, the functional unit of the particle beam device is a first functional unit, the control parameter is a first control parameter and the control unit is a first control unit for setting the first functional unit. Furthermore, the particle beam device has at least one second functional unit for guiding the particle beam onto the object. With regard to the possible design of the functional unit, reference is made to the statements made above, which also apply here. In addition, the particle beam device has at least one second control unit for controlling the second functional unit using a second control parameter. In the first group of method steps, this embodiment of the method according to the invention additionally has the following method steps:

• - Loading a first control parameter value of the second control parameter of the second control unit for controlling the second functional unit of the particle beam device from a database into the control unit. With regard to the properties of the second control parameter, reference is made to the comments on the control parameter above, which also apply here;
• - driving the second functional unit with the loaded first control parameter value of the second control parameter using the second control unit. In other words, the second control unit is controlled with the loaded first control parameter value of the second control parameter and in turn controls the second functional unit accordingly;
• - generating third detection signals based on the detected interaction particles using the first detector; such as
• - generating the image of the object with the second control unit using the third detection signals.

All of the aforementioned method steps of the first group of method steps can be carried out in the order described above. Alternatively, any order of the process steps of the first group of process steps suitable for the invention can be used.

• - Laden eines zweiten Steuerparameterwertes des zweiten Steuerparameters der zweiten Steuereinheit zur Ansteuerung der zweiten Funktionseinheit des Teilchenstrahlgeräts aus der Datenbank in die zweite Steuereinheit;
• - Ansteuern der Funktionseinheit mit dem geladenen zweiten Steuerparameterwert des zweiten Steuerparameters unter Verwendung der zweiten Steuereinheit. Mit anderen Worten ausgedrückt, wird die zweite Steuereinheit mit dem geladenen zweiten Steuerparameterwert des zweiten Steuerparameters angesteuert und steuert ihrerseits wieder die zweite Funktionseinheit entsprechend an;

• - Erzeugen von vierten Detektionssignalen basierend auf der detektierten Wechselwirkungsstrahlung unter Verwendung des zweiten Detektors; sowie
• - Erzeugen der Darstellung von Daten über das Objekt (beispielsweise ein Strahlungsspektrum, insbesondere ein Röntgenspektrum) mit der zweiten Steuereinheit unter Verwendung der vierten Detektionssignale.

In the second group of method steps, this embodiment of the method according to the invention additionally has the following method steps:

• - Loading a second control parameter value of the second control parameter of the second control unit for controlling the second functional unit of the particle beam device from the database into the second control unit;
• - driving the functional unit with the loaded second control parameter value of the second control parameter using the second control unit. In other words, the second control unit is controlled with the loaded second control parameter value of the second control parameter and in turn controls the second functional unit accordingly;

• - generating fourth detection signals based on the detected interaction radiation using the second detector; such as
• - Generating the representation of data about the object (for example a radiation spectrum, in particular an X-ray spectrum) with the second control unit using the fourth detection signals.

All of the aforementioned method steps of the second group of method steps can be carried out in the order described above. Alternatively, any order of the process steps of the second group of process steps suitable for the invention can be used.

In one embodiment of the method according to the invention, it is additionally or alternatively provided that the first control unit is used as the second control unit. In other words, an identical control unit is used as the first control unit and as the second control unit.

In a further embodiment of the method according to the invention, provision is additionally or alternatively made for the first group of method steps to be carried out first, then the second group of method steps and then the first group of method steps again. Furthermore, it is provided in particular that after the first group of method steps has been carried out again, the method steps of the second group of method steps are carried out again. In other words, the first group of method steps and the second group of method steps are carried out alternately (that is to say alternately).

• - der zweite Detektor wird bei Durchführung der ersten Gruppe von Verfahrensschritten in eine erste Position bewegt und bei Durchführung der zweiten Gruppe von Verfahrensschritten in eine zweite Position bewegt, wobei die erste Position weiter von dem Objekt als die zweite Position beabstandet ist. Auf diese Weise ist sichergestellt, dass die Wechselwirkungsstrahlung ausreichend gut mit dem in der zweiten Position angeordneten zweiten Detektor detektiert werden kann, da der Raumwinkel zur Detektion quadratisch mit dem Abstand zwischen dem zweiten Detektor und dem Objekt abnimmt. Wenn keine Wechselwirkungsstrahlung detektiert werden soll, dann wird der zweite Detektor in die erste Position bewegt. Dadurch ist es beispielsweise auch möglich, die Objektivlinse relativ zu dem Objekt mit einem Abstand von bis zu 5 mm anzuordnen;
• - als zweiter Detektor wird der erste Detektor verwendet. Mit anderen Worten ausgedrückt, wird als erster Detektor und als zweiter Detektor ein identischer Detektor verwendet.

In yet another embodiment of the method of the present invention, it is additional or alternatively provided that the method has at least one of the following method steps:

• - the second detector is moved to a first position when performing the first group of method steps and to a second position when performing the second group of method steps, the first position being spaced further from the object than the second position. This ensures that the interaction radiation can be detected sufficiently well with the second detector arranged in the second position, since the solid angle for detection decreases with the square of the distance between the second detector and the object. If no interaction radiation is to be detected, then the second detector is moved to the first position. This also makes it possible, for example, to arrange the objective lens at a distance of up to 5 mm relative to the object;
• - the first detector is used as the second detector. In other words, an identical detector is used as the first detector and as the second detector.

The invention also relates to a computer program product with a program code that can be loaded or is loaded into a processor of a particle beam device, the program code controlling the particle beam device when executed in the processor in such a way that a method with at least one of the above or following features or with a combination is performed by at least two of the above or below features.

The invention also relates to a particle beam device for generating an image of an object and/or a representation of data about the object, with the particle beam device already being explained above and being specified further below. This is briefly summarized below. The particle beam device according to the invention has at least one beam generator for generating a particle beam with charged particles. The charged particles are, for example, electrons or ions. The particle beam device also has a movable object holder on which the object can be arranged. Furthermore, the particle beam device has at least one functional unit. A functional unit is understood above and also below to mean a structural unit of the particle beam device, which can be adjusted in any way. For example, the position of the functional unit in the particle beam device can be adjusted. In addition or as an alternative, it is provided to set an electrostatic and/or magnetic configuration of the functional unit. The invention is not limited to the aforementioned adjustment options. Rather, the functional unit can be set up in any manner that is suitable for the invention.

The particle beam device according to the invention also has at least one control unit for controlling the functional unit. Furthermore, the particle beam device according to the invention has at least one guide unit for guiding the particle beam onto the object. The guide unit is designed as the functional unit, for example. Furthermore, the particle beam device according to the invention has at least one first detector for detecting interaction particles that result from an interaction of the particle beam with the object when the particle beam impinges on the object. In addition, the particle beam device according to the invention has at least one second detector for detecting interaction radiation, which results from an interaction of the particle beam with the object when the particle beam impinges on the object. Furthermore, the particle beam device according to the invention is provided with at least one display unit for displaying an image of the object and/or a representation of data about the object, the image and/or the representation being/is generated based on detection signals which are generated by the detected(s) Interaction particles and / or interaction radiation are generated. In addition, the particle beam device according to the invention has a processor in which a computer program product with the features already mentioned above is loaded.

• - mindestens eine Objektivlinse zur Fokussierung des Teilchenstrahls,
• - mindestens eine elektrostatische und/oder magnetische Einheit, wobei diese beispielsweise zur Zentrierung des Teilchenstrahls in der Objektivlinse, zur Einstellung der Rastergeschwindigkeit des Teilchenstrahls bei einer Rasterung des Teilchenstrahls über das Objekt oder zur Einstellung eines „Beamshift“ verwendet wird,
• - mindestens einen Stigmator,
• - mindestens eine mechanisch verstellbare Blendeneinheit, sowie
• - mindestens eine Kondensorlinse.

In a further embodiment of the particle beam device according to the invention, the guide unit comprises at least one of the following features:

• - at least one objective lens for focusing the particle beam,
• - at least one electrostatic and/or magnetic unit, which is used, for example, to center the particle beam in the objective lens, to adjust the raster speed of the particle beam when the particle beam is rastered over the object or to adjust a "beam shift",
• - at least one stigma,
• - at least one mechanically adjustable panel unit, as well as
• - at least one condenser lens.

In yet another embodiment of the particle beam device according to the invention, the functional unit comprises the movably designed object holder.

In yet another embodiment of the particle beam device according to the invention, it is additionally or alternatively provided that the beam generator is designed as a first beam generator and the particle beam as a first particle beam with first charged particles. The guide unit is designed as a first guide unit for guiding the first particle beam onto the object. Furthermore, the particle beam device according to the invention has at least one second beam generator for generating a second particle beam with second charged particles. In addition, the particle beam device according to the invention has at least one second guide unit for guiding the second particle beam onto the object.

In particular, provision is made for the particle beam device according to the invention to be in the form of an electron beam device and/or an ion beam device.

• 1 eine schematische Darstellung eines erfindungsgemäßen Teilchenstrahlgeräts;
• 1A eine schematische Darstellung einer Steuereinheit, die mit Funktionseinheiten und Führungseinheiten des Teilchenstrahlgeräts gemäß 1 verbunden ist;
• 2 eine schematische Darstellung eines weiteren erfindungsgemäßen Teilchenstrahlgeräts;
• 2A eine schematische Darstellung einer Steuereinheit, die mit Funktionseinheiten und Führungseinheiten des Teilchenstrahlgeräts gemäß 2 verbunden ist;
• 3 eine schematische Darstellung eines noch weiteren erfindungsgemäßen Teilchenstrahlgeräts;
• 3A eine schematische Darstellung einer Steuereinheit, die mit Funktionseinheiten und Führungseinheiten des Teilchenstrahlgeräts gemäß 3 verbunden ist;
• 4 ein Ablaufdiagramm einer Ausführungsform des erfindungsgemäßen Verfahrens;
• 5 ein Ablaufdiagramm einer ersten Gruppe von Verfahrensschritten des erfindungsgemäßen Verfahrens;
• 6 ein Ablaufdiagramm einer zweiten Gruppe von Verfahrensschritten des erfindungsgemäßen Verfahrens;
• 7 ein Ablaufdiagramm von weiteren Verfahrensschritten des erfindungsgemäßen Verfahrens;
• 8 ein Ablaufdiagramm von noch weiteren Verfahrensschritten des erfindungsgemäßen Verfahrens;
• 9 ein Ablaufdiagramm von wiederum weiteren Verfahrensschritten des erfindungsgemäßen Verfahrens;
• 10 ein Ablaufdiagramm von Verfahrensschritten des erfindungsgemäßen Verfahrens;
• 11 ein Ablaufdiagramm von weiteren Verfahrensschritten des erfindungsgemäßen Verfahrens;
• 12 ein Ablaufdiagramm von noch weiteren Verfahrensschritten des erfindungsgemäßen Verfahrens;
• 13 einen weiteren Verfahrensschritt des erfindungsgemäßen Verfahrens;
• 14 ein Ablaufdiagramm von weiteren Verfahrensschritten des erfindungsgemäßen Verfahrens;
• 15 einen wiederum weiteren Verfahrensschritt des erfindungsgemäßen Verfahrens;
• 16 ein Ablaufdiagramm von noch weiteren Verfahrensschritten des erfindungsgemäßen Verfahrens;
• 17 einen weiteren Verfahrensschritt des erfindungsgemäßen Verfahrens; sowie
• 18 einen wiederum weiteren Verfahrensschritt des erfindungsgemäßen Verfahrens.

Further practical embodiments and advantages of the invention are described below in connection with the drawings. Show it:

• 1 a schematic representation of a particle beam device according to the invention;
• 1A a schematic representation of a control unit with functional units and management units of the particle beam device according to FIG 1 connected is;
• 2 a schematic representation of a further particle beam device according to the invention;
• 2A a schematic representation of a control unit with functional units and management units of the particle beam device according to FIG 2 connected is;
• 3 a schematic representation of yet another particle beam device according to the invention;
• 3A a schematic representation of a control unit with functional units and management units of the particle beam device according to FIG 3 connected is;
• 4 a flowchart of an embodiment of the method according to the invention;
• 5 a flow chart of a first group of method steps of the method according to the invention;
• 6 a flowchart of a second group of method steps of the method according to the invention;
• 7 a flowchart of further method steps of the method according to the invention;
• 8th a flow chart of further method steps of the method according to the invention;
• 9 a flow chart of further method steps of the method according to the invention;
• 10 a flowchart of method steps of the method according to the invention;
• 11 a flowchart of further method steps of the method according to the invention;
• 12 a flow chart of further method steps of the method according to the invention;
• 13 a further process step of the process according to the invention;
• 14 a flowchart of further method steps of the method according to the invention;
• 15 an in turn further process step of the process according to the invention;
• 16 a flow chart of further method steps of the method according to the invention;
• 17 a further process step of the process according to the invention; such as
• 18 an in turn further process step of the process according to the invention.

The invention will now be explained in more detail using particle beam devices in the form of an SEM and in the form of a combination device which has an electron beam column and an ion beam column. It is expressly pointed out that the invention can be used in any particle beam device, in particular in any electron beam device and/or any ion beam device.

1 shows a schematic representation of an SEM 100. The SEM 100 has a first beam generator in the form of an electron source 101, which is designed as a cathode. Furthermore, the SEM 100 is provided with an extraction electrode 102 and an anode 103 which is placed on one end of a beam guiding tube 104 of the SEM 100 . For example, the electron source 101 is designed as a thermal field emitter. However, the invention is not limited to such Electron source 101 restricted. Rather, any electron source suitable for the invention can be used.

Electrons exiting the electron source 101 form a primary electron beam. The electrons are accelerated to anode potential due to a potential difference between the electron source 101 and the anode 103 . In the embodiment shown here, the anode potential is 100 V to 35 kV compared to a ground potential of a housing of a sample chamber 120, for example 5 kV to 15 kV, in particular 8 kV. Alternatively, it could also be at ground potential.

Two condenser lenses are arranged on the beam guiding tube 104, namely a first condenser lens 105 and a second condenser lens 106. Starting from the electron source 101 in the direction of a first objective lens 107, first the first condenser lens 105 and then the second condenser lens 106 are arranged. It is explicitly pointed out that further embodiments of the SEM 100 can only have a single condenser lens. A first diaphragm unit 108 is arranged between the anode 103 and the first condenser lens 105 . The first diaphragm unit 108, together with the anode 103 and the beam guidance tube 104, is at high-voltage potential, namely the potential of the anode 103 or at ground. The first diaphragm unit 108 has numerous first diaphragm openings 108A, one of which is in 1 is shown. For example, there are two first apertures 108A. Each of the plurality of first apertures 108A has a different aperture diameter. It is possible to adjust a desired first diaphragm opening 108A to an optical axis OA of the SEM 100 by means of an adjustment mechanism (not shown). It is explicitly pointed out that in further embodiments the first screen unit 108 can be provided with only a single first screen opening 108A. In this embodiment, an adjustment mechanism cannot be provided. The first panel unit 108 is then designed to be stationary. A stationary second diaphragm unit 109 is arranged between the first condenser lens 105 and the second condenser lens 106 . As an alternative to this, provision is made for the second screen unit 109 to be designed to be movable.

The first objective lens 107 has pole shoes 110 in which a bore is formed. The beam guiding tube 104 is guided through this bore. A coil 111 is arranged in the pole shoes 110 .

An electrostatic deceleration device is arranged in a lower region of the beam guiding tube 104 . This has a single electrode 112 and a tubular electrode 113 . The tubular electrode 113 is arranged at one end of the beam guidance tube 104 which faces an object 125 which is arranged on a movable object holder 114 .

The tube electrode 113 lies together with the beam guiding tube 104 at the potential of the anode 103, while the individual electrode 112 and the object 125 lie at a potential which is lower than the potential of the anode 103. In the present case, this is the ground potential of the housing of the sample chamber 120. In this way, the electrons of the primary electron beam can be decelerated to a desired energy that is desired for examining the object 125.

The SEM 100 also has a scanning device 115, by which the primary electron beam can be deflected and scanned (or rastered) over the object 125. The electrons of the primary electron beam thereby interact with the object 125. As a result of the interaction, interaction particles arise which are detected. In particular, electrons are emitted from the surface of the object 125 as interaction particles—so-called secondary electrons—or electrons of the primary electron beam are scattered back—so-called backscattered electrons.

The object 125 and the individual electrode 112 can also be at different potentials and different from ground. This makes it possible to adjust the location of the deceleration of the primary electron beam in relation to the object 125 . For example, if the deceleration is carried out very close to the object 125, imaging errors become smaller.

A detector arrangement, which has a first detector 116 and a second detector 117, is arranged in the beam guidance tube 104 to detect the secondary electrons and/or the backscattered electrons. The first detector 116 is arranged along the optical axis OA on the source side, while the second detector 117 is arranged on the object side along the optical axis OA in the beam guiding tube 104 . The first detector 116 and the second detector 117 are offset from one another in the direction of the optical axis OA of the SEM 100 . Both the first detector 116 and the second detector 117 each have a passage opening through which the primary electron beam can pass. The first detector 116 and the second detector 117 are approximately on the Potential of the anode 103 and the beam guiding tube 104. The optical axis OA of the SEM 100 runs through the respective through openings.

The second detector 117 mainly serves to detect secondary electrons. When exiting the object 125, the secondary electrons initially have a low kinetic energy and any direction of movement. The secondary electrons are accelerated in the direction of the first objective lens 107 by the strong extraction field emanating from the tubular electrode 113 . The secondary electrons enter the first objective lens 107 approximately in parallel. The bundle diameter of the secondary electron beam also remains small in the first objective lens 107 . The first objective lens 107 now has a strong effect on the secondary electrons and creates a comparatively short focus of the secondary electrons with sufficiently steep angles to the optical axis OA, so that the secondary electrons diverge far after the focus and hit the second detector 117 on its active surface. Electrons backscattered at the object 125--that is, backscattered electrons which, compared to the secondary electrons, have a relatively high kinetic energy when exiting the object 125--are detected by the second detector 117 only to a small extent. The high kinetic energy and the angle of the backscattered electrons to the optical axis OA when exiting the object 125 mean that a beam waist, ie a beam area with a minimal diameter, of the backscattered electrons is in the vicinity of the second detector 117 . A large part of the backscattered electrons passes through the through hole of the second detector 117 . The first detector 116 is therefore essentially used to detect the backscattered electrons.

In a further embodiment of the SEM 100, the first detector 116 can additionally be formed with an opposing field grating 116A. The opposing field grating 116A is arranged on the side of the first detector 116 facing the object 125 . The opposing field grid 116A has a negative potential with respect to the potential of the beam guidance tube 104 such that only backscattered electrons with a high energy reach the first detector 116 through the opposing field grid 116A. Additionally or alternatively, the second detector 117 has a further opposing field grating, which is designed analogously to the aforementioned opposing field grating 116A of the first detector 116 and has an analogous function.

Furthermore, in the sample chamber 120, the SEM 100 has a chamber detector 119, such as an Everhart-Thornley detector or an ion detector, which has a metal-coated detection surface that shields light.

The detection signals generated by the first detector 116, the second detector 117 and the chamber detector 119 are used to generate an image or images of the surface of the object 125.

It is explicitly pointed out that the diaphragm openings of the first diaphragm unit 108 and the second diaphragm unit 109 and the passage openings of the first detector 116 and the second detector 117 are shown in an exaggerated manner. The passage openings of the first detector 116 and the second detector 117 have an extension perpendicular to the optical axis OA in the range of 0.5 mm to 5 mm. For example, they are circular and have a diameter in the range of 1 mm to 3 mm perpendicular to the optical axis OA.

In the embodiment shown here, the second diaphragm unit 109 is designed as a perforated diaphragm and is provided with a second diaphragm opening 118 for the passage of the primary electron beam, which has an extension in the range from 5 μm to 500 μm, for example 35 μm. As an alternative to this, it is provided in a further embodiment that the second diaphragm unit 109 is provided with a plurality of diaphragm openings which can be mechanically shifted to the primary electron beam or which can be achieved using electrical and/or magnetic deflection elements from the primary electron beam. The second diaphragm unit 109 is designed as a pressure stage diaphragm. This separates a first area, in which the electron source 101 is arranged and in which there is an ultra-high vacuum (10 ^-7 hPa to 10 ^-12 hPa), from a second area, which has a high vacuum (10 ^-3 hPa to 10 ^-7 hPa ). The second area is the intermediate pressure area of the beam guiding tube 104 which leads to the sample chamber 120 .

The sample chamber 120 is under vacuum. A pump (not shown) is arranged on the sample chamber 120 to generate the vacuum. At the in 1 illustrated embodiment, the sample chamber 120 is operated in a first pressure range or in a second pressure range. The first pressure range only includes pressures less than or equal to 10 ^-3 hPa, and the second pressure range only includes pressures greater than 10 ^-3 hPa. In order to ensure these pressure ranges, the sample chamber 120 is sealed in terms of vacuum technology.

The object holder 114 is arranged on a sample table 122 . The sample table 122 is arranged in three mutually perpendicular directions designed to be movable, namely in an x-direction (first table axis), in a y-direction (second table axis) and in a z-direction (third table axis). In addition, the sample table 122 can be rotated about two axes of rotation (table rotation axes) arranged perpendicular to one another. The invention is not limited to the sample table 122 described above. Rather, the sample stage 122 can have further translational axes and rotational axes along or around which the sample stage 122 can move.

The SEM 100 also has a third detector 121 which is arranged in the sample chamber 120 . More specifically, the third detector 121 is arranged behind the sample stage 122 when viewed from the electron source 101 along the optical axis OA. The sample table 122 and thus the object holder 114 can be rotated in such a way that the object 125 arranged on the object holder 114 can be irradiated by the primary electron beam. When the primary electron beam passes through the object 125 to be examined, the electrons of the primary electron beam interact with the material of the object 125 to be examined. The electrons passing through the object 125 to be examined are detected by the third detector 121 .

A radiation detector 500 is arranged on the sample chamber 120, with which interaction radiation, for example X-rays and/or cathodoluminescence light, is detected. The radiation detector 500, the first detector 116, the second detector 117 and the chamber detector 119 are connected to a control unit 123 which has a monitor 124. The third detector 121 is also connected to the control unit 123 . This is not shown for reasons of clarity. The control unit 123 processes detection signals which are generated by the first detector 116, the second detector 117, the chamber detector 119, the third detector 121 and/or the radiation detector 500 and displays them in the form of images on the monitor 124.

The control unit 123 also has a database 126 in which data is stored and from which data is read. Furthermore, the control unit 123 is connected to the scanning device 115 . In addition, the control unit 123 is connected to other units of the SEM 100 . This is explained in more detail below.

The control unit 123 of the SEM 100 has a processor. A computer program product with program code is loaded into the processor, which when executed executes a method for operating the SEM 100 . This is explained in more detail below.

1A shows a schematic representation of the control unit 123 of the SEM 100. As already explained in part above, the control unit 123 of the SEM 100 is connected to functional units and management units of the SEM 100 by line technology. A functional unit is understood to mean a structural unit of the SEM 100 which can be adjusted in any way. For example, the position of the functional unit in the SEM 100 can be adjusted. In addition or as an alternative, it is provided to set an electrostatic and/or magnetic configuration of the functional unit. The invention is not limited to the aforementioned adjustment options. Rather, the functional unit can be set up in any manner that is suitable for the invention. A guidance unit is understood to mean any unit for guiding the primary electron beam onto the object 125, but also units for shaping the primary electron beam, which is then guided to the object 125. The guide unit is embodied, for example, as the first objective lens 107 for focusing the primary electron beam on the object 125, as an electrostatic and/or magnetic unit for beam shaping or for beam guidance, as a stigmator, as a condenser lens, or as a mechanically adjustable diaphragm unit with which the primary electron beam is limited . 1A shows the control unit 123, which is connected to functional units and/or management units of the SEM 100 by means of lines. More precisely, the control unit 123 is connected to the electron source 101, to the extraction electrode 102, to the anode 103, to the first diaphragm unit 108, to the first condenser lens 105, to the second condenser lens 106, to the first detector 116, to the second detector 117 , to the third detector 121, to the chamber detector 119, to the radiation detector 500, to the scanning device 115, to the coil 111, to the tubular electrode 113, to the single electrode 112 and to the sample stage 122.

2 shows a particle beam device in the form of a combination device 200. The combination device 200 has two particle beam columns. On the one hand, the combination device 200 is provided with the SEM 100, as shown in FIG 1 is already shown, but without the sample chamber 120. Rather, the SEM 100 is arranged on a sample chamber 201. The sample chamber 201 is under vacuum. A pump (not shown) is arranged on the sample chamber 201 to generate the vacuum. At the in 2 illustrated embodiment, the sample chamber 201 is operated in a first pressure range or in a second pressure range. The first pressure range includes only pressures smaller or equal to 10 ^-3 hPa, and the second pressure range only includes pressures greater than 10 ^-3 hPa. In order to ensure these pressure ranges, the sample chamber 201 is sealed in terms of vacuum technology.

The chamber detector 119 is arranged in the sample chamber 201 and is designed, for example, as an Everhart-Thornley detector or an ion detector and has a metal-coated detection surface that shields light. Furthermore, the third detector 121 is arranged in the sample chamber 201 .

The SEM 100 serves to generate a first particle beam, namely the primary electron beam already described above, and has the optical axis already mentioned above, which is shown in FIG 2 is provided with the reference number 709 and is also referred to below as the first beam axis. On the other hand, the combination device 200 is provided with an ion beam device 300 which is also arranged on the sample chamber 201 . The ion beam device 300 also has an optical axis in the 2 is provided with the reference number 710 and is also referred to below as the second beam axis.

The SEM 100 is arranged vertically with respect to the sample chamber 201 . In contrast, the ion beam device 300 is arranged inclined at an angle of approximately 0° to 90° to the SEM 100 . In the 2 an arrangement of approx. 50° is shown, for example. The ion beam device 300 has a second beam generator in the form of an ion beam generator 301 . The ion beam generator 301 generates ions that form a second particle beam in the form of an ion beam. The ions are accelerated by means of an extraction electrode 302, which is at a predeterminable potential. The second particle beam then passes through ion optics of the ion beam device 300 , the ion optics having a condenser lens 303 and a second objective lens 304 . Finally, the second objective lens 304 produces an ion probe which is focused on the object 125 arranged on an object holder 114 . The object holder 114 is arranged on a sample table 122 .

An adjustable or selectable diaphragm 306, a first electrode arrangement 307 and a second electrode arrangement 308 are arranged above the second objective lens 304 (i.e. in the direction of the ion beam generator 301), the first electrode arrangement 307 and the second electrode arrangement 308 being designed as scanning electrodes. The second particle beam is scanned (or rastered) over the surface of the object 125 by means of the first electrode arrangement 307 and the second electrode arrangement 308, with the first electrode arrangement 307 acting in a first direction and the second electrode arrangement 308 in a second direction, that of the first direction is opposite. The scanning thus takes place, for example, in an x-direction. The scanning in a y-direction perpendicular thereto is carried out by further electrodes (not shown) rotated by 90° on the first electrode arrangement 307 and on the second electrode arrangement 308.

As explained above, the object holder 114 is arranged on the sample table 122 . Also at the in 2 In the embodiment shown, the sample stage 122 is designed to be movable in three mutually perpendicular directions, namely in an x-direction (first stage axis), in a y-direction (second stage axis) and in a z-direction (third stage axis). In addition, the sample table 122 can be rotated about two axes of rotation (table rotation axes) arranged perpendicular to one another.

The one in the 2 The distances shown between the individual units of the combination device 200 are exaggerated in order to show the individual units of the combination device 200 better.

A radiation detector 500 is arranged on the sample chamber 201, with which interaction radiation, for example X-rays and/or cathodoluminescence light, is detected. The radiation detector 500 is connected to a control unit 123 which has a monitor 124 .

The control unit 123 processes detection signals which are received from the first detector 116, the second detector 117 (in 2 not shown), the chamber detector 119, the third detector 121 and/or the radiation detector 500 and displays these in the form of images on the monitor 124.

The control unit 123 also has a database 126 in which data is stored and from which data is read. Furthermore, the control unit 123 is connected to the scanning device 115 .

The control unit 123 of the combination device 200 has a processor. A computer program product with a program code is loaded into the processor, which, when executed, executes a method for operating the combination device 200 . This is explained in more detail below.

2A shows a schematic representation of the control unit 123 of the combination device 200. As already explained in part above, the control unit 123 of the combination device 200 is also included Functional units and management units of the combination device 200 wired connected. A functional unit is understood to mean a structural unit of the combination device 200 which can be adjusted in any way. For example, the position of the functional unit in the combination device 200 can be adjusted. In addition or as an alternative, it is provided to set an electrostatic and/or magnetic configuration of the functional unit. The invention is not limited to the aforementioned adjustment options. Rather, the functional unit can be set up in any manner that is suitable for the invention. A guiding unit is any unit for guiding the primary electron beam and/or the ion beam onto the object 125, but also units for shaping the primary electron beam and/or the ion beam, which is/are then guided to the object 125. The guide unit is designed, for example, as the first objective lens 107 or the second objective lens 304, as an electrostatic and/or magnetic unit for beam shaping or for beam guidance, as a stigmator, as a condenser lens or as a mechanically adjustable diaphragm unit with which the primary electron beam and/or the ion beam is limited. 2A shows the control unit 123, which is wired to the electron source 101, to the extraction electrode 102, to the anode 103, to the first diaphragm unit 108, to the first condenser lens 105, to the second condenser lens 106, to the first detector 116, to the second detector 117, with the third detector 121, with the chamber detector 119, with the radiation detector 500, with the scanning device 115, with the coil 111, with the tubular electrode 113, with the individual electrode 112, with the sample table 122, with the ion beam generator 301, with the extraction electrode 302 in the ion beam device 300, with the condenser lens 303 in the ion beam device 300, with the adjustable or selectable diaphragm 306, with the first electrode arrangement 307 and with the second electrode arrangement 308.

3 12 is a schematic representation of a further embodiment of a particle beam device according to the invention. This embodiment of the particle beam device is provided with reference number 400 and includes a mirror corrector for correcting, for example, chromatic and/or spherical aberration. The particle beam device 400 includes a particle beam column 401, which is designed as an electron beam column and essentially corresponds to an electron beam column of a corrected SEM. However, the particle beam device 400 is not limited to an SEM with a mirror corrector. Rather, the particle beam device can include any type of corrector units.

The particle beam column 401 comprises a particle beam generator in the form of an electron source 402 (cathode), an extraction electrode 403 and an anode 404. For example, the electron source 402 is designed as a thermal field emitter. Electrons exiting electron source 402 are accelerated toward anode 404 due to a potential difference between electron source 402 and anode 404 . Accordingly, a particle beam is formed in the form of an electron beam along a first optical axis OA1.

The particle beam is guided along a beam path corresponding to the first optical axis OA1 after the particle beam exits from the electron source 402 . A first electrostatic lens 405, a second electrostatic lens 406 and a third electrostatic lens 407 are used to guide the particle beam.

Furthermore, the particle beam is adjusted along the beam path using a beam guiding device. The beam guidance device of this embodiment comprises a source adjustment unit with two magnetic deflection units 408 arranged along the first optical axis OA1. In addition, the particle beam device 400 includes electrostatic beam deflection units. A first electrostatic beam deflection unit 409, which is also designed as a quadrupole in a further embodiment, is arranged between the second electrostatic lens 406 and the third electrostatic lens 407. The first electrostatic beam deflection unit 409 is arranged behind the magnetic deflection units 408 . A first multipole unit 409A in the form of a first magnetic deflection unit is arranged on one side of the first electrostatic beam deflection unit 409 . In addition, a second multipole unit 409B in the form of a second magnetic deflection unit is arranged on the other side of the first electrostatic beam deflection unit 409 . The first electrostatic beam deflecting unit 409, the first multipole unit 409A and the second multipole unit 409B are adjusted to adjust the particle beam with respect to the axis of the third electrostatic lens 407 and the entrance window of a beam deflector 410. The first electrostatic beam deflection unit 409, the first multipole unit 409A and the second multipole unit 409B can work together like a Wien filter. A further magnetic deflection element 432 is arranged at the entrance of the beam deflection device 410 .

The beam deflection device 410 is used as a particle beam deflector, which deflects the particle beam in a specific manner. the Beam deflector 410 includes a plurality of magnetic sectors, namely a first magnetic sector 411A, a second magnetic sector 411B, a third magnetic sector 411C, a fourth magnetic sector 411D, a fifth magnetic sector 411E, a sixth magnetic sector 411F and a seventh magnetic sector 411G. The particle beam enters the beam deflector 410 along the first optical axis OA1 and is deflected by the beam deflector 410 in the direction of a second optical axis OA2. The beam is deflected by the first magnetic sector 411A, the second magnetic sector 411B and the third magnetic sector 411C through an angle of 30° to 120°. The second optical axis OA2 is oriented at the same angle to the first optical axis OA1. The beam deflection device 410 also deflects the particle beam, which is guided along the second optical axis OA2, specifically in the direction of a third optical axis OA3. Beam deflection is provided by third magnetic sector 411C, fourth magnetic sector 411D and fifth magnetic sector 411E. In the embodiment in 3 the deflection to the second optical axis OA2 and to the third optical axis OA3 is provided by deflection of the particle beam at an angle of 90°. The third optical axis OA3 thus runs coaxially with the first optical axis OA1. However, it is pointed out that the particle beam device 400 according to the invention described here is not limited to a deflection angle of 90°. Rather, any suitable deflection angle can be selected by the beam deflection device 410, for example 70° or 110°, so that the first optical axis OA1 does not run coaxially with the third optical axis OA3. For further details of the beam deflection device 410, reference is made to FIG WO 2002/067286 A2 taken.

After the particle beam is deflected by the first magnetic sector 411A, the second magnetic sector 411B and the third magnetic sector 411C, the particle beam is guided along the second optical axis OA2. The particle beam is guided to an electrostatic mirror 414 and on its way to the electrostatic mirror 414 passes a fourth electrostatic lens 415, a third multipole unit 416A in the form of a magnetic deflector, a second electrostatic beam deflector 416, a third electrostatic beam deflector 417 and a fourth Multipole unit 416B in the form of a magnetic deflection unit. The electrostatic mirror 414 includes a first mirror electrode 413A, a second mirror electrode 413B and a third mirror electrode 413C. Electrons of the particle beam, which are reflected back at the electrostatic mirror 414, again run along the second optical axis OA2 and enter the beam deflection device 410 again. They are then deflected to the third optical axis OA3 by the third magnetic sector 411C, the fourth magnetic sector 411D and the fifth magnetic sector 411E.

The electrons of the particle beam emerge from the beam deflection device 410 and are guided along the third optical axis OA3 to an object 425 that is to be examined and is arranged in an object holder 114 . On the way to the object 425, the particle beam is guided to a fifth electrostatic lens 418, a beam guiding tube 420, a fifth multipole unit 418A, a sixth multipole unit 418B and an objective lens 421. The fifth electrostatic lens 418 is an electrostatic immersion lens. The particle beam is decelerated or accelerated by the fifth electrostatic lens 418 to an electric potential of the beam guiding tube 420 .

The particle beam is focused by the objective lens 421 in a focal plane in which the object 425 is arranged. The object holder 114 is arranged on a movable sample table 424 . The movable sample table 424 is arranged in a sample chamber 426 of the particle beam device 400 . The sample stage 424 is designed to be movable in three mutually perpendicular directions, namely in an x-direction (first stage axis), in a y-direction (second stage axis) and in a z-direction (third stage axis). In addition, the sample table 424 can be rotated about two axes of rotation (table rotation axes) arranged perpendicular to one another.

The sample chamber 426 is under vacuum. A pump (not shown) is arranged on the sample chamber 426 to generate the vacuum. At the in 3 illustrated embodiment, the sample chamber 426 is operated in a first pressure range or in a second pressure range. The first pressure range only includes pressures less than or equal to 10 ^-3 hPa, and the second pressure range only includes pressures greater than 10 ^-3 hPa. In order to ensure these pressure ranges, the sample chamber 426 is sealed in terms of vacuum technology.

The objective lens 421 can be formed as a combination of a magnetic lens 422 and a sixth electrostatic lens 423 . The end of the beam guiding tube 420 can also be an electrode of an electrostatic lens. Particles of the particle beam device - after they emerge from the beam guide tube 420 - on a potential of the object 425 is slowed down. The objective lens 421 is not limited to a combination of the magnetic lens 422 and the sixth electrostatic lens 423. Rather, the objective lens 421 can take any suitable form. For example, the objective lens 421 can also be designed as a purely magnetic lens or as a purely electrostatic lens.

The particle beam, which is focused on the object 425, interacts with the object 425. Interaction particles are generated. In particular, secondary electrons are emitted from the object 425 or backscattered electrons are backscattered on the object 425 . The secondary electrons or the backscattered electrons are accelerated again and guided into the beam guiding tube 420 along the third optical axis OA3. In particular, the paths of the secondary electrons and the backscattered electrons run in the opposite direction to the particle beam on the path of the particle beam.

The particle beam device 400 includes a first analysis detector 419, which is arranged along the beam path between the beam deflection device 410 and the objective lens 421. Secondary electrons traveling in directions oriented at a large angle with respect to the third optical axis OA3 are detected by the first analysis detector 419 . Backscattered electrons and secondary electrons which have a small axial distance with respect to the third optical axis OA3 at the location of the first analysis detector 419 - i.e. backscattered electrons and secondary electrons which have a small distance from the third optical axis OA3 at the location of the first analysis detector 419 - enter the beam deflection device 410 and are deflected by the fifth magnetic sector 411E, the sixth magnetic sector 411F and the seventh magnetic sector 411G along a detection beam path 427 to a second analysis detector 428. The deflection angle is 90° or 110°, for example.

The first analysis detector 419 generates detection signals largely generated by emitted secondary electrons. The detection signals generated by the first analysis detector 419 are fed to a control unit 123 and are used to obtain information about the properties of the interaction region of the focused particle beam with the object 425 . In particular, the focused particle beam is scanned across the object 425 using a scanner 429 . An image of the scanned area of the object 425 can then be generated by the detection signals generated by the first analysis detector 419 and displayed on a display unit. The display unit is a monitor 124, for example, which is arranged on the control unit 123.

The second analysis detector 428 is also connected to the control unit 123 . Detection signals from the second analysis detector 428 are fed to the control unit 123 and used to generate an image of the scanned area of the object 425 and to display it on a display unit. The display unit is, for example, the monitor 124 which is arranged on the control unit 123 .

A radiation detector 500 is arranged on the sample chamber 426, with which interaction radiation, for example X-rays and/or cathodoluminescence light, is detected. The radiation detector 500 is connected to the control unit 123 which has the monitor 124 . The control unit 123 processes detection signals from the radiation detector 500 and displays them on the monitor 124 in the form of images.

The control unit 123 also has a database 126 in which data is stored and from which data is read. Furthermore, the control unit 123 is connected to the scanning device 429 .

The control unit 123 of the particle beam device 400 has a processor. A computer program product with a program code is loaded into the processor, which, when executed, executes a method for operating the particle beam device 400 .

3A shows a schematic representation of the control unit 123 of the particle beam device 400. As already explained in part above, the control unit 123 of the particle beam device 400 is connected to functional units and management units of the particle beam device 400 by line technology. A functional unit is understood to mean a structural unit of the particle beam device 400 which can be adjusted in any way. For example, the position of the functional unit in the particle beam device 400 can be adjusted. In addition or as an alternative, it is provided to set an electrostatic and/or magnetic configuration of the functional unit. The invention is not limited to the aforementioned adjustment options. Rather, the functional unit can be set up in any manner that is suitable for the invention. A guidance unit is understood to mean any unit for guiding the particle beam onto the object 425, but also units for shaping the particle beam, which is then guided to the object 425. The leadership The unit is embodied, for example, as the objective lens 421 for focusing the particle beam on the object 425, as an electrostatic and/or magnetic unit for beam shaping or for beam guidance, as a stigmator, as a condenser lens, or as a mechanically adjustable diaphragm unit with which the particle beam is limited. 3A shows the control unit 123, which is wired to the electron source 402, to the extraction electrode 403, to the anode 404, to the first electrostatic lens 405, to the second electrostatic lens 406, to the third electrostatic lens 407, to the magnetic deflection unit 408 the first electrostatic beam deflection unit 409, with the first multipole unit 409A, with the second multipole unit 409B, with the beam deflection device 410, with the first magnetic sector 411A, with the second magnetic sector 411B, with the third magnetic sector 411C, with the fourth magnetic sector 411D , with the fifth magnetic sector 411E, with the sixth magnetic sector 411F, with the seventh magnetic sector 411G, with the first mirror electrode 413A, with the second game electrode 413B, with the third mirror electrode 413C, with the fourth electrostatic lens 415, with the second electrostatic beam deflection unit 416, with which dr middle multipole unit 416A, with the fourth multipole unit 416B, with the third electrostatic beam deflection unit 417, with the fifth electrostatic lens 418, with the fifth multipole unit 418A, with the sixth multipole unit 418B, with the first analysis detector 419, with the magnetic lens 422, with the sixth electrostatic lens 423, with the sample table 424, with the second analysis detector 428, with the scanning device 429, with the further magnetic deflection element 432 and with the radiation detector 500.

4 shows an embodiment of the method according to the invention with the SEM 100 according to the 1 is performed. The same applies to the execution of this embodiment of the method according to the invention in the other particle beam devices 200 and 400 mentioned above.

The embodiment of the method according to the invention serves to generate an image of the object 125 and/or a representation of data about the object 125 (for example a radiation spectrum, in particular an X-ray spectrum) with the SEM 100. The embodiment of the method according to the invention has a first group of method steps and a second group of process steps. The first group of method steps is carried out in method step S1. The second group of method steps is carried out in method step S2. The first group and the second group of method steps are explained in more detail below.

5 shows an embodiment of the first group of method steps. The first group of method steps includes method step S11. In method step S11, an imaging mode of the SEM 100 is selected using the control unit 123. The imaging mode is the mode of the SEM 100 with which at least one image of the object 125 is generated with the primary electron beam of the SEM 100. The control unit 123 serves in particular to control at least one functional unit of the SEM 100. Above and also below, a functional unit is understood to mean a structural unit of the SEM 100 which can be adjusted in any way. For example, the position of the functional unit in the SEM 100 can be adjusted. In addition or as an alternative, it is provided to set an electrostatic and/or magnetic configuration of the functional unit. The invention is not limited to the aforementioned adjustment options. Rather, the functional unit can be set up in any manner that is suitable for the invention. The SEM 100 has, for example, the following functional units: the electron source 101, the extraction electrode 102, the anode 103, the first aperture unit 108, the first condenser lens 105, the second condenser lens 106, the first detector 116, the second detector 117, the third detector 121 , the chamber detector 119, the radiation detector 500, the scanning device 115, the coil 111, the tubular electrode 113, the single electrode 112 and the sample table 122.

In addition, the first group of method steps includes method step S12. In method step S12, a first control parameter value of a control parameter of control unit 123 for controlling at least one functional unit of SEM 100 is loaded from database 126 into control unit 123. As already explained above, the control parameter is, for example, a physical variable, in particular a control current or a control voltage , but also, for example, the relationship between physical variables, in particular an amplification of physical variables. The values of the physical variable can be set on or with the control unit 123 and control and/or supply the functional unit of the SEM 100 in such a way that desired physical effects, for example the generation of specific magnetic fields and/or electrostatic fields, are brought about.

Examples of control parameters of the control unit 123 are explained in more detail below.

A first control parameter of the control unit 123 is used to set the so-called landing energy of the electrons of the primary electron beam on the object 125. When they strike the object 125, the electrons have this landing energy. In other words, the landing energy of the electrons is the energy with which the object 125 is examined and/or imaged. The landing energy of the electrons can be different from the energy with which the electrons are guided through the beam guiding tube 104 of the SEM 100 . In particular, provision is made for the electrons to first be accelerated very strongly and only to be decelerated to the landing energy shortly before they strike the object 125 . The landing energy of the electrons is, for example, in the range from 1 eV to 30 keV, including the range limits. However, the invention is not limited to the aforementioned range of landing energy. Rather, any range suitable for the invention may be used in the invention. In the imaging mode, a landing energy of 1 keV or less is preferably used. In the analysis mode, which is explained in more detail below, a landing energy in the range from 10 keV to 20 keV is preferably used.

A second control parameter of the control unit 123 adjusts the contrast in the generated image. The contrast is basically the difference in brightness (i.e. the difference in intensity) between the brightest pixel with maximum luminance Lmax and the darkest pixel with minimum luminance _Lmin in an image. A small difference in brightness between the two pixels means a low contrast. A high difference in brightness between the two pixels means a high contrast. The contrast can be given, for example, as a Weber contrast or as a Michelson contrast. The following applies to the Weber contrast: $$K_w=\frac{L_{max}}{L_{min}}-1mit\text{0}\le K_W\le \infty$$

For the Michelson contrast applies: $$K_M=\frac{L_{max}-L_{min}}{L_{max}+L_{min}}mit\text{0}\le {\text{K}}_M\le 1$$

The contrast, which is essentially generated by secondary electrons, is determined by the topography of the surface of the object 125. In contrast, the contrast, which is essentially generated by backscattered electrons, is essentially determined by the material of the imaged object area. This is also called material contrast. The material contrast depends on the average atomic number of the imaged area of the object 125. The contrast becomes greater, for example, the greater an amplification factor is set on an amplifier of the first detector 116, the second detector 117 and the chamber detector 119, with the first detector 116, the second detector 117 and the chamber detector 119 being used to generate the secondary electrons and/or Backscattered electrons are detected. The amplifier amplifies the detection signal generated by at least one of the aforementioned detectors 116, 117 and 119. Analogous to this, the contrast becomes smaller, for example, the smaller the amplification factor is set on the amplifier of the detector.

A third control parameter of the control unit 123 sets the brightness (ie “brightness”) in the generated image. In an image, brightness is basically related to each pixel in the image. A first pixel with a higher brightness value than a second pixel appears brighter in the image than the second pixel. The brightness is set, for example, by setting an amplification factor of the detection signal of the first detector 116, the second detector 117 and the chamber detector 119. The brightness of each pixel in the image is increased or decreased identically, for example using one stored in the database 126 Color table, where a specific lightness corresponds to a color recorded in the color table.

A fourth control parameter of the control unit 123 is used, for example, to control the first objective lens 107 of the SEM 100, with which a focusing of the primary electron beam on the object 125 is set.

A fifth control parameter of the control unit 123 is used to center the primary electron beam in the first objective lens 107. For example, the control unit 123 is used to adjust the first condenser lens 105 and the second condenser lens 106, with which the centering of the primary electron beam in the first objective lens 107 is adjusted.

In addition, the image quality of an image of the object 125 (and the representation of data about the object 125 explained further below) is influenced by a sixth control parameter of the control unit 123 for controlling and adjusting electrostatic and/or magnetic deflection units, which in the SEM 100 become a so-called "beam shift" can be used. This makes it possible to set the position of a scan area on the object 125 and, if necessary, to shift the scan area to a desired position. This can be done without using the sample table 122 on which the object 125 is placed. For example, if the scanning area differs from the actual area of the object 125, which is means of the SEM 100 migrates out due to a change in the settings on the SEM 100, in the case of a "beam shift" the primary electron beam is shifted by translational movements in such a way that the raster area is again in the desired observed area (field of view).

A stigmator used in the SEM 100 can also affect the image quality of the image of the object 125 (as well as the quality of the representation of data about the object 125 discussed below). The stigmator, a magnetic and/or electrostatic multipole element, is used in particular to correct astigmatism. The stigmator can be adjusted with the control unit 123 by means of a seventh control parameter.

However, the image quality of an image of the object 125 (and the quality of the representation of data about the object 125 explained further below) can also be influenced by the position of a mechanically displaceable unit of the SEM 100 . The position of the mechanically displaceable unit of the SEM 100 can be set, for example, with an eighth control parameter of the control unit 123 . For example, the image quality is influenced by the position of the first aperture unit 108 and/or the position of the second aperture unit 109, which is used to shape and limit the primary electron beam in the SEM 100. As an alternative or in addition to this, it is provided to change the position of the sample table 122 on which the object 125 is arranged. Then it is possible to adjust the distance between the object 125 and the first objective lens 107 of the SEM 100, for example. This distance is called the working distance. If the object 125 is imaged with the SEM 100 (ie in imaging mode), then the working distance is in the range of 1 cm or less than 1 cm, for example. If X-ray spectroscopy is to be carried out (see below), then the working distance is in the range of greater than 1 cm, for example between 2 cm and 10 cm.

The image quality of an image of the object 125 (and the quality of the representation of data about the object 125 explained below) can also be influenced by the so-called scan rotation. This is a rotation of the scan area in the plane of the grid area around the optical axis OA of the SEM 100.

The scan rotation can be set with a ninth control parameter of the control unit 123, for example.

With a tenth control parameter of the control unit 123, functional units of the SEM 100 can be adjusted in such a way that the current of the primary electron beam of the SEM 100 can be adjusted. For example, the functional units are designed as the first objective lens 107, the first aperture unit 108, the second aperture unit 109, the first condenser lens 105 and the second condenser lens 106. A current of the primary electron beam in the range of a few nanoamperes is used to generate an image of the object 125 (ie in imaging mode). On the other hand, a current of the primary electron beam in the range of a few microamperes is used in the generation of a representation of data about the object 125 (analysis mode), which will be explained further below.

With an eleventh control parameter of the control unit 123, functional units of the SEM 100 can be adjusted in such a way that in the sample chamber 120 of the SEM 100 there is a high vacuum or a pressure which almost corresponds to atmospheric pressure. By setting the eleventh control parameter of the control unit 123, a pump arranged on the sample chamber 120 is controlled, for example. As stated above, the sample chamber 120 is operated in the first pressure range or in the second pressure range. The first pressure range only includes pressures less than or equal to 10 ^-3 hPa, and the second pressure range only includes pressures greater than 10 ^-3 hPa. If it is determined that on the one hand the sample chamber 120 is operated in the first pressure range and on the other hand the object 125 charges due to the delivery of the primary electron beam onto the object 125, then the eleventh control parameter is changed such that the sample chamber 120 is operated in the second pressure range. In the second pressure range, for example, a gas with ions is then fed to the object 125, so that the charge of the object 125 on the surface of the object 125 is neutralized. Charging of the object 125 is present, for example, when the image of the object 125 is unstable, in particular when the brightness and/or the contrast of the image of the object 125 changes/changes with multiple scans over the identical area of the object 125. The object 125 is also charged, for example, if the same features are still recognizable in the image after a change in the direction of a scan due to a scan rotation and/or if the position of the object 125 in the image changes. In addition or as an alternative to this, charging of the object 125 is detected, for example, by comparing the image of the object 125 with a further image of the object 125 from a database, with the further image showing the object 125 with charges. Machine learning in particular is used for the comparison.

The invention is not limited to the control parameters mentioned above. Rather can any control parameter suitable for the invention may be used for the invention.

In addition, the first group of method steps includes method step S13. In method step S13, the functional unit is controlled with the loaded first control parameter value of the control parameter using control unit 123. In other words, control unit 123 is controlled with the loaded first control parameter value of the control parameter and in turn controls the functional unit accordingly.

The first group of method steps also includes method step S14. In method step S14, the primary electron beam of SEM 100 is guided onto object 125 using at least one guide unit of SEM 100. A guide unit is understood to mean any unit for guiding the primary electron beam onto object 125, but also units for shaping the primary electron beam, which then is led to the object 125. The guidance unit is embodied, for example, as a focusing unit for focusing the primary electron beam on the object 125, as an electrostatic and/or magnetic unit for beam shaping or for beam guidance, as a stigmator, as a condenser lens, or as a mechanically adjustable diaphragm unit with which the primary electron beam is limited. For example, the SEM 100 has the following guide units: the extraction electrode 102, the anode 103, the first aperture unit 108, the first condenser lens 105, the second condenser lens 106, the scanning device 115, the coil 111, the tube electrode 113 and the single electrode 112.

In addition, the first group of method steps includes method step S15. In method step S15, interaction particles are detected with a detector of SEM 100, for example first detector 116, second detector 117 and chamber detector 119. The interaction particles result from an interaction of the primary electron beam with object 125 when the primary electron beam impinges on object 125 out. The interaction particles are, for example, secondary electrons and backscattered electrons.

Furthermore, the first group of method steps includes method step S16. In method step S16, first detection signals are generated based on the detected interaction particles using a detector, for example the first detector 116, the second detector 117 and the chamber detector 119. An image of the object 125 is generated with the control unit 123 using the first detection signals (Step S17) and displayed with the monitor 124 of the SEM 100 (Step S18).

All of the aforementioned method steps of the first group of method steps can be carried out in the order described above. Alternatively, any order of the process steps of the first group of process steps suitable for the invention can be used.

6 shows an embodiment of the second group of method steps. The second group of method steps includes method step S21. Method step S21 includes selecting an analysis mode of the SEM 100 using the control unit 123 of the SEM 100. The analysis mode is the mode of the SEM 100 with which at least one representation of data about the object 125 (for example a radiation spectrum, in particular an X-ray spectrum) with the primary electron beam of the SEM 100 is generated.

In addition, the second group of method steps includes method step S22. In method step S22, a second control parameter value of the above control parameter of control unit 123 for controlling the functional unit of SEM 100 is loaded from database 126 into control unit 123. The second control parameter value of the above control parameter ensures the analysis mode. For this purpose, in particular the second control parameter value suitable for the analysis mode for the working distance and/or the current of the primary electron beam is loaded.

Furthermore, the second group of method steps includes method step S23. In method step S23, the above-mentioned functional unit is controlled with the loaded second control parameter value of the control parameter using control unit 123. In other words, control unit 123 is controlled with the loaded second control parameter value of the control parameter and in turn controls the functional unit accordingly.

The second group of method steps also includes method step S24. In method step S24, the primary electron beam of SEM 100 is guided onto object 125 using the above-mentioned guiding unit of SEM 100.

The second group of method steps also includes method step S25. in proceedings In step S25, interaction radiation is detected with a detector of SEM 100, for example radiation detector 500. The interaction radiation results from an interaction of the primary electron beam with object 125 when the primary electron beam impinges on object 125. The interaction radiation is, for example, X-ray radiation or cathodoluminescent light.

Furthermore, the second group of method steps also includes method step S26. In method step S26, second detection signals are generated based on the detected interaction radiation using, for example, the radiation detector 500. In addition, the second group of method steps includes method step S27. In method step S27, a representation of data about the object 125 (for example a radiation spectrum, in particular an X-ray spectrum) is generated with the control unit 123 using the second detection signals. The generated representation of data about the object 125 is displayed with the monitor 124 of the SEM 100 in method step S28.

All of the aforementioned method steps of the second group of method steps can be carried out in the order described above. Alternatively, any order of the process steps of the second group of process steps suitable for the invention can be used.

7 shows a further embodiment of the method according to the invention. In this embodiment of the method according to the invention, it is additionally provided that suitable values for the first control parameter value are first determined and stored in the database 126 . In this embodiment of the method according to the invention, provision is made for method step S01 to be carried out before the first group of method steps is carried out. In method step S01, the functional unit mentioned above is controlled with a selectable control parameter value of the control parameter mentioned above, using the control unit 123, so that the image of the object 125 is obtained with a desired image quality. Then, in method step S02, this selectable control parameter value of the control parameter is stored as the first control parameter value of the control parameter in database 126. In method step S03, it is checked whether method steps S01 and S02 should be repeated. If they are to be repeated, the method steps S01 and S02 are run through again in order to determine further selectable control parameter values as the first control parameter value and to store them in the database 126. If they are not repeated, method step S1, for example, is carried out.

The aforementioned desired image quality can be determined, for example, using objective criteria. For example, the image quality of an image is better the better the resolution in the image is or the better the contrast is. Alternatively, the image quality can be determined using subjective criteria. In this case, a user individually determines whether the image quality achieved is sufficient for him or not. However, it can happen that the image quality that a first user finds to be sufficiently good is not sufficient for a second user. For example, the image quality of an image of the object 125 can also be determined based on the signal-to-noise ratio of the detector signal. If the signal-to-noise ratio is between 0 and 5, the image quality is not good enough. For example, one speaks of a good signal-to-noise ratio (and thus also of good and sufficient image quality) when the signal-to-noise ratio is in the range of 20 to 40. The direction of the secondary particle beam (ie the particle beam that has secondary electrons and/or backscattered electrons) can also be a measure of the image quality. The secondary electrons can be emitted from the object 125 in different solid angles. Furthermore, the backscattered electrons can be scattered back into different solid angles on the object 125 . The direction of the secondary particle beam (ie the solid angle in which the secondary particle beam runs) can be influenced by tilting the primary electron beam and/or the object 125 with respect to the optical axis OA of the SEM 100 . This makes it possible, on the one hand, to select the direction of the secondary particle beam in such a way that the secondary particle beam impinges on a desired detector. On the other hand, both the number of generated secondary electrons and the number of backscattered electrons can be influenced by the above-mentioned tilting. If, for example, the primary electron beam enters the object 125 parallel to a crystal lattice of the object 125, the number of secondary electrons and/or backscattered electrons decreases. The detection signal becomes weaker. This leads to a reduction in image quality. By adjusting the tilt of the primary electron beam, the number of secondary electrons and backscattered electrons can be increased. With such an adjustment it is possible to distinguish crystals with a first orientation from crystals with a second orientation based on the strength of the detection signal.

8th shows a further embodiment of the method according to the invention. In this embodiment of the method according to the invention, it is additionally provided to carry out further method steps before carrying out the first group of method steps in order to determine a way of determining first control parameter values of the control parameter mentioned above. In method step S04, the landing energy of the electrons of the primary electron beam is set to a first value from a predefinable range of the landing energy. When hitting the object 125, the electrons of the primary electron beam have this landing energy. In other words, the landing energy of the electrons is the energy with which the object 125 is examined and/or imaged. The landing energy of the electrons can be different from the energy with which the electrons are guided through the beam guiding tube 104 of the SEM 100 . In particular, provision is made for the electrons to first be accelerated very strongly and only to be decelerated to the landing energy shortly before they strike the object 125 . The landing energy of the electrons is, for example, in the range from 1 eV to 30 keV, including the range limits. However, the invention is not limited to the aforementioned range of landing energy. Rather, any range suitable for the invention may be used in the invention. In particular, a landing energy of approximately 1 keV is used in the imaging mode.

In the embodiment of the method according to the 8th In method step S05, the above-mentioned functional unit is activated with a selectable control parameter value of the above-mentioned control parameter, so that the image of the object 125 is obtained with a desired image quality. With regard to the desired image quality, reference is made to the comments above, which also apply here. In addition, in method step S06, the landing energy is set to a second value from the predefinable range of the landing energy. In method step S07, the above-mentioned functional unit is controlled with a further selectable control parameter value of the control parameter, so that a further image of the object 125 with a desired image quality is obtained. Here, too, reference is made to the comments above with regard to the desired image quality, which also apply here.

Furthermore, in method step S08 it is checked whether method steps S06 and S07 should be repeated. If the method steps S06 and S07 are to be repeated, then the method steps S06 and S07 are performed again in order to determine further selectable control parameter values of the above control parameter at which images of the object 125 with a desired image quality are achieved. If method steps S06 and S07 are not to be repeated, then in method step S09 a functional relationship between the selectable control parameter value and the further selectable control parameter value (or the further selectable control parameter values) is determined as a function of the specifiable range of the landing energy. In method step S010, the functional relationship is stored in database 126 for calculating the first control parameter value before the first control parameter value is loaded from database 126 into control unit 123.

9 shows yet another embodiment of the method according to the invention. In this embodiment of the method according to the invention it is additionally or alternatively provided to carry out further method steps before carrying out the first group of method steps or the second group of method steps in order to determine a way of determining second control parameter values of the abovementioned control parameter. In other words, suitable values for the second control parameter value are first determined and stored in the database 126 . In this embodiment of the method according to the invention, it is provided in method step S011 to control the above-mentioned functional unit with an even further selectable control parameter value of the control parameter using control unit 123, so that a desired representation of data about object 125 (for example a radiation spectrum, in particular an X-ray spectrum) is obtained. In method step S012, the still further selectable control parameter value of the control parameter is stored as the second control parameter value of the control parameter in database 126. In method step S013, a check is made as to whether method steps S011 and S012 should be repeated. If they are to be repeated, the method steps S011 and S012 are run through again in order to determine further selectable control parameter values as the second control parameter value and to store them in the database 126. If they are not repeated, method step S1 or S2, for example, is carried out.

The aforementioned desired representation of data about the object 125 is, for example, a representation with a desired quality. If, for example, x-ray radiation is detected with the radiation detector 500, then the quality of the display is determined by a good detection signal from the radiation detector 500, for example. The quality of the display is then determined, for example, by the count rate of the detected X-ray quanta and on the other hand influenced by the half-width of the measured peaks in the X-ray spectrum. The higher the count rate and the smaller the half-width, the better the quality of the representation of the detection signals. If, for example, cathodoluminescence light is detected with the radiation detector 500, then the quality of the display can also be determined by a good detection signal from the radiation detector 500, for example. The quality of the representation is determined, for example, by the counting rate of the detected photons of the cathodoluminescent light. The counting rate can be influenced by suitable light optics. Furthermore, the primary electron beam can be adjusted in such a way that the object 125 emits as many photons as possible in total or in a specific wavelength interval.

10 shows a further embodiment of the method according to the invention. In this embodiment of the method according to the invention, it is additionally provided to carry out further method steps before carrying out the first group of method steps or the second group of method steps in order to determine a way of determining second control parameter values of the abovementioned control parameter. In method step S014, the landing energy of the electrons of the primary electron beam is set to a first value from a predefinable range of the landing energy. When hitting the object 125, the electrons of the primary electron beam have this landing energy. In other words, the landing energy of the electrons is the energy with which the object 125 is examined and/or imaged. Reference is made to all the statements on landing energy that have already been made above. These also apply here.

In the embodiment of the method according to the 10 In method step S015, the above-mentioned functional unit is controlled with a selectable control parameter value of the above-mentioned control parameter, so that data of the object 125 is displayed with a desired quality. With regard to the desired quality of the representation of data about the object 125, reference is made to the comments above, which also apply here. In addition, in method step S016, the landing energy is set to a second value from the predefinable range of the landing energy. In method step S017, the above-mentioned functional unit is controlled with a further selectable control parameter value of the control parameter, so that a further representation of data about the object 125 with a desired quality is achieved. Here, too, reference is made to the comments above with regard to the desired quality, which also apply here. Furthermore, in method step S018 it is checked whether method steps S016 and S017 should be repeated. If method steps S016 and S017 are to be repeated, then method steps S016 and S017 are performed again to determine further selectable control parameter values of the above control parameter at which representations of data about the object 125 of a desired quality are achieved. If method steps S016 and S017 are not to be repeated, then in method step S019 a functional relationship between the selectable control parameter value and the further selectable control parameter value (or the further selectable control parameter values) is determined as a function of the predefinable range of the landing energy. In method step S020, the functional relationship is stored in database 126 for calculating the second control parameter value before the second control parameter value is loaded from database 126 into control unit 123. This is followed by method step S1 or S2.

In one embodiment of the method according to the invention, it is additionally or alternatively provided to use at least one further functional unit in addition to the above-mentioned functional unit. In this embodiment of the method according to the invention, the functional unit of the SEM 100 is a first functional unit and the control parameter is a first control parameter. As mentioned above, the SEM 100 has other functional units. In other words, the SEM 100 has at least one second functional unit. The second functional unit is controlled by the control unit 123 using a second control parameter. In the first group of method steps, this embodiment of the method according to the invention also has the method steps explained below according to FIG 11 on. In method step S19, a first control parameter value of the second control parameter of control unit 123 for controlling the second functional unit of SEM 100 is loaded from database 126 into control unit 123. With regard to the properties of the second control parameter, reference is made to the statements on control parameters above, which also apply here. Furthermore, in method step S19A, the second functional unit is controlled with the loaded first control parameter value of the second control parameter using control unit 123. In other words, control unit 123 is controlled with the loaded first control parameter value of the second control parameter and in turn controls the second functional unit again speaking to. In method step S19B, third detection signals are generated based on the detected interaction particles using a detector, for example the first detector 116, the second detector 117 and the chamber detector 119. As already mentioned above, the image of the object 125 is processed with the control unit 123 under Generated using the first detection signals. In addition to this, in step S19C, the image of the object 125 is generated with the control unit 123 using the third detection signals. The image is then displayed on the monitor 124 of the SEM 100.

As already mentioned above, all the aforementioned method steps of the first group of method steps can be carried out in the order described above. Alternatively, any order of the process steps of the first group of process steps suitable for the invention can be used.

In the second group of method steps, this embodiment of the method according to the invention also has the method steps explained below according to FIG 12 on. In method step S29, a second control parameter value of the second control parameter of control unit 123 for controlling the second functional unit of SEM 100 is loaded from database 126 into control unit 123. Furthermore, in method step S29A, the second functional unit is controlled with the loaded second control parameter value of the second control parameter using the control unit 123. In other words, the control unit 123 is controlled with the loaded second control parameter value of the second control parameter and in turn controls the second functional unit accordingly. In addition, in method step S29B, fourth detection signals are generated based on the detected interaction radiation using a detector, for example the radiation detector 500. As already mentioned above, the representation of data about the object 125 is generated with the control unit 123 using the second detection signals . In addition to this, in method step S29C, the representation of data about the object 125 (for example a radiation spectrum, in particular an X-ray spectrum) is generated with the control unit 123 using the fourth detection signals.

All of the aforementioned method steps of the second group of method steps can be carried out in the order described above. Alternatively, any order of the process steps of the second group of process steps suitable for the invention can be used.

13 shows a further embodiment of the method according to the invention. In this embodiment, it is provided that a method step S30 is carried out before method step S1, for example. In method step S30, an area on object 125 is determined to which the primary electron beam is guided when carrying out the first group of method steps and/or the second group of method steps. Furthermore, it is additionally provided, for example, in the 14 to carry out the method steps S23A to S23D illustrated when carrying out the second group of method steps after method step S23. Thus, in method step S23A, provision is made for interaction particles to first be detected again using a detector, for example the first detector 116, the second detector 117 and the chamber detector 119. The interaction particles result from an interaction of the primary electron beam with the object 125 when the primary electron beam impinges on the object 125 . The interaction particles are, for example, secondary electrons and backscattered electrons. In method step S23B, further first detection signals are generated based on the detected interaction particles using a detector, for example the first detector 116, the second detector 117 and the chamber detector 119. Another image of the object 125 is created with the control unit 123 using the further first detection signals generated in step S23C. In step S23D, the primary electron beam is focused on the previously selected area of the object 125 using the further image of the object 125. Since it is quite possible that the previously selected area is no longer in the field of view of the SEM 100 due to the change in the values of the control parameter or parameters, this ensures that when the second group of method steps is carried out, the primary electron beam is always directed to the area to be analyzed.

15 shows a further embodiment of the method according to the invention. In this embodiment, it is provided that a method step S31 is carried out before method step S1, for example. In method step S31, a first area on the object 125 and a second area on the object 125 are determined, for example, before the first group of method steps is carried out. In other words, a first area on the object 125 and a second area on the object 125 are made chosen. Furthermore, it is additionally provided, for example, that when carrying out the first group of method steps, instead of method step S14, method step S14A according to FIG 16 is carried out. The primary electron beam is guided to the first area or the second area on the object 125 in step S14A. For example, the primary electron beam is first guided to the first area and the further method steps S15 and S16 are carried out. Following this, method steps S14A and S15 to S16 are repeated, with the primary electron beam being guided here to the second area on the object. The image of the object 125 is then generated and displayed on the monitor 124 (method steps S17 and S18). In addition, it is additionally provided, for example, that when carrying out the second group of method steps, instead of method step S24, method step S24A according to FIG 16 is carried out. The primary electron beam is guided to the first area or the second area on the object 125 in step S24A. For example, the primary electron beam is first guided to the first area and the further method steps S25 and S26 are carried out. Following this, the method steps S24A and S25 to S26 are repeated, with the primary electron beam being guided to the second area on the object 125 here. Following this, the representation of data about the object 125 is generated and displayed on the monitor 124 (method steps S27 and S28). As an alternative to the aforementioned embodiments, one embodiment of the method according to the invention provides for the first group of method steps and the second group of method steps to be carried out first for the first area and then for the first group of method steps and the second group of method steps to be carried out be carried out for the second area.

In yet another embodiment of the method according to the invention, it is provided that the position of the first area is stored in the database 126 . In addition or as an alternative to this, it is provided that the position of the second area is stored in the database 126 . In yet another embodiment of the method according to the invention, it is provided that for the first area it is determined whether the location of the origin of the interaction radiation is determined. This determination is stored in the database 126. In addition or as an alternative to this, it is provided that for the second area it is specified whether the location of the origin of the interaction radiation is determined. This determination is stored in the database 126. The aforementioned method steps are advantageous because the location at which the interaction radiation occurs is also determined. This makes it possible to precisely determine the material composition at a specific location of the object 125 .

In a further embodiment of the method according to the invention it is provided that after carrying out the first group of method steps and the second group of method steps in method step S3 according to FIG 4 it is checked whether the first group of method steps and the second group of method steps should be carried out again. If this is the case, method steps S1 and S2 are carried out again. In other words, the method steps S1 and S2 are carried out alternately (ie alternately). If the method steps S1 and S2 are not to be carried out again, in method step S4 according to the 4 stopped the inventive method.

In yet another embodiment of the method according to the invention, it is additionally provided that after method step S11 of the first group of method steps, method step S11A according to FIG 17 is carried out. In step S11A, the radiation detector 500 is moved to a first position. In addition, it is provided that after the method step S21 of the second group of method steps, the method step S21A according to the 18 is carried out. In step S21A, the radiation detector 500 is moved to a second position. A movement device (not shown) is provided for moving the radiation detector 500 . The first position is spaced further from the object 125 than the second position. This ensures that the interaction radiation can be detected sufficiently well with the radiation detector 500 arranged in the second position. If no interaction radiation is to be detected, then the radiation detector 500 is moved to the first position, so that the first objective lens 107 can be moved relative to the object 125 at a working distance of up to 5 mm, for example.

All embodiments of the method according to the invention are based on the surprising finding that suitable values of the control parameter, which enable a desired quality of an image of the object 125 on the one hand and a desired quality of a representation of data about the object 125 on the other, are stored in a database 126 of the SEM 100 are stored. For example, the user is saved th control parameter value and/or the second control parameter value of the control parameter as a function of object 125. This makes it possible, on the one hand, to transfer control parameter values suitable for a desired quality of an image of object 125 for the corresponding object 125 from database 126 to control unit 123 automatically to load and to control the functional unit(s) of the SEM 100 accordingly by means of the control unit 123. On the other hand, it is possible to automatically load suitable values of the control parameter for the corresponding object 125 from the database 126 into the control unit 123 for a desired quality of a representation of data about the object 125 and to activate the functional unit(s) of the SEM 100 accordingly using the Control unit 123 to control. A manual setting of the control parameter values of the control parameter by a user of the SEM 100 is therefore no longer absolutely necessary.

The features of the invention disclosed in the present description, in the drawings and in the claims can be essential both individually and in any combination for the realization of the invention in its various embodiments. The invention is not limited to the embodiments described. It can be varied within the scope of the claims and taking into account the knowledge of the person skilled in the art.

Reference List

100

S.E.M

101

electron source

102

extraction electrode

103

anode

104

beam guide tube

105

first condenser lens

106

second condenser lens

107

first objective lens

108

first aperture unit

108A

first aperture

109

second aperture unit

110

pole shoes

111

Kitchen sink

112

single electrode

113

tubular electrode

114

object holder

115

scanning device

116

first detector

116A

opposing field grid

117

second detector

118

second aperture

119

chamber detector

120

sample chamber

121

third detector

122

rehearsal table

123

Control unit with processor

124

monitor

125

object

126

Database

200

combination device

201

sample chamber

300

ion beam device

301

ion beam generator

302

Extraction electrode in the ion beam device

303

condenser lens

304

second objective lens

306

adjustable or selectable aperture

307

first electrode arrangement

308

second electrode arrangement

400

Particle beam device with correction unit

401

particle beam column

402

electron source

403

extraction electrode

404

anode

405

first electrostatic lens

406

second electrostatic lens

407

third electrostatic lens

408

magnetic deflection unit

409

first electrostatic beam deflection unit

409A

first multipole unit

409B

second multipole unit

410

beam deflection device

411A

first magnetic sector

411B

second magnetic sector

411C

third magnetic sector

411D

fourth magnetic sector

411E

fifth magnetic sector

411F

sixth magnetic sector

411G

seventh magnetic sector

413A

first mirror electrode

413B

second mirror electrode

413C

third mirror electrode

414

electrostatic mirror

415

fourth electrostatic lens

416

second electrostatic beam deflection unit

416A

third multipole unit

416B

fourth multipole unit

417

third electrostatic beam deflection unit

418

fifth electrostatic lens

418A

fifth multipole unit

418B

sixth multipole unit

419

first analysis detector

420

beam guide tube

421

objective lens

422

magnetic lens

423

sixth electrostatic lens

424

rehearsal table

425

object

426

sample chamber

427

detection beam path

428

second analysis detector

429

scanning device

432

another magnetic deflection element

500

radiation detector

709

first beam axis

710

second beam axis

OA

optical axis

OA1

first optical axis

OA2

second optical axis

OA3

third optical axis

S1 to S4

process steps

S11 to S19

process steps

S11A

process step

S14A

process step

S19A to S19C

process steps

S21 to S29

process steps

S21A

process step

S23A to S23D

process steps

S24A

process step

S29A to S29C

process steps

S30 to S31

process steps

S01 to S020

process steps

QUOTES INCLUDED IN DESCRIPTION

This list of documents cited by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Patent Literature Cited

• WO 2002/067286 A2 [0113]

Claims (21)

Method for generating an image of an object (125, 425) and/or a representation of data about the object (125, 425) with a particle beam device (100, 200, 400), the method having a first group of method steps and a second group of method steps, wherein - the first group of method steps has the following method steps: (i) selecting an imaging mode of the particle beam device (100, 200, 400) using a control unit (123) of the particle beam device (100, 200, 400); (ii) Loading a first control parameter value of a control parameter for controlling at least one functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A , 117, 118, 119, 121, 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A , 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 4.82, 424, 4.82 , 432, 500) of the particle beam device (100, 200, 400) from a database (126) into the control unit (123); (iii) Driving the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121 , 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 4111D, 4111E , 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 428, 429, 432, 500) with the loaded first control parameter value of the control parameter using the control unit (123); (iv) Guiding a particle beam of the particle beam device (100, 200, 400) onto the object (125, 425) using at least one guide unit (104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113 , 115, 116A, 118, 119, 303, 304, 306, 307, 308, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 4111G, 4111G, 4111G , 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 420, 421, 422, 423, 429, 432) of the particle beam device (100, 200, 400), wherein the particle beam device (100 , 200, 400) has at least one beam generator (101, 301, 402) for generating a particle beam with charged particles; (v) detecting interaction particles with at least one first detector (116, 117, 119, 121, 419, 428) of the particle beam device, the interaction particles resulting from an interaction of the particle beam with the object (125, 425) when the particle beam hits the object (125, 425); (vi) generating first detection signals based on the detected interacting particles using the first detector (116, 117, 119, 121, 419, 428); (vii) generating an image of the object (125, 425) with the control unit (123) using the first detection signals; and (viii) displaying the image of the object (125, 425) with a display unit (124) of the particle beam device (100, 200, 400); and wherein - the second group of method steps comprises the following method steps: (ix) selecting an analysis mode of the particle beam device (100, 200, 400) using the control unit (123); (x) Loading a second control parameter value of the control parameter for controlling the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411B, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 9, 824, 424 432, 500) from the database (126) into the control unit (123); (xi) Driving the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121 , 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 4111D, 4111E , 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 428, 429, 432, 500) with the loaded second control parameter value of the control parameter using the control unit (123); (xii) guiding the particle beam of the particle beam device (100, 200, 400) onto the object (125, 425) using the guide unit (104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 115, 116A, 118, 119, 303, 304, 306, 307, 308, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 4111G, 4131F, 4111F 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 420, 421, 422, 423, 429, 432); (xiii) detecting interaction radiation with at least one second detector (500) of the particle beam device (100, 200, 400), the interaction radiation resulting from an interaction of the particle beam with the object (125, 425) when the particle beam impinges on the object (125, 425) emerges; (xiv) generating second detection signals based on the detected interaction radiation using the second detector (500); (xv) generating a representation of data about the object (125, 425) with the control unit (123) using the second detection signals; such as (xvi) displaying the representation of data about the object (125, 425) with the display unit (124). procedure after claim 1 , wherein the following method steps are carried out before the first group of method steps is carried out: 115, 116, 116A, 117, 118, 119, 121, 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 42, 420, 4, 22, 142, 4, 22, 142 424, 428, 429, 432, 500) with a selectable control parameter value of the control parameter using the control unit (123) such that the image of the object (125, 425) is obtained with a desired image quality; and - storing the selectable control parameter value of the control parameter as the first control parameter value of the control parameter in the database (126). procedure after claim 1 , the following method steps being carried out before the first group of method steps is carried out: setting a landing energy of the charged particles to a first value from a predeterminable range of the landing energy; - Controlling the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122 , 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 4111E, 41111E ,413A,413B,413C,414,415,416,416A,416B,417,418,418A,418B,419,420,421,422,423,424,428,429,432,500) with a selectable control parameter value control parameters such that the image of the object (125, 425) is obtained with a desired image quality; - Setting the landing energy to a second value from the predefinable range of the landing energy; - Controlling the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122 , 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 4111E, 41111E , 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 428, 429, 432, 500) with another selectable control parameter value the control parameter such that another image of the object (125, 425) is obtained with a desired image quality; - determining a functional relationship between the selectable control parameter value and the further selectable control parameter value as a function of the predefinable range of the landing energy; - storing the functional relationship in the database (126) for calculating the first control parameter value before loading the first control parameter value from the database (126) into the control unit (123). Method according to one of the preceding claims, wherein the following method steps are carried out before the second group of method steps is carried out: - Controlling the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122 , 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 4111E, 41111E , 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 428, 429, 432, 500) with one more to choose from control parameter value of the control parameter such that a desired representation of data about the object (125, 425) is achieved; such as - storing the still further selectable control parameter value as the second control parameter value of the control parameter in the database (126). Procedure according to one of Claims 1 until 3 , the following method steps being carried out before the second group of method steps is carried out: setting a landing energy of the charged particles to a further first value from a predeterminable range of the landing energy; - Controlling the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122 , 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 4111E, 41111E , 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 428, 429, 432, 500) with one more selectable control parameter value of the control parameter such that a first desired representation of data about the object (125, 425) is achieved; - Setting the landing energy to a further second value from the predefinable range of the landing energy; - Controlling the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122 , 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 4111E, 41111E , 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 428, 429, 432, 500) with yet another selectable control parameter value of the control parameter such that a second desired representation of data about the object (125, 425) is achieved; - Determining a functional relationship between the still further selectable control parameter value and the further selectable control parameter value as a function of the predefinable range of the landing energy; and - storing the functional relationship in the database (126) for calculating the second control parameter value before loading the second control parameter value from the database (126) into the control unit (123). Method according to one of the preceding claims, wherein before carrying out the first group of method steps and/or the second group of method steps, an area on the object (125, 425) is determined to which the particle beam when carrying out the first group of method steps and /or the second group of process steps is performed. procedure after claim 6 , wherein when the second group of method steps is carried out, before the interaction radiation is detected, interaction particles are initially detected again with the first detector (116, 117, 119, 121, 419, 428) of the particle beam device (100, 200, 400), further first detection signals with the first detector (116, 117, 119, 121, 419, 428) are detected, another image of the object (125, 425) is generated with the control unit (123) using the first detection signals and the particle beam onto the area using of the further image of the object (125, 425) is focused. Method according to one of the preceding claims, wherein - Before carrying out the first group of method steps and/or the second group of method steps, a first area on the object (125, 425) and a second area on the object (125, 425) are determined; - the particle beam is guided to the first region when carrying out the first group of method steps and/or the second group of method steps; and where - the particle beam is guided to the second region when carrying out the first group of method steps and/or the second group of method steps. procedure after claim 8 wherein at least one of the following method steps is performed: (i) storing the position of the first region in the database (126); (ii) storing the location of the second region in the database (126); (iii) determining for the first region whether the location of the generation of the interaction radiation is determined and storing the determination in the database (126); (iv) determining for the second area whether the location of the origin of the interaction radiation is determined and storing the determination in the database (126). procedure after claim 8 or 9 , wherein - the first group of method steps and the second group of method steps are initially carried out for the first region; and wherein - subsequently the first group of method steps and the second group of method steps are carried out for the second region. Method according to one of the preceding claims, wherein - the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 4111B, 4111C, 411D 411E 411F 411G 413A 413B 413C 414 415 416 416A 416B 417 418 418A 418B 419 420 421 422 423 424 434 2928 434 500) of the particle beam device (100, 200, 400) a first functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A , 117, 118, 119, 121, 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411B , 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 4.82, 424, 4.82 , 432, 500), the control parameter a first control parameter and the control unit (123) a first control unit (123) for one Position of the first functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122 , 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 4111E, 41111E , 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 428, 429, 432, 500); - the particle beam device (100, 200, 400) has at least one second functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A , 117, 118, 119, 121, 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411B , 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 4.82, 424, 4.82 , 432, 500) of the particle beam device (100, 200, 400); - the particle beam device (100, 200, 400) has at least one second control unit (123) for controlling the second functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113 , 114, 115, 116, 116A, 117, 118, 119, 121, 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A , 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 209, 221, 44, 224, 44, 224 , 423, 424, 428, 429, 432, 500) using a second control parameter; and wherein the method comprises the following method steps in the first group of method steps: - loading a first control parameter value of the second control parameter for controlling the second functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110 , 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407 , 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 414, 818, 414 , 420, 421, 422, 423, 424, 428, 429, 432, 500) of the particle beam device (100, 200, 400) from the database (126) into the second control unit (123); - Controlling the second functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411G 413A 413B 413C 414 415 416 416A 416B 417 418 418A 418B 419 420 421 422 423 424 428 429 432 500) with the first loaded control parameter value of the second control parameter using the second control unit (123); - generating third detection signals based on the detected interaction particles using the first detector (116, 117, 119, 121, 419, 428); and - generating the image of the object (125, 425) with the second control unit (123) using the third detection signals; and wherein the method comprises the following method steps in the second group of method steps: - loading a second control parameter value of the second control parameter for controlling the second functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110 , 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407 , 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 414, 818, 414 , 420, 421, 422, 423, 424, 428, 429, 432, 500) from the database (126) to the second control unit (123); - Controlling the second functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 428, 429, 432, 500) with the second loaded control parameter value of the second control parameter using the second control unit (123); - generating fourth detection signals based on the detected interaction radiation using the second detector (500); and - generating the representation of data about the object (125, 425) with the second control unit (123) using the fourth detection signals. procedure after claim 11 , wherein the first control unit (123) is used as the second control unit (123). Method according to one of the preceding claims, wherein - first the first group of process steps, - then the second group of process steps, and - Then again the first group of method steps are carried out. procedure after Claim 13 , wherein after the first group of method steps has been carried out again, the second group of method steps is carried out again. Method according to one of the preceding claims, wherein the method has at least one of the following method steps: (i) the second detector (500) is moved to a first position when performing the first group of method steps and to a second position when performing the second group of method steps, the first position being further from the object (125, 425) than the second position is spaced; (ii) the first detector is used as the second detector. Computer program product with a program code that can be loaded into a processor (123) of a particle beam device (100, 200, 400) and, when executed, controls the particle beam device (100, 200, 400) in such a way that a method according to one of the preceding claims is carried out. Particle beam device (100, 200, 400) for generating an image of an object (125, 425) and/or a representation of data about the object (125, 425), with - at least one beam generator (101, 301, 402) for generating a particle beam with charged particles; - At least one movably designed object holder (114, 122, 424) for holding and positioning the object (125, 425); - at least one functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122 , 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 4111E, 41111E , 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 428, 429, 432, 500) of the particle beam device (100) 200, 400); - at least one control unit (123) for controlling the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122, 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 4111B, 4111C, 411D 411E 411F 411G 413A 413B 413C 414 415 416 416A 416B 417 418 418A 418B 419 420 421 422 423 424 434 2928 434 500); - at least one guiding unit (104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 115, 116A, 118, 119, 303, 304, 306, 307, 308, 405, 406, 407 , 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 417, 818, 420B , 421, 422, 423, 429, 432) for guiding the particle beam onto the object (125, 425); - At least one first detector (116, 117, 119, 121, 419, 428) for detecting interaction particles that result from an interaction of the particle beam with the object (125, 425) when the particle beam impinges on the object (125, 425). ; - At least one second detector (500) for detecting interaction radiation resulting from an interaction of the particle beam with the object (125, 425) when the particle beam impinges on the object (125, 425); - at least one display unit (124) for displaying an image of the object (125, 425) and/or a representation of data about the object (125, 425), wherein the image and/or the representation is/are generated based on detection signals, which are generated by detecting the interaction particles and/or alternating radiation; and with - at least one processor (123) in which a computer program product Claim 16 is loaded. particle beam device (100, 200, 400). Claim 17 , where the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122 , 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 4111E, 41111E , 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 428, 429, 432, 500) and/or the guide unit (104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 115, 116A, 118, 119, 303, 304, 306, 307, 308, 405, 406, 407, 408, 409 , 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A,42 1.24, 418B , 423, 429, 432) comprises at least one of the following features: (i) at least one objective lens (107, 304) for focusing the particle beam onto the object (125, 425); (ii) at least one electrostatic and/or magnetic unit (102, 103, 104, 105, 106, 107, 110, 111, 112, 113, 115, 302, 303, 304, 307, 308, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 411E, 411F, 411G, 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417,41 8A, 417,41 418B, 420, 421, 422, 423, 429, 432); (iii) at least one stigmator; (iv) at least one condenser lens (105, 106, 303); (v) at least one mechanically adjustable screen unit (108, 109). particle beam device (100, 200, 400). Claim 17 or 18 , where the functional unit (101, 102, 103, 104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113, 114, 115, 116, 116A, 117, 118, 119, 121, 122 , 301, 302, 303, 304, 306, 307, 308, 402, 403, 404, 405, 406, 407, 408, 409, 409A, 409B, 410, 411A, 411B, 411C, 411D, 4111E, 41111E , 413A, 413B, 413C, 414, 415, 416, 416A, 416B, 417, 418, 418A, 418B, 419, 420, 421, 422, 423, 424, 428, 429, 432, 500) the movable specimen holder (114) , 122, 424). Particle beam device (200) according to one of claims 17 until 19 , wherein the beam generator (101) is designed as a first beam generator and the particle beam is designed as a first particle beam with first charged particles, the guide unit (104, 105, 106, 107, 108, 108A, 109, 110, 111, 112, 113 , 115, 116A, 118, 119) is designed as a first guidance unit for guiding the first particle beam onto the object (125), and wherein the particle beam device (200) also has: - at least one second beam generator (301) for generating a second particle beam with second charged particles; and with - at least one second guide unit (303, 304, 306, 307, 308) for guiding the second particle beam onto the object (125). Particle beam device (100, 200, 400) according to one of claims 17 until 20 , wherein the particle beam device (100, 200, 400) is an electron beam device and/or an ion beam device.

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