DE112012003180T5 - Verfahren zum Polieren von Silizium-Wafern und Poliermittel - Google Patents
Verfahren zum Polieren von Silizium-Wafern und Poliermittel Download PDFInfo
- Publication number
- DE112012003180T5 DE112012003180T5 DE112012003180.6T DE112012003180T DE112012003180T5 DE 112012003180 T5 DE112012003180 T5 DE 112012003180T5 DE 112012003180 T DE112012003180 T DE 112012003180T DE 112012003180 T5 DE112012003180 T5 DE 112012003180T5
- Authority
- DE
- Germany
- Prior art keywords
- polishing
- silicon wafer
- agent
- polishing agent
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 315
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 113
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 97
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 95
- 239000010703 silicon Substances 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims abstract description 43
- 235000012431 wafers Nutrition 0.000 title description 94
- -1 silicate ions Chemical class 0.000 claims abstract description 69
- 238000007517 polishing process Methods 0.000 claims abstract description 16
- 239000003513 alkali Substances 0.000 claims description 39
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 19
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 10
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 10
- 235000011118 potassium hydroxide Nutrition 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 6
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 claims description 5
- 239000011736 potassium bicarbonate Substances 0.000 claims description 5
- 235000015497 potassium bicarbonate Nutrition 0.000 claims description 5
- 229910000028 potassium bicarbonate Inorganic materials 0.000 claims description 5
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 5
- 235000011181 potassium carbonates Nutrition 0.000 claims description 5
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 claims description 5
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 5
- 235000017550 sodium carbonate Nutrition 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 description 5
- 238000004088 simulation Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000008119 colloidal silica Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003002 pH adjusting agent Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-190916 | 2011-09-01 | ||
| JP2011190916 | 2011-09-01 | ||
| PCT/JP2012/005135 WO2013031111A1 (fr) | 2011-09-01 | 2012-08-13 | Procédé de polissage de tranche de silicium et abrasif |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112012003180T5 true DE112012003180T5 (de) | 2014-04-10 |
Family
ID=47755643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112012003180.6T Withdrawn DE112012003180T5 (de) | 2011-09-01 | 2012-08-13 | Verfahren zum Polieren von Silizium-Wafern und Poliermittel |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20140162456A1 (fr) |
| JP (1) | JP5598607B2 (fr) |
| KR (1) | KR101875880B1 (fr) |
| CN (1) | CN103733314B (fr) |
| DE (1) | DE112012003180T5 (fr) |
| SG (1) | SG2014009229A (fr) |
| TW (1) | TWI515782B (fr) |
| WO (1) | WO2013031111A1 (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6146213B2 (ja) * | 2013-08-30 | 2017-06-14 | 株式会社Sumco | ワークの両面研磨装置及び両面研磨方法 |
| KR101660900B1 (ko) * | 2015-01-16 | 2016-10-10 | 주식회사 엘지실트론 | 웨이퍼 연마 장치 및 이를 이용한 웨이퍼 연마 방법 |
| US10600634B2 (en) * | 2015-12-21 | 2020-03-24 | Globalwafers Co., Ltd. | Semiconductor substrate polishing methods with dynamic control |
| US11081359B2 (en) | 2018-09-10 | 2021-08-03 | Globalwafers Co., Ltd. | Methods for polishing semiconductor substrates that adjust for pad-to-pad variance |
| CN115890478B (zh) * | 2022-12-29 | 2024-11-22 | 西安奕斯伟材料科技股份有限公司 | 抛光头和抛光设备 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1110540A (ja) * | 1997-06-23 | 1999-01-19 | Speedfam Co Ltd | Ｃｍｐ装置のスラリリサイクルシステム及びその方法 |
| CN101037585B (zh) * | 2002-04-30 | 2010-05-26 | 日立化成工业株式会社 | 研磨液及研磨方法 |
| JP2004186350A (ja) * | 2002-12-03 | 2004-07-02 | Sanyo Chem Ind Ltd | Ｃｍｐプロセス用研磨組成物 |
| KR100641348B1 (ko) * | 2005-06-03 | 2006-11-03 | 주식회사 케이씨텍 | Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법 |
| CN102079962B (zh) * | 2009-11-28 | 2014-03-19 | 比亚迪股份有限公司 | 一种研磨材料及其制备方法和研磨液组合物 |
-
2012
- 2012-08-13 WO PCT/JP2012/005135 patent/WO2013031111A1/fr active Application Filing
- 2012-08-13 CN CN201280039229.5A patent/CN103733314B/zh active Active
- 2012-08-13 DE DE112012003180.6T patent/DE112012003180T5/de not_active Withdrawn
- 2012-08-13 US US14/236,858 patent/US20140162456A1/en not_active Abandoned
- 2012-08-13 JP JP2013531045A patent/JP5598607B2/ja active Active
- 2012-08-13 KR KR1020147005149A patent/KR101875880B1/ko active Active
- 2012-08-13 SG SG2014009229A patent/SG2014009229A/en unknown
- 2012-08-17 TW TW101129993A patent/TWI515782B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US20140162456A1 (en) | 2014-06-12 |
| KR20140068899A (ko) | 2014-06-09 |
| TWI515782B (zh) | 2016-01-01 |
| CN103733314A (zh) | 2014-04-16 |
| CN103733314B (zh) | 2016-05-04 |
| KR101875880B1 (ko) | 2018-07-06 |
| WO2013031111A1 (fr) | 2013-03-07 |
| JPWO2013031111A1 (ja) | 2015-03-23 |
| TW201322320A (zh) | 2013-06-01 |
| SG2014009229A (en) | 2014-04-28 |
| JP5598607B2 (ja) | 2014-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |