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DE4123370A1 - Method for producing electrical circuits based on flexible conductor plates - has rear side of copper@ laminated flexible basic material connected to mechanically stable auxiliary carrier with low heat expansion - Google Patents

Method for producing electrical circuits based on flexible conductor plates - has rear side of copper@ laminated flexible basic material connected to mechanically stable auxiliary carrier with low heat expansion

Info

Publication number
DE4123370A1
DE4123370A1 DE19914123370 DE4123370A DE4123370A1 DE 4123370 A1 DE4123370 A1 DE 4123370A1 DE 19914123370 DE19914123370 DE 19914123370 DE 4123370 A DE4123370 A DE 4123370A DE 4123370 A1 DE4123370 A1 DE 4123370A1
Authority
DE
Germany
Prior art keywords
flexible
auxiliary carrier
mechanically stable
circuits based
low heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19914123370
Other languages
German (de)
Inventor
Wilfried Dipl Ing Robock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19914123370 priority Critical patent/DE4123370A1/en
Publication of DE4123370A1 publication Critical patent/DE4123370A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/057—Shape retainable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Prodn. of electronic circuits based on flexible conductor plates, uses plates with preformed conductor pattern structure being firmly connected to a mechanically stable auxiliary carrier having low heat expansion, which only after completed further processing of the flexible circuit, including soldering, is deformed and partly or completely further removed. The flexible basic material is pref. of polyester and the auxiliary carrier is of spring bronze - CuSn6. Through a partial removal and structuring of the auxiliary carrier, functional areas such as heat troughs, fixture aids or additional conductor paths are produced. USE/ADVANTAGE - For the prodn. at favourable cost of electronic circuits on the basis of flexible conductor plates.

Description

Die Erfindung betrifft ein Verfahren zur Herstellung von vorzugs­ weise aus SMD-Bauelementen aufgebauten elektronischen Schaltungen auf der Basis flexibler Leiterplatten, die sich durch eine hohe Maßhaltigkeit auszeichnen und gegebenenfalls starre oder biegbare Bereiche, z. B. funktionell erforderliche Wärmesenken enthalten.The invention relates to a method for producing preferential electronic circuits built up of SMD components on the basis of flexible printed circuit boards, which are characterized by a high Mark dimensional accuracy and, if necessary, rigid or bendable Areas, e.g. B. contain functionally required heat sinks.

Bei der Herstellung von flexiblen Leiterplatten als Trägermaterial für die SMD-Montage spielt die Maßhaltigkeit der kompletten flexi­ blen Schaltung, insbesondere in der Feinleitertechnik, eine immer größere Rolle.In the production of flexible printed circuit boards as carrier material The dimensional stability of the complete flexi plays a role in SMD assembly blen circuit, especially in fine conductor technology, always bigger role.

Um den hohen Anforderungen hinsichtlich automatischer Bestückbar­ keit und Adaptierbarkeit der elektronischen Schaltung im Ferti­ gungsprozeß gerecht zu werden, kommen vorzugsweise speziell behan­ delte Polyimidträgermaterialien zur Anwendung. Ein Nachteil derar­ tiger Leiterplatten ist, neben dem hohen Materialpreis, die bei thermischer Einwirkung, z. B. beim Lötprozeß, auftretende Wärme­ schrumpfung.To meet the high requirements with regard to automatic assembly speed and adaptability of the electronic circuit in the ferti The process of doing justice to this is particularly appropriate delte polyimide carrier materials for use. A disadvantage of that tiger printed circuit boards is, in addition to the high material price, the thermal action, e.g. B. during the soldering process, heat shrinkage.

Insbesondere bei flexiblen Leiterplatten mit großflächigen Abmes­ sungen wirkt sich dies nachteilig auf die Maßhaltigkeit aus. Nach­ teilig ist weiterhin die schlechte Handhabbarkeit der flexiblen Leiterplatte im Weiterverarbeitungsprozeß zum elektronischen Sy­ stem bzw. zur elektronischen Schaltung.Especially with flexible printed circuit boards with large dimensions solutions, this affects the dimensional accuracy. After in part is the poor manageability of the flexible Printed circuit board in the processing process for electronic sy stem or for electronic switching.

Aufgabe der Erfindung ist die Schaffung eines Verfahrens zur ko­ stengünstigen Herstellung elektronischer Schaltungen auf der Basis flexibler Leiterplatten, die sich durch eine hohe Maßhaltigkeit einerseits und durch verbesserte Verarbeitungseigenschaften und erweiterte Anwendungsmöglichkeiten andererseits auszeichnen.The object of the invention is to provide a method for knockout cost-effective manufacture of electronic circuits on the basis flexible printed circuit boards, characterized by a high dimensional accuracy on the one hand and through improved processing properties and On the other hand, distinguish extended application options.

Erfindungsgemäß wird die Aufgabe dadurch gelöst, daß die Rückseite des Cu-kaschierten bzw. bereits strukturierten flexiblen Basisma­ terials mit einem mechanisch stabilen Hilfsträger geringer Wärme­ ausdehnung, vorzugsweise ganzflächig fest verbunden wird, und erst im Anschluß an die erfolgte Lötmontage der SMD-Bauelemente eine räumliche Ausbildung des Hilfsträgers/Leiterplattenverbundes bzw. eine vollständige oder teilweise Entfernung des Hilfsträgers er­ folgt.According to the invention the object is achieved in that the back of the Cu-clad or already structured flexible base terials with a mechanically stable auxiliary carrier of low heat expansion, preferably firmly connected over the entire surface, and only following the soldering assembly of the SMD components spatial training of the auxiliary carrier / circuit board assembly or  a complete or partial removal of the auxiliary carrier follows.

als Hilfsträger kommen vorzugsweise metallische Materialien zur Anwendung. In Verbindung mit den für flexible Leiterplatten bekannten Klebstoffsystemen eignen sich insbesondere Federbronzelegierungen (CuSn6) als Hilfsträger. CuSn6 ist mecha­ nisch gut bearbeitbar, kann z. B. durch Ätzprozesse einfach strukturiert werden und weist in Verbindung mit geeigneten Kleb­ stoffen, auch ohne aufwendige Vorbehandlungen, eine hohe Verbin­ dungsfestigkeit auf. Zur Schaffung starrer oder biegbarer Berei­ che, z. B. funktionell erforderlicher Wärmesenken oder zusätzli­ cher Leiterbahnen, kann eine teilweise Entfernung des Hilfsträgers erfolgen.Metallic materials are preferably used as auxiliary carriers Application. In conjunction with the for flexible circuit boards Known adhesive systems are particularly suitable Spring bronze alloys (CuSn6) as subcarriers. CuSn6 is mecha nisch well editable, z. B. simply by etching processes be structured and points in connection with suitable adhesive substances, even without extensive pretreatment, a high level tensile strength. To create rigid or flexible areas che, e.g. B. functionally required heat sinks or additional cher conductor tracks, partial removal of the subcarrier respectively.

Die Herstellung der flexiblen Schaltung erfolgt dadurch, daß vor­ zugsweise flexible Leiterplatten mit bereits ausgebildeter Leiter­ bildstruktur mit einem mechanisch stabilen, vorzugsweise biegbaren metallischen Hilfsträger verbunden werden, der erst nach erfolgter Weitervererarbeitung der flexiblen Schaltung, einschließlich der SMD-Lötmontage, räumlich verformt bzw. vollständig oder teilweise wieder entfernt wird. Dadurch wird der Einsatz kostengünstiger Po­ lyesterfolien möglich, die an sich im üblichen Löttemperaturbe­ reich von ca. 210°C-240°C erhebliche Wärmeschrumpfungen auf­ weisen. Durch die feste Verbindung mit dem Hilfsträger wird eine Schrumpfung der Polyesterfolie im Löttemperaturbereich verhindert. Selbst eine schockartige Erwärmung auf Löttemperatur wird ermög­ licht. Die bei der Weiterbehandlung der flexiblen Schaltung typi­ schen Wärmebelastungen bleiben auf die Vorverzinnung der flexiblen Leiterplatte und die im allgemeinen maschinelle Lötmontage be­ schränkt und garantieren damit, insbesondere für Polyesterfolien, ein hervorragendes Flexibilitäts- und Biegewechselverhalten, eine teilweise bzw. vollständige Entfernung des Hilfsträgers vorausge­ setzt.The production of the flexible circuit is done in that before preferably flexible circuit boards with already trained conductors image structure with a mechanically stable, preferably bendable metallic subcarrier can be connected, which only after Further processing of the flexible circuit, including the SMD solder assembly, spatially deformed or completely or partially is removed again. This makes the use of inexpensive bottom possible polyester foils, which are in the usual soldering temperature range from approx. 210 ° C-240 ° C to significant heat shrinkage point. Due to the firm connection with the subcarrier, a Shrinkage of the polyester foil in the soldering temperature range prevented. Even shock-like heating to the soldering temperature is possible light. Typi in the further processing of the flexible circuit thermal loads remain on the pre-tinning of the flexible PCB and the generally mechanical soldering assembly be limits and thus guarantees, especially for polyester films, excellent flexibility and bending behavior, a partial or complete removal of the auxiliary carrier puts.

Die weitere Ausgestaltung der Erfindung kann den Patentansprüchen entnommen werden.The further embodiment of the invention can be removed.

Mit der Anwendung des erfinderischen Verfahrens können elektroni­ sche Schaltungen auf der Basis flexibler Leiterplatten hergestellt werden, die gegenüber herkömmlichen Leiterplatten eine erhöhte Maßhaltigkeit besitzen und mit zusätzlichen Bestandteilen wie Wär­ mesenken oder z. B. Fixierungshilfen kombinierbar sind. Durch die Einsatzmöglichkeit von Polyesterfolien ist die Herstellung kosten­ günstiger hochflexibler Leiterplatten möglich. Das vorliegende Verfahren ermöglicht auch bei Anwendung üblicher maschineller Löt­ verfahren, z. B. Infrarotlöten, den Einsatz von Polyestermaterial.With the application of the inventive method, electroni circuits based on flexible printed circuit boards  be increased compared to conventional circuit boards Have dimensional accuracy and with additional components such as heat mesenken or z. B. fixation aids can be combined. Through the Possibility of using polyester films is the production cost affordable, highly flexible printed circuit boards possible. The present The method also enables the use of conventional machine soldering procedure, e.g. B. infrared soldering, the use of polyester material.

Es liegt natürlich im Rahmen der Erfindung, daß neben Polyester auch andere geeignete Materialien eingesetzt werden können.It is of course within the scope of the invention that in addition to polyester other suitable materials can also be used.

Die beim Lötprozeß auftretende Wärmeschrumpfung von Polyester wird durch Anwendung des erfinderischen Verfahrens auf Werte < 0,05% reduziert. Die mechanische Stabilität des vorzugsweise metalli­ schen Hilfsträgers erleichtert das Handling der flexiblen Leiter­ platte und wirkt sich günstig im Lötprozeß aus, da durch die gute thermische Leitfähigkeit des Hilfsträgers örtliche Temperaturun­ terschiede, z. B. aufgrund der unterschiedlichen Bauelementemasse, schnell ausgeglichen werden können.The heat shrinkage of polyester that occurs during the soldering process becomes by applying the inventive method to values <0.05% reduced. The mechanical stability of the preferably metallic auxiliary carrier makes handling the flexible ladder easier plate and has a favorable effect in the soldering process, because of the good thermal conductivity of the subcarrier local temperature different, e.g. B. due to the different component mass, can be compensated quickly.

Werden an die räumliche Ausbildbarkeit der elektronischen Schal­ tung nur geringe Ansprüche gestellt, kann auf eine Entfernung des biegbaren metallischen Hilfsträgers verzichtet werden.Be on the spatial trainability of the electronic scarf only low demands, can be removed from the bendable metallic subcarrier are dispensed with.

Die weitere Ausgestalgung der Erfindung. ist den Patentansprüchen zu entnehmen.The further embodiment of the invention. is the claims refer to.

Die Erfindung wird anhand eines Ausführungsbeispiels näher erläu­ tert. In den dazugehörigen Zeichnungen zeigen:The invention is explained in more detail using an exemplary embodiment tert. In the accompanying drawings:

Fig. 1 die schematische Darstellung des Grundaufbaus der flexiblen Schaltung mit Hilfsträger Fig. 1 shows the schematic representation of the basic structure of the flexible circuit with subcarrier

Fig. 2 die schematische Darstellung einer räumlich ausgebildeten biegbaren elektronischen Schaltung Fig. 2 is a schematic representation of a spatially formed bendable electronic circuit

Fig. 3 die schematische Darstellung einer flexiblen elektronischen Schaltung mit zusätzlichen funktionellen Bereichen. Fig. 3 is a schematic representation of a flexible electronic circuit with additional functional areas.

Entsprechend Fig. 1 ist mit (1) ein mechanisch stabiler, biegbarer Hilfsträger geringer Wärmeausdehnung bezeichnet, der z. B. mit ei­ nem thermisch stabilen Klebstoffsystem (2) fest mit der Rückseite einer bereits strukturierten flexiblen Leiterplatte verbunden ist. Die flexible Leiterplatte besteht aus einem mit einem Klebstoffsy­ stem (4) versehenen Basismaterial (3), der Leiterbildstruktur mit Cu-Kontaktierflächen (6) und einem Schutzlack bzw. einer Deckfolie (5). Die Cu-Kontaktierflächen (6) der flexiblen Leiterplatte sind vorzugsweise mit einer Zinn/Blei-Lotschicht (7) versehen.According to Fig. 1, ( 1 ) denotes a mechanically stable, bendable subcarrier with low thermal expansion, which, for. B. with egg NEM thermally stable adhesive system ( 2 ) is firmly connected to the back of an already structured flexible circuit board. The flexible printed circuit board consists of a base material ( 3 ) provided with an adhesive system ( 4 ), the circuit pattern structure with Cu contact surfaces ( 6 ) and a protective lacquer or a cover film ( 5 ). The Cu contact surfaces ( 6 ) of the flexible printed circuit board are preferably provided with a tin / lead solder layer ( 7 ).

Gemäß Fig. 2 ist der aus dem biegbaren Trägermaterial (1) und der flexiblen Leiterplatte bestehende Verbund räumlich ausgebildet. Diese räumliche Ausbindung kann so erfolgen, daß die Geometrie an ein einfaches räumliches Gehäusedesign angepaßt wird.According to Fig. 2 of from the flexible carrier material (1) and the flexible circuit board is formed spatially existing composite. This spatial expansion can be done so that the geometry is adapted to a simple spatial housing design.

Mit (8) sind die vor der räumlichen Ausbildung montierten SMD-Bau­ elemente bezeichnet. Bauelemente mit einer hohen Verlustleistung, z. B. in Nacktchipausführung (9) können direkt auf den Hilfsträger (1) montiert werden. Dazu sind in die flexible Leiterplatte Aus­ brüche (10) eingebracht.With ( 8 ) the mounted before the spatial training SMD construction elements are called. Components with a high power loss, e.g. B. naked chip version ( 9 ) can be mounted directly on the submount ( 1 ). For this purpose, breaks ( 10 ) are introduced into the flexible printed circuit board.

Entsprechend Fig. 3 ist mit (3) das Basismaterial der flexiblen Leiterplatte bezeichnet, die Cu-Leiterbahnen und Kontaktierflächen (6) aufweist. An den Kontaktierflächen (6) sind Anschlüsse der SMD-Bauelemente durch Zinn/Blei-Lot befestigt. Die Ausbildung der Lötstellen wird mit (12) bezeichnet. An der Rückseite der flexi­ blen Leiterplatte sind funktionelle Bereiche z. B. eine Wärmesenke (13) Zur verbesserten Abführung der Verlustleistung von SMD- Schaltkreisen vorgesehen. Die mit (11) bezeichnete Schicht im Bie­ gebereich der flexiblen Schaltung dient als mechanisch stabile Fi­ xierungshilfe. Zusätzliche Leiterzüge (14) können z. B. durch Strukturätzen aus einem metallischen Hilfsträger geschaffen werden und zur Kontaktierung zusätzlicher Bauelemente (15) dienen.Accordingly, Fig. 3 is denoted by (3) the base material of the flexible printed circuit board having Cu interconnects and contact surfaces (6). Connections of the SMD components are fastened to the contacting surfaces ( 6 ) using tin / lead solder. The formation of the solder joints is designated with (12). At the back of the flexi ble circuit board are functional areas such. B. a heat sink ( 13 ) is provided for improved dissipation of the power loss of SMD circuits. The layer designated with ( 11 ) in the bending area of the flexible circuit serves as a mechanically stable fixing aid. Additional conductor tracks ( 14 ) can, for. B. be created by structural etching from a metallic subcarrier and serve to contact additional components ( 15 ).

Die vollständige bzw. teilweise Entfernung des Hilfsträgers (1) erfolgt erst im Anschsuß an die Montage der SMD-Bauelemente. Durch eine teilweise Entfernung des Hilfsträgers gemäß Fig. 3 können Wärmesenken (13), Fixierungshilfen (11) und zusätzliche Lei­ terbahnen (14) erzeugt werden. Als Hilfsträger (1) wird eine Fe­ derbronzelegierung eingesetzt.The complete or partial removal of the auxiliary carrier ( 1 ) takes place only after the assembly of the SMD components. 3, heat sinks ( 13 ), fixing aids ( 11 ) and additional conductor tracks ( 14 ) can be generated by a partial removal of the auxiliary carrier according to FIG . An auxiliary bronze alloy is used as the auxiliary carrier ( 1 ).

Claims (4)

1. Verfahren zur Herstellung elektronischer Schaltungen auf der Basis flexibler Leiterplatten, dadurch gekennzeichnet, daß vorzugsweise flexible Leiterplatten mit bereits ausgebildeter Leiterbildstruktur (6) mit einem mecha­ nisch stabilen Hilfsträger (1) geringer Wärmeausdehnung fest ver­ bunden werden, der erst nach erfolgter Weiterverarbeitung der fle­ xiblen Schaltung, einschließlich der Lötmontage, räumlich verformt bzw. teilweise oder vollständig wieder entfernt wird.1. A process for the production of electronic circuits based on flexible printed circuit boards, characterized in that preferably flexible printed circuit boards with already formed circuit pattern structure ( 6 ) with a mechanically stable auxiliary carrier ( 1 ) low thermal expansion are connected ver, which only after further processing of the fle xiblen circuit, including the solder assembly, is spatially deformed or partially or completely removed again. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das flexible Basismaterial (3) vor­ zugsweise aus Polyester und der Hilfsträger (1) vorzugsweise aus Federbronze CuSn6 besteht.2. The method according to claim 1, characterized in that the flexible base material ( 3 ) before preferably made of polyester and the auxiliary carrier ( 1 ) preferably consists of spring bronze CuSn6. 3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß durch eine teilweise Entfernung bzw. Strukturierung des Hilfsträgers (1) funktionelle Bereiche wie Wär­ mesenken (13), Fixierungshilfen (11) oder zusätzliche Leiterbahnen (14) erzeugt werden.3. The method according to claim 1, characterized in that functional areas such as heat sinks ( 13 ), fixing aids ( 11 ) or additional conductor tracks ( 14 ) are generated by a partial removal or structuring of the auxiliary carrier ( 1 ). 4. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß zur direkten Montage von Bauelementen hoher Verlustleistung Ausbrüche (10) in die flexible Leiterplatte eingebracht sind.4. The method according to claim 1, characterized in that for the direct assembly of high power dissipation breakouts ( 10 ) are introduced into the flexible circuit board.
DE19914123370 1991-07-15 1991-07-15 Method for producing electrical circuits based on flexible conductor plates - has rear side of copper@ laminated flexible basic material connected to mechanically stable auxiliary carrier with low heat expansion Withdrawn DE4123370A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19914123370 DE4123370A1 (en) 1991-07-15 1991-07-15 Method for producing electrical circuits based on flexible conductor plates - has rear side of copper@ laminated flexible basic material connected to mechanically stable auxiliary carrier with low heat expansion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19914123370 DE4123370A1 (en) 1991-07-15 1991-07-15 Method for producing electrical circuits based on flexible conductor plates - has rear side of copper@ laminated flexible basic material connected to mechanically stable auxiliary carrier with low heat expansion

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4427112A1 (en) * 1994-07-30 1996-02-01 Kolbe & Co Hans Circuit board arrangement with aluminium base for power electronics
WO1998052391A1 (en) * 1997-05-16 1998-11-19 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, and processing a flexible circuit
DE19855715A1 (en) * 1998-12-03 2000-09-28 Leuze Electronic Gmbh & Co Arrangement for processing a circuit board
WO2002052909A3 (en) * 2000-12-26 2003-10-09 Emcore Corp Flexible printed circuit board
US6687969B1 (en) 1997-05-16 2004-02-10 Micron Technology, Inc. Methods of fixturing flexible substrates and methods of processing flexible substrates
US6799902B2 (en) 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
US6863444B2 (en) 2000-12-26 2005-03-08 Emcore Corporation Housing and mounting structure
US6863453B2 (en) 2003-01-28 2005-03-08 Emcore Corporation Method and apparatus for parallel optical transceiver module assembly
US6905260B2 (en) 2000-12-26 2005-06-14 Emcore Corporation Method and apparatus for coupling optical elements to optoelectronic devices for manufacturing optical transceiver modules
US7021836B2 (en) 2000-12-26 2006-04-04 Emcore Corporation Attenuator and conditioner

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4427112A1 (en) * 1994-07-30 1996-02-01 Kolbe & Co Hans Circuit board arrangement with aluminium base for power electronics
US6687969B1 (en) 1997-05-16 2004-02-10 Micron Technology, Inc. Methods of fixturing flexible substrates and methods of processing flexible substrates
WO1998052391A1 (en) * 1997-05-16 1998-11-19 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, and processing a flexible circuit
US5972152A (en) * 1997-05-16 1999-10-26 Micron Communications, Inc. Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
US6458234B1 (en) 1997-05-16 2002-10-01 Micron Technology, Inc. Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrate
DE19855715A1 (en) * 1998-12-03 2000-09-28 Leuze Electronic Gmbh & Co Arrangement for processing a circuit board
WO2002052909A3 (en) * 2000-12-26 2003-10-09 Emcore Corp Flexible printed circuit board
US6799902B2 (en) 2000-12-26 2004-10-05 Emcore Corporation Optoelectronic mounting structure
US6863444B2 (en) 2000-12-26 2005-03-08 Emcore Corporation Housing and mounting structure
US6867377B2 (en) 2000-12-26 2005-03-15 Emcore Corporation Apparatus and method of using flexible printed circuit board in optical transceiver device
US6905260B2 (en) 2000-12-26 2005-06-14 Emcore Corporation Method and apparatus for coupling optical elements to optoelectronic devices for manufacturing optical transceiver modules
US7021836B2 (en) 2000-12-26 2006-04-04 Emcore Corporation Attenuator and conditioner
US6863453B2 (en) 2003-01-28 2005-03-08 Emcore Corporation Method and apparatus for parallel optical transceiver module assembly

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