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DE69600696D1 - Abgeschirmtes gehäuse für elektronik - Google Patents

Abgeschirmtes gehäuse für elektronik

Info

Publication number
DE69600696D1
DE69600696D1 DE69600696T DE69600696T DE69600696D1 DE 69600696 D1 DE69600696 D1 DE 69600696D1 DE 69600696 T DE69600696 T DE 69600696T DE 69600696 T DE69600696 T DE 69600696T DE 69600696 D1 DE69600696 D1 DE 69600696D1
Authority
DE
Germany
Prior art keywords
cover plate
emi
shielding compound
rfi
shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69600696T
Other languages
English (en)
Other versions
DE69600696T2 (de
Inventor
Joseph Salvi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Parker Hannifin Corp
Original Assignee
Parker Hannifin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parker Hannifin Corp filed Critical Parker Hannifin Corp
Application granted granted Critical
Publication of DE69600696D1 publication Critical patent/DE69600696D1/de
Publication of DE69600696T2 publication Critical patent/DE69600696T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Dental Preparations (AREA)
DE69600696T 1995-03-03 1996-03-01 Abgeschirmtes gehäuse für elektronik Expired - Lifetime DE69600696T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/398,476 US5566055A (en) 1995-03-03 1995-03-03 Shieled enclosure for electronics
PCT/US1996/002818 WO1996028007A1 (en) 1995-03-03 1996-03-01 Shielded enclosure for electronics

Publications (2)

Publication Number Publication Date
DE69600696D1 true DE69600696D1 (de) 1998-10-29
DE69600696T2 DE69600696T2 (de) 1999-02-18

Family

ID=23575519

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69600696T Expired - Lifetime DE69600696T2 (de) 1995-03-03 1996-03-01 Abgeschirmtes gehäuse für elektronik

Country Status (12)

Country Link
US (1) US5566055A (de)
EP (1) EP0813805B1 (de)
JP (1) JPH11502672A (de)
CN (1) CN1098622C (de)
AT (1) ATE171589T1 (de)
BR (1) BR9607119A (de)
CA (1) CA2214434A1 (de)
DE (1) DE69600696T2 (de)
DK (1) DK0813805T3 (de)
ES (1) ES2122803T3 (de)
NO (1) NO974041L (de)
WO (1) WO1996028007A1 (de)

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DE60116666T2 (de) * 2000-11-20 2006-11-16 Parker-Hannifin Corp., Cleveland Interferenzverringerung mittels leitender thermoplastischer verbundmaterialien
US6760230B2 (en) * 2001-02-28 2004-07-06 Andrew Corporation Compact, high efficiency, high isolation power amplifier
US6747879B2 (en) * 2001-02-28 2004-06-08 Andrew Corporation High power amplifier and chassis
US6965071B2 (en) * 2001-05-10 2005-11-15 Parker-Hannifin Corporation Thermal-sprayed metallic conformal coatings used as heat spreaders
EP1386527A1 (de) 2001-05-10 2004-02-04 Parker Hannifin Corporation Herstellung eines gehäuses für elektronik mit einer metallisierten schutzschicht
EP1386528B1 (de) 2001-05-11 2005-10-05 Parker Hannifin Corporation Gekerbte elektromagnetische abgeschirmte dichtung mit geringer schliesskraft
US6809254B2 (en) 2001-07-20 2004-10-26 Parker-Hannifin Corporation Electronics enclosure having an interior EMI shielding and cosmetic coating
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EP1445998B1 (de) * 2003-02-07 2007-10-24 Sony Ericsson Mobile Communications AB Abschirmdeckel zur Abschirmung von elektronischen Bauteilen auf einer Leiterplatte
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) * 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
US6982866B2 (en) * 2003-02-14 2006-01-03 Intel Corporation Lightweight robust enclosure design for a mobile computing system
US7248484B2 (en) * 2003-03-12 2007-07-24 Hewlett-Packard Development Company, L.P. Electro-magnetic suppressive structure
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TWI291322B (en) * 2003-05-20 2007-12-11 Laird Technologies Inc Method for manufacturing an EMI shielding element
DE10324411B4 (de) * 2003-05-28 2007-01-25 Kathrein-Werke Kg Elektronisches Gerät
TWI333805B (en) * 2003-10-03 2010-11-21 Osram Sylvania Inc Housing for electronic ballast
US20050237663A1 (en) * 2004-04-21 2005-10-27 Riospring, Inc. Insulator with pocket features
FR2870429B1 (fr) * 2004-05-11 2006-07-28 Sagem Dispositif de blindage pour module electronique radioelectrique
US6903910B1 (en) 2004-08-06 2005-06-07 Azijuth Networks, Inc. Shielded enclosure with user-installable interface modules
US7260998B2 (en) * 2005-03-18 2007-08-28 The Boeing Company Apparatuses and methods for structurally testing fasteners
US7170277B2 (en) * 2005-04-12 2007-01-30 Texas Instruments Incorporated Shield for tester load boards
US7491899B2 (en) * 2005-10-06 2009-02-17 Laird Technologies, Inc. EMI shields and related manufacturing methods
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US7733659B2 (en) 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
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US8004135B2 (en) * 2007-01-22 2011-08-23 Nidec Motor Corporation Electric motor and controller assembly with integrated sensor device
US8630092B2 (en) * 2007-04-26 2014-01-14 Ceramtec Gmbh Cooling box for components or circuits
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JP5576542B1 (ja) * 2013-08-09 2014-08-20 太陽誘電株式会社 回路モジュール及び回路モジュールの製造方法
US10588248B1 (en) * 2014-10-24 2020-03-10 L-3 Communications Corp. Radial EMI and environmental gasket
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Also Published As

Publication number Publication date
HK1004853A1 (en) 1998-12-11
MX9706573A (es) 1997-11-29
EP0813805B1 (de) 1998-09-23
NO974041D0 (no) 1997-09-03
CA2214434A1 (en) 1996-09-12
NO974041L (no) 1997-09-03
US5566055A (en) 1996-10-15
ATE171589T1 (de) 1998-10-15
BR9607119A (pt) 1997-11-04
WO1996028007A1 (en) 1996-09-12
CN1182527A (zh) 1998-05-20
CN1098622C (zh) 2003-01-08
EP0813805A2 (de) 1997-12-29
ES2122803T3 (es) 1998-12-16
JPH11502672A (ja) 1999-03-02
DK0813805T3 (da) 1999-06-14
DE69600696T2 (de) 1999-02-18

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