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DE69841449D1 - Sperrschicht-feldeffekttransistor aus silicumcarbid - Google Patents

Sperrschicht-feldeffekttransistor aus silicumcarbid

Info

Publication number
DE69841449D1
DE69841449D1 DE69841449T DE69841449T DE69841449D1 DE 69841449 D1 DE69841449 D1 DE 69841449D1 DE 69841449 T DE69841449 T DE 69841449T DE 69841449 T DE69841449 T DE 69841449T DE 69841449 D1 DE69841449 D1 DE 69841449D1
Authority
DE
Germany
Prior art keywords
silicum
carbide
field effect
effect transistor
barrier field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69841449T
Other languages
English (en)
Inventor
Toshiyuki Oono
Takayuki Iwasaki
Tsutomu Yatsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69841449D1 publication Critical patent/DE69841449D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40Crystalline structures
    • H10D62/405Orientations of crystalline planes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/441Vertical IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0291Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
DE69841449T 1998-03-19 1998-03-19 Sperrschicht-feldeffekttransistor aus silicumcarbid Expired - Lifetime DE69841449D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1998/001185 WO1999048153A1 (en) 1998-03-19 1998-03-19 Silicon carbide semiconductor switching device

Publications (1)

Publication Number Publication Date
DE69841449D1 true DE69841449D1 (de) 2010-03-04

Family

ID=14207836

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69841449T Expired - Lifetime DE69841449D1 (de) 1998-03-19 1998-03-19 Sperrschicht-feldeffekttransistor aus silicumcarbid

Country Status (6)

Country Link
US (1) US6384428B1 (de)
EP (1) EP1065726B1 (de)
KR (1) KR100342798B1 (de)
CN (1) CN1286805A (de)
DE (1) DE69841449D1 (de)
WO (1) WO1999048153A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4360085B2 (ja) * 2002-12-25 2009-11-11 株式会社デンソー 炭化珪素半導体装置
US6747291B1 (en) 2003-01-10 2004-06-08 The United States Of America As Represented By The Secretary Of The Air Force Ohmic contacts on p-type silicon carbide using carbon films
WO2005053034A1 (ja) 2003-11-25 2005-06-09 Matsushita Electric Industrial Co., Ltd. 半導体素子
WO2006090432A1 (ja) * 2005-02-22 2006-08-31 Neomax Co., Ltd. SiC単結晶基板の製造方法
JP4775102B2 (ja) 2005-05-09 2011-09-21 住友電気工業株式会社 半導体装置の製造方法
JP4784178B2 (ja) * 2005-07-01 2011-10-05 株式会社日立製作所 半導体装置
JP5068009B2 (ja) 2005-09-14 2012-11-07 三菱電機株式会社 炭化ケイ素半導体装置
CN101132030B (zh) * 2007-08-24 2011-08-03 中国科学院上海硅酸盐研究所 一种高耐压碳化硅光导开关
WO2011089687A1 (ja) * 2010-01-19 2011-07-28 住友電気工業株式会社 炭化ケイ素半導体装置およびその製造方法
CA2740244A1 (en) * 2010-01-27 2011-07-27 Sumitomo Electric Industries, Ltd. Silicon carbide semiconductor device and method of manufacturing thereof
CN102157597A (zh) * 2010-02-11 2011-08-17 中国科学院上海硅酸盐研究所 一种光控碳化硅光电导开关
CA2779961A1 (en) * 2010-12-27 2012-06-27 Sumitomo Electric Industries, Ltd. Silicon carbide substrate, semiconductor device, method of manufacturing silicon carbide substrate and method of manufacturing semiconductor device
JP6278549B2 (ja) * 2012-03-30 2018-02-14 富士電機株式会社 半導体装置
JP2016004955A (ja) * 2014-06-19 2016-01-12 三菱電機株式会社 炭化珪素半導体装置及びその製造方法
CN104737912B (zh) * 2015-03-31 2017-09-15 临沂大学 一种非洲菊组培快繁培养基及其培育方法
JP6745458B2 (ja) * 2015-04-15 2020-08-26 パナソニックIpマネジメント株式会社 半導体素子
US9773924B2 (en) 2015-04-22 2017-09-26 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device having barrier region and edge termination region enclosing barrier region

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63289960A (ja) * 1987-05-22 1988-11-28 Fujitsu Ltd 電界効果型半導体装置
JP3267983B2 (ja) * 1991-02-14 2002-03-25 株式会社東芝 半導体発光素子及びその製造方法
JP3146694B2 (ja) 1992-11-12 2001-03-19 富士電機株式会社 炭化けい素mosfetおよび炭化けい素mosfetの製造方法
JP2910573B2 (ja) 1993-09-10 1999-06-23 株式会社日立製作所 電界効果トランジスタ及びその製造方法
DE69534888T2 (de) * 1994-04-06 2006-11-02 Denso Corp., Kariya Herstellungsverfahren für Halbleiterbauelement mit Graben
WO1995034915A1 (en) * 1994-06-13 1995-12-21 Abb Research Ltd. Semiconductor device in silicon carbide
US5736753A (en) * 1994-09-12 1998-04-07 Hitachi, Ltd. Semiconductor device for improved power conversion having a hexagonal-system single-crystal silicon carbide
JP3158973B2 (ja) * 1995-07-20 2001-04-23 富士電機株式会社 炭化けい素縦型fet
DE19636302C2 (de) * 1995-09-06 1998-08-20 Denso Corp Siliziumkarbidhalbleitervorrichtung und Verfahren zur Herstellung
JP3471509B2 (ja) * 1996-01-23 2003-12-02 株式会社デンソー 炭化珪素半導体装置
JPH10107263A (ja) * 1996-09-27 1998-04-24 Fuji Electric Co Ltd 絶縁ゲート型炭化ケイ素半導体装置
JPH10125904A (ja) * 1996-10-17 1998-05-15 Denso Corp 炭化珪素半導体装置

Also Published As

Publication number Publication date
KR20010041965A (ko) 2001-05-25
EP1065726B1 (de) 2010-01-13
KR100342798B1 (ko) 2002-07-03
CN1286805A (zh) 2001-03-07
US6384428B1 (en) 2002-05-07
WO1999048153A1 (en) 1999-09-23
EP1065726A1 (de) 2001-01-03
EP1065726A4 (de) 2006-08-23

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Legal Events

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