DE69016080D1 - Halbleiteranordnung mit einem in eine Kunststoffhülle eingebetteten Halbleiterkörper. - Google Patents

Halbleiteranordnung mit einem in eine Kunststoffhülle eingebetteten Halbleiterkörper.

Info

Publication number: DE69016080D1
Authority: DE; Germany
Prior art keywords: semiconductor; plastic shell; body embedded; arrangement; semiconductor body
Prior art date: 1989-04-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE69016080T

Other languages

English (en)

Other versions

DE69016080T2 (de

Inventor

Michael Friedrich Br Bellersen

Wilhelmus Franciscus M Gootzen

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Taiwan Semiconductor Manufacturing Co TSMC Ltd

Original Assignee

Philips Electronics NV

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-04-20

Filing date

1990-04-12

Publication date

1995-03-02

1990-04-12 Application filed by Philips Electronics NV filed Critical Philips Electronics NV

1995-03-02 Application granted granted Critical

1995-03-02 Publication of DE69016080D1 publication Critical patent/DE69016080D1/de

1995-09-21 Publication of DE69016080T2 publication Critical patent/DE69016080T2/de

2010-04-13 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3192—Multilayer coating
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Chemical & Material Sciences (AREA)
Ceramic Engineering (AREA)
Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Formation Of Insulating Films (AREA)

DE69016080T 1989-04-20 1990-04-12 Halbleiteranordnung mit einem in eine Kunststoffhülle eingebetteten Halbleiterkörper. Expired - Lifetime DE69016080T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
NL8900989A NL8900989A (nl)	1989-04-20	1989-04-20	Halfgeleiderinrichting met een in een kunststof omhulling ingebed halfgeleiderlichaam.

Publications (2)

Publication Number	Publication Date
DE69016080D1 true DE69016080D1 (de)	1995-03-02
DE69016080T2 DE69016080T2 (de)	1995-09-21

Family

ID=19854512

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69016080T Expired - Lifetime DE69016080T2 (de)	1989-04-20	1990-04-12	Halbleiteranordnung mit einem in eine Kunststoffhülle eingebetteten Halbleiterkörper.

Country Status (6)

Country	Link
US (1)	US5117278A (de)
EP (1)	EP0393757B1 (de)
JP (1)	JP3020107B2 (de)
KR (1)	KR0152999B1 (de)
DE (1)	DE69016080T2 (de)
NL (1)	NL8900989A (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH07302912A (ja)	1994-04-29	1995-11-14	Semiconductor Energy Lab Co Ltd	半導体装置
JPH08162528A (ja) *	1994-10-03	1996-06-21	Sony Corp	半導体装置の層間絶縁膜構造
US6800875B1 (en)	1995-11-17	2004-10-05	Semiconductor Energy Laboratory Co., Ltd.	Active matrix electro-luminescent display device with an organic leveling layer
TW384412B (en) *	1995-11-17	2000-03-11	Semiconductor Energy Lab	Display device
US5940732A (en) *	1995-11-27	1999-08-17	Semiconductor Energy Laboratory Co.,	Method of fabricating semiconductor device
US6294799B1 (en) *	1995-11-27	2001-09-25	Semiconductor Energy Laboratory Co., Ltd.	Semiconductor device and method of fabricating same
TW309633B (de) *	1995-12-14	1997-07-01	Handotai Energy Kenkyusho Kk
US6225218B1 (en)	1995-12-20	2001-05-01	Semiconductor Energy Laboratory Co., Ltd.	Semiconductor device and its manufacturing method
JP3725266B2 (ja)	1996-11-07	2005-12-07	株式会社半導体エネルギー研究所	配線形成方法
US6475836B1 (en) *	1999-03-29	2002-11-05	Semiconductor Energy Laboratory Co., Ltd.	Semiconductor device and manufacturing method thereof
US6252290B1 (en) *	1999-10-25	2001-06-26	Chartered Semiconductor Manufacturing Ltd.	Method to form, and structure of, a dual damascene interconnect device
EP3872851B1 (de)	2020-02-27	2025-04-30	Infineon Technologies Austria AG	Schutzkappe für gehäuse mit wärmeschnittstellenmaterial

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS53148972A (en) *	1977-06-01	1978-12-26	Hitachi Ltd	Manufacture of resin shielding type semiconductor device
US4134125A (en) *	1977-07-20	1979-01-09	Bell Telephone Laboratories, Incorporated	Passivation of metallized semiconductor substrates
JPS54149469A (en) *	1978-05-16	1979-11-22	Toshiba Corp	Semiconductor device
JPS6018145B2 (ja) *	1980-09-22	1985-05-09	株式会社日立製作所	樹脂封止型半導体装置
JPS59191353A (ja) *	1983-04-15	1984-10-30	Hitachi Ltd	多層配線構造を有する電子装置
JPS6010644A (ja) *	1983-06-30	1985-01-19	Toshiba Corp	半導体装置の製造方法
JPS6030153A (ja) *	1983-07-28	1985-02-15	Toshiba Corp	半導体装置
JPS6080264A (ja) *	1983-10-07	1985-05-08	Toshiba Corp	半導体装置
US4829363A (en) *	1984-04-13	1989-05-09	Fairchild Camera And Instrument Corp.	Structure for inhibiting dopant out-diffusion
US4686559A (en) *	1984-08-03	1987-08-11	Advanced Micro Devices, Inc.	Topside sealing of integrated circuit device
JPS6234920A (ja) *	1985-08-07	1987-02-14	Toshiba Corp	エポキシ樹脂組成物およびそれを用いた樹脂封止型半導体装置
US4855801A (en) *	1986-08-22	1989-08-08	Siemens Aktiengesellschaft	Transistor varactor for dynamics semiconductor storage means
US4795722A (en) *	1987-02-05	1989-01-03	Texas Instruments Incorporated	Method for planarization of a semiconductor device prior to metallization
JPS63258060A (ja) *	1987-04-15	1988-10-25	Nec Corp	半導体記憶装置
JP2735193B2 (ja) *	1987-08-25	1998-04-02	株式会社東芝	不揮発性半導体装置及びその製造方法
JPS6472557A (en) *	1987-09-11	1989-03-17	Seiko Instr & Electronics	Image sensor

1989
- 1989-04-20 NL NL8900989A patent/NL8900989A/nl not_active Application Discontinuation
1990
- 1990-04-12 DE DE69016080T patent/DE69016080T2/de not_active Expired - Lifetime
- 1990-04-12 EP EP90200894A patent/EP0393757B1/de not_active Expired - Lifetime
- 1990-04-17 KR KR1019900005304A patent/KR0152999B1/ko not_active Expired - Fee Related
- 1990-04-18 JP JP2102761A patent/JP3020107B2/ja not_active Expired - Lifetime
1991
- 1991-06-06 US US07/713,023 patent/US5117278A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
US5117278A (en)	1992-05-26
EP0393757A1 (de)	1990-10-24
KR0152999B1 (ko)	1998-10-15
EP0393757B1 (de)	1995-01-18
DE69016080T2 (de)	1995-09-21
NL8900989A (nl)	1990-11-16
JP3020107B2 (ja)	2000-03-15
KR900017154A (ko)	1990-11-15
JPH02301157A (ja)	1990-12-13

Publication	Publication Date	Title
DE68920055D1 (de)	1995-02-02	Geformte Kunststoffartikel mit Formgedächtnis.
DE68920247D1 (de)	1995-02-09	Kunststoffschaum mit Formgedächtnis.
NO891683D0 (no)	1989-04-24	Plastbeholder.
FI893899A7 (fi)	1989-08-18	Parannettu venttiilillä varustettu muovinen paineistettu astia
DE69001677D1 (de)	1993-06-24	Kunststofftraeger mit wasserzeichen.
DE69033822D1 (de)	2001-11-15	Thermoplastische formmassen mit verringertem glanz
NO894600D0 (no)	1989-11-17	Toroms plastpose.
NL194814B (nl)	2002-11-01	Ge´ntegreerde halfgeleiderketen met een identificatieketen in een gemeenschappelijk halfgeleiderlichaam.
DE68909220D1 (de)	1993-10-21	Ankupplungsanordnung in einem haut-durchgang.
DE69004245D1 (de)	1993-12-02	Semi-thermoplastische Formmasse mit thermostabilem Formerinnerungsvermögen.
DE3780764D1 (de)	1992-09-03	Gegossenes kunststoff-chip-gehaeuse mit steckermuster.
DE69027223D1 (de)	1996-07-04	Motorrad mit höhenverstellbarer Karosserie
DE68918510D1 (de)	1994-11-03	Thermoplastische Harzzubereitung.
DE3883562D1 (de)	1993-10-07	Elektrochemische Einrichtung mit einem heizenden Körper.
DE68905031D1 (de)	1993-04-01	Bolzen mit integriertem heizgeraet.
DE69018323D1 (de)	1995-05-11	Formkörper.
DE68901250D1 (de)	1992-05-21	Golfball.
DE69016080D1 (de)	1995-03-02	Halbleiteranordnung mit einem in eine Kunststoffhülle eingebetteten Halbleiterkörper.
DE58905043D1 (de)	1993-09-02	Kunststoff-spritzgiessmaschine.
DE68907394D1 (de)	1993-08-05	Golfball.
DE68923041D1 (de)	1995-07-20	Formmaterial.
NO891332D0 (no)	1989-03-30	Kunststoffkanne.
DE3750175D1 (de)	1994-08-11	Mikroprozessor mit einem Cache-Speicher.
DE58905410D1 (de)	1993-10-07	Kunststoff-Bauelement.
DE68908170D1 (de)	1993-09-09	Anhaenger mit mehreren achsen.

Legal Events

Date	Code	Title	Description
1996-02-22	8364	No opposition during term of opposition
1999-12-16	8327	Change in the person/name/address of the patent owner	Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N
2003-01-16	8320	Willingness to grant licences declared (paragraph 23)
2003-07-17	8328	Change in the person/name/address of the agent	Representative=s name: VOLMER, G., DIPL.-ING., PAT.-ANW., 52066 AACHEN
2008-11-20	8327	Change in the person/name/address of the patent owner	Owner name: NXP B.V., EINDHOVEN, NL
2008-11-20	8328	Change in the person/name/address of the agent	Representative=s name: EISENFUEHR, SPEISER & PARTNER, 10178 BERLIN
2010-01-07	8327	Change in the person/name/address of the patent owner	Owner name: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., , TW
2010-01-07	8328	Change in the person/name/address of the agent	Representative=s name: TER MEER STEINMEISTER & PARTNER GBR PATENTANWAELTE