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EA199900160A1 - Удаление материала излучением, приложенным под наклонным углом - Google Patents

Удаление материала излучением, приложенным под наклонным углом

Info

Publication number
EA199900160A1
EA199900160A1 EA199900160A EA199900160A EA199900160A1 EA 199900160 A1 EA199900160 A1 EA 199900160A1 EA 199900160 A EA199900160 A EA 199900160A EA 199900160 A EA199900160 A EA 199900160A EA 199900160 A1 EA199900160 A1 EA 199900160A1
Authority
EA
Eurasian Patent Office
Prior art keywords
substrate
removal
radiation
inclined angle
undesirable material
Prior art date
Application number
EA199900160A
Other languages
English (en)
Inventor
Одри С. Энгелсберг
Эндрю В. Джонсон
Вилльям А. Паркер
Original Assignee
Колдрон Лимитед Партнершип
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Колдрон Лимитед Партнершип filed Critical Колдрон Лимитед Партнершип
Publication of EA199900160A1 publication Critical patent/EA199900160A1/ru

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Drying Of Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Road Signs Or Road Markings (AREA)
  • Cleaning In General (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Vending Machines For Individual Products (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Confectionery (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

Устройство (10) и способ удаления нежелательного материала с поверхности подложки (12) обеспечивает поток (18) инертного газа над поверхностью подложки из нежелательного материала при облучении (11) нежелательного материала энергетическими фотонами, направленными под углом (8), наклонным к подложке (12). Изобретение позволяет удалять нежелательный материал без изменения физических свойств материала, лежащего под удаляемым нежелательным материалом или рядом с ним. В определённых условиях неперпендикулярное облучение обеспечивает эффективное удаление, в то время как перпендикулярное облучение наносит подложке повреждения или даёт плохое удаление, либо приводит и к тому, и к другому.Международная заявка была опубликована вместе с отчетом о международном поиске.
EA199900160A 1996-07-26 1997-07-22 Удаление материала излучением, приложенным под наклонным углом EA199900160A1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/686,523 US5800625A (en) 1996-07-26 1996-07-26 Removal of material by radiation applied at an oblique angle
PCT/US1997/013317 WO1998004366A1 (en) 1996-07-26 1997-07-22 Removal of material by radiation applied at an oblique angle

Publications (1)

Publication Number Publication Date
EA199900160A1 true EA199900160A1 (ru) 1999-08-26

Family

ID=24756659

Family Applications (1)

Application Number Title Priority Date Filing Date
EA199900160A EA199900160A1 (ru) 1996-07-26 1997-07-22 Удаление материала излучением, приложенным под наклонным углом

Country Status (17)

Country Link
US (1) US5800625A (ru)
EP (1) EP0921871B1 (ru)
JP (1) JP2000515811A (ru)
KR (1) KR100476814B1 (ru)
CN (1) CN1231623A (ru)
AT (1) ATE242065T1 (ru)
AU (1) AU3966397A (ru)
BR (1) BR9710764A (ru)
CZ (1) CZ19899A3 (ru)
DE (1) DE69722633T2 (ru)
EA (1) EA199900160A1 (ru)
HU (1) HUP9903927A3 (ru)
LV (1) LV12345A (ru)
MY (1) MY113873A (ru)
NO (1) NO990150L (ru)
TW (1) TW388075B (ru)
WO (1) WO1998004366A1 (ru)

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US6635845B2 (en) * 2001-05-19 2003-10-21 Imt Co., Ltd. Dry surface cleaning apparatus using a laser
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US20040182416A1 (en) * 2002-07-25 2004-09-23 Allen Susan Davis Method and apparatus for removing minute particle(s) from a surface
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US7006222B2 (en) * 2003-01-08 2006-02-28 Kla-Tencor Technologies Corporation Concurrent measurement and cleaning of thin films on silicon-on-insulator (SOI)
US7247986B2 (en) 2003-06-10 2007-07-24 Samsung Sdi. Co., Ltd. Organic electro luminescent display and method for fabricating the same
US7341695B1 (en) * 2003-12-16 2008-03-11 Stuart Garner Anti-fouling apparatus and method
DE102005020072B4 (de) * 2005-04-22 2007-12-06 Forschungsverbund Berlin E.V. Verfahren zum Feinpolieren/-strukturieren wärmeempfindlicher dielektrischer Materialien mittels Laserstrahlung
DE102005024812A1 (de) * 2005-05-27 2006-11-30 Emag Laser Tec Gmbh Verfahren und Vorrichtung zur Behandlung von Werkstückoberflächen mittels Laserstrahlung
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JP5202876B2 (ja) * 2007-06-06 2013-06-05 日東電工株式会社 レーザー加工方法及びレーザー加工品
US8002899B2 (en) * 2008-09-30 2011-08-23 Applied Materials, Inc. Method and apparatus for mask pellicle adhesive residue cleaning
US9563137B2 (en) 2009-06-23 2017-02-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8310670B2 (en) * 2009-07-08 2012-11-13 Universidade De Vigo Method for removal of wax from porous stones in historical monuments
JP2011085642A (ja) * 2009-10-13 2011-04-28 Hitachi High-Technologies Corp Ｆｐｄパネル実装装置及び実装方法
US20120132629A1 (en) * 2010-11-30 2012-05-31 Electro Scientific Industries, Inc. Method and apparatus for reducing taper of laser scribes
CN102380491A (zh) * 2011-08-01 2012-03-21 迪普干冰制造(大连)有限公司 一种加热吸尘搭配干冰清洗的表面脱漆处理设备及方法
KR101507215B1 (ko) * 2013-02-07 2015-03-30 주식회사 아이엠티 유리 단차부 이물의 건식 세정 방법 및 장치
CN203936519U (zh) * 2014-05-30 2014-11-12 宁德新能源科技有限公司 锂离子电池极片涂层清洗装置
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CN105772447B (zh) * 2016-05-17 2019-02-22 上海临仕激光科技有限公司 一种铝合金氧化膜焊前激光清洗的方法
CN106391591B (zh) * 2016-11-29 2019-11-22 苏州热工研究院有限公司 激光工作头及激光清洗系统
CN107695040B (zh) * 2017-10-20 2021-01-15 大族激光科技产业集团股份有限公司 激光清洗系统及方法
CN108554936A (zh) * 2018-04-08 2018-09-21 苏州珮凯科技有限公司 半导体8寸晶元薄膜制程的e-max工艺的石英零部件的再生方法
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CN111463122B (zh) * 2020-04-20 2021-04-20 天津大学 基于极紫外光的原子级材料可控去除方法
CN113690280B (zh) * 2021-08-11 2023-11-28 深圳市华星光电半导体显示技术有限公司 阵列基板的修复方法和阵列基板
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CN118253509B (zh) * 2024-05-29 2024-08-30 浙江珏芯微电子有限公司 一种去除杜瓦内部多余物的装置及吸附体的制备方法

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Also Published As

Publication number Publication date
US5800625A (en) 1998-09-01
ATE242065T1 (de) 2003-06-15
KR20000029533A (ko) 2000-05-25
EP0921871A1 (en) 1999-06-16
EP0921871B1 (en) 2003-06-04
LV12345A (lv) 1999-09-20
MY113873A (en) 2002-06-29
KR100476814B1 (ko) 2005-03-18
AU3966397A (en) 1998-02-20
BR9710764A (pt) 1999-08-17
HU9903927A (en) 2000-04-28
HUP9903927A3 (en) 2000-05-29
JP2000515811A (ja) 2000-11-28
NO990150L (no) 1999-03-02
CZ19899A3 (cs) 1999-09-15
TW388075B (en) 2000-04-21
NO990150D0 (no) 1999-01-13
DE69722633D1 (de) 2003-07-10
WO1998004366A1 (en) 1998-02-05
CN1231623A (zh) 1999-10-13
DE69722633T2 (de) 2004-04-29

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