EP0816095A1 - Ink jet print head based on organic silicon reaction products - Google Patents

Abstract

The invention provides inkjet printheads which have one or more components made of a polymeric material which is produced essentially from or using at least one compound (I) XaRbSiR '(4-ab) with X = hydrolyzable group, R = optionally substituted Alkyl, aryl, alkenyl, alkylaryl or arylalkyl, R '= organic radical with at least one polymerizable group, a = 1 to 3, b = 0 to 2. Furthermore, the invention provides a process for producing the heads and the use of a polymeric material ready for this.

Description

The present invention relates to ink jet printheads which consist at least in part of a polymeric material that is produced using organosilicon compounds with polycondensable and polymerizable groups.

Inkjet printheads now have to be sold in increasing numbers to be produced. This printing technology is now one time extremely widespread, on the other hand it is desirable to have one To develop "cheap printhead", each together with the Ink cartridge can be replaced.

Inkjet printheads exist next to the actuator (heating element, Piezo element, electrodynamic transducer, etc.) made of structures for liquid management (channel walls, covers, nozzle walls, -covers, ink supply), ink filters and one not wetting nozzle outlet side (e.g. nozzle plate). Modern Ink printheads have the planar structure in common that with the means of semiconductor manufacturing a relatively inexpensive Manufacture with high accuracy in large numbers enables. There are differences in the structure: "Edge shooter arrangement" the droplet is ejected tangentially to the heating element surface, while the so-called "Side shooter arrangement" of the drops normal to the heating element surface is delivered.

The layered structure of the "edge shooter variant" (substrate, Thin film structure, channel structure, channel cover, glass tub with Ink reservoir) requires nozzles that come from different Materials with different wetting properties be formed (thin film layer, photoresist channel wall, Photoresist adhesive layer, channel cover). This different wetting properties can be negative affect drop formation. Therefore, with "edge shooter arrangements" additionally the coating on the nozzle outlet side with a hydrophobic material.

The nozzle outlet of the side-shooter arrangement nozzle plate exists but from only one material. Thereby lie in the nozzle area same wetting properties. Here is an additional one only Coating ("anti-slide coating") required, if the hydrophobic properties of the material are not suffice.

The channel structures of today's printheads are usually made Acrylic-based photoresists through photolithographic Processes generated. For example, photo glass is used that structured after the exposure of the mask can be etched.

The object of the present invention is a universally applicable To provide material for inkjet printheads, with the channel structures, substrates, nozzle plates, nozzles, ink reservoirs, Ink filters and the like for color and mono ink jet print heads can be completely manufactured, and whose hydrophobic properties are sufficient to respond to the To be able to dispense with an anti-triel coating. The Material should be inexpensive, and structuring should with little effort and / or with high precision can.

X

= hydrolysierbare Gruppe

R

= gegebenenfalls substituiertes Alkyl, Aryl, Alkenyl, Alkylaryl oder Arylalkyl,

R'

= organischer Rest mit mindestens einer polymerisierbaren Gruppe,

a

= 1 bis 3

b

= 0 bis 2.

This object is achieved by the provision of a polymeric material for inkjet printheads which is produced from essentially or using at least one compound I. X _a R _b SiR ' _(4-ab) With

X

= hydrolyzable group

R

= optionally substituted alkyl, aryl, alkenyl, alkylaryl or arylalkyl,

R '

organic residue with at least one polymerizable group,

a

= 1 to 3

b

= 0 to 2.

It was found that the generation of Channel structures with the help of technical or physical different procedures can take place, so that depending on Requirement for quality and price particularly inexpensive heads as so-called "disposable heads" can be manufactured while with somewhat more elaborate process high quality Printheads can be generated that have longer lifetimes enable, or are suitable for higher ink throughput.

Polymer materials of the type used according to the invention belong to the material class of the so-called ORMOCERE (ORganically MOdified CERamics). You can choose between inorganic and organic polymers are classified. The production is based on alkoxides of silicon and, if necessary, in addition other metals wholly or partly through organic polymerizable substituents are modified. By hydrolysis and condensation becomes the inorganic part of the network built up by polymerization, polyaddition or others organic coupling reactions the organic part from reactive organic substituents.

Through the targeted installation of photocrosslinkable organic Groups and components can be the aforementioned ORMOCERE for photolithographic and other applications relevant here produce. These are preferably Four-component systems, which are within a broad framework specifically modified and adapted to the requirement profiles of microelectronic, microoptical and micromechanical Conditions can be adjusted.

According to the invention, layers to be structured can be produced as follows:
First of all, within a polycondensation reaction (eg in the sol-gel process), a pre-condensate (here usually referred to as "lacquer") is produced from the selected starting materials, which, depending on the chemical compounds used, is usually stable in storage for a few months. The solids content of the lacquer can be varied, for example by removing solvent or water or by adding an additional solvent. The lacquer is then applied to the desired substrate material as a layer by dipping, spin coating or spraying or the like, the substrate not only consisting of foreign material such as glass, ceramic, metal or foreign polymer, but also of the identical material. By structuring exposure (mostly UV light), the lacquer can be photopolymerized at the desired positions using any technology, whereupon in a so-called "development step" the part not exposed to the light is removed (negative resist behavior), which is done with the help of solvents such as acetone or an alkaline aqueous medium. Finally, the already structured material is thermally crosslinked. Mechanical embossing with simultaneous or subsequent exposure and subsequent thermal post-crosslinking is also possible.

It is therefore preferred that the polymeric material be both photopolymerizable groups as well as thermally cross-linkable Contains groups. Furthermore, it is of course preferred a photoinitiator and possibly an accelerator, for example based on amine added.

FIG. 1 shows an example of the formation of a polymeric "ORMOCER" hybrid material:
First, the inorganic oxide network is built up by polycondensation of alkoxysilanes, in a subsequent step the methacrylic groups of 3-methacryloxypropyltrimethoxysilane (MEMO) are photochemically crosslinked and finally the epoxy groups of 3-glycidoxypropyltrimethoxysilane (GLYMO) are thermally polymerized, so that an organic network value also arises .

G

= Glycidoxypropyltrimethoxysilan,

P2

= Diphenylsilandiol,

M

= Methacryloxypropyltrimethoxysilan,

T

= Tetraethoxysilan und

D

= Dimethyldimethoxysilan.

Als photochemischer Radikalstarter eignet sich beispielsweise Quantacure ITX von Shell Chemie, Irgacure 184 von Ciba-Geigy oder Darocur 4263 von der Firma Merck. Als Beschleuniger für die photochemische Vernetzung eignet sich beispielsweise N-Methyldiethanolamin oder Diethylentriamin, wobei letzteres auch als Epoxid-Härter fungieren kann. Es können auch Mischungen hiervon eingesetzt werden.The following systems have proven to be particularly suitable for the production of the polymeric material:
GMP2T, GMDT, GMP2D and GMD, where:

G

= Glycidoxypropyltrimethoxysilane,

P2

= Diphenylsilanediol,

M

= Methacryloxypropyltrimethoxysilane,

T

= Tetraethoxysilane and

D

= Dimethyldimethoxysilane.

Quantacure ITX from Shell Chemie, Irgacure 184 from Ciba-Geigy or Darocur 4263 from Merck are suitable as photochemical radical initiators. Suitable accelerators for photochemical crosslinking are, for example, N-methyldiethanolamine or diethylene triamine, the latter also being able to act as an epoxy hardener. Mixtures of these can also be used.

The use of the GMP2T system is very particularly preferred.

The paint is preferably made by first the desired silanes, if necessary with further additives (e.g. Network formers or modifying substances), mixed and, if necessary under heat, hydrolyzed by adding water. The Water addition can be done slowly, so the system first substoichiometric amounts are supplied.

The liquid lacquer produced as described above becomes possibly brought to a desired solids content, what preferably by spinning in or distilling off Solvent or water happens. If necessary, additional or alternatively diluted with a suitable solvent (e.g. with ethanol, acetone, propyl acetate or the like). A Solids content in the range from 50% to 85%, especially from about 75% is desirable. However, it should be clear that depending on the type of order and the one you want Structure height also worked with other solids contents can be.

The varnish can then be applied as a layer on one or different Substrate (s) are applied. With the substrate or substrates can it be made of another material like glass, Ceramic, metal, silicon or polymer or the like. Act it can also be an order on the used according to the invention Material take place, which should then already be hardened. The varnish can be applied by spin-on application (for example at a rotation speed of about 300 to 800 rpm and a period of about 30 to 80 seconds). Of course, there are other options for the order given as e.g. Doctor blade, dipping, spraying, embossing or similar

1. Photolithographie
Eine Photostrukturierung erfolgt prinzipiell mit Hilfe von Belichten der gewünschten Teile des Lacks, wobei das Belichten mit einer flächigen Lichtquelle erfolgt. Die Teile des Lacks, die nicht belichtet werden sollen, werden mit Hilfe einer Maske vor dem Bestrahlen geschützt. Dabei kann die Maske z.B. vor der Lichtquelle angeordnet werden. Alternativ kann mit einem Mask-Aligner gearbeitet werden, wobei unter bestimmten Umständen ein gleichzeitiges mechanischen Prägen des Lacks mit Hilfe der Maske erfolgen kann. Dies ist jedoch Spezialfällen vorbehalten, da häufig eine Kontaktbelichtung zu einer Verklebung von Maske und Lack führen könnte. Belichtet wird mit einer Wellenlänge, die die photochemischen Reaktionen im Lack initiiert. Eine für die Photolithographie geeignete Zusammensetzung des polymeren Werkstoffs ist das System GMP2T. Insbesondere ein Lack aus diesem Material, der im wesentlichen von bei der Umsetzung der Komponenten entstandenen flüchtigen Bestandteilen (Alkoholen, Wasser) befreit wurde und mit Propylacetat auf den gewünschten Feststoffgehalt verdünnt wurde, lassen sich Schichtdicken von mehr als 10µm und sogar im Bereich von ≤40µm erzielen. Neben GMP2T erweist sich GMDT als gut geeignet, insbesondere im Hinblick auf Haftungseigenschaften. GMP2D und besonders GMD haben wegen ihres hohen Anteils an nur zweifach anorganisch vernetzbaren Einheiten eine höhere Elastizität, wodurch größere Strukturhöhen rißfrei realisierbar sind. Die Einarbeitung von Füllstoffen ist möglich. Dabei ist zu beachten, daß ein steigender Anteil von Füllstoff die Haftung zum Substrat reduzieren kann.Nach Belichtung der gewünschten Teile des Lacks werden die photochemisch nicht umgesetzten Partien mit einem Lösungsmittel behandelt ("Entwicklung"). Als Lösungsmittel eignen sich polare Substanzen wie wässrige Alkalilösungen, Alkohol und dgl., aber auch unpolare Lösungsmittel wie Toluol und dgl., sofern sie in der Lage sind, das unpolymerisierte Kondensat aus der Schicht herauszulösen. Als besonders geeignet für das System GMP2T haben sich Ethanol, Isopropanol und Aceton erwiesen.Anschließend werden die erhaltenen Strukturen thermisch nachgehärtet. Dies kann beispielsweise im Stundenbereich bei einer Temperatur zwischen 100°C und 170°C erfolgen.Laserdirektschreiben
Die Beschichtung der Substrate, das Entwickeln der Strukturen sowie die thermische Nachhärtung erfolgt beim Laserdirektschreiben wie bei der Photolithographie. Allerdings wird anstelle einer großflächigen Lichtquelle ein eng fokussierter Laserstrahl zur direkten Belichtung des Lacks gewählt. Der Laserstrahl wird dabei auf die gewünschte Breite, beispielsweise 3 bis 50µm und insbesondere 10 bis 20µm für die beschriebenen Kanalstrukturen, fokussiert. Geschrieben wird beispielsweise mit einer Geschwindigkeit von 0,1 bis 10 mm/sec. Insbesondere eine Geschwindigkeit von ungefähr 1 mm/sec. ist bevorzugt, um rißfreie, gleichmäßige Strukturen zu erzielen. Auch mit den Laserdirektschreiben können Strukturhöhen bis zu 40µm erreicht werden. Das vorstehende Verfahren ist gegenüber der Photolithographie bezüglich der Genauigkeit, d.h. des möglichst rechtwinkligen Profils der Strukturen, zu bevorzugen, es ist jedoch wegen der geringen Schreibgeschwindigkeit erheblich teurer.Prägeverfahren
Eine weitere Möglichkeit zur Herstellung der Kanalstrukturen stellt das Prägeverfahren dar. In diesem Fall wird der Lack bevorzugt thermisch oder photochemisch vorvernetzt, um ein Verkleben mit der Prägemaske zu vermeiden. Günstig ist eine thermische Vorbehandlung von wenigen Minuten bei etwa 80°C - 120°C. Höhere Temperaturen führen zu starker Vorvernetzung (wodurch das Eindringen der Prägemaske erschwert wird), während kürzere thermische Vorbehandlungen das Verkleben von Maske und Schicht nicht verhindert. Als Masken können z.B. strukturierte Glas- oder Si-Masken oder Nickelbleche mit Strukturhöhen im Bereich von 40µm verwendet werden. Prägemaschinen nach Art eines Mask-Aligners sind möglich. Vorzugsweise erfolgt gleichzeitig mit der Anpressung der Maske eine Belichtung oder thermische Behandlung bei Temperaturen bis 170°C. Anschließend wird wieder entspannt, die Maske abgezogen und die erhaltene Struktur thermisch nachgehärtet.Mit dem vorliegenden Verfahren lassen sich Tintendruckkopf-komponenten wie Kanalwände, Kanalabdeckungen, Düsenwände, Düsenabdeckungen, Passivierungsschichten, Düsenplatten, Tintenreservoire, Tintenfilter und dgl. erzeugen. Dafür werden die beschichteten Substrate unter Erzeugung der gewünschten Kanäle aufeinandergesetzt (Basis-Basis, Kopf-Kopf). Wenn als Substrat (Basis) identisches Material verwendet wird, läßt sich ein Tintendruckkopf aus einem einheitlichen Material erzeugen, ausgenommen die Aktoren zur Tropfenerzeugung (Heizelement, Piezoelement, elektrodynamischer Wandler etc.). Insbesondere die Erzeugung planarer Tintendruckköpfe ist erfindungsgemäß besonders günstig.

Nachstehend soll die Erfindung anhand von Ausführungsbeispielen näher erläutert werden.The lacquer is then subjected to structuring in order to produce channels or comparable structures. In principle, this can be done by any method, but the following are preferred:

1. Photolithography
In principle, photostructuring takes place with the aid of exposing the desired parts of the lacquer, the exposing being carried out with a flat light source. The parts of the varnish that are not to be exposed are protected from exposure by means of a mask. The mask can be arranged in front of the light source, for example. Alternatively, a mask aligner can be used, whereby under certain circumstances the lacquer can be mechanically embossed simultaneously using the mask. However, this is reserved for special cases, since contact exposure could often lead to mask and varnish sticking together. The exposure takes place at a wavelength that initiates the photochemical reactions in the coating. The GMP2T system is a composition of the polymer material that is suitable for photolithography. In particular, a varnish made of this material, which was essentially freed from volatile constituents (alcohols, water) that were formed during the implementation of the components and which was diluted to the desired solids content with propyl acetate, allows layer thicknesses of more than 10 μm and even in the range of ≤40 μm achieve. In addition to GMP2T, GMDT has proven to be particularly suitable, particularly with regard to its adhesive properties. GMP2D and especially GMD have a higher elasticity due to their high proportion of units that can only be crosslinked in two ways, which means that larger structural heights can be realized without cracks. The incorporation of fillers is possible. It should be noted that an increasing proportion of filler can reduce the adhesion to the substrate. After the desired parts of the lacquer have been exposed, the photochemically unreacted parts are treated with a solvent ("development"). Suitable solvents are polar substances such as aqueous alkali solutions, alcohol and the like, but also non-polar solvents such as toluene and the like, provided that they are able to dissolve the unpolymerized condensate out of the layer. Ethanol, isopropanol and acetone have proven to be particularly suitable for the GMP2T system, after which the structures obtained are thermally post-cured. This can be done, for example, in the hourly range at a temperature between 100 ° C and 170 ° C. Laser writing directly
The coating of the substrates, the development of the structures and the thermal post-curing takes place in direct laser writing as in photolithography. However, instead of a large-area light source, a narrowly focused laser beam is chosen for direct exposure of the lacquer. The laser beam is focused on the desired width, for example 3 to 50 µm and in particular 10 to 20 µm for the channel structures described. For example, writing takes place at a speed of 0.1 to 10 mm / sec. In particular, a speed of approximately 1 mm / sec. is preferred in order to achieve crack-free, uniform structures. Structural heights of up to 40 µm can also be achieved with laser direct writing. The above method is to be preferred over photolithography in terms of accuracy, ie the most rectangular profile of the structures, but it is considerably more expensive because of the slow writing speed
The embossing process is another possibility for producing the channel structures. In this case, the lacquer is preferably thermally or photochemically pre-crosslinked in order to avoid sticking to the embossing mask. A thermal pretreatment of a few minutes at around 80 ° C - 120 ° C is beneficial. Higher temperatures lead to strong pre-crosslinking (which makes it more difficult for the embossing mask to penetrate), while shorter thermal pre-treatments do not prevent the mask and layer from sticking together. Structured glass or Si masks or nickel sheets with structure heights in the range of 40 μm can be used as masks. Embossing machines in the manner of a mask aligner are possible. Exposure or thermal treatment at temperatures up to 170 ° C. is preferably carried out simultaneously with the pressing of the mask. Then the pressure is relaxed again, the mask is removed and the structure obtained is thermally hardened. Using the present method, ink printhead components such as channel walls, channel covers, nozzle walls, nozzle covers, passivation layers, nozzle plates, ink reservoirs, ink filters and the like can be produced. For this purpose, the coated substrates are placed on top of one another to create the desired channels (base-base, head-to-head). If identical material is used as the substrate (base), an ink print head can be produced from a uniform material, with the exception of the actuators for generating drops (heating element, piezo element, electrodynamic converter, etc.). In particular, the production of planar ink print heads is particularly favorable according to the invention.

The invention will be explained in more detail below on the basis of exemplary embodiments.

example 1 Production of a coating lacquer Output connections:

1. 0.4 mol g-glycidoxypropyltrimethoxysilane (= 38.6 mol%)

2. 0.4 mol g-methacryloxypropyltrimethoxysilane (= 38.6 mol%)

3. 0.2 mol diphenylsilanediol (= 18.9 mol%)

4. 0.04 mol tetraethoxysilane (= 3.9 mol%)

5. 2.37 mol water

The components 1. to 4. are submitted and at Room temperature stirred for 18 h. Then within The suspension was heated to about 70 ° C. for 90 minutes. after the Suspension has become clear, is 1/4 of the amount of water Maintenance of heating added. At intervals of approx. The remaining amount of water is added for 20 min 1/4). After all the water has been added, the mixture is stirred at 70 ° C. for 1 h continued stirring. Then the heater is removed, and after the paint is ready to use after cooling.

Example 2 Photolithographic creation of channel structures

The system GMPT2 is used for the generation of channel structures, which has very good adhesion to the various substrate materials, even after ink storage. In order to obtain large structural heights, the solvent is distilled off until a solids content of 75% is reached. 1.5% by mass of photoinitiator (Quantacure ITX, Shell Chemie) and 1.5% by mass of accelerator (N-methyldiethanolamine and diethylenetriamine, ratio 1: 1) are dissolved in the lacquer and this system is carried out on substrates (glass, Si) Spin-on application applied (600 rpm for 60 sec.). The photostructuring is carried out using a mask aligner (Karl-Süss MA 45) at a wavelength of 360 nm and an exposure intensity of 14 mW / cm ² . Exposure times of approximately 10 seconds have proven to be optimal under these conditions. The exposed structures are developed by spraying with ethanol (duration: 10 seconds). The structures obtained are cured at 120 ° C. for 10 h. These structures are characterized in FIGS. 2 to 4 (SEM and profilometer measurements). With the described method, crack-free structure heights of up to 30 µm can be achieved in one step. These structures have a high edge steepness, have good substrate adhesion and the required ink storage stability. For this reason and due to their temperature stability up to 270 ° C (thermogravimetric determination in air), they are very well suited for use as channel structures for inkjet printheads.

Example 3 Generation of channel structures with the help of laser direct writing

The coating of the substrates, the development of the structures as well as thermal post-curing for direct laser writing takes place as described in Example 2. As a material again the system GMPT2 chosen, the concentration on Photoinitiator is 0.05% by weight (Irgacure 184, company Ciba-Geigy or Quantacure ITX), the laser wavelength is included 360 nm, the laser power before focusing is 1.41 - 2.28 mW (variable; 1 mm beam diameter). The laser beam is focused on approx. 10 - 15µm. It is written with a Speed of 1 mm / sec. In Figures 5 and 6 is one such laser-written structuring and the associated Profilometer measurement shown. The thickening on the corners is on the persistence of the laser beam when changing direction attributed. The structure height is 20 µm.

Example 4 Embossing process

The GMP2T system is also used for embossing channel structures (see example 2). Application conditions (glass substrates) and curing (photochemical and thermal post-curing) are described in the example above. The embossing process requires thermal pretreatment of the applied coating. The most favorable pre-hardening conditions are thermal pre-treatments at approx. 80 ° C (5 min). Increasing the temperature leads to strong pre-crosslinking (bad penetration of the embossing mask as a result), while shorter thermal pre-treatment leads to the mask and layer sticking together. Structured glass or Si masks with structure heights of up to 40 µm are used as masks. After the pre-hardening of the layer, these masks are placed on it and pressed with a pressure of approx. 1 kg / cm ² , exposure being carried out (approx. 10 sec, 14 mW / cm ² at 360 nm). Then the pressure is released again, the mask is removed and the structure obtained is post-cured at 120 ° C. for 10 hours.

Claims (15)

Inkjet printhead, characterized in that it has one or more components made of a polymeric material which is produced from essentially or using at least one compound I. X _a R _b SiR ' _(4-ab) With

X

= hydrolyzable group

R

= optionally substituted alkyl, aryl, alkenyl, alkylaryl or arylalkyl,

R '

organic residue with at least one polymerizable group,

a

= 1 to 3

b

= 0 to 2.

Inkjet printhead according to claim 1, characterized in that the components are selected from channel structures, substrates, nozzle plates, nozzles, ink reservoirs and ink filters. Inkjet printhead according to claim 1 or 2, characterized in that a compound I with a group accessible to photopolymerization and a compound I with a thermally crosslinkable group or a compound I which contains both a group accessible to photopolymerization and a thermally crosslinkable group for the manufacture was used. Ink jet print head according to claim 1 or 2, characterized in that a compound I with an optionally substituted vinyloxyalkyl group and a compound I with an optionally substituted alkylene oxide oxyalkyl group were used for the preparation. The ink jet printhead of claim 4, wherein the polymeric Material is manufactured using Glycidoxypropyltrimethoxysilane, Methacryloxypropyltrimethoxysilane, diphenylsilanediol and Tetraethoxysilane. A method for producing an ink jet print head, characterized in that one or more components of the head are / are made from a polymeric material which is produced using at least one compound I X _a R _b SiR ' _(4-ab) With

X

= hydrolyzable group

R

= optionally substituted alkyl, aryl, alkenyl, alkylaryl or arylalkyl,

R '

organic residue with at least one polymerizable group,

a

= 1 to 3

b

= 0 to 2

or was generated from essentially at least one compound I. A method according to claim 6, characterized in that the component (s) are produced by the material in the form of a lacquer from the starting compound (s) precondensed by the addition of water, to which a photoinitator and possibly an accelerator is admixed, on substrates is applied, the lacquer is structured, if necessary after pretreatment, and the substrates are then optionally assembled, so that a three-dimensional structure is produced. A method according to claim 7, characterized in that the lacquer is brought to a solids content of at least 50% by weight before being applied to the substrates. Method according to one of claims 7 or 8, characterized in that the lacquer is applied to the substrates using the spin-on method. Method according to one of claims 7 to 9, characterized in that the structuring of the lacquer takes place with the aid of the following steps: Exposing the desired parts of the varnish, Washing out unexposed parts of the varnish with a solvent, thermal post-curing of the formed structures, whereby the polymeric material is formed. A method according to claim 10, characterized in that the exposure is carried out with a flat light source, the parts of the lacquer which are not to be exposed are protected from the radiation by means of a mask. A method according to claim 10, characterized in that the exposure is carried out by direct laser writing with a focused laser beam. Method according to one of claims 7 to 9, characterized in that the structuring of the lacquer takes place with the aid of the following steps: if necessary thermal or photochemical pretreatment, mechanical impression of the desired structures in the paint, Exposing at least the non-recessed parts of the varnish, thermal post-crosslinking of the structures formed. Use of a polymeric material which is produced essentially from or using at least one compound I. X _a R _b SiR ' _(4-ab) With

X

= hydrolyzable group

R

= optionally substituted alkyl, aryl, alkenyl, alkylaryl or arylalkyl,

R '

organic residue with at least one polymerizable group,

a

= 1 to 3

b

= 0 to 2

as a material for ink jet printheads or ink jet printhead components. Use according to claim 14, characterized in that the inkjet printhead components are selected from channel walls, channel covers, nozzle walls, nozzle covers, passivation layers, nozzle plates, ink reservoirs and ink filters.

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