[go: up one dir, main page]

EP3140853A4 - Pulsed-mode direct-write laser metallization - Google Patents

Pulsed-mode direct-write laser metallization Download PDF

Info

Publication number
EP3140853A4
EP3140853A4 EP15776752.6A EP15776752A EP3140853A4 EP 3140853 A4 EP3140853 A4 EP 3140853A4 EP 15776752 A EP15776752 A EP 15776752A EP 3140853 A4 EP3140853 A4 EP 3140853A4
Authority
EP
European Patent Office
Prior art keywords
pulsed
write laser
mode direct
laser metallization
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP15776752.6A
Other languages
German (de)
French (fr)
Other versions
EP3140853A1 (en
Inventor
Michael Zenou
Zvi Kotler
Jonathan ANKRI
Abraham ROTNEMER
Oleg ERMAK
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orbotech Ltd
Original Assignee
Orbotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd filed Critical Orbotech Ltd
Publication of EP3140853A1 publication Critical patent/EP3140853A1/en
Publication of EP3140853A4 publication Critical patent/EP3140853A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Powder Metallurgy (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
EP15776752.6A 2014-04-10 2015-04-05 Pulsed-mode direct-write laser metallization Pending EP3140853A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461977766P 2014-04-10 2014-04-10
PCT/IB2015/052476 WO2015155662A1 (en) 2014-04-10 2015-04-05 Pulsed-mode direct-write laser metallization

Publications (2)

Publication Number Publication Date
EP3140853A1 EP3140853A1 (en) 2017-03-15
EP3140853A4 true EP3140853A4 (en) 2018-01-17

Family

ID=54287371

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15776752.6A Pending EP3140853A4 (en) 2014-04-10 2015-04-05 Pulsed-mode direct-write laser metallization

Country Status (7)

Country Link
EP (1) EP3140853A4 (en)
JP (1) JP6635313B2 (en)
KR (1) KR102345450B1 (en)
CN (1) CN106133891B (en)
IL (1) IL247946B (en)
TW (1) TWI661752B (en)
WO (1) WO2015155662A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6600351B2 (en) 2014-08-07 2019-10-30 オルボテック リミテッド LIFT printing system
EP4380323A3 (en) 2014-10-19 2024-09-25 Orbotech Ltd. Lift printing of conductive traces onto a semiconductor substrate
CN107208256B (en) 2015-01-19 2020-08-11 奥博泰克有限公司 Printing of three-dimensional metal structures using sacrificial supports
WO2017006306A1 (en) 2015-07-09 2017-01-12 Orbotech Ltd Control of lift ejection angle
WO2017085712A1 (en) 2015-11-22 2017-05-26 Orbotech Ltd Control of surface properties of printed three-dimensional structures
TW201901887A (en) 2017-05-24 2019-01-01 以色列商奧寶科技股份有限公司 Electrical interconnection circuit components on the substrate without prior patterning
KR102040530B1 (en) * 2018-04-25 2019-11-05 성균관대학교산학협력단 Method of forming redistribution layer using photo―sintering
EP3566799B1 (en) * 2018-05-08 2023-09-27 Seco Tools Ab A method for manufacturing a sintered body
JP2021190594A (en) * 2020-06-01 2021-12-13 旭化成株式会社 Structure, metal wiring manufacturing method, and metal wiring manufacturing equipment
CN112201571A (en) * 2020-10-30 2021-01-08 英诺激光科技股份有限公司 Method and system for forming ohmic contacts on silicon carbide substrates

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070105395A1 (en) * 2005-11-04 2007-05-10 Edward Kinzel Laser functionalization and patterning of thick-film inks
US7294449B1 (en) * 2003-12-31 2007-11-13 Kovio, Inc. Radiation patternable functional materials, methods of their use, and structures formed therefrom
US20090274833A1 (en) * 2007-05-18 2009-11-05 Ishihara Chemical Co., Ltd. Metallic ink
EP2957155A1 (en) * 2013-02-18 2015-12-23 Orbotech Ltd. Two-step, direct- write laser metallization

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61290796A (en) * 1985-06-19 1986-12-20 沖電気工業株式会社 Manufacture of thick film hybrid integrated circuit board
JPS63209193A (en) * 1987-02-25 1988-08-30 松下電器産業株式会社 Conductor pattern formation method
JPH11307914A (en) * 1998-04-21 1999-11-05 Matsushita Electric Ind Co Ltd Pattern forming method for thick film wiring board
US6921626B2 (en) * 2003-03-27 2005-07-26 Kodak Polychrome Graphics Llc Nanopastes as patterning compositions for electronic parts
US7682970B2 (en) * 2003-07-16 2010-03-23 The Regents Of The University Of California Maskless nanofabrication of electronic components
JP2006038999A (en) * 2004-07-23 2006-02-09 Sumitomo Electric Ind Ltd Method for forming conductive circuit using laser irradiation and conductive circuit
TWI324423B (en) * 2005-11-01 2010-05-01 Cymer Inc Laser system
US10231344B2 (en) 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US20090120924A1 (en) * 2007-11-08 2009-05-14 Stephen Moffatt Pulse train annealing method and apparatus
US8476552B2 (en) * 2008-03-31 2013-07-02 Electro Scientific Industries, Inc. Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes
JP2009290112A (en) * 2008-05-30 2009-12-10 Fujifilm Corp Conductive inorganic film, method for manufacturing thereof, wiring board, and semiconductor device
US8422197B2 (en) * 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
KR101114256B1 (en) * 2010-07-14 2012-03-05 한국과학기술원 Method of fabricating pattern
TW201339279A (en) * 2011-11-24 2013-10-01 Showa Denko Kk Conductive-pattern formation method and composition for forming conductive pattern via light exposure or microwave heating

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7294449B1 (en) * 2003-12-31 2007-11-13 Kovio, Inc. Radiation patternable functional materials, methods of their use, and structures formed therefrom
US20070105395A1 (en) * 2005-11-04 2007-05-10 Edward Kinzel Laser functionalization and patterning of thick-film inks
US20090274833A1 (en) * 2007-05-18 2009-11-05 Ishihara Chemical Co., Ltd. Metallic ink
EP2957155A1 (en) * 2013-02-18 2015-12-23 Orbotech Ltd. Two-step, direct- write laser metallization

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *
See also references of WO2015155662A1 *

Also Published As

Publication number Publication date
JP2017513040A (en) 2017-05-25
IL247946B (en) 2022-08-01
EP3140853A1 (en) 2017-03-15
TW201543978A (en) 2015-11-16
TWI661752B (en) 2019-06-01
KR102345450B1 (en) 2021-12-29
WO2015155662A1 (en) 2015-10-15
JP6635313B2 (en) 2020-01-22
CN106133891B (en) 2020-03-03
CN106133891A (en) 2016-11-16
IL247946A0 (en) 2016-11-30
KR20160144985A (en) 2016-12-19

Similar Documents

Publication Publication Date Title
EP3208898A4 (en) Semiconductor laser oscillator
EP3134754A4 (en) Generating an agriculture prescription
EP3193600A4 (en) Smyd inhibitors
EP3232226A4 (en) Laser radar device
EP3249422A4 (en) Laser radar device
EP3116503A4 (en) Hptp-beta inhibitors
EP3099378A4 (en) Multiple beam laser treatment device
EP3131897B8 (en) Factor ixa inhibitors
EP3135426A4 (en) Laser machining device
EP3276759A4 (en) Semiconductor laser oscillator
EP3140853A4 (en) Pulsed-mode direct-write laser metallization
EP3156823A4 (en) Laser radar device
EP3211734A4 (en) Laser module
EP3120190A4 (en) Laser arrays
EP3196437A4 (en) Turbomachine
GB201418637D0 (en) Laser
EP3131896A4 (en) Factor ixa inhibitors
EP3170612A4 (en) Laser irradiation device
EP3238725A4 (en) Poultice
EP3108992A4 (en) Laser beam machine
EP3111932A4 (en) Ketoprofen-containing poultice
EP3165615A4 (en) Laser machining device
EP3232024A4 (en) Columnar-type hydraulic tappet
EP3171465A4 (en) Semiconductor laser device
EP3528352A4 (en) Laser device

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20160929

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20171219

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/4763 20060101ALI20171213BHEP

Ipc: H01L 21/477 20060101AFI20171213BHEP

Ipc: H05K 3/02 20060101ALI20171213BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20210119

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230527