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GB0422021D0 - Methods and apparatus for processing the backsides of wafers - Google Patents

Methods and apparatus for processing the backsides of wafers

Info

Publication number
GB0422021D0
GB0422021D0 GBGB0422021.6A GB0422021A GB0422021D0 GB 0422021 D0 GB0422021 D0 GB 0422021D0 GB 0422021 A GB0422021 A GB 0422021A GB 0422021 D0 GB0422021 D0 GB 0422021D0
Authority
GB
United Kingdom
Prior art keywords
backsides
wafers
methods
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0422021.6A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trikon Technologies Ltd
Original Assignee
Trikon Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Trikon Technologies Ltd filed Critical Trikon Technologies Ltd
Priority to GBGB0422021.6A priority Critical patent/GB0422021D0/en
Publication of GB0422021D0 publication Critical patent/GB0422021D0/en
Priority to GB0520100A priority patent/GB2419035A/en
Priority to US11/242,863 priority patent/US20060182618A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
GBGB0422021.6A 2004-10-05 2004-10-05 Methods and apparatus for processing the backsides of wafers Ceased GB0422021D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GBGB0422021.6A GB0422021D0 (en) 2004-10-05 2004-10-05 Methods and apparatus for processing the backsides of wafers
GB0520100A GB2419035A (en) 2004-10-05 2005-10-04 Methods and apparatus for processing the backsides of wafers
US11/242,863 US20060182618A1 (en) 2004-10-05 2005-10-05 Methods and apparatus for processing the backsides of wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0422021.6A GB0422021D0 (en) 2004-10-05 2004-10-05 Methods and apparatus for processing the backsides of wafers

Publications (1)

Publication Number Publication Date
GB0422021D0 true GB0422021D0 (en) 2004-11-03

Family

ID=33428050

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0422021.6A Ceased GB0422021D0 (en) 2004-10-05 2004-10-05 Methods and apparatus for processing the backsides of wafers
GB0520100A Withdrawn GB2419035A (en) 2004-10-05 2005-10-04 Methods and apparatus for processing the backsides of wafers

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB0520100A Withdrawn GB2419035A (en) 2004-10-05 2005-10-04 Methods and apparatus for processing the backsides of wafers

Country Status (1)

Country Link
GB (2) GB0422021D0 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008147379A1 (en) 2006-09-14 2008-12-04 Brooks Automation Inc. Carrier gas system and coupling substrate carrier to a loadport
US9105673B2 (en) 2007-05-09 2015-08-11 Brooks Automation, Inc. Side opening unified pod

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5299901A (en) * 1992-04-16 1994-04-05 Texas Instruments Incorporated Wafer transfer machine
US5858459A (en) * 1996-02-22 1999-01-12 Micron Technology, Inc. Cassette invertor apparatus and method
WO2003007350A2 (en) * 2001-07-12 2003-01-23 Speedline Manufacturing Company Wafer jar loader method, system and apparatus
TWI258831B (en) * 2001-12-31 2006-07-21 Applied Materials Inc Cassette and workpiece handler characterization tool

Also Published As

Publication number Publication date
GB2419035A (en) 2006-04-12
GB0520100D0 (en) 2005-11-09

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)