GB2134026A - A method of joining a component part to an integrated circuit - Google Patents
A method of joining a component part to an integrated circuit Download PDFInfo
- Publication number
- GB2134026A GB2134026A GB08401455A GB8401455A GB2134026A GB 2134026 A GB2134026 A GB 2134026A GB 08401455 A GB08401455 A GB 08401455A GB 8401455 A GB8401455 A GB 8401455A GB 2134026 A GB2134026 A GB 2134026A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- support layer
- component part
- vias
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000001465 metallisation Methods 0.000 claims abstract description 4
- 238000005476 soldering Methods 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 230000000284 resting effect Effects 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 230000004907 flux Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0182—Using a temporary spacer element or stand-off during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0568—Resist used for applying paste, ink or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A layer 7 of solder resistant material is applied to a substrate 1 with holes or vias 8 left for connection to the substrate metallization 2, the vias are then filled with solder paste and a component 5 to be mounted is arranged over the pattern of vias and supported by the solder resist layer, the thus formed assembly is then reflow soldered after which the support layer is dissolved; this method prevents residues from being trapped between the component and the substrate, provides better lateral alignment for the component over the substrate metallization pattern and improves vertical location of the component. <IMAGE>
Description
SPECIFICATION
A method of joining a component part to an integrated circuit
This invention relates to a method of joining a component part to the substrate in the assembly of a hybrid integrated circuit using a solder reflow process.
The component parts are generally unencapsulated and may consist of diffused or thin-film components and one or more monolithic circuits; all have terminals for electrical connection to a printed circuit of one form or another.
A known technique for attaching or joining such component parts to a hybrid circuit, which may be a thick film circuit, is illustrated by Figs. 1 (a) to 7(a) of the drawing and comprises the steps of: taking a ceramic or glass substrate 1,
ii. metallizing a pattern 2 of interconnections and passive components on the substrate 1,
iii. forming permanent pillars 3 on the substrate 1,
iv. applying flux containing solder paste 4 to the metallized connection points 2,
v. placing a component 5 in position and supported clear of the substrate 1 by the pillars 3,
vi. heating the thus formed assembly to above the melting point of the solder paste to reflow solder the component 5 to the metallized connection points 2, forming an electrically conducting solder joint, and
vii. thereafter solvent cleaning away flux residues 6, solder balls and other contaminents.
Such cleaning is necessary to obtain long term reliability for the assembly. Flux residues and solder balls are often trapped between the component and the substrate and the permanent pillars 3, which may be formed of an insulating curable resin or other plastics material, are used to raise the component a few thousandths of an inch clear of the substrate to allow the removal of residues between the component and the substrate.
This technique possesses some deficiencies:
i) flux residues are trapped between the pillars and the component,
ii) vertical and lateral location of the component with respect to the substrate is inconsistent, and
iii) inspection of the assembly is difficult due to the presence of the pillars.
It has also been proposed to use temporary removable standoffs during reflow soldering of flip chips in the assembly of a hybrid integrated circuit.
The object of the present invention is to overcome the above stated deficiencies.
According to the present invention, a method of joining a component part to a substrate in the assembly of a hybrid integrated circuit using a solder reflow process comprises the steps of:
(a) applying a support layer of a solder resistant material to the substrate, the support layer having an appropriate pattern of holes or vias to provide for electrical connection between any particular component part and a conductive metallization pattern on the substrate;
(b) filling the vias with solder paste;
(c) placing the component part in position over the pattern of vias and resting on the support layer;
(d) reflow soldering the thus formed assembly; and
(e) subsequently removing the support layer.
The vias thus serve to contain and, to some extent, mould the solder as it melts during reflow heating.
Advantageously, the support layer material is soluble in the same solvent that is employed to dissolve and remove residues left after the reflow soldering process has been completed.
The invention is illustrated by way of example by Figs. 1 (b) to 7(b) of the drawing.
As shown, a substrate 1 of glass, ceramic, porcelainised steel or the like has a thick film circuit 2 of metallized interconnections and, possibly, passive components formed thereon by known techniques; a conventional printed circuit board (minus fixing holes) could also be used. A solvent soluble, solder resistant, screen printable compound, for example thick film systems '1092
Maskant' (Trade Mark), is then screen printed to form a support layer 7 of controlled thickness. The support layer 7 has a pattern of appropriately dimensioned holes or vias 8 extending through the layer down to the metallized connection points 2.
The support layer 7 is then heat-cured. The vias 8 are then filled with solder paste 4 and a component 6 positioned over the vias. The thus formed assembly is then heated for reflow soldering and is thereafter cleaned in a solvent cleaner, e.g. Xylene, which removes both flux residues 6 and the support layer 7, leaving solder connections 9.
The advantages to be gained by the above method are that:
(i) solder is contained by the vias during the reflow soldering process and this improves lateral location of the chip device (see Fig. 6(b)),
(ii) the thickness of the support layer is controlled by an accurate printing process so that vertical location of the component is improved,
(iii) support removal during cleaning eliminates the possibility of residue remaining trapped, and
(iv) post assembly inspection is improved by the removal of supports after cleaning.
The method of this invention is applicable to components such as chip devices or surface mounted devices or any type of component device not having terminal wires for insertion through holes in a printed circuit board.
Claims (7)
1. A method of joining a component part to a substrate in the assembly of a hybrid integrated circuit using a solder reflow process comprising the steps of:
a) applying a support layer of a solder resistant material to the substrate, the support layer having an appropriate pattern of holes or vias to provide for electrical connection between any particular component part and a conductive metallization pattern on the substrate;
b) filling the vias with solder paste;
c) placing the component part in position over the pattern of vias and resting on the support layer;
d) reflow soldering the thus formed assembly; and
e) subsequently removing the support layer.
2. A method as claimed in claim 1 wherein the support layer is soluble in the same solvent used to dissolve and remove reflow soldering residues.
3. A method as claimed in claim 1 or claim 2, wherein the support layer is screen printed onto the substrate.
4. A method as claimed in any of claims 1 to 3 wherein the substrate is made of glass, ceramic or porcelainised steel.
5. A method as claimed in any of claims 1 to 3, wherein the substrate is a printed circuit board without fixing holes.
6. A method as claimed in any of claims 1 to 5, wherein the component part is a chip device or a surface mounted device.
7. A method of joining a component part to a substrate substantially as described with reference to Figs. 1 (b) to 7(b) of the drawing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08401455A GB2134026B (en) | 1983-01-27 | 1984-01-19 | A method of joining a component part to an integrated circuit |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB838302310A GB8302310D0 (en) | 1983-01-27 | 1983-01-27 | Joining component to integrated circuit |
| GB08401455A GB2134026B (en) | 1983-01-27 | 1984-01-19 | A method of joining a component part to an integrated circuit |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8401455D0 GB8401455D0 (en) | 1984-02-22 |
| GB2134026A true GB2134026A (en) | 1984-08-08 |
| GB2134026B GB2134026B (en) | 1985-11-20 |
Family
ID=26285043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08401455A Expired GB2134026B (en) | 1983-01-27 | 1984-01-19 | A method of joining a component part to an integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2134026B (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0274915A1 (en) * | 1987-01-12 | 1988-07-20 | Ford Motor Company Limited | A dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors |
| EP0206619A3 (en) * | 1985-06-20 | 1988-10-26 | Metcal Inc. | Self-soldering, flexible circuit connector |
| EP0307766A1 (en) * | 1987-09-09 | 1989-03-22 | Siemens Aktiengesellschaft | Circuit board to be imprinted with SMD components |
| US5045666A (en) * | 1985-06-20 | 1991-09-03 | Metcal, Inc. | Self-soldering flexible circuit connector |
| US5144472A (en) * | 1990-05-17 | 1992-09-01 | Xerox Corporation | Electrical contacts for an electro-optic modulator |
| US5175409A (en) * | 1985-06-20 | 1992-12-29 | Metcal, Inc. | Self-soldering flexible circuit connector |
| DE4137045A1 (en) * | 1991-11-11 | 1993-05-13 | Siemens Ag | METHOD FOR PRODUCING SOLDER AREAS ON A CIRCUIT BOARD AND SOLDER PASTE FILM FOR CARRYING OUT THE METHOD |
| US5252180A (en) * | 1990-05-17 | 1993-10-12 | Xerox Corporation | Electrical contacts for an electro-optic modulator |
| EP0631461A1 (en) * | 1993-06-24 | 1994-12-28 | Kabushiki Kaisha Toshiba | Electronic circuit device |
| US5684677A (en) * | 1993-06-24 | 1997-11-04 | Kabushiki Kaisha Toshiba | Electronic circuit device |
| GB2324753A (en) * | 1997-05-02 | 1998-11-04 | Nec Corp | Manufacturing printed circuit and printed wiring boards |
| EP1199588A4 (en) * | 1999-05-28 | 2003-05-07 | Toppan Printing Co Ltd | OPTO-ELECTRONIC SUBSTRATE, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING AN OPTO-ELECTRONIC SUBSTRATE |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB851476A (en) * | 1956-04-13 | 1960-10-19 | Emi Ltd | Improvements in or relating to the soldering of conductors supported on panels |
-
1984
- 1984-01-19 GB GB08401455A patent/GB2134026B/en not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB851476A (en) * | 1956-04-13 | 1960-10-19 | Emi Ltd | Improvements in or relating to the soldering of conductors supported on panels |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5175409A (en) * | 1985-06-20 | 1992-12-29 | Metcal, Inc. | Self-soldering flexible circuit connector |
| EP0206619A3 (en) * | 1985-06-20 | 1988-10-26 | Metcal Inc. | Self-soldering, flexible circuit connector |
| US4788404A (en) * | 1985-06-20 | 1988-11-29 | Metcal, Inc. | Self-soldering flexible circuit connector |
| US5045666A (en) * | 1985-06-20 | 1991-09-03 | Metcal, Inc. | Self-soldering flexible circuit connector |
| EP0274915A1 (en) * | 1987-01-12 | 1988-07-20 | Ford Motor Company Limited | A dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors |
| EP0307766A1 (en) * | 1987-09-09 | 1989-03-22 | Siemens Aktiengesellschaft | Circuit board to be imprinted with SMD components |
| US5144472A (en) * | 1990-05-17 | 1992-09-01 | Xerox Corporation | Electrical contacts for an electro-optic modulator |
| US5252180A (en) * | 1990-05-17 | 1993-10-12 | Xerox Corporation | Electrical contacts for an electro-optic modulator |
| DE4137045A1 (en) * | 1991-11-11 | 1993-05-13 | Siemens Ag | METHOD FOR PRODUCING SOLDER AREAS ON A CIRCUIT BOARD AND SOLDER PASTE FILM FOR CARRYING OUT THE METHOD |
| EP0631461A1 (en) * | 1993-06-24 | 1994-12-28 | Kabushiki Kaisha Toshiba | Electronic circuit device |
| US5684677A (en) * | 1993-06-24 | 1997-11-04 | Kabushiki Kaisha Toshiba | Electronic circuit device |
| GB2324753A (en) * | 1997-05-02 | 1998-11-04 | Nec Corp | Manufacturing printed circuit and printed wiring boards |
| GB2324753B (en) * | 1997-05-02 | 1999-09-01 | Nec Corp | Printed circuit and printed wiring boards and methods of manufacture |
| EP1199588A4 (en) * | 1999-05-28 | 2003-05-07 | Toppan Printing Co Ltd | OPTO-ELECTRONIC SUBSTRATE, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING AN OPTO-ELECTRONIC SUBSTRATE |
| US6739761B2 (en) | 1999-05-28 | 2004-05-25 | Toppan Printing Co., Ltd. | Optical-electric printed wiring board, printed circuit board, and method of fabricating optical-electric printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8401455D0 (en) | 1984-02-22 |
| GB2134026B (en) | 1985-11-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |