GB2557616A - Closed loop coolant control - Google Patents
Closed loop coolant control Download PDFInfo
- Publication number
- GB2557616A GB2557616A GB1621085.8A GB201621085A GB2557616A GB 2557616 A GB2557616 A GB 2557616A GB 201621085 A GB201621085 A GB 201621085A GB 2557616 A GB2557616 A GB 2557616A
- Authority
- GB
- United Kingdom
- Prior art keywords
- stage
- coolant
- heat exchanger
- cooling
- cooling stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002826 coolant Substances 0.000 title claims abstract description 109
- 238000001816 cooling Methods 0.000 claims abstract description 95
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000012546 transfer Methods 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 description 11
- 238000013459 approach Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
System and method for cooling an electronic device which comprises a first cooling stage 10 for transferring heat from said device to a first heat exchanger 15. A second cooling stage 20 provides a coolant 25 to the first heat exchanger 15 and carries the coolant 25 to a second heat exchanger 21. A third cooling stage 30 provides water to the second heat exchanger 21 and carries the heated water away from the second heat exchanger 21. The third cooling stage 30 comprises a thermostatic controlled valve 35 to control the provision of water to the second heat exchanger 21. The thermostatic controlled valve 35 is controlled according to a temperature of the coolant 25. The second cooling stage 20 may comprise a tank 23 for holding the coolant 25 and a thermostat 36, wherein a thermostat pipe 33 couples the thermostat 36 to the thermostatic controlled valve 35.
Description
(54) Title of the Invention: Closed loop coolant control Abstract Title: CLOSED LOOP COOLANT CONTROL (57) System and method for cooling an electronic device which comprises a first cooling stage 10 for transferring heat from said device to a first heat exchanger 15. A second cooling stage 20 provides a coolant 25 to the first heat exchanger 15 and carries the coolant 25 to a second heat exchanger 21. A third cooling stage 30 provides water to the second heat exchanger 21 and carries the heated water away from the second heat exchanger 21. The third cooling stage 30 comprises a thermostatic controlled valve 35 to control the provision of water to the second heat exchanger 21. The thermostatic controlled valve 35 is controlled according to a temperature of the coolant 25. The second cooling stage 20 may comprise a tank 23 for holding the coolant 25 and a thermostat 36, wherein a thermostat pipe 33 couples the thermostat 36 to the thermostatic controlled valve 35.
/ 25 \ f 33
4_p._____ [/ \T Z.....7 ' / /
I .> ?
Figure 1 y
ο
Figure 1
- 1 Closed Loop Coolant Control
Technical Field of the Invention
The invention relates to a system for cooling an electronic device and a corresponding method.
Background to the Invention
Electronic devices generate heat in operation, which can lead to overheating and consequent damage to the device and other parts of the system. Such electronic devices often include motherboards, central processing units (CPUs) and memory modules. It is therefore desirable to cool the device by transferring the heat away from it and to maintain the device temperature no higher than the maximum operating temperature that is specified for its correct and reliable operation.
International patent publication number WO-2010/130993 and US patent publication number 2010/0290190 (commonly assigned with this invention) describe cooling systems based on multiple stages of liquid coolant. In a first cooling stage, a sealable module contains one or more heat generating electronic components, together with a liquid coolant in which the electronic components are immersed. The first stage coolant is desirably contained and typically sealed within a container (a tank or case). This is done so that the electronic components are immersed in the coolant, but without the coolant being lost or otherwise exposed outside the tank. Part of the outer housing of the sealable module forms a heat exchanger, which transfers heat from the first stage coolant to a second stage coolant. Both the first stage coolant and the second stage coolant are desirably maintained as liquids and the flow rate of the second stage coolant may be controlled in order to achieve this. Typically, the second stage coolant is water. In some embodiments, a second heat exchanger is also provided to transfer heat from the second stage coolant to a third stage coolant, which may be a gas such as air or a further liquid coolant.
Systems based on this approach have been implemented by Iceotope Limited and sold under the brand name PetaGen (RTM). In practice, a third cooling stage is provided using water from a main water supply provided to a heat rejection unit. This creates a closed loop third cooling stage, with no water wastage. It is also scalable, such that systems with more high capacity (for example using multiple first stage modules) can be cooled using a heat rejection unit of larger size. The water of the third cooling stage is
- 2 normally at a higher pressure than the water of the second cooling stage. This approach is therefore efficient and not damaging to the environment, as no water is wasted.
However, heat rejection units are not always a practical approach. In general, a heat rejection unit is mounted outside a building, to cool to the atmosphere. This may not always be possible or practical, for example where the first stage module is far away from any external wall of the building. Heat rejection units can be relatively noisy, which can be undesirable. Therefore, an alternative way to provide third stage cooling is desirable, especially whilst maintaining efficiency and without causing environmental damage.
Summary of the Invention
Against this background, the invention provides a system for cooling an electronic device in accordance with claim 1 and a method of cooling an electronic device in line with claim 14. Further features of the invention are detailed in the dependent claims and herein. Features of the method corresponding with those of the system may additionally be provided.
Heat is received from the electronic device in a first cooling stage. A first heat exchanger transfers heat from the first cooling stage to a coolant (typically a liquid) in a second cooling stage. A second heat exchanger (for example, a plate heat exchanger) transfers heat from the second stage coolant to a third stage coolant. The third stage coolant is water from a main water supply and its flow is controlled by a thermostatic controlled valve, which is controlled by a temperature of the second stage coolant. The third stage coolant may be output to a drainage part of the main water supply and/or to a central heating system.
The use of a thermostatic controlled valve allows flowing water from a main (or mains) water supply to be used as a third stage coolant whilst mitigating and/or minimising wastage. The system can be installed with any main water supply feed. The water is only used as a third stage coolant when necessitated by the second stage coolant temperature. This is therefore an efficient alternative approach to a heat rejection unit for providing third stage cooling. It is especially well-suited for systems with low cooling requirements. Under normal use, this system is quieter than a heat rejection unit. Moreover, its infrastructure requirements are minimal: only a main water supply inlet and a suitable outlet are used.
Preferably, a tank is provided in the second cooling stage and in particular, the thermostatic controlled valve is controlled by the tank temperature. In the preferred embodiment, the second stage coolant flows from the tank to the first heat exchanger, from the first heat exchanger to the second heat exchanger and from the second heat
-3exchanger to the tank. The tank is normally higher than the first heat exchanger (and the second heat exchanger). A pump may be provided to cause the second stage coolant to flow and the pump may be located on a fluid path between the second heat exchanger and the tank.
Optionally, the first cooling stage comprises a module, configured to hold the electronic device. The module may have a sealable (or sealed) volume, in which the electronic device is housed together with a first stage coolant. The first heat exchanger is then beneficially configured to transfer heat from the first stage coolant to the second stage coolant. Optionally, multiple first cooling stage modules are provided, each module being arranged to cool a respective electronic device. The first cooling stage modules may be coupled to the same second cooling stage in series, parallel or some combination of the two. The invention may be particularly suited to systems with no more than 25, 20, 15, 14, 13, 12, 11, 10, 9, 8, 7, 6 5, 4, 3, 2 or 1 first cooling stage module or modules (an office environment, rather than a data centre implementation).
In some embodiments, the thermostatic controlled valve is controlled to maintain the temperature of the second stage coolant to within a predetermined range of temperatures. Additionally or alternatively, the thermostatic controlled valve may be controlled to maintain a difference between the temperature of the second stage coolant and a temperature of the third stage coolant to within a defined range.
Brief Description of the Drawing
The invention may be put into practice in a number of ways and a preferred embodiment will now be described by way of example only and with reference to the accompanying drawing, in which:
Figure 1 shows a schematic diagram of an embodiment in accordance with the disclosure.
Detailed Description of Preferred Embodiments
Referring first to Figure 1, there is shown a schematic diagram of an embodiment of a three stage cooling system. The cooling system comprises: a first cooling stage 10; a second cooling stage 20; and a third cooling stage 30.
The first cooling stage 10 is a module (commonly referred to as a ‘blade’), containing the electronic device being cooled (not shown) immersed in a first stage coolant.
This is typically a liquid and the electronic device and coolant are sealed inside the module.
Further details of an exemplary first cooling stage module in accordance with this design
-4may be found in International patent publication number WO-2010/130993 and US patent publication number 2010/0290190. More than one first cooling stage module 10 may be provided, although only one is shown in Figure 1. The first cooling stage module or modules 10 are normally housed in a cabinet or rack (not shown).
Immersion of the electronic device in a fluid (liquid and/or gas) that carries heat away from the electronic device can be thermodynamically-efficient. The first stage coolant may be thermally conductive whilst being electrically non-conductive and may further have advantageous convective properties. Moreover, the first stage coolant can be selected and used so as not to cause damage to the electronic device in normal operation.
Nevertheless, the first stage coolant could cause damage elsewhere, for example due to toxicity, corrosion or other reactive, physical or chemical properties. For this reason, the volume in which the electronic device and first stage coolant are contained is preferably sealed and it is unnecessary to remove the electronic device from the first stage coolant or pipe the first stage coolant away from the sealed module.
Heat is transferred from the first cooling stage 10 to the second cooling stage 20 by means of a first heat exchanger 15. This is advantageously an integral part of the first cooling stage module 10. The first heat exchanger 15 receives the second stage coolant and heat is transferred from the first stage coolant to the second stage coolant using the first heat exchanger 15. Normally, the second stage coolant 25 is water. The second stage coolant 25 is provided to the first heat exchanger 15 from a second stage coolant tank 23. The tank 23 is sometimes referred to as a top tank. This is because the tank 23 may sit at the top of the cabinet or rack in which the first stage cooling module or modules 10 is housed. In any case, the tank 23 may be located above the first stage cooling module 10. A pump 22 is therefore provided to cause the second stage coolant 25 to flow to the tank 23. Any type of pump is suitable for this purpose.
The second stage coolant is also provided to a second heat exchanger 21, which is a liquid-to-liquid plate heat exchanger. The second heat exchanger 21 further receives a third stage coolant from the third cooling stage 30. The third stage coolant is water provided from a main (or mains) water supply. This is normally cold water. The water is received from an input 31. The third stage coolant water heated by the second heat exchanger 21 is then provided to an output 32. This is typically provided to a main water supply drainage or sewerage. Alternatively, the heated (warm) third stage coolant can be recaptured. An example of this would be by providing to a central heating system, such as a radiator. Normally, the quantity of water being provided to the output 32 will be small.
-5A thermostatic controlled valve 35 is also provided in the third cooling stage 30, controlling the flow of water from the input 31 to the second heat exchanger 21. The valve is coupled to a thermostat 36 using a thermostat pipe 33 (a gas-filled tube that controls the valve). The thermostat 36 is positioned (submerged) in the tank 23 of the second cooling stage, such that the thermostatic controlled valve 35 is controlled based on the temperature of the second stage coolant 25 in the tank 23. The specific thermostatic controlled valve 35 being used in current implementations is sold by Danfoss under the part number and name: 003N3162 AVTA 20 Water regulator valve 25-65°C M/10.
The valve 35 is normally in a closed position. When the second stage coolant 25 in the tank 23 begins to rise in temperature above a threshold level, the thermostatic controlled valve 35 opens. This allows the required quantity of cold main-supplied water from input 31, through the second heat exchanger 21. The cold main-supplied water cools the second stage coolant 25 via the second heat exchanger 21. As the second stage coolant 25 returns to a desired temperature (which may be the threshold temperature or another temperature), the thermostatic controlled valve 35 begins to close. This controls the temperature of the second stage coolant 25. In typical operation, it is aimed to cool the second stage coolant 25 by 5C over the second heat exchanger 21. In particular, it is envisaged that the second stage coolant 25 will be cooled from approximately 60C or 55C to approximately 55C or 50C over the second heat exchanger 21.
The valve 35 is relatively quiet in operation. Noise is only generated when the valve 35 opens and water runs through the second heat exchanger 21. This is fairly infrequent and the noise generated is low.
In general terms, there may be considered a system for cooling an electronic device, comprising: a first cooling stage, configured to receive heat from the electronic device and transfer the heat to a first heat exchanger; a second cooling stage, configured to provide a second stage (liquid) coolant to the first heat exchanger for receiving heat from the first cooling stage, the second cooling stage being further configured to carry the second stage coolant to a second heat exchanger; and a third cooling stage, configured to be coupled to a main water supply and provide water from the main water supply to the second heat exchanger for receiving heat from the second cooling stage. The third cooling stage is advantageously further configured to carry the heated water away from the second heat exchanger. Beneficially, the third cooling stage comprises a thermostatic controlled valve, arranged to control the provision of water to the second heat exchanger. The thermostatic controlled valve is advantageously controlled in accordance with a temperature of the second stage coolant.
-6A method of cooling an electronic device, comprising operating the system as herein described is also provided. Such a method may have respective steps corresponding with each of any one or more structural features described herein, the steps defining the operation of the feature. A method of providing a system for cooling an electronic device, comprising providing any system as herein described is further considered. Optional features and implementation details of the system are now discussed in general terms and it will be understood that method steps corresponding with any of these can also be provided.
Optionally, multiple first cooling stage modules are provided, each module being arranged to cool a respective electronic device. The first cooling stage modules may be coupled to the same second cooling stage in series, parallel or some combination of the two. The invention may be particularly suited to systems with no more than 25, 20, 15, 14, 13, 12, 11, 10, 9, 8, 7, 6 5, 4, 3, 2 or 1 first cooling stage module or modules (each first cooling stage module consuming between 600W and 1.4kW of electrical power).
Preferably, the thermostatic controlled valve comprises a thermostat arranged to measure the temperature of the second stage coolant at a location in the second cooling stage. For example, the thermostatic controlled valve may further comprise: a valve; and a thermostat pipe coupling the thermostat to the valve. Then, a thermostat pipe may be configured to control the valve in accordance with the thermostat.
In the preferred embodiment, the second cooling stage further comprises a tank for holding some of the second stage coolant. Then, the thermostatic controlled valve may be controlled in accordance with a temperature of the second stage coolant in the tank. In other words, the thermostat may be positioned or arranged in the tank (immersed in the second stage coolant). The tank is preferably configured to provide the second stage coolant to the first heat exchanger (without flowing through the second heat exchanger). Preferably additionally (but optionally alternatively), the second cooling stage may be arranged such that the second stage coolant flows from the second heat exchanger to the tank without flowing through the first heat exchanger. The tank is beneficially arranged in a location higher than the first cooling stage (which may comprise one or more modules, for example). Then, the second cooling stage may further comprise a pump, arranged to cause the second stage coolant to flow from the first heat exchanger to the tank.
Optionally, the pump is arranged on a fluid path between the second heat exchanger and the tank.
In preferred implementations, the first cooling stage comprises a module configured to hold the electronic device. The module may further comprise a sealable (or sealed)
-7volume in which the electronic device is housed together with a first stage coolant. The first stage coolant is preferably a liquid. The first heat exchanger is advantageously configured to transfer heat from the first stage coolant to the second stage coolant. It may also be understood that, in embodiments, the second heat exchanger is configured to transfer heat from the second stage coolant to the water of the third cooling stage. Preferably, the second heat exchanger is a plate heat exchanger. The third cooling stage is preferably configured to output the heated water to a drainage part of the main water supply and/or to a central heating system.
The thermostatic controlled valve is desirably controlled to maintain the temperature of the second stage coolant to within a predetermined range of temperatures. For instance, the thermostatic controlled valve may be configured to open when the temperature of the second stage coolant is at least (or greater than) a first threshold value. The first threshold value may be 45C, 50C, 55C or 60C. Additionally or alternatively, the thermostatic controlled valve may be configured to close when the temperature of the second stage coolant is no more (or less) than a second threshold value. The second threshold value is usually different from the first threshold value. For example, the second threshold value may be 50C, 55C, 60C or 65C. Then, the predetermined range of temperatures may be 45C to 65C, more preferably 50C to 60C and most preferably 55C to 60C. In some implementations, the thermostatic controlled valve is controlled to maintain a difference between the temperature of the second stage coolant and a temperature of the third stage coolant to within a predefined range. The predefined range may be less than (or no more than) 10C, 8C, 7C, 6C, 5C, 4C or 3C.
Although specific embodiments have now been described, the skilled person will appreciate that various modifications and alternations are possible. The first cooling stage 10 need not be as described and the skilled person will understand that other arrangements of a first cooling stage are possible. It will further be recognised that the second stage coolant 25 need not be water and other fluid coolants are possible, preferably a liquid. The design and type of the first heat exchanger 15 and/or the second heat exchanger 21 may be varied. The first heat exchanger 15 need not be an integral part of the first cooling stage module 10 and it can be provided separately from the module. One first heat exchanger 15 may be provided for each module or a single first heat exchanger 15 might be used for multiple modules in some implementations.
The layout and/or configuration of the second cooling stage 20 may also be changed, for example placing the first heat exchanger 15, second heat exchanger 21, pump 22 and tank 23 in a different order. It will further be understood that pump 22 and/or
-8tank 23 are optional and the system can be implemented in some configurations without one or both of these. For example, convection currents may be used to cause the second stage coolant 25 to flow. The thermostat 36 need not be provided in a tank, but rather in a pipe. The use of tank is advantageous for providing second stage coolant to 25 the first heat exchanger 15 at an appropriate pressure and for obtaining a stable temperature measurement, however.
Different types of thermostatic controlled valve may be used. Software control of the valve may further be considered.
All of the features disclosed herein may be combined in any combination, except 10 combinations where at least some of such features and/or steps are mutually exclusive. In particular, the preferred features of the invention are applicable to all aspects of the invention and may be used in any combination. Likewise, features described in nonessential combinations may be used separately (not in combination).
Claims (14)
1. A system for cooling an electronic device, comprising:
a first cooling stage, configured to receive heat from the electronic device and transfer the heat to a first heat exchanger;
a second cooling stage, configured to provide a second stage coolant to the first heat exchanger for receiving heat from the first cooling stage, the second cooling stage being further configured to carry the second stage coolant to a second heat exchanger; and a third cooling stage, configured to be coupled to a main water supply and provide water from the main water supply to the second heat exchanger for receiving heat from the second cooling stage, the third cooling stage being further configured to carry the heated water away from the second heat exchanger;
wherein the third cooling stage comprises a thermostatic controlled valve, arranged to control the provision of water to the second heat exchanger, the thermostatic controlled valve being controlled in accordance with a temperature of the second stage coolant.
2. The system of claim 1, wherein the thermostatic controlled valve comprises a thermostat arranged to measure the temperature of the second stage coolant at a location in the second cooling stage.
3. The system of claim 1 or claim 2, wherein the second cooling stage further comprises a tank for holding some of the second stage coolant, the thermostatic controlled valve being controlled in accordance with a temperature of the second stage coolant in the tank.
4. The system of claim 3, wherein the tank is configured to provide the second stage coolant to the first heat exchanger.
5. The system of claim 3 or claim 4, wherein the second cooling stage is arranged such that the second stage coolant flows from the second heat exchanger to the tank without flowing through the first heat exchanger.
6. The system of any one of claims 3 to 5, wherein the tank is arranged in a location higher than the first cooling stage, the second cooling stage further comprising a pump,
- 10arranged to cause the second stage coolant to flow from the first heat exchanger to the tank.
7. The system of claim 6, wherein the pump is arranged on a fluid path between the second heat exchanger and the tank.
8. The system of any preceding claim, wherein the first cooling stage comprises a module, configured to hold the electronic device.
9. The system of claim 8, wherein the module further comprises a sealable volume in which the electronic device is housed together with a first stage coolant, the first heat exchanger being configured to transfer heat from the first stage coolant to the second stage coolant.
10. The system of any preceding claim, wherein the second heat exchanger is a plate heat exchanger.
11. The system of any preceding claim, wherein the thermostatic controlled valve is controlled to maintain the temperature of the second stage coolant to within a predetermined range of temperatures.
12. The system of any preceding claim, wherein the thermostatic controlled valve is controlled to maintain a difference between the temperature of the second stage coolant and a temperature of the third stage coolant to within a predefined range
13. The system of any preceding claim, wherein the third cooling stage is configured to output the heated water to a drainage part of the main water supply and/or to a central heating system.
14. A method of cooling an electronic device, comprising operating the system of any preceding claim.
Intellectual
Property
Office
Application No: GB1621085.8
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1621085.8A GB2557616A (en) | 2016-12-12 | 2016-12-12 | Closed loop coolant control |
| PCT/GB2017/053651 WO2018109439A1 (en) | 2016-12-12 | 2017-12-04 | Closed Loop Coolant Control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1621085.8A GB2557616A (en) | 2016-12-12 | 2016-12-12 | Closed loop coolant control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB201621085D0 GB201621085D0 (en) | 2017-01-25 |
| GB2557616A true GB2557616A (en) | 2018-06-27 |
Family
ID=58222238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1621085.8A Withdrawn GB2557616A (en) | 2016-12-12 | 2016-12-12 | Closed loop coolant control |
Country Status (2)
| Country | Link |
|---|---|
| GB (1) | GB2557616A (en) |
| WO (1) | WO2018109439A1 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050122685A1 (en) * | 2003-12-03 | 2005-06-09 | International Business Machines Corporation | Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems |
| EP2584880A2 (en) * | 2011-10-18 | 2013-04-24 | Hitachi Plant Technologies, Ltd. | Cooling system and method for controlling cooling system |
| US20130104383A1 (en) * | 2011-10-31 | 2013-05-02 | International Business Machines Corporation | Multi-rack assembly method with shared cooling unit |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7883266B2 (en) * | 2008-03-24 | 2011-02-08 | International Business Machines Corporation | Method and apparatus for defect detection in a cold plate |
| GB2467805C (en) * | 2009-05-12 | 2011-06-01 | Iceotope Ltd | Cooled electronic system |
| US8369090B2 (en) * | 2009-05-12 | 2013-02-05 | Iceotope Limited | Cooled electronic system |
-
2016
- 2016-12-12 GB GB1621085.8A patent/GB2557616A/en not_active Withdrawn
-
2017
- 2017-12-04 WO PCT/GB2017/053651 patent/WO2018109439A1/en not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050122685A1 (en) * | 2003-12-03 | 2005-06-09 | International Business Machines Corporation | Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems |
| EP2584880A2 (en) * | 2011-10-18 | 2013-04-24 | Hitachi Plant Technologies, Ltd. | Cooling system and method for controlling cooling system |
| US20130104383A1 (en) * | 2011-10-31 | 2013-05-02 | International Business Machines Corporation | Multi-rack assembly method with shared cooling unit |
Also Published As
| Publication number | Publication date |
|---|---|
| GB201621085D0 (en) | 2017-01-25 |
| WO2018109439A1 (en) | 2018-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11997827B2 (en) | Immersion cooling system that enables increased heat flux at heat-generating components of computing devices | |
| JP6604999B2 (en) | Electronic system cooled | |
| KR102299767B1 (en) | Integrated cooling system for electronics testing apparatus | |
| US9045995B2 (en) | Electronics rack with liquid-coolant-driven, electricity-generating system | |
| US9167721B2 (en) | Direct facility coolant cooling of a rack-mounted heat exchanger | |
| US9161480B2 (en) | Vacuum pumped liquid cooling system for computers | |
| US7864527B1 (en) | Systems and methods for close coupled cooling | |
| JP2019500759A (en) | Fluid cooling system and method for electronic devices | |
| EP3596417A1 (en) | Cooling systems and methods | |
| US20180059746A1 (en) | Phase change cooling device and phase change cooling method | |
| TW201703625A (en) | Coolant distribution unit | |
| CN107396599A (en) | A kind of heat abstractor and thermal management algorithm of movable cabinet level server system | |
| CN207040117U (en) | A cooling device for a mobile rack-level server system | |
| EP3658836A1 (en) | Systems and methods for heat exchange | |
| US20140124497A1 (en) | Tank Container | |
| GB2557616A (en) | Closed loop coolant control | |
| RU2643173C1 (en) | Immersion cooling system for electronic devices | |
| CN110993539B (en) | Temperature control device and semiconductor processing equipment | |
| US20220316764A1 (en) | Systems and methods for heat exchange | |
| US11991866B2 (en) | Adaptive cascade cooling method for datacenters | |
| US20220015259A1 (en) | Method, apparatus, and computer program product for multiphase cooling of a mobile electronic device | |
| US11662126B2 (en) | Leak mitigation system | |
| US20220418146A1 (en) | Disaggregated system architecture for immersion cooling | |
| US20240172392A1 (en) | System for harnessing heat generated by intensive processes | |
| JP4046060B2 (en) | Cryogenic cooling system for cryogenic cables |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |