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HK1103825A - Structure comprising an electronic device particularly for the production of a security or value document - Google Patents

Structure comprising an electronic device particularly for the production of a security or value document Download PDF

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Publication number
HK1103825A
HK1103825A HK07107957.9A HK07107957A HK1103825A HK 1103825 A HK1103825 A HK 1103825A HK 07107957 A HK07107957 A HK 07107957A HK 1103825 A HK1103825 A HK 1103825A
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HK
Hong Kong
Prior art keywords
layer
document
inset
adhesive
electronic device
Prior art date
Application number
HK07107957.9A
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German (de)
French (fr)
Chinese (zh)
Other versions
HK1103825B (en
Inventor
Sandrine Rancien
Frédéric VICENTINI
Original Assignee
Hid Global Cid Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hid Global Cid Sas filed Critical Hid Global Cid Sas
Publication of HK1103825A publication Critical patent/HK1103825A/en
Publication of HK1103825B publication Critical patent/HK1103825B/en

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Description

The present invention relates to a structure comprising an electronic device, for example RFID (Radio Frequency Identification Device), in particular for the manufacture of a security document or of value or for the securing of an article. The electronic device may allow the exchange of data without contact.
通过安全化一项文章,人们理解的是给一项文章配备例如防盗或身份识别或跟踪电子设备。
GB 2 279 907 describes a chip card realized by assembling layers with a central structure bearing an electronic device, which comprises an integrated circuit and a coil connected to the circuit. To realize this central structure, the electronic device is taken in sandwich between two polyester layers, each covered with a thermally activable adhesive. This central structure is itself taken in sandwich between two lower and upper layers in PVC. The assembly of the constitutive layers of the central structure with the electronic device as well as that of the central structure with the lower and upper layers takes place during the manufacture of the card. Under the action of pressure and temperature, the electronic device sinks into the adjacent layers, which allows compensating for its thickness while the different layers bind to each other. This patent application does not describe a pre-assembled central structure.
We know a chip card by US patent 6 305 609, made by assembling lower and upper layers with a central structure carrying an electronic device. This central structure comprises a support film carrying the electronic device, which includes an integrated circuit and a coil connected to this circuit. This device projects on both sides of the support film. The projecting parts are compensated in thickness thanks to a thermoplastic resin under UV radiation. This liquid is introduced at the last moment during the assembly of the central structure with the previously mentioned lower and upper layers. These latter as well as the support film are in thermoplastic material. This type of central structure presenting overthicknesses requires a specific equipment for final assembly in the card or for example between two lower and upper layers of fibrous nature.
By US patent 6 233 818, we know a chip card produced by assembling lower and upper layers with a central structure bearing an electronic device. This central structure includes a thermoplastic support film with a window in which the electronic device is placed, which comprises a module with an integrated circuit and a copper coil connected to this circuit and inserted into the surface of the film via an ultrasonic process. The film, in PVC, PC or PET-G, is then directly laminable with lower and upper layers printed for the manufacture of the chip card on a specific equipment generating pressure and temperature.
操作这种结构是相当复杂的,因为天线是与结构表面相接触的。
此外,这种结构类型不适合护照封面和活页夹等的直接整合,目前使用的胶合剂是冷胶合剂,并且是以液态形式应用的。
We also know from the demand WO 00/42569 a label made by successively depositing on a silicone covered paper the following layers: a reticulated adhesive layer under the effect of a UV radiation, a layer of an electrically conductive material forming connection legs, a dielectric layer, a layer of a conductive metallic ink to form an antenna, an expandable layer containing a polymer resin and having a window.
An electronic device is introduced in the expandable layer window, in contact with the antenna. In this request, there is no pre-assembled central structure. The expandable layer comprises a reserve at the level of the chip to avoid over-thickening. In the case of a label thus realized, it is relatively easy to peel off the label from its support after application, without any evidence of forgery. Finally, such a construction does not allow to camouflage the electronic device, that is the chip and its antenna, during an observation in transmitted light.
International application WO 02/089052 describes a passport having a frequency identification device on its cover.
This cover may comprise a first sheet bearing a radio frequency device, a second sheet having a hole, and a third paper sheet, the three sheets being counterlaid and the chip coming to lodge in the hole.
International application WO 02/082126 discloses a self-adhesive document comprising an electronic chip connected to an antenna. The latter is made by printing a conductive ink on an adhesive layer.
美国专利号5528222描述了一种结构,包括柔性基板上的RFID设备,以及粘合剂的两层,粘合剂覆盖了RFID设备和基板的两边。
US 2003/0136503申请描述了制造一种物品的方法,该方法使用一个含有多个RFID设备和天线的支撑物。
European patent EP 0 742 926 B1 describes a data support such as an integrated circuit card with one or several layers, in which an electronic module is embedded. The card layers are paper and/or cardboard and are connected to each other by adhesives.
European patent EP 1 271 398 A1 discloses a multi-layered security label comprising an RFID, a release layer causing the destruction of the RFID in case of detachment.
国际申请WO 01/41061 A1公开了一种带有纤维材料支撑天线的集成电路卡的制造方法
Smartrac commercializes structures called « Prelaminated Inlays » containing layers in polycarbonate or PET, to be integrated in a security document. AONTEC also commercializes structures called « Prelaminated Inlays » to be laminated with layers in a security document, these structures containing layers in PVC or PC.
这些结构不能完全满足安全和装配的需要,特别是与底层和顶层纤维结构相结合时。
The invention relates to a structure, in particular to an article, comprising an electronic device making it more difficult, if not impossible, to falsify any article or document of security or value having such a structure, and which may be easily assembled with the article or the rest of the document.
The invention thus relates to a structure according to claim 1.
Intercalaire layer may be white or colored.
本发明的结构例如可应用于身份文件,例如护照,或签证标签的制作。
Under the term “electronic device” we refer to any device allowing the storage and/or exchange of information, in particular by a wireless link. The electronic device may also be a RFID device. The electronic device may comprise an antenna, which may for example take the form of a coil, wire or printed. The electronic device may or may not present apparent electrical contacts from the outside of the structure.
Thanks to the invention, the structure may be devoid of a sensitive overthickness if desired, the electronic device being able to be entirely housed in the intercalaire layer window. Thus, the structure may easily be assembled, at choice, with different types of security documents, without being provided with a specific element to compensate for the thickness of the electronic device, as it is the case, for example, for the chip card described in the US patent 6 305 609 cited above.
The structure according to the present invention also has the advantage that any attempt at falsification of it is relatively difficult, if not impossible, because the intercalary layer is easily altered in the event of a skinning attempt on the structure, which may not be the case for a security or value document made with a central structure such as described in US patent 6,233,818 or in WO 00/42569.
此外,由于电子装置至少部分位于夹层窗内,电子装置免受机械冲击。
紧邻上述结构的层例如是附加的间隔层,遮盖层或电子装置的支撑层,上述列表并不具有限制性。
When the structure is destined to manufacture a label, for example a visa, the previously mentioned adhesive layer is advantageously covered with a removable protective anti-adhesive film.
In a particular implementation, the structure comprises at least an outer fibrous layer intended to be assembled with a fibrous layer of the security or value document.
因此,结构可由至少一层安全或价值文件的纤维层组装而成,这通常是相对容易的,无需特殊粘合剂或特殊层压条件,例如在生产智能卡时经常遇到的层压条件(层压时间为30分钟至150摄氏度),并能限制卷曲问题,因为要组装的结构和文件的纤维层的性质相似或兼容。
优势在于,隔层完全纤维化,这可能会使安全组件融入其中变得容易,这可能会使尝试伪造时容易将其剥离。
In an example of the implementation of the invention, at least one of the nature and thickness of the intercalary layer is chosen so that the intercalary layer is opaque to transmitted light. Thus, the intercalary layer may allow to mask at least partially the electronic device when the structure is observed in transmitted light.
另外,遮光层可以被设计来反射光线,这使得结构被反射或穿透光线观察时,至少部分地遮盖电子装置。
As indicated above, the intercalary layer may be white or, in variation, be colored. The intercalary layer may contain a colored core with a white coating.
When the intercalary layer is colored, the colorants and/or pigments present in the intercalary layer are preferably retained in the intercalary layer with a sufficient force to avoid migration of the colorants or pigments in adjacent layers of the structure and/or of the security or value document on which the structure is assembled.
间隔层可金属化或层压,至少包含一层金属膜,这可以使其变得不透明,同时确保电子设备的书写/阅读功能不受干扰。
更优者,窗户贯穿间隔层,但是窗子是不贯穿的。
In an example of implementation of the invention, the structure is arranged so as to allow the detection, visually, possibly under particular lighting, or with the aid of a detection device, of a security element carried by the structure, said security element being for example present on the electronic device, for example in the form of an inscription or a coating such as for example a varnish. The structure can for example comprise a detectable thermochromic coating on the security document or value through the window.
优选地,所述结构,尤其是至少一夹层,所述遮盖层和所述粘合层,包含至少下列安全元件之一:认证元件,假货显像元件,安全元件是可视的和/或借助于检测装置是可检测的。
The structure, particularly one or more intercalary layer, one or more masking layer of the structure and one or more adhesive layer, comprises advantageously at least one security element chosen among : a variable and/or diffractive optical element as for example a holographic, iridescent or liquid crystal element, a magnetic or crystalline coating, magnetic fibers, detectable by magnetic resonance markers, detectable by X fluorescence markers, a varnish or ink impression, luminescent or fluorescent markers, photochromic, thermochromic, electro-luminescent and/or piezochromic compounds and/or which change color in contact with one or more predetermined chemical products, particularly acids, bases or oxidizers or solvents.
Advantageously, the window and/or intercalary layer present a shape imitating an image, a logo or a stamp, in order to define an additional safety of the structure and of the document equipped with the structure. The window may thus be non rectangular, for example.
In an embodiment of the invention, the electronic device comprises a support carrying an electronic chip and an antenna connected to the electronic chip, the electronic chip extending at least partially within the interlayer window. The antenna enables electrical power to be provided to the electronic chip and reading and/or writing of data, without contact, in the chip. This latter may comprise one or more integrated circuits, notably a memory.
The support may be flexible. The support may be based on a mineral or organic, natural or synthetic material, for example, be a fibrous layer, notably a paper layer.
The support may be made for example of a material containing a polymer, such as PET. The support may be made of PVC, ABS/PC, PC, PA, polyimide, PE, PP or epoxy glass, this list being non-limitative.
The electronic chip fixed on the support may or may not be encapsulated or sealed in a resin. The antenna may be of a wire type or may be engraved, printed, or realized by stamping, or even by electrolytic growth process. The antenna may extend at least partly on the chip. When the antenna is wire type, it is advantageously maintained by a layer of an adhesive, which may serve to assemble two layers of the structure. The adhesive layer then advantageously has a thickness greater than that of the wire of the antenna.
The support may have on one face a coating containing a security element, for example an irreversible thermochromic compound which changes color, for example passes from colorless to a predetermined color, for example rose or red, when the temperature exceeds a predetermined value, for example about 65 °C. This allows to reveal a thermal attack on the structure.
In an embodiment of the invention, the support is sandwiched between two layers of the structure. In this case, the structure may comprise a single intercalary layer.
可变型地,所述结构可包含至少一层间隔层,所述间隔层中至少部分地容纳所述电子装置的支撑元件。所述装置可包含例如具有连接部分的模块,所述连接部分旨在与天线连接,并且所述电子元件被封装树脂覆盖。
Additional intercalary layer may contain a window housing at least partially the connection part of the module, the encapsulating resin being housed in the window of the other intercalary layer. The electronic device antenna may be carried by this additional intercalary layer.
可选地,电子装置可与第二天线耦合,该第二天线例如可以扮演放大器的角色,例如通过增加作用范围,该第二天线可由夹层额外层或相邻层承载。
When the structure comprises several intercalary layers each having a window, the different windows may present different shapes and dimensions in order, for example, to adapt to the shape of the electronic device. Thus, the protection of the latter against shocks can be strengthened.
When the structure contains two intercalary layers, one of them may contain a smaller window than the other intercalary layer.
The electronic device may comprise, particularly when it constitutes a module, two portions of different widths, the portion with the smallest width being received in the smallest window and the portion with the largest width in the largest window.
The intercalary layer with the smallest aperture respectively the largest aperture may present a thickness substantially equal to that of the portion of the electronic device with the smallest aperture respectively the largest aperture width.
The electronic device may comprise an antenna, for example engraved or filaire, disposed between the two intercalary layers. The electronic device may in particular comprise an antenna disposed on its wider portion.
The adhesive used between the two intercalated layers may not be a pressure-sensitive adhesive, to facilitate the precise positioning of the two intercalated layers relative to each other. For example, the two layers may be temporarily maintained together by forming, in a heat-activatable adhesive located between the two layers, fusion points, for example by local ultrasonic application before final assembly.
另一种方式是两层窗户的大小相同。
例如,结构的最大厚度可以是大约500微米。
In an embodiment of the invention, the structure comprises at least one masking layer disposed at least to the right of an intercalary layer window, so as to partially mask the electronic device when the structure is observed in transmitted light and/or reflected light. Thus, the structure may present enhanced security against counterfeiting, making it more difficult to attempt to reproduce the structure.
The mask layer may be white or colored. The mask layer may comprise a colored core with a white coating.
遮盖层可以金属化或至少用一层金属膜金属化。
The mask layer may be fibrous or not.
In an embodiment of the invention, the adhesive layer is selected to allow the cold or hot assembly of the intercalating layer with an adjacent layer of the structure, or with an adjacent layer of a security or value document in which the structure is integrated or attached.
粘合剂可能是热塑性粘合剂或热硬化粘合剂,弹性体或它们的混合物之一。
粘合剂可被网状化,以提高性能,特别是在机械强度、热性能或化学产品方面。
粘合剂可以以固体形式呈现,例如,热熔型粘合剂在施用时可通过加热而变为液态。
The adhesive may, in variants, be in the form of a liquid in solvent or aqueous medium or contain 100% of adhesive matter.
粘合剂,以另一种变体为例,可以是粘合剂压力敏感片或可热激活片的形式。
一种热激活的粘合剂型无瞬间粘合剂的粘合剂片材,对于在制造过程中能方便地定位各层是有利的,从而在最终组装前就能进行组装。
粘合剂可以以薄膜形式出现,若有必要,可以由纤维层加强,可以是织造的或非织造的。
粘合剂的固化可以通过溶剂或水的蒸发,通过溶剂或热能的活化,通过化学反应性的粘合剂的聚合,通过热冷却热浇注的热可熔粘合剂来获得。
In some cases, the materials to be assembled with the chosen adhesives will be subjected to pressure, with or without heat, to increase the adhesion.
例如,热激活粘合剂的电影可以基于例如改性聚乙烯,乙烯-醋酸乙烯酯,聚丁二烯丙烯酸酯,聚氨酯网络或合成橡胶和环氧树脂混合物。
可压敏胶片的基底可为聚丙烯酸盐。
一种可固化液体胶粘剂,例如可以基于丙烯酸或聚氨酯,改性或不改性。
粘合层可被着色以部分或完全掩盖透过和/或反射光观察到的电子装置。
Preferably, the adhesion between two adjacent layers of the structure is greater than the internal cohesion of at least one of said layers. The internal cohesion of a layer in particular corresponds to its ability to resist internal delamination. Thus, an attempt to separate one of the layers of the structure causes alteration of the latter.
In an example of the application of the invention, the structure comprises two intercalary layers, one of them having a lower internal cohesion than the other intercalary layer.
中间层,如果有的话,具有至少与遮盖层相等或较低的内部凝聚力。
When the electronic device comprises a support, the internal cohesion of the support may be inferior or equal to that of the intercalary layer. Thus, the structure provides a security against a falsification attempt to try to isolate the electronic device by tearing or delamination between the intercalary layer and the masking layer or between the intercalary layer and the support, in particular if the latter has the same dimensions as the intercalary layer.
The structure may comprise an anti-adhesive film intended to be removed when the structure must be adhered to a document or an object, such as for example a packaging.
The structure may be covered on both of its opposite faces with a layer of an adhesive. Each layer of adhesive may be protected by a removable protective anti-adhesive film, especially when the adhesive is sensitive to pressure. When the adhesive is not sensitive to pressure, for example, activable by heat, an anti-adhesive film may not be necessary.
结构,尤其是当它包含有保护粘合剂层的防粘膜时,可以构成护照一页粘贴的签证。
该结构可包含一个可见安全元素。
The presence of a fibrous layer, such as paper, intercalaire or masking, on the external surface of the structure is advantageous because such a layer may be compatible with liquid adhesives, for example water-based, which may be used in passport manufacturing.
Moreover, a fibrous layer can be formulated to be weakly cohesive and be altereded in the event of an attempt to delaminate the structure or separate the structure from a passport cover with which the structure is assembled, and thus serve as evidence of fraudulent manipulation.
此外,有可能在纤维层中加入安全元素。
此层可以相对薄,例如密度小于或等于100 g/m2,甚至小于或等于70 g/m2。
发明的结构可以是柔性的。
The invention relates also to a security or valuables document containing a structure as defined above or formed by such structure, this being the case notably when the document is a visa.
The security document may be preferable to an identification document, a visa label, or a passport booklet, for example, this list is not exhaustive. The value document may be a payment means
The document may comprise a receiver layer which is assembled with the structure and internal cohesion of this layer is preferably superior to that of the intercalary structure layer and possibly to that of the structure mask layer, which is assembled with the receiver layer of the document.
Advantageously, the adhesion between the document layer on the one hand and the intercalary layer or the possible masking layer on the other hand, is greater than the internal cohesion of the intercalary layer or the possible masking layer.
本发明的一种结构可设计为夹在两层纤维中间,例如两层纸。
The invention also relates to a process for making a structure as claimed in claim 33.
The process may comprise the following steps : deposit an adhesive layer on the intercalary layer, realize a window, preferably transverse, in the ensemble made up of the intercalary layer and the adhesive layer, preferably with the aid of a punch or a laser.
The process may further comprise the following steps: provide an adhesive layer in the form of a transfer film for example sensitive to pressure and/or activalbe to heat, said adhesive layer being initially covered or not by at least one anti-adhesive film, remove the anti-adhesive film from the adhesive layer, if appropriate, assemble the adhesive layer with the intercalary layer.
In a variant, the method comprises the following steps : depositing a liquid adhesive on the intercalary layer or on a possible masking layer, so as to form an adhesive layer, and possibly, covering the thus formed adhesive layer with an anti-adhesive film.
When the structure comprises two intercalary layers, the process may comprise the following steps: to realize separately on each of the intercalary layers at least one window, preferably transverse.
When the structure comprises a polymer adhesive intercalary layer and two fibrous intercalary layers, the process may comprise the following steps: assembling the adhesive with the intercalary layer, making a through-window in the assembly, making a through-window in another intercalary layer, assembling the two intercalary layers with the electronic device in the windows.
The process may comprise the following step : applying an adhesive layer on each intercalaire layer, cold or hot laminating the different layers of the structure with or without pressure.
The invention further relates to a process for realizing a security or value document, characterized by the fact that it comprises the following steps: providing a structure as defined above, the structure being pre-assembled, assembling said structure with the security or value document.
This process may comprise the step of cold or hot laminating the structure with a security or value document layer.
The process may comprise the following steps: apply an adhesive layer to the structure and/or a security or value document, assemble the structure with the security or value document with the aid of the adhesive layer.
Alternatively, the process may comprise the following steps: treat an outer surface of the structure in order to render it adhesive and cover it temporarily with an anti-adhesive film, assembl the structure with the security or value document by contacting the treated surface of the structure with the document.
The process may include the step of sewing the structure with at least one sheet or layer of the security or value document.
优选地,缝纫在电子结构的电子设备的支撑件上,且不包括天线和电子芯片。
The process may comprise the following steps :realize a security element impression or deposit on a layer of the document before assembly with the structure,assemble the structure with the mentioned document layer.
Thus, the structure is incorporated in the document only when the document layers are correctly printed or the security element is correctly reported.
As an alternative, the procedure may comprise the following steps: assemble the structure with a document layer, then make an impression or deposit a security element on the document layer
The invention may be better understood from the following detailed description, non-limitative examples of its implementation and the examination of the attached drawing, on which : figure 1 represents, schematically and partially, a structure conform to an example of implementation of the invention, figure 2 represents, schematically and partially, in transverse section, the structure of figure 1, figure 3 represents, schematically and partially, in transverse section, a security or valuables document assembled with the structure of figure 2, figure 4 is a view, schematically and partially, in transverse section,from one structure corresponding to another example of the implementation of the invention, figures 5 and 6 represent schematically and partially, in transverse section, two security or value documents assembled with the structure of figure 4, figure 7 represents schematically and partially, in transverse section, a structure corresponding to another example of the implementation of the invention, figure 8 is a schematic and partial, in transverse section, view of a security or value document with the structure of figure 7, figures 9A and 9 represent schematically and partially, in transverse section, structures corresponding to other examples of the implementation of the inventionFigure 10 schematically and partially illustrates a security or value document in cross-section, with the structure of figure 9. Figure 11 schematically and partially illustrates another embodiment of the invention in cross-section. Figure 12 schematically and partially illustrates a security or value document in cross-section, with the structure of figure 11. Figure 13 schematically and partially illustrates an intercalary layer window according to the invention. Figure 14 schematically and partially illustrates an invention security document with a stitched structure on top.Figure 15 schematically and partially represents a set of leaves and a structure to be sewn together to form the document of figure 14. Figure 16 schematically and partially represents, in cross-section, a structure corresponding to another embodiment of the invention. Figure 17 schematically and partially represents, in cross-section, a booklet corresponding to an embodiment of the invention. Figure 18 schematically and partially represents steps of the manufacturing process of the structure of figure 17. Figures 19 and 20 schematically and partially represent two examples of the invention corresponding to the invention.figure 21 schematically and partially represents an insert incorporating an electronic device, figures 22 to 24 schematically and partially represent in cross section conform structures to the invention, incorporating the insert of figure 21, and figures 25 to 28 schematically and partially represent in cross section different conform structures to different examples of implementation of the invention.
In relation to the drawing, the relative proportions of the different elements represented are not always respected, for clarity.
图1代表了本发明旨在实现安全文件或有价值文件的结构1。
Structure 1 comprises an intercalaire layer 2 comprising a traversing opening defining a window 4.
In the considered example, window 4 is in the form of a rectangle, but the present invention is not limited to a rectangular window when window 4 has another shape, for example in the form of a star, as shown on figure 13. In general, window 4 can present a non circular or rectangular shape imitating an image, a logo or an inscription.
In the considered example, intercalary layer 2 is a fibrous layer, in particular a paper layer, for example with a density of about 215 g/m2 and a thickness of 280 µm.
第二层间隔层可包含染料,例如硫化黑使其具有黑色,该染料在第二层间隔层中具有满意的附着力,这避免了当第二层间隔层与粘合剂接触以及/或处于高温以及/或高湿度的环境中时染料迁移至其他层。
The intercalaire layer 2 is, in the considered example, opaque to transmitted light and may include a visually detectable security element, optionally under predetermined lighting, for example UV or IR, or, in a variant, with the aid of a predetermined detection device, for example magnetic detection.
In the considered example, the intercalary layer 2 comprises detectable tracers with an adapted detection device, for example, the tracers marketed by the company Microtag, detectable by magnetic resonance.
2层的间层可以达到约150的斯科特单位的凝聚力,通过斯科特仪器测量得出。
Intercalary layer 2 may contain any other security element, such as for example: an optical variable and/or diffractive element such as an optical element holographic, iridescent or liquid crystal, a magnetic or crystalline coating, magnetic fibers, detectable magnetic or fluorescence X tracers, varnish or ink impression, luminescent or fluorescent tracers, photochromic, thermochromic, electroluminescent and/or piezochromic compounds and/or which change color upon contact with one or more predetermined products.
As shown in figure 2, an adhesive layer 6 is deposited on the lower surface of the intercalary layer 2, so as to allow assembly of the latter with a support 7 of an electronic device 8 of contactless type.
In general, the thickness of the intercalary layer is greater than or equal to that of the bare die, encapsulated or part of a module comprising the die. The window size is greater than or equal to that of the bare die, encapsulated or part of a module comprising the die.
In the considered example, adhesive 6 is a pressure-sensitive adhesive. In a variant, adhesive 6 may be of any other type, for example a temperature-sensitive adhesive.
In the considered example, the adhesive layer 6 contains a permanent adhesive containing a solvent, for example acrylic and has a thickness of about 25 μm.
粘合层6最初以转移膜的形式出现,并且被冷压在中间层2上。
Adhesion power and cohesion of adhesive layer 6 are superior to the cohesion of intercalary layer 2.
The electronic apparatus 8 includes, in addition to the support 7, an electronic chip 10.
In the considered example, the chip 10 is a chip marketed under the designation Picotag 16 KS by the company Inside and has a square shape with a section of about 4 mm2 and a thickness of about 200 µm.
Puce 10 is connected to antenna 11, which is made of aluminium and engraved on support 7. The latter contains a PET film with a thickness of about 40 µm.
Puce 10 may be made from silicon or, in a variant, from a polymer.
支持件7在其一面包括粘合剂或粘合层,所述粘合剂或粘合层包含一种热变色不可逆化合物,当温度超过65°C时,所述化合物改变颜色,例如由无色变为玫瑰红。
The structure 1 comprises an anti-adherent film 15 attached to the support 7 via an adhesive layer 16. This latter is identical to the adhesive layer 6. The anti-adherent film 15 is intended to be removed before the assembly of the structure on a document or an article.
We will now give a more detailed description of the manufacturing steps of structure 1.
First, the adhesive layer 6 fixed on an anti-adhesive film (not represented) is cold rolled on the underside of the intercalary layer 2.
An opening is realized in the ensemble made up of intercalaire layer 2, adhesive layer 6 and anti-adhesive film, with the help of a cutting machine equipped with a punch, this opening being destined to form window 4 of structure 1.
The anti-adhesive film is then separated.
Layer 2 intercalaire with adhesive layer 6 on top, support 7 with antenna 11 on top, adhesive layer 16 and anti-adhesive film 15 are assembled by cold lamination on a specific machine, the chip 8 coming to lodge in window 4, without overrunning it, as can be seen on figures 1 and 2.
The resulting structure 1 may be used for the manufacture of a security document.
On has represented on Figure 3 a document 20, such as a visa sticker, having a fibrous layer 21, made of paper, this layer 21 being cold laminated on the upper face of the structure 1, through a pressure-sensitive adhesive layer 22.
In addition, document 20 may receive a security element, for example, a holographic patch, a reactive ink to apolar solvents, an irreversible thermochromic ink changing color when the temperature reaches 65° C, these security elements being preferably made outside portion 21a of layer 21 located in regard of window 4 of structure 1.
Layer 21 may contain other security elements such as visible fluorescent safety fibers, invisible fluorescent planchettes for authentication, and chemical reagents such as reagents for acids, bases, oxidants, and polar solvents to prevent any attempt at chemical product counterfeiting.
Document 20 may thus present the following advantages: authentication security: first level of security: visible fibers, for example, an etched star visible in transmitted light, second level of security: planchette and fluorescent fibers detectable under UV light of 365 nm, third level of security: microtag detectable with a detection device. counterfeit protection: against chemical attacks: reagents in the paper giving a visible colored stain on the label surface during chemical attacks. These chemical attacks may occur during attempts to erase inscriptions present on the printed surface of the visa or during attempts to remove the visa from a passport, or even during attempts to open the visa to retrieve the electronic device.against thermal attacks: attempts to remove the visa with the electronic device after application on a passport paper (the napkin between passport and intercalary layer) causes a color change of the thermochromic compound on the support of the electronic device, this color change being visible in reflection and especially in transmission at the level of window 4 of the intercalary layer 2, attempts to recover the security paper (napkin between security paper and intercalary layer) cause the appearance of a colored pattern at the level of the thermochromic ink printed on the security paper surface, which makes the use of any fraud inconvenient.Against mechanical attacks, without temperature input: attempts to remove the visa with the electronic device after application on a passport paper (amorced pelage between passport and intercalary layer) lead to the delamination of the intercalary layer, part of which will remain on the passport paper and the other on the label, so it is difficult to reuse the visa in its entirety. However, if the label is stuck on another passport, during a control, there will be always a loss of the Microtag detection signal since there is a missing part of the intercalary layer in the label. Attempts to recover the security paper alone (amorced pelage between security paper and intercalary layer) lead to the delamination of the intercalary layer or the visa.If the intercalaire layer is peeled, the visible motif at the window level has a high chance of being altereded and there is evidence of falsification.
此外,第八电子装置4号窗户外不透光,从而提高了文档20和印在上面的图案的美学。
Structure may present a different form.
图16表示的是结构1’,它与前文中描述的结构1不同之处在于,结构1’的每一块夹层2上都覆盖有一层粘合剂16。每层粘合剂16上覆盖有一层防粘膜15,该防粘膜15可以在组装结构1’至文件或物品上时被移除。
在图4中代表了结构23,用于执行与本发明另一实施例一致的安全文档。
Structure 23 comprises : an intercalary layer 2 as described above, an adhesive layer 6 only extends around the window 4 of the intercalary layer 2, and not on the whole face of this intercalary layer 2, an electronic device 8 support 7', only extending on a part of the intercalary layer 2, on the right of the adhesive layer 6', an adhesive layer 24 extends over the whole bottom face of the intercalary layer 2, a mask layer 15'.
Structure 23 may be incorporated in a security document 25 as shown in Fig. 5, being laminated between two sheets of paper 26 by means of two layers of adhesives 27. These may contain a heat-sensitive adhesive.
In the example considered, intercalary layer 2 has an internal cohesion lower or equal to that of paper layer 26 on which layer 2 is assembled. Thus, a peeling attempt of the paper layer may cause a delamination of the intercalary layer 2.
Throughout the example considered, the mask layer 15 has a lower or equal internal cohesion than the adjacent paper layer 26. The adhesion between the intercalary layer 2 and the mask layer 15, between the intercalary layer 2 and the adjacent layer 26, and between the mask layer 15 and the adjacent paper layer 26, is higher than the cohesion of the intercalary layer 2 and the cohesion of the mask layer 15. The intercalary layer 2 and the mask layer 15 have similar cohesion. The adhesive layer 24 has a higher adhesion and cohesion than the cohesion of the intercalary layer 2 and the cohesion of the mask layer 15.
防止第25号文件的篡改,可以通过撕裂或剥落夹层2或遮盖层15来移除电子设备8。
Security against forgery is strengthened when the intercalary layers 2 or masking 15' comprising security elements, an alteration of the intercalary layer 2 and/or the masking layer 15' may lead to a deterioration of the security elements or to a modification of an optical, electrical or magnetic signal likely to be easily detected.
the structure 23 may still be incorporated in document 25', as illustrated on figure 6, by treating the external faces of the intercalary layer 2 and of the masking layer 15' in order to make them have reactive adhesive properties at high temperature.
The layers of paper 26 are then laminated on the structure 23. A structure 27 is represented on figure 7 successively : an intercalary layer 2, an adhesive layer 6, an electronic device support 7, this support 7 extending over the entire bottom surface of the intercalary layer 2. The antenna is printed by screen printing on the support 7 and the chip is lodged in the window 4.
Such a structure 27 may be used for example to make a security or value document 28 as shown on figure 8.
Structure 27 may be lamination for assembly with two layers of paper 26 through two layers of adhesive 29.
Each adhesive layer 29 initially presents, for example, in the form of a transfer film sandwiched between two anti-adhesive films, for example, containing a paper layer with a silicone coating.
本发明不局限于上文所述的电子设备。
The figure 9 represents a structure 30 which comprises successively: a first masking layer 31, a first adhesive layer 32, a first intercalary layer 33 with a first window 40, a second adhesive layer 34, a second intercalary layer 35 with a second window 41, larger than the window 40, a third adhesive layer 36, a second masking layer 37.
Electronic device 42 is located in windows 40 and 41.
Figure 9A represents structure 30 without mask layers 31 and 37.
例如,第31和第37层的遮盖层包括各自一个黑色的躯体,其外部面覆盖有适于接收印迹的白色遮盖层。
白饰面可以包含例如荧光颗粒称为Hilites,可检测下UV波长大约365 nm的照射。
白涂层可包含安全纤维,例如在254 nm和365 nm紫外光下可激发的双荧光安全纤维。
过滤层31和37也可以包含,集成到黑色层中,例如Microtag等可追踪标签,可以使用便携式检测设备进行检测。
透光面31和37层有利地具有足够的不透明度,使得电子设备42在透光面中无法被发现。
层32、34和36例如含有对压力敏感的粘合剂。
The adhesive layers 32 and 36 may be preliminarily deposited in liquid form on the masking layers 31 and 37, on their internal face, that is, on the respective black cores.
粘合层34最初是转移片的形式。
The adhesive layers 32 and 36 have an approximate thickness of 25 µm in the example. The layer 34 may have a thicker layer, for example a thickness slightly higher than 100 µm, in order to compress the antenna thickness.
The electronic device 42, for example, comprises a module 43 marketed by the Philips company under the designation MOA4.
Module 43 occupies an area of about 42 mm2 and has a total thickness of 410 μm.
Module 43 contains at its lower part an integrated circuit, or several variants, and a connection circuit 44 with connecting feet 45 connected to a copper antenna 46 of type wire, deposited on the intercalary layer 35, and at its upper part an encapsulating resin 47.
In the considered example, the intercalary layer 33 is a fibrous layer based on cellulose fibres, having a density of about 320 g/m2 and a thickness of about 400 µm.
The intercalary layer 33 of this window 40 receives the encapsulation resin 47 of the module 43, this encapsulation resin 47 having a thickness of about 330 µm and occupying an area of about 25 mm2 in the illustrated example.
The intercalaire layer 33 is present in the considered example, it is white in color and may contain safety elements, for example, invisible yellow phosphorescent traceurs, detectable with a UV lamp of about 365 nm wavelength.
此外,第33层还包含可由便携式荧光X设备检测的可检测标记,这些标记可由KeyMasters Technologies公司销售。
In the considered example, the intercalaire layer 35 is a fibrous layer, for example based on cellulose fibers, for example white in color, having for example a density of about 90 g/m2 for a thickness of about 125 μm.
Layer 35 intercalaire receives module connection circuit 44, the thickness of which is for example about 120 µm.
第三十五层可以包含安全元素,例如可由365纳米波长的紫外灯检测的红色荧光不透明物。
In the example considered, intercalary layer 35 presents cohesion, measured by Scott Bond device, inferior or equal to that of intercalary layer 33 and that of mask layers 31 and 37.
粘合层34的附着力和凝聚力高于夹层33和35之间的凝聚力。
Now we will describe more precisely the manufacturing steps of structure 30.
Layer 34 is sandwiched between two removable anti-adhesive films (not represented).
After separation of the two antistatic films, the adhesive layer 34 is cold-laminated on one side of the intercalary layer 33.
随后,在粘合层34和粘合层33构成的整体中,在粘合层34上开一窗。
该窗口可以使用配备有剪裁工具的切割机来实现。
第35层也设置一个窗口。
We place antenna 46 of electronic device 42 on one face of intercalaire layer 35.
The module 43 is introduced into the window 41 of the intercalaire layer 35 so that the connection circuit 44 is completely housed in it, being connected to the antenna 46 by the connection pins 45. This connection can be realized for example by soldering.
The film anti-adhesive present on the adhesive layer 34 is removed.
The assembly of the intercalaire layer 33 and the adhesive layer 34 is assembled with the intercalaire layer 35 so that the encapsulation resin 47 of module 43 is housed in the window 40 of the intercalaire layer 33 and the antenna is taken in a sandwich between the intercalaire layers 33 and 35. The adhesive layer 34 may contribute to the maintenance of the antenna when it is not printed but filaire.
最后,31和37层在先前接收32和36层可压敏粘合剂后,与中间层33和35层复合。
所获得的结构30可以接收例如一种或多种墨水,尤其是化学反应性墨水,一种或多种光学可变墨水,而且还可以接收一个全息图。
31和37层的白色层可以进行个性化结构。
The structure 30 obtained may be introduced between two transparent plastic layers 48, and be laminated with these layers 48 through an adhesive layer 49, as illustrated on Figure 10.
由此获得一张包含电子设备的身份证明卡,该设备已准备好供使用。
The structure 30 assemblée of the document extends until the edge of this document in such a way that the safety elements present in particular in the intercalary layers 33 and 35 are apparent on the edge and can be detected on it by adapted means, or visually.
The following are some advantages of such an identity document: Authentication security: First level: optical variable ink, holographic patch,... Second level: fluorescent particles and double fluorescence fibers on both sides of the printed document, yellow and red fluorescent effect on the edge of the document,... Third level: Microtag and KeyMaster detectable with specific equipment,... Forgery security: Against chemical adhesives: reagents in the security inks on each surface of the document, giving a visible colored stain on the surface of the card, during chemical attacks. These chemical attacks may occur during attempts to open plastic layers or attempts to erase inscriptions present on the printed surface of the document, or during attempts to retrieve the electronic device,Against mechanical attacks: attempts to remove the electronic device cause a tear or delamination of the intercalaire 33 layer and/or the intercalaire 35 layer. These attempts will also result in a loss of yellow and red fluorescence at the edge as well as a modification of the signal brought by either the KeyMaster tracer present in the intercalaire layers or the Microtag tracer present in the masking layers, attempts to open the document will cause a delamination of the white layers at the masking layers and thus damage the inscriptions present.
Moreover, the electronic device is not visible at all, neither in transmission, nor in reflection in the final document, which reinforces the aesthetics of the card and the present impressions.
图11示出了实施例50的结构,该结构用于实现安全或有价值文件,如后续将看到的。
The structure 50 comprises successively : an intercalary layer 51 with a first window 58, an adhesive layer 52, an intercalary layer 53 with a second window 59 larger than the first window 58, an adhesive layer 54, and a masking layer 55.
例如,第一层51是纤维素纤维层,其密度为270g/m2,厚度为350μm。
The first intercalary layer 51 is, for example, white, containing safety elements such as, for example, yellow green fluorescent traceable elements SC4, commercialized by the company Angström, which are visually traceable with a lamp emitting a UV radiation of 365 nm wavelength, as well as quantitatively with a scanner commercialized by the company Angström.
The structure 50 also comprises an electronic device 60 of the contactless type, comprising a mineral support 61 having a thickness of about 130 µm.
除了第60装置,还包含树脂封装保护的芯片62,该芯片厚度大约为330微米。
61号支撑件装有63号铜线天线。
例如,支撑物61可以具有4.7cm×12cm的截面。
Interlayer 51 Layer 58 receives encapsulation resin 62.
In the embodiment considered, the second intercalary layer 53 is a fibrous layer based on cellulose fibers having a density of 100 g/m2 and a thickness of about 130 μm, this thickness being substantially equal to that of the support 61.
For example, the intercalary layer 53 is a white paper and may contain security elements such as invisible fluorescent red tracers SC10 and visually detectable with a UV lamp emitting a UV radiation of 365 nm wavelength, as well as quantitatively with a scanner marketed by the company Angström.
In the considered example, the intercalary layer 51 has an internal cohesion inferior or equal to that of the intercalary layer 53. This latter presents an internal cohesion inferior or equal to that of the mask layer 55. The adhesion between the first intercalary layer 51 and the second intercalary layer 53 is superior to the cohesion of the intercalary layer 51. The adhesion between the mask layer 55 and the intercalary layer 53 is superior to the cohesion of the intercalary layer 53. The adhesive layers 52 and 54 have an adhesion power and cohesion superior to the intercalary layers 51 and 53 and the mask layer 55.
In the example considered, the masking layer 55 is black, the dye or pigment used for coloring being preferably resistant to migration under predetermined temperature and humidity conditions, for example with 80 % relative humidity, at 65 °C and a contact pressure for example below 1 kg/cm2.
The pressure-sensitive layers 52 and 54 are applied in a liquid form. These adhesive layers have a thickness of about 25 μm.
Now we will describe in more detail the steps of the structure 50 manufacturing process.
intercalaire 51 receives on its internal face a liquid adhesive layer 52.
The 55th layer also receives on its internal face an adhesive 54 in liquid form.
接着,通过激光切割机,在间层51、粘合剂层52和粘合剂层52上贴有防粘层的组合件中,形成一个窗口。
53层间层还开有一扇窗户。
After removing the anti-adhesive film from the adhesive layer 52, the intercalaire layer 51, the electronic device 60, the intercalaire layer 53 and the mask layer 55 are assembled on a specific machine.
The electronic support 61 is located in the interlayer 53 window 59. The encapsulation resin 62 chip is located in the interlayer 51 window 58.
The resulting structure 50 may be used for the production of a passport booklet 80, for example.
The manufacture of the passport booklet 80 may comprise the following steps, implemented on a mounting machine: assembly of the structure 50 with a sheet set 81 comprising visa pages and security films, this assembly being realized at the level of the cover page by means of a liquid adhesive 82, as illustrated on figure 15, centered sewing of the sheet set 81 and the structure 50, the sewing being realized so that the sheet set and a part of the support 61 of the electronic device 60 are found sewn together.as shown in figure 15. The sewing 84 is made outside of the antenna 63 and of the electronic chip of the device 60, so as not to affect the operation of the electronic device 60, assembly of the structure and of the sheets 81 sewn with a textile sheet 85 coated with a liquid glue 82 in order that the structure 50 be taken in sandwich between the paper sheets and the textile sheet coated, as shown in figure 14, final cover decoration on its coated face by transfer foil deposition.缝纫工艺缝纫书
Security features: Counterfeit resistance against mechanical attacks: Any attempt to remove the electronic device will become very difficult because the electronic device is sewn into the passport, any attempt to remove the electronic device by peeling off and removing the thread causes a visible delamination of the intercalary layer 51 or 53 and affects the recognition of the yellow and red fluorescence on the cover, whether visually or automatically with the Angstrom scanner. Authentication security: Second level: yellow and red fluorescence on the cover of the passport, third level: measurement of the spectral signature of the fluorescence at the level of the cover thanks to a dedicated scanner.
Moreover, the electronic device is not visible either in transmission or in reflection on the final passport booklet cover.
Structure 50 may, by variant, be incorporated in a security document 70, laminated between two layers of paper 71 through two layers of adhesive 72, as shown on the figure 12.
图17中以护照形式代表了一本100页的册子,它具有封面101和联结在一起的页数102
Cover 101 comprises structure 103 including electronic device 104 and intercalary fibrous layer 105 with window 106 in which the electronic device 104 is partly extended.
这个电子设备104例如以模块形式呈现,该模块包含封装在树脂中的电子芯片,并固定在基板上,该基板带有与电子芯片的两个触脚连接的天线。
The structure described corresponds to that of Figure 9 but the mask layer 31 is replaced by the assembled leaves 102 and the mask layer 37 is replaced by an outer layer 108.
The cover comprises in addition an outer layer 108 adhered to the structure 103 via an adhesive layer 109.
for example, the outer layer 108 may be realized by latex impregnated paper and receiving a plastic coating. As an alternative, the outer layer 108 is realized by plastic impregnated textile and receiving a plastic coating.
In the considered example, structure 103 comprises an additional fibrous intercalary layer 110 having a window 111 of lower section than window 106 and arranged to receive partially electronic device 104.
The intercalary layers 105 and 110 are assembled by means of an adhesive layer 112, for example a liquid glue, the electronic device 104 comprising an antenna 113 deposited on the layer 105 in advance, before receiving the adhesive layer 112.
The ensemble of leaf 102 contains a guard page 115 adhered to the structure 103, on the side of the additional fibrous layer 110.
This intercalary layer 110 may be made, if desired, in a different material from the paper, for example in polymer.
Now we will describe the steps of the process for the manufacture of structure 103.
As shown in Figure 18, at step 120, a window 106 is made in the paper layer 105.
至于第121站,电子设备104被带到窗106通过载体118电子设备104。
At the 122th step, the antenna 113 is placed on layer 105 and connected to the electronic device 104 by soldering.
At the 123th step, the 105th layer is brought into contact with the 110th layer having previously received an adhesive 112 layer applied by transfer rolls. The layers 105 and 110 are laminated in a measured way to align the windows.
Electronic device 104 extends over windows 106 and 111 of layers 105 and 110.
在第124步中,103结构按照希望的格式进行分割。
在第125阶段,结构103在压力和温度下进行层压,以使粘合剂硬化和/或网状化。
In a variant of step 123, adhesive layer 112 is brought in the form of a heat-activatable film between layers 105 and 110 and the whole is laminated under pressure at a heat, for example between two rollers or in a plate press.
在上述程序中,有可能周期性地将结构103暴露于超声波下,以保持结构103的各个部件在热压下最终装配前的位置。
The support sheet 118 is removed at the end of the procedure.
本发明的结构103的装配,参照图17或按照发明实现的其他结构,结合活页夹的封面,可采用多种方式。
As shown in Figure 19, the leaf assembly 102 may be assembled with the structure 103 before this structure 103 is assembled with the outer layer 108 of the cover.
In the example of this figure, the leaves 102 are joined by a stitch 140, which does not serve to solidarise the leaves 102 with the rest of the covering.
变体中,如图20所示,缝合线140也用于将所有叶片102固定到框架103上。
140缝线中的至少一根可以充分浸透粘合剂141,使得缝线与外部层108固结。
图21中表示了插入件150,包括电子设备151,其上附有电子芯片152并连接有天线153。
插入150号展示,在所考虑的例子中,是一种盘状形式。
Puce 152 is made on a plastic film.
The 152 pin includes connection wires with the 153 antenna.
The puce 152, the connection wires and the antenna 153 may be encapsulated in one or more resins.
插入150的复合物,例如包含两层外壳树脂层粘合和中间树脂层,中间树脂层部分浇注并硬化。
The plastic film and/or the outer layers of the encapsulating resin may be based on polyimide (PI) or other materials such as glass epoxy films associated with resins. Polyimide is a thermally resistant material (250°C continuously), with excellent mechanical resistance from -100°C to +200°C, good shock resistance, good chemical resistance, satisfactory electrical insulating properties, and a very low coefficient of expansion. At least one of the resins may be selected from a thermosetting resin, notably with a high destruction point, for example above 400°C.
To increase the communication distance between the tag and the reader, it is possible to add an amplifying antenna, not represented, to the 150 insert. This amplifying antenna extends around the tag antenna, outside the insert, on the intercalary layer.
插入物150,例如,具有200至300微米,例如大约250微米的厚度。
On represented in figure 22 a structure 160 corresponding to an embodiment of the invention, comprising a paper mask layer 161 on which is adhered an insert 150 as previously mentioned, for example through a layer 162 of adhesive based on a thermally activable material, for example polyurethane, of thickness ranging from 20 to 25 μm.
160 structure also comprises an intercalary layer 163 formed by a further activable adhesive film, for example a polyurethane film, featuring a window, surrounding the insert 150 and presenting a chosen thickness to compensate for that of the insert 150 and that of the underlying adhesive 162.
As illustrated on figure 23, the structure 160 may include, if we wish, a fibrous mask layer 164, this layer 164 and the mask layer 161 being sandwiched by the insert 150.
结构160,具有纤维层164,可能具有400至450微米的厚度。
图24中示出另一实施例的结构170,包括两层纤维遮盖层171和173,夹有一层间隔纤维层172,基于天然和/或合成纤维,例如通过湿法或干法获得的纤维素。
this intercalaire layer 172 comprises a window 175 for receiving an insert 150, for example as defined above.
层171-173由中间两层粘合剂174装配,例如在热可激活材料中,例如聚氨酯。
The amplifier antenna may be deposited between the inner surface of the mask layer 173 and the adhesive 174 or between the mask layer 171 and the adhesive 174 or even on the final document provided that the amplifier antenna surrounds the insert 150.
Fig. 25 illustrates another embodiment of the invention in which the mask paper layers 181 and 182 sandwich the intercalary paper layer 183.
The latter presents a window 184 capable of accommodating partially an electronic device 185.
this includes a base 186, outside window 184, sandwiched between the fibrous layer 182 and the intercalary layer 183.
不同层181-183通过包含压力敏感粘合剂187的层间结合。
可选的外层遮盖片181和182可以印刷图案。
如图26所示,遮蔽层182可以被抗粘附支撑190替代,该支撑承载电子装置185。
27. In figure 27, structure 200 without a fibrous layer, successively comprising : a masking layer 201 in plastic material, an activable hot adhesive layer 202, a plastic intercalating layer 203 having a window 204 for receiving partially an electronic device 205, an activable hot adhesive layer 206, for example, without an instant adhesion, having a window 207 for receiving a part of the electronic device 205 and containing an antenna 208 of the electronic device 205.
the structure 210 shown on figure 28 comprises: an electronic device 211,an intercalating first layer 212 with a window 213 in which the electronic device extends at least partially,an intercalating second layer 214 with thermal activation properties with a window 215 in which the electronic device extends at least partially,an intercalating third layer 216 with a window 217 in which the electronic device extends at least partially, the electronic device being housed in the cavity formed by the three windows 213, 215 and 217 assembled in a defined manner, the antenna 218 resting between the second and third intercalating layers.
The structure also comprises an additional adhesive layer 219 on the external surface of the third intercalary layer 216 to enable its application on a substrate, and an adhesive layer 220 and a masking layer 221 on the external surface of the first intercalary layer 212 to hide the part of the electronic device visible in the window.
当然,发明不限于刚刚描述的实施例。
可以将不同的实施例的特征组合在一起,这些实施例是本领域技术人员可以理解的,但是未被本发明的附图所公开。
For example, the electronic devices, such as the modules, may be in one or the other sense, i.e. head up or down, in the structures described above.
The expression “comprising a” should be understood as “comprising at least one”, unless the contrary is specified.

Claims (45)

  1. A structure (1; 23; 27; 30; 50) for fabricating a security document or a document of value, comprising:
    - an electronic device (8; 42; 60) enabling data to be exchanged without contact, the electronic device comprises a support (7) carrying an electronic chip (10) and an antenna (11), for example engraved or wired, connected to the electronic chip,
    - an inset layer (2; 33; 35; 51; 53) made at least in part out of fiber, and having a window (4; 41; 58; 59) within which the electronic device (8 ; 42 ; 60) extends, at least in part, the electronic chip (10) of the electronic device extending in the window of the inset layer.;
    - an adhesive layer (6; 6'; 24; 32; 34; 36; 52; 54) in contact with the inset layer;
    - an adjacent layer assembled with the inset layer via the adhesive layer, the adhesive presenting adhesive power and coherence that are sufficiently high so that any attempt at separating the inset layer from the adjacent layer spoils at least the inset layer, the adjacent layer being an additional inset layer, a masking layer, or the support of the electronic device,
    the adhesion between two adjacent layers of the structure being stronger than the internal cohesion of at least one of said layers.
  2. A structure according to claim 1, characterized in that the structure includes a removable anti-adhesive film for protecting the adhesive layer.
  3. A structure according to any one of previous claims, characterized in that the inset layer (2; 33; 35; 51; 53) is made entirely of fiber.
  4. A structure according to any one of previous claims, characterized in that the structure includes at least one outer fiber layer (2; 31; 37; 51; 55) for being assembled to a fiber layer of the security document or document of value.
  5. A structure according to the previous claims, characterized in that the support (7) is flexible.
  6. A structure according to any one of the two previous claims, characterized in that the support (7) is made of a polymer material selected among PET, PVC, ABS/PC, PC, PA, PI, PE, PP.
  7. A structure according to any one of claims 4 and 5, characterized in that the support (7) is a fiber layer.
  8. A structure according to any one of claims 4 and 5, characterized in that the support (7) is made of mineral material.
  9. A structure according to any one of claims 4 and 5, characterized in that the support (7) is made of epoxy glass.
  10. A structure according to any one of claims 4 to 9, characterized in that the support has a face with a coating containing an irreversible thermochromic compound.
  11. A structure according to any one of claims 4 to 10, characterized in that the support (7) is sandwiched between two layers of the structure.
  12. A structure according to any one of previous claims, characterized in that the electronic device (8 ; 42 ; 60) comprises a module with a connection portion for connection to an antenna and an electronic chip embedded in an encapsulating resin.
  13. A structure according to previous claim, characterized in that the structure includes an additional inset layer (35; 53) with a window housing the module, the encapsulating resin being housed in the window of the other inset layer.
  14. A structure according to previous claim, characterized in that the electronic device includes an antenna, and wherein the antenna is carried by said additional inset layer (35).
  15. A structure according to any one of previous claims, characterized in that the adhesive layer enables the inset layer to be assembled cold with an adjacent layer of the structure or the security document or the document of value.
  16. A structure according to claim 15, characterized in that the adhesive is a pressure-sensitive adhesive.
  17. A structure according to any one of claims 1 to 14, characterized in that the adhesive layer enables the inset layer to be assembled hot with an adjacent layer of the structure or the security document or the document of value.
  18. A structure according to claim 17, characterized in that the adhesive layer is hot-activatable.
  19. A structure according to any one of previous claims, the structure comprising two inset layers, characterized in that one of the inset layers (33, 35, 51, 53) presents internal cohesion that is less than that of the other inset layer.
  20. A structure according to any one of previous claims, including a masking layer, characterized in that the inset layer (2; 35; 51; 53) presents internal cohesion that is less than or equal to the internal cohesion of the masking layer (15; 31; 37; 55).
  21. A structure according to any one of previous claims, characterized in that the cohesion of the support (7) is less than or equal to the cohesion of the inset layer (2).
  22. A structure according to any one of previous claims, having two inset layers, characterized in that one of the inset layers includes a window (40, 58) that is smaller than the window (41, 59) of the other inset layer.
  23. A structure according to the previous claim, characterized in that the electronic device includes two portions of different widths, the portion of smaller width being received in the smaller window and the portion of greater width being received in the larger window.
  24. A structure according to the previous claim, characterized in that the inset layer with the smaller, respectively with the larger, window presents thickness substantially equal to that of the portion of the electronic device having the smaller, respectively the greater, width.
  25. A structure according to any one of claims 22 to 24, characterized in that the electronic device includes an antenna disposed between the two inset layers.
  26. A structure according to any one of claims 22 to 25, characterized in that the electronic device includes an antenna disposed on the portion of greater width.
  27. A structure according to any one of claims 22 to 26, characterized in that the structure does not include pressure-sensitive adhesive between the two inset layers.
  28. A structure according to claim 1, characterized in that the structure includes two adhesive layers (15) on its opposite faces, eventually each one being covered by a removable anti-adhesive film.
  29. A structure according to any one of previous claims, characterized in that the electronic device is a RFID device.
  30. A security document or a document of value (20; 25; 25'; 28; 39; 70) including a structure as defined in any one of previous claims.
  31. A document according to claim 30, constituting an identity document, a visa label, or a passport booklet.
  32. A document according to any one of claims 30 and 31, characterized in that the structure is sandwiched between two fiber layers, especially in paper.
  33. A process for fabricating a structure according to any one of claims 1 to 29, the process comprising the steps of:
    - supplying the electronic device (8; 42; 60) enabling data to be exchanged without contact;
    - supplying the inset layer (2; 33; 35; 51; 53) with the window (4; 40; 41; 58; 59);
    - placing on the inset layer the adhesive layer enabling the inset layer to be assembled with an adjacent layer of the structure or of the security document or document of value,
    - placing the electronic device at least in part in the window in the inset layer.
  34. A process according to the previous claim, characterized by the fact that it includes the following steps:
    - depositing the adhesive layer (6; 6'; 24; 32; 36;52; 54) on the inset layer (2; 33; 35; 51; 53); and
    - making a window in the assembly constituted by the inset layer and the adhesive layer, in particular with the help of a die or a laser.
  35. A process according to any one of the two previous claims, characterized by the fact that it includes the following steps:
    - providing an adhesive layer in the form of a film for transfer, said adhesive layer initially being covered in at least one anti-adhesive film, and in particular by two anti-adhesive films each on a respective face of the adhesive layer;
    - removing the anti-adhesive film from the adhesive layer;
    - assembling the adhesive layer with the inset layer.
  36. A process according to any one of the claims 34 and 35, characterized by the fact that it includes the following steps:
    - depositing an adhesive in liquid form on the inset layer or on an optional masking layer so as to form an adhesive layer; and
    - optionally covering the adhesive layer as formed in this way in an anti-adhesive film.
  37. A process according to any one of the claims 33 to 36, characterized by the fact that it includes the following steps:
    - supplying two inset layers (33; 35; 51; 53);
    - separately forming at least one window in each of the inset layers; and
    - depositing an adhesive layer on each of the inset layers.
  38. A process according to any one of the claims 33 and 36, characterized by the fact that it includes the following step:
    - bonding the various layers of the structure together by cold or hot-lamination.
  39. A process of making a security document or a document of value (20; 25; 25'; 28; 39; 70), characterized by the fact that it comprises the following steps:
    - providing a structure as defined in any one of claims 1 to 29, said structure being preassembled;
    - assembling said structure with the security document or document of value.
  40. A process according to the previous claim, characterized by the fact that it includes the following step:
    - bonding together the structure and a layer of the security document or the document of value by cold or hot-lamination.
  41. A process according to any one of the claims 34 and 40, characterized by the fact that it includes the following steps:
    - depositing an adhesive layer on the structure and/or a layer of the security document or document of value;
    - assembling the structure together with the security document or document of value with the help of the adhesive layer.
  42. A process according to any one of claims 39 and 41, characterized by the fact that it includes the following steps:
    - treating an outside surface of the structure in such a manner as to make it adhesive and optionally covering it temporarily in an anti-adhesive film;
    - assembling the structure with the security document or document of value by putting the treated face of the structure into contact with the document.
  43. A process according to any one of claims 39 and 42, including the following step:
    - sewing the structure to at least one sheet or layer of the security document or document of value.
  44. A process according to any one of claims 39 to 43, characterized by the fact that it includes the following steps:
    - making a security print and/or depositing a security element on a layer of the document prior to assembling the document with the structure; and
    - assembling the structure with said layer of the document.
  45. A process according to any one of claims 39 to 44, characterized by the fact that it includes the following steps:
    - assembling the structure with a layer of the document;
    - then making a security print or depositing a security element on said layer of the document.
HK07107957.9A 2004-04-14 2005-04-14 Structure comprising an electronic device particularly for the production of a security or value document HK1103825B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0403908 2004-04-14

Publications (2)

Publication Number Publication Date
HK1103825A true HK1103825A (en) 2007-12-28
HK1103825B HK1103825B (en) 2018-10-19

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