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ID18031A - Sistem pengeringan dengan pemanasan uap - Google Patents

Sistem pengeringan dengan pemanasan uap

Info

Publication number
ID18031A
ID18031A IDP972859A ID972859A ID18031A ID 18031 A ID18031 A ID 18031A ID P972859 A IDP972859 A ID P972859A ID 972859 A ID972859 A ID 972859A ID 18031 A ID18031 A ID 18031A
Authority
ID
Indonesia
Prior art keywords
drying system
steam heating
steam
heating
drying
Prior art date
Application number
IDP972859A
Other languages
English (en)
Inventor
Robert H Clark
Anthony K Green
Stevens A Sykes
Original Assignee
Forward Technology Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forward Technology Ind Inc filed Critical Forward Technology Ind Inc
Publication of ID18031A publication Critical patent/ID18031A/id

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microbiology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
IDP972859A 1996-08-16 1997-08-15 Sistem pengeringan dengan pemanasan uap ID18031A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2368696P 1996-08-16 1996-08-16

Publications (1)

Publication Number Publication Date
ID18031A true ID18031A (id) 1998-02-19

Family

ID=21816607

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP972859A ID18031A (id) 1996-08-16 1997-08-15 Sistem pengeringan dengan pemanasan uap

Country Status (6)

Country Link
JP (1) JP3896164B2 (id)
KR (1) KR100492026B1 (id)
ID (1) ID18031A (id)
MY (1) MY121614A (id)
TW (1) TW413725B (id)
WO (1) WO1998006889A2 (id)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368183B1 (en) * 1999-02-03 2002-04-09 Speedfam-Ipec Corporation Wafer cleaning apparatus and associated wafer processing methods
US6620723B1 (en) 2000-06-27 2003-09-16 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US6551929B1 (en) 2000-06-28 2003-04-22 Applied Materials, Inc. Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US6765178B2 (en) 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6734020B2 (en) 2001-03-07 2004-05-11 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6998014B2 (en) 2002-01-26 2006-02-14 Applied Materials, Inc. Apparatus and method for plasma assisted deposition
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6833161B2 (en) 2002-02-26 2004-12-21 Applied Materials, Inc. Cyclical deposition of tungsten nitride for metal oxide gate electrode
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US6846516B2 (en) 2002-04-08 2005-01-25 Applied Materials, Inc. Multiple precursor cyclical deposition system
US6875271B2 (en) 2002-04-09 2005-04-05 Applied Materials, Inc. Simultaneous cyclical deposition in different processing regions
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
KR20060079144A (ko) 2003-06-18 2006-07-05 어플라이드 머티어리얼스, 인코포레이티드 배리어 물질의 원자층 증착
JP2007152231A (ja) * 2005-12-05 2007-06-21 Nidec Sankyo Corp 洗浄装置
EP1967803B1 (en) 2006-05-18 2016-09-28 FUJIFILM Corporation Method for drying a coated film
JP2011073211A (ja) 2009-09-29 2011-04-14 Fujifilm Corp 平版印刷版原版の製造方法
JP5366324B2 (ja) 2010-03-03 2013-12-11 富士フイルム株式会社 平版印刷版の製造方法及び製造装置
CN102641859A (zh) * 2012-05-07 2012-08-22 江苏合海机械制造有限公司 一种工件步进循环自动清洗机
KR101554006B1 (ko) 2013-05-27 2015-09-17 (주) 나인테크 과열증기 건조장치
CN108062990B (zh) * 2018-01-11 2024-06-07 航天晨光股份有限公司 一种放射性废液结晶干燥系统及其方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5371950A (en) * 1990-02-23 1994-12-13 S & K Products International, Inc. Isopropyl alcohol vapor dryer system
US5085238A (en) * 1991-03-04 1992-02-04 Branson Ultrasonics Corporation Vapor degreasing apparatus

Also Published As

Publication number Publication date
MY121614A (en) 2006-02-28
KR100492026B1 (ko) 2005-05-31
JP2000516334A (ja) 2000-12-05
WO1998006889A3 (en) 1998-07-02
TW413725B (en) 2000-12-01
JP3896164B2 (ja) 2007-03-22
KR20000030012A (ko) 2000-05-25
WO1998006889A2 (en) 1998-02-19

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