JP2000003973A - Package for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component package which is cheap and excellent in workability in a sealing operation. SOLUTION: A lid 202 is composed of a metal plate 203 and a metal brazing material 204 which is provided, at least, to the one side of the metal plate 203 for cladding. A metallized part 201 is provided in the peripheral frame of a ceramic vessel 100, and an electronic component 104 is mounted in a recessed part. The lid 202 is mounted on the ceramic vessel 100 making the metal brazing material 204 confront the metallized part 201 so as to stop up the opening of the ceramic vessel 100. A pulsating electric power is applied between a pair of roller electrodes which rotate along the opposed edges of the lid 202 to fix the lid 2 to the ceramic vessel 100, whereby a package of this constitution can be hermetically sealed up without using an expensive covering used for conventional seam sealing and a vacuum chamber used for electron beam sealing, so that an electronic component package which is cheap and excellent in production efficiency can be provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component package, and more particularly to an electronic component package having a package lid provided with a metal brazing material.

[0002]

2. Description of the Related Art In recent years, mobile communication devices have been reduced in size and price, and electronic components including piezoelectric components such as piezoelectric vibrators and SAW filters have also been reduced in size and cost. The demand for is increasing. In order to keep the frequency stability of the piezoelectric component highly stable, such a package for a piezoelectric component is generally sealed in a high vacuum state or a state in which an inert gas is filled. Normally, sealing in which the package is in a high vacuum state can provide a piezoelectric component having extremely high frequency stability because there are few foreign substances such as gas adhering to the surface of the piezoelectric element, but sealing in a vacuum chamber. There is a drawback that productivity is poor because of the work.
That is, since the vacuum chamber is completely closed during the sealing operation, it is impossible to carry the package into and out of the chamber at the time of sealing. Therefore, when many packages are sealed, a new package must be carried into the chamber after one sealing, and the inside of the chamber must be brought into a high vacuum state again, which requires many steps and time. Was. On the other hand, a piezoelectric component filled with inert gas cannot achieve extremely high frequency stability, but the sealing operation is performed in a container filled with inert gas, and the package is loaded and unloaded into and out of the container. Is performed through a pass box provided at a position adjacent to the container so that the concentration of the inert gas in the container does not drop sharply. Character can be obtained. Accordingly, sealing in a high vacuum state is used for expensive piezoelectric components requiring extremely high frequency stability, and sealing with an inert gas is used for piezoelectric components requiring low cost. Note that the pass box is a container used to carry an object from outside air into a working container for performing a sealing operation.The pass box filled with the object to be carried into the working container is filled with an inert gas. Then, by carrying the object into the working container, the article can be freely carried in without lowering the concentration of the inert gas in the working container. In order to keep the inside of the package container in a high vacuum or inert gas sealed state, the metal lid and the container are usually joined by a seam welding method.

FIG. 3 shows the state of conventional seam welding. Sealing by seam welding is performed for ceramic container 100
The Kovar ring 101 and the metal lid 102 which are brazed to each other are overlapped, and a pair of roller electrodes 103 are pressed and energized along opposing ends of the lid 102 to form a joint between the lid 102 and the Kovar ring 101. Joule heat is continuously generated, whereby the lid 102 and the Kovar ring 101 are continuously spot-welded and sealed. The electronic component 104 shown in the figure is mounted in a recess of the ceramic container 100 and is electrically connected to a circuit wiring pattern provided on the ceramic container 100 by a metal wire or the like. Although the package sealed in such a manner is excellent in airtightness, since the expensive Kovar ring 101 is used for performing the seam sealing, there is a problem that a cost of an electronic component is increased, and There is also a disadvantage that cracks occur in the ceramic container 100 due to high temperature Joule heat generated at the joint. The problem of cracks occurring in the ceramic container 100 is improved by preventing the ceramic container 100 from being rapidly and heated to a high temperature, for example, by increasing the thickness of kovaring. There has been a problem that it is impossible to reduce the height of components, that is, to reduce the size.

FIG. 4 is a sectional view showing another conventional package sealing method capable of reducing the height of a piezoelectric component. FIG.
1 shows an exploded configuration view of the package, and FIG. 1B shows a sectional view at the time of assembly. The electronic component package shown in FIG. 8 includes a ceramic container 100 in which an electronic component 104 is mounted and a metal lid 202 similarly to the package shown in FIG. 4 described above. Further, the ceramic container 100 has a structure in which a metallized portion 201 is provided on the outer peripheral frame. The metallized portion 201 has a structure in which the surface of a metal film such as tungsten or molybdenum is plated with nickel or gold. The lid 202 includes a metal plate 203 having the same shape as the opening of the ceramic container 100, and a metal brazing material 204 clad on one side of the metal plate 203. For example, as the metal plate 203, an iron-based alloy is used, and the metal brazing material 204 is used.
Uses a metal material such as a silver alloy or an aluminum alloy. First, as shown in FIG. 2B, the surface of the lid 202 on which the metal brazing material 204 is adhered comes into contact with the metallized portion 201 on the outer peripheral frame of the ceramic container 100, and the opening of the ceramic container 100 is sealed. Arrange to stop. Then, the ceramic container 100 is placed from above the lid 202.
By irradiating the outer periphery with an electron beam to dissolve the metal brazing material, the lid 202 and the metallized portion 201 of the ceramic container 100 are welded to seal the electronic component package.

[0005]

However, since it is necessary to perform electron beam irradiation in a vacuum as is well known, the irradiation is performed in a vacuum chamber, whereby the package is sealed in a high vacuum state. Is stopped. Therefore, as described above, vacuum sealing has low productivity, so that it is impossible to reduce the cost of piezoelectric components. That is, there has been a problem that the demand for a low-profile piezoelectric component requiring a low price cannot be achieved by the sealing method using an electron beam.

[0006]

According to a first aspect of the present invention, there is provided a package for an electronic component comprising a metal lid and a ceramic container. At least one peripheral edge of the lid is provided with a clad metal brazing material or a metal layer provided with metal plating on the surface of the metal brazing material, and the ceramic container is used for housing electronic components. The recessed portion has a metallized portion on the upper surface of the frame of the ceramic container, the lid is overlapped so that the surface of the brazing metal contacts the metallized portion of the ceramic container, and both are fixed by seam welding. Features.

[0007]

FIG. 1 shows a structure of an electronic component package according to an embodiment of the present invention. The lid 202 shown in the figure is a metal plate 2 of an iron-nickel-cobalt alloy.
03 has a liquidus temperature of 183 ° C.
A metal brazing material 2 clad with a silver alloy, a gold alloy, or another metal alloy having a temperature range of 957 ° C.
04 layers are provided. The cladding of the metal plate 203 and the metal brazing material 204 can be performed by joining two metal plates by rolling. In addition, an electronic component 104 is mounted in a recessed portion of the ceramic container 100 shown in the figure, and further, for example, tungsten or molybdenum plated with nickel or gold is provided on an outer peripheral frame of the ceramic container 100. A metallizing unit 201 is provided. A major difference between the present invention and the package shown in FIG. 4 lies in that sealing is performed using a seam welding method instead of using an electron beam welding method at the time of sealing.
That is, as shown in FIG. 1, the metallized portion 201 and the metal brazing material 204 are overlapped, and a pair of roller electrodes 103 are pressed and energized along opposing ends of the lid 202 to form a contact with the metallized portion 201. Metal brazing material 204
Are continuously spot-welded to keep the inside of the package airtight. Further, the metal brazing material has a lower melting point temperature as compared with Kovaring, so that welding at a lower temperature is possible. Therefore, even if the current supplied from the roller electrode 103 is small, it is melted, and even if the metal brazing material is thinner than Kovaring, the ceramic container 100 is not damaged by the heat generated at the time of sealing.

FIG. 2 is a side sectional view showing another embodiment of the package according to the present invention. The structure of the figure differs from that of the embodiment shown in FIG. 1 in that a metal brazing material 204 is applied to at least one surface of a metal plate 203, and furthermore, nickel or the like is applied to the surface of the metal brazing material 204, for example, when 1 is set to 0.1. 1 μm ~
This is where plating 1 was applied to a thickness of 3 μm.
If the plating 1 is applied in this manner, the metal brazing material 20 can be used at the time of sealing.
It is possible to prevent the waste of the metal brazing material generated when 4 is melted from scattering on the surface of the electronic component and causing the electrical characteristics of the electronic component to be defective. That is, metal brazing material 2
04 melts the metal brazing material 204 and the flux contained in the metal brazing material 204 upon melting, and disperses the metal brazing material scattered by the force of the vaporized gas by a plating film having a melting point higher than that of the metal brazing material. As a result, it is possible to prevent a short circuit in the circuit of the electronic component due to adhesion of the metal brazing material to the surface of the electronic component. In addition, the lid 2
When the size of the ceramic container 100 is smaller than the outer circumference of the ceramic container 100 by, for example, about 0.1 mm to 0.05 mm, a fillet made of a metal brazing material is easily formed on the outer peripheral edge of the lid 202 after sealing, and the sealing strength is further improved. Needless to say, this is obtained. Although the embodiment of the present invention has been described using the configuration in which the metal brazing material is provided on one surface of the lid, the present invention is not limited to this, even when the metal brazing material is provided on both surfaces of the lid, A function equivalent to that of the package structure of FIG. 1 is obtained, and furthermore, the sealing can be performed without checking the metal brazing material surface of the lid during the sealing operation.

[0009]

As described above, according to the first aspect of the present invention, since the metal brazing material provided on the surface of the lid and the recessed container is seam-welded, a vacuum chamber is required. In addition, since sealing can be performed in a short time, there is an effect that it is possible to achieve a reduction in the price of electronic components with an improvement in productivity. In addition, the package for an electronic component according to the present invention does not require a heating time as compared with soldering for heating the entire component, so that the productivity is excellent and the cost of the electronic component can be reduced, and the heating of only the sealed portion is achieved. Because
There is no thermal shock to the electronic component, which also provides an effect that an electronic component having excellent long-term stability of electrical characteristics can be obtained.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing one embodiment of an electronic component package sealing method according to the present invention.

FIG. 2 is a side sectional view of another embodiment of the electronic component package sealing method according to the present invention.

FIG. 3 is a diagram illustrating a conventional seam sealing step.

FIG. 4 is a side sectional structural view of a conventional electronic component package by electron beam sealing. (a) is an exploded configuration diagram. (B) It is a side sectional view.

[Explanation of symbols]

1 metal plating, 100 ceramic container, 101 kovaring, 102 lid, 103 roller electrode, 104 electronic components,
201 metallized part, 202 lid, 203 metal plate, 204
Metal brazing material

Claims (1)

[Claims] An electronic component package comprising a metal lid and a ceramic container, wherein at least one peripheral edge of the lid is provided with a clad metal brazing material or a metal plating on the surface of the metal brazing material. The provided metal layer is provided,
Further, the ceramic container has a concave portion for accommodating an electronic component and a metallized portion on a top surface of the frame of the ceramic container, and the lid is made such that the surface of the metal brazing material contacts the metallized portion of the ceramic container. A package for electronic parts, wherein the two parts are overlapped and fixed by seam welding.