JP2000010507A - Light emitting display device and its production - Google Patents
Light emitting display device and its productionInfo
- Publication number
- JP2000010507A JP2000010507A JP10171595A JP17159598A JP2000010507A JP 2000010507 A JP2000010507 A JP 2000010507A JP 10171595 A JP10171595 A JP 10171595A JP 17159598 A JP17159598 A JP 17159598A JP 2000010507 A JP2000010507 A JP 2000010507A
- Authority
- JP
- Japan
- Prior art keywords
- display device
- light emitting
- emitting display
- reflection case
- electrode terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 238000000465 moulding Methods 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 9
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- 238000002347 injection Methods 0.000 description 10
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、インサートモー
ルド成型による細長い発光表示装置の製造時に捻れや歪
みの少ない発光表示装置の実現を可能とする発光表示装
置及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting display device capable of realizing a light-emitting display device having less twist and distortion when manufacturing an elongated light-emitting display device by insert molding, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来、複数の半導体発光素子チップを用
いた発光表示装置は、以下に説明する手順で製造されて
いた。まず、パンチプレス機等により金属薄板を打ち抜
き加工し、電極端子面、外部リード、支持枠部等を１ユ
ニットとして多数ユニットが並設されるようにリードフ
レームを形成する。次に、リードフレームを挟み込むよ
うに表裏面から金型で挟持し、この金型に溶融した樹脂
を注入して箱状の反射ケースをインサートモールド成型
する。続いて、リードフレームの電極端子面に半導体発
光素子である発光ダイオードチップ（以下、ＬＥＤチッ
プという）を各ユニット毎に載置してワイヤーボンディ
ングで配線接続する。その後、反射ケースの凹部内に透
明な樹脂を充填する。そして、成形物からリードフレー
ムの支持枠部を切除する。これにより、発光表示装置が
完成する。2. Description of the Related Art Conventionally, a light-emitting display device using a plurality of semiconductor light-emitting element chips has been manufactured according to the following procedure. First, a thin metal plate is punched by a punch press or the like, and a lead frame is formed such that a large number of units are arranged side by side, with the electrode terminal surface, external leads, support frame portion and the like as one unit. Next, the lead frame is sandwiched between the front and back surfaces by a mold, and a molten resin is injected into the mold to insert-mold a box-shaped reflection case. Subsequently, a light emitting diode chip (hereinafter, referred to as an LED chip), which is a semiconductor light emitting element, is mounted on each of the units on the electrode terminal surface of the lead frame and connected by wire bonding. Then, a transparent resin is filled in the concave portion of the reflection case. Then, the support frame of the lead frame is cut off from the molded product. Thus, the light emitting display device is completed.
【０００３】[0003]
【発明が解決しようとする課題】ところで、従来の発光
表示装置は、上述したようにインサートモールド成型に
依るリードフレームの一方の面にＬＥＤチップ等を積載
して製造するため、以下のような課題がある。As described above, the conventional light-emitting display device is manufactured by mounting an LED chip or the like on one surface of a lead frame by insert molding as described above. There is.
【０００４】１つのリードフレームに多数のＬＥＤチッ
プを整列させて使用するタイプでのインサートモールド
成型では、樹脂の射出成形後にリードフレームの面（厚
さ方向）に対し反りが生じてしまう課題がある。[0004] In the insert molding of a type in which a large number of LED chips are aligned and used on one lead frame, there is a problem that the surface (thickness direction) of the lead frame is warped after resin injection molding. .
【０００５】また、１つのリードフレームに多数のＬＥ
Ｄチップを整列載置した後に樹脂を充填させた時、充填
樹脂の硬化によりリードフレームの面（厚さ方向）に対
し反りが生じてしまう課題がある。[0005] In addition, a large number of LEs
When the resin is filled after the D chips are aligned and placed, there is a problem that the filling resin hardens and warps the surface (thickness direction) of the lead frame.
【０００６】さらに、特に細長く１つのリードフレーム
に多数のＬＥＤチップを整列載置した場合には、充填樹
脂の硬化等によりリードフレーム上に設けた電極端子と
ＬＥＤチップ間にワイヤーボンディングを施した金線等
のワイヤーが切断されていまう課題がある。Further, particularly when a large number of LED chips are aligned and mounted on a single elongated lead frame, gold bonded by wire bonding between the electrode terminals provided on the lead frame and the LED chips by curing of a filling resin or the like. There is a problem that wires such as wires are cut.
【０００７】また、生産性を上げるために射出樹脂温度
や射出圧力等を高めに設定して操業するために、よりリ
ードフレームの面（厚さ方向）に対し反りが生じてしま
う課題がある。In addition, since the operation is performed with the injection resin temperature, the injection pressure and the like set at a high level in order to increase the productivity, there is a problem that the warp is more likely to occur on the surface (thickness direction) of the lead frame.
【０００８】そこで、本発明は、上記問題点に鑑みてな
されたものであり、成形時における熱応力、機械的応力
を吸収でき、部分箇所への集中応力を分散、緩和するこ
とができる発光表示装置及びその製造方法を提供するこ
とを目的としている。In view of the above, the present invention has been made in view of the above problems, and a light emitting display capable of absorbing thermal stress and mechanical stress at the time of molding and dispersing and relaxing a concentrated stress on a portion. It is an object to provide an apparatus and a method for manufacturing the same.
【０００９】[0009]
【課題を解決するための手段】次に、上記の課題を解決
するための手段を、実施の形態に対応する図面を参照し
て説明する。請求項１の発明は、金属薄板からなるリー
ドフレーム２の一方の面に複数の半導体発光素子チップ
８が所定間隔で載置されて配線接続される電極端子面２
ｃが形成され、前記電極端子面２ｃに載置された前記半
導体発光素子チップ８のそれぞれが露出するように連続
形成された溝部４を有する箱状の反射ケース３が前記リ
ードフレーム２の表裏面からインサートモールド成型さ
れ、該反射ケース３の前記溝部４に透明樹脂が充填され
た発光表示装置１において、前記反射ケース３は、前記
半導体発光素子チップ８の各位置における前記溝部４の
外周縁部分に対向して円弧状に突出した突起６（６ａ，
６ｂ）を有し、かつ前記突起６ａ，６ｂ間の位置に対応
する底面部３ｂに切欠部７を設けて成形されることを特
徴とする。Next, means for solving the above problems will be described with reference to the drawings corresponding to the embodiments. According to the first aspect of the present invention, a plurality of semiconductor light emitting element chips 8 are mounted on one surface of a lead frame 2 made of a thin metal plate at predetermined intervals and are connected by wiring.
c is formed, and the box-shaped reflection case 3 having the groove 4 continuously formed so as to expose each of the semiconductor light emitting element chips 8 mounted on the electrode terminal surface 2 c is formed on the front and back surfaces of the lead frame 2. In the light emitting display device 1 in which the groove 4 of the reflective case 3 is filled with a transparent resin, the reflective case 3 has an outer peripheral portion of the groove 4 at each position of the semiconductor light emitting element chip 8. The protrusion 6 (6a, 6a,
6b) and is formed by providing a notch 7 in the bottom surface 3b corresponding to the position between the protrusions 6a and 6b.
【００１０】請求項１に係る発光表示装置によれば、半
導体発光素子チップ８の各位置における溝部４の外周縁
部分に対向して円弧状に突出した突起６（６ａ，６ｂ）
を有し、かつ突起６ａ，６ｂ間の位置に対応する底面部
３ｂに切欠部７を設けて反射ケース３が成形されるの
で、熱応力や機械的応力を吸収できる。According to the light emitting display device of the first aspect, the projections 6 (6a, 6b) projecting in an arc shape facing the outer peripheral edge portion of the groove portion 4 at each position of the semiconductor light emitting element chip 8.
And the notch 7 is formed in the bottom surface 3b corresponding to the position between the protrusions 6a and 6b, so that the reflection case 3 is molded, so that thermal stress and mechanical stress can be absorbed.
【００１１】請求項２の発明は、請求項１の発光表示装
置１において、切欠部７を円弧状の突起６の数から１つ
減した数とすることを特徴とする。According to a second aspect of the present invention, in the light emitting display device 1 of the first aspect, the number of the cutout portions 7 is reduced by one from the number of the arc-shaped protrusions 6.
【００１２】請求項２に係る発光表示装置によれば、切
欠部７を反射ケース３の前面部３ａに形成した円弧状の
突起６から１つ減した数とするので、切欠き干渉による
集中応力の分散ができる。According to the second aspect of the present invention, since the number of the notch portions is one less than the number of the arc-shaped protrusions 6 formed on the front surface portion 3a of the reflection case 3, the concentrated stress due to the notch interference. Can be dispersed.
【００１３】請求項３の発明は、請求項１の発光表示装
置１において、前記切欠部７は、前記電極端子面２ｃの
中央の位置に載置される半導体発光素子チップ８を中心
として対称に位置して形成されていることを特徴とす
る。According to a third aspect of the present invention, in the light emitting display device 1 of the first aspect, the cutout portion 7 is symmetrical with respect to a semiconductor light emitting element chip 8 mounted at a center position of the electrode terminal surface 2c. It is characterized by being formed in a position.
【００１４】請求項３に係る発光表示装置によれば、電
極端子面２ｃの中央の位置に載置される半導体発光素子
チップ８を中心として対称に位置して切欠部７を形成す
るので、樹脂の射出時に於ける熱応力を切欠部７により
均等に分散させることができる。According to the light emitting display device of the third aspect, the notch portion 7 is formed symmetrically with respect to the semiconductor light emitting element chip 8 mounted at the center position of the electrode terminal surface 2c. The thermal stress at the time of injection can be evenly distributed by the cutouts 7.
【００１５】請求項４の発明は、請求項１〜３のいずれ
かの発光表示装置１において、切欠部７が矩形または円
弧状からなり、前記円弧状の突起６部分の体積の５５〜
７０％の体積比となることを特徴とする。According to a fourth aspect of the present invention, in the light emitting display device 1 according to any one of the first to third aspects, the notch 7 is formed in a rectangular or arc shape, and the volume of the arc-shaped protrusion 6 is 55 to 55.
The volume ratio is 70%.
【００１６】請求項４に係る発光表示装置によれば、切
欠部７を矩形または円弧状とし、円弧状の突起６部分の
体積を５５〜７０％の体積比としたので、部分箇所への
集中応力を緩和することができる。According to the light emitting display device of the fourth aspect, the notch 7 is rectangular or arc-shaped, and the volume of the arc-shaped projection 6 is 55 to 70% in volume ratio. Stress can be relieved.
【００１７】請求項５の発明は、金属薄板からなるリー
ドフレーム２の一方の面に複数の半導体発光素子チップ
８が所定間隔で載置されて配線接続される電極端子面２
ｃを形成し、前記リードフレーム２の表裏面から反射性
樹脂のインサートモールド成型により前記電極端子面２
ｃに載置された前記半導体発光素子チップ８のそれぞれ
が露出するように連続形成された溝部４を有する箱状の
反射ケース３を形成し、該反射ケース３の前記溝部４に
透明樹脂を充填する発光表示装置１の製造方法におい
て、前記半導体素子チップ８の各位置における前記溝部
４の外周縁部分に対向して円弧状に突出した突起６（６
ａ，６ｂ）が形成され、かつ前記突起６ａ，６ｂ間の位
置に対面する底面部３ｂに切欠部７が形成されるように
前記反射ケース３をインサートモールド成型する工程を
含むことを特徴とする。According to a fifth aspect of the present invention, a plurality of semiconductor light emitting element chips 8 are mounted on one surface of a lead frame 2 made of a thin metal plate at predetermined intervals and are connected by wiring.
c is formed, and the electrode terminal surface 2 is formed from the front and back surfaces of the lead frame 2 by insert molding of a reflective resin.
forming a box-shaped reflective case 3 having a groove 4 continuously formed so that each of the semiconductor light emitting element chips 8 placed on the reflective light-emitting device 8 is exposed, and filling the groove 4 of the reflective case 3 with a transparent resin; In the manufacturing method of the light emitting display device 1 described above, the protrusion 6 (6) protruding in an arc shape facing the outer peripheral edge portion of the groove 4 at each position of the semiconductor element chip 8
a, 6b), and a step of insert-molding the reflection case 3 so that the notch 7 is formed in the bottom surface 3b facing the position between the protrusions 6a, 6b. .
【００１８】請求項５に係る発光表示装置によれば、半
導体素子チップ８の各位置における溝部４の外周縁部分
に対向して円弧状に突出した突起６（６ａ，６ｂ）が形
成され、かつ突起６ａ，６ｂ間の位置に対面する底面部
３ｂに切欠部７が形成されるように反射ケース３をイン
サートモールド成型するので、反射ケースに形成された
切欠部により熱応力や機械的応力を吸収でき、インサー
トモールド成型時や透明樹脂充填時に反りや曲がりを防
止できる。According to the light emitting display device of the fifth aspect, the projections 6 (6a, 6b) protruding in an arc shape are formed facing the outer peripheral edge of the groove portion 4 at each position of the semiconductor element chip 8, and Since the reflective case 3 is insert-molded so that the notch 7 is formed in the bottom portion 3b facing the position between the projections 6a and 6b, the notch formed in the reflective case absorbs thermal stress and mechanical stress. It is possible to prevent warpage or bending during insert molding or filling with a transparent resin.
【００１９】[0019]
【発明の実施の形態】以下、本発明の実施の形態を添付
図面に基づいて説明する。本発明は、複数のＬＥＤチッ
プを用いる発光表示装置に関し、ＬＥＤチップ間の位置
に対面する反射ケースの底面部に矩形や円弧状の切欠部
を設けることにより、インサートモールド成型時に於け
る反りや曲がりを防いでいる。Embodiments of the present invention will be described below with reference to the accompanying drawings. The present invention relates to a light-emitting display device using a plurality of LED chips, and by providing a rectangular or arc-shaped notch on the bottom surface of a reflection case facing a position between the LED chips, warpage or bending during insert molding. Is preventing.
【００２０】図１（ａ）は、本発明に係る発光表示装置
の平面図、図１（ｂ）は、図１（ａ）の側面図、図２
（ａ）はリードフレームに多数ユニットが並設された状
態を示す平面図、図２（ｂ）は図２（ａ）の側面図、図
３は図２（ａ）の底面図である。FIG. 1A is a plan view of a light emitting display device according to the present invention, FIG. 1B is a side view of FIG.
2A is a plan view showing a state in which many units are arranged side by side on a lead frame, FIG. 2B is a side view of FIG. 2A, and FIG. 3 is a bottom view of FIG. 2A.
【００２１】図１（ａ），（ｂ）に示すように、発光表
示装置１は、金属薄板からなるリードフレーム２を面対
称にして、その表裏面から金型を挟持し、金型への溶融
した樹脂の注入によるインサートモールド成型で形成さ
れた細長箱形状の反射ケース３を有している。As shown in FIGS. 1 (a) and 1 (b), the light emitting display device 1 has a lead frame 2 made of a thin metal plate in plane symmetry, and holds a mold from the front and back surfaces thereof. It has an elongated box-shaped reflection case 3 formed by insert molding by injection of molten resin.
【００２２】図２（ａ），（ｂ）及び図３に示すよう
に、リードフレーム２は、導電性及び弾性力のある燐青
銅やアルミニウム等の金属薄板からなり、外部リード２
ａ、支持枠部２ｂ、電極端子面２ｃ等を有し、これらを
１ユニットとして、多数ユニットが並設して連結される
ようにパンチプレス機等の打ち抜き加工により形成され
ている。As shown in FIGS. 2A, 2B and 3, the lead frame 2 is made of a thin metal plate such as phosphor bronze or aluminum having conductivity and elasticity.
a, a support frame portion 2b, an electrode terminal surface 2c, and the like. These are formed as one unit by punching using a punch press or the like so that a number of units are connected side by side.
【００２３】外部リード２ａは、発光表示装置１への電
源の供給や取付等に用いるリードであり、最終的にはこ
の部分のみが露出する金属部分で、他の部分は切断除去
される。The external lead 2a is a lead used for supplying power to the light-emitting display device 1 and attaching it to the light-emitting display device 1. The external lead 2a is a metal portion where only this portion is finally exposed, and the other portions are cut and removed.
【００２４】支持枠部２ｂは、反射ケース３のインサー
トモールド成型、ＬＥＤチップ８のボンディング、ワイ
ヤー９のボンディング及び透明樹脂の充填等の工程を経
て発光表示装置１が完成するまで全体のフレームに保持
し、最終的には切断除去されるものである。支持枠部２
ｂは、特に、電極端子面２ｃに載置されるＬＥＤチップ
８が多く、外部リード２ａの間隔が広く細長い場合など
機械的変形を起こさないために重要な部材である。The supporting frame portion 2b is held on the entire frame until the light emitting display device 1 is completed through processes such as insert molding of the reflective case 3, bonding of the LED chip 8, bonding of the wire 9, and filling of the transparent resin. Then, it is finally cut and removed. Support frame 2
b is an important member to prevent mechanical deformation such as when many LED chips 8 are mounted on the electrode terminal surfaces 2c and the distance between the external leads 2a is wide and thin.
【００２５】電極端子面２ｃは、予め電気的極性を定
め、ＬＥＤチップ８の載置及びＬＥＤチップ８を直列又
は並列接続するための配線を具している。電極端子面２
ｃには、反射ケース３のインサートモールド成型後に、
ＬＥＤチップ８がダイボンダで載置される。そして、フ
ィラを樹脂に分散させた銀ペースト等を恒温槽や炉等で
例えば１５０℃で硬化させた後、ＬＥＤチップ８と電極
端子面２ｃとの間にワイヤーボンディングし、ＬＥＤチ
ップ８の電気的接続が行われる。The electrode terminal surface 2c is provided with wiring for mounting the LED chips 8 and connecting the LED chips 8 in series or in parallel, with the electrical polarity being determined in advance. Electrode terminal surface 2
c, after insert molding of the reflective case 3,
The LED chip 8 is mounted on the die bonder. Then, after a silver paste or the like in which the filler is dispersed in a resin is cured at, for example, 150 ° C. in a constant temperature bath or a furnace, wire bonding is performed between the LED chip 8 and the electrode terminal surface 2c, and the electrical The connection is made.
【００２６】樹脂成形部である反射ケース３は、変成ポ
リアミド、ポリブチレンテレフタレート、ナイロン４６
や芳香族系ポリエステル等からなる液晶ポリマなどの絶
縁性の有る材料に、光の反射性を良くするとともに遮光
性を得るためにチタン酸バリウム等の白色粉体を混入さ
せたものを、融点よりやや高め例えば３２０℃に加熱し
圧力を加え例えば８００Ｋｇ／ｃｍ2 で射出して成形さ
れる。The reflection case 3 which is a resin molded part is made of modified polyamide, polybutylene terephthalate, nylon 46
A material obtained by mixing a white powder such as barium titanate with an insulating material such as a liquid crystal polymer composed of It is heated slightly to, for example, 320 ° C., pressurized, and injected at, for example, 800 kg / cm 2 to be molded.
【００２７】反射ケース３は、リードフレーム２を面対
称として、電極端子面２ｃの形成された一方の面（表
面）側に前面部３ａが形成され、他方の面（裏面）側に
底面部３ｂが形成されたものである。The reflection case 3 has a front surface portion 3a formed on one surface (front surface) on which the electrode terminal surface 2c is formed, and a bottom surface portion 3b formed on the other surface (rear surface) side, with the lead frame 2 being plane-symmetric. Is formed.
【００２８】反射ケース３の前面部３ａは、リードフレ
ーム２を挟んで底面部３ｂと一体化成形される。前面部
３ａは、光の反射性と遮光性を得る目的のため、例えば
チタン酸バリウム等の白色粉体を混入させた変成ポリア
ミド等の絶縁性の有る材料を金型に射出した樹脂成形か
ら成形される。The front part 3a of the reflection case 3 is formed integrally with the bottom part 3b with the lead frame 2 interposed therebetween. For the purpose of obtaining light reflectivity and light shielding properties, the front surface portion 3a is formed by resin molding in which an insulating material such as denatured polyamide mixed with white powder such as barium titanate is injected into a mold. Is done.
【００２９】前面部３ａには、ＬＥＤチップ８が載置さ
れる電極端子面２ｃが表出するように、細長方形状の溝
部４が電極端子面２ｃに向かって開口されている。溝部
４内には、ＬＥＤチップ８と電極端子面２ｃ間の電気的
接続が行われた状態で、電気的および光学的に優れたエ
ポキシ樹脂等の透明樹脂が充填される。この透明樹脂の
充填は、電極端子面２ｃに載置したＬＥＤチップ８、電
極端子面２ｃ及びボンディングワイヤー９を保護すると
ともに、後述する円弧状の突起によりレンズ面を形成す
るためになされる。On the front surface 3a, a narrow rectangular groove 4 is opened toward the electrode terminal surface 2c so that the electrode terminal surface 2c on which the LED chip 8 is mounted is exposed. The groove 4 is filled with a transparent resin such as an epoxy resin which is excellent in electrical and optical properties in a state where the LED chip 8 and the electrode terminal surface 2c are electrically connected. The filling of the transparent resin is performed to protect the LED chip 8 placed on the electrode terminal surface 2c, the electrode terminal surface 2c, and the bonding wire 9, and to form a lens surface by arc-shaped projections described later.
【００３０】溝部４の縁部分には堰部５が一体形成され
ている。堰部５は、溝部４内にエポキシ樹脂等の透明樹
脂を充填する時や透明樹脂の例えば恒温槽や炉等で１２
０℃で硬化させた時に溝部４内から外部への漏れを防ぐ
目的で形成される。特に、溝部４内に充填される透明樹
脂内部の気泡等の発生を防ぐため、透明樹脂の粘性度を
低下させて気泡を追放する際の熱膨張により体積増加し
たときに、堰部５が効果的に作用する。A weir 5 is formed integrally with the edge of the groove 4. The weir portion 5 is formed when the groove portion 4 is filled with a transparent resin such as an epoxy resin or when a transparent resin such as a thermostat or furnace is used.
It is formed for the purpose of preventing leakage from inside the groove 4 to the outside when cured at 0 ° C. In particular, in order to prevent the generation of air bubbles and the like inside the transparent resin filled in the groove portion 4, when the volume increases due to thermal expansion when the viscosity of the transparent resin is reduced and the air bubbles are expelled, the weir portion 5 is effective. Acts in a way.
【００３１】前面部３ａの外縁部分には、電極端子面２
ｃに載置される各ＬＥＤチップ８を挟んで対向するよう
に、前面部３ａの表面からほぼ垂直に突出して一対の円
弧状突起６（６ａ，６ｂ）が一体形成されている。この
円弧状の突起６ａ，６ｂは、ＬＥＤチップ（光源）８か
らの光を遮断するとともに内側での反射により輝度の向
上を図っている。An electrode terminal surface 2 is provided on the outer edge of the front portion 3a.
A pair of arc-shaped projections 6 (6a, 6b) protruding substantially perpendicularly from the surface of the front surface portion 3a so as to face each other with the respective LED chips 8 mounted on the pair c interposed therebetween. The arc-shaped projections 6a and 6b block the light from the LED chip (light source) 8 and improve the luminance by reflection inside.
【００３２】この円弧状の突起６は、ＬＥＤチップ８の
発光能力や必要輝度に対応した位置に設けることによ
り、光束の拡がりにより隣置間隔や曲率半径等の寸法を
変化させることができる。そして、前面部３ａは、円弧
状によるレンズ効果と遮蔽効果によってＬＥＤチップ８
からの光の方向を制御している。また、溝部４へのエポ
キシ樹脂等の透明樹脂の充填によるレンズ効果で光束の
拡大が得られ、ＬＥＤチップ（光源）８からの光制御を
行っている。By providing the arc-shaped protrusion 6 at a position corresponding to the light emitting ability and required luminance of the LED chip 8, it is possible to change dimensions such as an adjacent distance and a radius of curvature by spreading of a light beam. The front surface 3a is formed by the LED chip 8 by the lens effect and the shielding effect by the arc shape.
The direction of light from the camera is controlled. Further, a light beam can be expanded by the lens effect by filling the groove 4 with a transparent resin such as an epoxy resin, and the light from the LED chip (light source) 8 is controlled.
【００３３】反射ケース３の底面部３ｂは、リードフレ
ーム２を挟んで前面部３ａの反対面側に金型により前面
部３ａと同時に一体成形される。底面部３ｂには、前面
部３ａに隣接配置される各突起６間のほぼ中央に対面し
て切欠部７が形成されている。The bottom surface 3b of the reflection case 3 is formed integrally with the front surface 3a by a mold on the opposite side of the front surface 3a across the lead frame 2. A cutout 7 is formed on the bottom surface 3b so as to face substantially the center between the projections 6 arranged adjacent to the front surface 3a.
【００３４】更に説明すると、切欠部７は、前面部３ａ
に形成された円弧状の突起６の数量から１つ減した数量
が切欠きされている。図１に示す例では、突起６の数量
が４なので、３つの切欠部７が形成されている。そし
て、この切欠部７を多く設けることにより、切欠き干渉
により集中応力を分散させて集中応力の緩和を行ってい
る。More specifically, the notch 7 is provided on the front surface 3a.
Is cut out by one less than the number of arc-shaped projections 6 formed in the first and second portions. In the example shown in FIG. 1, since the number of the projections 6 is 4, three notches 7 are formed. By providing many notches 7, the concentrated stress is dispersed by the notch interference, and the concentrated stress is reduced.
【００３５】切欠部７は、円弧状の突起６の全体積に対
して体積比を５５〜７０（好ましくは６０％程度）にあ
たる矩形の形状に形成される。この切欠部７の形成時に
は、３２０℃程度の融点よりやや高めに加熱した変成ポ
リアミド樹脂が注入部７ａ（ゲート）から８００Ｋｇ／
ｃｍ2 程度の圧力で注入される。なお、切欠部７は矩形
に限らず、円弧の形状に形成してもよい。The notch 7 is formed in a rectangular shape having a volume ratio of 55 to 70 (preferably about 60%) with respect to the entire volume of the arc-shaped projection 6. At the time of forming the notch 7, a modified polyamide resin heated to a temperature slightly higher than the melting point of about 320 ° C. is supplied from the injection portion 7a (gate) at 800 kg / g.
It is injected at a pressure of about cm 2 . The notch 7 is not limited to a rectangle, and may be formed in an arc shape.
【００３６】切欠部７は、リードフレーム２の熱伝導
率、例えば燐青銅では５２Ｋｃａｌ／ｍ・ｈ・℃と反射
ケース３の前面部３ａや底面部３ｂの熱伝導率、例えば
変成ポリアミド樹脂等では０．２０〜０．２５Ｋｃａｌ
／ｍ・ｈ・℃との差により樹脂の射出時に於ける熱応力
と、反射ケース３の前面部３ａと底面部３ｂとの蓄熱エ
ネルギーの差を吸収目的に設け、射出時に於ける熱応力
を吸収し、リードフレーム２の反りを防いでいる。The notch 7 has a thermal conductivity of the lead frame 2 such as 52 Kcal / m · h · ° C. for phosphor bronze and a thermal conductivity of the front surface 3 a and the bottom surface 3 b of the reflection case 3 such as a modified polyamide resin. 0.20-0.25Kcal
/ M · h · ° C., the difference between the thermal stress at the time of resin injection and the heat storage energy between the front surface 3a and the bottom surface 3b of the reflection case 3 is provided for the purpose of absorption, and the thermal stress at the time of injection is reduced. It absorbs and prevents the warpage of the lead frame 2.
【００３７】切欠部７は、反射ケース３の前面部３ａに
形成された円弧状の突起６にＬＥＤチップ８を載置した
後に、溝部４ａにエポキシ樹脂等の透明樹脂を充填し、
樹脂の硬化時に依る収縮に伴う前面部３ａ側への収縮力
等の機械的応力を吸収している。After the LED chip 8 is mounted on the arc-shaped protrusion 6 formed on the front surface 3a of the reflection case 3, the notch 7 is filled with a transparent resin such as epoxy resin in the groove 4a.
It absorbs mechanical stress such as shrinkage force to the front surface 3a side due to shrinkage due to curing of the resin.
【００３８】次に、上記構成による発光表示装置１の製
造方法を図４のフローチャートに基づいて説明する。ま
ず、金属薄板を図２に示すようなパターン形状にパンチ
プレス機等により打ち抜き加工してリードフレーム２を
形成する。続いて、リードフレーム２の表面にＣｕメッ
キ、Ａｇメッキの順にメッキ処理し導電パターン（電極
端子面２ｃ）を形成する（ＳＴ１）。Next, a method of manufacturing the light-emitting display device 1 having the above configuration will be described with reference to the flowchart of FIG. First, a lead frame 2 is formed by punching a thin metal plate into a pattern shape as shown in FIG. 2 using a punch press or the like. Subsequently, the surface of the lead frame 2 is plated in the order of Cu plating and Ag plating to form a conductive pattern (electrode terminal surface 2c) (ST1).
【００３９】次に、リードフレーム２を表裏面から金型
によって面対称に挟み込み、金型に溶融した樹脂を注入
してインサートモールド成型により図１〜図３に示す形
状の反射ケース３を成形する（ＳＴ２）。Next, the lead frame 2 is sandwiched between the front and back surfaces by a mold in a plane-symmetric manner, a molten resin is injected into the mold, and the reflection case 3 having the shape shown in FIGS. 1 to 3 is formed by insert molding. (ST2).
【００４０】すなわち、一方の面（表面）にＬＥＤチッ
プ８からの発光方向を制御する円弧状の突起６を有する
前面部３ａと、他方の面（裏面）に突起６間の位置に対
応した切欠部７を有する底面部３ｂとが一体成形された
反射ケース３をインサートモールド成型により成形する
（ＳＴ３）。That is, a front surface 3a having an arc-shaped projection 6 for controlling the direction of light emission from the LED chip 8 on one surface (front surface) and a notch corresponding to a position between the projections 6 on the other surface (back surface). The reflection case 3 integrally formed with the bottom surface 3b having the portion 7 is formed by insert molding (ST3).
【００４１】その際、リードフレーム２を表裏面による
面対称に挟み込む金型の一方は、切欠部７に対応した矩
形（又は円弧状）の金型と同材からなる駒により、製造
に係わる切欠部７の位置及び形状の選択を自由に交換で
きるようになっている。これにより、設計の自由度が増
して互換性等が図れ、コストの低減、作業性の高めるこ
とができる。At this time, one of the dies which sandwiches the lead frame 2 symmetrically with respect to the front and back surfaces is formed by a piece made of the same material as a rectangular (or arc-shaped) die corresponding to the notch 7, so that a notch related to manufacturing is formed. The position and shape of the part 7 can be freely selected and exchanged. As a result, the degree of freedom in design is increased, compatibility and the like can be achieved, and cost reduction and workability can be improved.
【００４２】ここで、上記反射ケース３を成型するため
の樹脂は、変成ポリアミド、ポリブチレンテレフタレー
ト、ナイロン４６や芳香族系ポリエステル等からなる液
晶ポリマなどの絶縁性のある材料に、光の反射性を良く
するとともに遮光性を得るためにチタン酸バリウム等の
白色粉体を混入させたものを、例えば３２０℃程度の融
点よりやや高めで加熱し、注入部７ａから例えば８００
Ｋｇ／ｃｍ2 程度の圧力で注入される。The resin for molding the reflection case 3 is made of a material having an insulating property such as a liquid crystal polymer made of modified polyamide, polybutylene terephthalate, nylon 46, aromatic polyester, or the like. The mixture containing white powder such as barium titanate is heated slightly higher than the melting point of, for example, about 320 ° C. in order to improve the light-shielding property and to obtain a light shielding property.
It is injected at a pressure of about Kg / cm 2 .
【００４３】その際、円弧状の突起６の全体積に対して
体積比が６０％となるように、各円弧状の突起６間の中
央に対面する反射ケース３の底面部３ｂに矩形形状の切
欠部７を形成する。これにより、リードフレーム２の熱
伝導率と反射ケース３の熱伝導率との差により樹脂の射
出時に於ける熱応力と、反射ケース３の前面部３ａと底
面部３ｂとの蓄熱エネルギーの差を吸収してリードフレ
ーム２の反りを防ぐことができる。At this time, the bottom surface 3b of the reflection case 3 facing the center between the arc-shaped projections 6 is formed in a rectangular shape so that the volume ratio is 60% of the total volume of the arc-shaped projections 6. The notch 7 is formed. Thus, the difference between the thermal conductivity of the lead frame 2 and the thermal conductivity of the reflective case 3 causes the thermal stress at the time of resin injection and the difference between the heat storage energy of the front surface 3a and the bottom surface 3b of the reflective case 3 to be reduced. By absorbing, the warpage of the lead frame 2 can be prevented.
【００４４】また、各突起６間の中央に対面する反射ケ
ース３の底面部３ｂに切欠部７を形成することにより、
各切欠部７の切欠き干渉によって集中応力を分散させて
集中応力を緩和させることができる。The notch 7 is formed in the bottom 3b of the reflection case 3 facing the center between the projections 6, so that
The concentrated stress can be dispersed by the notch interference of each of the notches 7 to reduce the concentrated stress.
【００４５】上記のようにしてリードフレーム２に反射
ケース３がインサートモールド成型されると、反射ケー
ス３の溝部４内に露出する電極端子面２ｃにＬＥＤチッ
プ８をダイボンダで載置し、フィラを樹脂に分散させた
銀ペースト等を恒温槽や炉等で例えば１５０℃で硬化さ
せる（ＳＴ４）。その後、ＬＥＤチップ８と電極端子面
２ｃとの間にワイヤーボンディングして電気的接続を行
う（ＳＴ５）。When the reflection case 3 is insert-molded on the lead frame 2 as described above, the LED chip 8 is mounted on the electrode terminal surface 2c exposed in the groove 4 of the reflection case 3 by a die bonder, and the filler is mounted. The silver paste or the like dispersed in the resin is cured at, for example, 150 ° C. in a thermostat or a furnace (ST4). Thereafter, electrical connection is performed by wire bonding between the LED chip 8 and the electrode terminal surface 2c (ST5).
【００４６】次に、電気的及び光学的に優れたエポキシ
樹脂等の透明樹脂を反射ケース３の溝部４内に充填する
（ＳＴ６）。その際、反射ケース３の底面部３ｂの切欠
部７により、透明樹脂の硬化時に依る収縮に伴う反射ケ
ース３の前面部３ａへの収縮力等の機械的応力が吸収さ
れる。Next, a transparent resin such as an epoxy resin excellent in electrical and optical properties is filled in the groove 4 of the reflection case 3 (ST6). At this time, the notch 7 in the bottom surface 3b of the reflection case 3 absorbs mechanical stress such as a contraction force on the front surface 3a of the reflection case 3 due to the contraction due to the curing of the transparent resin.
【００４７】反射ケース３のインサートモールド成型及
びＬＥＤチップ８の配線接続が完了すると、成形物から
リードフレーム２の外部リード２ａを残して不要部分
（支持枠部２ｂ）が切除される（ＳＴ７）。これによ
り、発光表示装置１が完成する。When the insert molding of the reflection case 3 and the wiring connection of the LED chip 8 are completed, an unnecessary portion (support frame portion 2b) is cut away from the molded product, leaving the external leads 2a of the lead frame 2 (ST7). Thereby, the light emitting display device 1 is completed.
【００４８】このように、本実施の形態では、反射ケー
スは、電極端子面２ｃに載置されるＬＥＤチップの各位
置における反射ケース３の溝部４の外周縁部分に対向し
て円弧状に突出した突起６を設け、突起６間の位置に対
面する底面部３ｂに矩形状の切欠部７を設けて反射ケー
ス３をインサートモールド成型するので、切欠部７によ
り熱応力や機械的応力を吸収でき、リードフレーム２の
反りが無い発光表示装置１を製造することが出来る。As described above, in the present embodiment, the reflection case protrudes in an arc shape facing the outer peripheral portion of the groove 4 of the reflection case 3 at each position of the LED chip mounted on the electrode terminal surface 2c. The reflective case 3 is insert-molded by providing the rectangular projections 6 on the bottom surface 3b facing the position between the projections 6 and insert-molding the reflective case 3, so that the thermal stresses and mechanical stresses can be absorbed by the notches 7. Thus, the light emitting display device 1 having no warpage of the lead frame 2 can be manufactured.
【００４９】ところで、上記実施の形態では、各突起６
間の中央に対面する底面部３ｂに切欠部７を形成した構
成について説明したが、切欠部７は必ずしも各突起６間
の中央に対面して底面部３ｂに形成する必要はなく、集
中する応力の度合いに応じて位置を変えるようにしても
よい。また、反射ケース３の溝部４内の中央に位置する
電極端子面２ｃに載置されるＬＥＤチップを中心とし
て、左右対称位置に切欠部７を形成する構成としてもよ
い。この構成によれば、樹脂の射出時に於ける熱応力を
切欠部７により均等に分散させることができる。In the above embodiment, each of the projections 6
Although the configuration in which the notch 7 is formed in the bottom 3b facing the center between them has been described, the notch 7 does not necessarily need to be formed in the bottom 3b so as to face the center between the projections 6, and the concentrated stress The position may be changed according to the degree of the change. Further, the notch 7 may be formed at a symmetrical position with respect to the LED chip mounted on the electrode terminal surface 2c located at the center in the groove 4 of the reflection case 3. According to this configuration, the thermal stress at the time of injecting the resin can be evenly dispersed by the notch 7.
【００５０】[0050]
【発明の効果】以上の説明で明らかなように、本発明の
請求項１に係る発光表示装置は、半導体発光素子チップ
の各位置における溝部の外周縁部分に対向して円弧状に
突出した突起を有し、かつ突起間の位置に対応する底面
部に切欠部を設けて反射ケースが成形されるので、熱応
力や機械的応力を吸収でき、インサートモールド成型時
や透明樹脂充填時に反りや曲がりを防止できる。As is apparent from the above description, the light emitting display device according to the first aspect of the present invention has a projection protruding in an arc shape facing the outer peripheral portion of the groove at each position of the semiconductor light emitting element chip. The reflective case is molded with a notch at the bottom corresponding to the position between the protrusions, so it can absorb thermal stress and mechanical stress, and can be warped or bent during insert molding or filling with transparent resin. Can be prevented.
【００５１】請求項２に係る発光表示装置は、切欠部を
円弧状の突起の数から１つ減した数とするので、切欠き
干渉による集中応力の分散ができ、多数の半導体発光素
子を使用した細長い発光表示装置でも製造が可能とな
る。In the light emitting display device according to the second aspect, since the number of the cutout portions is reduced by one from the number of the arc-shaped protrusions, the concentrated stress due to the cutout interference can be dispersed, and a large number of semiconductor light emitting elements are used. It is possible to manufacture even an elongated light emitting display device.
【００５２】請求項３に係る発光表示装置は、電極端子
面の中央の位置に載置される半導体発光素子チップを中
心として対称に位置して切欠部を形成するので、樹脂の
射出時に於ける熱応力を切欠部によって均等に分散させ
ることができる。In the light-emitting display device according to the third aspect, the cutout portion is formed symmetrically with respect to the semiconductor light-emitting element chip mounted at the center position of the electrode terminal surface, so that the resin is injected when the resin is injected. The thermal stress can be evenly distributed by the notch.
【００５３】請求項４に係る発光表示装置は、切欠部が
矩形または円弧状からなり、円弧状の突起部分の体積の
５５〜７０％の体積比としたので、部分箇所への集中応
力を緩和することができ、常に反りのない発光表示装置
が得られる。In the light-emitting display device according to the fourth aspect, the cutout portion is formed in a rectangular or arc shape, and the volume ratio is 55 to 70% of the volume of the arc-shaped projection portion, so that the stress concentrated on the portion is reduced. Thus, a light-emitting display device that is always free from warpage can be obtained.
【００５４】請求項５に係る発光表示装置の製造方法
は、半導体素子チップの各位置における溝部の外周縁部
分に対向して円弧状に突出した突起が形成され、かつ突
起間の位置に対面する底面部に切欠部が形成されるよう
に反射ケースをインサートモールド成型する工程を含む
ので、反射ケースに形成された切欠部により熱応力や機
械的応力を吸収でき、インサートモールド成型時や透明
樹脂充填時に反りや曲がりを防止できる。According to a fifth aspect of the present invention, there is provided a method of manufacturing a light emitting display device, wherein a projection protruding in an arc shape is formed opposite to an outer peripheral portion of a groove at each position of a semiconductor element chip, and faces a position between the projections. Includes the process of insert-molding the reflective case so that the notch is formed in the bottom part, so that the notch formed in the reflective case can absorb thermal stress and mechanical stress, and can be used during insert molding or filling with transparent resin. Sometimes warpage and bending can be prevented.
【００５５】このように、本発明によれば、インサート
モールド成型における射出時間の短縮や完成品の歩留ま
りの向上が図れ、生産性、信頼性、経済性を良くするこ
とができる。As described above, according to the present invention, the injection time in the insert molding can be shortened and the yield of the finished product can be improved, and the productivity, reliability and economy can be improved.
【図１】（ａ）本発明に係る発光表示装置の平面図 （ｂ）（ａ）の側面図FIG. 1A is a plan view of a light emitting display device according to the present invention. FIG. 1B is a side view of FIG.
【図２】（ａ）リードフレームに多数ユニットが並設さ
れた状態を示す平面図 （ｂ）（ａ）の側面図FIG. 2A is a plan view showing a state in which many units are arranged side by side on a lead frame. FIG. 2B is a side view of FIG.
【図３】図２（ａ）の底面図FIG. 3 is a bottom view of FIG.
【図４】発光表示装置の製造方法の手順を示すフローチ
ャートFIG. 4 is a flowchart showing a procedure of a method for manufacturing a light-emitting display device.
１…発光表示装置、２…リードフレーム、２ａ…外部リ
ード、２ｂ…電極端子面、３…反射ケース、３ａ…前面
部、３ｂ…底面部、４…溝部、５…堰部、６（６ａ，６
ｂ）…突起、７…切欠部、７ａ…注入部（ゲート）。DESCRIPTION OF SYMBOLS 1 ... Light-emitting display device, 2 ... Lead frame, 2a ... External lead, 2b ... Electrode terminal surface, 3 ... Reflective case, 3a ... Front part, 3b ... Bottom part, 4 ... Groove part, 5 ... Weir part, 6 (6a, 6
b) Projection, 7 Notch, 7a Injection (gate).
Claims (5)
の面に複数の半導体発光素子チップが所定間隔で載置さ
れて配線接続される電極端子面が形成され、前記電極端
子面に載置された前記半導体発光素子チップのそれぞれ
が露出するように連続形成された溝部を有する箱状の反
射ケースが前記リードフレームの表裏面からインサート
モールド成型され、該反射ケースの前記溝部に透明樹脂
が充填された発光表示装置において、 前記反射ケースは、前記半導体発光素子チップの各位置
における前記溝部の外周縁部分に対向して円弧状に突出
した突起を有し、かつ前記突起間の位置に対応する底面
部に切欠部を設けて成形されることを特徴とする発光表
示装置。1. An electrode terminal surface on which a plurality of semiconductor light emitting element chips are mounted at predetermined intervals and connected by wiring is formed on one surface of a lead frame made of a thin metal plate, and is mounted on the electrode terminal surface. A box-shaped reflection case having a groove formed continuously so that each of the semiconductor light emitting element chips is exposed was insert-molded from the front and back surfaces of the lead frame, and the groove of the reflection case was filled with a transparent resin. In the light-emitting display device, the reflection case has a protrusion protruding in an arc shape facing an outer peripheral edge portion of the groove at each position of the semiconductor light-emitting element chip, and a bottom portion corresponding to a position between the protrusions A light emitting display device characterized by being formed by providing a cutout portion in the light emitting display device.
ら１つ減した数とすることを特徴とする請求項１記載の
発光表示装置。2. The light emitting display device according to claim 1, wherein the number of the notches is one less than the number of the arc-shaped protrusions.
位置に載置される半導体発光素子チップを中心として対
称に位置して形成されていることを特徴とする請求項１
記載の発光表示装置。3. The semiconductor device according to claim 1, wherein the notch is formed symmetrically with respect to a semiconductor light emitting element chip mounted at a center of the electrode terminal surface.
The light-emitting display device according to claim 1.
り、前記円弧状の突起部分の体積の５５〜７０％の体積
比となることを特徴とする請求項１〜３いずれかに記載
の発光表示装置。4. The method according to claim 1, wherein the notch has a rectangular or arc shape, and has a volume ratio of 55 to 70% of the volume of the arc-shaped protrusion. Light-emitting display device.
の面に複数の半導体発光素子チップが所定間隔で載置さ
れて配線接続される電極端子面を形成し、前記リードフ
レームの表裏面から反射性樹脂のインサートモールド成
型により前記電極端子面に載置された前記半導体発光素
子チップのそれぞれが露出するように連続形成された溝
部を有する箱状の反射ケースを形成し、該反射ケースの
前記溝部に透明樹脂を充填する発光表示装置の製造方法
において、 前記半導体素子チップの各位置における前記溝部の外周
縁部分に対向して円弧状に突出した突起が形成され、か
つ前記突起間の位置に対面する底面部に切欠部が形成さ
れるように前記反射ケースをインサートモールド成型す
る工程を含むことを特徴とする発光表示装置の製造方
法。5. An electrode terminal surface on which a plurality of semiconductor light emitting element chips are mounted at predetermined intervals and are connected by wiring to one surface of a lead frame made of a thin metal plate. A box-shaped reflection case having a groove continuously formed so that each of the semiconductor light emitting element chips mounted on the electrode terminal surface is exposed by insert molding of a resin is formed, and the groove of the reflection case is formed in the reflection case. In a method of manufacturing a light emitting display device that is filled with a transparent resin, a protrusion protruding in an arc shape is formed facing an outer peripheral edge portion of the groove at each position of the semiconductor element chip, and faces a position between the protrusions. A method for manufacturing a light-emitting display device, comprising a step of insert-molding the reflection case so that a notch is formed in a bottom surface portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17159598A JP4198233B2 (en) | 1998-06-18 | 1998-06-18 | Light emitting display device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17159598A JP4198233B2 (en) | 1998-06-18 | 1998-06-18 | Light emitting display device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000010507A true JP2000010507A (en) | 2000-01-14 |
| JP4198233B2 JP4198233B2 (en) | 2008-12-17 |
Family
ID=15926087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17159598A Expired - Fee Related JP4198233B2 (en) | 1998-06-18 | 1998-06-18 | Light emitting display device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4198233B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7201511B2 (en) | 2002-10-25 | 2007-04-10 | Moriyama Sangyo Kabushiki Kaisha | Light emitting module |
| JP2008244350A (en) * | 2007-03-28 | 2008-10-09 | ▲せん▼宗文 | Manufacturing method of multi-particle surface self-adhesive light emitting diode and structure of same |
| WO2008153345A3 (en) * | 2007-06-14 | 2009-02-26 | Medileds Co Ltd | Floodlighting apparatus |
-
1998
- 1998-06-18 JP JP17159598A patent/JP4198233B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7201511B2 (en) | 2002-10-25 | 2007-04-10 | Moriyama Sangyo Kabushiki Kaisha | Light emitting module |
| JP2008244350A (en) * | 2007-03-28 | 2008-10-09 | ▲せん▼宗文 | Manufacturing method of multi-particle surface self-adhesive light emitting diode and structure of same |
| WO2008153345A3 (en) * | 2007-06-14 | 2009-02-26 | Medileds Co Ltd | Floodlighting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4198233B2 (en) | 2008-12-17 |
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