JP2000017447A - Faucet fittings - Google Patents
Faucet fittingsInfo
- Publication number
- JP2000017447A JP2000017447A JP18716298A JP18716298A JP2000017447A JP 2000017447 A JP2000017447 A JP 2000017447A JP 18716298 A JP18716298 A JP 18716298A JP 18716298 A JP18716298 A JP 18716298A JP 2000017447 A JP2000017447 A JP 2000017447A
- Authority
- JP
- Japan
- Prior art keywords
- faucet
- plating film
- nickel plating
- electroless nickel
- faucet body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 58
- 238000007747 plating Methods 0.000 claims abstract description 41
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 abstract description 7
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005266 casting Methods 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RGHNJXZEOKUKBD-SQOUGZDYSA-M D-gluconate Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O RGHNJXZEOKUKBD-SQOUGZDYSA-M 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229940050410 gluconate Drugs 0.000 description 1
- -1 hypophosphorous acid compound Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- POWFTOSLLWLEBN-UHFFFAOYSA-N tetrasodium;silicate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-][Si]([O-])([O-])[O-] POWFTOSLLWLEBN-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Domestic Plumbing Installations (AREA)
- Chemically Coating (AREA)
Abstract
(57)【要約】
【課題】 銅合金を素材とする水栓本体の通水路から鉛
が溶出するのを防止した水栓金具を提供する。
【解決手段】 銅合金を素材とする水栓本体１の通水路
２及び表面に、無電解ニッケルメッキ膜３を施した。
【効果】 水栓本体は湯水の通水路にも均一の厚みで無
電解ニッケルメッキ膜を形成することができ、耐食性が
向上し腐食を抑えることができるので、従来問題となっ
ていた鋳物表面からの鉛の溶出を確実に抑えることがで
きる。
(57) [Problem] To provide a faucet fitting in which lead is prevented from being eluted from a water passage of a faucet body made of a copper alloy. SOLUTION: An electroless nickel plating film 3 is applied to a water passage 2 and a surface of a faucet body 1 made of a copper alloy. [Effect] The faucet body can form an electroless nickel plating film with a uniform thickness on the hot water flow passage, improving the corrosion resistance and suppressing corrosion. Of the lead can be reliably suppressed.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、銅合金を素材とす
る水栓本体の通水路から鉛が溶出するのを防止する水栓
金具に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a faucet fitting for preventing lead from eluting from a water passage of a faucet body made of a copper alloy.
【０００２】[0002]
【従来の技術】従来の水栓金具は一般に素材として青銅
等の銅合金が用いられており、この銅合金は切削加工の
際の切削性を向上させるため鉛を含有している。しかし
鉛を含有した銅合金を素材とする水栓金具は、機械加
工、研磨加工の後にニッケルメッキ膜及びクロームメッ
キ膜を施して表面の耐食性及び光沢性を向上させている
が、これらの電気メッキでは本体内面の通水路表面には
メッキ膜がいきわたらず鋳肌が露出したままであり、水
質条件が悪い場合は通水路の表面が腐食して鉛が流体中
に溶出されてしまい、人体に悪影響を与える恐れがあ
り、鉛の溶出しない水栓金具の開発が望まれていた。2. Description of the Related Art Conventional faucet fittings generally use a copper alloy such as bronze as a raw material, and this copper alloy contains lead in order to improve the machinability in cutting. However, faucet fittings made of lead-containing copper alloy have been subjected to nickel plating and chrome plating after machining and polishing to improve the corrosion resistance and gloss of the surface. In this case, the plating film does not spread to the inner surface of the water passage, and the casting surface remains exposed.If the water quality conditions are poor, the surface of the water passage will corrode and lead will be eluted into the fluid, causing human body damage. There is a possibility of having an adverse effect, and the development of a faucet fitting from which lead is not eluted has been desired.
【０００３】[0003]
【発明が解決しようとする課題】本発明が解決しようと
する課題は、銅合金を素材とする水栓本体の通水路から
鉛が溶出するのを防止した水栓金具を提供することであ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a faucet fitting in which lead is prevented from being eluted from a water passage of a faucet body made of a copper alloy.
【０００４】[0004]
【課題を解決するための手段】本発明は請求項１では、
水栓金具は銅合金を素材とする水栓本体の通水路及び表
面に、無電解ニッケルメッキ膜を施したものである。SUMMARY OF THE INVENTION According to the present invention,
The faucet fitting is formed by applying an electroless nickel plating film to a water passage and a surface of a faucet body made of a copper alloy.
【０００５】また請求項２では、前記水栓本体は無電解
ニッケルメッキ膜を施した後に、ニッケルメッキ膜及び
クロームメッキ膜を順に施したものである。According to a second aspect of the present invention, the faucet body is formed by applying an electroless nickel plating film, and then applying a nickel plating film and a chrome plating film in this order.
【０００６】さらに請求項３では、前記水栓金具は無電
解ニッケルメッキ膜を施した後に、樹脂カバーで覆うも
のである。According to a third aspect of the present invention, the faucet is provided with an electroless nickel plating film and then covered with a resin cover.
【０００７】[0007]
【発明の実施の形態】以下、本発明の実施の形態を図に
基づいて詳細に説明する。本発明の水栓本体１は銅合金
を素材としており、図１に示す切削加工された水栓本体
１に無電解ニッケルメッキ膜３を施す際の前工程は次の
通りである。Embodiments of the present invention will be described below in detail with reference to the drawings. The faucet body 1 of the present invention is made of a copper alloy, and the pre-process for applying the electroless nickel plating film 3 to the cut faucet body 1 shown in FIG. 1 is as follows.
【０００８】（１）アルカリ洗浄。炭酸ソーダ、オルソ
ケイ酸ソーダ、苛性ソーダ等のアルカリ剤を含んだ洗浄
剤に水栓本体１を浸漬してアルカリ洗浄を行い、水栓本
体１の鋳物表面の油や汚れを除去する。(1) Alkaline washing. The faucet body 1 is immersed in a detergent containing an alkaline agent such as sodium carbonate, sodium orthosilicate, caustic soda, etc. to perform alkali cleaning, thereby removing oil and dirt on the casting surface of the faucet body 1.
【０００９】（２）スケール除去。水栓本体１の加工時
に鋳物表面に強固なスケールが生成され、前記アルカリ
洗浄では除去しにくいスケールがある。このスケールの
上に無電解ニッケルメッキ膜を施すと密着不良となるた
め、過マンガン酸塩、グルコン酸塩等を用いて鋳物表面
のスケールを溶解除去する。(2) Scale removal. When the faucet body 1 is processed, a strong scale is generated on the casting surface, and there are scales that are difficult to remove by the alkali cleaning. Applying an electroless nickel plating film on this scale results in poor adhesion. Therefore, the scale on the casting surface is dissolved and removed using permanganate, gluconate or the like.
【００１０】（３）酸洗い。水栓本体１の鋳物表面の加
工の際に生成されたスケール、厚い錆の層を除去するた
め、塩酸、硫酸、フッ酸、硝酸、Ｃｒ酸等の単一又は混
合水溶液中に浸漬する。(3) Pickling. In order to remove the scale and thick rust layer generated during the processing of the casting surface of the faucet main body 1, the faucet is immersed in a single or mixed aqueous solution of hydrochloric acid, sulfuric acid, hydrofluoric acid, nitric acid, Cr acid or the like.
【００１１】（４）化学研磨。水栓本体１を酸化剤中に
浸漬して、鋳物表面を平滑化する。(4) Chemical polishing. The faucet body 1 is immersed in an oxidizing agent to smooth the casting surface.
【００１２】（５）酸活性。水栓本体１を塩酸、硫酸を
含んだ水溶液中に浸漬して、前処理工程中に発生した薄
錆を除去し、鋳物表面をわずかに溶解し、新鮮な面に変
えメッキの密着性をより完全にする。(5) Acid activity. The faucet body 1 is immersed in an aqueous solution containing hydrochloric acid and sulfuric acid to remove the thin rust generated during the pretreatment process, slightly dissolve the casting surface, change the casting surface to a fresh surface, and improve the adhesion of plating. Complete.
【００１３】なお、前記工程中、（２）又は（４）は鋳
物表面が清浄な場合は省略してもよい。In the above process, (2) or (4) may be omitted if the casting surface is clean.
【００１４】以上の前処理工程を終了した水栓本体１に
無電解ニッケルメッキを行う。無電解ニッケルメッキに
用いるメッキ液は塩化ニッケル、硫酸ニッケル等の金属
塩と、次亜リン酸化合物、ほう素化合物等の還元剤を主
成分とし、メッキ液の寿命を長くしたり、還元剤の効率
を良くするため後述する補助成分を添加し、約９０度の
メッキ液に水栓本体１を約４０〜５０分浸漬すると、表
面に約１０ミクロンの皮膜を形成することができる。Electroless nickel plating is performed on the faucet main body 1 after the above pretreatment step. The plating solution used for electroless nickel plating contains metal salts such as nickel chloride and nickel sulfate, and a reducing agent such as a hypophosphorous acid compound and a boron compound as main components. When an auxiliary component described later is added to improve the efficiency and the faucet main body 1 is immersed in a plating solution of about 90 degrees for about 40 to 50 minutes, a film of about 10 microns can be formed on the surface.
【００１５】なお、補助成分としては一般に水酸化ナト
リウム、水酸化アンモニウム等のＰＨ調整剤、クエン酸
ナトリウム、酢酸ナトリウム等のＰＨの変動を抑える緩
衝剤、酢酸、グリコール酸、クエン酸、酒石酸等のメッ
キ液の安定性を向上させる錯化剤、メッキ液の自然分解
を抑える安定剤、及び光沢を与える改良剤を使用する。The auxiliary components generally include a pH adjuster such as sodium hydroxide and ammonium hydroxide, a buffering agent such as sodium citrate and sodium acetate which suppresses fluctuations in pH, and acetic acid, glycolic acid, citric acid and tartaric acid. A complexing agent that improves the stability of the plating solution, a stabilizer that suppresses spontaneous decomposition of the plating solution, and an improver that provides gloss are used.
【００１６】前記の約９０度に加熱したメッキ液に水栓
本体１を浸けておき、浸漬時間を調節することで１〜５
０ミクロンの膜厚の無電解ニッケルメッキ膜３が得られ
る。１〜５０ミクロンとしたのは十分な膜厚でしかも水
栓本体１のねじ部分の寸法公差に影響を受けない範囲に
するためである。The faucet body 1 is immersed in the above-mentioned plating solution heated to about 90 ° C.
An electroless nickel plating film 3 having a thickness of 0 μm is obtained. The reason why the thickness is set to 1 to 50 microns is to ensure that the thickness of the water faucet main body 1 is not affected by the dimensional tolerance of the threaded portion.
【００１７】無電解ニッケルメッキは一般的なニッケル
やクロームの電気メッキと異なり、どの面にもピンホー
ルのない均一な厚みの皮膜にすることができる。従って
複雑な形状をした湯水の通水路２にも均一の厚みで皮膜
を形成することができ、耐食性が向上し腐食を抑えるこ
とができるので、鋳物表面からの鉛の溶出を抑えること
ができる。Unlike electroless nickel or chrome electroplating, electroless nickel plating can provide a film having a uniform thickness without pinholes on any surface. Accordingly, a coating film having a uniform thickness can be formed on the water passage 2 having a complicated shape, and the corrosion resistance can be improved and the corrosion can be suppressed. Therefore, the elution of lead from the casting surface can be suppressed.
【００１８】無電解ニッケルメッキ膜３を施した水栓本
体１は、表面の仕上がりが電気メッキと比較して劣る。
従って無電解ニッケルメッキ膜３を施した後に、図３に
示すように通常の電気メッキによるニッケルメッキ膜４
及びクロームメッキ膜５を施すことで光沢性を向上させ
たり、図４に示すように樹脂カバー６で覆えば美観を損
なうことがない。The faucet body 1 provided with the electroless nickel plating film 3 is inferior in surface finish as compared with electroplating.
Therefore, after the electroless nickel plating film 3 is applied, as shown in FIG.
By applying the chrome plating film 5 to improve the glossiness, or by covering with a resin cover 6 as shown in FIG.
【００１９】[0019]
【発明の効果】本発明の水栓金具は、銅合金を素材とす
る水栓本体の通水路及び表面に無電解ニッケルメッキ膜
を施したので、湯水の通水路にも均一の厚みで皮膜を形
成することができ、耐食性が向上し腐食を抑えることが
できるので、従来問題となっていた鋳物表面からの鉛の
溶出を確実に抑えることができる。According to the faucet fitting of the present invention, since the electroless nickel plating film is applied to the water passage and the surface of the water faucet body made of a copper alloy, the film is formed with a uniform thickness on the hot and cold water passage. Since it can be formed, corrosion resistance is improved and corrosion can be suppressed, elution of lead from the casting surface, which has conventionally been a problem, can be reliably suppressed.
【００２０】また、水栓本体の表面に無電解ニッケルメ
ッキ膜を施した後に、一般的な電気メッキによるニッケ
ル膜及びクロームメッキ膜を順に施したり、樹脂カバー
で覆えば、水栓金具の美観を損なうことがない。Further, if the electroless nickel plating film is applied to the surface of the water faucet body, and then a nickel film and a chrome plating film by general electroplating are applied in order or covered with a resin cover, the faucet fittings can be aesthetically pleasing. There is no loss.
【図１】水栓本体に無電解ニッケルメッキ膜を施した状
態の説明図である。FIG. 1 is an explanatory view showing a state in which an electroless nickel plating film is applied to a faucet main body.
【図２】水栓本体の縦断面図である。FIG. 2 is a longitudinal sectional view of the faucet main body.
【図３】水栓本体に無電解ニッケルメッキ膜を施した後
に、ニッケルメッキ膜及びクロームメッキ膜を施した状
態の説明図である。FIG. 3 is an explanatory view showing a state in which a nickel plating film and a chrome plating film are applied after an electroless nickel plating film is applied to a faucet main body.
【図４】水栓本体に無電解ニッケルメッキ膜を施した後
に、樹脂カバーで覆う場合の説明図である。FIG. 4 is an explanatory view of a case where an electroless nickel plating film is applied to a faucet body and then covered with a resin cover.
１ 水栓本体 ２ 通水路 ３ 無電解ニッケルメッキ膜 ４ ニッケルメッキ膜 ５ クロームメッキ膜 ６ 樹脂カバー Reference Signs List 1 faucet main body 2 water passage 3 electroless nickel plating film 4 nickel plating film 5 chrome plating film 6 resin cover
Claims (3)
び表面に、無電解ニッケルメッキ膜を施したことを特徴
とする水栓金具。1. A faucet fitting wherein an electroless nickel plating film is applied to a water passage and a surface of a faucet body made of a copper alloy.
を施した後に、ニッケルメッキ膜及びクロームメッキ膜
を順に施したことを特徴とする請求項１記載の水栓金
具。2. The faucet fitting according to claim 1, wherein the faucet body is formed by applying an electroless nickel plating film, and then applying a nickel plating film and a chrome plating film in that order.
を施した後に、樹脂カバーで覆うことを特徴とする請求
項１記載の水栓金具。3. The faucet fitting according to claim 1, wherein the faucet body is covered with a resin cover after applying an electroless nickel plating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18716298A JP2000017447A (en) | 1998-07-02 | 1998-07-02 | Faucet fittings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18716298A JP2000017447A (en) | 1998-07-02 | 1998-07-02 | Faucet fittings |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000017447A true JP2000017447A (en) | 2000-01-18 |
Family
ID=16201216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18716298A Pending JP2000017447A (en) | 1998-07-02 | 1998-07-02 | Faucet fittings |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000017447A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2005085500A1 (en) * | 2004-03-05 | 2008-04-24 | 株式会社キッツ | Nickel elution prevention method, nickel elution prevention protective film forming agent, and nickel elution prevention detergent for copper alloy wetted parts |
| US8221556B2 (en) | 2002-09-09 | 2012-07-17 | Kitz Corporation | Copper alloy plumbing hardware, such as valves and tube couplings, and the treatment method for reducing elution of lead |
-
1998
- 1998-07-02 JP JP18716298A patent/JP2000017447A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8221556B2 (en) | 2002-09-09 | 2012-07-17 | Kitz Corporation | Copper alloy plumbing hardware, such as valves and tube couplings, and the treatment method for reducing elution of lead |
| JPWO2005085500A1 (en) * | 2004-03-05 | 2008-04-24 | 株式会社キッツ | Nickel elution prevention method, nickel elution prevention protective film forming agent, and nickel elution prevention detergent for copper alloy wetted parts |
| EP1722010A4 (en) * | 2004-03-05 | 2010-02-24 | Kitz Corp | Method of preventing nickel leaching from copper alloy made liquid-contact equipment item, protective film forming agent for nickel leaching prevention and cleaner for nickel leaching prevention |
| US8182879B2 (en) | 2004-03-05 | 2012-05-22 | Kitz Corporation | Method for preventing elution of nickel from water-contact instrument of copper alloy by formation of a protective film |
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