JP2000163540A - Composite IC module, composite IC card, and composite IC card system - Google Patents

Abstract

(57) [Summary] A composite IC card system having both a contact type and a non-contact type power and signal transmission function, and connecting a non-contact coupling element provided on a card base to a composite IC module. And a composite IC module, a composite IC card, and a composite IC card system which are simple to manufacture and which improve the transmission characteristics of the non-contact transmission mechanism. A composite IC card system comprising a composite IC card and a read / write device thereof, wherein the composite IC module has a built-in contact type transfer function and a non-contact type transfer function.
A chip, a module substrate with external terminals as a contact-type transmission mechanism, and an antenna of a non-contact transmission mechanism; the external terminals are formed with a conductor pattern on one surface of the module substrate; The read / write device is disposed on the opposite surface, and includes a read / write antenna of a non-contact read / write mechanism including a contact type and a non-contact type read / write mechanism and having a magnetic core with high magnetic permeability.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type information medium, and more particularly, to an IC used in each field of office automation (so-called OA), factory automation (so-called FA), security (Security), and the like. An information medium represented by a card or the like is provided with a contact type in which power is received and a signal is transmitted and received via an electrical contact, and at least one of power supply power and signal transmission / reception is provided to an IC card by an electromagnetic coupling method. Composite IC card having both functions of non-contact type which is performed in a non-contact state without providing electrical contacts, and a composite IC using the same
The present invention relates to a card system and a composite IC module used for the card system.

[0002]

2. Description of the Related Art With the advent of an IC card having a built-in semiconductor memory or the like, the storage capacity has been dramatically increased as compared with a conventional magnetic card or the like, and an IC card has been built by incorporating a semiconductor integrated circuit device such as a microcomputer. By itself having an arithmetic processing function, it has become possible to impart high security to an information medium.

[0003] IC cards are internationally standardized by the so-called ISO. Generally, IC cards are mounted on a card body made of plastic or the like as an IC, such as a semiconductor memory.
And a metal conductive terminal is provided on the card surface for connection to an external read / write device.
I for communication of data between the card and the external read / write device
The C card is used by inserting it into a card slot of an external read / write device. This is advantageous in applications requiring certainty and security of communication such as mass data exchange and settlement business, for example, credit and electronic wallet applications.

On the other hand, in application to gate management such as entry and exit, authentication is the main communication content, and the amount of communication data is often small, so simpler processing is desired. A technology devised to solve this problem is a contactless IC card. This generates a field of vibration energy such as high-frequency electromagnetic fields, ultrasonic waves, and light in space, absorbs and rectifies the energy, and uses it as a DC power source to drive the electronic circuit built into the card. The frequency of the component is used as it is or is multiplied or divided to provide an identification signal, and the identification signal is transmitted to the information processing circuit of the semiconductor element via a coupler such as an antenna coil or a capacitor.

[0005] In particular, many non-contact IC cards for the purpose of authentication and simple counting data processing are provided by wireless authentication (Ra) of hard logic without a battery and a CPU (central processing unit).
dioFrequency IDentification;
With the advent of this non-contact IC card, the security against forgery and tampering is increased as compared with a magnetic card, and the card holder passes through the gate by a reader / writer attached to the gate device. All that is necessary is to approach the antenna unit of the reader / writer or touch the antenna unit of the reader / writer, and the complexity of data exchange of removing the card from the case and inserting the card into the slot of the reader / writer is reduced.

In recent years, a composite card having a contact-type function having an external terminal and a non-contact-type function of exchanging data by wireless communication has been developed for the purpose of supporting a versatile application with one card. Type IC cards have been devised. It combines the advantages of both high security of contact type CPU processing and convenience of non-contact type CPU processing.

[0007] A composite IC card is generally manufactured as follows. An antenna coil made of metal foil for non-contact transmission formed by etching is sandwiched between a sheet and a base material in which a fitting hole of an IC module is opened, and laminated to produce a card body. At this time, two antenna terminals for connection between the antenna coil and the IC module are exposed inside the fitting hole of the card body. On one surface of the IC module, a metal terminal electrode for connection to an external device is formed. An IC is mounted on the other surface, and terminals for connection to an antenna are provided. For example, a conductive adhesive is applied to the terminals. After the IC module is installed in the fitting hole of the card body such that the terminal of the IC module having the conductive adhesive applied to the terminal and the antenna terminal of the card overlap, heat and pressure are applied to the terminal of the IC module. And the antenna terminal are combined, and the mounting is completed. In addition, as a connection method, solder ball attachment can also be used.

Although such a mounting method is relatively simple,
It is difficult to check the state of the connection between the IC module and the antenna, and the connection reliability becomes a problem. In addition, the mechanical stress tends to cause deterioration of the connection portion.
Furthermore, since a conductive adhesive application step and a thermocompression bonding step are required to connect the IC module and the antenna, it is difficult to use the conventional contact IC card manufacturing apparatus, and if the production is high, If production is to be carried out under the gender, a new production line must be newly established.

An IC in a card manufacturing process of a composite IC card
As a conventional technique that does not require connection between a module and an antenna, there is a technique disclosed in, for example, JP-A-7-239922. According to this, an IC module for an IC card, the IC module comprising: an IC chip;
A transmission mechanism electrically connected to the IC chip and transmitting information and / or energy to and from an external device;
A non-contact type transmission mechanism comprising a coil or an antenna, and a plurality of terminal electrodes formed by patterning conductors provided on the surface of the support, comprising: a C chip; and a support for supporting the transmission mechanism. And a module capable of supporting both contact and non-contact types, and this IC module is fitted and fixed to a plastic card base.

Further, as the above-mentioned realizing means, an antenna or a coil for non-contact transmission is provided so as to surround the periphery of the terminal electrode, or conversely, the antenna is centered and the terminal electrode is provided around the antenna. Thus, the terminal electrode and the antenna are disposed on the same side of the module substrate and exposed on the card surface side. In other words, by storing the non-contact transmitting antenna in the IC module, the connection between the antenna coil and the IC module in the final step of mounting the IC module on the card substrate is eliminated.

However, in the method of providing the antenna coil in a printed pattern around the terminal electrodes of the IC module substrate, the size of a normal IC module is 12 mm.
Since it is about 12 mm, the size of the antenna coil is not allowed to exceed the above value. Therefore, when the coil is arranged on the outer peripheral portion of the terminal electrode in the IC module, even if a printed coil is formed, only a few turns are taken, and sufficient electric power is affected by the small area of the coil. No signal can be received, and only tight connections with communication distances of a few millimeters or less are allowed. In this case, the effect of adding the non-contact transmission function is small. Also, when a read / write device having a general air-core transmitting / receiving coil is used, if the output is set within a specified value, it is clear that non-contact transmission can hardly be performed, but there is no mention of the problem.

The effect of imparting the non-contact transmission mechanism to the contact-type transmission mechanism is obtained by a communication distance of several tens of millimeters to more than one hundred millimeters. In this area, the card is "held" over the antenna of the external read / write device. This makes communication possible. To do so,
It is necessary to increase the area of the coil or increase the number of turns. However, if the number of turns is practical, the embossed area will be applied.

In the latter arrangement of providing the terminal electrodes around the antenna, the intrusion into the embossed area is obvious, and the arrangement largely deviates from ISO7816 which is the standard of an IC card with external terminals. It is unlikely to be done. As a result, the method of providing the printed coil on the same surface as the external terminal has a low accommodation efficiency and is not practical.

[0014]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and is directed to an IC in which an IC module and an antenna coil for non-contact transmission are integrated. It is a module that does not require antenna connection in the final process, has sufficient receiving sensitivity to obtain a sufficient communication distance, and can maintain both contact-type and non-contact-type transmission mechanisms in a practical operating state. It is an object to provide a complex IC card system and a complex IC card.

[0015]

Means provided by the present invention for solving the above-mentioned problems are:
As shown in the figure, a composite IC chip incorporating a contact-type transmission function and a non-contact type transmission function for an IC card, a module substrate having an external terminal serving as a contact-type transmission mechanism, and an antenna as a non-contact transmission mechanism Wherein the external terminal is formed of a conductor pattern on one surface of a module substrate,
The composite antenna according to claim 1, wherein the antenna is disposed on a surface of the module substrate opposite to a surface on which external terminals are formed.
It is a C module.

According to a second aspect of the present invention, the composite IC module of the first aspect has a basic structure,
The antenna arranged in the C module has a portion around which a conductive wire provided with an insulating film is wound. According to this, the number of turns of the antenna can be increased as compared with the case where a coil using a conductor pattern (also referred to as a print coil in this specification) is used.

According to a third aspect of the present invention, the composite IC module according to any one of the first and second aspects has a basic configuration,
In particular, the antenna arranged in the composite IC module is formed by being wound around a sealing material of the IC chip. This is a more specific means for realizing the composite IC module of the first aspect.

According to a fourth aspect of the present invention, the composite IC module according to any one of the first and second aspects has a basic configuration,
In particular, the antenna arranged in the composite IC module is formed by being wound around the IC chip, and the antenna is resin-sealed together with the IC chip. According to this, the number of turns of the antenna can be increased as compared with the case where a coil using a conductor pattern (also referred to as a print coil in this specification) is used. The configuration of such a composite IC module is another specific means for realizing the composite IC module of the second aspect.

According to a fifth aspect of the present invention, the composite IC module according to the first aspect has a basic structure,
The antenna arranged in the C module is formed by winding a conductive wire coated with an insulating film around an end face of the module substrate. The composite IC module may be configured as described above.
This is another specific means for realizing the composite IC module, which is realized by winding an antenna coil of the composite IC module around the module substrate.

According to a sixth aspect, the composite IC module according to any one of the first to fifth aspects has a basic configuration,
In particular, the antenna arranged in the composite IC module is characterized in that a conductive wire provided with an insulating film is formed by being wound in a toroidal shape.

According to a seventh aspect of the present invention, there is provided a composite IC chip having a built-in contact-type transmission function and a non-contact type transmission function for an IC card, a module substrate having an external terminal serving as a contact-type transmission mechanism, and A composite IC card including an IC module including an antenna as a non-contact transmission mechanism and a card base, wherein the external terminals are formed in a conductive pattern on one surface of a module substrate. The antenna is a composite IC card, wherein the antenna is disposed on a surface of the module substrate opposite to a surface on which external terminals are formed.

According to the eighth aspect of the present invention, the composite IC card according to the seventh aspect has a basic structure. In particular, the antenna arranged in the composite IC module has a portion around which a conductive wire coated with an insulating film is wound. It is characterized by having. According to this, the number of turns of the antenna can be increased as compared with the case where a coil using a conductor pattern (also referred to as a print coil in this specification) is used.

According to a ninth aspect of the present invention, based on the composite IC card according to any one of the seventh and eighth aspects, in particular, the antenna arranged in the composite IC module includes:
It is characterized by being formed by being wound around the sealing material of the IC chip. This is a more specific means for realizing the composite IC card of the seventh aspect.

According to a tenth aspect of the present invention, the composite IC card according to any one of the seventh to ninth aspects has a basic structure.
The antenna is wound around the IC chip, and the antenna is resin-sealed together with the IC chip. According to this, a coil using a conductor pattern (also referred to as a print coil in this specification).
, The number of turns of the antenna can be increased. The configuration of such a composite IC card is another specific means for realizing the composite IC card according to the eighth aspect.

According to an eleventh aspect of the present invention, the composite IC card of the seventh aspect has a basic structure, and
The antenna arranged in the module is formed by winding a conductive wire coated with an insulating film around an end face of the module substrate. The configuration of the composite IC module in this way is another specific means for realizing the composite IC module according to claim 8, and is realized by winding an antenna coil of the composite IC module around the module substrate. It was done.

According to a twelfth aspect of the present invention, the composite IC card according to any one of the seventh to eleventh aspects has a basic structure.
A conductive wire provided with an insulating film is formed by being wound in a toroidal shape.

[0027] Then, as in claim 13, an IC
An IC card system comprising a card and a read / write device thereof, wherein the IC card includes an IC module and a card base, and the IC module has a built-in contact-type transfer function and a non-contact-type transfer function for an IC card. It is provided with a composite IC chip, a module substrate on which an external terminal as a contact-type transmission mechanism is formed, and an antenna as a non-contact transmission mechanism, and the external terminal is formed by a conductor pattern on one surface of the module substrate. Wherein the antenna is a complex IC card arranged on a surface different from the external terminal forming surface of the module substrate, wherein the read / write device includes a contact-type read / write mechanism and a non-contact-type read / write mechanism. Read / write of a non-contact read / write mechanism for non-contact power supply and / or information transmission with the IC module Use antenna, a composite IC card system characterized by having a high permeability core.

According to this, the standard of the IC card can be satisfied without changing the external dimensions of the conventional contact type IC module. Further, the non-contact transmission function is realized without sealing the antenna to the card base. Further, the same processing equipment as the contact type IC card can be used, and almost all the standards of the contact type IC card such as embossing and magnetic recording layer can be complied with. Furthermore, a longer communication distance can be realized by configuring the antenna as an antenna of such a non-contact read / write mechanism.

According to a fourteenth aspect of the present invention, there is provided an eighth aspect.
A composite IC card system which comprises using either a composite IC card Itaru 12.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The basic structure and basic principle of a non-contact transmission mechanism according to the present invention will be described with reference to the drawings.

FIG. 6 is an equivalent circuit diagram of a non-contact coupling circuit for explaining the principle of the non-contact transmission mechanism of the present invention. 6, a transmission / reception circuit 101 of a non-contact type external reading device 100 is connected to a transmission / reception coil 102 which is an electromagnetic coupler for supplying power to the non-contact transmission mechanism of the complex IC card 1 and transmitting / receiving information. . The transmission / reception coil 102 is wound in a rectangular, polygonal, or circular shape.
Magnetic material with high magnetic permeability (ferromagnetic material) close to or coaxial with 2
Is provided. On the other hand, the non-contact transmission mechanism of the composite IC card 1 is
02 is only the antenna coil 3 that is directly electromagnetically coupled to the antenna coil 3 and is involved in receiving power and transmitting and receiving information. Here, the coupling between the coils in the case where power and information are transmitted from the external read / write device 100 to the composite IC card 1 will be described below.

Transmission / reception circuit 10 of external read / write device 100
A high-frequency magnetic field is induced in the transmission / reception coil 102 by the high-frequency signal (not shown) generated in 1. This high frequency signal is radiated into space as magnetic energy. At this time, when the composite IC card 1 is located in the high-frequency magnetic field, a current flows through the antenna coil 3 of the composite IC card 1 by the high-frequency magnetic field generated by the transmission / reception coil 102 of the external read / write device 100. At this time, the receiving sensitivity greatly depends on the characteristics of the antenna coil 3 and the characteristics of the transmitting and receiving coil 102.

Transmission / reception coil 1 of external read / write device 100
In the magnetic field generated by 02, the magnetic flux density is increased near the magnetic core 103 due to the presence of the magnetic core 103.
On the other hand, the antenna coil 3 of the composite IC card 1 is impedance-matched so as to optimize the reception efficiency. As a result, the transmission / reception coil 102 of the external read / write device 100
And the antenna coil 3 of the composite IC card 1 realizes the coupling exhibiting the maximum transmission efficiency. External read / write device 100
The maximum transmission efficiency between the transmitting / receiving coil 102 and the antenna coil 3 of the composite IC card 1 is determined by the selection of circuit constants. As described above, the reception characteristics are improved, and a communication distance of more than 10 mm can be achieved even with a small-diameter antenna coil that can be mounted on the composite IC module 2.

Further, by increasing the number of turns of the antenna coil 3, the coupling coefficient with the transmitting / receiving coil 102 increases, and the energy transmitted to the composite IC chip 6 further increases. However, with the current printed wiring board manufacturing technology, the pattern width of 0.1 mm is the limit, and it is difficult for a printed coil to wind several tens of turns in the module base surface of the IC card.

On the other hand, it is possible to form a coil with a conductive wire provided with an insulating film to a diameter of several tens of microns due to advances in magnetic head technology. Paying attention to the technique, the inventors have devised a means for forming the antenna coil of the composite IC module of the present invention by a conductive wire coated with an insulating film.

[0036]

FIG. 1 is a schematic configuration diagram of a complex IC card system according to the present invention. The composite IC card system according to the present invention includes an external read / write device 100 and a composite IC card 1. The external read / write device 100 includes a transmitting / receiving coil 102 for transmitting information to and from the complex IC card 1 in a non-contact manner.
Is provided. A magnetic core 103 having an appropriate thickness is arranged inside the transmission / reception coil 102. In the present embodiment, ferrite is used for the magnetic core 103, but any other material such as iron or nickel may be used as long as it exhibits ferromagnetism with a relative magnetic permeability of about 100 to about 500. It does not do. In FIG. 1, the shape of the transmission / reception coil 103 is drawn as a circle, but the shape of the coil is not limited to a rectangle, a polygon, an ellipse, or the like.

The composite IC card 1 includes only the composite IC module 2 having the antenna coil 3 according to the present invention and the card substrate 10.

FIG. 2 is a schematic configuration diagram of a composite IC card according to the present invention. The composite IC module 2 includes a patterned terminal electrode 7 serving as a contact-type transmission unit, a composite IC chip 6 having a built-in contact type interface and a non-contact type interface (not shown), a periphery of the composite IC chip 6, or a module substrate 9. And an antenna coil 3 of a non-contact type transmission part formed by a conductive wire provided with an insulating film around the module, and a module substrate 9. The composite IC chip 6 is mounted on the surface of the module substrate 9 opposite to the surface on which the terminal electrodes 7 are formed. The composite IC chip 6 and the terminal electrodes 7 of the module substrate 9 are connected by through holes. The circuit is formed by heat welding the composite IC chip 6 and the circuit pattern of the antenna coil 3 using solder or a conductive adhesive. For this connection, solder ball attachment is also useful in face-down, and the composite IC chip 6 is used in face-up.
It can also be realized by wire-bonding the circuit forming surface to the module substrate 9.

After the composite IC chip 6 is mounted on the module substrate 9 and connected to the circuit, the composite IC chip 6 is sealed with a resin 16 and then an insulating film is formed around the composite IC chip 6 or around the module substrate 9. The composite IC module 2 is completed by winding the conducting wire subjected to the above and connecting the circuit pattern of the module substrate 9 and the terminal of the antenna coil 3. FIG. 2B shows a case where the antenna coil 3 is formed with a wound coil around the resin sealing 16 of the composite IC chip 6. If sufficient communication sensitivity is obtained, an antenna may be formed on the mounting surface of the composite IC chip 6 of the module substrate 9 with a conductor pattern.

Subsequently, the composite IC card 1 according to the present invention is manufactured as follows. First, the card substrate 10 is formed by injection molding. A chamber for the IC module fitting hole 11 is provided in the molding die, and the fitting hole 11 of the composite IC module 2 is formed simultaneously with the production of the card substrate 10 by injection molding. Finally, the composite I of the card substrate 10
The composite IC card 1 is completed by bonding the composite IC module 2 to the fitting hole 11 of the C module 2.

Although vinyl chloride was used as the card base material, any other material, such as PET, polycarbonate, synthetic paper, etc. that can provide sufficient card characteristics can be applied to the present invention.

In the present invention, the card is manufactured by injection molding. However, any method that maintains the card characteristics can be applied to the present invention. For example, a laminate method may be used. The fitting hole 11 of the IC module is
Hollowing after card molding is also included in the present invention.

FIG. 3 shows an embodiment in which the antenna coil 3 is wound around the composite IC chip 6. As a preparation for forming the antenna coil 3, the periphery of the resin seal 16 of the composite IC module 2 manufactured up to the step of resin seal 16 is processed by a cutting means or the like so as to be easily wound. Thereafter, winding is directly performed around the resin sealing 16 of the composite IC module 2 by a winding machine (not shown). After the winding operation of the predetermined number of turns is completed, the insulating film of the connection terminal (not shown) of the antenna coil 3 is removed, and the module is connected to a predetermined circuit pattern (not shown) of the module substrate 9.

At this time, when the resin sealing 16 is applied, the cutting process of the resin sealing 16 can be omitted by using a mold or the like so as to facilitate winding. Alternatively, the antenna coil 3 may be manufactured by forming a planar coil in a separate process using a coil winding machine without directly winding the winding around the composite IC chip 6 and bonding it to the module substrate 9. In the present embodiment, the cross-sectional shape of the manufactured coil is a rounded rectangle, but may be an elliptical shape, a circular shape, or another shape, and the present invention does not particularly limit the shape. Absent.

FIG. 4 shows an embodiment in which the resin coil 16 is applied after mounting the antenna coil 3 around the composite IC chip 6. After mounting the composite IC chip 6 on the composite IC module 2, the antenna coil 3 is aligned and wound around the composite IC chip 6. A connection terminal (not shown) of the antenna coil 3 is connected to a predetermined circuit pattern (not shown) of the module substrate 9. Finally, the composite IC chip 6 and the antenna coil 3 are both resin-sealed 16 to form a composite IC.
Module 2 is completed. Although the cross-sectional shape of the antenna coil 3 in this embodiment is a rectangle with rounded corners, it may be circular or another shape as described above.

FIG. 5 shows an embodiment in which the antenna coil 3 is wound around the end face of the module substrate 9. Compound I with rounded corners
Around the module substrate 9 of the C module 2 (in the thickness direction)
The antenna coil 3 can also be formed by winding a wire. The winding around the module substrate 9 was executed before the mounting of the composite IC chip 6. This may be performed at the end of the manufacturing process of the composite IC module 2 and does not limit the order of the processes. By winding around the module substrate 9 (thickness direction) of the rounded composite IC module 2, the thickness of the module substrate 9 is reduced to 0.3 m.
m, it is possible to wind a coil with a width of 1 mm from the outer shape of the module substrate 9 even if embossing is taken into consideration. If the winding diameter is 0.1 mm, it is possible to wind 3 × 10 = 30 times. It is. This is five times or more the case where the winding is formed by the print pattern.

[0047]

As is apparent from the above description, the composite IC module according to the present invention is compatible with both the contact type having an external terminal and the non-contact type having a non-contact coupling element such as an antenna coil. Has a possible function, and this complex I
The compound IC card incorporating the C module is a contact type I card.
The configuration was made so as to be equivalent to the C card configuration.

Then, the antenna coil of the IC module is realized by a winding coil and is directly wound around the resin sealing portion of the IC chip, or is directly adhered to a pre-fabricated planar coil and a module substrate, or By taking the number of turns of the coupling coil of the module substrate as large as possible within the permissible range, for example, by winding it around the end surface of the substrate, the composite IC card incorporating this composite IC module can receive the antenna coil. The electromagnetic energy thus obtained can be transmitted to an IC chip by transformer coupling with a high coupling coefficient.

Further, by using a cored coil having a ferromagnetic core as the antenna of the external read / write device, communication characteristics can be improved by about two digits as compared with an antenna of an air-core coil. As a result, the advantage of the non-contact transmission function, that is, the effect of being able to further improve the communication sensitivity characteristic by "holding" the card near the antenna of the external read / write device, was obtained. In addition, an increase in the receiving sensitivity of the card has made it possible to increase the communication distance and / or suppress the transmission output of the external reading / writing device. This is because the transmission output for non-contact type IC cards (for composite IC cards) is regulated by the Radio Law.
It is convenient for cards. Since the connection between the IC module and the antenna circuit built in the card substrate is unnecessary, the IC card manufacturing related to the conventional technology of bonding and mounting the IC module in the fitting hole provided in the card substrate is not required. The process can be used as it is, and even if a mechanical stress such as a bending stress is applied to the card, there is no connection point between them, so that the risk of failure is extremely small.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an IC card system according to the present invention.

FIG. 2 is a schematic configuration diagram of an IC card system according to the present invention.

FIG. 3 is an explanatory diagram of mounting of a coupling coil of the IC module according to the first embodiment of the present invention.

FIG. 4 is an explanatory view of mounting a coupling coil of an IC module according to a second embodiment of the present invention.

FIG. 5 is an explanatory view of mounting a coupling coil of an IC module according to a third embodiment of the present invention.

FIG. 6 is an equivalent circuit diagram of a non-contact coupling circuit for explaining the principle of the non-contact transmission mechanism of the present invention.

[Explanation of symbols]

 1 ··· Compound IC card 2 ··· IC module 3 ··· Antenna coil 6 ··· Composite IC chip 7 ··· Terminal electrode 9 ··· Module board 10 ··· Card board 11 Fitting hole 16 Resin encapsulation 100 External read / write device 101 Transmitter / receiver circuit 102 Transmitter / receiver antenna 103 Magnetic core

 ──────────────────────────────────────────────────の Continued on the front page F term (reference) 2C005 MA33 MB01 MB07 NA02 NA09 NB03 NB16 PA02 RA07 RA15 RA16 TA22 5B035 AA04 AA13 BA03 BB09 CA01 CA23 5B058 CA13 CA17 KA32

Claims (14)

[Claims] A composite IC chip having a built-in contact-type transmission function and a non-contact type transmission function for an IC card, a module substrate having an external terminal serving as a contact-type transmission mechanism, and an antenna as a non-contact transmission mechanism. A composite IC module comprising: an external terminal formed on one surface of a module substrate by a conductor pattern; and an antenna opposite to an external terminal forming surface of the module substrate. A composite IC module, wherein the composite IC module is disposed on a surface of the composite IC module. 2. The composite IC module according to claim 1, wherein the antenna arranged in the composite IC module has a portion around which a conductive wire provided with an insulating film is wound. 3. The composite according to claim 1, wherein the antenna arranged in the composite IC module is formed by being wound around a sealing material of the IC chip. I
C module. 4. The antenna arranged in the composite IC module is formed by being wound around the IC chip, and the antenna is resin-sealed together with the IC chip. The composite I according to any one of 1 to 3,
C module. 5. The composite according to claim 1, wherein the antenna arranged in the composite IC module is formed by winding a conductive wire coated with an insulating film around an end face of the module substrate. IC module. 6. The antenna according to claim 1, wherein the antenna provided in the composite IC module is formed by winding a conductor coated with an insulating film in a toroidal shape. Complex I
C module. 7. A composite IC chip having a built-in contact-type transmission function and a non-contact type transmission function for an IC card, a module substrate having an external terminal serving as a contact-type transmission mechanism, and an antenna as a non-contact transmission mechanism. A composite IC card comprising an IC module provided and a card base, wherein the external terminals are formed by a conductor pattern on one surface of a module substrate, and the antenna is A composite IC card disposed on a surface of the substrate opposite to the surface on which the external terminals are formed. 8. The composite IC card according to claim 7, wherein the antenna arranged in the composite IC module has a portion wound with a conductive wire provided with an insulating film. 9. The composite according to claim 7, wherein the antenna arranged in the composite IC module is formed by being wound around a sealing material of the IC chip. IC card. 10. The antenna disposed in the composite IC module is formed by being wound around the IC chip, and the antenna is resin-sealed together with the IC chip. The composite I according to any one of 7 to 9,
C card. 11. The composite according to claim 7, wherein the antenna arranged in the composite IC module is formed by winding a conductive wire coated with an insulating film around an end surface of the module substrate. IC card. 12. The antenna according to claim 7, wherein the antenna disposed in the composite IC module is formed by winding a conductor coated with an insulating film in a toroidal shape. Composite IC card. 13. A IC card system comprising an IC card and its reading and writing apparatus, the IC card comprises an IC module and the card substrate, said IC module contact type transfer function and the non-contact type for IC card A composite IC chip having a built-in transmission function, a module substrate having an external terminal which is a contact type transmission mechanism, and an antenna serving as a non-contact transmission mechanism. The external terminal is provided on one side of the module substrate. The antenna is a composite IC card arranged on a surface different from the external terminal forming surface of the module substrate, wherein the read / write device is provided with a contact type read / write mechanism. A contact-type read / write mechanism for supplying power and / or transmitting information to and from the IC module without contact; Composite IC card system for reading and writing antenna read and write mechanism, to have a high permeability core, characterized by. 14. A composite IC card system using the composite IC card according to claim 8.