JP2000188056A - Protection element and its manufacture - Google Patents
Protection element and its manufactureInfo
- Publication number
- JP2000188056A JP2000188056A JP10364894A JP36489498A JP2000188056A JP 2000188056 A JP2000188056 A JP 2000188056A JP 10364894 A JP10364894 A JP 10364894A JP 36489498 A JP36489498 A JP 36489498A JP 2000188056 A JP2000188056 A JP 2000188056A
- Authority
- JP
- Japan
- Prior art keywords
- insulating
- bottom plate
- conductive
- insulating base
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000011521 glass Substances 0.000 claims abstract description 43
- 239000002245 particle Substances 0.000 claims abstract description 42
- 239000002241 glass-ceramic Substances 0.000 claims abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052709 silver Inorganic materials 0.000 claims abstract description 10
- 239000004332 silver Substances 0.000 claims abstract description 10
- 239000000919 ceramic Substances 0.000 claims abstract description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 46
- 230000001681 protective effect Effects 0.000 claims description 25
- 239000002002 slurry Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000004062 sedimentation Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、所定の抵抗値を有
し過電流によって電流を遮断する保護素子に関する。本
発明はまた、前記の保護素子の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a protection element having a predetermined resistance value and interrupting a current by an overcurrent. The present invention also relates to a method for manufacturing the above-mentioned protection element.
【０００２】[0002]
【従来の技術】過電流で電流を遮断する保護素子として
は、低融点合金を用いたものが一般的である。その代表
的なものについて、以下説明する。図９は従来の保護素
子の縦断面図である。図９において、３１は低融点合金
よりなる保護素子本体で、ガラス筒体３２の中に収容さ
れており、前記ガラス筒体３２の両端部には金属キャッ
プ３３、３４が固着されており、前記低融点合金３１は
これら金属キャップ３３、３４の中心孔を貫通して、は
んだ３５、３６により金属キャップ３３、３４に接続固
着してある。2. Description of the Related Art As a protection element for interrupting an electric current by an overcurrent, an element using a low melting point alloy is generally used. Representative examples will be described below. FIG. 9 is a longitudinal sectional view of a conventional protection element. In FIG. 9, reference numeral 31 denotes a protective element body made of a low melting point alloy, which is accommodated in a glass cylinder 32, and metal caps 33 and 34 are fixed to both ends of the glass cylinder 32, respectively. The low melting point alloy 31 penetrates through the center holes of the metal caps 33 and 34 and is connected and fixed to the metal caps 33 and 34 by solders 35 and 36.
【０００３】[0003]
【発明が解決しようとする課題】上記構成の保護素子に
おいては、低融点合金よりなる保護素子本体３１をガラ
ス筒体３２に収容しているので、機械的強度が小さいと
いう問題点があるのみならず、保護素子本体３１の金属
キャップ５、６への挿通、金属キャップ３３、３４のガ
ラス筒体３４への固着および金属キャップ３３、３４と
保護素子本体３１とのはんだ付けが必要であり、組立が
煩雑であるという問題がある。また、この保護素子を回
路に取り付けるには、ソケット４０が必要であるという
問題がある。そこで、本発明は、機械的強度が大きく、
製造容易な保護素子を提供することを目的とする。本発
明はまた、上記の保護素子の製造方法を提供することを
目的とする。In the protective element having the above structure, since the protective element body 31 made of a low melting point alloy is housed in the glass tube 32, there is only a problem that the mechanical strength is small. It is necessary to insert the protection element body 31 into the metal caps 5 and 6, fix the metal caps 33 and 34 to the glass cylinder 34, and solder the metal caps 33 and 34 to the protection element body 31. Is complicated. Further, there is a problem that a socket 40 is required to attach the protection element to a circuit. Therefore, the present invention has a large mechanical strength,
An object of the present invention is to provide a protection element that is easy to manufacture. Another object of the present invention is to provide a method for manufacturing the above-described protection element.
【０００４】[0004]
【課題を解決するための手段】本発明は、底板部および
枠体部を有する絶縁性ベースと、この絶縁性ベースの内
方から外方に導出された電極と、前記底板部および枠体
部で囲まれる凹部の下方に位置する絶縁媒質中に導電性
粒子が高密度に存在する導電層と、前記凹部の上方に位
置する実質的に絶縁媒質のみよりなる絶縁層とを有する
保護素子である。本発明はまた、底板部および枠体部を
有する絶縁性ベースと、この絶縁性ベースの内方から外
方に導出された電極とを有する保護素子容器内に、絶縁
媒質中に導電性粒子を分散した導電ガラススラリーを注
入する工程と、前記スラリーを加熱して固化させる工程
とを含むことを特徴とする保護素子の製造方法である。SUMMARY OF THE INVENTION The present invention provides an insulating base having a bottom plate and a frame, electrodes extending from the inside to the outside of the insulating base, and the bottom plate and the frame. A protective element having a conductive layer in which conductive particles exist at a high density in an insulating medium located below a concave portion surrounded by a concave portion, and an insulating layer substantially consisting only of the insulating medium located above the concave portion. . The present invention also provides an insulating base having a bottom plate portion and a frame portion, and a protective element container having electrodes led out from the inside of the insulating base to the outside. A method for manufacturing a protective element, comprising: a step of injecting a dispersed conductive glass slurry; and a step of heating and solidifying the slurry.
【０００５】[0005]
【発明の実施の形態】本発明の請求項１記載の発明は、
底板部および枠体部を有する絶縁性ベースと、この絶縁
性ベースの内方から外方に導出された電極と、前記底板
部および枠体部で囲まれる凹部の下方に位置する絶縁媒
質中に導電性粒子が高密度に存在する導電層と、前記凹
部の上方に位置する実質的に絶縁媒質のみよりなる絶縁
層とを有する保護素子である。BEST MODE FOR CARRYING OUT THE INVENTION
An insulating base having a bottom plate portion and a frame portion, an electrode extending outward from the inside of the insulating base, and an insulating medium located below a recess surrounded by the bottom plate portion and the frame portion. The protection element includes a conductive layer in which conductive particles are present at a high density, and an insulating layer, which is located above the concave portion and is substantially composed of only an insulating medium.
【０００６】本発明の請求項２記載の発明は、底板部お
よび枠体部を有する絶縁性ベースと、この絶縁性ベース
の内方から外方に導出された電極と、前記底板部および
枠体部で囲まれる凹部の下方に位置する絶縁媒質中に導
電性粒子が高密度に存在する導電層と、前記凹部の上方
に位置する実質的に絶縁媒質のみよりなる絶縁層とを有
し、前記導電層と絶縁層との間で導電性粒子の密度が連
続的に変化している保護素子である。According to a second aspect of the present invention, there is provided an insulating base having a bottom plate and a frame, electrodes extending from inside to outside of the insulating base, the bottom plate and the frame. A conductive layer in which conductive particles are present at a high density in an insulating medium located below the concave portion surrounded by the portion, and an insulating layer substantially consisting only of the insulating medium located above the concave portion, This is a protection element in which the density of the conductive particles continuously changes between the conductive layer and the insulating layer.
【０００７】本発明の請求項３記載の発明は、底板部お
よび枠体部を有するセラミック製またはガラスセラミッ
ク製の絶縁性ベースと、この絶縁性ベースの内方から外
方に導出された電極と、前記底板部および枠体部で囲ま
れる凹部の下方に位置する絶縁媒質中に導電性粒子が高
密度に存在する導電層と、前記凹部の上方に位置する実
質的に絶縁媒質のみよりなる絶縁層とを有する保護素子
である。According to a third aspect of the present invention, there is provided an insulating base made of ceramic or glass ceramic having a bottom plate portion and a frame portion, and an electrode extending from the inside to the outside of the insulating base. A conductive layer in which conductive particles are present at a high density in an insulating medium located below the concave portion surrounded by the bottom plate portion and the frame portion; and an insulating layer substantially consisting of only the insulating medium located above the concave portion. And a protective element.
【０００８】本発明の請求項４記載の発明は、底板部お
よび枠体部を有する絶縁性ベースと、この絶縁性ベース
の内方から外方に導出された電極と、前記底板部および
枠体部で囲まれる凹部の下方に位置する絶縁媒質中に銀
粒子が高密度に存在する導電層と、前記凹部の上方に位
置する実質的に絶縁媒質のみよりなる絶縁層とを有する
保護素子である。According to a fourth aspect of the present invention, there is provided an insulating base having a bottom plate and a frame, electrodes extending from inside to outside of the insulating base, the bottom plate and the frame. A protective layer having a conductive layer in which silver particles are present at a high density in an insulating medium located below a concave portion surrounded by a portion, and an insulating layer substantially consisting only of the insulating medium located above the concave portion. .
【０００９】本発明の請求項５記載の発明は、底板部お
よび枠体部を有するアルミナセラミック製またはガラス
セラミック製のベースと、このベースの内方から外方に
導出された電極と、前記底板部および枠体部で囲まれる
凹部の下方に位置するガラス中に銀粒子が高密度に存在
する導電層と、前記凹部の上方に位置する実質的にガラ
スのみよりなる絶縁層とを有する保護素子である。According to a fifth aspect of the present invention, there is provided a base made of alumina ceramic or glass ceramic having a bottom plate portion and a frame portion, an electrode led out from inside to outside of the base, and the bottom plate. A protective element having a conductive layer in which silver particles are present at a high density in glass located below a concave portion surrounded by a portion and a frame portion, and an insulating layer substantially consisting only of glass located above the concave portion It is.
【００１０】本発明の請求項６記載の発明は、底板部お
よび枠体部を有する絶縁性ベースと、この絶縁性ベース
の内方から外方に導出された電極とを有する保護素子容
器内に、絶縁媒質中に導電性粒子を分散した導電ガラス
スラリーを入れる工程と、前記導電ガラススラリーを加
熱して固化させる工程とを含むことを特徴とする保護素
子の製造方法である。According to a sixth aspect of the present invention, there is provided a protective element container having an insulating base having a bottom plate portion and a frame portion, and electrodes extending from the inside to the outside of the insulating base. And a step of placing a conductive glass slurry in which conductive particles are dispersed in an insulating medium, and a step of heating and solidifying the conductive glass slurry.
【００１１】本発明の請求項７記載の発明は、底板部お
よび枠体部を有する絶縁性ベースと、この絶縁性ベース
の内方から外方に導出された電極とを有する保護素子容
器内に、絶縁媒質中に導電性粒子を分散した導電ガラス
スラリーを注入する工程と、前記導電ガラススラリー中
の導電性粒子を沈降させる工程と、前記導電ガラススラ
リーを加熱して固化させる工程とを含むことを特徴とす
る保護素子の製造方法である。According to a seventh aspect of the present invention, there is provided a protective element container having an insulating base having a bottom plate portion and a frame portion, and electrodes extending from the inside to the outside of the insulating base. Including a step of injecting a conductive glass slurry in which conductive particles are dispersed in an insulating medium, a step of allowing the conductive particles in the conductive glass slurry to settle, and a step of heating and solidifying the conductive glass slurry. A method for manufacturing a protection element characterized by the following.
【００１２】[0012]
【実施例】本発明の実施例について、以下、図面を参照
して説明する。図１は本発明の一実施例の保護素子Ａの
縦断面図、図１は図２の保護素子Ａの平面図で、前記図
１は図２の保護素子ＡのＡ−Ａ線に沿う縦断面図であ
る。図１および図２において、１はセラミック製または
カラスセラミツク製の絶縁性ベースで、底板部２と枠体
部３とを一体に有する。４、５は前記絶縁性ベース１の
内方から外方に導出されている電極で、銀ペーストまた
は銀パラジウムペースト等を塗布・焼成して形成されて
おり、一方の電極４は底板部２の長手方向の一端の上面
から、前記底板部２と枠体部３との間を通って外部に導
出され、さらに絶縁性ベース１の端面部を通って底板部
２の裏面まで延在して形成されている。他方の電極５は
底板部２の長手方向の一端の上面から、前記底板部２と
枠体部３との間を通って外部に導出され、さらに絶縁性
ベース１の端面部を通って底板部２の裏面まで延在して
形成されている。そして、前記底板部２と枠体部３とで
囲まれる凹部６には、その下方に絶縁媒質７であるガラ
ス中に、導電性粒子８、例えば銀粒子を高密度に分散し
た導電層９と、その上方の実質的に絶縁媒質７であるガ
ラスのみからなる絶縁層１０とを有している。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a longitudinal sectional view of a protection element A according to one embodiment of the present invention, FIG. 1 is a plan view of the protection element A of FIG. 2, and FIG. 1 is a longitudinal section of the protection element A of FIG. FIG. 1 and 2, reference numeral 1 denotes an insulating base made of ceramic or crow ceramic, which has a bottom plate 2 and a frame 3 integrally. Reference numerals 4 and 5 denote electrodes extending from the inside of the insulating base 1 to the outside. The electrodes are formed by applying and baking a silver paste or a silver-palladium paste or the like. It extends from the upper surface of one end in the longitudinal direction to the outside through the space between the bottom plate portion 2 and the frame body portion 3, and further extends through the end surface portion of the insulating base 1 to the back surface of the bottom plate portion 2. Have been. The other electrode 5 is led out from the upper surface of one end in the longitudinal direction of the bottom plate portion 2 through the space between the bottom plate portion 2 and the frame body portion 3, and further passes through the end surface portion of the insulating base 1. 2 is formed to extend to the back surface. In the concave portion 6 surrounded by the bottom plate portion 2 and the frame portion 3, a conductive layer 9 in which conductive particles 8, for example, silver particles are dispersed at a high density, in a glass serving as an insulating medium 7 is provided below the concave portion 6. And an insulating layer 10 made of only glass, which is substantially the insulating medium 7, above the insulating layer.
【００１３】上記の保護素子Ａにおいては、セラミック
製またはガラスセラミック製の絶縁性ベース１を用い、
表面がガラスよりなる絶縁層１０で被覆されているの
で、機械的強度が大きく、また、電極４、５が絶縁性ベ
ース１の底板部２の裏面まで延在して形成されているの
で、これらの電極４、５を利用して、直接プリント基板
当の取付基板に固着できる。しかも、前記電極４、５は
後述するように同時に形成され、また、前記導電層９と
絶縁層１０も後述するように同時に形成されるのみなら
ず、前記電極４、５と導電層９との接続や、導電層９の
表面の絶縁層１０による封止は自動的に行われるので、
著しく容易に製造できるという特長がある。In the protection element A, an insulating base 1 made of ceramic or glass ceramic is used.
Since the front surface is covered with the insulating layer 10 made of glass, the mechanical strength is high, and the electrodes 4 and 5 are formed to extend to the back surface of the bottom plate 2 of the insulating base 1. Utilizing the electrodes 4 and 5 described above, it can be directly fixed to a mounting board such as a printed board. Moreover, the electrodes 4 and 5 are formed simultaneously as described later, and the conductive layer 9 and the insulating layer 10 are not only formed simultaneously as described later but also formed by the electrodes 4 and 5 and the conductive layer 9. Since the connection and the sealing of the surface of the conductive layer 9 by the insulating layer 10 are performed automatically,
It has the feature that it can be manufactured extremely easily.
【００１４】図３は本発明の保護素子Ａの製造方法につ
いて説明するための製造工程ブロック図で、図４ないし
図７は前記各工程における状態を示す中間構体の斜視
図、平面図、縦断面図である。以下、図３ないし図７を
用いて、本発明の保護素子Ａの製造方法について説明す
る。まず、図４および図５に示す保護素子用容器を製作
する（図３ａ）。図４および図５に示す保護素子用容器
において、１は絶縁性ベースの一例としての熱膨張係数
が１０〜１５×１０-6／℃のガラスセラミック製の絶縁
性ベースで、底板部２と枠体部３とを有し、長手方向の
両端部に電極４、５を有する。前記電極４、５は、前記
底板部２と枠体部３とで囲まれる凹部６の底面に内方端
部が露出し、外方端部は絶縁性ベース１の端面部を通っ
て底板部２の裏面まで延在して形成されている。前記の
ような熱膨張係数の絶縁性ベース１は、例えば、ガラス
中に３０〜７０ｗｔ％のフォルステライト粉末を含むガ
ラスセラミックグリーンシートで製作することができ
る。すなわち、前記の組成のガラスセラミックグリーン
シートからなり長手方向の両端に電極４、５を有する底
板部２と、同一組成のガラスセラミックグリーンシート
からなる枠体部３とを重ね合わせてプレスし、焼結一体
化することによって製造できる。次に、前記保護素子用
容器の底板部２と枠体部３とによって囲まれる凹部６
に、図６に示すように、絶縁媒質７、例えばガラス粒子
およびバインダ中に、導電性粒子８、例えば粒径が１〜
１０ｎｍの銀粒子を２〜４ｗｔ％分散した、比抵抗が
３，０００〜１０，０００×１０-8Ω-ｃｍの導電ガラ
ススラリー１１を注入する（図３ｂ）。次に、図７に示
すように、前記凹部６内に導電ガラススラリー１１を満
たした状態で、所定時間放置して、あるいは積極的に加
振して、導電ガラススラリー１１の中の導電性粒子８と
ガラス粒子７との比重差を利用して、導電性粒子８を沈
降させる（図３ｃ）。すると、凹部６内の下方には導電
性粒子８が高密度に分散された導電層９が形成されると
ともに、上方には実質的に導電性粒子８を含まないガラ
スのみからなる絶縁層１０が形成される。この沈降工程
に要する時間は、加振の有無や導電ガラススラリー１１
の粘度等によって異なるが、概ね５〜１５分間程度でよ
い。最後に、３００〜４００℃で５〜１０分間程度加熱
焼結すれば、導電ガラススラリー１１中のバインダが焼
失して、図１に示すように、凹部６の内部の下方に導電
性粒子８が高密度に分散された導電層９が形成されると
ともに、上方には導電性粒子８を実質的に含まない絶縁
層１０が形成され、しかも前記下方の導電層９が電極
４、５と電気的に接続された保護素子Ａが得られる（図
３ｄ）。前記の条件で製造した保護素子Ａは、例えば、
０．１〜０．５Ω -ｃｍの抵抗値を有し、５〜８ＶＤＣ
の使用電圧で３０〜１００ｍＡで溶断動作することが確
認された。FIG. 3 is a manufacturing process block diagram for explaining a method of manufacturing the protection element A according to the present invention. FIGS. 4 to 7 are perspective views, plan views, and longitudinal cross-sectional views of the intermediate structure showing states in the respective steps. FIG. Hereinafter, a method for manufacturing the protection element A of the present invention will be described with reference to FIGS. First, the protective element container shown in FIGS. 4 and 5 is manufactured (FIG. 3A). In the protective element container shown in FIGS. 4 and 5, reference numeral 1 denotes an insulating base made of glass ceramic having a thermal expansion coefficient of 10 to 15 × 10 −6 / ° C. as an example of the insulating base. And electrodes 4 and 5 at both ends in the longitudinal direction. The inner ends of the electrodes 4, 5 are exposed at the bottom surface of the concave portion 6 surrounded by the bottom plate 2 and the frame 3, and the outer ends pass through the end surface of the insulating base 1. 2 is formed to extend to the back surface. The insulating base 1 having the above-described coefficient of thermal expansion can be made of, for example, a glass-ceramic green sheet containing 30 to 70 wt% forsterite powder in glass. That is, a bottom plate portion 2 made of a glass ceramic green sheet having the above-described composition and having electrodes 4 and 5 at both ends in a longitudinal direction, and a frame portion 3 made of a glass ceramic green sheet having the same composition are overlaid and pressed, followed by firing. It can be manufactured by tying and integrating. Next, the concave portion 6 surrounded by the bottom plate portion 2 and the frame portion 3 of the protective element container.
As shown in FIG. 6, conductive particles 8, for example, having a particle size of 1 to 1 in insulating medium 7, for example, glass particles and a binder.
A conductive glass slurry 11 having a specific resistance of 3,000 to 10,000 × 10 −8 Ω-cm, in which 2 to 4 wt% of 10 nm silver particles are dispersed (FIG. 3B), is injected. Next, as shown in FIG. 7, in a state where the conductive glass slurry 11 is filled in the recess 6, the conductive particles in the conductive glass slurry 11 are left standing for a predetermined time or vibrated vigorously. The conductive particles 8 are settled by utilizing the difference in specific gravity between the glass particles 7 and the glass particles 7 (FIG. 3C). As a result, a conductive layer 9 in which conductive particles 8 are dispersed at a high density is formed below the concave portion 6, and an insulating layer 10 made of only glass substantially containing no conductive particles 8 is formed above. It is formed. The time required for the sedimentation step depends on whether or not there is vibration and whether the conductive glass slurry 11
Although it depends on the viscosity and the like, it may be about 5 to 15 minutes. Lastly, if sintering is performed at 300 to 400 ° C. for about 5 to 10 minutes, the binder in the conductive glass slurry 11 is burned off, and as shown in FIG. A conductive layer 9 dispersed at a high density is formed, an insulating layer 10 substantially free of conductive particles 8 is formed above, and the lower conductive layer 9 is electrically connected to the electrodes 4 and 5. Is obtained (FIG. 3d). The protection element A manufactured under the above conditions is, for example,
Having a resistance of 0.1-0.5Ω-cm, 5-8VDC
It was confirmed that the fusing operation was performed at a working voltage of 30 to 100 mA.
【００１５】上記の製造方法によれば、導電ガラススラ
リー１１中の導電性粒子８の沈降によって、自動的に導
電層９および絶縁層１０が形成されるとともに、導電層
９が電極４、５と電気的に接続されるので、従来の保護
素子のような、各種部品の組み付けおよび接続等の煩雑
な作業は一切不要になり、しかも、導電性粒子８の沈降
は多数個を同時に実施できるので、加工費を低減できる
という特長がある。According to the above manufacturing method, the conductive layer 9 and the insulating layer 10 are automatically formed by the sedimentation of the conductive particles 8 in the conductive glass slurry 11, and the conductive layer 9 is Since they are electrically connected, complicated operations such as assembling and connecting various parts such as conventional protection elements are not required at all, and the settling of the conductive particles 8 can be performed simultaneously for many pieces, It has the feature that processing costs can be reduced.
【００１６】なお、上記実施例は特定の構成の保護素子
Ａについて説明したが、本発明はこの構成の保護素子Ａ
に限定されるものではなく、本発明の精神を逸脱しない
範囲で各種の変形された構成が採用できる。例えば、上
記の保護素子Ａでは、絶縁性ベース１の長手方向の平坦
な両端部に電極を形成したものについて説明したが、図
８に示すように、絶縁性ベース２１の長手方向の両端部
に電極形成用の凹部２２、２３を設けて、この凹部２
２、２３内に電極４、５を形成するようにしてもよい。
このような構成によれば、凹部２２、２３を利用して、
絶縁性ベース２１の端面部に必要な厚さの電極４、５が
容易に形成できるのみならず、プリント基板等への実装
時に、凹部２２、２３部分にはんだが凝集しやすくなっ
て、はんだ付けが容易かつ確実になるという特長があ
る。また、電極４、５が絶縁性ベース１の端面部を通っ
て底板部２の裏面まで延在して形成された表面実装型の
ものを示したが、もし必要ならば、電極４、５の外方端
部にリードを接続したものでもよい。このような構成に
よれば、既存の電子機器等への組み付けが容易に行え
る。In the above embodiment, the protection element A having a specific configuration has been described.
The present invention is not limited to this, and various modified configurations can be adopted without departing from the spirit of the present invention. For example, in the above-described protection element A, a description has been given of a case in which electrodes are formed at both ends in the longitudinal direction of the insulating base 1. However, as shown in FIG. By providing concave portions 22 and 23 for forming electrodes,
The electrodes 4 and 5 may be formed in 2 and 23.
According to such a configuration, using the concave portions 22 and 23,
Not only electrodes 4 and 5 having a required thickness can be easily formed on the end face of the insulating base 21, but also solder tends to agglomerate in the recesses 22 and 23 during mounting on a printed circuit board or the like. Is easy and reliable. Also, the surface mount type in which the electrodes 4 and 5 are formed so as to extend to the back surface of the bottom plate 2 through the end surface of the insulating base 1 is shown. A lead connected to the outer end may be used. According to such a configuration, it can be easily assembled to an existing electronic device or the like.
【００１７】さらに、上記実施例による製造方法では、
絶縁性ベース１の凹部６内に導電ガラススラリー１１を
注入後、沈降させる工程を設ける場合について説明した
が、このような沈降工程を設けることにより、安定した
抵抗値の保護素子が得られる利点はあるが、この沈降工
程を省略しても、導電ガラススラリー１１中の絶縁媒質
７の加熱溶融時に、導電性粒子８と絶縁媒質７との比重
差により、導電性粒子８の沈降動作は得られる。Further, in the manufacturing method according to the above embodiment,
A case has been described in which a step of injecting the conductive glass slurry 11 into the concave portion 6 of the insulating base 1 and then settling is provided. By providing such a settling step, the advantage that a protection element having a stable resistance value can be obtained is provided. However, even if this sedimentation step is omitted, the sedimentation operation of the conductive particles 8 can be obtained due to the specific gravity difference between the conductive particles 8 and the insulating medium 7 when the insulating medium 7 in the conductive glass slurry 11 is heated and melted. .
【００１８】[0018]
【発明の効果】本発明は以上のように、底板部および枠
体部を有する絶縁性ベースと、この絶縁性ベースの内方
から外方に導出され電極と、前記底板部および枠体部で
囲まれる凹部の下方に位置する絶縁媒質中に導電性粒子
が高密度に存在する導電層と、前記凹部の上方に位置す
る実質的に絶縁媒質のみよりなる絶縁層とを有する保護
素子であるから、従来の保護素子に比較して、機械的強
度が大きく、製造容易な保護素子が提供できる。本発明
はまた、底板部および枠体部を有する絶縁性ベースと、
この絶縁性ベースの内方から外方に導出され電極とを有
する保護素子容器内に、絶縁媒質中に導電性粒子を分散
した導電ガラススラリーを注入する工程と、前記導電ガ
ラススラリーを加熱して固化させる工程とを含むことを
特徴とする保護素子の製造方法であるから、前記の保護
素子を効率よく大量生産できる製造方法を提供できると
いう効果を奏する。As described above, according to the present invention, the insulating base having the bottom plate and the frame, the electrode led out from the inside of the insulating base to the outside, and the bottom plate and the frame are used. Since the protective element includes a conductive layer in which conductive particles are present at a high density in the insulating medium located below the enclosed recess and an insulating layer substantially including only the insulating medium located above the recess. In addition, a protection element having a higher mechanical strength than the conventional protection element and easy to manufacture can be provided. The present invention also provides an insulating base having a bottom plate portion and a frame portion,
A step of injecting a conductive glass slurry in which conductive particles are dispersed in an insulating medium into a protective element container having an electrode led out from the inside of the insulating base to the outside, and heating the conductive glass slurry And a step of solidifying the protective element. Therefore, there is an effect that it is possible to provide a manufacturing method capable of efficiently mass-producing the protective element.
【図１】 図２に示す本発明の一実施例の保護素子Ａの
Ａ−Ａ線に沿う縦断面図FIG. 1 is a longitudinal sectional view taken along line AA of a protection element A of one embodiment of the present invention shown in FIG.
【図２】 図１の保護素子Ａの平面図FIG. 2 is a plan view of the protection element A of FIG.
【図３】 図１の保護素子Ａの製造方法について説明す
るための工程ブロック図FIG. 3 is a process block diagram for explaining a method of manufacturing the protection element A of FIG. 1;
【図４】 本発明の保護素子Ａの製造に用いる容器の斜
視図FIG. 4 is a perspective view of a container used for manufacturing the protection element A of the present invention.
【図５】 図４の容器の平面図FIG. 5 is a plan view of the container of FIG. 4;
【図６】 図４の容器の容器の凹部内に導電ガラススラ
リーを注入している状態を示す縦断面図FIG. 6 is a longitudinal sectional view showing a state where a conductive glass slurry is poured into a concave portion of the container of the container of FIG. 4;
【図７】 図４の容器の容器の凹部内に導電ガラススラ
リーを注入し終わった状態の縦断面図FIG. 7 is a longitudinal sectional view showing a state where the conductive glass slurry has been poured into the concave portion of the container of the container shown in FIG. 4;
【図８】 本発明の第２実施例の保護素子Ｂの平面図FIG. 8 is a plan view of a protection element B according to a second embodiment of the present invention.
【図９】 従来の代表的な保護素子の縦断面図FIG. 9 is a longitudinal sectional view of a conventional typical protection element.
Ａ、Ｂ 保護素子 １、２１ 絶縁性ベース ２ 底板部 ３ 枠体部 ４、５ 電極 ６ 凹部 ７ 絶縁媒質（ガラス） ８ 導電性粒子（銀粒子） ９ 導電層 １０ 絶縁層 １１ 導電ガラススラリー ２２、２３ 凹部 A, B Protective element 1, 21 Insulating base 2 Bottom plate 3 Frame 4, Electrode 6 Depression 7 Insulating medium (glass) 8 Conductive particles (silver particles) 9 Conductive layer 10 Insulating layer 11 Conductive glass slurry 22, 23 recess
Claims (7)
と、この絶縁性ベースの内方から外方に導出された電極
と、前記底板部および枠体部で囲まれる凹部の下方に位
置する絶縁媒質中に導電性粒子が高密度に存在する導電
層と、前記凹部の上方に位置する実質的に絶縁媒質のみ
よりなる絶縁層とを有する保護素子。1. An insulating base having a bottom plate and a frame, an electrode extending from the inside to the outside of the insulating base, and a position below a recess surrounded by the bottom plate and the frame. A protection element comprising: a conductive layer in which conductive particles are present at a high density in an insulating medium to be formed; and an insulating layer located substantially above the concave portion and substantially consisting only of the insulating medium.
と、この絶縁性ベースの内方から外方に導出された電極
と、前記底板部および枠体部で囲まれる凹部の下方に位
置する絶縁媒質中に導電性粒子が高密度に存在する導電
層と、前記凹部の上方に位置する実質的に絶縁媒質のみ
よりなる絶縁層との間で、導電性粒子の密度が連続的に
偏している保護素子。2. An insulating base having a bottom plate portion and a frame portion, electrodes extending from the inside to the outside of the insulating base, and a portion positioned below a recess surrounded by the bottom plate portion and the frame portion. The density of the conductive particles is continuously biased between the conductive layer in which the conductive particles are present at a high density in the insulating medium to be formed and the insulating layer which is located above the concave portion and is substantially composed of only the insulating medium. Protective element.
またはガラスセラミック製の絶縁性ベースと、この絶縁
性ベースの内方から外方に導出された電極と、前記底板
部および枠体部で囲まれる凹部の下方に位置する絶縁媒
質中に導電性粒子が高密度に存在する導電層と、前記凹
部の上方に位置する実質的に絶縁媒質のみよりなる絶縁
層とを有する保護素子。3. An insulating base made of ceramic or glass ceramic having a bottom plate portion and a frame portion, electrodes extending from the inside to the outside of the insulating base, and the bottom plate portion and the frame portion. A protective element comprising: a conductive layer in which conductive particles are present at a high density in an insulating medium located below an enclosed recess; and an insulating layer substantially consisting of only an insulating medium located above the recess.
と、この絶縁性ベースの内方から外方に導出された電極
と、前記底板部および枠体部で囲まれる凹部の下方に位
置する絶縁媒質中に銀粒子が高密度に存在する導電層
と、前記凹部の上方に位置する実質的に絶縁性媒質のみ
よりなる絶縁層とを有する保護素子。4. An insulating base having a bottom plate portion and a frame portion, electrodes extending from the inside to the outside of the insulating base, and a portion located below a concave portion surrounded by the bottom plate portion and the frame portion. A protective element comprising: a conductive layer in which silver particles are present at a high density in an insulating medium to be formed; and an insulating layer, which is located above the concave portion and is substantially composed of only an insulating medium.
ミック製またはガラスセラミック製のベースと、このベ
ースの内方から外方に導出された電極と、前記底板部お
よび枠体部で囲まれる凹部の下方に位置するガラス中に
銀粒子が高密度に存在する導電層と、前記凹部の上方に
位置する実質的にガラスのみよりなる絶縁層とを有する
保護素子。5. A base made of alumina ceramic or glass ceramic having a bottom plate portion and a frame portion, an electrode led out from inside to outside of the base, and a concave portion surrounded by the bottom plate portion and the frame portion. A protective layer having a conductive layer in which silver particles are present at a high density in glass located below the insulating layer, and an insulating layer substantially consisting only of glass located above the concave portion.
と、この絶縁性ベースの内方から外方に導出された電極
とを有する保護素子容器内に、絶縁媒質中に導電性粒子
を分散した導電ガラススラリーを注入する工程と、前記
導電ガラススラリーを加熱して固化させる工程とを含む
ことを特徴とする保護素子の製造方法。6. A protective element container having an insulating base having a bottom plate portion and a frame portion, and electrodes extending from the inside to the outside of the insulating base, wherein conductive particles are contained in an insulating medium. A method for manufacturing a protective element, comprising: a step of injecting a dispersed conductive glass slurry; and a step of heating and solidifying the conductive glass slurry.
と、この絶縁性ベースの内方から外方に導出された電極
とを有する保護素子容器内に、絶縁媒質中に導電性粒子
を分散した導電ガラススラリーを注入する工程と、前記
導電ガラススラリー中の導電性粒子を沈降させる工程
と、前記導電ガラススラリーを加熱して固化させる工程
とを含むことを特徴とする保護素子の製造方法。7. A protective element container having an insulating base having a bottom plate portion and a frame portion and electrodes extending from the inside to the outside of the insulating base is provided with conductive particles in an insulating medium. A method of manufacturing a protective element, comprising: a step of injecting a dispersed conductive glass slurry; a step of causing conductive particles in the conductive glass slurry to settle; and a step of heating and solidifying the conductive glass slurry. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10364894A JP2000188056A (en) | 1998-12-22 | 1998-12-22 | Protection element and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10364894A JP2000188056A (en) | 1998-12-22 | 1998-12-22 | Protection element and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000188056A true JP2000188056A (en) | 2000-07-04 |
Family
ID=18482936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10364894A Withdrawn JP2000188056A (en) | 1998-12-22 | 1998-12-22 | Protection element and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000188056A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009193950A (en) * | 2008-01-17 | 2009-08-27 | Yazaki Corp | Battery direct fuse unit and method for manufacturing the fuse unit |
-
1998
- 1998-12-22 JP JP10364894A patent/JP2000188056A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009193950A (en) * | 2008-01-17 | 2009-08-27 | Yazaki Corp | Battery direct fuse unit and method for manufacturing the fuse unit |
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