JP2000105267A - Semiconductor part inspecting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely inspect a semiconductor part having irregularities such as a chip size package semiconductor flip chip packaged with semiconductor chips different in thickness. SOLUTION: In inspecting, a semiconductor part 1 is installed in a designated position and an electrode terminal 14 and a measuring terminal 3 are opposite to each other. A cover 4 is put on the main body 2 and the upper part of the semiconductor part 1 to be pressed. A bag 5 is soft because of the material quality and an inner liquid 51 so that it surely comes into contact with the surfaces of both semiconductor chips 11, 12 different in height of the surface of the semiconductor 1. When the semiconductor chips are pressed by the liquid 51 in the bag 5, even if the semiconductor chips are different in thickness, the pressure of the same magnitude is equally applied to the surfaces of the chips by hydrostatic pressure. Accordingly, the semiconductor part 1 can be uniformly pressed without inclination so that the electrode terminal 14 and the measuring terminal 3 surely come into contact with each other electrically to enable stable measurement.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor component inspection apparatus for electrically inspecting a semiconductor component such as an integrated circuit.

[0002]

2. Description of the Related Art Microcomputers and other logic circuit elements are formed on a semiconductor substrate to form a BGA (Ball G
It is housed in a package having several hundred electrodes on the back surface, such as a rid allay (CSP) or a CSP (Chip Size Package). The functions and electrical characteristics of such electronic components are tested and measured before the product is shipped or by the user.

A conventional measurement technique will be described below with reference to FIG. FIG. 3 is a cross-sectional view showing a socket portion for electrically connecting a semiconductor component to an inspection device in a conventional semiconductor component inspection device. The semiconductor component 1 has a large number of electrode terminals 14 two-dimensionally arranged on the back surface such as BGA or CSP.
The semiconductor chips 11 and 12 are provided.
The inspection device includes a main body 2 and an electrode terminal 1 of the semiconductor component 1.
4 and a probe terminal of a spring probe type arranged so as to face each of the main body 4 and the main body 2 of the inspection apparatus.
Terminal 14 of semiconductor component 1 installed at a predetermined position
And a lid 4 for electrically connecting the measuring terminal 3 of the inspection device to the semiconductor component 1 from above. The lid 4 is made of a metal such as aluminum or a material such as a hard resin, and is configured to press the surface of the semiconductor component 1 with a surface, a side, or a point.
In this way, the semiconductor component and the inspection device are electrically connected and measured.

[0004]

However, in the conventional configuration, as shown in FIG. 3, when the semiconductor chips 11 and 12 have different thicknesses due to the difference in the manufacturing method,
Due to the formation of steps and irregularities, the inspection apparatus is inclined and fixed inside. For this reason, the contact between a part of the electrode terminal 14 and the measuring terminal is insufficient, so that the measurement cannot be performed, or a large non-uniform load is partially generated on the semiconductor chips 11 and 12,
There is a problem that the chip may be broken.

An object of the present invention is to solve the above-mentioned conventional problems and to provide a highly reliable semiconductor component inspection apparatus capable of stably measuring even if there are steps or irregularities on the surface of the semiconductor component. With the goal.

[0006]

In order to achieve this object, a semiconductor component inspection apparatus according to the present invention comprises a first semiconductor component inspection apparatus.
A semiconductor terminal comprising: a measurement terminal disposed to face the electrode terminal provided on the surface of the semiconductor component; and a lid portion in which a bag filled with a fluid is fixed, and facing the first surface of the semiconductor component. Is pressed by a bag fixed to the lid to electrically connect the electrode terminals of the semiconductor component to the measurement terminals. By pressing the semiconductor component with the bag filled with the fluid, a load is uniformly applied to the semiconductor component, and the electrode terminal and the measurement terminal can be reliably brought into contact. This effect is particularly great for semiconductor components having irregularities on the second surface.

Further, in the semiconductor component inspection apparatus of the present invention, the bag can be filled with a fluid having good thermal conductivity, and the bag can be brought into contact with a cooling body or a heating body. This makes it possible to suppress the heat generation of the semiconductor component under inspection or to heat it to a constant temperature. The cooling and heating may be such that the fluid passed through the cooling device or the heating device liquid circulates inside the bag.

[0008]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing a socket part of a semiconductor component inspection apparatus according to the present invention, wherein 1 is a semiconductor component, 2 is a main body of the inspection apparatus, 3 is a measuring terminal, 4 is a lid, and 5 is a bag. .
The semiconductor component 1 includes a semiconductor chip 11 and a semiconductor chip 12 having different thicknesses, and a carrier 13.
The semiconductor chips 11 and 12 are flip-chip mounted on the surface of the carrier 13. The electrode terminals 14 are two-dimensionally formed in a matrix on the rear surface of the carrier 13. The main body 2 is provided with a measuring terminal 3 corresponding to the electrode terminal 14 of the carrier 13, and the measuring terminal 3 is fixed to the main body 2 via a spring (not shown) and is elastically movable. The lid portion 4 has a bag 5 made of a flexible and durable material at a position corresponding to the semiconductor component 1, and the inside of the bag 5 is filled with an inert liquid 51, for example, a fluid such as Fluorinert manufactured by 3M. ing.

At the time of inspection, the semiconductor component 1 is placed at a predetermined position on the main body 2, and the electrode terminal 14 and the measuring terminal 3 face each other. The cover 4 is pressed from above the main body 2 and the upper part of the semiconductor component 1. At this time, the bag 5 pressed against the semiconductor component 1 is flexible due to its material and the liquid 51 inside, so that the semiconductor chips 1 having different surface heights of the semiconductor component 1 are provided.
Make sure that both surfaces 1 and 12 are in contact. Furthermore, when pressed due to the liquid 51 filled in the bag 5, due to the hydrostatic pressure, even if the thicknesses of the semiconductor chips 11 and 12 are different, pressures of the same magnitude are uniformly applied to both surfaces. Therefore, the semiconductor component 1 is pressed uniformly downward without tilting, and the measuring terminal 3 facing the electrode terminal 14 moves by its elasticity, absorbs the flatness variation such as the warpage of the rear surface of the carrier 13 and the electrode terminal by the repulsive force. 14 and the measuring terminal 3 are electrically connected. Further, the opposite end of the measuring terminal 3 is connected to a measuring section of the inspection device through a wiring board (not shown) or the like to measure the semiconductor component. As described above, the semiconductor component inspection apparatus of the present invention can reliably bring the measurement terminal 3 into contact with the electrode terminal 14 of the semiconductor component even when there are steps or irregularities on the surface of the semiconductor component, and can perform stable measurement. it can.

FIG. 2 is a sectional view of an inspection apparatus showing another embodiment of the present invention. In this case, a heat sink 6 is connected to the lid 4, and the heat generated by the semiconductor component 1 during the inspection can be efficiently cooled through the liquid 51 inside the bag 5. This is because the bag 5 uniformly contacts the lower surface of the heat sink 6 even if the thickness of the semiconductor chips 11 and 12 is different due to the flexibility of the bag 5 and the liquid 51 inside. In the conventional structure, as shown in FIG. 3, even if a heat sink is attached to the lid, it is clear that the semiconductor chip does not contact uniformly and the heat radiation state remains poor.

Here, if the liquid 51 inside the bag 5 is made of a liquid having a high thermal conductivity, for example, pure water or mercury, the heat dissipation efficiency can be further improved. Further, in the present embodiment, the heat sink 6 is connected to perform cooling, but the semiconductor component can be efficiently heated instead of the heater block or the like. In the present embodiment, the heat sink 6 is directly attached to the lid 4 to cool and heat the semiconductor component 1 through the liquid 51 inside the bag 5. However, the liquid 51 inside the bag 5 is externally cooled or heated by a heating device. May be circulated to cool and heat the liquid 51 and cool and heat the semiconductor component 1.

In this embodiment, the measurement terminal of the spring probe type is shown, but it may be a leaf spring type or a sheet type measurement terminal. In addition, the semiconductor chip on the surface of the semiconductor component may be a method other than the flip chip mounting method, for example, a TAB method, a wire bonding method, or a semiconductor chip mounted by those methods molded with a resin or the like. There may be passive components as well as chips.

[0014]

By using the semiconductor component inspection apparatus according to the present invention, the function and characteristics of the semiconductor component can be measured stably and with high reliability even when the semiconductor component has steps or irregularities on the surface. can do.

[Brief description of the drawings]

FIG. 1 is a sectional view of a semiconductor component inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of a semiconductor component inspection apparatus according to another embodiment of the present invention.

FIG. 3 is a sectional view of a conventional semiconductor component inspection apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor component 2 Inspection apparatus main body 3 Measurement terminal 4 Lid 5 Bag 6 Heat sink 11 Semiconductor chip 12 Semiconductor chip 13 Carrier 14 Electrode terminal 51 Liquid

Claims (4)

[Claims] 1. A semiconductor component inspection apparatus for inspecting a semiconductor component having an electrode terminal on a first surface, comprising: a measurement terminal arranged to face the electrode terminal of the semiconductor component; And a lid fixed to the semiconductor component by pressing a second surface of the semiconductor component facing the first surface of the semiconductor component with the bag fixed to the lid. A semiconductor component inspection apparatus, wherein the electrode terminal of the component and the measurement terminal are electrically connected. 2. A semiconductor component inspection apparatus according to claim 1, wherein said bag is filled with a fluid having a good thermal conductivity, and said bag is brought into contact with a cooling body or a heating body. Inspection equipment. 3. The semiconductor component inspection apparatus according to claim 1, wherein the fluid passed through a cooling device or a heating device circulates inside the bag. 4. The semiconductor component inspection apparatus according to claim 1, wherein the second surface of the semiconductor component has irregularities.