JP2000138247A - Resin encapsulation method of chip size package and resin molding equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin encapsulation method for a chip size package which improves productivity and molding quality wherein voids are hardly generated. SOLUTION: In a resin encapsulation method of a chip size package which seals an object 3 to be molded with resin, wherein a semiconductor chip is bonded to a carrier tape on which a wiring pattern is formed, via an elastomer from a surface electrode forming surface, and the wiring pattern is electrically connected with a surface electrode, the semiconductor chip as the object 3 to be molded is accommodated in a cavity-recessed part of a metal mold 1, in which a release film 2 is stuck on a parting surface. While the carrier tape is clamped by the metal mold 1 as it is, sealing resin 11 is injected from a gate opened at a gap position formed between the cavity recessed part and the object 3 to be molded at a specified resin pressure, and resin encapsulation is performed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin sealing method and a resin sealing device for a chip size package.

[0002]

2. Description of the Related Art A configuration of a chip size package (CSP) formed to be substantially the same size as a semiconductor chip will be described with reference to FIG. FIG. 9A shows the wiring pattern 5.
Base film (carrier tape, etc.) 5 on which 1 is formed
2 is provided with a surface of the semiconductor chip 54 on which a surface electrode is formed via an electrically insulating layer (elastomer or the like) 53. Wiring pattern 5 extending from this electrically insulating layer 53
1 is connected to the surface electrode 56,
The exposed portions of the leads 55 and the gaps including the side surfaces of the semiconductor chip 54, the electrically insulating layer 53, the base film 52 and the like are sealed with a sealing resin 57. A solder ball 58 serving as an external connection terminal is joined to the wiring pattern 51 formed on the base film 52 by exposure.

The leads 55 connected to the surface electrodes 56 of the semiconductor chip 54, the semiconductor chip 54, and the electrical insulating layer 5
3. The sealing resin 57 filling the side surfaces of the base film 52 and the like is usually filled by potting. This is the case with a semiconductor chip 5 in the case of a chip size package.
4 is mounted on the base film 52 via the electrical insulating layer 53. Therefore, if the resin molding is performed by the usual transfer molding method, the molded product cannot be securely pressed, and the resin flash is unnecessary on an unnecessary portion. When the runner is peeled off or the gate is broken after resin sealing, the wiring pattern 5
1 may be damaged.

FIG. 9B shows another example of a chip size package in which a semiconductor chip 54 is housed inside a ring 59 formed in a rectangular frame shape and sealed with a resin by potting. (C) is an example in which the semiconductor chip 54 is housed in the can 60 and sealed with a resin by potting.

[0005]

In recent years, while the wiring in a semiconductor chip has been miniaturized (0.35 → 0.25 → 0.18 → 0.13 μm), it becomes a semiconductor chip 54 of a chip size package and external connection terminals. The ball pitch of the solder balls 58 is 0.5 mm (the solder ball diameter is 0.3 mm), which is the minimum pitch for mounting on the base film 52, and the chip area is smaller than the mounting area. in this way,
Since the area of the semiconductor chip 54 has become smaller than the mounting area, the surface electrodes 56 of the semiconductor chip 54 are provided at the center and the leads 5 connected to the wiring pattern 51 are provided.
A chip size package to which the semiconductor chip 5 is bonded has been proposed.

However, since the conventional chip size package is sealed with a resin by potting, it takes a long time for the sealing resin to harden, resulting in a problem of low productivity. In the case of potting,
There is also a problem that air is easily entrained when the sealing resin is injected, and voids are easily generated. Further, since the resin pressure cannot be applied during the resin sealing, the void cannot be reduced, and thus the adhesiveness between the sealing resin and the semiconductor chip and the electrical insulating layer depends only on the affinity of the resin. Further, in the case of potting, there is also a problem that handling is poor because there is a variation in the outer shape of the molded article filled with the sealing resin. In particular, in the case of a chip size package in which the semiconductor chip is not the outermost shape but the thinner elastomer and the carrier tape are the outermost shape, the outer shape of the molded product tends to vary.

An object of the present invention is to provide a resin sealing method and a resin sealing device for a chip size package, which solves the above-mentioned problems of the prior art, improves productivity and improves molding quality in which voids are less likely to occur. It is in.

[0008]

The present invention has the following arrangement to achieve the above object. That is, the semiconductor chip is bonded to the base film on which the wiring pattern is formed from the surface electrode formation surface via the electrical insulating layer, and the molded product in which the wiring pattern is electrically connected to the surface electrode is resin-sealed. In the resin sealing method of chip size package
In a mold having a release film stretched on a parting surface, the semiconductor chip of the workpiece is accommodated in the cavity recess, and the base film is clamped by the mold and the mold is formed with the workpiece in the cavity recess. The semiconductor device is characterized in that a sealing resin is filled with a predetermined resin pressure from a gate opened at a gap position formed therebetween and resin-sealed.

The external dimensions of the cavity recess of the mold are larger than the external dimensions of the semiconductor chip, and one or a plurality of gates opening into the cavity concave at a gap formed around the semiconductor chip. The sealing resin may be filled and sealed with the resin. Further, the molded article may be such that a plurality of semiconductor chips are mounted on a carrier tape via an elastomer, and a wiring pattern is electrically connected to a surface electrode formed in a central portion of the semiconductor chip. In order to define the outermost shape of the molded product, a ring surrounding four sides of the semiconductor chip is joined, and a sealing port is formed by cutting out a part of the ring, and a sealing resin is provided between the ring and the product to be formed. It may be filled with resin and sealed with resin,
Alternatively, a can for accommodating a semiconductor chip is bonded to the carrier tape to define the outermost shape of the molded product, and a sealing resin is formed between the can and the molded product through a gate opening formed by cutting out a part of the can. The gap may be filled and sealed with resin.

In a resin sealing device for a chip-size package, a semiconductor chip is bonded to a base film on which a wiring pattern is formed from an surface on which a surface electrode is formed via an electrical insulating layer, and the wiring pattern is electrically connected to the surface electrode. The base film of the molded product is clamped, and the sealing resin is filled with a predetermined resin pressure from the gate that opens at the gap position where the semiconductor chip is housed in the cavity recess and sealed with the resin. Having a mold die, a release film stretched on a parting surface including a cavity concave portion and a pot of the mold die, and suction holding means for sucking and holding the release film on the parting surface of the mold die. It is characterized by.

The external dimensions of the cavity concave portion of the mold are larger than the external dimensions of the semiconductor chip, and one or a plurality of gates opening to the cavity concave portion at a gap formed around the semiconductor chip. The sealing resin may be filled and sealed with the resin. Further, the molded article may have a plurality of semiconductor chips mounted on a carrier tape via an elastomer, and a wiring pattern may be connected to a surface electrode formed at the center of the semiconductor chip. A ring surrounding the four sides of the semiconductor chip is joined to define the outermost shape of the semiconductor chip, and a sealing resin is filled in a gap between the ring and the article to be formed from a gate opening formed by cutting out a part of the ring. A can for accommodating a semiconductor chip is bonded to the carrier tape to define the outermost shape of the molded product, and a part of the can is sealed off from a gate opening formed. Resin may be filled in the gap between the can and the molded article and sealed with the resin. In addition, the suction holding means,
A suction hole that opens on the parting surface of the mold, a cavity suction hole that opens on the inner bottom surface of the cavity recess, and an air suction mechanism that communicates with these may be provided.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In this embodiment, a resin sealing method and a resin sealing device for resin-sealing a chip size package of a semiconductor package will be described. FIG. 1 is an explanatory front view showing a configuration of a main part of a resin sealing device, FIG. 2 (a) is an explanatory view showing a manufacturing process of a molded article, and FIG. 2 (b) is a mold through a release film. FIG. 3 is a plan view of a molded product, FIG. 4A is a top view showing a resin sealing step of the molded product, and FIG. 4B is FIG. 4A. Arrow AA
FIG. 5A is a cross-sectional view of the molded product of FIG. 5C clamped by a mold, as viewed from the direction of arrows BB. FIG. 5B is clamped by a mold. FIG. 5C is a cross-sectional view of the molded product in FIG.
FIG. 5C is a top view of the molded product, and FIG.
6C is a cross-sectional view taken along the arrow DD, FIG. 6A is a top view showing a resin sealing step of a molded product according to another example, and FIG.
FIG. 7A is a cross-sectional view of the arrow EE of FIG. 7A, and FIG. 7A is an arrow F- of the molded article of FIG. 7C clamped by a mold.
7 (b) is a cross-sectional view of the molded product of FIG. 7 (c) clamped by a mold, as viewed from the direction of arrows GG, and FIG. 7 (c) is a molded product. FIG. 7D is a cross-sectional view taken along line HH of FIG. 7C, and FIG. 8 is an explanatory view showing the configuration of various chip size packages sealed with resin.

First, a schematic configuration of a resin sealing device will be described with reference to FIG. The present embodiment is an apparatus for resin-sealing a chip size package by a transfer molding method, and covers a required part of a parting surface of a mold 1 for clamping a molded product 3 with a release film 2 and performs resin sealing. Things.

The molded article 3 to be resin-sealed by the transfer molding method has a surface on which a surface electrode is formed of a semiconductor chip mounted on a substrate surface on which a wiring pattern is formed via an electrical insulating layer. A lead that is a part of the wiring pattern that extends further is connected to the surface electrode. Specifically, as shown in FIG. 2, a plurality of semiconductor chips 5 are mounted on a carrier tape 4 via an elastomer 6, and a beam lead 8 which is a part of a wiring pattern 7 is provided.
Are connected to a surface electrode (not shown) formed at the center of the semiconductor chip 5. Incidentally, only one semiconductor chip 5 may be mounted on the carrier tape 4 in some cases.

Reference numerals 9 and 10 denote upper and lower dies for forming the mold 1. The left half from the center line in FIG. 1 shows a state where the upper mold 9 and the lower mold 10 are clamped, and the sealing resin 1 is shown on the right half.
1 shows a state filled with 1. As the sealing resin 11, a granular resin, a liquid resin, or the like may be used in addition to the columnar resin tablet. A pot 12 is formed in the lower mold 10, and a plunger 13 is movably mounted inside the pot 12. In addition, a cavity recess 14 is formed in the lower die 10, and the semiconductor chip 5 is accommodated therein. The external dimensions of the cavity recess 14 are formed larger than the external dimensions of the semiconductor chip 5, and open to gaps formed between the cavity 3 and the molded product 3 in the cavity 14, such as a connection portion of the beam lead 8. The sealing resin 11 is filled with a predetermined resin pressure from the gate 16 and is sealed with the resin (FIGS. 4B and 5A and 5B).
reference). The sealing resin 11 is formed at three locations where the resin path 15 branches off in a branched manner, and is filled in the gaps through gates 16 that open into the cavity recesses 14. Incidentally, the number of gates 16 opened in the cavity concave portion 14 may be one,
The height position of the gate 16 is formed between the carrier tape 4 and the semiconductor chip 5 below the division surface of the upper die 9 and the lower die 10.

The release film 2 comprises an upper mold 9 and a lower mold 1
It is stretched on a parting surface including the cavity recessed portion 14 and the pot 12. The release film 2 is effective because the resin can be sealed without directly adhering the sealing resin 11 (without generating resin burrs) to the parting surfaces of the upper mold 9 and the lower mold 10. Further, when the molded product 3 is clamped by the mold 1 via the release film 2, the outer surface of the molded product 3 is elastically pressed and pressed, so that the molded product 3 is clamped without being damaged. can do. As will be described later, the release film 2 has the flexibility of being sucked and supported in accordance with the inner surface shape of the cavity concave portion 14 by air suction, and has the heat resistance to withstand the heating temperature of the mold. Further, it is necessary that the resin can be easily released from the mold after resin sealing and can be easily separated from the sealing resin 11. Such films include, for example, FEP films, fluorine impregnated glass cloths, PET films, E
TFE films, polyvinylidene chloride and the like are preferably used.

The mold 1 has a release film 3
Is provided on the parting surface. Specifically, a cavity suction hole 17 opening in a slit shape is formed on the inner bottom surface of the cavity recess 14.
Are formed. Further, suction holes 18 are formed on the parting surfaces of the upper mold 9 and the lower mold 10. These cavity suction holes 17 and suction holes 18 are
Is connected to an external air suction mechanism (not shown) via an air flow path provided in the air passage.

Next, a process of resin-sealing a chip size package by using the resin sealing device configured as described above will be described with reference to FIGS. First, FIG.
In step (1), a release film 2 is stretched on the parting surfaces (upper and lower surfaces) of the opened mold 1 of the resin sealing device. The release film 2 is stretched so as to cover the parting surface including the cavity concave portion 14 and the pot 12 of the mold 1. As the release film 2, a long film having a feed mechanism and a winding mechanism (not shown) may be used, or a strip-shaped release film may be carried into the mold 1 by a transport means (not shown). . The release film 2 includes an upper mold 9 and a lower mold 10.
Is sucked through the suction holes 18 and the cavity suction holes 17 provided in the nozzle and is suction-held along the parting surface.

In the present embodiment, a plurality of semiconductor chips 5 are mounted on a long or strip-shaped carrier tape 4 as shown in FIG. 2A.
Are bonded via an elastomer 6, and a beam lead 8, which is a part of the wiring pattern 7, is bonded to a surface electrode formed at the center of the semiconductor chip 5 by a bonding tool 21. More specifically, as shown in FIG. 3, on both sides of the carrier tape 4 opposite to the chip mounting surface, connection terminal areas on which solder balls 22 serving as external connection terminals are mounted are formed on both sides, and are provided therebetween. In the beam lead window 23, the beam lead 8 is installed so as to connect the connection terminal areas on both sides. The beam lead 8 laid on the beam lead window 22 is cut from the center by a capital 20 shown in FIG. 2A, and the cut end is bonded to a surface electrode of the semiconductor chip 5 by a bonding tool 21. You. Further, the carrier tape 4 can be pitch-fed by a feed mechanism (not shown) by sprocket holes 24 provided at predetermined pitches near both ends.

Next, the sealing resin 11 is supplied to the pot 12 of the mold 1 via the release film 2 and the molded article 3 is placed in the cavity recess 14 of the lower mold 10 so that the semiconductor chip 5 is accommodated therein. Supply with alignment.
Then, the molded article 3 is clamped by the molding die 1 with the carrier tape 4. This state is shown in FIGS. 2 (b) and 4 (b). The release film 2 clamps the carrier tape 4 on which the wiring pattern 7 is formed so as to hermetically seal, and elastically presses the connection terminal forming surface on which the solder balls 22 are formed and the outer surface of the semiconductor chip 5.

Next, the sealing resin 11 supplied to the pot 12 through the resin path 15 connected to the cavity recess 14 shown in FIGS. 4 (a), 5 (a) and 5 (b) is
Is moved upward to fill and seal the resin while applying a predetermined resin pressure. The outer diameter of the cavity recess 14 of the mold 1 is formed larger than the outer diameter of the semiconductor chip 5, and is sealed by the gate 16 opening into the cavity recess 14 at a gap formed around the semiconductor chip 5. The sealing resin 11 is filled with a predetermined resin pressure and sealed with a resin. In this embodiment, the resin is sealed up to the gap formed on the outer surface of the elastomer 6 or the carrier tape 4. A gap may be formed between the semiconductor chip 5 and the release film 2. In this case, the periphery of the semiconductor chip 5 is sealed with a resin. Further, the cavity concave portion 14 of the mold 1
4B, the gap between the carrier tape 4 and the semiconductor chip 5 corresponding to the bonding portion of the beam lead 8 to the surface electrode of the semiconductor chip 5, or the position of the gate 16 as shown in FIG. As shown in FIG. 3A, a semiconductor chip 5 such as a gap between the elastomer 6 and the release film 2 or a gap between the carrier tape 4 and the release film 2 is formed.
Is formed corresponding to the gap position formed around the periphery. The position of the gate 16 formed on the mold 1 can be changed as appropriate according to the shape and size of the molded article 3 as shown in FIGS. The present embodiment illustrates a case where the bonding portions of the semiconductor chip 5 and the beam leads 8 are sealed with resin.

The sealing resin 11 is supplied from the pot 12 to the resin path 1.
A predetermined resin pressure is applied to the gap of the cavity concave portion 14 from the gate 16 through the gate 5, and the space is filled with heat. Then, after sealing the resin, the mold 1 is opened, taken out by a carrying-out mechanism such as an unloader (not shown), gate break is performed, unnecessary resin is separated and removed, and only the molded product is taken out. Since the molded product is covered with the release film 2, the releasability from the mold 1 is extremely good. This molded product is individually separated as a chip size package 25 later as shown in FIG.

According to the above configuration, while the chip size package 25 is supported by the carrier tape 4, the predetermined resin is formed by transfer molding from the gate 16 which is opened at the gap position formed between the cavity concave portion 14 and the molded product 3. Since the sealing resin is filled with pressure and can be sealed with resin,
The curing time of the sealing resin 11 is faster than potting,
Productivity can be improved. In particular, the sealing resin 11
Since resin sealing can be performed while applying an appropriate resin pressure to the resin, air is hardly mixed in, and even if a void is generated, it can be suppressed to a minute level, so that molding quality can be improved. Further, in a chip size package in which the semiconductor chip 5 is not the outermost shape but the thinner elastomer 6 and the carrier tape 4 are the outermost shape, even if the sealing resin 11 is filled in the outermost shape of the molded article 3, Since the resin can be molded into a fixed shape while suppressing variations in the products, handling of the molded products can be improved. Further, since the molded product 3 is clamped by the mold 1 via the flexible release film 2, the external connection terminals of the semiconductor device and the outer surface of the semiconductor chip 5 can be clamped without applying excessive pressure. Resin sealing can be performed without damaging the molded article 3.

In the above embodiment, the case where the four sides of the semiconductor chip 5 are sealed with resin as the molded article 3 has been described.
6 and 7 illustrate a case where the gap formed on the side surface in the longitudinal direction of the semiconductor chip 5 is filled with the sealing resin 11 and sealed with the resin. In this case as well, the semiconductor chip 5 is not the outermost shape but the thinner elastomer 6 and the carrier tape 4 are the outermost shape.
As shown in (a) and (b), a gap between the carrier tape 4 and the semiconductor chip 5 corresponding to a bonding portion of the beam lead 8 to the surface electrode of the semiconductor chip 5, a gap between the elastomer 6 and the release film 2, It is formed corresponding to the gap between the carrier tape 4 and the release film 2.

The present invention is not limited to the above embodiment. As the molded article 3, as shown in FIGS. 8B and 8C, a chip size package using a ring 26 and a can 27 is used. It may be 25. That is, FIG.
A ring 26 surrounding four sides of the semiconductor chip 5 is joined to the carrier tape 4 so as to define the outermost shape of the molded product, and the sealing resin 11 is inserted through a gate opening 28 formed by cutting out a part of the ring 26. Is filled in the gap between the ring 26 and the article 3 and is sealed with resin. FIG. 8C shows a semiconductor chip 5 on the carrier tape 4 for defining the outermost shape of the molded product.
Is sealed, and the sealing resin 11 is inserted through a gate opening 28 formed by cutting out a part of the can 27.
Is filled in the gap between the can 27 and the molded article 3 and is sealed with a resin. Also in these cases, by providing the gate opening 28 in the cavity concave portion 14 and the ring 26 or the can 27,
Similarly, resin sealing can be performed by transfer molding.
Also, the chip size package 25 using the carrier tape 4 has been described as a product to be formed. However, the chip size package 25 using a resin substrate may be used, and furthermore, a resin-encapsulated fan-in / fan-out type μ-BGA is used. It is needless to say that more modifications can be made without departing from the spirit of the invention, for example, the present invention can be applied.

[0026]

As described above, according to the present invention, while a chip size package is supported by a base film, a predetermined resin pressure is applied by transfer molding from a gate opening at a gap formed between the cavity concave portion and a molded product. , The sealing resin is filled, and the resin can be sealed, so that the hardening time of the sealing resin is shorter than in potting, and the productivity can be improved. In particular, since resin sealing can be performed while applying an appropriate resin pressure to the sealing resin, air is less likely to be mixed in, and even if voids are generated, it is possible to minimize the occurrence of voids, thereby improving molding quality. it can. Further, in a chip size package in which the semiconductor chip is not the outermost shape but the thinner electrically insulating layer and the substrate are the outermost shape, even if the sealing resin is filled in the outermost shape of the molded product, Since resin can be molded into a fixed shape while suppressing variations in molded products, handling of molded products can be improved. Also, since the molded product is clamped by a mold via a flexible release film, it can be clamped without applying excessive pressure to the external connection terminals of the semiconductor device and the outer surface of the semiconductor chip. Resin sealing can be performed without damage.

[Brief description of the drawings]

FIG. 1 is an explanatory front view showing a configuration of a main part of a resin sealing device.

FIG. 2 is an explanatory view showing a manufacturing process of a molded article and a state where the article is clamped to a mold via a release film.

FIG. 3 is a plan view of a molded article.

4A and 4B are a top view and a cross-sectional view taken along a line AA showing a resin sealing step of a molded article.

FIG. 5 is a cross-sectional view of a molded product clamped by a molding die viewed from the directions of arrows BB and CC, a top view of the molded product, and a cross-sectional diagram of arrows DD.

FIG. 6 is a top view and an arrow EE sectional view showing a resin sealing step of a molded article according to another example.

FIG. 7 is a cross-sectional view of a molded product according to another example clamped by a mold, viewed from the directions of arrows FF and GG, a top view of the molded product, and a cross-sectional view of arrows HH. It is.

FIG. 8 is an explanatory diagram showing a configuration of various chip size packages sealed with resin.

FIG. 9 is an explanatory view showing a configuration of a conventional various chip size package sealed with resin.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 mold die 2 release film 3 molded product 4 carrier tape 5 semiconductor chip 6 elastomer 7 wiring pattern 8 beam lead 9 upper die 10 lower die 11 sealing resin 12 pot 13 plunger 14 cavity concave part 15 resin path 16 gate 17 cavity suction Hole 18 Suction hole 19 Mold base 20 Capital 21 Bonding tool 22 Solder ball 23 Beam lead window 24 Sprocket hole 25 Chip size package 26 Ring 27 Can 28 Gate opening

Claims (11)

[Claims] 1. A molded article in which a semiconductor chip is joined to a base film on which a wiring pattern is formed from an surface on which a surface electrode is formed via an electrical insulating layer, and the wiring pattern is electrically connected to the surface electrode. In a resin sealing method for a chip size package which is sealed with a resin, the semiconductor chip of the article to be formed is housed in a cavity recess in a mold having a release film stretched over a parting surface, and While the film is clamped by the mold, the sealing resin is filled and sealed with a predetermined resin pressure from a gate opening at a gap position formed between the cavity concave portion and the molded product. A resin sealing method for a chip size package. 2. An external dimension of the cavity concave portion of the molding die is formed larger than an external dimension of the semiconductor chip, and a singular opening to the cavity concave portion at a gap position formed around the semiconductor chip. 2. The method according to claim 1, wherein a sealing resin is filled from a plurality of gates and sealed. 3. The molded article, wherein a plurality of semiconductor chips are mounted on a carrier tape via an elastomer, and the wiring pattern is electrically connected to the surface electrode formed at the center of the semiconductor chip. The resin sealing method for a chip-size package according to claim 1 or 2, wherein: 4. The molded article is formed by joining a ring surrounding four sides of the semiconductor chip to the carrier tape so as to define the outermost shape of the molded article, and cutting out a part of the ring. 4. The resin sealing method for a chip size package according to claim 1, wherein a sealing resin is filled from a gate opening into a gap between the ring and the article to be formed and sealed. . 5. A gate opening formed by cutting out a part of the can to join the semiconductor chip with the carrier tape so as to define the outermost shape of the molded article. The resin sealing method for a chip size package according to claim 1, wherein the sealing resin is filled in a gap between the can and the molded article, and is sealed with the resin. 6. A molded product in which a semiconductor chip is joined to a base film on which a wiring pattern is formed from an surface on which a surface electrode is formed via an electrical insulating layer, and the wiring pattern is electrically connected to the surface electrode. A mold for clamping the base film, filling a sealing resin with a predetermined resin pressure from a gate opening at a gap position formed by housing the semiconductor chip in the cavity recess, and sealing the resin; A release film stretched over a parting surface including the cavity recess and the pot of the mold; and suction holding means for sucking and holding the release film on the parting surface of the mold. Resin sealing device for chip size package. 7. The molded article has a plurality of semiconductor chips mounted on a carrier tape via an elastomer, and the wiring pattern is connected to the surface electrode formed at the center of the semiconductor chip. The resin sealing device for a chip size package according to claim 6, wherein: 8. The semiconductor device according to claim 6, wherein a sealing resin is filled from one or a plurality of gates opening in the cavity recess at a gap position formed around the semiconductor chip, and the semiconductor chip is sealed. A resin sealing device for a chip size package according to claim 7. 9. The molded article is formed by joining a ring surrounding four sides of the semiconductor chip to the carrier tape so as to define the outermost shape of the molded article, and cutting out a part of the ring. 9. The resin sealing device for a chip-size package according to claim 6, wherein a sealing resin is filled from a gate opening into a gap between the ring and the article to be formed and sealed. . 10. A gate opening formed by cutting out a part of the can to join the semiconductor chip with the carrier tape so as to define the outermost shape of the molded article. 9. The resin sealing device for a chip size package according to claim 6, wherein a sealing resin is filled in a gap between the can and the molded article to be sealed with the resin. 11. The suction holding means includes a suction hole opened on a parting surface of the mold, a cavity suction hole opened on an inner bottom surface of the cavity recess, and an air suction mechanism communicating with these. The resin sealing device for a chip size package according to claim 6, 7, 8, 9, or 10.