JP2000252032A - Solder supply tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a solder supply tool capable of stably supplying solder. SOLUTION: In this solder supply tool 1, an outer fitting member 14 is fitted on a lower end part of a guide pipe 13, while heat pipes 17 are provided in bottom-equipped holes 16 of the outer fitting member 14. The heat pipes 17 are extended upward with them in close contact with the guide pipe 13, while the outer fitting member 14 is fixed to a lower end of a tool body 11. A cap 23 is fitted on an upper end of the guide pipe 13, and is fixed to an upper end of the tool body 11. The guide pipe 13 is fixed to the tool body 11 through the cap 23 and the outer fitting member 14 such that gaps 25 are formed between the tool body 11 and the respective heat pipes 17. An inlet port 51 of the tool body 11 is provided with a supply pipe 52, while an outlet port 53 thereof is provided with a discharge pipe 54.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a solder supply tool for supplying solder on a heated lead frame.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor manufacturing apparatus, when a die is bonded to a lead frame, the lead frame is heated to a high temperature in a mixed gas atmosphere and a linear solder wire supplied from a solder supply device is used. After contacting and melting the lead frame, the die was bonded.

[0003] The solder supply device has a solder supply tool 101 as shown in FIG. The solder supply tool 1
01 is a guide pipe 10 into which the solder wire is inserted.
2 and a tool body 10 holding the guide pipe 102
3 and an outer fitting member 104 fixed to a lower portion of the tool body 103 and externally fitted to a lower end of the guide pipe 102.
At the lower end of 02, a tapered delivery head 105 is provided. The delivery head 105 is provided with a guide hole 106, and the solder wire is configured to be guided and delivered by the guide hole 106.

An inflow port 111 is provided at a side portion of the tool main body 103, and a fluid such as water or air introduced from the inflow port 111 flows between the guide pipe 102 and the tool main body 103. Through the inflow passage 113 formed at the lower end of the guide pipe 102, and through a gap 112 formed between the tool body 103 and the outer fitting member 104, the tool body 10
It is configured to flow out from an outlet 114 formed on three sides. Accordingly, the lower end of the guide pipe 102, which is installed on the heated lead frame and is exposed to the mixed gas for heating the lead frame, can be cooled by the fluid.

[0005]

However, the solder supply tool 101 has a structure in which the lower end of the guide pipe 102 is directly cooled by the fluid passing through the gap 113 between the tool body 103 and the guide pipe 102. However, its cooling capacity is naturally limited. For this reason,
When the lead frame is exposed to the mixed gas for heating for a long time, the temperature of the lower end of the guide pipe 102 may rise to near the melting point of the solder wire. In this case, the solder cannot be supplied stably, and the supply amount of the solder becomes uneven.

[0006] The present invention has been made in view of such a conventional problem, and has as its object to provide a solder supply tool capable of stably supplying solder.

[0007]

According to the present invention, there is provided a solder supply tool in which a guide pipe for sending a linear solder wire from a lower end is provided in a tool body. A plurality of heat pipes extending upward along the guide pipe are provided on an outer fitting member externally fitted to the lower end of the guide pipe so as to surround the guide pipe,
The guide pipe is housed in the cylindrical tool main body via the external fitting member, and a gap is formed between the tool main body and each of the heat pipes. An inlet and an outlet communicating with the inside of the tool body were provided.

That is, when bonding a die to a lead frame, a linear solder wire sent from a solder supply tool is brought into contact with a lead frame heated to a high temperature by a mixed gas and melted, and the die is bonded. I do. At this time, the lower end of the guide pipe from which the solder wire is sent is exposed to a high temperature, and an outer fitting member is externally fitted to the lower end, and the outer fitting member is attached to the guide pipe. A plurality of heat pipes having a high thermal conductivity extending upward along the guide pipe are provided so as to surround the guide pipe. Therefore, the heat applied to the lower end of the guide pipe is
The heat is transmitted to the upper portion of each of the heat pipes via the outer fitting member, and is dispersed throughout the heat pipes.

On the other hand, the tool main body is provided with an inflow port and an outflow port communicating with the inside of the tool main body, and a gap formed between each heat pipe and the cylindrical tool main body is provided with a tool. After the fluid that has flowed in from the inflow port of the main body flows, it flows out of the outflow port. For this reason, while being applied to the lower end of the guide pipe, the heat distributed to the entire area of each heat pipe is transmitted to the fluid from the peripheral surface of each heat pipe, and then transmitted from the outlet by the fluid. Released outside the tool body.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing a solder supply tool 1 according to the present invention. The solder supply tool 1 has a solder wire 2 in which solder is linearly formed on a lead frame heated in a mixed gas atmosphere. Is to supply.

The solder supply tool 1 includes a cylindrical tool body 11, and a fixing portion 12 fixed to an arm (not shown) is provided on the tool body 11 so as to protrude laterally.
A cylindrical guide pipe 13 is provided in the tool body 11.
Is accommodated, and at the lower end of the guide pipe 13,
The external fitting member 14 is externally fitted. A through hole 15 is formed in the center of the outer fitting member 14 to be fixed in a state where the guide pipe 13 penetrates, and an outer peripheral portion of the through hole 15 is, as shown in FIG. Circular bottomed holes 16,... Communicating with the through holes 15 are formed at six equally spaced locations. The bottom ends of the cylindrical heat pipes 17,... Are fixed to the bottomed holes 16 in a state where they are inserted, and the heat pipes 17,. It is extended upward along the guide pipe 13 in a state of being in close contact. Here, the heat pipe 17 is a device that performs heat transfer by reducing the pressure inside the metal pipe and transferring vapor of a heat medium such as water and transfer of latent heat of vaporization (November 20, 1995, Foundation Published by the Japanese Standards Association, "JIS Industrial Technical Dictionary 4th Edition").

As shown in FIG. 1, the outer fitting member 14 is formed with an inner fitting portion 21 which is internally fitted to the lower end of the solder supply tool 1. A male screw part 22 is formed at the lower end of the tool body 11 to be screwed. A cap 23 is externally fitted on the upper end of the guide pipe 13, and the cap 23 has a male screw portion 24 which is internally fitted on the upper end of the tool body 11 and is screwed therein. I have. The guide pipe 13 is fixed to the tool body 11 via the cap 23 and the outer fitting member 14,
A gap 25 is formed between the tool body 11 and each of the heat pipes 17,.

At the upper end of each of the heat pipes 17,... Accommodated in the tool body 11, ring members 31a, 31b externally fitted to the guide pipe 13 are mounted. Between them, a coil spring 32 is mounted, and is fixed to the tool body 11 with the cap 23. .. Are inserted downward into the bottomed holes 16 of the outer fitting member 14, and are urged downward by the coil spring 32.

The guide pipe 13 is formed in a cylindrical shape, and has an upper end protruding upward through the cap 23 and a lower end protruding downward from the outer fitting member 14. An insertion hole 41 into which the solder wire 2 is inserted is provided at an upper end of the guide pipe 13 so that the solder wire 2 sent by a supply roller 42 is sent into the guide pipe 13. ing. A tapered delivery head 43 is provided at the lower end of the guide pipe 13, and the delivery head 43 is provided with a guide hole 44. The guide hole 44 has an inner diameter adapted to the outer dimension of the solder wire 2 inserted into the guide pipe 13, is configured to guide and send out the solder wire 2, and is used. It is configured to be replaced according to the solder wire 2.

Then, on the side of the tool body 11,
An inflow port 51 communicating with the inside of the tool body 11 is formed, and the inflow port 51 is provided with a supply pipe 52 to which an air supply hose is connected. Above the inlet 51, an outlet 53 is provided, and the inlet 53 is provided with a discharge pipe 54 to which an air discharge hose is connected. Thereby, air as a fluid supplied from the supply pipe 52 flows through the gap 25 formed between the tool main body 11 and each of the heat pipes 17, and is discharged from the discharge pipe 54. It is configured to:

In the present embodiment having the above-described configuration, when the die is bonded to the lead frame, the supply roller 42 above the solder supply tool 1 is rotated by a predetermined amount and inserted into the insertion hole 41 at the upper end of the guide pipe 13. A fixed amount of the solder wire 2 is inserted, and at the same time, the solder wire 2 delivered from the delivery head 43 at the lower end of the guide pipe 13 is brought into contact with the lead frame heated by the mixed gas to melt and bond the die. At this time, the lower end of the guide pipe 13 provided with the delivery head 43 for delivering the solder wire 2 is exposed to a high temperature by a heat source for heating the lead frame. Are externally fitted to the external fitting member 14, and six heat pipes 17,... Having a high thermal conductivity and extending upward while being in contact with the guide pipe 13 are attached to the guide pipe 1.
3 is provided. Therefore, the heat applied to the lower end of the guide pipe 13 is
Are transmitted to the upper portions of the heat pipes 17, and are dispersed throughout the heat pipes 17,.

On the other hand, the tool main body 11 is provided with an inflow port 51 and an outflow port 54 communicating with the inside of the tool main body 11.
A supply pipe 52 for connecting an air supply hose for feeding air into the inside is provided, and the outlet 54 is provided with:
A discharge pipe 54 for connecting an air discharge hose for discharging the air in the tool body 11 is provided. For this reason,
By supplying air into the tool main body 11 from the supply pipe 52 and discharging the air from the discharge pipe 54, the air is formed between the tool main body 11 and the heat pipes 17,. The gap 25
The air can be passed. Thereby, while being applied to the lower end portion of the guide pipe 13, the heat distributed throughout the heat pipes 17,.
Are transmitted to the air from the peripheral surfaces of the respective heat pipes 17,.
It can be released more out of the tool body 11.

Therefore, the cooling capacity can be increased as compared with the conventional case where only the lower end of the guide pipe 13 is cooled by the air flowing into the tool body 11. Accordingly, even when the lower end of the guide pipe 13 is exposed to the mixed gas for heating the lead frame for a long time, it is possible to suppress a rise in the temperature of the lower end of the guide pipe 13, However, the solder wire 2 can be supplied more stably and uneven supply of the supplied amount of solder can be prevented as compared with the conventional case where the melting point of the solder wire 2 rises to near the melting point.

In addition, a flow path must be formed to divert the air to the lower part of the tool body 11 so that the air flowing into the tool body 11 cools the lower end of the guide pipe 13. As compared with the related art, the structure can be simplified, and the manufacturing cost can be suppressed while preventing the tool body 11 from being enlarged.

[0020]

As described above, in the present invention,
The heat applied to the lower end of the guide pipe for sending out the solder wire and distributed to the entire area of the plurality of heat pipes provided on the outer fitting member at the lower end of the heat pipe from the inlet of the heat pipe from the peripheral surface of each heat pipe. After being transmitted to the inflowing fluid, the fluid can be discharged from the outlet through the outlet. Thereby, the cooling capacity can be increased as compared with the conventional case where only the lower end of the guide pipe is cooled by the fluid flowing into the tool body.

Therefore, even if the lower end of the guide pipe is exposed to the mixed gas for heating the lead frame for a long time, it is possible to suppress a rise in the temperature of the lower end of the guide pipe, and to reduce the temperature of the lower end of the guide pipe. As compared with the related art in which the portion rises to near the melting point of the solder wire, the solder wire can be supplied more stably, and the supply unevenness of the solder supply amount can be prevented.

[0022] In addition, a flow path for diverting the air to the lower part of the tool body must be formed so that the fluid flowing into the tool body cools the lower end of the guide pipe. As a result, the structure can be simplified, and the manufacturing cost can be suppressed while preventing the tool body from being enlarged.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a sectional view showing a main part of the embodiment.

FIG. 3 is a cross-sectional view showing a conventional solder supply tool.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder supply tool 2 Solder wire 11 Tool main body 13 Guide pipe 14 External fitting member 17 Heat pipe 25 Gap 51 Inflow 53 Outflow

Claims (1)

[Claims] 1. A solder supply tool in which a guide pipe for sending a linear solder wire from a lower end is provided on a tool main body, wherein an external fitting member externally fitted to a lower end of the guide pipe is provided along the guide pipe. A plurality of heat pipes extending upward are provided so as to surround the guide pipe, and the guide pipe is accommodated in the tool body formed in a cylindrical shape via the external fitting member, and the tool body and the heat pipe are provided. A solder supply tool, wherein a gap is formed between each heat pipe and an inflow port and an outflow port communicating with the inside of the tool main body are provided in the tool main body.