JP2000286628A - Yagi antenna substrate and wireless communication device using the same - Google Patents

Abstract

(57) [Problem] In the case of a conventional Yagi antenna in which a pin serving as an antenna element is fixed to a ground plate, each element becomes shorter as the operating frequency increases, so that dimensional accuracy is required. There is a problem that it becomes difficult to fix the pin to the main plate. In addition, the number of required parts such as ground plates, pins, and power supply lines is large, and the man-hours required for assembling the antenna are large. Also, when a molded antenna is incorporated in a wireless communication device, it is difficult to arrange other high-frequency components. There is a point. SOLUTION: A plurality of via holes are formed in a substrate,
One of the via holes is an antenna radiator, and one of the via holes is separate from the antenna radiator.
One is an antenna reflector, and a via hole having an inner diameter smaller than that of the antenna reflector is an antenna director, thereby forming a Yagi antenna substrate, and a wireless communication device using the same.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technology for forming an antenna using via holes formed in a substrate, and more particularly, to the size and length of via holes on a substrate.
The present invention relates to a Yagi antenna substrate having a Yagi antenna formed on a substrate by arrangement or the like and a wireless communication device using the same.

[0002]

2. Description of the Related Art First, a conventional general Yagi antenna will be described. The Yagi antenna has a reflector that is longer than the radiator, close to the radiator, a half-wave dipole,
It is an antenna in which directors shorter than the radiator are arranged in parallel, and has been widely used as a directional antenna for TV reception and others. Such a Yagi antenna will be described with reference to the drawings.

FIG. 8 shows a schematic configuration diagram of a conventional Yagi antenna. It is composed of a radiator having a feed part, a reflector arranged in parallel with the radiator, and a waveguide arranged in parallel on the opposite side to the reflector, and arranged at substantially equal intervals . Generally, reflectors are longer than radiators, and directors are shorter than radiators. Some waveguides have a plurality of directors.In this case, the directors are of the same length or shorter ones as the distance from the radiator increases. Some allow transmission and reception.
General Yagi antennas are described, for example, in various dictionaries such as “Maglow Hill Scientific and Technical Term Dictionary 2nd Edition”, page 1663-Publisher, Oku Kenko-Publishing Office, Nikkan Kogyo Shimbun Co., Ltd.

FIG. 9 shows a schematic configuration example of a monopole Yagi antenna as a specific example of a conventional Yagi antenna. On the ground plate, a quarter-wave monopole as a radiator, and a reflector and a director are arranged on both sides of the radiator so as to be parallel to each other. In this antenna, a pin, which is a separate component, is connected and fixed on a ground plate to form a radiator, a reflector, and a director.

[0005]

In the above-described method of fixing a pin, each element becomes shorter as the operating frequency becomes higher, so that dimensional accuracy is required. There is a problem that becomes difficult. In addition, the number of required parts such as ground plates, pins, and power supply lines is large, and the man-hours required for assembling the antenna are also large. There is a problem.

Further, there is a type in which the ground plate and each pin are integrally formed by molding. However, in the case of this integral formation, it is necessary to manufacture the mold, and since the mold is expensive, it is necessary to produce it in large quantities. Is high. SUMMARY OF THE INVENTION An object of the present invention is to provide an inexpensive and easily formed Yagi antenna substrate and a wireless communication device using the same, which solve these conventional problems by forming an antenna on the substrate itself.

[0007]

According to the first aspect of the present invention, a substrate is provided with a plurality of via holes having different inner diameters on a substrate, and these via holes are a reflector, a radiator, or a conductor of a Yagi antenna. It is characterized by operating as a wave filter, a plurality of via holes can be formed in a substrate, and the substrate itself can be used as a Yagi antenna.

In order to solve the conventional problem, the invention according to claim 2 is the substrate according to claim 1, wherein the inner diameter of the via hole operating as a reflector is larger than the inner diameter of the via hole operating as a director. The substrate itself can be used as a Yagi antenna by forming a plurality of via holes having different inner diameters in the substrate.

According to a third aspect of the present invention, in the substrate according to the first aspect of the present invention, the inner diameter of the via hole closer to the radiator is larger among the plurality of via holes operating as a director. By forming a plurality of via holes having different inner diameters in the substrate, the substrate itself can be used as a Yagi antenna having a plurality of waveguides.

According to a fourth aspect of the present invention, there is provided a substrate as set forth in the first aspect, wherein the land diameter of the via hole operating as a reflector is larger than the land diameter of the via hole operating as a director. It is characterized in that it is made larger. By forming a plurality of via holes having different inner diameters in the substrate, the substrate itself can be used as a Yagi antenna.

According to a fifth aspect of the present invention, there is provided a substrate as set forth in the first aspect, wherein the plurality of via holes have different inner diameters or land diameters or different inner diameters and land diameters. Of the Yagi antenna substrate can be set by changing the impedance of the Yagi antenna substrate.

[0012] In order to solve the conventional problem, the invention according to claim 6 includes a substrate having a plurality of via holes, one of the via holes being an antenna radiator, and a via different from the antenna radiator. One of the holes is used as an antenna reflector, and a via hole having an inner diameter smaller than the antenna reflector is used as an antenna waveguide. The substrate itself can be used as a Yagi antenna by forming a plurality of.

[0013] In order to solve the conventional problem, the invention according to claim 7 includes a substrate having a plurality of via holes, one of the via holes being an antenna radiator, and a via different from the antenna radiator. One of the holes is used as an antenna reflector, and a via hole having a land diameter smaller than the antenna reflector is used as an antenna waveguide, and the substrate has different land diameters. By forming a plurality of via holes, the substrate itself can be used as a Yagi antenna.

In order to solve the conventional problem, the invention according to claim 8 is directed to a substrate according to claim 6 or claim 7, wherein
The via hole comprises at least three via holes, one of the via holes as an antenna radiator, another of the via holes as an antenna reflector, and a further one of the via holes. The substrate itself can be a Yagi antenna having three or more elements by forming at least three via holes having different inner diameters or land diameters on the substrate. .

According to a ninth aspect of the present invention, there is provided a multi-layer substrate having a plurality of via holes, and the via holes operate as a reflector, a radiator, or a director of the Yagi antenna. And
A plurality of via holes having different inner diameters or land diameters can be formed in the multilayer substrate, and the substrate itself can be used as a Yagi antenna.

According to a tenth aspect of the present invention, there is provided a circuit board according to the ninth aspect, wherein one of the plurality of via holes is an antenna radiator, and another of the plurality of via holes is an antenna radiator. One of the via holes is used as an antenna reflector, and the via hole having a shorter hole length than the antenna reflector is used as an antenna director. By forming a via hole, the substrate itself can be used as a Yagi antenna.

In order to solve the conventional problem, the invention according to claim 11 is the substrate according to claim 9 or claim 10, wherein the hole lengths of the plurality of via holes are made different by blind via hole forming. The via holes having different hole lengths can be easily formed in a multilayer substrate, and thus the substrate itself can be used as a Yagi antenna.

According to a twelfth aspect of the present invention, there is provided a substrate as set forth in any one of the first to eleventh aspects, wherein the plurality of via holes are substantially straight and arranged at substantially equal intervals. The substrate itself can be a Yagi antenna by forming a via hole in which the reflector and the director are arranged substantially linearly and at substantially equal intervals with respect to the radiator. .

According to a thirteenth aspect of the present invention, there is provided a substrate as set forth in any one of the first to twelfth aspects, wherein the radiator is fed by a feed line formed on the same substrate. It is a feature that the via hole itself serving as a radiator can be used as a feed portion, and thus the substrate itself can be used as a Yagi antenna having a feed portion.

In order to solve the conventional problem, the invention according to claim 14 is the substrate according to claim 13, characterized in that the feeder line is a microstrip line and is a radiator. The via hole itself can be used as a power supply unit by a microstrip line,
Therefore, the substrate itself can be used as a Yagi antenna.

According to a fifteenth aspect of the present invention, there is provided a substrate as set forth in the thirteenth aspect, wherein the feeder line is a coplanar line, and the via becomes a radiator. The hole itself can be used as a feed section by a coplanar line, and thus the substrate itself can be used as a Yagi antenna.

In order to solve the conventional problem, the invention according to claim 16 is the substrate according to claim 14 or 15, wherein high-frequency components are arranged and connected on the same substrate as the substrate. In addition, high-frequency components such as an IF circuit and a switch circuit related to transmission and reception can be arranged close to the radiator of the antenna. By arranging them closer together, the size of the entire transmitting / receiving unit including the antenna can be reduced.

According to a seventeenth aspect of the present invention, in order to solve the conventional problem, in a wireless communication apparatus, a transmitter, a receiver, or a transceiver is provided by using the substrate according to the fourteenth aspect. This makes it easy to assemble the wireless communication device with the substrate serving as the Yagi antenna. Further, since the board can be accommodated in the wireless communication device main body, the entire main body can be reduced in size, and the main body can be formed as an antenna that does not protrude outward.

[0024]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a first embodiment of the configuration of a Yagi antenna substrate according to the present invention. The printed circuit board 4 is provided with three via holes, of which the via hole 1 is a radiator, the via hole 2 is a reflector, and the via hole 3 is a waveguide. The inner diameter surfaces of the via holes 2 and 3 are conductor surfaces, and therefore, these via holes have a circular cylindrical shape. Also, the via holes are arranged substantially linearly and at substantially equal intervals. Further, in FIG. 7 described later, a plurality of via holes 3 serving as waveguides may be provided.

The impedance of the antenna element depends on the element length and the element diameter. Therefore, it is possible to change the impedance of each element by changing the diameter of the via hole. Specifically, the reflector has a larger via hole diameter than the director, and (inversely, the director has a smaller via hole diameter than the reflector). By forming via holes having different thicknesses in thickness, it is possible to use a reflector, a director, and a radiator separately. Also, when a plurality of directors are provided,
The plurality of via holes serving as the waveguide may be of the same diameter, but the element length may be shorter for a waveguide farther from the radiator (the via hole diameter is smaller for a waveguide farther from the radiator). .

With respect to the via hole 1 serving as a radiator, the inner diameter surface may or may not be a conductor. FIG. 2 shows a case where the conductor is not a conductor and FIG. 3 shows a case where the conductor is a conductor. In the embodiment of FIGS. 2 and 3, the inner diameter of the director via hole 3 is smaller than the inner diameter of the reflector via hole 2. Therefore, an antenna equivalent to a conventional Yagi antenna having different pin lengths can be constituted by the via holes of the substrate.

FIG. 2 is an embodiment showing a state of power supply to a radiator via hole when the Yagi antenna board of the present invention is mounted on a wireless communication device, and shows a case where the inner diameter portion is not a conductor. The radiator via hole 1 is connected to the connector 5 for power supply, or the center conductor of the power supply cable 6 is connected to the via hole 1 as it is so that the radiator via hole 1 emits radiation. In addition, in the case where the inner diameter portion is made of a conductor in addition to FIG. 2, the via hole to be supplied with power may be separated from the ground surface so as not to be short-circuited.

FIG. 3 shows a case where the Yagi antenna substrate according to the present invention is formed not only of a reflector and a director but also of a radiator with a via hole, and the inner diameter portion is a conductor. FIG. 3 (a)
3 shows the front surface of the substrate, and FIG. 3B shows the back surface of the substrate. In the substrate 4, 1 is a radiator, 2 is a reflector, and 3 is a director. On the back surface, the reflector 1 is connected to a coplanar line. In addition, the other side has a GND pattern. In this embodiment, a coplanar line is formed from the radiator via hole 1 so as not to contact the ground surface as shown on the back surface of the substrate in FIG. 3B, and the coplanar line is wired to the radiator via hole 1 to supply power. It feeds the radiator that is the element.

FIG. 10 is an embodiment showing wiring when a multi-layer substrate is used. FIG. 10 (a) shows the substrate surface, and FIG.
0 (b) shows a substrate intermediate layer, FIG. 10 (c) shows a back surface of the substrate, and FIG. 10 (d) shows a side view of the substrate. In the substrate 4, 1 is a radiator and 2 is a reflector. Reference numeral 3 denotes a waveguide, a microstrip line is formed on the reflector 1 on the back surface of the substrate, and the periphery of the radiator 1 is insulated on the substrate intermediate layer, and the other surface is a GND pattern. Here, the pattern layer located on the back surface of the substrate is a microstrip line, and a relief portion is formed (that is, insulated) around the radiator via hole on the ground surface of the intermediate layer of the substrate so that short-circuiting can be prevented. It is. Although FIG. 10 shows an example of a three-layer board, even when more multilayer boards are used, the layer to be fed is a microstrip line, and the pattern escapes so as not to short-circuit around the radiator via hole on the ground plane. It may be formed.

FIG. 4 shows an embodiment in which high-frequency components are arranged and connected on a Yagi antenna board according to the present invention, whereby a transmitting section and a receiving section in wireless communication can be formed on the same board. FIG. 4A shows the substrate surface, and FIG.
(B) shows the back surface of the substrate, and via holes are formed in the substrate as radiators, reflectors, and waveguides. A portion (about half the area in the figure) of the substrate surface is used as a GND pattern, and A GND pattern is formed at a position substantially opposite to the substrate surface. The reflector portion of the GND pattern on the back surface of the substrate is connected to a coplanar line and connected to a high-frequency circuit. No GND pattern is formed around the high-frequency circuit, and the coplanar line becomes a microstrip line and is connected to the high-frequency circuit.

In general, in a radio communication system, the lower the frequency, the smaller the loss in the transmission path.
It is often converted to F) once. In particular, since transmission loss is large in a quasi-millimeter wave band or a millimeter wave band, it is advantageous to convert to an intermediate frequency as close to the antenna as possible. Also,
In the case of a sector antenna used by switching a plurality of antennas, a sector switch is required near the antenna.
Conventionally, antennas and these circuits were connected using semi-rigid cables, but by placing IF circuits and switch circuits on the printed circuit board that constitutes the antenna, and connecting the radiators by coplanar lines, Loss at the connection point of the connector and the connector can be reduced. It is to be noted that the coplanar line on the back side of the substrate in FIG. 4B shows that it can be converted to a microstrip line on the way.

The embodiment of the present invention has been described in detail above. Next, FIG. 7 shows a first embodiment of the present invention as a specific example of a Yagi antenna substrate of the present invention. In FIG. 7, the inner diameter of the radiator via hole 71 is formed as a conductor, and the reflector via hole 72 is formed as a via hole having a larger inner diameter than the radiator via hole 71. The waveguide via hole 73a has an inner diameter smaller than that of the radiator via hole 71. Further, the waveguide via holes 73b and 73c are formed, and the inner diameters thereof are sequentially smaller. Therefore, the inner diameter of the via hole in this embodiment is as follows: 72>71>73a>73b> 73c. The radiator via hole 71 is a feed portion, and the director via holes 73a, 73b,
Since 73c may have the same inner diameter, the minimum necessary condition in the above equation is as follows: 72> 73a ≧ 73b ≧ 73c. When power is supplied to the radiator via hole 71 by a coplanar line or the like, the inner diameter portion is made to be a conductor, so that 72>71> 73. Printed circuit board 7
A high-frequency component or the like can be arranged on the other surface of the device 4.

Next, FIG. 5 shows a second embodiment of the configuration of the Yagi antenna substrate according to the present invention. In this embodiment, at least three via holes are formed in the printed circuit board 54 in a substantially straight line and at substantially equal intervals (five via holes in the figure), and the inner diameters of the via holes are the same. Are those having different land diameters. Radiator via hole 51, reflector via hole 52, director via hole 53a,
3b, 53c, the reflector via hole 52
Thus, each of the director via holes 53a, 53b, 53c has a small land diameter. Further, the waveguide via holes farther from the radiator via hole 51 have smaller land diameters in order (land diameter: 52> 53a ≧ 53b ≧ 53).
c). Alternatively, the land diameter portion of radiator via hole 51 may be used as a power supply portion by using a conductor as a conductor and adjusting the size of the diameter. In this embodiment, the via hole 52 is made larger than the land diameter of the via hole 51,
3a is made smaller, and 53b and 53c are made smaller in order.

FIG. 6 shows a third embodiment as an embodiment of the Yagi antenna substrate of the present invention. In this embodiment, a multilayer printed board 64 is used, and at least three via holes are formed in the board 64 in a substantially straight line and at substantially equal intervals (in FIG. 6, five via holes are formed).
In this case, the inner diameter or land diameter of the via holes is the same, but the lengths of the hole lengths are different, and a conductor is used for the length of the hole length. Since it is a multi-layer substrate, the hole length can be formed into via holes for arbitrary layers. For example, the hole length of the first to second layers, the hole length of the first to third layers,
Via holes having different lengths, such as a hole length from the first layer to an increase of five, can be formed. The hole length itself is formed by forming holes from one layer to all the layers, and the first to second conductors, the first to third conductors, and the first to fifth layers are increased. A similar effect can be obtained by using a via hole such as a conductor up to.

In the embodiment shown in FIG. 6, a radiator via hole 61, a reflector via hole 62, and a director via holes 63a, 63b, 63c are provided. Container via hole 63
a, 63b and 63c have short hole lengths. Further, the waveguide via holes farther away from the radiator via hole 61 have shorter hole lengths in order (hole length: 62>
63a ≧ 63b ≧ 63c). Radiator via hole 6
By adjusting the length of the hole length by using the hole length portion of one as a conductor, the power feeding portion can also be provided. In the present embodiment, the via hole 62 is made larger than the hole length of the via hole 61, the via hole 63a is made smaller, and
b and 63c are sequentially reduced.

[0036]

According to the present invention, a Yagi antenna can be formed by forming a via hole in a substrate. Therefore, an easy-to-mold and inexpensive Yagi antenna substrate suitable for mass production and wireless communication using the same. Machine can be provided. In particular, it is effective in the quasi-millimeter wave band and the high frequency band higher than the millimeter wave band.If the wavelength is about 4 cm or less for a wireless system, it can be easily adapted to the substrate thickness, and it is practical. The above effect is extremely large.

[0037]

[Brief description of the drawings]

FIG. 1 shows a first embodiment of the configuration of a Yagi antenna substrate according to the present invention.

FIG. 2 shows a power supply state to a radiator via hole when the present invention is mounted on a wireless communication device.

FIG. 3 shows a Yagi antenna substrate of the present invention, in which a radiator is also formed of a via hole.

FIG. 4 shows an embodiment in which high-frequency components are arranged and connected on a Yagi antenna substrate of the present invention.

FIG. 5 shows a second embodiment of the configuration of the Yagi antenna substrate of the present invention.

FIG. 6 shows a third embodiment of the configuration of the Yagi antenna substrate of the present invention.

FIG. 7 shows an embodiment of the first embodiment of the present invention in the case of multi-elements.

FIG. 8 shows a schematic configuration diagram of a conventional Yagi antenna.

FIG. 9 shows a schematic configuration example of a conventional monopole Yagi antenna.

FIG. 10 shows a feed wiring by a microstrip line in the case of a Yagi antenna substrate of the present invention, which is a multilayer substrate.

[Explanation of symbols]

1, 51, 61, 71: radiator via hole, 2, 52, 62, 72: reflector via hole, 3, 53a, 53b, 53c, 63a, 63b, 63
c, 73a, 73b, 73c: director via hole; 4, 54, 64, 74: printed circuit board

 ──────────────────────────────────────────────────続 き Continuing on the front page F term (reference) 5E338 AA02 AA03 AA20 BB02 BB13 BB25 CC01 CC02 CC04 CC06 CD01 CD23 EE32 5E346 AA12 AA15 AA43 BB02 BB03 BB04 BB06 BB16 FF01 FF45 HH33 5J020 AA03 Q02AB05 AB03

Claims (17)

[Claims] 1. A Yagi antenna substrate comprising a substrate having a plurality of via holes having different inner diameters, wherein the via holes operate as a reflector, a radiator, or a director of the Yagi antenna. 2. The Yagi antenna substrate according to claim 1, wherein the inner diameter of the via hole operating as a reflector is larger than the inner diameter of the via hole operating as a director. 3. The substrate according to claim 1, wherein the inner diameter of the via hole closer to the radiator is increased among the plurality of via holes operating as a director. 4. The substrate according to claim 1, wherein the land diameter of the via hole operating as a reflector is larger than the land diameter of the via hole operating as a director. 5. The substrate according to claim 1, wherein the impedance of the via hole is changed by making the inner diameter or land diameter of the plurality of via holes or the land diameter different from the inner diameter. A Yagi antenna board characterized by being operated as: 6. A substrate having a plurality of via holes, one of the via holes being an antenna radiator, and one of the via holes different from the antenna radiator being an antenna reflector. A yagi antenna substrate, wherein a via hole having an inner diameter smaller than an antenna reflector is used as an antenna waveguide. 7. A substrate having a plurality of via holes, one of the via holes serving as an antenna radiator, and one of the via holes different from the antenna radiator serving as an antenna reflector. A Yagi antenna substrate having a via hole configuration in which a via hole having a land diameter smaller than an antenna reflector is used as an antenna waveguide. 8. The substrate according to claim 6, wherein said via hole comprises at least three via holes, one of said via holes serving as an antenna radiator, and another of said via holes serving as an antenna radiator. Wherein one of the via holes is an antenna reflector, and another of the via holes is an antenna director. 9. A multi-layer substrate having a plurality of via holes,
The Yagi antenna substrate, wherein the via holes operate as a reflector, a radiator or a director of the Yagi antenna. 10. The substrate according to claim 9, wherein one of the plurality of via holes is an antenna radiator.
A Yagi antenna substrate, wherein one of the via holes different from the antenna radiator is used as an antenna reflector, and a via hole having a shorter hole length than the antenna reflector is used as an antenna director. 11. The substrate according to claim 9, wherein the plurality of via holes have different hole lengths by blind via hole forming. 12. The Yagi antenna substrate according to claim 1, wherein the plurality of via holes have a via hole configuration in which the via holes are arranged substantially linearly and at substantially equal intervals. 13. The Yagi antenna substrate according to claim 1, wherein the radiator is fed by a feed line formed on the same substrate. 14. The Yagi antenna substrate according to claim 13, wherein the feeder line is a microstrip line. 15. The substrate according to claim 13, wherein the feeder line is a coplanar line. 16. The Yagi antenna substrate according to claim 14, wherein a high-frequency component is arranged and connected on the same substrate as the substrate. 17. A wireless communication device, wherein the substrate according to claim 14 is used as a transmitter, a receiver, or a transceiver.