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JP2000294597A - Winding form of bonding wire for semiconductor - Google Patents

Winding form of bonding wire for semiconductor

Info

Publication number
JP2000294597A
JP2000294597A JP11100308A JP10030899A JP2000294597A JP 2000294597 A JP2000294597 A JP 2000294597A JP 11100308 A JP11100308 A JP 11100308A JP 10030899 A JP10030899 A JP 10030899A JP 2000294597 A JP2000294597 A JP 2000294597A
Authority
JP
Japan
Prior art keywords
wire
adhesive
spool
flange
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11100308A
Other languages
Japanese (ja)
Inventor
Tadao Asuke
忠雄 安助
Tsutomu Yamashita
勉 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP11100308A priority Critical patent/JP2000294597A/en
Publication of JP2000294597A publication Critical patent/JP2000294597A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00Handled material; Storage means
    • B65H2701/30Handled filamentary material
    • B65H2701/36Wires
    • B65H2701/361Semiconductor bonding wires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/786Means for supplying the connector to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01075Rhenium [Re]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】 【課題】接着剤付着の虞れ無くワイヤ端部の止着、引出
しを容易に行え、ワイヤの線径、組成、特性等の情報を
豊富に表示でき、再利用も可能なワイヤ端部止着手段を
備えたワイヤ巻線形態を提供する。 【解決手段】フランジ1cに着脱自在に弾性嵌合するクリ
ップ状治具3と、左右フランジ1b,1cに亘って掛け渡す
治具4により、ワイヤの終端部2aと始端部2bをフランジ
1b,1cに固定する。治具3、4は止着効果の低減が少な
いので繰り返し使用できる。適度な大きさとしてワイヤ
端部の止着、引出し作業を容易に行うことができ、巻き
付けたワイヤ2に関する情報を多く表示できる。
(57) [Summary] [Problem] It is possible to easily attach and pull out a wire end without fear of adhesion of an adhesive, and to abundantly display information such as a wire diameter, a composition, and characteristics of a wire, and to reuse the wire. The present invention provides a wire winding configuration provided with a simple wire end fastening means. A terminal jig (3) is detachably and elastically fitted to a flange (1c), and a jig (4) bridging over left and right flanges (1b, 1c) to form a flange between an end portion (2a) and a start end (2b) of a wire.
Fix to 1b, 1c. The jigs 3 and 4 can be repeatedly used because the fixing effect is little reduced. As a suitable size, fastening and pulling-out work of the wire end can be easily performed, and much information on the wound wire 2 can be displayed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は半導体装置の組立て
等に用いるボンディングワイヤ(以下、単に「ワイヤ」
と称する場合もある)の巻線形態に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding wire (hereinafter simply referred to as "wire") used for assembling a semiconductor device or the like.
In some cases).

【0002】[0002]

【従来の技術】従来から、半導体装置の組立て等に用い
るボンディングワイヤは、例えば特開平1−17218
2号に開示されるように、スプールの円筒状胴部に巻き
付けられており、その巻始め端部(ワイヤ繰出し時には
終端部になる)と巻終り端部(ワイヤ繰出し時には始端
部になる)は接着テープにより胴部内側又はフランジに
止着して巻き崩れを防止するようになっている。そうし
て使用時には、スプールをボンディング装置に装着した
後、接着テープを剥がして始端部を引き出し、ボンディ
ング装置のワイヤ繰出し経路に導くようになる。
2. Description of the Related Art Conventionally, a bonding wire used for assembling a semiconductor device or the like is disclosed in, for example, Japanese Patent Laid-Open No. 1-121818.
As disclosed in No. 2, the spool is wound around the cylindrical body of the spool, and its winding start end (becomes a terminal end when the wire is fed out) and a winding end end (becomes a start end when the wire is fed out). The tape is fixed to the inside of the body or to the flange by an adhesive tape to prevent collapse of the winding. In use, after the spool is mounted on the bonding apparatus, the adhesive tape is peeled off, the starting end is pulled out, and the spool is guided to the wire feeding path of the bonding apparatus.

【0003】処で、上記接着テープは裏面に接着剤を塗
布した接着テープであって、該テープによりワイヤ端部
を止着する場合、以下のような点について改善の余地が
ある。
[0003] The above-mentioned adhesive tape is an adhesive tape having an adhesive applied to the back surface. When the tape is used to fix the end of the wire, there is room for improvement in the following points.

【0004】すなわち、ワイヤを全て繰出した使用後の
スプールは回収し洗浄後に再利用する工程に供される
が、回収されたスプールには上記テープを剥がした跡の
接着剤が残っている虞れがある。このような残留接着剤
は、スプール洗浄中に剥がれてスプール胴部のワイヤ巻
き付け部分に再付着し、そのスプールに巻き付けたワイ
ヤに付着する虞れがあり、この場合、ワイヤの繰出し不
良やボンディング不良に繋がることも考えられる。その
ため、スプールを再利用する工程においては、有機溶剤
を用いてスプールを洗浄して残留接着剤を溶かすと共
に、洗浄後のスプールの残留接着剤の検査を行ってお
り、コスト高の要因になっていた。
[0004] That is, the used spool from which all the wires have been fed out is collected and subjected to a process of reuse after washing. However, the collected spool may have an adhesive remaining after the tape is peeled off. There is. Such a residual adhesive may be peeled off during the cleaning of the spool and reattached to the wire winding portion of the spool body, and may adhere to the wire wound around the spool. In this case, poor wire feeding or poor bonding may occur. It is also possible that it leads to. Therefore, in the process of reusing the spool, the spool is washed with an organic solvent to dissolve the residual adhesive, and the residual adhesive of the spool after the cleaning is inspected, which is a factor of high cost. Was.

【0005】また、この種ボンディングワイヤは1mm
以下の極細径のものであるため、上記テープで止着され
るワイヤ端部が該テープの接着剤層中に入り込んでしま
う虞れがある。周知のようにボンディング作業にあって
は、ワイヤの断線の検出やボール形成の制御を図るた
め、ボンディング装置に装着したスプールの終端部をワ
イヤディテクタに接続する場合があるが、前記の如くワ
イヤ端部が接着剤層中に入り込んでしまうとディテクタ
との導通が図れなくなる虞れがあり、この場合、ワイヤ
の断線検出やボール形成の制御に不都合が生じる。
[0005] Further, this kind of bonding wire is 1 mm.
Because of the following ultra-thin diameter, there is a risk that the end of the wire fixed by the tape may enter the adhesive layer of the tape. As is well known, in a bonding operation, the end of a spool mounted on a bonding apparatus may be connected to a wire detector in order to detect wire breakage and control ball formation. If the portion enters the adhesive layer, there is a possibility that conduction with the detector may not be achieved, and in this case, inconvenience occurs in disconnection detection of the wire and control of ball formation.

【0006】前述したような接着剤による不具合が出来
る限り生じないようにすると共に、止着箇所がフランジ
という幅狭な部位であることから上記テープは小さくカ
ットされて使用されるが、このため、ワイヤ端部の止着
作業や剥がす作業がピンセットを使った非常に細かい作
業になることに加え、ワイヤの線径や組成、特性等の情
報表示に制限がある。他方、上記テープは再利用が出来
ないのでコスト高にも繋がる。
[0006] The above-described tape is used in a small cut because the above-mentioned problems caused by the adhesive are prevented as much as possible, and the fastening portion is a narrow portion such as a flange. In addition to the very fine work using tweezers for fixing and peeling off the end of the wire, there is a limitation in displaying information such as the wire diameter, composition, and characteristics of the wire. On the other hand, the tape cannot be reused, which leads to an increase in cost.

【0007】[0007]

【発明が解決しようとする課題】本発明は上述したよう
な従来事情に鑑みてなされたもので、その目的とする処
は、ワイヤに接着剤が付着する虞れが無く、ワイヤ端部
の止着、引出し作業を容易に行え、巻き付けたワイヤに
関する情報を豊富に表示でき、再利用も可能なワイヤ端
部止着手段を備えたボンディングワイヤの巻線形態を提
供することにある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and has as its object to eliminate the possibility that an adhesive will adhere to a wire and to stop a wire end. An object of the present invention is to provide a winding form of a bonding wire provided with a wire end fastening means capable of easily performing attachment and withdrawal operations, displaying abundant information on the wound wire, and reusable.

【0008】[0008]

【課題を解決するための手段】上述の目的を達成するた
めに本発明は請求項1記載のように、スプールの円筒状
胴部に半導体用ボンディングワイヤを巻き付け、該ボン
ディングワイヤの端部を前記スプールのフランジ又は胴
部に止着した半導体用ボンディングワイヤの巻線形態に
おいて、前記ボンディングワイヤ端部をフランジ又は胴
部に止着する手段を非接着手段としたことを要旨とす
る。
In order to achieve the above-mentioned object, according to the present invention, a semiconductor bonding wire is wound around a cylindrical body of a spool, and an end of the bonding wire is attached to the cylindrical body. In the winding form of the semiconductor bonding wire fixed to the flange or the body of the spool, the means for fixing the end of the bonding wire to the flange or the body is a non-adhesive means.

【0009】本発明で言う非接着手段とは、ワイヤ端部
をフランジ又は胴部に止着する手段として接着剤を用い
ない手段を言う。接着剤を用いる手段とは、接着剤を塗
布したテープを用いてワイヤ端部をフランジに固定した
り、ワイヤ端部を接着剤によりフランジに直接固定する
手段を言う。またここで「接着剤」とは、例えば化学大
辞典(1989年 共立出版株式会社発行)の「接着剤」の
項に記載されるように、合成接着剤としてポリ酢酸ビニ
ール又はポリアクリル酸エステル等を主成分とするもの
や、天然接着剤としてアラビアゴム等が例示できる。
The non-adhesive means referred to in the present invention means a means that does not use an adhesive as a means for fixing a wire end to a flange or a body. The means using an adhesive means a means for fixing a wire end to a flange using a tape coated with an adhesive or a means for directly fixing a wire end to a flange with an adhesive. As used herein, the term “adhesive” refers to, for example, polyvinyl acetate or polyacrylate as a synthetic adhesive, as described in the section of “adhesive” in the Chemical Dictionary (published by Kyoritsu Shuppan Co., Ltd. in 1989). And natural gums such as gum arabic.

【0010】そうして、請求項1の構成によれば、接着
剤を用いない止着手段によりワイヤ端部をスプールに固
定するので、接着剤がワイヤに付着して繰出し不良やボ
ンディング不良、導通不良等を引き起こす虞れが無くな
り、またスプールの再利用工程において残留接着剤を溶
かすための有機溶剤や洗浄後の残留接着剤検査が不要に
なる。また接着剤を用いない止着手段は止着効果の低減
が少ないので再利用が可能である。更に、接着剤による
不具合が生じる虞れがないので、止着手段を必要以上に
小さくする必要が無い。
[0010] According to the first aspect of the present invention, since the wire end is fixed to the spool by the fastening means that does not use an adhesive, the adhesive adheres to the wire and causes poor feeding, poor bonding, and conduction. This eliminates the risk of causing defects and the like, and eliminates the need for an organic solvent for dissolving the residual adhesive and a residual adhesive inspection after cleaning in the spool recycling process. In addition, the fastening means that does not use an adhesive can be reused because the fastening effect is less reduced. Further, since there is no possibility of causing a problem due to the adhesive, there is no need to make the fastening means smaller than necessary.

【0011】また上記非接着手段の態様として本発明で
は、スプールのフランジ又は胴部に着脱自在に弾性嵌合
する治具(請求項2)、伸縮性を有する環状部材(請求
項3)、非接着テープ(請求項4)、を夫々採用したこ
とを特徴とする。また上記非接着手段は、スプールのフ
ランジ又は胴部とでボンディングワイヤの端部を挟持す
るよう形成したことを特徴とする(請求項5)。これら
請求項2〜5の構成においても、請求項1に係るものと
同様の作用、効果が得られることは言うまでもない。
According to the present invention, as a mode of the non-adhesive means, a jig (claim 2) removably elastically fitted to a flange or a body of a spool, an annular member having elasticity (claim 3), Adhesive tapes (claim 4) are each adopted. Further, the non-adhesive means is formed so as to sandwich the end of the bonding wire between the flange or the body of the spool (claim 5). It is needless to say that the same operations and effects as those of the first aspect can be obtained in the configurations of the second to fifth aspects.

【0012】また請求項2における治具の態様として、
ボンディングワイヤ端部をフランジ又は胴部とで挟持す
る形状の治具が例示でき、さらに詳しくは、スプールの
フランジの厚み方向に対し着脱自在に弾性嵌合するクリ
ップ状の治具や、スプールの左右のフランジに亘って着
脱自在に掛け渡す治具(図1〜図4参照)、若しくは、
スプールのフランジ外面と共にワイヤ端部を挟持する押
え面を有し、該押え面をスプールの胴部内側に着脱自在
に嵌合可能に形成した治具(図5及び図7参照)等が例
示できる。
[0012] In another aspect of the present invention,
A jig having a shape in which the end of the bonding wire is clamped by a flange or a body can be exemplified. More specifically, a clip-shaped jig that removably and resiliently fits in the thickness direction of the spool flange, and a left and right spool Jig (see FIGS. 1 to 4) that detachably spans over the flange of
A jig (see FIGS. 5 and 7) and the like having a holding surface for holding the wire end together with the outer surface of the flange of the spool and having the holding surface detachably fitted to the inside of the body of the spool can be exemplified. .

【0013】請求項3における環状部材の態様として、
スプールのフランジ又は胴部に被せてボンディングワイ
ヤ端部をフランジ又は胴部と共に挟持する形状の環状部
材が例示でき、さらに詳しくは、スプールのフランジに
被せて上記ボンディングワイヤ端部をフランジと共に挟
持する、ゴムなどの伸縮材料からなる環状のバンドが例
示できる(図6及び図8参照)。
[0013] As an embodiment of the annular member in claim 3,
An annular member shaped to cover the flange or body of the spool and clamp the bonding wire end together with the flange or body can be exemplified.More specifically, cover the flange of the spool and clamp the bonding wire end together with the flange. An annular band made of an elastic material such as rubber can be exemplified (see FIGS. 6 and 8).

【0014】請求項4における非接着テープの具体的な
態様として、裏面が吸盤加工されフランジに吸着する吸
盤テープや、磁性材料からなり、スプールフランジに磁
力により固定される磁性テープ等が例示できる。
Specific examples of the non-adhesive tape according to the fourth aspect include a sucker tape whose back surface is sucked and adhered to a flange, and a magnetic tape made of a magnetic material and fixed to a spool flange by magnetic force.

【0015】[0015]

【発明の実施の形態】以下、本発明の実施の形態の例を
図面を参照して説明する。図中1はスプール、2ワイ
ヤ、3、4、5、6、7は夫々非接着手段を表す。
Embodiments of the present invention will be described below with reference to the drawings. In the figure, reference numeral 1 denotes a spool, 2 wires, 3, 4, 5, 6, and 7 respectively denote non-adhesive means.

【0016】スプール1は、ワイヤ2を巻くための円筒
状の胴部1aの一端又は両端にフランジを備えたもの
で、本例では胴部1a両端にフランジ1b,1cを備え
る。
The spool 1 is provided with a flange at one or both ends of a cylindrical body 1a for winding the wire 2. In this example, the spool 1 is provided with flanges 1b and 1c at both ends of the body 1a.

【0017】ワイヤ2は、半導体装置の組立て等に用い
る例えばAu,Ag,Al,Cu或いはこれらの合金等
からなる極細径のボンディングワイヤである。ワイヤ2
は、巻始め端部(ワイヤ繰出し時には終端部になる)2
aと、巻終り端部(ワイヤ繰出し時には始端部になる)
2bとを後述する非接着手段により各々フランジ1b,
1cに止着される。
The wire 2 is a very small diameter bonding wire made of, for example, Au, Ag, Al, Cu, or an alloy thereof used for assembling a semiconductor device. Wire 2
Is the winding start end (it becomes the end when the wire is fed out) 2
a and the end of the winding (becomes the starting end when the wire is fed)
2b and the flanges 1b,
1c.

【0018】図1〜図4に示す非接着手段のうち、3は
クリップ状の治具、4は掛渡し治具であり、これら治具
3、4は合成樹脂等により所望の弾性を有するよう形成
する。
In the non-adhesive means shown in FIGS. 1 to 4, 3 is a clip-shaped jig, 4 is a bridging jig, and these jigs 3, 4 are made of synthetic resin or the like so as to have desired elasticity. Form.

【0019】クリップ状治具3は、スプール1のフラン
ジ1a、1bの厚み方向に対し着脱自在に弾性嵌合可能
な断面コ形のクリップ形状に形成され、ワイヤの終端部
2a、始端部2bをフランジ1a、1bとで挟持するも
のである。
The clip-shaped jig 3 is formed in a clip shape having a U-shaped cross section so that it can be detachably and elastically fitted in the thickness direction of the flanges 1a and 1b of the spool 1, and has a wire end portion 2a and a wire end portion 2b. It is sandwiched between the flanges 1a and 1b.

【0020】掛渡し治具4は、スプール1の左右のフラ
ンジ1a、1bに亘って着脱自在に掛渡し可能なように
形成し、その両端に備えた折曲面部4a、4bとフラン
ジ1a、1bの外面とで、ワイヤの終端部2a、始端部
2bを挟持可能なものである。
The bridging jig 4 is formed so as to be detachably bridging over the left and right flanges 1a and 1b of the spool 1, and has bent surface portions 4a and 4b provided at both ends thereof and the flanges 1a and 1b. And the outer surface of the wire can clamp the end 2a and the start 2b of the wire.

【0021】これらの治具3、4の使用形態としては、
図1に示すように、ワイヤの終端部2aをクリップ状治
具3でフランジ1cに止着し、始端部2bを掛渡し治具
4でフランジ1bに止着する形態と、図2に示すよう
に、前記終端部2aと始端部2bの双方をクリップ状治
具3、3でフランジ1b、1cに止着する形態が例示で
きる。
The use of these jigs 3 and 4 is as follows.
As shown in FIG. 1, the end 2a of the wire is fixed to the flange 1c with the clip-shaped jig 3, and the start end 2b is fixed to the flange 1b with the bridging jig 4, as shown in FIG. In addition, a mode in which both the end portion 2a and the start end portion 2b are fixed to the flanges 1b and 1c with the clip-shaped jigs 3 and 3 can be exemplified.

【0022】図5及び図7に示す非接着手段は、スプー
ル1のフランジ1a、1b外面と共にワイヤの終端部2
a、始端部2bを挟持する押え面5aを有する環状治具
5であり、この環状治具5も合成樹脂等により所望の弾
性を有するよう形成する。環状治具5は、スプール胴部
1aの内側に着脱自在に嵌合する円筒部5bの一端周縁
に、前記押え面5aを一体に形成したもので、円筒部5
bをスプール胴部1aの内側に嵌合することで、押え面
5aとフランジ1a、1b外面とでワイヤの終端部2
a、始端部2bが挟持される。
The non-adhesive means shown in FIG. 5 and FIG.
a, an annular jig 5 having a pressing surface 5a for holding the start end 2b, and this annular jig 5 is also formed of synthetic resin or the like so as to have desired elasticity. The annular jig 5 is formed by integrally forming the pressing surface 5a on one peripheral edge of a cylindrical portion 5b removably fitted inside the spool body 1a.
b is fitted into the inside of the spool body 1a, so that the pressing surface 5a and the outer surfaces of the flanges 1a and 1b are connected to the end 2 of the wire.
a, the starting end 2b is clamped.

【0023】図6及び図8に示す非接着手段は、伸縮性
を有し、スプールのフランジに被せて上記ボンディング
ワイヤ端部をフランジと共に挟持する環状部材6であ
る。該環状部材6は、ゴムなどの伸縮材料からなる環状
のバンドである。
The non-adhesive means shown in FIGS. 6 and 8 is an annular member 6 having elasticity and covering the flange of the spool and holding the bonding wire end together with the flange. The annular member 6 is an annular band made of an elastic material such as rubber.

【0024】図9及び図10に示す非接着手段は非接着
テープ7であって、該テープ7は、裏面が吸盤加工され
フランジ1b、1cに着脱自在に吸着する吸盤テープ
や、磁性材料からなり、フランジ1b、1cに磁力によ
り固定される磁性テープ等が例示できる。尚、磁性テー
プとする場合、スプール1は鉄などの磁性材料で一体成
形したものに錆止め用のめっき(例えばNiめっきな
ど)を施したものを用いることは言うまでもない。
The non-adhesive means shown in FIGS. 9 and 10 is a non-adhesive tape 7, which is made of a sucker tape or a magnetic material, the back surface of which is sucked and which is detachably attached to the flanges 1b and 1c. And a magnetic tape fixed to the flanges 1b and 1c by a magnetic force. When a magnetic tape is used, it is needless to say that the spool 1 is made of a magnetic material such as iron and is integrally molded with rust-preventive plating (for example, Ni plating).

【0025】以上の構成からなる非接着手段3、4、
5、6、7を用いた巻線形態によれば、接着剤を用いる
ことなくワイヤの終端部2a、始端部2bをフランジ1
b、1cに止着することができる。また夫々の非接着手
段3、4、5、6、7は止着効果の低減が少なく再利用
が可能である。更に、夫々の非接着手段3、4、5、
6、7は必要以上に小さくする必要無く適宜大きさに形
成して用いることが出来、よってワイヤ終端部2a、始
端部2bの止着作業や引出し時の取り外し作業を、ピン
セット等を用いることなく容易に行うことができると共
に、巻き付けたワイヤに関する情報を数多く表示するこ
とが可能になる。前記止着作業や取り外し作業の容易性
についてはクリップ状治具3、掛渡し治具4、環状治具
5が殊に優れており、情報表示については掛渡し治具
4、環状治具5が殊に優れている。
The non-adhesive means 3, 4,
According to the winding configuration using 5, 6, and 7, the end 2a and the start 2b of the wire can be connected to the flange 1 without using an adhesive.
b, 1c. Further, each of the non-adhesive means 3, 4, 5, 6, and 7 can be reused with a small reduction in the fastening effect. Further, each of the non-adhesive means 3, 4, 5,
6 and 7 can be formed and used appropriately without the need to make them unnecessarily small, so that the work of fixing the wire end portion 2a and the start end portion 2b and removing the wire at the time of pulling out can be performed without using tweezers or the like. This can be easily performed, and a lot of information on the wound wire can be displayed. The clip-shaped jig 3, the bridging jig 4, and the annular jig 5 are particularly excellent in terms of the easiness of the fixing work and the removing work, and the bridging jig 4, the annular jig 5 are particularly good for displaying information. Especially excellent.

【0026】また、夫々の非接着手段3、4、5、6、
7の使用形態としては図示のものに限定されず、夫々の
非接着手段3、4、5、6、7を適宜に組み合わせて使
用することが可能である。
Each of the non-adhesive means 3, 4, 5, 6,
The use form of 7 is not limited to the illustrated form, and the respective non-adhesive means 3, 4, 5, 6, and 7 can be used in an appropriate combination.

【0027】尚、図示の都合上、ワイヤ2は実際より大
径で、且つスプール1に対し二層状に巻くよう示した
が、該ワイヤ2は直径1mm以下の細線であってスプー
ル1に多層状に巻かれようになることは言うまでもな
い。
For convenience of illustration, the wire 2 is shown to be larger in diameter than the actual one and wound in two layers around the spool 1. However, the wire 2 is a thin wire having a diameter of 1 mm or less, and Needless to say, it will be wrapped around.

【0028】[0028]

【発明の効果】本発明の巻線形態は以上説明したように
構成したので、下記の効果を奏する。接着剤がワイヤに
付着して繰出し不良やボンディング不良、導通不良等を
引き起こす虞れが無くなる。またスプールの再利用工程
において有機溶剤を用いた洗浄や残留接着剤の検査作業
が不要になる。さらに止着効果の低減が少ないので再利
用が可能であり、コスト削減や資源の有効利用が図れ
る。止着手段(非接着手段)を必要以上に小さくする必
要が無いので、ワイヤ端部の止着、引出し作業を容易に
行うことができると共に、巻き付けたワイヤに関する情
報を数多く表示することが可能になる等、多くの効果を
奏する。
The winding configuration of the present invention is constructed as described above, and has the following effects. This eliminates the possibility that the adhesive adheres to the wire to cause poor feeding, poor bonding, poor conduction, and the like. Further, in the spool reusing process, cleaning using an organic solvent and inspection work of the residual adhesive become unnecessary. Further, since the reduction of the fastening effect is small, it can be reused, and cost reduction and effective use of resources can be achieved. Since it is not necessary to make the fastening means (non-adhesive means) unnecessarily small, fastening and pulling-out work of the wire end can be easily performed, and a large amount of information on the wound wire can be displayed. Numerous effects are achieved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る巻線形態の実施の形態の一例を示
す斜視図。
FIG. 1 is a perspective view showing an example of an embodiment of a winding mode according to the present invention.

【図2】本発明に係る巻線形態の実施の形態の一例を示
す斜視図。
FIG. 2 is a perspective view showing an example of an embodiment of a winding mode according to the present invention.

【図3】図2(ロ)に示す巻線形態の縦断面図。FIG. 3 is a longitudinal sectional view of the winding configuration shown in FIG.

【図4】図1(ロ)に示す巻線形態の(X)−(X)線
断面図。
FIG. 4 is a sectional view taken along line (X)-(X) of the winding configuration shown in FIG.

【図5】本発明に係る巻線形態の実施の形態の一例を示
す斜視図。
FIG. 5 is a perspective view showing an example of an embodiment of a winding mode according to the present invention.

【図6】本発明に係る巻線形態の実施の形態の一例を示
す斜視図。
FIG. 6 is a perspective view showing an example of an embodiment of a winding mode according to the present invention.

【図7】図5(ロ)に示す巻線形態の縦断面図。FIG. 7 is a longitudinal sectional view of the winding configuration shown in FIG.

【図8】図6(ロ)に示す巻線形態の縦断面図。FIG. 8 is a vertical sectional view of the winding configuration shown in FIG.

【図9】本発明に係る巻線形態の実施の形態の一例を示
す正面図で一部断面で表す。
FIG. 9 is a partial cross-sectional front view showing an example of an embodiment of a winding form according to the present invention.

【図10】図9に示す巻線形態の斜視図。FIG. 10 is a perspective view of the winding configuration shown in FIG. 9;

【符号の説明】[Explanation of symbols]

1:スプール 1a:胴部 1b、1c:フランジ 2:ワイヤ(ボンディングワイヤ) 2a:ワイヤの巻始め端部(ワイヤ繰出し時の終端部) 2b:ワイヤの巻終り端部(ワイヤ繰出し時の始端部) 3:クリップ状治具(非接着手段) 4:掛渡し治具(非接着手段) 5:環状治具(非接着手段) 6:環状部材(非接着手段) 7:非接着手段(非接着手段) 1: Spool 1a: Body 1b, 1c: Flange 2: Wire (bonding wire) 2a: Beginning end of wire (end at the time of wire feeding) 2b: End of winding of wire (start at the time of wire feeding) 3: clip-shaped jig (non-adhesive means) 4: bridging jig (non-adhesive means) 5: annular jig (non-adhesive means) 6: annular member (non-adhesive means) 7: non-adhesive means (non-adhesive means) means)

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 スプールの円筒状胴部に半導体用ボンデ
ィングワイヤを巻き付け、該ボンディングワイヤの端部
を前記スプールのフランジ又は胴部に止着した半導体用
ボンディングワイヤの巻線形態において、前記ボンディ
ングワイヤ端部をフランジ又は胴部に止着する手段が非
接着手段であることを特徴とする半導体用ボンディング
ワイヤの巻線形態。
In a winding form of a semiconductor bonding wire, a semiconductor bonding wire is wound around a cylindrical body of a spool, and an end of the bonding wire is fixed to a flange or a body of the spool. The winding form of the semiconductor bonding wire, wherein the means for fixing the end to the flange or the body is a non-adhesive means.
【請求項2】 上記非接着手段が、スプールのフランジ
又は胴部に着脱自在に弾性嵌合する治具であることを特
徴とする請求項1記載の半導体用ボンディングワイヤの
巻線形態。
2. The winding form of a semiconductor bonding wire according to claim 1, wherein said non-adhesive means is a jig which is removably and elastically fitted to a flange or a body of a spool.
【請求項3】 上記非接着手段が伸縮性を有する環状部
材であることを特徴とする請求項1記載の半導体用ボン
ディングワイヤの巻線形態。
3. The winding form of a bonding wire for a semiconductor according to claim 1, wherein said non-adhesive means is an annular member having elasticity.
【請求項4】 上記非接着手段が、非接着テープである
ことを特徴とする請求項1記載の半導体用ボンディング
ワイヤの巻線形態。
4. The winding form of a semiconductor bonding wire according to claim 1, wherein said non-adhesive means is a non-adhesive tape.
【請求項5】 上記非接着手段は、上記スプールのフラ
ンジ又は胴部とでボンディングワイヤの端部を挟持する
ものである請求項1〜4の何れか1項記載の半導体用ボ
ンディングワイヤの巻線形態。
5. The winding of a bonding wire for a semiconductor according to claim 1, wherein the non-adhesive means holds an end of the bonding wire with a flange or a body of the spool. Form.
JP11100308A 1999-04-07 1999-04-07 Winding form of bonding wire for semiconductor Pending JP2000294597A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11100308A JP2000294597A (en) 1999-04-07 1999-04-07 Winding form of bonding wire for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11100308A JP2000294597A (en) 1999-04-07 1999-04-07 Winding form of bonding wire for semiconductor

Publications (1)

Publication Number Publication Date
JP2000294597A true JP2000294597A (en) 2000-10-20

Family

ID=14270556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11100308A Pending JP2000294597A (en) 1999-04-07 1999-04-07 Winding form of bonding wire for semiconductor

Country Status (1)

Country Link
JP (1) JP2000294597A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6288076B1 (en) 1996-02-29 2001-09-11 The Research Foundation Of State Unversity Of New York Antimicrobial compositions
EP3412371A1 (en) * 2017-05-30 2018-12-12 Amphenol-Tuchel Electronics GmbH Tape bearing device
JP2020059273A (en) * 2018-10-04 2020-04-16 日東電工株式会社 Heat-resistant mold release sheet and thermal compression bond method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6288076B1 (en) 1996-02-29 2001-09-11 The Research Foundation Of State Unversity Of New York Antimicrobial compositions
EP3412371A1 (en) * 2017-05-30 2018-12-12 Amphenol-Tuchel Electronics GmbH Tape bearing device
JP2020059273A (en) * 2018-10-04 2020-04-16 日東電工株式会社 Heat-resistant mold release sheet and thermal compression bond method

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