JP2000235877A - Anisotropic conductive sheet and manufacturing method thereof - Google Patents

Abstract

(57) [Summary] [PROBLEMS] A required electrical connection is reliably achieved even for an electrode having an oxide film formed on the surface, without contaminating the surface of the electrode to be connected, and many times. Provided is an anisotropic conductive sheet capable of obtaining a long service life even when repeatedly used over a long period of time, and a method for manufacturing the same. SOLUTION: The anisotropic conductive sheet of the present invention has a sheet base material in which a plurality of elastic conductive path forming portions extending in a thickness direction are arranged in a state in which they are insulated from each other by an insulating portion. A conductive material for a contact is integrally provided on the conductive path forming portion via a conductive adhesive layer in which conductive powder is dispersed in a curable resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive material which is preferably used as a connector in an electrical connection between circuit devices such as electronic parts and an inspection device for circuit devices such as printed circuit boards and semiconductor integrated circuits. It is about a sheet.

[0002]

2. Description of the Related Art An anisotropic conductive elastomer sheet has conductivity only in the thickness direction, or has a pressurized conductive portion which has conductivity only in the thickness direction when pressed in the thickness direction. And it is possible to achieve a compact electrical connection without using means such as soldering or mechanical fitting, and it is possible to absorb mechanical shocks and strains and make a soft connection Because of these features, using such features, for example, computers,
In the fields of electronic digital watches, electronic cameras, computer keyboards, etc., it is widely used as a connector for achieving an electrical connection between circuit devices, for example, a printed circuit board and a leadless chip carrier, a liquid crystal panel, etc. ing.

In electrical inspection of a circuit device such as a printed circuit board or a semiconductor integrated circuit, an electrode to be inspected formed on one surface of a circuit device to be inspected and an electrode formed on the surface of the inspection circuit substrate. In order to achieve electrical connection with the test electrode, an anisotropic conductive elastomer sheet is interposed between the test electrode region of the circuit device and the test electrode region of the test circuit board. I have.

Conventionally, as such an anisotropic conductive elastomer sheet, those having various structures are known. For example, Japanese Patent Application Laid-Open No. Sho 51-93393 discloses that metal particles are uniformly dispersed in an elastomer. Anisotropic conductive elastomer sheet (hereinafter referred to as “dispersion type anisotropic conductive elastomer sheet”) obtained by the method described in JP-A-53-147772 is disclosed. By distributing the particles non-uniformly in the elastomer, an anisotropic conductive elastomer sheet (hereinafter, referred to as an electrically conductive elastomer sheet) in which a number of conductive path forming portions extending in the thickness direction and insulating portions that insulate them from each other are formed. "Eccentrically distributed anisotropic conductive elastomer sheet") is disclosed.
Japanese Unexamined Patent Publication No. 250906/2005 discloses an unevenly distributed anisotropic conductive elastomer sheet in which a step is formed between the surface of a conductive path forming portion and an insulating portion.

[0005] The unevenly distributed anisotropic conductive elastomer sheet has a conductive path forming portion formed in accordance with a pattern opposite to an electrode pattern of a circuit board or the like. This is advantageous in that electrical connection between the electrodes can be achieved with high reliability even for a circuit device or the like in which electrodes to be connected are arranged at a small pitch. The one formed so as to protrude from the insulating portion is more preferable because the contact with the electrode to be inspected is surely performed.

However, when such an unevenly distributed anisotropically conductive elastomer sheet is used as a connector in an electrical inspection of a semiconductor integrated circuit, for example, there are the following problems. (1) The surface electrode of a semiconductor integrated circuit is generally made of aluminum.
The aluminum oxide film is formed. Thus,
The conductive path forming portion of the anisotropic conductive elastomer sheet is naturally flexible because it is made of an elastomer. Therefore, when the conductive path forming portion is connected to the electrode on which the oxide film is formed, the conductive path forming portion is formed. Makes it difficult to break through the oxide film, and as a result, the required electrical connection cannot be achieved.

[0007] (2) Silicone rubber is generally used as the elastic polymer material constituting the anisotropic conductive elastomer sheet, and the silicone rubber contains low molecular weight silicone (oil-like). Is contained. When such an anisotropic conductive elastomer sheet is used for a long time, for example, for testing a circuit device, low-molecular-weight silicone bleeds out on the surface of the anisotropic conductive elastomer sheet. The surface of the electrode to be inspected is contaminated. As a result, when mounting the circuit device, bonding cannot be performed or required electrical connection cannot be achieved.

In order to solve such a problem, there has been proposed an anisotropic conductive elastomer sheet in which a conductive material for a contact made of, for example, metal is provided on a conductive path forming portion.
However, in such an anisotropically conductive elastomer sheet, since the adhesiveness between the elastic polymer material forming the anisotropically conductive elastomer sheet and the metal forming the conductive material for contact is low, the following problems are caused. It turned out that there is. That is, when electrically connecting the anisotropic conductive elastomer sheet to the electrode, the conductive path forming portion is pressed and deformed by compression, so that a considerably high stress is applied to the conductive material for contact. When the conductive elastomer sheet is used repeatedly, the conductive material for the contact is separated from the conductive path forming portion early or the conductive material for the contact is cracked, so that a long service life cannot be obtained. .

[0009]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide an electrode having an oxide film formed on its surface. Electrical connection is reliably achieved, without contaminating the surface of the electrode to be connected, and even when used repeatedly many times, an anisotropic conductive sheet that can provide a long service life. To provide. Second embodiment of the present invention
An object of the present invention is to provide a method capable of advantageously producing the above anisotropic conductive sheet.

[0010]

According to the present invention, there is provided an anisotropic conductive sheet in which a plurality of conductive path forming portions each extending in a thickness direction and having elasticity are arranged in a state of being insulated from each other by an insulating portion. An anisotropic conductive sheet having a base material, on a conductive path forming portion of the sheet base material, via a conductive adhesive layer in which conductive powder is dispersed in a curable resin, and a conductive material for contact. Are provided integrally.

In the anisotropic conductive sheet according to the present invention, the sheet substrate has a concave portion on the conductive path forming portion by arranging an upper surface of the conductive path forming portion below an upper surface of the insulating portion. It is preferable that the conductive adhesive layer is accommodated in a recess in the sheet substrate. When the conductive adhesive layer is provided so as to protrude from the surface of the sheet substrate, the conductive material for a contact is provided so as to cover an upper surface and side surfaces of the conductive adhesive layer. Is preferred. Further, it is preferable that the conductive material for a contact is made of a metal sheet or a metal film.

[0012] The method for producing an anisotropic conductive sheet of the present invention comprises:
A method for producing the above anisotropic conductive sheet, comprising, on a conductive material layer for forming a conductive material for a contact, a plurality of conductive adhesive layers in which conductive powder is dispersed in a curable resin. Forming a plurality of elastic conductive path forming portions formed integrally with the conductive adhesive layer and extending in the thickness direction on the conductive adhesive layer, and an insulating member for insulating the conductive path forming portions from each other; Forming a sheet base consisting of
Then, by removing a part of the conductive material layer,
Forming a contact conductive material on the conductive adhesive layer by using the remaining portion of the conductive material layer.

In the method for producing an anisotropic conductive sheet according to the present invention, the conductive material layer is supported on an easily peelable support plate. Is preferably separated from the conductive material layer.
Preferably, the conductive material for a contact formed on the conductive adhesive layer is formed of a metal sheet or a metal film.

[0014]

(1) Since the conductive material for contact is formed on the conductive path forming portion of the sheet substrate via the conductive adhesive layer, the electrode to be connected has an oxide film on its surface. Even so, the oxide film can be pierced by the conductive material for the contact, so that the required electrical connection is reliably achieved. (2) Since the conductive path forming portion of the sheet substrate does not directly contact the electrode to be connected, the low molecular weight component contained in the elastic polymer material forming the conductive path forming portion causes the electrode to be connected. No contamination of the surface. (3) The curable resin constituting the conductive adhesive layer has high adhesiveness to both the elastic polymer substance and the metal, and the conductive adhesive layer itself is not deformed. Even when the conductive adhesive layer is used repeatedly, the conductive adhesive layer does not peel off from the conductive path forming portion and the contact conductive material does not peel off from the conductive adhesive layer, so that a long service life can be obtained.

[0015]

Embodiments of the present invention will be described below in detail. <First Embodiment> FIG. 1 is an explanatory sectional view showing the structure of a main part of a first embodiment of the anisotropic conductive sheet of the present invention. The anisotropic conductive sheet has a sheet substrate 10 including a plurality of conductive path forming portions 11 extending in the thickness direction, and an insulating portion 12 for insulating the conductive path forming portions 11 from each other. Each of the conductive path forming portions 11 in the sheet substrate 10 is formed of a conductive material having elasticity, and is arranged along the surface direction of the sheet substrate 10 according to a pattern corresponding to a pattern of an electrode to be connected. ing. The conductive material for contact 30 is integrally provided on the conductive path forming portion 11 via the conductive adhesive layer 20. In the first embodiment, each of the conductive path forming portions 11 has the same thickness as the thickness of the insulating portion 12, and is arranged such that its upper surface is located on the same plane as the upper surface of the insulating portion 12. As a result, the conductive adhesive layer 20 and the conductive material for contact 30 are in a state of protruding from the surface of the insulating portion 12 of the sheet substrate 10.

The conductive path forming portion 11 in the sheet substrate 10
Is constituted by containing conductive particles in an insulating elastic polymer material, and preferably, the conductive particles are oriented in the elastic polymer material in a state of being arranged in the thickness direction. A conductive path is formed in the thickness direction of the conductive path forming portion. The conductive path forming section 11 may be a pressurized conductive path forming section in which a conductive path is formed by reducing a resistance value when compressed in a thickness direction and compressed.

As the insulating elastic high molecular substance used for the conductive path forming portion 11, a high molecular substance having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance forming material that can be used to obtain the crosslinked polymer substance, and specific examples thereof include polybutadiene rubber, natural rubber, polyisoprene rubber, and styrene-
Conjugated diene rubbers such as butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, and block copolymers such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer Rubber and their hydrogenated products,
Examples include chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene-propylene-diene copolymer rubber. In the above, when weather resistance is required for the obtained anisotropic conductive sheet, it is preferable to use a material other than the conjugated diene rubber, and particularly, from the viewpoint of moldability and electrical characteristics, use of silicone rubber Is preferred.

Preferably, the silicone rubber is obtained by crosslinking or condensing a liquid silicone rubber. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of condensation type, addition type, and those containing a vinyl group or a hydroxyl group. Good. Specifically, dimethylsilicone raw rubber, methylvinylsilicone raw rubber, methylphenylvinylsilicone raw rubber and the like can be mentioned.

Among these, liquid group-containing silicone rubber (vinyl group-containing polydimethylsiloxane)
Is usually obtained by subjecting dimethyldichlorosilane or dimethyldialkoxysilane to hydrolysis and condensation reaction in the presence of dimethylvinylchlorosilane or dimethylvinylalkoxysilane, for example, followed by fractionation by repeated dissolution-precipitation. Also,
The liquid silicone rubber containing vinyl groups at both ends is anionically polymerized with a cyclic siloxane such as octamethylcyclotetrasiloxane in the presence of a catalyst, and uses, for example, dimethyldivinylsiloxane as a polymerization terminator and other reaction conditions (for example, , The amount of the cyclic siloxane and the amount of the polymerization terminator). Here, as a catalyst for anionic polymerization, alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C. Such a vinyl group-containing polydimethylsiloxane preferably has a molecular weight Mw (weight average molecular weight in terms of standard polystyrene; the same applies hereinafter) of 10,000 to 40,000. In addition, from the viewpoint of heat resistance of the obtained conductive path element, the molecular weight distribution index (the value of the ratio Mw / Mn between the standard polystyrene-equivalent weight average molecular weight Mw and the standard polystyrene-equivalent number average molecular weight Mn; hereinafter the same) is 2. 0.0 or less is preferable.

On the other hand, a liquid silicone rubber containing hydroxyl groups (hydroxyl group-containing polydimethylsiloxane) is usually prepared by hydrolyzing dimethyldichlorosilane or dimethyldialkoxysilane in the presence of dimethylhydrochlorosilane or dimethylhydroalkoxysilane. And condensation reaction, for example,
It is obtained by performing fractionation by repeating precipitation.
The cyclic siloxane is anionically polymerized in the presence of a catalyst, and a polymerization terminator such as dimethylhydrochlorosilane, methyldihydrochlorosilane or dimethylhydroalkoxysilane is used. Other reaction conditions (for example, the amount of the cyclic siloxane and the polymerization termination) Amount of agent)
Can also be obtained by appropriately selecting Here, as a catalyst for anionic polymerization, alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or a silanolate solution thereof can be used. The reaction temperature is, for example, 80 to 130 ° C. Such hydroxyl group-containing polydimethylsiloxane is,
It is preferable that the molecular weight Mw is 10,000 to 40,000. Further, from the viewpoint of heat resistance of the obtained conductive path element, those having a molecular weight distribution index of 2.0 or less are preferable. In the present invention, either one of the above-mentioned vinyl group-containing polydimethylsiloxane and hydroxyl group-containing polydimethylsiloxane can be used, or both can be used in combination.

As the conductive particles used in the conductive path forming portion 11, the particles are formed by a method described later.
It is preferable to use conductive magnetic particles from the viewpoint that they can be easily oriented in the thickness direction of 0. Specific examples of the conductive magnetic particles include particles of a metal exhibiting magnetism such as nickel, iron, and cobalt, or particles of an alloy thereof, or particles containing these metals, or particles containing these metals as core particles. The core particles are obtained by plating the surface of a core particle with a metal having good conductivity such as gold, silver, palladium, and rhodium, or inorganic particles or polymer particles such as nonmagnetic metal particles or glass beads as core particles. Examples thereof include a particle obtained by plating the surface of a particle with a conductive magnetic material such as nickel and cobalt, and a particle obtained by coating a core particle with both a conductive magnetic material and a metal having good conductivity. Among them, it is preferable to use nickel particles as core particles, the surfaces of which are plated with a metal having good conductivity such as gold or silver. Means for coating the surface of the core particles with a conductive metal is not particularly limited, but may be, for example, chemical plating or electroless plating.

When the conductive particles are formed by coating the surface of a core particle with a conductive metal, the coverage of the conductive metal on the particle surface (from the viewpoint of obtaining good conductivity) Is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%. Further, the coating amount of the conductive metal is 0.5 to
It is preferably 50% by weight, more preferably 1 to
The content is 30% by weight, more preferably 3 to 25% by weight, particularly preferably 4 to 20% by weight. When the conductive metal to be coated is gold, the coating amount is from 2.5 to 2.5
It is preferably 30% by weight, more preferably 3 to
It is 20% by weight, more preferably 3.5 to 15% by weight, particularly preferably 4 to 10% by weight. When the conductive metal to be coated is silver, the coating amount is preferably 3 to 50% by weight of the core particles, more preferably 4 to 40% by weight, and further preferably 5 to 30% by weight. weight%,
Particularly preferably, it is 6 to 20% by weight.

The conductive particles have a particle size of 1 to 100.
0 μm, more preferably 2 to 50 μm.
0 μm, more preferably 5 to 300 μm, particularly preferably 10 to 200 μm. Further, the particle size distribution (Dw / Dn) of the conductive particles is preferably 1 to 10, more preferably 1.01 to 7, further preferably 1.05 to 5, and particularly preferably 1.1 to 1. 4. By using conductive particles that satisfy such conditions,
The obtained conductive path forming portion 11 can be easily deformed under pressure, and sufficient electrical contact between the conductive particles can be obtained in the conductive path forming portion 11. Further, the shape of the conductive particles is not particularly limited, but is spherical, star-shaped, or a secondary particle in which these are aggregated because they can be easily dispersed in the polymer material. It is preferably in the form of a lump of particles.

The water content of the conductive particles is preferably 5% or less, more preferably 3% or less, further preferably 2% or less, and particularly preferably 1% or less. By using the conductive particles satisfying such conditions, it is possible to prevent bubbles from being generated in the polymer material layer when the polymer material layer is cured in the manufacturing method described below or Is suppressed.

As the conductive particles, those whose surfaces have been treated with a coupling agent such as a silane coupling agent can be used as appropriate. When the surface of the conductive particles is treated with the coupling agent, the adhesion between the conductive particles and the elastic polymer material is increased, and as a result, the obtained conductive path forming portion 11 has durability in repeated use. It becomes high. The amount of the coupling agent used is appropriately selected within a range that does not affect the conductivity of the conductive particles. However, the coverage of the coupling agent on the surface of the conductive particles (the ratio of the coupling agent to the surface area of the conductive core particles). (The ratio of the coating area) is preferably 5% or more, more preferably 7 to 100%, further preferably 10 to 100%, and particularly preferably 20 to 10%.
The amount is 0%.

The conductive particles are formed in the conductive path forming portion 1.
1 to 30 to 60% by volume fraction, preferably 35 to 50
% Is preferable. If the ratio is less than 30%, the conductive path forming portion 11 having a sufficiently small electric resistance value may not be obtained. On the other hand, if this ratio exceeds 60%, the obtained conductive path forming portion 11 tends to be fragile, and the elasticity required for the conductive path forming portion may not be obtained.

The insulating portion 12 of the sheet base 10 is made of an elastic high-molecular substance having an insulating property. Curable polymer material forming materials that can be used to obtain such an elastic polymer material include polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, and the like. Conjugated diene rubbers and hydrogenated products thereof, styrene-butadiene-diene block copolymer rubbers, block copolymer rubbers such as styrene-isoprene block copolymers and hydrogenated products thereof, chloroprene, urethane rubber, polyester Base rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, and the like.If the obtained anisotropic conductive sheet is required to have weather resistance, it may be conjugated. Use other than diene rubber Preferred.

As the elastic high molecular substance forming the insulating section 12, the same type or different type of elastic high molecular substance forming the conductive path forming section 12 can be used. Further, the insulating section 12 may be integrated with the conductive path forming section 11 or may be separate.

The thickness of the sheet substrate 10 is, for example, 0.1 to
2 mm, preferably 0.2 to 1 mm. The diameter of the conductive path forming portion 11 is, for example, 0.02 to 1 mm.
And preferably 0.05 to 0.5 mm.

The conductive adhesive layer 20 is formed by dispersing conductive powder in a curable resin. Conductive adhesive layer 20
Various thermosetting resins or radiation-curable resins can be used as the curable resin constituting the resin, and specific examples thereof include an epoxy resin, a polyimide resin, and a phenol resin. As the conductive powder constituting the conductive adhesive layer 20, various metal powders can be used, and specific examples thereof include silver powder, palladium powder, silver-palladium alloy powder, gold powder, copper powder or these. And the like. Conductive adhesive layer 2
The thickness of 0 is, for example, 0.05 to 0.5 mm, and preferably 0.15 to 0.25 mm.

The content ratio of the conductive powder in the conductive adhesive layer 20 is 30 to 70% by volume, particularly 40 to 60%.
It is preferred that If this content ratio is too small, it may be difficult to obtain the conductive adhesive layer 20 having the required conductivity. On the other hand, if this content ratio is excessive, the obtained conductive adhesive layer 20 tends to have low strength, and when repeatedly used, is broken early and cannot provide a long service life. There is.

As the conductive material 30 for the contact, a material made of an organic material such as a conductive polymer, a material mixed with a metal, a material made of a metal such as a metal sheet or a metal film, or the like can be used. it can. Among these, it is preferable to use a metal sheet or a metal film or other metal, since it can reliably break through an oxide film formed on the surface of the electrode to be connected. Specific examples of such a metal include , Copper, gold, rhodium, platinum, palladium, nickel or their plating or alloys thereof. Such a contact conductive material 30 may be composed of a laminate such as a nickel layer / copper layer / gold layer. In addition, the thickness of the contact conductive material 30 is, for example, 0.01 to 0.5 mm,
Preferably it is 0.025 to 0.1 mm.

The above-described anisotropic conductive sheet can be produced, for example, by the following method (a) or method (b). Method (a): In this method (a), first, as shown in FIG.
A conductive material layer 30A made of, for example, a metal for forming the contact conductive material 30 is formed on one surface 41 of the easily peelable support plate 40. Next, as shown in FIG. 3, the conductive pattern corresponding to the intended arrangement pattern of the conductive path forming portions 11 is formed on the conductive material layer 30 </ b> A supported on the one surface 41 of the easily peelable support plate 40 by photolithography. A resist layer 45 having holes 46 formed according to the pattern is formed. Then, the holes 46 in the resist layer 45 are formed.
Is filled with a fluid conductive adhesive layer forming material obtained by dispersing conductive powder in a curable resin material, and the conductive adhesive layer forming material is cured, as shown in FIG. Then, the conductive adhesive layer 20 is formed in the hole 46 of the resist layer 45.
Is formed.

In the above, stainless steel (SUS) is preferably used as a material constituting the easily peelable support plate 40. In addition, as a method for forming the conductive material layer 30A made of metal on one surface 41 of the easily peelable support plate 40, a sputtering method, an evaporation method, another plating method, or the like can be used. As a method of filling the conductive adhesive layer forming material into the holes 46 of the resist layer 45, a printing method such as screen printing, a porous printing method, or the like can be used.

Next, on the upper surfaces of the resist layer 45 and the conductive adhesive layer 20, a sheet base forming material in which conductive magnetic particles are dispersed in a polymer material which is cured to become an elastic polymer material is provided. By applying, as shown in FIG. 5, the sheet base material forming material layer 10A is formed on the upper surfaces of the resist layer 45 and the conductive adhesive layer 20.

The sheet base material may contain a curing catalyst for curing the polymer substance forming material. Such curing catalysts include organic peroxides,
Fatty acid azo compounds, hydrosilylation catalysts and the like can be used. Specific examples of the organic peroxide used as the curing catalyst include benzoyl peroxide, bisdicyclobenzoyl peroxide, dicumyl peroxide, and ditertiary butyl peroxide. Specific examples of the fatty acid azo compound used as a curing catalyst include azobisisobutyronitrile. Specific examples of those which can be used as a catalyst for the hydrosilylation reaction include chloroplatinic acid and salts thereof, a platinum-unsaturated group-containing siloxane complex, a complex of vinylsiloxane and platinum,
Known examples include a complex of platinum and 1,3-divinyltetramethyldisiloxane, a complex of triorganophosphine or phosphite and platinum, an acetylacetate platinum chelate, and a complex of cyclic diene and platinum. The amount of curing catalyst used is
It is appropriately selected in consideration of the type of the polymer-forming material, the type of the curing catalyst, and other curing treatment conditions, and is usually 3 to 15 parts by weight based on 100 parts by weight of the polymer-forming material.

[0037] The sheet base material may contain an inorganic filler such as ordinary silica powder, colloidal silica, airgel silica, and nalmina, if necessary. By including such an inorganic filler, the thixotropy of the sheet base material is secured, the viscosity thereof is increased, and the dispersion stability of the conductive particles is improved, and the obtained sheet base material is obtained. The strength of is increased. The use amount of such an inorganic filler is not particularly limited, but if used in a large amount, the orientation of the conductive magnetic particles due to the magnetic field cannot be sufficiently achieved in the manufacturing method described below. Is not preferred. The viscosity of the sheet base material is preferably in the range of 100,000 to 1,000,000 cp at a temperature of 25 ° C.

Next, as shown in FIG. 6, one magnetic pole plate 50 is arranged on the upper surface of the sheet base material forming material layer 10A, and the other magnetic pole plate 55 is arranged on the lower surface of the easily peelable support plate 40. Further, a pair of electromagnets 51 and 56 are arranged on the upper surface of one pole plate 50 and the lower surface of the other pole plate 55.
Here, the one magnetic pole plate 50 has a ferromagnetic material portion M formed in accordance with a pattern opposite to the intended arrangement pattern of the conductive path forming portions 11, and a non-magnetic material portion is provided on portions other than the ferromagnetic material portion M. A portion N is formed, and the ferromagnetic portion M
Are arranged above the conductive adhesive layer 20.
Further, the other magnetic pole plate 55 is provided with the target conductive path forming portion 1.
A ferromagnetic portion M is formed according to the same pattern as the arrangement pattern of No. 1, and a non-magnetic portion N is formed in a portion other than the ferromagnetic portion M. It is arranged to be located below the layer 20.

One pole plate 50 and the other pole plate 55
As a material constituting the ferromagnetic portion M in each of the above, iron, nickel, cobalt, or an alloy thereof can be used. In addition, as a material forming the nonmagnetic portion N in each of the one magnetic pole plate 50 and the other magnetic pole plate 55, a nonmagnetic metal such as copper, a heat-resistant resin such as polyimide, or the like can be used.

By operating the electromagnets 51 and 56, a parallel magnetic field acts in a direction from the ferromagnetic portion M of the one pole plate 50 to the corresponding ferromagnetic portion M of the other pole plate 55. I do. As a result, in the sheet base material forming layer 10A, the sheet base forming material layer 1
The conductive magnetic particles dispersed in the magnetic poles 0A gather in a portion located between the ferromagnetic portion M of one pole plate 50 and the corresponding ferromagnetic portion M of the other pole plate 55. And more preferably, it is oriented in the thickness direction of the sheet base forming material layer 10A. In this state, by curing the sheet base material forming layer 10A, as shown in FIG. 7, the strength of the ferromagnetic portion M of one pole plate 50 and the strength of the other pole plate 55 corresponding to the ferromagnetic portion M are increased. A sheet base comprising a conductive path forming portion 11 densely filled with conductive magnetic particles and an insulating portion 12 containing no or almost no conductive magnetic particles, disposed between the magnetic portion M 10 are formed.

In the above, the sheet base material layer 10
The curing treatment of A can be performed in a state where the parallel magnetic field is applied, but can also be performed after stopping the application of the parallel magnetic field. The intensity of the parallel magnetic field applied to the sheet base material forming layer 10A is preferably 200 to 10000 gauss on average. As a means for applying a parallel magnetic field, a permanent magnet can be used instead of an electromagnet. As such a permanent magnet, a magnet made of Alnico (registered trademark) (Fe-Al-Ni-Co-based alloy), ferrite, or the like is preferable in that a parallel magnetic field strength within the above range can be obtained. In the conductive path forming portion 11 thus obtained, since the conductive particles are oriented so as to be arranged in the thickness direction of the sheet substrate 10, good conductivity can be obtained even if the ratio of the conductive particles is small.

The curing treatment of the sheet base forming material layer 10A is appropriately selected depending on the material to be used.
The heat treatment is performed. When performing the curing treatment of the sheet base material forming material layer 10A by heating, the electromagnet 51,
A heater may be provided at 56. The specific heating temperature and heating time are appropriately selected in consideration of the type of the material for the polymer substance constituting the sheet base forming material layer 10A, the time required for the movement of the conductive magnetic particles, and the like.

The easily peelable support plate 40 on which the sheet base material 10 has been formed in this manner is taken out from between the one magnetic pole plate 50 and the other magnetic pole plate 55, and further, as shown in FIG. The peelable support plate 40 is peeled from the conductive material layer 30A. Then, photolithography and etching are performed on the conductive material layer 30A to remove a part of the conductive material layer 30A, and as shown in FIG. A contact conductive material 30 made of a metal sheet or a metal film is formed, and a resist layer 45 formed on the sheet base 10 is further formed.
By removing, an anisotropic conductive sheet having the configuration shown in FIG. 1 is obtained.

According to such a method, the conductive adhesive layer forming material is applied on the conductive material layer 30A for forming the contact conductive material 30, and the curing process is performed. Conductive adhesive layer 20 with high adhesion to
The sheet having the conductive path forming portion 11 having a high adhesiveness to the conductive adhesive layer 20 in order to form the sheet base material forming layer 10A on the conductive adhesive layer 20 and to perform the curing treatment thereof. The substrate 10 is obtained reliably. Further, since the conductive material layer 30A is supported on the easily peelable support plate 40, the conductive adhesive layer 20 can be easily formed on the conductive material layer 30A, and the conductive adhesive layer 20 Thus, the sheet base material 10 can be easily formed.

Method (b): In this method (b),
As shown in FIG. 10, a sheet base 10 prepared in advance by an appropriate method is prepared, and on this sheet base 10,
A resist layer 45 having a hole 46 exposing the upper surface of the conductive path forming portion 11 is formed, and the hole 46 of the resist layer 45 is filled with the above-described conductive adhesive layer forming material. By performing the curing process of FIG.
As shown in FIG. 5, the conductive adhesive layer 20 is formed in the hole 46 of the resist layer 45. As a method of filling the conductive adhesive layer forming material into the holes 46 of the resist layer 45, a printing method such as screen printing or the like can be used.

Next, as shown in FIG. 12, a conductive material layer 3 made of, for example, a metal for forming the contact conductive material 30 is formed on the resist layer 45 and the conductive adhesive layer 20.
0A is formed, and photolithography and etching are performed on the conductive material layer 30A to remove a part of the conductive material layer 30A, thereby forming the conductive material layer 30A on the conductive adhesive layer 20 as shown in FIG. The contact conductive material 30 made of, for example, a metal sheet or a metal film is formed by the remainder, and the resist layer 4 formed on the sheet base 10 is further formed.
By removing 5, an anisotropic conductive sheet having the configuration shown in FIG. 1 is obtained. As a method for forming the conductive material layer 30A on the upper surfaces of the resist layer 45 and the conductive adhesive layer 20, a sputtering method, an evaporation method, another plating method, or the like can be used.

In the anisotropic conductive sheet of the present invention, the contact conductive material 30 in the anisotropic conductive sheet is brought into contact with the electrode to be connected, and further pressed, whereby the contact conductive material 30 Through the adhesive layer 20 and the conductive path forming portion 11 in the sheet substrate 10, required electric connection is achieved.

According to such an anisotropic conductive sheet, on the conductive path forming portion 11 of the sheet substrate 10,
Since the contact conductive material 30 is formed via the conductive adhesive layer 20, even if the electrode to be connected has an oxide film on its surface, the contact conductive material 30 may break through the oxide film. Therefore, required electrical connection can be reliably achieved. In addition, since the conductive path forming portion 11 of the sheet substrate 10 does not directly contact the electrode to be connected, the electrode is formed by the low molecular weight component contained in the elastic polymer material constituting the sheet substrate 10. Surface is not contaminated. Further, the conductive adhesive layer 2
In addition, the curable resin constituting the sheet No. 0 has high adhesiveness to both the elastic polymer substance constituting the sheet base material 10 and the material constituting the conductive material for contact 30, for example, a metal. Since the layer 20 itself is not deformed, even when repeatedly used many times, the conductive adhesive layer 20 is separated from the sheet base material 10 and the conductive material 30 for contact from the conductive adhesive layer 20 is removed. Long service life is obtained without peeling.

<Second Embodiment> FIG. 14 is an explanatory cross-sectional view showing the structure of a main part of a second embodiment of the anisotropic conductive sheet of the present invention. The anisotropic conductive sheet has a plurality of conductive path forming portions 1 each extending in the thickness direction.
1 and an insulating portion 12 that insulates the conductive path forming portions 11 from each other. Each of the conductive path forming portions 11 in the sheet substrate 10 is formed of a conductive material having elasticity, and is arranged along the surface direction of the sheet substrate 10 according to a pattern corresponding to a pattern of an electrode to be connected. ing. The conductive material for contact 30 is integrally provided on the conductive path forming portion 11 via the conductive adhesive layer 20. In the second embodiment, each of the conductive path forming portions 11 is
The concave portion 15 is formed on the conductive path forming portion 11 by arranging such that the upper surface thereof is located lower than the upper surface of the insulating portion 12. The conductive adhesive layer 20 is accommodated in the recess 15 formed on the conductive path forming portion 11, so that the upper surface of the conductive adhesive layer 20 is flush with the upper surface of the insulating portion 12. As a result, the contact conductive material 30 is projected from the surface of the insulating portion 12 of the sheet base 10. In the above, the sheet substrate 10, the conductive adhesive layer 20, and the contact conductive material 3
The specific configuration of each of 0 is the same as that of the anisotropic conductive sheet according to the above-described first embodiment.

The above-described anisotropic conductive sheet can be manufactured, for example, by the following method. First, the first
In the same manner as in the method (a) in the embodiment, an easily peelable support plate 40 having a smooth surface 41 is prepared, and as shown in FIG. A conductive material layer 30A made of, for example, a metal for forming the conductive material 30 is formed. Next, on the conductive material layer 30A supported on one surface 41 of the easily peelable support plate 40, a fluid conductive adhesive layer forming material in which conductive powder is dispersed in a curable resin material is used. The conductive adhesive layer forming material is applied in accordance with a pattern corresponding to the arrangement pattern of the conductive path forming portions 11 to be cured, and the conductive adhesive layer forming material is cured as shown in FIG. Layer 20 is formed. Then, on the upper surfaces of the conductive adhesive layer 20 and the conductive material layer 30A, a sheet substrate forming material in which conductive magnetic particles are dispersed in a polymer material that is cured to become an elastic polymer material is applied. As a result, as shown in FIG. 16, the sheet base forming material layer 10A is formed on the upper surfaces of the conductive adhesive layer 20 and the conductive material layer 30A.
Is formed. In the above, the specific configurations of the conductive adhesive layer forming material and the sheet base material are the same as those of the method (a) in the first embodiment.

A parallel magnetic field is applied to the thus formed sheet base material layer 10A in the same manner as in the first embodiment, and the sheet base material layer 10A is cured. Thus, as shown in FIG. 17, the conductive magnetic particles disposed between the ferromagnetic portion M of one magnetic pole plate 50 and the corresponding ferromagnetic material portion M of the other magnetic pole plate 55 Conductive path forming part 1 in which is densely filled
Thus, a sheet base material 10 is formed, which is composed of an insulating portion 12 having no or almost no conductive magnetic particles.

The easily peelable support plate 40 on which the sheet base material 10 is formed in this manner is taken out from between the one magnetic pole plate 50 and the other magnetic pole plate 55, and further, as shown in FIG. The peelable support plate 40 is peeled from the conductive material layer 30A. The conductive material layer 30A is subjected to photolithography and etching to remove a part of the conductive material layer 30A, thereby forming the contact conductive material 30 made of, for example, a metal sheet or a metal film on the conductive adhesive layer 20. Thus, an anisotropic conductive sheet having the configuration shown in FIG. 14 is obtained.

According to such an anisotropic conductive sheet, the same effects as those of the anisotropic conductive sheet according to the first embodiment can be obtained, and furthermore, the conductive adhesive layer 20 The conductive adhesive layer 2 has a higher adhesiveness to the sheet substrate 10 because it is formed in a state of being housed in the recess 15 formed on the conductive path forming portion 11 of the material 10.
0 is obtained.

<Third Embodiment> FIG. 19 is an explanatory sectional view showing the structure of a main part of a third embodiment of the anisotropic conductive sheet of the present invention. The anisotropic conductive sheet has a plurality of conductive path forming portions 1 each extending in the thickness direction.
1 and an insulating part 1 for insulating these conductive path forming parts from each other.
2 having a sheet base material 10. Each of the conductive path forming portions 11 in the sheet substrate 10 is formed of a conductive material having elasticity, and is arranged along the surface direction of the sheet substrate 10 according to a pattern corresponding to a pattern of an electrode to be connected. ing. Then, the conductive path forming section 1
1, a conductive material 30 for contact is provided integrally via a conductive adhesive layer 20. In the third embodiment, each of the conductive path forming portions 11 has the same thickness as the thickness of the insulating portion 12 and is arranged such that its upper surface is located on the same plane as the upper surface of the insulating portion 12. As a result, the conductive adhesive layer 20 and the conductive material for contact 30 are in a state of protruding from the surface of the insulating portion 12 of the sheet substrate 10. The conductive material for contact 30 is provided so as to cover the upper surface and side surfaces of the conductive adhesive layer 20. In the above, the sheet substrate 10, the conductive adhesive layer 20
The specific configuration of each of the contact conductive materials 30 is the same as that of the anisotropic conductive sheet according to the first embodiment.

The above-described anisotropic conductive sheet can be manufactured, for example, by the following method. First, the first
In the same manner as in the method (a) in the embodiment, an easily peelable support plate 40 having a smooth surface 41 is prepared, and FIG.
As shown in FIG. 5, on one surface 41 of this easily peelable support plate 40,
A resist layer 45 having holes 46 formed in accordance with a pattern corresponding to a target arrangement pattern of the conductive path forming portions 11 is formed by a photolithography technique.
Next, as shown in FIG. 21, a conductive material layer 30A made of, for example, a metal for forming the contact conductive material 30 is formed on the resist layer 45 and the easily peelable support plate 40. 22 is filled with a fluid conductive adhesive layer forming material in which a conductive powder is dispersed in a curable resin material, and the conductive adhesive layer forming material is cured by the hardening treatment shown in FIG. As shown in FIG. 5, the conductive adhesive layer 20 is formed in the hole 46 of the resist layer 45.
Then, on the upper surfaces of the conductive adhesive layer 20 and the conductive material layer 30A, a sheet substrate forming material in which conductive magnetic particles are dispersed in a polymer material that is cured to become an elastic polymer material is applied. Thereby, as shown in FIG. 23, sheet base forming material layer 10A is formed on the upper surfaces of conductive adhesive layer 20 and conductive material layer 30A. In the above, the specific configurations of the conductive adhesive layer forming material and the sheet base material are the same as those of the method (a) in the first embodiment.

A parallel magnetic field is applied to the sheet base material layer 10A thus formed in the same manner as in the first embodiment, and the sheet base material layer 10A is cured. Thus, as shown in FIG. 24, the conductive magnetic particles disposed between the ferromagnetic portion M of one pole plate 50 and the corresponding ferromagnetic portion M of the other pole plate 55 Conductive path forming part 1 in which is densely filled
Thus, a sheet base material 10 is formed, which is composed of an insulating portion 12 having no or almost no conductive magnetic particles.

The easily peelable support plate 40 on which the sheet base material 10 is formed in this manner is taken out from between the one magnetic pole plate 50 and the other magnetic pole plate 55, and further, as shown in FIG. The peelable support plate 40 is peeled from the conductive material layer 30A. Then, by removing the resist layer 45,
As shown in FIG. 26, the entire surface of conductive material layer 30A is exposed, photolithography and etching are performed on conductive material layer 30A to remove a part of conductive material layer 30A. The conductive material 30 for a contact made of, for example, a metal sheet or a metal film is formed by the remaining portion of the conductive material layer 30A, whereby the anisotropic conductive sheet having the configuration shown in FIG. 19 is obtained.

According to such an anisotropic conductive sheet, the same effects as those of the anisotropic conductive sheet according to the first embodiment can be obtained, and further, the contact conductive material 30
Since it is provided so as to cover the upper surface and the side surface of the conductive adhesive layer 20, the contact conductive material 30 having higher adhesiveness to the conductive adhesive layer 20 can be obtained.

Although the three embodiments according to the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications as described below can be added. (1) As shown in FIG. 27, a hemispherical conductive adhesive layer 20 is provided on the conductive path forming portion of the sheet substrate 10, and the contact conductive material 30 covers the surface of the conductive adhesive layer 20. May be provided. Such an anisotropic conductive sheet can be obtained by the method (b) in the first embodiment.
In this case, the production can be performed by forming a hemispherical conductive adhesive layer 20 on the conductive path forming portion 11 in the sheet substrate 10.

(2) As shown in FIG. 28, a contact conductive material 30 is provided so as to cover the upper surface and side surfaces of the conductive adhesive layer 20 and to cover the periphery of the conductive adhesive layer 20 in the sheet substrate 10. It may be. This anisotropic conductive sheet is different from the manufacturing method according to the third embodiment in that
By photolithography and etching process,
Conductive adhesive layer 2 in conductive material layer 30A made of metal
The conductive material layer 30A can be manufactured by removing a part of the conductive material layer 30A so as to leave a portion formed in the peripheral portion of 0. According to such an anisotropic conductive sheet, since the contact conductive material 30 is also adhered to the sheet base 10,
As a result of improving the adhesive strength of the contact conductive material 30, a longer service life can be obtained.

(3) As shown in FIG.
And a conductive adhesive layer 20 formed of a columnar protruding portion 22 having an outer diameter smaller than that of the base layer portion 21 formed so as to protrude from the base layer portion 21.
The contact conductive material 10 may be provided so as to cover the upper surface and side surfaces of the protruding portion 22 and the upper surface and side surfaces of the base layer portion 21. This anisotropic conductive sheet is the same as the method of the third embodiment, except that the conductive adhesive layer 2
It can be manufactured by forming a resist layer having holes of a shape conforming to the shape of 0. According to such an anisotropic conductive sheet, since the conductive adhesive layer 20 has the protruding portion 22 having a small outer diameter, electrical connection to the electrode having the oxide film can be more reliably achieved.

[0062]

According to the anisotropic conductive sheet of the present invention, the conductive material for the contact is formed on the conductive path forming portion of the sheet base via the conductive adhesive layer. Therefore, even if the electrode to be connected has an oxide film on its surface, the contact conductive material can break through the oxide film, so that required electrical connection can be reliably achieved. In addition, since the conductive path forming portion of the sheet substrate does not directly contact the electrode to be connected, the surface of the electrode is low due to the low molecular weight component contained in the elastic polymer material constituting the sheet substrate. No contamination. Further, the curable resin constituting the conductive adhesive layer has a high adhesiveness to both the elastic polymer substance and the metal, and furthermore, the conductive adhesive layer itself does not deform, so that it can be used many times. Even when used repeatedly, the conductive adhesive layer does not peel off from the sheet substrate and the conductive material for contact does not peel off from the conductive adhesive layer, and a long service life can be obtained.

According to the anisotropic conductive sheet of the second aspect, the conductive adhesive layer is formed in a state of being accommodated in the recess formed on the conductive path forming portion of the sheet base. In addition, a conductive adhesive layer having higher adhesiveness to the sheet substrate can be formed. According to the anisotropic conductive sheet of the third aspect, since the contact conductive material is provided so as to cover the upper surface and the side surface of the conductive adhesive layer, the contact material having higher adhesion to the conductive adhesive layer is used. A conductive material can be formed. According to the anisotropic conductive sheet according to claim 4, since the conductive material for the contact is formed of a metal sheet or a metal film, the oxide film formed on the surface of the electrode to be connected by the conductive material for the contact Can be reliably broken through, so that the required electrical connection can be achieved more reliably.

According to the method for manufacturing an anisotropic conductive sheet according to the fifth to seventh aspects, a conductive adhesive layer is formed on a conductive material layer for forming a conductive material for a contact. A sheet having a conductive path-forming portion having high adhesiveness to the conductive adhesive layer in order to reliably obtain a conductive adhesive layer having high adhesiveness to the conductive material and to form a sheet substrate on the conductive adhesive layer. The substrate is obtained reliably. According to the method of manufacturing an anisotropic conductive sheet according to claim 6, since the conductive material layer is supported on the easily peelable support plate, the conductive adhesive layer is easily formed on the conductive material layer. And on the conductive adhesive layer,
The sheet substrate can be easily formed. According to the method of manufacturing an anisotropic conductive sheet according to claim 7, since the contact conductive material formed on the conductive adhesive layer is a metal sheet or a metal film, it is formed on the surface of the electrode to be connected. It is possible to form a conductive material for a contact which can surely break through the oxide film.

[Brief description of the drawings]

FIG. 1 is an explanatory cross-sectional view illustrating a configuration of a main part of an anisotropic conductive sheet according to a first embodiment.

FIG. 2 is an explanatory cross-sectional view showing a state in which a conductive material layer is formed on one surface of an easily peelable support plate.

FIG. 3 is an explanatory sectional view showing a state in which a resist layer is formed on a conductive material layer.

FIG. 4 is an explanatory cross-sectional view showing a state where a conductive adhesive layer is formed in a hole of a resist layer.

FIG. 5 is an explanatory sectional view showing a state in which a sheet base material forming material layer is formed on a resist layer and a conductive adhesive layer.

FIG. 6 is an explanatory cross-sectional view showing a state in which a parallel magnetic field is applied to a sheet base material forming material layer.

FIG. 7 is an explanatory cross-sectional view showing a state where a sheet substrate is formed on a resist layer and a conductive adhesive layer.

FIG. 8 is an explanatory cross-sectional view showing a state in which the easily peelable support plate is peeled from the conductive material layer.

FIG. 9 is an explanatory cross-sectional view showing a state where a conductive material for a contact is formed on a conductive adhesive layer.

FIG. 10 is an explanatory sectional view showing a state in which a resist layer is formed on the upper surface of a sheet base material.

FIG. 11 is an explanatory cross-sectional view showing a state where a conductive adhesive layer is formed in a hole of a resist layer.

FIG. 12 is an explanatory cross-sectional view showing a state where a conductive material layer is formed on a resist layer and a conductive adhesive layer.

FIG. 13 is an explanatory cross-sectional view showing a state where a conductive material for a contact is formed on a conductive adhesive layer.

FIG. 14 is an explanatory cross-sectional view illustrating a configuration of a main part of an anisotropic conductive sheet according to a second embodiment.

FIG. 15 is an explanatory cross-sectional view showing a state where a conductive adhesive layer is formed on one surface of an easily peelable support plate via a conductive material layer.

FIG. 16 is an explanatory cross-sectional view showing a state where a sheet base material forming material layer is formed on a conductive material layer and a conductive adhesive layer.

FIG. 17 is an explanatory cross-sectional view showing a state where a sheet substrate is formed on a conductive material layer and a conductive adhesive layer.

FIG. 18 is an explanatory cross-sectional view showing a state in which the easily peelable support plate is peeled from the conductive material layer.

FIG. 19 is an explanatory cross-sectional view illustrating a configuration of a main part of an anisotropic conductive sheet according to a second embodiment.

FIG. 20 is an explanatory cross-sectional view showing a state where a resist is formed on one surface of the easily peelable support plate.

FIG. 21 is an explanatory cross-sectional view showing a state where a conductive material layer is formed on a resist layer and an easily peelable support plate.

FIG. 22 is an explanatory cross-sectional view showing a state where a conductive adhesive layer is formed in a hole of a resist layer.

FIG. 23 is an explanatory cross-sectional view showing a state where a sheet base material forming material layer is formed on a conductive material layer and a conductive adhesive layer.

FIG. 24 is an explanatory cross-sectional view showing a state where a sheet substrate is formed on a conductive material layer and a conductive adhesive layer.

FIG. 25 is an explanatory cross-sectional view showing a state in which the easily peelable support plate is peeled from the conductive material layer and the resist layer.

FIG. 26 is an explanatory cross-sectional view showing a state where a resist layer has been removed from above a conductive material layer.

FIG. 27 is an explanatory cross-sectional view showing a configuration of a main part in another example of the anisotropic conductive sheet according to the present invention.

FIG. 28 is an explanatory cross-sectional view showing a configuration of a main part in still another example of the anisotropic conductive sheet according to the present invention.

FIG. 29 is an explanatory cross-sectional view showing a configuration of a main part in still another example of the anisotropic conductive sheet according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 sheet base material 10A sheet base formation material layer 11 conductive path forming portion 12 insulating portion 15 recess 20 conductive adhesive layer 21 base layer portion 22 upper layer portion 30 conductive material for contact 30A conductive material layer 40 easily peelable support plate 41 easy One surface of the releasable support plate 45 Resist layer 46 Hole in the resist layer 50 One pole plate 51 Electromagnet 55 The other pole plate 55 Electromagnet M Ferromagnetic part N Non-magnetic part

Claims (7)

[Claims] 1. An anisotropic conductive sheet having a sheet substrate in which a plurality of elastic conductive path forming portions each extending in a thickness direction are arranged in a state of being insulated from each other by an insulating portion, A conductive material for a contact is provided integrally on a conductive path forming portion of a sheet base via a conductive adhesive layer in which conductive powder is dispersed in a curable resin. One side conductive sheet. 2. A recess is formed in the sheet base by arranging the upper surface of the conductive path forming portion below the upper surface of the insulating portion in the sheet base. The anisotropic conductive sheet according to claim 1, wherein a conductive adhesive layer is accommodated in the recess. 3. A conductive adhesive layer is provided so as to protrude from the surface of the sheet substrate, and a contact conductive material is provided so as to cover an upper surface and side surfaces of the conductive adhesive layer. The anisotropic conductive sheet according to claim 1. 4. The anisotropically conductive sheet according to claim 1, wherein the conductive material for a contact comprises a metal sheet or a metal film. 5. The method for producing an anisotropic conductive sheet according to claim 1, wherein a curable resin is formed on a conductive material layer for forming a conductive material for a contact. A plurality of conductive adhesive layers formed by dispersing a conductive powder on the conductive adhesive layer, and a plurality of elastic conductive layers formed integrally with the conductive adhesive layer and extending in the thickness direction, respectively, on the conductive adhesive layer. By forming a sheet base made of a path forming portion and an insulating portion that insulates the conductive path forming portion from each other, by removing a part of the conductive material layer,
A method for manufacturing an anisotropic conductive sheet, comprising a step of forming a conductive material for a contact by the remaining part of the conductive material layer on the conductive adhesive layer. 6. The conductive material layer is supported on an easily peelable support plate, and after forming a sheet substrate, the easily peelable support plate is separated from the conductive material layer. Item 6. The method for producing an anisotropic conductive sheet according to Item 5. 7. The anisotropic conductive sheet according to claim 5, wherein the conductive material for a contact formed on the conductive adhesive layer is a metal sheet or a metal film. Production method.