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JP2000237886A - Laser piercing method - Google Patents

Laser piercing method

Info

Publication number
JP2000237886A
JP2000237886A JP11040851A JP4085199A JP2000237886A JP 2000237886 A JP2000237886 A JP 2000237886A JP 11040851 A JP11040851 A JP 11040851A JP 4085199 A JP4085199 A JP 4085199A JP 2000237886 A JP2000237886 A JP 2000237886A
Authority
JP
Japan
Prior art keywords
cut
laser
base material
focal point
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11040851A
Other languages
Japanese (ja)
Other versions
JP4119028B2 (en
Inventor
Akira Kojo
昭 古城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koike Sanso Kogyo Co Ltd
Original Assignee
Koike Sanso Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koike Sanso Kogyo Co Ltd filed Critical Koike Sanso Kogyo Co Ltd
Priority to JP04085199A priority Critical patent/JP4119028B2/en
Publication of JP2000237886A publication Critical patent/JP2000237886A/en
Application granted granted Critical
Publication of JP4119028B2 publication Critical patent/JP4119028B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

(57)【要約】 【課題】被切断材を型切断するに際し、切断の起点とな
る該被切断材の厚さ方向に貫通した穴を形成するピアシ
ングを円滑に行う。 【解決手段】レーザートーチ3に設けたレンズ4によっ
て集光したレーザー光1の焦点Oを被切断材5の表面か
ら上方に離隔した位置から厚さ方向の内部に入り込んだ
位置まで下降させると共に光軸2に沿って2Hz〜20Hz
の範囲で振動させる。焦点Oが被切断材の母材に照射さ
れたとき、母材が溶融,蒸発して窪み12を形成する。次
に、焦点Oが母材から離隔して母材の溶融を停止させ、
この状態で窪み12から溶融物が排除される。このような
動作を繰り返しつつ焦点Oの位置が被切断材5の厚さ方
向に入り込むことで、該被切断材5に厚さ方向に貫通し
た穴13を形成することが出来る。
(57) [Summary] When dies are cut in a mold, piercing is smoothly performed to form a hole that penetrates in the thickness direction of the cut material as a starting point of the cutting. A focal point O of a laser beam 1 condensed by a lens 4 provided on a laser torch 3 is lowered from a position separated upward from a surface of a workpiece 5 to a position where the laser beam 1 enters the inside in the thickness direction and light is emitted. 2Hz to 20Hz along axis 2
Vibration in the range of When the focus O is applied to the base material of the material to be cut, the base material melts and evaporates to form a depression 12. Next, the focus O is separated from the base material to stop the melting of the base material,
In this state, the melt is removed from the depression 12. When the position of the focal point O enters the thickness direction of the workpiece 5 while repeating such an operation, the hole 13 penetrating in the thickness direction of the workpiece 5 can be formed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、被切断材を型切断
する際に切断の起点となる穴を良好に形成することが出
来るレーザーピアシング方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser piercing method capable of forming a hole serving as a starting point of cutting when a material to be cut is die-cut.

【0002】[0002]

【従来の技術】レーザー切断は、高いエネルギー密度を
持ったレーザー光の焦点を被切断材の厚さ方向の所定位
置に設定して照射しつつ、該焦点の位置を目的の切断線
に沿って移動させることで、該焦点の位置及び近傍の母
材を瞬時に溶融させると共に蒸発させて排除するという
物理的な反応を継続させることによって被切断材を切断
するものである。このため、被切断材の材質を限定する
ことなく所望の切断を実施することが出来る。
2. Description of the Related Art In laser cutting, a focal point of a laser beam having a high energy density is set at a predetermined position in the thickness direction of a material to be cut and irradiated, and the position of the focal point is set along a target cutting line. By moving, the material to be cut is cut by continuing the physical reaction of instantaneously melting and evaporating and removing the base material at and near the focal point. For this reason, desired cutting can be performed without limiting the material of the material to be cut.

【0003】例えば被切断材として鋼板を用いた場合、
レーザー光の焦点は鋼板の表面よりも板厚方向に僅かに
入った位置に設定されており、この状態でレーザー光を
照射すると、鋼板は焦点を起点として表面側、及び厚さ
方向の僅かな部分にある母材が瞬時に溶融し略同時に蒸
発する。このため、鋼板には母材の蒸発による窪み或い
は溝が形成される。従って、レーザー光の照射に伴う母
材の蒸発を継続させるように焦点の位置を目的の切断線
に沿って移動させることで、被切断材を切断することが
出来る。
For example, when a steel sheet is used as a material to be cut,
The focal point of the laser light is set at a position slightly in the thickness direction than the surface of the steel sheet, and when the laser light is irradiated in this state, the steel sheet is slightly shifted from the focal point to the surface side and the thickness direction. The base material in the portion melts instantaneously and evaporates almost simultaneously. For this reason, depressions or grooves are formed in the steel sheet due to evaporation of the base material. Therefore, the workpiece can be cut by moving the focal point along the target cutting line so that the evaporation of the base material accompanying the irradiation of the laser beam is continued.

【0004】しかし、レーザー光の照射部位には母材の
蒸気が充満してエネルギーを効率良く被切断材に付与し
得なくなることがある。このため、レーザー光に沿って
ガスを噴射し、この噴射エネルギーによって母材の蒸気
を排除し得るようにしているのが一般的である。特に、
被切断材が鉄系の金属であり、母材の燃焼反応が見込ま
れる場合、レーザー光に沿って酸素ガスを噴射すること
で母材の一部を燃焼させると共に、酸素ガスの噴射エネ
ルギーによって燃焼生成物を排除することで、被切断材
に於けるレーザー光の焦点を起点とした広範囲の母材を
排除して切断を実行することが出来る。
[0004] However, the laser beam irradiation site may be filled with the vapor of the base material, making it impossible to efficiently apply energy to the material to be cut. For this reason, it is common to inject a gas along the laser beam so that the vapor of the base material can be eliminated by this injection energy. In particular,
If the material to be cut is an iron-based metal and the combustion reaction of the base material is expected, a part of the base material is burned by injecting oxygen gas along the laser beam, and the combustion is performed by the injection energy of oxygen gas. By eliminating the product, cutting can be performed while excluding a wide range of base material starting from the focal point of the laser beam in the material to be cut.

【0005】被切断材から様々な形状を持った図形を切
断する所謂型切断を行う場合、被切断材に於ける製品以
外の位置に厚さ方向に貫通した穴を形成(ピアシング)
し、この穴を起点として切断するのが一般的である。こ
の場合、レーザートーチを被切断材に於ける穴の形成位
置に対向して配置し、該位置からレーザー光を照射して
被切断材の母材の一部を溶融させて排除することで、被
切断材の表面に形成された窪みを深さ方向に成長させて
貫通した穴を形成している。
In the case of performing so-called die cutting for cutting figures having various shapes from a material to be cut, a hole penetrating in the thickness direction is formed at a position other than the product in the material to be cut (piercing).
Then, the hole is generally cut starting from the hole. In this case, the laser torch is arranged opposite to the position where the hole is formed in the material to be cut, and a part of the base material of the material to be cut is melted by irradiating laser light from the position to remove the material. The depression formed on the surface of the material to be cut is grown in the depth direction to form a penetrating hole.

【0006】被切断材に対してピアシングを実行するこ
とで厚さ方向に貫通した穴を形成する場合、穴が貫通す
るまでの間、溶融した母材は酸素ガスの噴射エネルギー
によって被切断材の表面から排除される。このとき、母
材の溶融物が飛散してレーザートーチの先端に付着し或
いはレーザートーチの内部に入り込んで該レーザートー
チを損傷する虞がある。このため、レーザー光を集光す
るレンズの位置を変化させることなく、レーザートーチ
を上昇させて溶融物の付着を防止し得るように構成する
のが一般的である。
[0006] In the case of forming a hole penetrating in the thickness direction by piercing the material to be cut, until the hole is penetrated, the molten base material is injected with oxygen gas by the injection energy of the oxygen gas. Excluded from the surface. At this time, the melt of the base material may be scattered and adhere to the tip of the laser torch, or may enter the inside of the laser torch and damage the laser torch. For this reason, it is common to raise the laser torch without changing the position of the lens that focuses the laser light, thereby preventing the adhesion of the melt.

【0007】[0007]

【発明が解決しようとする課題】上記の如くしてピアシ
ングを実施することによってレーザートーチに対する溶
融物の付着を軽減することが出来るものの、焦点の位置
が固定されているため、被切断材に形成された窪みから
の溶融物の排除を円滑になし得ない。このため、ピアシ
ングに要する時間が長くなり、コストを押し上げる要因
となっているという問題がある。
By performing the piercing as described above, the adhesion of the melt to the laser torch can be reduced, but since the position of the focal point is fixed, it is formed on the material to be cut. It is not possible to smoothly remove the melt from the formed depression. For this reason, there is a problem that the time required for piercing becomes longer, which is a factor that increases costs.

【0008】本発明の目的は、被切断材にピアシングを
行う場合に必要な時間を大幅に長くすることのないレー
ザーピアシング方法を提供することにある。
An object of the present invention is to provide a laser piercing method that does not significantly increase the time required for piercing a workpiece.

【0009】[0009]

【課題を解決するための手段】上記課題を解決するため
に本発明に係るレーザーピアシング方法は、被切断材に
向けてレーザー光を照射して被切断材の一部を排除して
厚さ方向に貫通した穴を形成するレーザーピアシング方
法であって、レーザー光の焦点を該レーザー光の光軸に
沿って2Hz乃至20Hzの範囲で振動させることを特徴と
するものであり、前記レーザー光の焦点を被切断材に対
し上昇させ又は下降させることが好ましい。
In order to solve the above-mentioned problems, a laser piercing method according to the present invention is directed to a method of irradiating a laser beam toward a material to be cut to remove a part of the material to be cut, and to remove the material in a thickness direction. A laser piercing method for forming a hole penetrating through the laser light, wherein the focal point of the laser light is oscillated in the range of 2 Hz to 20 Hz along the optical axis of the laser light. Is preferably raised or lowered with respect to the material to be cut.

【0010】上記レーザーピアシング方法(以下、単に
「ピアシング」という)では、レーザー光の焦点を光軸
に沿って2Hz〜20Hzの範囲で振動させ、且つレーザー
光の焦点が被切断材の上表面よりも上方に離隔した位置
から被切断材の厚さ方向の内部に入り込む位置まで下降
させることで、被切断材の母材の一部を溶融,蒸発させ
て除去し、これにより、良好な状態でピアシングを実施
することが出来る。
In the above laser piercing method (hereinafter simply referred to as "piercing"), the focal point of the laser light is oscillated along the optical axis in the range of 2 Hz to 20 Hz, and the focal point of the laser light is higher than the upper surface of the material to be cut. Also, by lowering from a position separated upward to a position where it enters into the thickness direction of the material to be cut, a part of the base material of the material to be cut is melted and evaporated to be removed. Piercing can be performed.

【0011】即ち、レーザー光の焦点を光軸に沿って振
動させ、該焦点が被切断材の母材上に形成されたとき、
被切断材を溶融,蒸発させ、且つ焦点が被切断材の母材
から離隔させたとき、被切断材の表面から母材の溶融物
及び蒸発物を排除することが出来る。このため、ピアシ
ングに要する時間を短縮してコストを上昇させることが
ない。
That is, when the focal point of the laser beam is vibrated along the optical axis, and the focal point is formed on the base material of the material to be cut,
When the material to be cut is melted and evaporated and the focal point is separated from the base material of the material to be cut, the molten material and the evaporated material of the base material can be removed from the surface of the material to be cut. For this reason, the time required for piercing is reduced and the cost is not increased.

【0012】[0012]

【発明の実施の形態】以下、上記ピアシング方法の好ま
しい実施形態について図を用いて説明する。図1は本発
明に係るピアシング方法を説明する図である。図2はレ
ーザー光の焦点を振動させる装置の一例を示す図であ
る。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the piercing method will be described below with reference to the drawings. FIG. 1 is a diagram illustrating a piercing method according to the present invention. FIG. 2 is a diagram illustrating an example of an apparatus that vibrates the focal point of laser light.

【0013】先ず、本発明に係るピアシング方法を実施
するに当たってレーザー光の焦点を振動させると共に昇
降させる機構の一例に付いて図2により説明する。図に
於いて、図示しないレーザー発振器から出射されたレー
ザー光1は、予め設定されたレーザー光路2(光軸2)
に沿って導かれてレーザートーチ3に到達し、該レーザ
ートーチ3に設けたレンズ4によって焦点Oに集光さ
れ、被切断材5に照射されて該被切断材5の母材の一部
を溶融,蒸発させる。
First, in carrying out the piercing method according to the present invention, an example of a mechanism for vibrating and raising and lowering the focus of a laser beam will be described with reference to FIG. In the figure, a laser beam 1 emitted from a laser oscillator (not shown) has a predetermined laser beam path 2 (optical axis 2).
The laser beam reaches the laser torch 3 and is condensed at a focal point O by a lens 4 provided on the laser torch 3, irradiates the workpiece 5 and removes a part of the base material of the workpiece 5. Melt and evaporate.

【0014】被切断材5の材質は特に限定するものでは
ない。しかし、本実施例では、被切断材5を鋼板とし、
レーザートーチ3の先端に取り付けたノズル6から所定
の圧力に調整した酸素ガスを噴射してレーザー光1の照
射によって溶融した母材を燃焼させると共に酸素ガスの
噴射エネルギーによって溶融した母材、及び溶融した酸
化物等を排除してガス切断のプロセスを取り入れること
で、良好な切断を継続し得るように構成している。
The material of the material to be cut 5 is not particularly limited. However, in the present embodiment, the workpiece 5 is a steel plate,
Oxygen gas adjusted to a predetermined pressure is injected from a nozzle 6 attached to the tip of the laser torch 3 to burn the base material melted by the irradiation of the laser light 1 and to melt the base material by the injection energy of the oxygen gas; By adopting a gas cutting process by removing the oxides and the like, the structure is such that good cutting can be continued.

【0015】このため、レーザートーチ3の先端に装着
したノズル6に図示しない酸素供給装置と接続されたホ
ース7が着脱可能に取り付けられており、該ホース7を
介して予め設定された圧力に調整された酸素ガスが供給
される。
To this end, a hose 7 connected to an oxygen supply device (not shown) is detachably attached to a nozzle 6 attached to the tip of the laser torch 3 and adjusted to a preset pressure via the hose 7. The supplied oxygen gas is supplied.

【0016】レーザートーチ3を移動させる装置は特に
限定するものではない。即ち、通常のガス切断やプラズ
マ切断に利用される切断装置であって、レーザー切断の
速度に追従し得るものであれば良い。本実施例では、図
示しないレールに載置された台車にレーザー発振器を搭
載し、且つレーザートーチ3をレールの敷設方向に対し
直角方向に横行させる横行キャリッジ8に昇降モーター
9aによって駆動されてレーザートーチ3を昇降させる
ように構成されたトーチ昇降装置9を介して搭載されて
いる。
The device for moving the laser torch 3 is not particularly limited. That is, any cutting device used for ordinary gas cutting or plasma cutting may be used as long as it can follow the speed of laser cutting. In the present embodiment, a laser oscillator is mounted on a carriage mounted on a rail (not shown), and a laser torch 3 3 is mounted via a torch elevating device 9 configured to elevate and lower the torch.

【0017】レンズ4はレーザートーチ3の内部に設け
た昇降筒体10に取り付けられており、該昇降筒体10を振
動モーター11によって2Hz〜20Hzの範囲で昇降駆動す
ることで、レンズ4を前記振動数で振動させるように構
成している。またレンズ4が往復移動する寸法(振幅)
は特に限定するものではないが、本実施例では10mmに設
定している。
The lens 4 is mounted on an elevating cylinder 10 provided inside the laser torch 3, and the elevating cylinder 10 is driven up and down by a vibrating motor 11 in the range of 2 Hz to 20 Hz. It is configured to vibrate at a frequency. The size (amplitude) of the reciprocating movement of the lens 4
Is not particularly limited, but is set to 10 mm in this embodiment.

【0018】尚、レーザー光の焦点Oを被切断材5の厚
さ方向に振動させる機構は、上記構造にのみ限定される
ものではなく、例えば、レーザートーチ3そのものを上
下方向に往復移動させることで振動させても良く、レン
ズ4を振動させる場合であっても、振動モーター11以外
にソレノイドの断続による振動の付与やカムによる振動
の付与或いはリニア駆動による振動の付与等、更に、ミ
ラーの曲率を変えることによる振動の付与等、種々の機
構によって実現することが可能である。
The mechanism for oscillating the focal point O of the laser beam in the thickness direction of the workpiece 5 is not limited to the above-described structure. For example, the mechanism for reciprocating the laser torch 3 vertically. In addition, even when the lens 4 is vibrated, in addition to the vibration motor 11, vibration is applied by intermittent operation of a solenoid, vibration is applied by a cam, or vibration is applied by a linear drive. It can be realized by various mechanisms, such as applying vibration by changing.

【0019】焦点Oを振動させる際の振動数は2Hz〜2
0Hzの範囲に設定される。この振動数は被切断材5に対
するピアシングを実施する際に、母材の溶融物や酸化物
を好ましい状態で排除し得るように適宜設定される値で
あり、被切断材5の厚さが厚い場合には振動数を大きく
し、厚さが薄い場合には振動数を少なくするように設定
される。この振動数の設定は、振動モーター11を制御す
る図示しない制御部からの駆動信号を制御することで行
われる。
The frequency at which the focal point O is oscillated is 2 Hz to 2 Hz.
It is set in the range of 0 Hz. This frequency is a value appropriately set so that a melt or an oxide of the base material can be removed in a preferable state when piercing the workpiece 5, and the thickness of the workpiece 5 is large. In this case, the frequency is set to be large, and when the thickness is small, the frequency is set to be small. The setting of the frequency is performed by controlling a drive signal from a control unit (not shown) that controls the vibration motor 11.

【0020】次に、図1によりピアシング方法について
説明する。本発明に係るピアシング方法は、レーザー光
1の焦点Oを光軸2に沿って振動させ、或いは焦点Oを
振動させつつ被切断材5に対し上昇或いは下降させるこ
とで、被切断材5の一部を溶融,蒸発させて窪み12を形
成し、該窪み12を成長させて厚さ方向に貫通した穴13を
形成するものである。
Next, the piercing method will be described with reference to FIG. In the piercing method according to the present invention, the focal point O of the laser beam 1 is vibrated along the optical axis 2 or the focal point O is raised or lowered with respect to the workpiece 5 while vibrating, so that the The portion is melted and evaporated to form a depression 12, and the depression 12 is grown to form a hole 13 penetrating in the thickness direction.

【0021】そして、窪み12を形成する際に、レーザー
光1の焦点Oを被切断材5に照射して該照射部位の母材
を溶融,蒸発させると共に酸素ガスを噴射して溶融した
母材を燃焼させ、且つレーザー光1の焦点Oを窪み12か
ら離隔させることで、母材の溶融を一時的の停止させて
発生した溶融物を酸素ガスの噴射エネルギーによって該
窪み12から排出させることで、良好な状態でピアシング
を実施することが可能である。
When forming the depression 12, the focal point O of the laser beam 1 is applied to the material 5 to be melted to evaporate and evaporate the base material at the irradiated portion, and the molten base material is injected by injecting oxygen gas. Is burned, and the focal point O of the laser beam 1 is separated from the depression 12, so that the melting of the base material is temporarily stopped, and the generated melt is discharged from the depression 12 by the injection energy of oxygen gas. , Piercing can be performed in good condition.

【0022】レーザー光1の焦点Oを単に振動させた状
態でピアシングを実施するか、振動させつつ上昇させる
か、振動させつつ下降させるかは、被切断材5の厚さに
応じて設定される。即ち、被切断材5の厚さが厚い場
合、レーザー光1の焦点Oを光軸2にそって振動させつ
つ下降させてピアシングを実施するのが好ましく、被切
断材5の厚さが薄い場合、レーザー光1の焦点Oを振動
させつつ上昇させることが好ましい。更に、被切断材5
の厚さが適度な場合、レーザー光1の焦点Oを単に振動
させることで、良好なピアシングを実施することが可能
である。
Whether the piercing is performed with the focus O of the laser beam 1 simply vibrated, the piercing is raised while vibrating, or the piercing is lowered while vibrating is set according to the thickness of the material 5 to be cut. . That is, when the thickness of the material to be cut 5 is large, it is preferable to perform piercing by lowering the focal point O of the laser beam 1 while vibrating along the optical axis 2. It is preferable to raise the focal point O of the laser beam 1 while oscillating the same. Further, the material to be cut 5
When the thickness of the laser beam 1 is moderate, good piercing can be performed by simply oscillating the focal point O of the laser beam 1.

【0023】以下の実施例では、初期状態では被切断材
5の表面から上方に離隔した位置に設定しておき、レー
ザー光1の焦点Oを光軸2に沿って振動させつつ板厚方
向に下降させる方法について説明する。
In the following embodiment, in the initial state, the laser beam 1 is set at a position upwardly separated from the surface of the workpiece 5 and the focal point O of the laser beam 1 is oscillated along the optical axis 2 in the plate thickness direction. A method for lowering the camera is described.

【0024】図1(a)はレーザー光1の焦点Oが被切
断材5の表面から上方に離隔した位置にある状態を示し
ている。この状態では、レーザー光1によって被切断材
5の表面に窪みを形成することはなく、例えば、被切断
材5の表面に図示しない錆止め塗装やゴムライニング或
いは合成樹脂ライニング等の被覆層が形成されているよ
うな場合、この被覆層を構成する材料を溶融,蒸発させ
て除去することが可能である。
FIG. 1A shows a state in which the focal point O of the laser beam 1 is at a position separated upward from the surface of the workpiece 5. In this state, no dent is formed on the surface of the material 5 to be cut by the laser beam 1, and for example, a coating layer such as rust prevention coating, rubber lining, or synthetic resin lining (not shown) is formed on the surface of the material 5 to be cut. In such a case, the material forming the coating layer can be removed by melting and evaporating.

【0025】従って、被切断材5の表面にピアシングを
阻害するような被覆層が形成されている場合であって
も、レーザー光1の焦点Oを被切断材5の表面から上方
に離隔した位置に設定することによって被覆層を除去す
ることが可能となり、見掛け上、表面に母材が露出した
被切断材5に対するピアシングを行うことが可能であ
る。
Therefore, even when a coating layer that inhibits piercing is formed on the surface of the material 5 to be cut, the focal point O of the laser beam 1 is separated upward from the surface of the material 5 to be cut. By setting to, the coating layer can be removed, and it is possible to pierce the workpiece 5 having the base material exposed on the surface.

【0026】同図(b)は、昇降モーター9aを駆動し
てレーザートーチ3を下降させることで、レーザー光1
の焦点Oを被切断材5の厚さ方向の内部に僅かに入り込
ませた状態を示している。この状態では、レーザー光1
のエネルギーは被切断材5に於ける焦点Oの形成位置及
びその近傍に付与され、母材が溶融すると共に蒸発す
る。特に、レーザー光1に沿って酸素ガスが照射される
ため、被切断材5の母材が燃焼し、溶融した母材及び溶
融した酸化物が生成され、窪み12が形成される。
FIG. 3B shows that the laser beam 1 is driven by driving the elevating motor 9 a to lower the laser torch 3.
3 shows a state in which the focal point O slightly enters the inside of the workpiece 5 in the thickness direction. In this state, the laser light 1
Is applied to the position where the focal point O is formed on the workpiece 5 and its vicinity, and the base material is melted and evaporated. In particular, since the oxygen gas is irradiated along the laser beam 1, the base material of the material to be cut 5 burns, a molten base material and a molten oxide are generated, and a depression 12 is formed.

【0027】上記の如く、被切断材5に窪み12を形成し
或いは成長させているとき、即ち、レーザー光1の焦点
Oが母材の表面(被切断材5の表面及び窪み12の表面)
に接触し、或いは表面近傍にあるとき、発生した母材の
溶融物は、窪み12の深さが浅い間では比較的表面に沿っ
て平面的に飛散するが、窪み12が深くなると窪みの内壁
に沿って急角度で上方に飛散する。
As described above, when the dent 12 is formed or grown in the material 5 to be cut, that is, the focus O of the laser beam 1 is on the surface of the base material (the surface of the material 5 and the surface of the dent 12).
In contact with or near the surface, the melt of the generated base material scatters relatively flat along the surface while the depth of the depression 12 is shallow, but when the depth of the depression 12 becomes deeper, the inner wall of the depression becomes Splashes upward at a steep angle along.

【0028】従って、同図(b)に示すように、レーザ
ー光1の焦点Oが被切断材5の表面から僅かに厚さ方向
に入り込んだ位置にあるとき、付与されたエネルギーに
よって母材は盛んに溶融し、溶融物の一部が窪み12から
外部に飛散する。しかし、発生した母材の溶融物及び溶
融酸化物は全てが瞬時に窪み12から排出されるものでは
なく、大部分の溶融物は窪み12内に止まる。
Accordingly, as shown in FIG. 2B, when the focal point O of the laser beam 1 is at a position slightly in the thickness direction from the surface of the material 5 to be cut, the base material is moved by the applied energy. It melts vigorously, and a part of the molten material scatters outside from the depression 12. However, not all of the generated base material melt and molten oxide are instantaneously discharged from the depression 12, and most of the melt stays in the depression 12.

【0029】このため、レーザー光1の焦点Oを光軸2
に沿って振動(上下動)させることで、窪み12に止まっ
ている溶融物を排除する。即ち、同図(c)に示すよう
に、焦点Oの位置を同図(b)に示す状態から僅かに上
昇させることで、被切断材5に対するエネルギーの付与
を停止させ、これにより、母材の溶融を停止させて溶融
物の発生を抑えた状態とし、引き続き噴射される酸素ガ
スの噴射エネルギーによって窪み12内にある溶融物を排
除する。
For this reason, the focal point O of the laser beam 1 is
By vibrating (moving up and down) along, the melt remaining in the depression 12 is eliminated. That is, as shown in FIG. 3C, the position of the focal point O is slightly raised from the state shown in FIG. 3B, thereby stopping the application of energy to the material 5 to be cut. Is stopped so that the generation of the melt is suppressed, and the melt in the depression 12 is removed by the injection energy of the oxygen gas subsequently injected.

【0030】尚、上記の如き、レーザー光1の焦点Oを
光軸2に沿って振動させるタイミングは、昇降モーター
9aを駆動して行うレーザートーチ3の昇降とは独立し
ており、レーザートーチ3の昇降速度と焦点Oの振動数
とは特別に関連付けるものではない。
The timing of oscillating the focal point O of the laser beam 1 along the optical axis 2 as described above is independent of the elevation of the laser torch 3 driven by driving the elevation motor 9a. Is not specially associated with the frequency of the focus O.

【0031】引き続き、昇降モーター9aを駆動してレ
ーザートーチ3を下降させると共に焦点Oを2Hz〜20
Hzの範囲で光軸2に沿った上下方向の振動をさせること
で、同図(d),(e)に示すように、窪み12を成長さ
せる。
Subsequently, the laser motor 9a is driven to lower the laser torch 3, and the focus O is set to 2 Hz to 20 Hz.
By vibrating up and down along the optical axis 2 in the range of Hz, the depression 12 is grown as shown in FIGS.

【0032】そして窪み12が深さ方向に成長した結果、
同図(f)に示すように、被切断材5には厚さ方向に貫
通した穴13が形成される。このように、被切断材5の厚
さ方向に貫通した穴13が形成されることによって、母材
の溶融物及び酸化溶融物は穴13から下方に排出され、上
方に飛散することがない。
Then, as a result of the depression 12 growing in the depth direction,
As shown in FIG. 1F, a hole 13 is formed in the workpiece 5 in the thickness direction. By forming the holes 13 penetrating in the thickness direction of the material 5 to be cut in this manner, the melt and the oxidized melt of the base material are discharged downward from the holes 13 and do not scatter upward.

【0033】上記の如くして被切断材5に対するピアシ
ングを実施するに際し、レーザー光1の焦点Oを光軸2
に沿って振動させる振動数は、2Hz〜20Hzの範囲であ
れば良く、2Hz以下であると振動の効果が全く現れず、
20Hz以上であると母材の溶融を停止して酸素ガスによ
って母材の溶融物を排除する際に充分な排除をなし得な
い内に新たに溶融物が発生してしまい、結果的に振動さ
せた効果が損なわれる。
When piercing the workpiece 5 as described above, the focal point O of the laser beam 1 is shifted to the optical axis 2
The frequency to be vibrated along may be in the range of 2 Hz to 20 Hz, and if it is 2 Hz or less, the effect of vibration does not appear at all,
If the frequency is higher than 20 Hz, the melting of the base material is stopped, and when the melt of the base material is eliminated by the oxygen gas, a new melt is generated before the metal material can be sufficiently excluded. Effect is impaired.

【0034】[0034]

【発明の効果】以上詳細に説明したように本発明に係る
レーザーピアシング方法では、レーザー光の焦点を光軸
に沿って2Hz〜20Hzの範囲で振動させることで、被切
断材に対し良好なピアシングを実施することが出来る。
As described above in detail, in the laser piercing method according to the present invention, a good piercing of the material to be cut is achieved by oscillating the focal point of the laser light in the range of 2 Hz to 20 Hz along the optical axis. Can be implemented.

【0035】特に、レーザー光の焦点を光軸に沿って振
動させつつ、被切断材の表面から離隔させた位置から被
切断材の厚さ方向の内部に入り込んだ位置まで下降させ
ることで、レーザー光を母材に照射して該母材を溶融,
蒸発或いは燃焼させる動作と、レーザー光を母材から離
隔させて溶融,蒸発を停止させて溶融物を排除する動作
とを連続させることによって、被切断材に形成された窪
みから溶融物の排除を円滑に行うことが出来、これによ
り被切断材の厚さ方向に貫通させた穴を形成するピアシ
ングを円滑に行うことが出来る。
In particular, by oscillating the focal point of the laser beam along the optical axis, the laser beam is lowered from a position separated from the surface of the material to be cut to a position in the thickness direction of the material to be cut. The base material is irradiated with light to melt the base material,
By continuing the operation of evaporating or burning and the operation of separating the laser beam from the base material to stop melting and evaporating and eliminating the melt, the elimination of the melt from the dent formed in the material to be cut is performed. It is possible to smoothly perform the piercing to form a hole penetrated in the thickness direction of the material to be cut.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係るレーザーピアシング方法を説明す
る図である。
FIG. 1 is a diagram illustrating a laser piercing method according to the present invention.

【図2】レーザー光の焦点を振動させる装置の一例を示
す図である。
FIG. 2 is a diagram illustrating an example of an apparatus that vibrates a focal point of laser light.

【符号の説明】[Explanation of symbols]

O 焦点 1 レーザー光 2 レーザー光路 3 レーザートーチ 4 レンズ 5 被切断材 6 ノズル 7 ホース 8 横行キャリッジ 9 昇降装置 9a 昇降モーター 10 昇降筒体 11 振動モーター 12 窪み 13 穴 O Focus 1 Laser beam 2 Laser beam path 3 Laser torch 4 Lens 5 Material to be cut 6 Nozzle 7 Hose 8 Traversing carriage 9 Elevating device 9a Elevating motor 10 Elevating cylinder 11 Vibration motor 12 Depression 13 Hole

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 被切断材に向けてレーザー光を照射して
被切断材の一部を排除して厚さ方向に貫通した穴を形成
するレーザーピアシング方法であって、レーザー光の焦
点を該レーザー光の光軸に沿って2Hz乃至20Hzの範囲
で振動させることを特徴とするレーザーピアシング方
法。
1. A laser piercing method for irradiating a material to be cut with a laser beam to remove a part of the material to be cut and to form a hole penetrating in a thickness direction, wherein the focus of the laser light is adjusted. A laser piercing method characterized by oscillating along the optical axis of laser light in a range of 2 Hz to 20 Hz.
【請求項2】 レーザー光の焦点を光軸に沿って振動さ
せつつ前記レーザー光の焦点を被切断材に対し上昇させ
又は被切断材に対し下降させることを特徴とする請求項
1に記載したレーザーピアシング方法。
2. The method according to claim 1, wherein the focal point of the laser beam is raised with respect to the workpiece or lowered with respect to the workpiece while oscillating the focal point of the laser beam along the optical axis. Laser piercing method.
JP04085199A 1999-02-19 1999-02-19 Laser piercing method Expired - Lifetime JP4119028B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP04085199A JP4119028B2 (en) 1999-02-19 1999-02-19 Laser piercing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP04085199A JP4119028B2 (en) 1999-02-19 1999-02-19 Laser piercing method

Publications (2)

Publication Number Publication Date
JP2000237886A true JP2000237886A (en) 2000-09-05
JP4119028B2 JP4119028B2 (en) 2008-07-16

Family

ID=12592085

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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US9919383B2 (en) 2014-10-17 2018-03-20 Mitsubishi Electric Corporation Laser machining method and laser machining apparatus
CN106271058B (en) * 2016-08-29 2018-07-27 无锡洲翔激光设备有限公司 Technique of the laser cutting less than plate thickness diameter circular aperture is carried out on plank
CN106271058A (en) * 2016-08-29 2017-01-04 无锡洲翔成套焊接设备有限公司 The cut technique less than sheet metal thickness diameter circular aperture is carried out on sheet material

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