JP2000323026A - Thick film pattern forming apparatus and substrate on which thick film pattern is formed - Google Patents

Abstract

According to the present invention, it is possible to easily manufacture a large-sized product in which a fine thick film pattern is formed with high precision, that is, the line width and the thickness of the thick film pattern are faithfully reproduced. Also,
Since the image is directly transferred to the object to be transferred, there is no restriction on the apparatus, the mass production effect is high, and the quality of the obtained thick film pattern is good.
Provided is a thick film pattern forming apparatus which is excellent in low cost. SOLUTION: The thick film pattern forming apparatus according to the present invention comprises:
An intaglio having a predetermined thick film pattern, a substrate fixing portion for fixing a substrate on which the thick film pattern is formed based on the intaglio, and a moving mechanism for relatively moving the intaglio and the substrate fixing portion. A material holding unit for holding the material of the thick film pattern, a plurality of rollers through which the material passes before applying and filling the intaglio with the thick film pattern material, and a material of the thick film pattern passing through the rollers Between the intaglio and the substrate fixed on the substrate fixing portion,
A mechanism for forming a predetermined thick film pattern on the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick film pattern forming apparatus and a substrate on which a thick film pattern is formed. In particular, the present invention relates to formation of a thick film pattern on a display substrate, and further relates to formation of electrodes of a plasma display panel.

[0002]

2. Description of the Related Art In recent years, electronic circuit boards and displays have been required to be larger. Under such circumstances, there is a demand that a fine and thick film pattern having a line width after firing of about 30 to 250 μm and a thickness after firing of 2 μm or more is formed with extremely high precision. Therefore,
Although photolithography has been used for its production, the production process is complicated, the material loss is large, and the development cost of large-sized exposure equipment and capital investment are enormous. The first problem is that there is a limit to the size of the applied mask and the specifications of the coating machine.

For this reason, cost reduction has been attempted by using a printing method which has a simple process and has high productivity. However, the intaglio offset printing method that has been tried variously is considered to be the printing method most suitable for the purpose of forming a fine pattern with high accuracy.

However, the intaglio used in the intaglio offset printing method or the like is a metal intaglio or a glass intaglio, and the material of the thick film pattern has low releasability. The second problem is that the material of the formed thick film pattern is not completely transferred to the blanket, and a part of the material remains in the concave portion and a predetermined film thickness cannot be obtained.

Further, since a blanket whose surface is a rubber layer is used, the line width, which is the shape of the thick film pattern, becomes uneven or meanders due to the transfer of the thick film pattern material from the blanket to the object to be formed. There is a third problem.

Since the substrate to be formed has fine irregularities and undulations on its surface and is not flat, if an intaglio having no cushioning property such as a metal or glass intaglio is used,
When transferring the thick film pattern material from the intaglio plate onto the substrate, the substrate may be cracked or deformed, and the transfer of the thick film pattern material may cause unevenness and adversely affect the quality of the thick film pattern. There are four problems.

[0007] Also, as a concern, if the edge of the cross-sectional shape of the formed thick film pattern is sharp, the edge of the thick film pattern is exposed by breaking through a predetermined layer formed on the thick film pattern. There is a sixth problem. For example, a dielectric layer is formed on an electrode of a plasma display panel, but if the edge of the electrode, which is a thick film pattern, is sharp, the edge is exposed by breaking through the dielectric layer formed thereon. There is a concern.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-mentioned conventional problems, and has as its object to provide a thick film pattern forming apparatus and a substrate on which a thick film pattern is formed.

[0009]

According to the present invention, there is provided an apparatus for forming a thick film pattern, comprising: an intaglio having a predetermined thick film pattern; a substrate fixing portion for fixing a substrate on which the thick film pattern is formed based on the intaglio; Having a moving mechanism for relatively moving the intaglio and the substrate fixing portion, a material holding portion for holding a thick film pattern material, and before applying and filling the thick film pattern material to the intaglio, A plurality of rollers through which the material passes, and by sandwiching the material of the thick film pattern passing through the rollers between the intaglio and the substrate fixed on the substrate fixing portion, a predetermined thick film pattern is formed on the substrate. It has a mechanism for forming.

Furthermore, it is desirable to have a mechanism in which at least one of a plurality of rollers that pass before the thick film pattern material is applied to the intaglio plate and filled is rotated while swinging in the direction of the rotation axis.

Furthermore, it is desirable that the intaglio is formed of a release material.

Further, it is desirable that a cushion layer is formed in the intaglio.

Further, it is desirable that the side surface of the intaglio mold has an inclined surface.

Further, it is desirable to have a pressing roller for pressing the formed thick film pattern.

In any one of the thick film pattern forming apparatuses of the present invention, a substrate on which a thick film pattern is formed is characterized in that a side surface of the formed thick film pattern has a curved portion.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, as an example of an embodiment of the present invention, an apparatus for forming an electrode of a plasma display panel will be described in detail with reference to the drawings. Of course, the present invention need not be limited to the electrodes of the plasma display panel. It can be used for forming a thick film pattern of various displays and the like.

FIG. 1 is a view showing an apparatus for forming a thick film pattern according to an embodiment of the present invention. FIG. 1A is a side view, and FIG. 1B is a plan view.

The thick film pattern forming apparatus includes an intaglio 1 on which a predetermined thick film pattern is formed, a glass substrate 2 on which a thick film pattern is to be formed, and a substrate fixing portion 3 on which the glass substrate 2 is placed and fixed. And a moving mechanism (not shown) that moves relative to the intaglio 1 and the substrate fixing unit 3. With such a configuration, the intaglio 1 is superimposed on the glass substrate 2 fixed on the substrate fixing portion 3 while relatively moving the intaglio 1 and the substrate fixing portion 3, and a predetermined thick film pattern is formed on the glass substrate 2.
It is formed directly on the upper predetermined position. For this reason, it has become possible to respond to a demand for a larger substrate in an electronic circuit board, a display, or the like with a simple manufacturing process and at a low manufacturing cost. Further, since the blanket is not used, the line width of the shape of the thick film pattern may become non-uniform or meander when the material of the thick film pattern is transferred from the blanket to the substrate 2 which is the object to be formed. lost. Also,
When the substrate fixing portion 3 is stopped and the intaglio 1 is moved to form a thick film pattern, space can be saved. of course,
The thick film pattern may be formed by moving the substrate fixing part 3 without moving the intaglio 1.

The forming unit 4 includes, in addition to the intaglio 1,
The blade 5 and the delivery roller 7 are provided as material holding portions for holding the thick film pattern material 6, and there is a gap between the blade 5 and the delivery roller 7. The thick film pattern material 6 is discharged from the gap, and the discharged material is transferred from the discharge roller 7 to the kneading roller 8. Here, there are three kneading rollers 8, each of which oscillates alternately in the direction of the rotation axis to uniformly maintain the dispersion of the powder contained in the material. In particular, as an electrode of a plasma display panel, an average particle size of 0.1 is preferable.
About 01 to 2 μm, more preferably 0.03 to 0.03 μm
Conductive particles of about 1 μm (specifically, Ag, Au, C
When the intaglio is filled with a material 6 of a thick film pattern including powders such as u, Al, Pt, Ni, Pd, etc., alone or in a mixture, the rejection of unnecessary portions of the thick film pattern material 6 is improved, and It is possible to fill the intaglio accurately without protruding. Further, since fine conductive particles are uniformly dispersed, damage such as a scratch on the intaglio is eliminated.

Further, in order to suppress the agglomeration of the powder, if the powder is subjected to a surface treatment or if an anti-agglomeration agent or a dispersant is added to the thick film pattern material 6, the above-mentioned effect is further enhanced. Also,
By inserting a glass frit into the thick film pattern material 6, the adhesion to the glass substrate can be improved.

Then, the material 6 is applied and filled on the intaglio 1 by the application and filling roller 9. Two application and filling rollers 9 are used. In this way, the first coating and filling roller 9 applies and fills the intaglio 1 and further the second coating and filling roller 9
The intaglio 1 can be filled properly. In other words, the second coating and filling roller 9 can additionally fill the intaglio 1 if the thick film pattern material 6 is insufficiently filled. Conversely, if the amount of the material 6 to the intaglio 1 is large, the material 6 is removed, and the material 6 is again kneaded by the kneading roller 8 to maintain uniform fluidity, viscosity, etc., and to apply and fill the intaglio 1 again.
Of course, the intaglio 1 may be filled with the material 6 of the thick film pattern by using one roller having a larger diameter than the illustrated coating and filling roller.

The substrate fixing section 2 is for mounting and fixing a glass substrate 10 on which a predetermined thick film pattern is formed based on the intaglio 1. As shown in the plan view of the substrate fixing unit 2 in FIG. 2A, the first substrate position is set with one corner of each substrate being a common reference point 20 in order to mount substrates of two sizes. 25, a second substrate position 26 is provided. Here, the position is determined such that each of the substrates is at a predetermined position with one vertical substrate positioning member 27 and two horizontal substrate positioning members 28. Of course, it is not limited to two types of substrates. Here, since each of the positioning members 27 and 28 is a cylindrical body, the point of contact with the glass substrate is determined at two points. For this reason, the position of the substrate is easier to determine than in the case of a rectangular parallelepiped contacting the substrate with a line. Further, at the time of positioning by the positioning members 27 and 28, one positioning member 27 and two positioning members 28 were determined. If more than this number, it is difficult to adjust the position of the positioning member. For this reason, the position at which the positioning is performed may change depending on the size of the substrate. Further, a first suction groove 21, a second suction groove 22, a third suction groove 23, and a plurality of suction holes corresponding to each groove are selectively used according to the size of each substrate so that these substrates can be fixed. The hole 24 is machined.

FIG. 2B is a sectional view of the first suction groove 21, the third suction groove 23, and the plurality of suction holes 24 formed in the substrate fixing portion 2. Thus, the suction hole is formed in the bottom surface of the suction groove. When the substrate 2 is placed at the first substrate position 25, the first suction groove 21 and the second suction groove 22 are selected, and the suction holes corresponding to these suction grooves 21 and 22 are selected. 24 is selected to suck and fix the substrate 2 placed on the first substrate position. Similarly, when the substrate 2 is placed at the second substrate position 26, the first suction groove 21
And the third suction groove 23 are selected, and these suction grooves 2
The suction holes 24 corresponding to 1 and 23 are selected to suck and fix the substrate 2 placed at the second substrate position.

FIG. 3 is an image diagram developed on the plane of the thick film pattern formed on the intaglio 1. Of course, this is not a limitation. As a predetermined thick film pattern, an electrode pattern 31 of a display portion of the plasma display panel is formed at the center of the substrate 2, and an electrode pattern 32 of a terminal portion provided for connection to an external circuit is opposed to the substrate 2. Positioning alignment marks 33 are formed at the four corners of the substrate 2, which are formed on both ends of the substrate 2, and are used for sequentially superposing layers having various functions on the substrate 2 to be formed to form a multilayer. I have. By forming the intaglio 1 in this manner, the electrode pattern 31 of the main display section, the electrode pattern 32 of the connection terminal section, and the alignment mark 33 for positioning can be formed in one thick film pattern forming operation. Can be simultaneously formed, and a predetermined thick film pattern can be formed collectively. Also, the thick film pattern forming operation is performed a plurality of times (2.
If the thick film pattern is formed by repeating the above process (about 3 times), the thick film pattern can be further thickened, and in some cases, there is an effect of reducing defects.

FIG. 4 (A) is a view of the mold 41 of the display unit formed on the intaglio 2 as viewed from the front, and FIG. 4 (B) is a view as viewed from the side of FIG. 4 (A). Show. FIG. 4C shows a view of the terminal mold 42 formed on the intaglio 2 as viewed from the front, and FIG. 4D shows a view as viewed from the side of FIG. 4C. Here, the rotating shaft for holding the intaglio is omitted. As shown in the figure, since the side surface of each mold of the intaglio has the inclined surface 43, the thick film pattern material 6 filled in the mold of the intaglio can be easily released from the mold of the intaglio. Since the material of the thick film pattern filled in the mold remains inside the mold, a predetermined thickness of the thick film pattern can be obtained. In the case where the mold is not formed as a straight mold in the rotation axis direction, the mold may be applied and filled by using a blade instead of the application and filling roll. In addition, if some material may remain in the intaglio, the side surface of each mold of the intaglio need not necessarily have the inclined surface 43, or may have the inclined surface 43 partially.

Further, when the intaglio mold is processed with a release material, this effect becomes remarkable. FIG. 5 shows an enlarged part of the intaglio mold. FIG. 5A shows a mold 50.
2 shows a mold in which a portion (silicon portion 51) corresponding to the side surface is processed using silicon as a material. Then, a portion (non-silicon portion 52) corresponding to the bottom surface of the mold 50 is made of a non-silicon material such as metal or resin. In this case, the mold depth (plate depth) is 1
When it is 0 μm to 40 μm, preferably 15 μm to 30 μm
μm, 5 of the thick film pattern material 6 filled in the mold.
About 0% transfer. Thereby, the thickness of the obtained thick film pattern becomes 5 μm to 20 μm. FIG. 5 (B)
Shows a mold in which portions (silicon portion 51) corresponding to the side and bottom surfaces of the mold 50 are processed using silicon as a material. . In this case, when the mold depth (plate depth) is 5 μm to 20 μm, about 100% of the thick film pattern material 6 filled in the mold is transferred.

Further, FIGS. 5C, 5D, and 5
(E) and FIG. 5 (F) show a configuration characterized in that the cushion layer 53 is formed in the intaglio. By forming the cushion layer 53 in this manner, the material 6 of the thick film pattern can be transferred with a predetermined thickness corresponding to the smooth or fine uneven surface on the surface of the glass substrate 2 which is an object to be formed. Further, the material 6 of the thick film pattern can be transferred with a predetermined film thickness in accordance with the eccentricity or the like during rotation of the intaglio. As a result, the thickness unevenness of the thick film pattern formed on the glass substrate can be prevented. The metal layer 54 used here is made of SUS, N
The material is i, Cu, Cr, Ti, Al, or the like. This makes it possible to suppress the elongation of the intaglio mold made of silicon, thereby improving the accuracy of forming a thick film pattern on a glass substrate. The cushion layer 53 may be made of rubber or resin so as to absorb the undulation of the glass substrate.
Further, in order to repeatedly form a thick film pattern, the silicon portion 51, the cushion layer 53, and the metal layer 54 may be fixed with an adhesive so as not to peel off.

The thick film pattern forming apparatus shown in FIG. 1 having the intaglio 1 and the substrate fixing portion 3 as described above is used to form a thick film pattern material on the intaglio 1 and the glass substrate 2 fixed on the substrate fixing portion 3. A predetermined thick film pattern is formed on the substrate 2 by being sandwiched therebetween. Thereby, the glass substrate 2,
The cross-sectional shape of the thick film pattern 61 formed on 60 is shown in FIG.
As shown in (A), a thick film pattern 61 having a curved periphery is obtained. As described above, the thick film pattern is formed on the glass substrate 2 by the thick film pattern forming apparatus shown in FIG. This prevents the edge of the thick film pattern from being exposed by breaking through a predetermined layer.

In FIG. 1, after the thick film pattern is formed on the glass substrate 2 by the intaglio 1, the thick film pattern formed on the glass substrates 2 and 60 by the pressing roll 11 arranged behind the intaglio 1 of the forming unit 4. Crush the top surface of 61. As a result, the cross-sectional shape of the thick film pattern 61 formed on the glass substrates 2 and 60 becomes a thick film pattern 62 having a flat upper surface and a curved periphery as shown in FIG. Furthermore, if a photocurable resin such as a UV resin is used as the material of the thick film pattern, the upper surface of the thick film pattern is flat and the periphery is curved by a lamp house that houses a UV lamp and the like provided behind the pressing roll 11. The thick film pattern can be cured in the state. In addition, the pressing roller 11 that has been soiled by the material of the thick film pattern can be cleaned by the cleaning roller 12. Thereby, the upper surface of the thick film pattern formed on the glass substrate can be constantly crushed by the clean surface of the pressing roll 11, and dirt does not adhere to the thick film pattern. Further, although not shown, a U provided in front of the pressing roll 11 is provided.
After the thick film pattern is cured by a lamp house containing a V lamp or the like, the upper surface of the thick film pattern is
The thickness may be a thick film pattern which is flat at 1 and whose periphery is curved. Further, the thick film pattern may be transferred and formed while irradiating UV.

By forming a thick film pattern on the glass substrate 2 by the thick film pattern forming apparatus shown in FIG. 1 in this manner, the edge of the cross section of the formed thick film pattern is not sharp, and the thick film pattern 62 is formed. Is flattened, thereby preventing the edge of the thick film pattern from being exposed by breaking through a predetermined layer formed on the thick film pattern 63 and, at the same time, the uneven shape can be reduced. At this time, the cross-sectional shapes of the thick film pattern 63 and the upper dielectric layer 64 are
The result is as shown in FIG.

After a thick film pattern is formed on the glass substrate 2 by the intaglio 1 in FIG.
The glass substrate 2 is pressed by the pressing roll 11
Another embodiment in which the upper surface of the thick film pattern 61 formed on the upper surface 60 is crushed is shown. Here, a photocurable resin such as a UV resin is used as the material of the thick film pattern. First, after the forming unit 4 is moved to the left of the glass substrate 2, a lamp house containing a UV lamp and the like provided behind the pressing roll 11 comes to the left of the thick film pattern of the glass substrate. After the thick film pattern is once cured by irradiating the thick film pattern with the lamp of the lamp house in this way, the upper surface of the thick film pattern is crushed flat. Then, as shown in FIG. 6B, the upper surface of the thick film pattern becomes flat, and the thick film pattern in a state where the periphery thereof is curved can be cured. In addition, the pressing roller 11 that has been soiled by the material of the thick film pattern can be cleaned by the cleaning roller 12. Thereby, the upper surface of the thick film pattern formed on the glass substrate can be constantly crushed by the clean surface of the pressing roll 11, and dirt does not adhere to the thick film pattern.

By forming a thick film pattern on the glass substrate 2 by the thick film pattern forming apparatus shown in FIG. 1 in this manner, the edge of the cross-sectional shape of the formed thick film pattern is no longer sharp, and the thick film pattern 62 is formed. Is flattened, thereby preventing the edge of the thick film pattern from being exposed by breaking through a predetermined layer formed on the thick film pattern 63 and, at the same time, the uneven shape can be reduced. At this time, the cross-sectional shapes of the thick film pattern 63 and the upper dielectric layer 64 are
The result is as shown in FIG.

[0033]

According to the present invention, it is possible to easily manufacture a large product in which a fine thick film pattern is formed with high accuracy, that is, the line width and the thickness of the thick film pattern are faithfully reproduced. In addition, since the image is directly transferred to the transfer target, there is no restriction on the device,
It is excellent in that the mass production effect is high, the quality of the obtained thick film pattern is good, and the cost is low.

[Brief description of the drawings]

FIG. 1 is a diagram showing a thick film pattern forming apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a surface plate of the thick film pattern forming apparatus according to the embodiment of the present invention.

FIG. 3 is a diagram showing an intaglio pattern according to the embodiment of the present invention.

FIG. 4 is a diagram showing an intaglio according to an embodiment of the present invention.

FIG. 5 is a view showing a laminated structure of an intaglio according to the embodiment of the present invention.

FIG. 6 is a view showing a substrate on which a thick film pattern according to the embodiment of the present invention is formed.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Intaglio 2 Glass substrate 3 Substrate fixing part 4 Forming unit 5 Blade 6 Thick film pattern forming material 7 Dispensing roller 8 Mixing roller 9 Application filling roller 10 Lamp house 11 Press roller 12 Cleaning roller

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yozo Kosaka 1-1-1, Ichigaya Kagacho, Shinjuku-ku, Tokyo Inside Dai Nippon Printing Co., Ltd. (72) Inventor Ken Sasaki 1-1-1, Ichigaga-cho, Shinjuku-ku, Tokyo No. 1 Dai Nippon Printing Co., Ltd. F-term (reference) 5C027 AA01 AA09 5C040 GC19 GF19 GG09 JA04 JA19 JA20 JA40 MA25 MA26

Claims (7)

[Claims] An intaglio having a predetermined thick film pattern, a substrate fixing portion for fixing a substrate on which the thick film pattern is formed based on the intaglio, and a relative movement between the intaglio and the substrate fixing portion. Having a moving mechanism, a material holding unit for holding the material of the thick film pattern, a plurality of rollers through which the material passes before applying and filling the intaglio with the thick film pattern material, and via the rollers A thick film pattern forming apparatus having a mechanism for forming a predetermined thick film pattern on the substrate by sandwiching a material of the thick film pattern between the intaglio and the substrate fixed on the substrate fixing portion. 2. A mechanism according to claim 1, wherein at least one of a plurality of rollers that pass before applying and filling the intaglio plate with the thick film pattern material is rotated while swinging in the direction of the rotation axis. Thick film pattern forming apparatus. 3. The thick film pattern forming apparatus according to claim 1, wherein the intaglio is formed of a release material. 4. A thick film pattern forming apparatus according to claim 1, wherein a cushion layer is formed in the intaglio. 5. The thick film pattern forming apparatus according to claim 1, wherein the side surface of the intaglio mold has an inclined surface. 6. A thick film pattern forming apparatus according to claim 1, further comprising a pressing roller for pressing the formed thick film pattern. 7. A substrate on which a thick film pattern is formed according to claim 1, wherein the side surface of the formed thick film pattern has a curved portion.