JP2001060799A - Terminal alignment detection method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a terminal alignment detection method for promoting especially the high-speed packaging of electronic parts, and its device. SOLUTION: In a device for detecting the alignment state of the terminals of electronic parts S, the terminal alignment detection device is provided with a suction head 2 for sucking electronic parts S, a second traveling means 5 for moving the suction head 2 up and down, an inspection stage 20 that moves in a horizontal direction for orthogonally crossing the advance/retreat directions of the suction head 2, a light projection part 30 for emitting parallel light in parallel with the alignment direction of the terminals of the electronic parts S being sucked by the suction head 2 toward a terminal P, and a light reception part 31 for receiving light from the light projection part 30 while being placed on the inspection stage 20 opposite to the light projection part 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for detecting terminal alignment, and more particularly to a method for detecting a terminal alignment of an electronic component in a state where the electronic component is sucked by a suction head before the electronic component is mounted on a circuit board. The present invention relates to a method and an apparatus for detecting terminal alignment used for detecting an alignment state of a terminal.

[0002]

2. Description of the Related Art Conventionally, as a technique in such a field, there is JP-A-9-145333. The device described in this publication has a configuration in which a laser beam is irradiated in parallel to the arrangement direction of terminals of electronic components, and the laser beam is received by a light receiving sensor. Then, as a method for determining the quality of the arrangement state of the terminals of the electronic component, the energy of light emitted from the laser light source is compared with the energy of light received by the light receiving element, and the light-shielded width is first determined. Ask. Thereafter, the quality of the terminal arrangement is determined by comparing the width with the reference value.

[0003]

A conventional terminal bending inspection apparatus uses a laser beam to inspect the terminal bending of an electronic component. Such an inspection is generally performed by using an electronic component on a circuit board. This is performed before mounting the components. In this case, a stage for inspection is provided in the middle of the transportation of the electronic components, and the laser light source and the light receiving element arranged on the inspection stage determine whether the arrangement state of the terminals is good. It is carried out. Therefore, it is necessary to pass the electronic component once through the inspection stage. In this case, a separate inspection space must be provided, and the moving time (tact time) required until the electronic component is mounted on the circuit board. ), Which has been a problem for high-speed mounting of electronic components.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and it is an object of the present invention to provide a terminal alignment detecting method and a device therefor, which facilitate high-speed mounting of electronic components.

[0005]

According to a first aspect of the present invention, there is provided a terminal alignment detecting method for detecting an alignment state of terminals of an electronic component sucked by a suction head. On the way to
The inspection stage is moved so that it passes below the suction head in the horizontal direction perpendicular to the direction in which the suction head moves, and the light emitting unit placed on the inspection stage is moved in parallel with the terminal alignment direction. The light is emitted toward the terminal, and the light is received by a light receiving unit mounted on the inspection stage to detect an alignment state of the terminal.

In this terminal alignment detecting method, the suction head transports an electronic component from a suction position at which the electronic component is sucked to a mounting position at which the electronic component is mounted on a circuit board. And moves in the horizontal direction perpendicular to the direction in which the suction head moves. During this passage, light directed in the direction in which the terminals of the electronic components are aligned is emitted from the light receiving unit disposed on the inspection stage toward the light emitting unit. As a result of moving the inspection stage in this manner, the alignment of the terminals of the electronic component can be detected while the suction head is moving. That is, the transport of the electronic component by the suction head and the detection of the alignment state of the terminals of the electronic component can be performed simultaneously.
Therefore, the moving time (tact time) required for mounting the electronic component on the circuit board can be reduced, and the electronic component can be mounted at a high speed.

According to a second aspect of the present invention, there is provided a terminal alignment detecting method and apparatus for detecting a terminal alignment state of an electronic component, wherein the suction head sucks the electronic component and the suction head is moved in a horizontal direction. A first moving means, a second moving means for vertically moving the suction head, an inspection stage for moving in a horizontal direction perpendicular to the direction of movement of the suction head, and a suction stage mounted on the inspection stage, A light projecting unit that emits light parallel to the alignment direction of the terminals of the electronic components sucked by the head toward the terminals, and is placed on an inspection stage so as to face the light projecting units. A light receiving unit for receiving light.

In this terminal alignment detecting device, the suction head moves in the horizontal direction by the first moving means and moves up and down by the second moving means. Further, this apparatus employs an inspection stage, on which a light emitting unit and a light receiving unit are mounted, and the inspection stage is arranged so as to pass under the suction head so as to be horizontal with respect to the moving direction of the suction head. Move in the direction. During this movement, light is emitted from the light projecting unit toward the light receiving unit on the inspection stage, and the light is directed in the direction in which the terminals of the electronic component are aligned. As a result of moving the inspection stage in this manner, the alignment of the terminals of the electronic component can be detected while the suction head is moving. That is, the transport of the electronic component by the suction head and the detection of the alignment state of the terminals of the electronic component can be performed simultaneously. Accordingly, it is possible to reduce a moving time (tact time) from when the electronic component is sucked by the suction head to when it is mounted on the circuit board, and high-speed mounting of the electronic component is enabled.

In the terminal alignment detecting device according to the third aspect, the first moving means extending in the horizontal direction connects the base and a moving base arranged on the base, and the second moving means extends in the vertical direction. The third moving means connects the moving base and the suction head, and extends horizontally between the moving base and the inspection stage in a direction orthogonal to the extending direction of the first moving means. It is preferable to connect by means. When such a configuration is adopted, the first moving means
The moving base can be moved forward and backward on the base in the horizontal direction, the suction head can be reciprocated up and down with respect to the moving base by the second moving means, and the inspection stage can be moved by the third moving means. In addition, it is possible to reciprocate beneath the suction head in a direction orthogonal to the direction of movement of the suction head.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a terminal alignment detecting method and apparatus according to the present invention will be described below in detail with reference to the drawings.

The terminal alignment detecting device 1 is used as a part of a component mounter for mounting the electronic component S on the circuit board 18. Before mounting the electronic component S on the circuit board 18, During the transportation of the electronic component S, the alignment state of the terminals P of the electronic component S is detected, and the electronic component S is used as a device for mounting only the electronic component S having a good terminal state on the circuit board 18.

As shown in FIGS. 1 to 3, the terminal alignment detecting device 1 has a suction head 2 for performing vacuum suction of an electronic component S, and a suction nozzle 3 is provided at a lower end of the suction head 2. ing. The suction head 2 moves up and down along a column 4 erected on a moving base 10 extending in the horizontal direction.
Further, the column 4 and the suction head 2 are connected via the second moving means 5.

The second moving means 5 comprises a ball screw mechanism. The second ball screw mechanism 5 extends along the column 4 and is rotated by an AC servomotor 6 fixed to the column 7. And a female screw portion 8 screwed to the screw shaft 7. Then, the head holding portion 2a of the suction head 2 is fixed to the female screw portion 8, and the suction head 2
It reciprocates up and down via the linear guide 9. Therefore, by operating the servo motor 6, the suction head 2 can be moved up and down by a predetermined amount following the rotation amount of the screw shaft 7.

The moving base 10 moves forward and backward on the base 11 in the horizontal direction. The moving base 10 and the base 11 are the first
The moving base 10 is connected via moving means 12 of
It slides in the horizontal direction via the linear guide 16. The first moving means 12 comprises a ball screw mechanism. The first ball screw mechanism 12 extends along the base 11 and has a screw shaft 13 rotated by an AC servomotor 15 fixed to the base 11. And a female screw portion 14 fixed to the moving base 10 and screwed to the screw shaft 13.
Therefore, by operating the servomotor 15, the movable base 10 can be moved forward and backward by a predetermined amount following the rotation amount of the screw shaft 13.

The range in which the moving base 10 advances and retreats from the suction position A where the suction head 2 sucks the electronic component S.
This is a range in which the electronic component S can be moved to a mounting position B where the electronic component S is mounted on the circuit board 18 (see FIG. 3). That is, the first
Of the moving base 10 by the moving means 12 of
The suction head 2 is moved horizontally to the suction position A, the suction head 2 is lowered by the second moving means 5, and the suction nozzle 3 sucks the electronic component S by a series of operations.

Thereafter, the suction head 2 is raised by the second moving means 5, and the suction head 2 is horizontally moved to the mounting position B by the retreat of the moving base 10 by the first moving means 12. Then, the electronic component S is mounted on the circuit board 18 by lowering the suction head 2 by the second moving means 5. Thus, the suction head 2
The electronic component S moves while being retracted from the suction position A to the mounting position B.

Here, the electronic components S supplied on the suction position A side include not only non-defective products but also defective products with bent terminals P. It is not possible to mount defective terminals on the circuit board 18. It is extremely inconvenient.

Therefore, while the electronic component S is being conveyed by the suction head 2, the alignment of the terminals P of the electronic component S is inspected. That is, the conveyance of the electronic component S by the suction head 2 and the detection of the alignment state of the terminals P of the electronic component S are simultaneously advanced. As a result, the moving time (tact time) required for mounting the electronic component S on the circuit board 18 can be reduced, and the electronic component S can be mounted at a high speed.

More specifically, as shown in FIGS. 1 to 5, while the electronic component S is being conveyed by the suction head 2, the inspection stage 20 moves under the suction head 2 so as to pass below the suction head 2. It moves in a direction perpendicular to the forward and backward directions. The inspection stage 20 is moved by the third moving means 21 disposed on the back surface of the moving base 10.
Reciprocate along.

The inspection stage 20 and the moving base 10 are connected via a third moving means 21 and a linear guide 22
Slides horizontally through. This third moving means 21
Comprises a ball screw mechanism. The third ball screw mechanism 21 extends horizontally in a direction perpendicular to the extending direction of the screw shaft 13 of the first moving means 12 and rotates by an AC servomotor 23. 24, and a female screw portion 25 fixed to the inspection stage 20 and screwed to the screw shaft 24. Therefore, by operating the servo motor 23, the inspection stage 20 can be moved forward and backward by a predetermined amount following the rotation amount of the screw shaft 24.

On the inspection stage 20, a light projecting section 30 used as a laser beam generating source and a light receiving section 31 for receiving the laser beam are arranged to face each other with the suction nozzle 3 interposed therebetween. The light projecting unit 30 includes the electronic component S
Light is emitted toward the terminal P of the
Are emitted so as to extend in parallel to the direction in which the terminals P of the electronic components S in the suction state by the suction head 2 are aligned. Therefore, by moving the inspection stage 20 while the electronic components are being conveyed by the suction head 2, the light emitting unit 30 is moved.
The terminal P can be sequentially scanned with the laser beam emitted from the terminal P.

In this beam scanning, the light projecting unit 3
The light energy from 0 and the light energy received by the light receiving unit 31 are compared and calculated, and if the received light energy is smaller than a specified value, a state in which a light blocking object exists more than specified, that is, the bent terminal P Is in a state where the light is blocked, it is determined that the electronic component is defective. Thereby, the defective electronic component S is sucked by the suction nozzle 3 while the electronic component S is being conveyed.
And collect the defective products in a predetermined place.

The laser beam has a light emitting / receiving interval of 1 unit.
If the distance is 0 cm or more, the laser beam spreads beyond the convergence critical value of the laser beam, so that a detection error may occur. Therefore, when scanning and inspecting a large and rectangular electronic component S, the electronic component S is not scanned in the longitudinal direction (longitudinal direction) of the electronic component S, but is scanned while scanning the light in the longitudinal direction of the electronic component S. It is preferable to make light run in the lateral direction of S.

The present invention is not limited to the above-described embodiment. For example, the light projecting unit 3 used as a light source
0 is not limited to the laser light source and may be an LED having high directivity. Further, the terminal P to be inspected is not limited to the pin-shaped terminal, but may be a ball-shaped terminal.

The first, second and third moving means 1
2, 5, and 21 are not limited to the ball screw mechanism described above, and may use a belt drive mechanism, a pulse motor, a linear motor, or the like. That is, the guide may be performed so as to maintain at least the state where the inspection stage 20 is kept horizontal or the state where the inspection stage 20 can perform linear movement, and the mechanism of each moving means is not limited to the above-described one.

[0026]

According to the terminal alignment detecting method of the present invention, while moving the suction head from the suction position to the mounting position,
The inspection stage is moved so that it passes below the suction head in the horizontal direction perpendicular to the direction in which the suction head moves, and the light emitting unit placed on the inspection stage is moved in parallel with the terminal alignment direction. The light is emitted toward the terminals, and the light is received by the light receiving unit placed on the inspection stage, and the alignment of the terminals is detected, thereby promoting high-speed mounting of electronic components. it can.

Further, the terminal alignment detecting device according to the present invention comprises:
A suction head for sucking the electronic component, a first moving means for moving the suction head in a horizontal direction, a second moving means for moving the suction head in a vertical direction, and a horizontal direction perpendicular to the moving direction of the suction head. An inspection stage that moves in the direction, a light-emitting unit that is mounted on the inspection stage, and emits, toward the terminals, light parallel to the alignment direction of the terminals of the electronic components sucked by the suction head, and a light-emitting unit. And a light receiving unit that receives the light from the light projecting unit and is mounted on the inspection stage in opposition to the electronic component, so that high-speed mounting of the electronic component can be promoted.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a terminal alignment detecting device according to the present invention.

FIG. 2 is a front view of the terminal alignment detecting device shown in FIG.

FIG. 3 is a sectional view taken along the line III-III in FIG. 1;

FIG. 4 is a perspective view showing a main part of an inspection stage of the terminal alignment detecting device according to the present invention.

FIG. 5 is a front view showing a main part of the inspection stage.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Terminal alignment detection apparatus, 2 ... Suction head, 5 ... 2nd ball screw mechanism (2nd moving means), 10 ... Moving base,
DESCRIPTION OF SYMBOLS 11 ... Base, 12 ... 1st ball screw mechanism (1st moving means), 20 ... Inspection stage, 21 ... 3rd ball screw mechanism (3rd moving means), 30 ... Light emitting part, 31 ... Light receiving part , S: electronic components, P: terminals.

Claims (3)

[Claims] 1. A method for detecting an alignment state of a terminal of an electronic component sucked by a suction head, wherein the suction head is orthogonal to a moving direction of the suction head while moving the suction head from a suction position to a mounting position. In the horizontal direction, the inspection stage is moved so as to pass below the suction head, and light parallel to the alignment direction of the terminals is directed from the light emitting unit mounted on the inspection stage to the terminals. And detecting the aligned state of the terminals by causing the light to be received by a light receiving unit mounted on the inspection stage. 2. An apparatus for detecting an alignment state of terminals of an electronic component, a suction head for sucking the electronic component, first moving means for moving the suction head in a horizontal direction, and moving the suction head in a vertical direction. A second moving means for moving the electronic component, a test stage moving in a horizontal direction perpendicular to the direction of movement of the suction head, and an electronic component mounted on the test stage and sucked by the suction head. A light projecting unit that emits light parallel to the direction in which the terminals are aligned toward the terminal, and placed on the inspection stage so as to face the light projecting unit;
A terminal alignment detecting device, comprising: a light receiving unit that receives light from the light emitting unit. 3. The first moving means extending in the horizontal direction connects a base and a moving base arranged on the base, and the second moving means extending in the up-down direction comprises: A third moving unit that connects the moving base and the suction head, and extends horizontally between the moving base and the inspection stage in a direction orthogonal to an extending direction of the first moving unit; The terminal alignment detecting device according to claim 2, wherein the terminal alignment detecting device is connected by: