JP2001079865A - Vacuum laminating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vacuum laminating apparatus capable of laminating respective layers by efficiently heating a molding material by simple constitution and efficiently cooling the formed laminated article to stabilize the same. SOLUTION: A vacuum laminating apparatus is equipped with an upper plate 1 and a lower plate 2 both of which are arranged so as to be able to approach and separate each other, the film members 3, 4 provided to the opposed surfaces of both plates, a framework 5 for forming a molding material housing space S, the heating means 7, 8 respectively provided so as to be adjacent to the rear surfaces of the film members 3, 4, the cooling means 9, 10 respectively provided between the heating means 7, 8 and the opposed surfaces of the upper and lower plates 1, 2, a vacuum means for evacuating the molding material housing space, a film member operating means for operating the film members 3, 4 in a controllable manner, interval holding mechanisms 11, 12 for separating the heating means 7, 8 from the cooling means 9, 10 to bring them into close contact with the film members to move the heating means so as to follow the movement of the film members and cooling means operating mechanisms 13, 14 for operating the cooling means 9, 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum laminating apparatus for laminating molding materials by heating and pressing them in a vacuum atmosphere.

[0002]

2. Description of the Related Art For example, when a printed wiring board is manufactured, an insulating substrate made of a thermosetting resin such as a phenol resin or an epoxy resin, or a flexible insulating base film made of a thermoplastic resin such as a polyimide. And a step of laminating a conductor layer such as a copper foil which is patterned or etched in a later step (the former is simply called a laminated substrate, and the latter is called a flexible laminated substrate). In the case of forming a laminated substrate, the insulating substrate and the copper foil are heated and pressed in a vacuum atmosphere, the insulating substrate is plasticized by a chemical reaction of a thermosetting resin, adhered and laminated with the copper foil, and further subjected to a chemical reaction. To cure the insulating substrate to which the copper foil is bonded. Also,
Similarly, when molding a flexible laminated substrate, the insulating base film and the copper foil are heated and pressed in a vacuum atmosphere,
The insulating base film is plasticized and adhesively laminated with a copper foil. That is, in the step of laminating a conductor layer such as a copper foil, a molding material itself such as an insulating substrate or an insulating base film made of a thermosetting resin becomes an adhesive.

In order to protect the laminated copper foil from etching, plating, soldering, etc., a film-like photoresist forming layer comprising a support film and a photosensitive layer is laminated on the laminated substrate and the flexible laminated substrate. There is a step of thermocompression bonding to the surface of the conductor layer thus formed. The photoresist forming layer has tackiness when heated, and is pressed and laminated on the surface of the copper foil.

[0004] In recent years, such a printed wiring board has a higher integration density and its configuration has changed with the development of surface mounting. Therefore, multilayer printed wiring boards and multilayer flexible printed wiring boards having three or more conductive patterns including the surface conductive layer have been increasingly used. When molding these multilayer printed wiring boards and the like, a laminated substrate or a flexible laminated substrate,
Further, a build-up method in which an insulating substrate or an insulating base film and a conductor layer are sequentially laminated is used.

[0005] By the way, when performing the above-described laminating step of the conductor layer and the thermocompression bonding step of the film-like photoresist forming layer, bubbles such as volatile components of the molding material are formed between the laminated substrate or the flexible laminated substrate and the copper foil. In some cases, voids may be generated between the laminated copper foil and the film-like photoresist forming layer. The generated void is
For example, it may expand during high-temperature processing in a post-process such as a molten solder bath, and may damage a laminated copper foil or a film-like photoresist forming layer, which may result in poor protection of a circuit board, poor insulation, and thus poor conductivity. There is a possibility that.

Since various molding materials are laminated by heating and pressing without causing voids between such molding materials, for example, Japanese Patent Application Laid-Open Nos. Sho 63-295218 and 63-299895, etc. As disclosed in Japanese Patent Application Laid-Open No. H11-163, lamination molding of a molding material in a vacuum atmosphere has been conventionally performed. The vacuum laminating apparatus disclosed in JP-A-63-295218 and JP-A-63-299895, for laminating a plurality of plate-, sheet-, or film-shaped molding materials, includes a heating vessel. A rubber sheet is provided in the inside, or a rubber sheet is stretched inside a vacuum chamber which can be opened and closed, and a vacuum pump is connected inside the cylindrical rubber or between the rubber sheets. In these vacuum laminating apparatuses, a molding material is arranged in a cylindrical rubber or between rubber sheets to form a molding material accommodating space by sealing the cylindrical rubber or rubber sheet. By evacuating the inside,
A cylindrical rubber or rubber sheet presses the molding material.
In JP-A-63-295218, a stage material is heated by a heating vessel to which a heating device is connected. In JP-A-63-299895, the stage material is heated by heating the fixed-side chamber and the movable-side chamber by a heating mechanism.

Another conventional vacuum laminating apparatus includes:
For example, as disclosed in Japanese Patent Publication No. 4-52200, a plurality of hot plates are disposed between a fixed platen and a movable platen which is provided so as to be capable of clamping and opening the fixed platen. A vacuum hot press in which an airtight chamber is formed by enclosing a moving space of a movable board is known. In such a vacuum hot press, generally, a temperature control fluid passage is formed in each hot plate, and a heating medium such as pressurized steam or heating oil is supplied to each temperature control fluid passage to thereby provide a space between each hot plate. The inserted molding material is heated simultaneously with pressurization. Also, in the temperature control fluid passage for supplying this heat medium,
Alternatively, by supplying a coolant so as to be switchable with the heating medium, to a temperature regulating fluid passage formed in each heating plate in order to supply a coolant such as cooling water separately from the temperature regulating fluid passage supplying the heat medium, The heated molding is cooled.

Further, as another conventional vacuum laminating apparatus,
As disclosed in Japanese Patent Application Laid-Open No. 10-315257, an upper plate and a lower plate are disposed so as to be able to approach and retreat from each other, and a film body provided on each of opposing surfaces of the upper plate and the lower plate. And, when the upper plate and the lower plate are brought close to each other, a frame forming a molding material accommodating space in which the molding material is accommodated between the two film bodies, and at least one of the upper plate and the lower plate film Heating means provided on the body, a recess formed so as to have a predetermined interval between the film body having the heating means and the opposing surface of the upper plate and / or the lower plate provided with the film body, A cooling means for cooling the concave portion, a depressurizing means for evacuating the molding material accommodation space, and at an arbitrary timing, pressurizing the molding material housed in the molding material accommodation space while being separated from the depression. The laminated molding material is brought into close contact with the concave portions of the upper plate and / or lower plate. So that the controllably vacuum lamination apparatus comprising: the film body operating means for operating the film body, is known. As the heating means in this vacuum laminating apparatus, one having flexibility capable of closely adhering to the concave portion and rigidity capable of functioning as a surface plate when pressing the molding material accommodated in the molding material accommodation space is used. Have been.

[0009]

However, among the above-mentioned prior arts, in the vacuum laminating apparatus disclosed in JP-A-63-295218 or JP-A-63-299895, the inside of the chamber is not provided. Before the thermosetting resin is pressurized by heat conduction or radiation heat, the curing reaction proceeds, causing poor adhesion to a molding material such as a copper foil, and there is a problem that the bonding strength is not guaranteed. In addition, since the molding material heated by the heating device or the heating mechanism is gradually cooled to a temperature at which the molding material is stabilized, the heat at the time of heating remains in the molding material even after lamination is completed. The thermal expansion coefficient is different between the insulating substrate and insulating base film made of thermosetting resin and the film-like photoresist forming layer, and molding defects such as wrinkles, shrinkage, and deformation due to heat shrinkage due to non-uniform temperature drop. There was a problem that occurred. Further, in the case of a molding material having a high temperature dependency such as a film-like photoresist forming layer having adhesiveness by being heated as described above,
There is a problem in that the contacted portion is stuck before the vacuum atmosphere is formed, and there is a problem of degassing between the laminated copper foil and the film-like photoresist forming layer. Further, there is a problem that plasticization proceeds too much before pressurization, and wrinkles are generated and accuracy of positioning and the like is reduced. These problems cause the yield of molded articles to deteriorate.

On the other hand, in a vacuum hot press as disclosed in Japanese Patent Publication No. 52200/1992, a heat medium or a refrigerant is supplied to a temperature control fluid passage formed in each hot plate. However, there was a problem that the molding cycle could not be shortened, and that the thermal efficiency was poor, the cost was high, and the productivity could not be improved.

In the case of the vacuum laminating apparatus disclosed in Japanese Patent Application Laid-Open No. 10-315257, the laminated product is brought into close contact with a concave portion of an upper plate and / or a lower plate provided with cooling means. Therefore, complicated control of the film operating means was required. Further, in this device, cooling means is provided directly on the upper plate and the lower plate, and the laminated product is placed in one of the concave portions of the upper plate and / or the lower plate provided with the cooling means. Because of the close contact, only one side of the laminate could be cooled.

The present invention has been made in order to solve the above-mentioned problems, and it is possible to efficiently heat a molding material to laminate each layer with a simple structure, and to further efficiently cool a laminated product. It is an object to provide a vacuum laminating apparatus that can be stabilized.

[0013]

According to a first aspect of the present invention, there is provided an upper plate and a lower plate which are disposed opposite to each other so as to be able to approach and retreat, and the upper plate and the lower plate are opposed to each other. When the upper and lower plates are brought close to each other, a frame body that forms a molding material accommodating space for accommodating a molding material between the two film bodies, Heating means respectively provided adjacent to the opposing surfaces of the upper plate and the lower plate; cooling means provided between each heating means and the opposing surfaces of the upper plate and the lower plate; Pressure reducing means for evacuating the film, and at any timing, preventing the bulging of each film body so that the molding material in the evacuated molding material accommodation space is not pressed, or forming in the molding material accommodation space. In order to expand each film body so as to pressurize the material, film body operation means for operating the film body, and heating means, From each retirement unit holds to be spaced at predetermined intervals greater than, is characterized in that it comprises a spacing holding mechanism to follow the movement to the movement of the film body so as to close the respective film body.

According to a second aspect of the present invention, in order to achieve the above object, in the first aspect of the present invention, at any timing, the film is brought into close contact with each film body via a heating means against the spacing mechanism. As described above, a cooling means operating mechanism for controlling each of the cooling means so as to be controllable is provided.

According to the first aspect of the present invention, a molding material including a plurality of layers is inserted into the frame in a state where the upper plate and the lower plate are separated from each other, and the upper plate and the lower plate are brought into close proximity to each other, so that A molding material accommodating space is formed by the two film bodies and the frame body of the lower plate. Then, in a state in which both the film bodies are brought into close contact with the opposing surfaces of the upper plate and the lower plate by the film body operation means so as to prevent the molding material in the molding material storage space from being pressed, and the swelling of each film body is prevented. The inside of the molding material accommodation space is evacuated by the decompression means. Subsequently, the close contact between the upper and lower plates of both film bodies by the film body operating means is released, and the film body operating means is operated so as to bulge the two film bodies in order to press the molding material. At this time, the heating means is separated from the cooling means by the interval holding mechanism at a predetermined interval or more, respectively, follows the film body and closely adheres thereto, and the molding material is pressed by the film body,
Heated by the heating means, the layers are laminated. At this time, since the heating unit is separated from the cooling unit by a predetermined distance or more by the interval holding mechanism, the heat capacity of the heating unit can be reduced, and the thermal efficiency is improved.

According to a second aspect of the present invention, in the first aspect of the present invention, after the molded materials are laminated by pressurizing and heating, the heating by the heating means is stopped while the pressurization by the film body is maintained. The cooling means is cooled by sandwiching the laminated product between the cooling means via the film body and the heating means by the cooling means operating mechanism. In the laminate, each layer uniformly cools down due to a temperature drop and stabilizes without forming wrinkles.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, an embodiment of a vacuum laminating apparatus according to the present invention will be described in detail with reference to FIG. The same reference numerals in the drawings denote the same or corresponding parts.

The vacuum laminating apparatus of the present invention is generally provided on an upper plate 1 and a lower plate 2 which are opposed to each other so as to be able to approach and retreat, and on opposing surfaces of the upper plate 1 and the lower plate 2 respectively. When the film bodies 3 and 4 and the upper plate 1 and the lower plate 2 are brought close to each other, a frame 5 forming a molding material storage space S in which the molding material H is accommodated between the film bodies 3 and 4 Heating means 7 and 8 provided adjacent to the film bodies 3 and 4 on the sides facing the upper plate 1 and the lower plate 2 respectively; and the heating means 7 and 8 and the upper plate 1 and the lower plate 2 Cooling means 9 and 10 provided between the first and second surfaces, respectively;
Decompression means for evacuating the molding material storage space S (described later)
At any time, the swelling of each of the film bodies 3 and 4 is prevented so that the molding material H in the vacuumed molding material accommodation space S is not pressed, or the molding in the molding material accommodation space S is prevented. Material H
In order to swell each of the film bodies 3 and 4 so as to pressurize, the film body operating means (described later) for operating the film bodies 3 and 4 and the heating means 7 and 8 are moved from the cooling means 9 and 10 respectively. While holding at a predetermined interval or more, each film
And spacing maintaining mechanisms 11 and 12 that follow the movement of the film bodies 3 and 4 so as to be in close contact with the film bodies 3 and 4 respectively.
4 so that the cooling means 9 and 10
Are provided with cooling means operating mechanisms 13 and 14, respectively.

The upper plate 1 is formed of a substantially rectangular flat plate. In this embodiment, a concave portion 30 having substantially the same area as the inner peripheral opening of the frame 5 is formed on the lower surface facing the lower plate 2. Is formed. As will be described later, the frame 5 in this embodiment includes an upper frame 5A attached to the upper plate 1,
A lower frame 5B is attached to the lower plate 2, and both frames 5A and 5B have substantially the same inner peripheral opening. The upper frame body 5A has a peripheral surface of the film body 3 hermetically fixed to the upper surface thereof, and is attached to the lower surface of the upper plate 1 via a sealing material (not shown) with bolts. Therefore, an airtight space J is formed in the upper plate 1 by the concave portion 30 and the film body 3. At the approximate center of the upper plate 1, a membrane operation passage 31 is formed so as to open into the space J. A pipe (not shown) for supplying and discharging a membrane operating fluid for operating the membrane 3 by the membrane operating means is connected to the membrane operating passage 31 as described later.

Like the upper plate 1, the lower plate 2 is formed of a substantially rectangular flat plate, and has a recess 40 having substantially the same area as the inner peripheral opening of the lower frame 5B. Body 5B
The periphery of the film body 4 is hermetically fixed to the lower surface of the lower plate 2 and is attached to the upper surface of the lower plate 2 via a sealing material (not shown) with bolts. Therefore, an airtight space K is also formed in the lower plate 2 by the concave portion 40 and the film body 4.
The upper plate 1 and the lower plate 2 can fixedly support one of them, and can support the other of the fixed one so as to be relatively movable toward and away from the other. Both of the lower plates 2 may be supported so as to be able to move toward and away from each other. At a substantially center of the lower plate 2, a membrane operation passage 41 is formed so as to open to the space K. Membrane operation passage 4
A pipeline (not shown) for supplying and discharging a membrane operating fluid for operating the membrane 4 by the membrane operating means is connected to 1 as described later.

Both membrane members 3 and 4 are, for example, flexible,
It can be made of a sheet-like silicone rubber having elasticity, elasticity, heat resistance and the like, and can be attached to each of the frames 5A and 5B by baking or the like. The film bodies 3 and 4 can form airtight spaces J and K between the recesses 30 and 40 in the upper plate 1 and the lower plate 2, respectively, and press the molding material H under pressure. If you can secure enough area to do
It is not necessary to fix to the upper frame 5A and the lower frame 5B, respectively.

As described above, the frame 5 in this embodiment is composed of the upper frame 5A and the lower frame 5B, and each of the seal members (the reference numerals are omitted).
Are attached to the upper plate 1 and the lower plate 2 through the base plate. FIG.
As shown in FIG. 5, the upper frame 5A and the lower frame 5B are abutted when the upper plate 1 and the lower plate 2 are relatively close to each other, and In cooperation with 4, an airtight molding material storage space S is formed. In the case of this embodiment, the lower plate 2 is formed with a deaeration passage 50 connected to a decompression means such as a vacuum pump for evacuating the molding material storage space S, and communicates with the deaeration passage 50. A passage 51 is formed so as to open to the upper surface of the lower frame 5B. The upper frame 5A communicates between the molding material storage space S and the passage 50 that opens to the upper surface of the lower frame 5B. The notch 52 which forms the clearance gap is provided. In addition, the frame 5 of the present invention
Without being limited to this embodiment, the upper plate 1 and the lower plate 2
Is relatively airtight when the molding material housing space S is closed.
Are formed, and when they are relatively separated from each other, the molding material accommodation space S
It is not necessary to form the upper frame 5A and the lower frame 5B, as long as they can be opened. Although not shown, instead of the above-described embodiment, for example, a deaeration passage 50 connected to a decompression unit may be used.
Is formed in the upper plate 1 and a passage 5 communicating with the deaeration passage 50 is formed.
1 can be formed in the upper frame 5A, and the notch 52 can be provided in the lower frame 5B. Alternatively, the passage 50 connected to the pressure reducing means can be formed in either the upper frame 5A or the lower frame 5B. It can also be formed directly.

In the recesses 30 and 40 of the upper plate 1 and the lower plate 2, cooling plates 32 and
42 are inserted so as to be able to move up and down.
Heating means 7 and 8 are arranged between the facing surface 42 and the film bodies 3 and 4. Heating means (hereinafter referred to as heater) 7,
Reference numeral 8 in the case of this embodiment is made of a thin plate or foil of stainless steel or the like having relatively small heat capacity, which generates heat due to electric resistance when energized, and has a smooth surface. Conductive terminals 33 and 43 for supplying electric power are attached to opposed edges of the heaters 7 and 8, and the conductive terminals 33 and 43 are formed so as to penetrate the cooling boards 32 and 42. Insulator 3 in guide holes 32a, 42a
4 and 44 so as to be able to move up and down relative to the cooling boards 32 and 42, and the conductive terminals 33 and 43 are provided with guide holes 32a,
It is inserted in a state where its movement is regulated so that it does not fall off from 42a. A pair of conductive plugs 35 and 45 extending between the upper plate 1 and the lower plate 2 between the outside and the spaces J and K are provided via seal bushes 36 and 46 for maintaining the airtightness of the spaces J and K. The conductive terminals 33, 43 and the conductive plug 35,
As shown in FIG. 6, the plate 45 is connected to the plate-shaped conductors 37 and 47 having flexibility. Note that only one of the conductive plug 45 and the plate-shaped conductor 47 on the lower plate 2 side is shown in the drawing, and the other is not shown. Further, in this embodiment, a DC power supply is connected to the pair of conductive plugs 35 and 45, respectively. The conductors 37 and 47 can supply electric power to the heaters 7 and 8 that move up and down relatively with respect to the upper plate 1 and the lower plate 2 via the cooling boards 32 and 42. However, the present invention is not limited to this embodiment, and other forms can be used.

Inside the cooling plates 32 and 42, passages 32 for supplying, circulating and discharging a cooling fluid of a predetermined temperature are provided.
b, 42b are formed, and the passages 32b, 42b
The cooling fluid supply / discharge pipes 38 and 48 are connected to both ends (the connection between the two 32b and 42b and 38 and 48 is not shown). Each cooling fluid supply
The discharge pipes 38, 48 are supported by the upper plate 1 and the lower plate 2 via seal bushes 39, 49 for maintaining the airtightness of the spaces J, K, respectively, so as to be movable in the longitudinal direction. Further, the upper plate 1 and the lower plate 2 are provided with drive cylinders 13 and 14 as a cooling means operating mechanism. The piston rod 1 of the drive cylinders 13 and 14
3a and 14a are seal bushes between the upper plate 1 and the lower plate 2 so as to maintain the airtightness of the spaces J and K, similarly to the conductive plugs 35 and 45 and the cooling fluid supply / discharge pipes 38 and 48. 70 and 80 are interposed. And
A cooling plate 3 is attached to the tip of the piston rods 13a and 14a.
2, 42 are attached by bolts 71, 81. The piston rods 13a of the drive cylinders 13, 14
By extending and driving the 14a, the cooling boards 32 and 42 are moved via the heaters 7 and 8 so as to be in close contact with the respective film bodies 3 and 4.

For example, when air is used as the membrane operating fluid, the membrane operating means is an air compressor for supplying air to the membrane operating passage 31 of the upper plate 1 and the membrane operating passage 41 of the lower plate 2. A vacuum pump for sucking air from the membrane operation passages 31 and 41, and a control so that air can be supplied to and sucked into the membrane operation passages 31 and 41 at an arbitrary timing and independently of each other. Control means having a switching valve for performing the operation (not shown). The vacuum pump of the membrane operating means is configured such that when the molding material housing space S is depressurized, the membranes 3 and 4 swell and the molding material H
Is sucked through heaters 7 and 8 by sucking air in space J between film body 3 and recess 30 and in space K between film body 4 and recess 40 so as not to pressurize The film bodies 3 and 4 are brought into close contact with the cooling boards 32 and 42, respectively. Further, the air compressor of the film body operating means supplies air to the spaces J and K so as to press the molding material H at a predetermined pressure, thereby expanding the film bodies 3 and 4. Then, the control means of the film body operation means presses the molding material H in the molding material storage space S by the film bodies 3 and 4 at an arbitrary timing.
Control the suction and air supply in K. Depending on the required pressurizing pressure for the molding material H, it may be sufficient to depressurize the molding material accommodation space S and open the spaces J and K to the atmosphere. In this case, it is sufficient to operate the air compressor or operate the compressor. The existence itself becomes unnecessary.

[0026] Distance maintaining mechanism 1 in this embodiment
The heaters 1 and 12 have different configurations for the heater 7 of the upper plate 1 and the heater 8 of the lower plate 2. As described above, the interval holding mechanism 11 that separates the heater 7 of the upper plate 1 from the cooling board 32 at a predetermined interval or more, connects the conductive terminal 33 attached to the opposite edge of the heater 7 to the guide hole of the cooling board 32. 32a
It is constituted by passing through. That is, the heater 7 causes the guide hole 32a of the cooling
Is suspended from the cooling board 32 and adheres to and follows the film body 3. Therefore, the interval at which the heater 7 is separated from the cooling board 32 is determined by the length of the conductive terminal 33 that regulates suspension with respect to the cooling board 32. This interval is, for example, 0.5 to the extent that heat generated by energizing the heater 7 can be secured without being impaired by the cooling plate 32.
It is desirable to set the interval to be at least 1 mm to 1 mm. On the other hand, the interval holding mechanism 12 for separating the heater 8 of the lower plate 2 from the cooling board 42 at a predetermined interval or more, as described above, connects the conductive terminal 43 attached to the opposite edge of the heater 8 to the cooling board 42. As shown in FIG. 7, the heater supporting member 62 is inserted into the bottomed hole 42c provided in the cooling board 42 and has the heater 8 mounted thereon. And a compression spring 63 that urges the compression spring 63. That is, the heater 8 is inserted into the guide hole 42 a of the cooling board 42 in a state where the movement of the conductive terminal 43 is restricted, and is separated from the cooling board 42 by being urged by the compression spring 63. Membrane 4
Will follow closely. The interval at which the heater 8 is separated from the cooling board 42 restricts the protrusion of the conductive terminal 43 attached to the heater 8 urged by the compression spring 63 via the heater support member 62 from the upper surface of the cooling board 42. Determined by length.

The molding material H to be laminated according to the present invention
For example, as in the case of laminating a film-like photoresist forming layer composed of a support film and a photosensitive layer on a laminated substrate or a flexible laminated substrate, a plurality of plate-like, continuous sheet-like or film-like materials are used. Alternatively, a film made of a thermoplastic or thermosetting resin or a film-like material and a substrate such as a wood plate, a metal plate, a sheet made of an organic material, an inorganic material, or a composite material may be attached. In addition, the lamination of the film-like materials may be the same or different and may be performed in two or more layers, and the lamination of the film-like material on the substrate may be performed on only one side of the substrate or on both sides. It may be performed.

Next, the operation of the vacuum laminating apparatus of the present invention configured as described above will be described with reference to FIGS. As shown in FIG. 1, first, the upper plate 1 and the lower plate 2 are in a state of being far away from each other and the molding material accommodating space S is open. In this state, the molding material H is carried into the inside of the frame 5. The molding materials H to be laminated are supported by a continuous film (not shown) and carried between the film bodies 3 and 4 inside the frame body 5 in a state of being close to or separated from each other, or It is carried in with only the molding material H having a length that can be accommodated inside the frame body 5 and placed on the film body 4. Also,
If the molding materials H are not superimposed on each other, the same or different molding materials can be carried into the frame 5 as necessary.

At this time, the space J and the space K are evacuated by sucking the internal air by the membrane operating means through the membrane operating passages 31 and 41, and the membranes 3 and 4 are heated by the heaters 7 and 4. 8 and are closely attached to the cooling boards 32 and 42.
Accordingly, the heater 7 resists its own weight, and the heater 8 resists the urging of the compression spring 63, and each of the cooling plates 3
2 and 42. The close contact of the film bodies 3 and 4 may be performed by evacuation in the molding material storage space S described below. Cooling fluid such as cooling water is constantly supplied to the passages 32b and 42b in the cooling boards 32 and 42 via cooling fluid supply / discharge pipes 38 and 48, and is circulated and discharged.

Next, as shown in FIG. 2, the upper frame 1A and the lower frame 2
When these are brought into contact with each other, the film bodies 3 and 4 and the frame body 5 form an airtight molding material accommodation space S. At this time, the deaeration passage 5
0 is communicated with the atmosphere, and the film bodies 3 and 4 are heaters 7 and 8.
Through the cooling plates 32 and 42 respectively.

Subsequently, as shown in FIG. 3, the air in the molding material accommodating space S is sucked through the notch 52, the passage 51 and the deaeration passage 50 by driving a decompression means such as a vacuum pump. Vacuum. The evacuation in the molding material accommodation space S is continued until the lamination molding is completed, the upper plate 1 and the lower plate 2 are moved away from each other, and the molding material accommodation space S is opened again. At this time, if the reduced pressure in the molding material storage space S becomes substantially equal to the reduced pressure in the similarly evacuated space J and space K, the heater 7 uses its own weight and the heater 8
Are respectively biased by the compression spring 63,
4 while maintaining a state in contact with the back surface of the cooling plate 4 so as to form a predetermined space from the cooling plates 32 and 42. However, the conductive terminals 3 attached to the heaters 7, 8
The guide holes 32a, 4 are controlled in such a manner that the movement of the guide holes 32a, 4 is prevented from falling off the cooling boards 32, 42.
At this point, the molding material H is not inadvertently pressed by the film bodies 3 and 4 because it is inserted through 2a.

From this state, as shown in FIG. 4, the space J, J through the membrane operation passages 31 and 41 by the membrane operation means.
When K is communicated with the atmosphere or compressed air is similarly supplied to the spaces J and K at a predetermined pressure, the compressed air supplied to the spaces J and K is reduced by or in addition to the reduced pressure in the molding material storage space S. Due to the pressure, the film bodies 3 and 4 bulge out from each other so as to reduce the volume of the molding material accommodation space S, and the molding material H is pressed. At this time, in this embodiment, the piston rod 14a of the drive cylinder 14 is pressed to such an extent that the heater 8 is urged by the compression spring 63 and can be kept separated from the cooling plate 42 by a predetermined distance.
Is appropriately extended, and only the cooling plate 42 of the lower plate 2 is moved upward, whereby the compression spring 63 is urged by the compression spring 63 following the movement of the film body 4 swelled to press the molding material H. In addition, the heater 8 whose movement of the conductive terminal 43 is restricted is brought into close contact with the back surface of the film body 4. And the conductive plug 3
A plate-shaped conductor 37,
A direct current is supplied to the heaters 7 and 8 via 47 and the conductive terminals 33 and 43. The heaters 7 and 8 made of a stainless steel plate or the like are provided with conductive terminals 33 and
When a direct current is supplied from 43, heat is generated over the entire surface so as to rise to a temperature uniformly set by the electric resistance, and the molding material H pressed by the film bodies 3 and 4 is heated. Since the heaters 7, 8 are separated from the cooling boards 32, 42, which constantly supply and circulate the cooling fluid, by a predetermined distance, the heat capacity of the heaters 7, 8 can be extremely reduced without heat loss. Therefore, the thermal efficiency can be improved. The molding material H is pressed by the film bodies 3 and 4 and heated by the heaters 7 and 8, and the plurality of layers are fused and laminated.

Thereafter, as shown in FIG. 5, while the pressurization by the film bodies 3 and 4 is maintained, the power supply to the heaters 7 and 8 is stopped, and the piston rods 13a and 14a of both drive cylinders 13 and 14 are moved. The cooling boards 32 and 42 are brought into close contact with the back surfaces of the film bodies 3 and 4 via the heaters 7 and 8 by the extension driving. The laminated product H 'thus fused is cooled so that each layer thereof uniformly decreases in temperature and thermally contracts while being pressed between the film bodies 3 and 4. The state of cooling the laminate H ′ is maintained for a predetermined time. Therefore, the laminate H ′ can be stabilized without forming wrinkles, and the molding cycle can be shortened. In addition, since the heat of the heaters 7 and 8 is removed together with the cooling of the laminated product H ′, the plasticizing and curing of the laminated product H ′ progresses excessively due to the residual heat of the heaters 7 and 8, and the next laminating cycle Therefore, the molding material H is heated before the pressure is applied, so that wrinkles are not generated and the accuracy of positioning of each layer is not reduced.

After the laminate H 'is cooled and stabilized, the piston rods 13a, 14a of both drive cylinders 13, 14 are retracted in order to stop pressurization of the laminate by the film body 3 and the film body 4. While being driven, air is supplied from the passage 5a of the frame 5 through the deaeration passage 50 by the decompression means to make the molding material accommodation space S communicate with the atmosphere, and the upper plate 1 and the lower plate 2
Are separated from each other to open the molding material accommodation space S,
Unload the laminate H ′. Simultaneously with the air communication with the molding material accommodating space S, the membrane operating passage 31 and
The air in the spaces J and K is sucked through the vacuum chamber 41 and evacuated, and the membranes 3 and 4 are brought into close contact with the cooling boards 32 and 42 via the heaters 7 and 8 as shown in FIG. , Preparing for the next lamination cycle. In addition, both drive cylinders 13 and 14 are
In this embodiment, the piston rod 13
Although the description has been given of the case where the double-acting members a and 14a can be extended and retracted, the present invention is not limited to this embodiment. The pistons 13a, 14 of the drive cylinders 13, 14 are brought into close contact with the membranes 3, 4 by evacuation of the inside.
Retraction of a may be performed.

[0035]

According to the first aspect of the present invention, the heating means provided adjacent to the upper surface and the lower surface of each of the film bodies, respectively, and the heating means and the upper plate and the lower plate are provided. Cooling means respectively provided between the opposing surfaces, decompression means for evacuating the molding material storage space, and at any timing so that the molding material in the evacuated molding material storage space is not pressurized. In order to prevent swelling of the membrane, or to swell each membrane so as to pressurize the molding material in the molding material accommodation space, the membrane operating means for operating the membrane and the heating means are cooled. When the molding material is heated by a simple configuration including a holding mechanism that holds the member at a predetermined interval or more from the means and moves along with the movement of the film so as to be in close contact with each film, respectively. The heating means is separated from the cooling means by a predetermined distance In the state, the close contact to follow moving the membrane body, it is possible to improve the thermal efficiency of the heating means,
Also, when cooling the molding material, the molding material of the laminate is uniformly cooled because the laminate is sandwiched and cooled between the cooling means via the film body and the heating means by the operation of the cooling means operation mechanism. Therefore, a vacuum laminating apparatus capable of efficiently heating a molding material and laminating each layer can be provided, since the temperature can be reduced and heat shrinkage can be performed without forming wrinkles.

According to the second aspect of the present invention, in the first aspect of the present invention, further, at any timing, the film is brought into close contact with each film body via a heating means against the interval maintaining mechanism. By providing a cooling means operating mechanism for operating each cooling means in a controllable manner, after the molding material is pressed and heated and laminated, while maintaining the pressure by the film body,
The heating by the heating means is stopped, and the cooling means is cooled by sandwiching the laminated product between the cooling means via the film body and the heating means by the cooling means operating mechanism so as to uniformly lower the temperature of each layer of the laminated product. Since heat shrinkage and stabilization can be achieved without forming wrinkles, a vacuum laminating apparatus capable of efficiently cooling and stabilizing a laminated product can be provided.

[Brief description of the drawings]

FIG. 1 shows an embodiment of a vacuum laminating apparatus according to the present invention;
It is sectional drawing which shows the state which opened the molding material accommodation space.

FIG. 2 is a cross-sectional view showing a state in which an upper plate and a lower plate are relatively close to each other to form a molding material accommodation space from the state of FIG.

FIG. 3 is a cross-sectional view showing a state in which a molding material accommodating space is evacuated from the state of FIG.

FIG. 4 is a cross-sectional view showing a state in which a molding material is pressed and heated from the state shown in FIG.

FIG. 5 is a cross-sectional view showing a state where a molding material is pressurized and cooled from the state shown in FIG.

FIG. 6 is a partial plan view showing a conductive terminal for supplying power to a cooling board and a heater, a plate-shaped conductor, and a conductive plug on the upper plate side.

FIG. 7 is a partially enlarged sectional view showing a lower plate-side interval holding mechanism.

DESCRIPTION OF SYMBOLS 1 Upper plate 2 Lower plate 3 Film body 4 Film body 5 Frame 7 Heating means 8 Heating means 9 Cooling means 10 Cooling means 11 Spacing mechanism 12 Spacing mechanism 13 Cooling means operating mechanism 14 Cooling means operating mechanism H molding material S molding space

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B29L 31:34

Claims (2)

[Claims] 1. An upper plate and a lower plate which are disposed so as to be able to approach and retreat to each other, a film body provided on each of opposing surfaces of the upper plate and the lower plate, and an upper plate and a lower plate which are close to each other. When formed, a frame body forming a molding material accommodating space for accommodating the molding material between the two film bodies, and each of the film bodies was provided adjacent to the upper plate and the lower plate facing the opposite surface side. Heating means, cooling means provided between each heating means and the opposing surfaces of the upper plate and the lower plate, decompression means for evacuating the molding material accommodating space, and forming at a desired timing The swelling of each film body is prevented so that the molding material in the material accommodation space is not pressed,
Alternatively, the film body operating means for operating the film body to expand each film body so as to pressurize the formed material in the formed material accommodating space, and the heating means are separated from the cooling means at predetermined intervals or more. And an interval holding mechanism that moves to follow the movement of the membrane so as to be in close contact with each of the membranes,
A vacuum laminating apparatus comprising: 2. A cooling means operating mechanism for controlling each cooling means in a controllable manner so that the cooling means is brought into close contact with each film body via a heating means at an arbitrary timing against the spacing mechanism. The vacuum laminating apparatus according to claim 1, wherein: