JP2001142573A - Electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem where an element is damaged since a device becomes hot because the heat generation of a heat generating element is increased with the acceleration, etc., of a CPU, etc., and a conventional cooling system becomes insufficient for cooling the device. SOLUTION: A channel is formed at a radiation panel to enclose a cooling liquid and this cooling liquid is circulated by a pump. Further, a fan is installed under the radiation panel to discharge heat inside of a first casing to outside air. Thus, a part of heat generated from plural heat generating elements inside of the first casing is dispersed to the whole area of the radiation panel and a part of the heat of this radiation panel is radiated to outside air by the fan. Therefore, since a part of heat generated from a CPU, etc., is forcedly dispersed and radiated, the CPU generating heat is cooled speedily to a prescribed temperature. Further, the reliability and performance of a notebook-sized personal computer are kept to be high.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a first housing housing a wiring board on which a heating element is mounted, a keyboard, a storage device, and the like, and a housing housing a display device and the like, and being rolled up with the first housing. The present invention relates to an electronic device including a second housing movably mounted, and more particularly to a structure for dispersing and radiating heat from a heating element.

[0002]

2. Description of the Related Art As a conventional technique, Japanese Patent Application Laid-Open No. 8-2867 is disclosed.
No. 83 discloses that a heat sink is installed at the bottom of the first housing in which the heating element is mounted, and a part of the heat of the heating element is transmitted to the heat sink at the bottom of the housing and the bottom of the keyboard. Dissipates heat and dissipates heat. Also, Japanese Patent Application Laid-Open No. 8-263162
Japanese Patent Application Laid-Open Publication No. H11-163873 discloses an example in which a fan is mounted in a housing to cool a heating element. Further, JP-A-10-160
Japanese Patent No. 367 discloses an example in which a part of heat of a heat generating element is radiated by a radiator plate in which a working fluid condensable in two layers is sealed.

[0003]

In an electronic device typified by a portable personal computer or the like, the speed of arithmetic processing is increased, but the elements generate heat. Further, the housing is required to be thinner and lighter. For this reason, it is necessary to cool the element while taking into account the reduction in thickness and weight.

In the prior art, a part of the heat from the heat generating element is transferred to a heat radiating plate provided at the bottom of the first housing and a heat radiating plate provided at the back of the first housing to radiate heat. There are a method, a method of radiating heat by forced cooling by a fan, and a method of radiating heat by a radiator plate in which a two-layer condensable working fluid is sealed. This cools the CPU (central processing unit) that generates heat.

[0005] However, in a CPU in which the arithmetic processing speed is further increased, the amount of heat generated is large, and the CPU cannot be sufficiently cooled even by the above-described method.

An object of the present invention is to provide a small cooling structure in the portable electronic device, which can sufficiently cool even if an element having a large calorific value is used.

[0007]

In order to achieve the above object, the present invention has the following configuration.

[0008] A first housing on which a wiring board on which a plurality of heating elements are mounted, a keyboard, a storage device, and the like, a display device, and the like are housed, and the second housing is rotatably mounted on the first housing by a hinge. In the electronic device having the above-mentioned housing, a pump for circulating the cooling water, a radiator plate cooled by the circulating of the cooling water, and a fan for supplying the cooling air are provided inside the first housing. As a result, part of the heat generated from the plurality of heat generating elements inside the first housing is cooled through the radiator plate through which the cooling water circulates. Further, the heat sink is cooled by cooling air supplied by a fan.

[0009]

Embodiments of the present invention will be described below. FIG. 1 is a perspective view of a thin electronic device represented by a portable personal computer or the like, and shows a state in which a keyboard unit is removed for explanation.

This thin electronic device is roughly divided into a main body central section A having a central function such as a CPU, and a display section B for displaying a result processed by the main body central section A. The display section B also has a role as a lid of the apparatus, and can be opened and closed by a hinge 8.

The central part A of the main body includes a sub-wiring board 2 on which an element 1 (hereinafter, referred to as CPU 1) having a particularly large heat generation such as a CPU is mounted, and a main wiring board on which the sub-wiring board 2 and a plurality of elements are mounted. It comprises a substrate 3, a plurality of keys 4, and a first housing 10 in which the sub-wiring board 2, the main wiring board 3 and the like are housed, and the plurality of keys 4 are arranged on the upper surface. The keys 4 are arranged on the upper surface of the keyboard 5. The keyboard 5 integrates an upper keyboard 5a for the purpose of arranging the plurality of keys 4 at predetermined positions and a lower keyboard 5b for the main purpose of heat dissipation and heat transfer. For example, a material such as Si rubber mixed with a filler such as aluminum oxide) and a radiator plate 6
And is thermally connected. Although a detailed description is omitted here, a floppy disk or a CD is provided on the first housing side.
And a driving device for driving the motor.

The display section B comprises a display device 21 and a second housing 20 for accommodating the display device 21. The second housing 20 is connected to the first housing 10 via a hinge 8 and both housings. The bodies are pivotally mounted so that the bodies fold over one another.

FIG. 2 is a sectional view of a thin electronic device according to the present invention.

The CPU 1 is mounted on the sub-wiring board 2. A connector 12 is provided on each of the sub-wiring board 2 and the main wiring board 3, and the sub-wiring board 2 and the main wiring board 3 are electrically connected via the connector 12. Main wiring board 3 to which sub-wiring board 2 is connected
Is attached to the first housing 10 by screwing a screw 9 into a boss 11 installed on the first housing 10. Although not shown, the keyboard 5, the display device 21, and the fan 13 are also electrically connected to the main wiring board 3. On the main wiring board 3, a processing performance control circuit (for example, a clock frequency variable circuit) of the CPU 1 and a CPU
Control circuit for the fan 13 linked with the processing performance control circuit 1
(For example, fan speed control and fan on / off control)
And are included.

Sub-wiring board 2 to which CPU 1 is attached
A flexible heat conductive member 7 is installed on the upper surface of the device, a radiator plate 6 is provided thereon, and a keyboard 5 is provided thereon.
Part of the heat generated by the CPU 1 is radiated from the surface of the key 4 to the outside air via the sub-wiring board 2, the flexible heat conductive member 7, the radiator plate 6, and the keyboard 5. Part of the heat generated by the CPU 1 is radiated from the bottom surface of the first housing 10 to the outside air via the sub-wiring board 2, the screw 9, and the boss 11. Further, part of the heat generated in the CPU 1 and stored in the first housing 10 is radiated to the outside air through the ventilation holes 14 provided in the first housing 10 by the ventilation action of the fan 13. .

FIG. 3 is a perspective view of components around the CPU 1 and the heat radiating plate 6, and shows a state where the components are separated for explanation. At the time of mounting, the sub-wiring board 2 and the flexible heat conductive member 7
And the flexible heat conductive member 7 and the heat radiating plate 6 come into contact with each other, and the CPU 1 attached to the sub-wiring board 2 and the heat radiating plate 6 are thermally connected. A flow path 15 through which the cooling liquid flows is formed inside the heat sink 6. Tubes 16 are connected to both ends of the flow path 15 of the heat sink 6. The tube 16 is connected to a pump 30. Heat sink 6
The coolant is sealed in the flow path 15, the tube 16, and the pump 30. By operating the pump 30, the sealed coolant is forcibly circulated. On the other hand, below the radiator plate 6, a fan 13 is provided, and by operating the fan 13, a part of the heat of the radiator plate 6 is forcibly discharged to the outside air.

FIG. 4 is a sectional view showing an example of the pump used in this embodiment.

This pump is an internal gear pump, and has an external gear 3
An internal gear 32 is inscribed in 1, and the internal gear 32 is connected to a motor 34 by a shaft 33. Seal member 35
Is fixed to the external gear 31 and the motor 34 and the sealing member 35
Is fixed by a fixing member 36. By rotating the motor 34, the internal gear 32 rotates, and the coolant is sucked through the suction port 37 and discharged from the discharge port 38. Further, the seal member 35 prevents liquid leakage when the pump is operating.

As a small pump, a scroll type micro pump or the like can be considered in addition to the present embodiment.
Any pump having any function may be used as long as it has a function of circulating the cooling liquid and is small and can be stored in the housing.

With the above configuration, a part of the heat from the CPU 1 is transmitted to the heat radiating plate 6 via the flexible heat conducting member 7,
The radiator plate 6 is cooled by circulation of a cooling liquid. further,
A part of the heat of the heat radiating plate 6 is exhausted by the fan 13 to the outside air of the housing, and the CPU 1 is cooled.

In this embodiment, the material of the radiator plate is aluminum, which has good thermal conductivity and is lightweight, but other materials may be used. Although the cooling liquid sealed in the flow channel is water, other cooling liquids may be used.

Further, in this configuration, the heat radiating plate 6 is provided on the keyboard side, but a heat radiating plate may be provided on the housing side in consideration of leakage of the cooling liquid. However, in this case, it is necessary to devise the installation position of the cooling fan.

[0023]

According to the present invention, a cooling liquid is circulated through a flow path provided in a heat sink by a pump, whereby a CPU is provided.
And other heating elements can be cooled. In addition, since the radiator plate is cooled by the fan provided below the radiator plate, efficient cooling becomes possible.

[Brief description of the drawings]

FIG. 1 is an exemplary perspective view showing an electronic device according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view illustrating the electronic device according to the embodiment of the present invention.

FIG. 3 is a perspective view showing a component configuration of a heat discharge path in one embodiment of the present invention.

FIG. 4 is a sectional view showing a configuration of a pump in one embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... CPU, 2 ... Sub wiring board, 3 ... Main wiring board,
4 key, 5 keyboard, 5a upper keyboard, 5b
... lower keyboard, 6 ... heat sink, 7 ... flexible heat conductive member, 8
... Hinges, 9 screws, 10 first housing, 11 bosses,
12 connector, 13 fan, 14 vent, 15
Flow path, 16 tube, 20 second casing, 21 display device, 30 pump, 31 external gear, 32 internal gear, 3
3 ... shaft, 34 ... motor, 35 ... seal member, 36
... fixing member, 37 ... suction port, 38 ... discharge port.

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Yoshihiro Kondo 502, Kandate-cho, Tsuchiura-shi, Ibaraki Pref. Machinery Research Laboratories, Hitachi, Ltd. Inside the Machinery Research Laboratory (72) Inventor Atsushi Ishikawa 502 Kandachi-cho, Tsuchiura-city, Ibaraki Pref. Inside the Machine Research Laboratory, Hitachi, Ltd. (72) Takeshi Nakagawa 810 Shimo-Imaizumi, Hitachi, Ltd.PC Division, Hitachi, Ltd. Term (reference) 5E322 AA05 DA01

Claims (2)

[Claims] An electronic circuit including a heating element such as a CPU, a heat conductive member thermally connected to the heating element, a storage device and the like are housed therein, and a first housing having a keyboard mounted on an upper surface thereof. In an electronic device in which a second housing for displaying a processing result by the CPU is rotatably attached to a body, a pump for circulating a coolant in the first housing and a circulation flow path for the coolant are provided. An electronic device, comprising a built-in heat sink, and dispersing and radiating a part of heat generated from a heat generating element such as the CPU from the heat sink. 2. The electronic device according to claim 1, wherein a fan for supplying cooling air is provided in said first housing, and a part of heat of said heat radiating plate is radiated to outside air. Electronic devices.