JP2001143840A - Socket for electronic components - Google Patents

Abstract

[PROBLEMS] To easily mount and replace an electronic component such as a package module in which a semiconductor chip or the like is integrated, and to reduce the thickness. An elastic engaging leg piece (4a) temporarily fixed to an engaging hole (2b) of a board (2), a tongue piece (4b) soldered to a fixing pad (2c) of the board (2), and a package on a metal plate body (4) of a socket (1). And a resilient holding piece (6) having an engaging claw (6a) for engaging the shoulder of the module (3). The synthetic resin holder 5 of the conductive contact unit 5 is integrated with the plate-shaped main body by molding. [Effect] The socket can be fixed to the substrate by solder reflow, the package module can be easily mounted and replaced at the time of version upgrade by the resilient holding pieces, and furthermore, the metal plate-shaped main body and the synthetic resin holder can be connected. Due to the double structure, the strength is high and the holder (socket) can be made thin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component socket used for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art Conventionally, to mount a semiconductor chip or the like on a motherboard, a package module or the like as an electronic component on which the semiconductor chip or the like is mounted is directly soldered to the motherboard.

[0003] However, there are various types of package modules as described above, and there are various types of personal computers as products, some of which include package modules as standard equipment and some of which do not. . Therefore, a user who purchases a personal computer that does not have a package module as standard equipment will do so later if it becomes necessary to equip a new or different package module.

[0004]

As described above, when it becomes necessary to equip the package module on the user side, when the pins for connecting to the motherboard are like solder balls arranged on the bottom of the package module. However, there has been a problem that it is extremely difficult or impossible to solder the package module on the user side.

[0005]

SUMMARY OF THE INVENTION In order to solve these problems, it is possible to easily mount and replace electronic components such as a package module in which a semiconductor chip and the like are integrated and to reduce the thickness. In the present invention, an electronic component socket for mounting an electronic component on a substrate, having a plate-shaped body formed in a shape that can be placed on the substrate, the plate-shaped body, An electronic component holding means for holding and detachable the electronic component, and a connector means for making electrical contact with the substrate by making electrical contact with the electronic component.

According to this, in the socket interposed between the electronic component and the board and electrically connecting the both, the electronic component holding means for attaching and detaching the electronic component is provided, so that the mounting of the electronic component is easy. And can be exchanged.

[0007] Further, the plate-shaped main body further includes at least one of a temporary fixing means for temporarily fixing to the substrate in the above-mentioned mounted state and a solder fixing portion to be soldered to the substrate. Since the socket can be temporarily fixed to the board, when the connector means provided on the socket is soldered to the board by, for example, reflow, the socket can be simultaneously soldered and fixed to the board.

The temporary fixing means comprises an elastic engaging claw projecting from the plate-shaped main body toward the substrate and capable of elastically compressing and deforming, and for inserting the elastic engaging claw into the substrate. According to the provision of the holes, the elastic engagement claws are press-fitted into the holes, and the plate-shaped main body is temporarily fixed to the substrate. Can be.

Further, the connector means has a resin holder for receiving a conductive contact for electrically connecting the substrate and the electronic component, and at least one of the plate-shaped main body and the holder. According to one of the above, the thermal expansion / deformation permitting means for permitting a thermal expansion / deformation difference between the plate-shaped main body and the holder or between the substrate and the substrate is provided. Accordingly, even if the holder is made as thin as possible, the strength does not decrease, and even if a difference in thermal expansion deformation occurs between the holder and the substrate, it can be tolerated.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to specific examples shown in the accompanying drawings.

FIG. 1 is a perspective view showing a mounted state of an electronic component socket to which the present invention is applied, FIG. 2 is an enlarged side sectional view of a main part showing the mounted state, and FIG. FIG.

As shown in FIG. 1, the socket 1
It is mounted on a substrate 2, and for example, a package module 3 as an electronic component is mounted thereon for use. In the package module 3, a semiconductor chip is sealed with a synthetic resin material, and a plurality of connection terminals 3a are provided on the back surface as shown in FIG. The terminals 3 a of the package module 3 and the wiring pads 2 a formed as a wiring pattern on the substrate 2 are electrically connected via the socket 1.

The socket 1 comprises a metal (for example, stainless steel) plate-shaped main body 4 and a conductive contact unit 5 as connector means. The conductive contact unit 5 is coaxially received in a hole penetrating in the thickness direction, as shown in FIG. 2, in a synthetic resin holder 5a integrated with the plate-shaped main body 4 by, for example, molding. The conductive needle-shaped body 5b made of a coil spring may be provided.

One of the conductive needles 5b (lower side in the figure)
Is soldered to the above-mentioned wiring pad 2a of the substrate 2, and the other (upper side in the figure) coil end is upwardly from the upper surface of the holder 5a so as to resiliently contact the terminal 3a of the package module 3. A predetermined amount protrudes toward it. Also, as shown in FIG. 1, it is preferable that the conductive needle-shaped body 5b can be temporarily fixed in the hole of the holder 5a before the holder 5a is mounted on the plate-shaped main body 4. For example, the soldering-side coil end of the conductive needle-shaped body 5b is slightly enlarged in diameter so as to be pressed into the hole.

As described above, in the socket 1 according to the present invention, the plate-shaped main body 4 is attached to the substrate 2 and mounted on the holder 5a of the conductive contact unit 5 integrated with the plate-shaped main body 4. The package module 3 placed is integrally held and made detachable. Next, the structure is shown.

In the plate-shaped main body 4 of the present socket, FIG.
In addition, as shown in FIG. 4, it has a rectangular shape, and in the illustrated example, four elastic engagement leg pieces 4a as temporary fixing means to the board 2 and fixing to the board 2 by soldering at appropriate positions on both long sides thereof. For example, in the illustrated example, six tongue pieces 4b and a pair of resilient holding pieces 6 are integrally formed in the illustrated example as electronic component holding means that is resiliently engaged with the package module 3. In order to strengthen the integration of the synthetic resin holder 5 by molding, a coupling piece portion embedded in the holder 5 as shown in FIG. 4c is formed.

The main surface of the plate-shaped main body 4 has an opening 4d for connecting each conductive needle-shaped body 5b to the wiring pad 2a. There are provided two slits 4e cut from both long sides in a direction perpendicular to the direction axis, and a plurality of ribs 4f disposed at appropriate places on the flat portion. The slits 4e are for allowing a difference in thermal expansion deformation between the metal plate-shaped main body 4 and the synthetic resin holder 5 and between the substrate 2 and the ribs 4f. This is for compensating for a decrease in strength due to the above.

The socket 5 is integrated with the plate-shaped main body 4 formed as described above by, for example, a mold to form a socket 1. As shown in FIG.
At this time, each elastic engaging leg piece 4a of the plate-shaped main body 4 is inserted into each engaging hole 2b provided in advance corresponding to the substrate 2.

The elastic engagement leg piece 4a in the illustrated example is composed of a pair of U-shaped pieces as shown in FIG.
The elastic deformation of both U-shaped pieces inserted into the
Is resiliently engaged with. Thereby, socket 1
The (plate-shaped main body 4) is temporarily fixed to the substrate 2. In addition, the substrate 2
As shown in FIG. 6, the outer side edges of both U-shaped pieces of the elastic engaging leg pieces 4a are gently projecting outward in the radial direction of the engaging holes 2b so as to be able to cope with the difference in thickness of the elastic engaging leg pieces 4a. It is formed in a chevron shape.

Next, for example, a solder paste is applied to the tongue piece 4b, and the board 2 with the socket 1 temporarily fixed is passed through a reflow furnace, so that the tongue piece 4b and the tongue piece 4b are provided on the board 2. The fixing pad 2c is soldered,
Thereby, the socket 1 is completely fixed to the substrate 2. At the same time, as described above, the solder paste is also applied to the lower coil end of the conductive needle 5b, so that the conductive needle 5b and the wiring pad 2a are soldered (W in FIG. 2). You.

Then, as shown in FIG. 1, the package module 3 is placed on the socket 1 (holder 5).
As shown in FIG. 7A, the resilient holding piece 6 is provided with an engagement claw 6a cut and raised so as to extend obliquely downward toward the inside of the socket 1.
The space between the engaging claws 6a of the two resilient holding pieces 6 provided to face each other is slightly shorter than the width of the package module 3.

Accordingly, when the package module 3 is mounted from above the socket 1, the two resilient engaging pieces 6 are pushed out and when the package module 3 is mounted on the holder 5, as shown in FIG. The pawl 6a is adapted to engage with the shoulder of the package module 3. In order to lengthen the effective engagement portion of the engaging claw 6a, both side edges in the width direction of the engaging claw 6a are bent at substantially right angles. When it becomes necessary to replace the upgraded package module, the two resilient engaging pieces 6 are deformed so that the opposing engaging claws 6 a escape to the outside of the package module 3. The combined state is released, and the package module can be easily replaced.

In the illustrated example, since the socket 1 has a double structure of the metal plate-shaped main body 1 and the synthetic resin holder 5, the holder 5 can be made as thin as possible without losing its strength. The thickness of the socket 1 can be reduced. Further, a rib 4f is provided to prevent warpage or the like.

Although the holder 5 is molded on the plate-shaped main body 4 in the illustrated example, it may be bonded.
In any case, in the repetition of high and low temperatures during use, warpage, bending, cracks, and misalignment due to differences in the coefficient of thermal expansion between the plate-shaped main body 4 and the holder 5 and the substrate occur. According to the illustrated example, the slit 4e is provided as described above to absorb the difference in thermal expansion, but the same effect can be obtained by providing the slit on the holder 5 side (or both sides). I can play.

Further, according to the illustrated example, the package module 3 is mounted from above the socket 1, and the engaging claws 6a are engaged with the shoulders of the package module 3 at a minimum. For this reason, the upper surface of the package module is widely opened, the heat radiation effect is large, and heat storage can be prevented.

[0026]

As described above, according to the present invention, the electronic component holding means for detachably mounting the electronic component is provided, so that the mounting of the electronic component is easy and the socket can be temporarily fixed to the substrate. When the connector means provided on the socket is soldered to the board side by, for example, reflow, the socket can be soldered simultaneously and fixed to the board. Further, even when it becomes necessary to replace the upgraded electronic component, only the electronic component can be replaced with one touch, so that it is possible to avoid a situation in which the entire motherboard is replaced as in the related art.

Further, since the temporary fixing means comprises an elastic engaging claw which can be elastically compressed and deformed, the temporary fixing by press-fitting can be performed only by inserting into the hole provided in the substrate. It is possible to correspond to. Also, when the connector means has a synthetic resin holder, it has a double structure with a metal plate-shaped main body, so that the strength does not decrease even if the holder is made as thin as possible, and thermal expansion between the two. Even if a deformation difference occurs, it can be tolerated, and the thickness of the socket can be reduced as much as possible.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a mounted state of an electronic component socket to which the present invention is applied.

FIG. 2 is an enlarged sectional side view of a main part of the socket, taken along line II-II in FIG.

FIG. 3 is an exploded perspective view of the socket.

FIG. 4 is a rear view of the plate-shaped main body.

FIG. 5 is an enlarged side sectional view of an essential part taken along the line VV of FIG. 1;

FIG. 6 is an enlarged view showing the shape of the elastic engagement leg piece, as viewed from the arrow VI line in FIG. 3;

FIG. 7A is a diagram illustrating a mounting procedure of a package module, and FIG. 7B is a diagram illustrating a state after the mounting.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Socket 2 Substrate, 2a Wiring pad, 2b Engagement hole 3 Package module, 3a Connection terminal 4 Plate-shaped main body, 4a Elastic engagement leg piece, 4b Tongue piece, 4c
Connection piece 4d Opening 4e Slit 4f Rib 5 Conductive contact unit 5a Holder 5b Conductive needle 6 Resilient holding piece 6a Engagement claw

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E021 FA05 FB03 FB14 FC06 FC29 FC31 FC34 FC36 FC40 HC08 HC31 5E024 CA13 CB01 5E077 BB23 BB31 CC22 CC26 CC27 DD01 DD17 GG03 GG05 JJ05 JJ12 JJ20 JJ24

Claims (4)

[Claims] An electronic component socket for mounting an electronic component on a substrate, comprising a plate-shaped main body formed in a shape mountable on the substrate, wherein the plate-shaped main body is an electronic component. An electronic component holding means for holding and detaching the electronic component, and a connector means for making electrical contact with the substrate by making electrical contact with the electronic component. Socket. 2. The method according to claim 1, wherein the plate-shaped main body further includes at least one of a temporary fixing unit for temporarily fixing the substrate in the mounted state, and a solder fixing part to be soldered to the substrate. The electronic component socket according to claim 1, wherein: 3. The temporary fixing means comprises an elastic engaging claw projecting from the plate-shaped main body toward the substrate and elastically compressively deformable, and for inserting the elastic engaging claw into the substrate. Make a hole,
The electronic component socket according to claim 2, wherein the elastic engaging claw is press-fitted into the hole to temporarily fix the plate-shaped main body to the substrate. 4. The connector means has a resin holder for receiving a conductive contact for electrically connecting the substrate and the electronic component, and at least one of the plate-shaped main body and the holder. The thermal expansion / deformation permitting means for permitting a thermal expansion / deformation difference between the plate-shaped main body and the holder or between the plate-shaped body and the substrate is provided on one of the sides. Socket for electronic components.