JP2001163936A - Resin composition, solder resist resin composition and their cured products - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition which can provide a cured product excellent in flexibility, soldering-heat resistance, heat deterioration resistance, electroless gold plating resistance, and is developable by an organic solvent or a dilute alkali solution and suitable for a solder resist and an interlayer insulating layer. SOLUTION: The resin composition comprises a specific oligomer (A), obtained by reacting a specific polyimide precursor bearing a specific terminal acid anhydride group with a polyol compound (b) as an optional component and an ethylenically unsaturated group-containing polyhydroxy compound (c), and a diluent (B).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin composition containing a specific oligomer (A) and a diluent (B), which is useful as a resin composition for printed wiring boards, and a cured product thereof. More specifically, it is useful as a solder resist for a flexible printed wiring board, a plating resist, and an interlayer electrical insulating material for a multilayer printed wiring board. It has excellent developability, and its cured film has adhesiveness, flexibility (flexibility), The present invention relates to a resin composition that gives a cured product excellent in solder heat resistance, chemical resistance, gold plating resistance, and the like, and a cured product thereof.

[0002]

2. Description of the Related Art A wiring (circuit) pattern formed on a substrate by screen printing or the like is not required in a soldering process performed when protecting a wiring (circuit) pattern from an external environment or mounting electronic components on a printed wiring board. In order to protect solder from adhering to any part, a protective layer called a cover coat or a solder mask is coated on a printed wiring board. Heretofore, as a solder resist ink used for such an application, a polyfunctional epoxy resin-based ink has been mainly used, but the resulting cured film has a problem that heat resistance is good but flexibility is low. Was. Therefore, such a solder resist ink is used for a rigid board which does not require the flexibility (flexibility) of a cured film, and the use thereof is limited, and a flexible printed wiring board (FPC) which has been increasingly used in recent years is used.
Is difficult to use.

Under the circumstances described above, many proposals have recently been made as resist inks having flexibility. For example, JP-A-2-269166 discloses a thermosetting solder resist ink comprising polyparabanic acid, an epoxy resin and a polar solvent, and JP-A-6-41485 discloses a thermal drying method comprising polyparabanic acid and a phenoxy resin as essential components. Molded solder resist inks have been proposed.
However, since these solder resists form a resist pattern by screen printing, it is difficult to respond to fine image formation associated with today's high density, for example, the line width of the screen is limited. . For this reason, in recent years, there has been proposed a photo-developing type as disclosed in JP-A-2-173949, JP-A-2-173750, JP-A-2-173951, and the like, but still has sufficient flexibility. It has not been done yet.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a fine image capable of coping with the high density of today's printed circuits, having excellent sensitivity to active energy rays, exposure and organic solvents, water or diluted alkaline aqueous solutions. The cured film obtained by heat-curing in a post-curing (post-curing) step is rich in flexibility, and has excellent solder heat resistance, heat deterioration resistance, electroless gold plating resistance, acid resistance, and water resistance. It is an object of the present invention to provide a resin composition suitable for an organic solvent, water or alkali developing type resist ink for a flexible printed wiring board which forms an excellent film, and a cured product thereof.

[0005]

Means for Solving the Problems In order to solve the above-mentioned problems, the present inventors have solved the above problem by using a resin composition containing a specific oligomer (A) and a diluent (B). Have been achieved, and the present invention has been completed. That is, according to the present invention, (1) a polyimide precursor (a) having a terminal anhydride group represented by the general formula (1)

[0006]

Embedded image

Wherein R ₁ represents a tetravalent organic group having 2 to 30 carbon atoms, R ₂ represents a divalent organic group having 2 to 240 carbon atoms, and n represents 0 or 1 or more. A resin composition comprising an oligomer (A) obtained by reacting a polyol compound (b) with an ethylenically unsaturated group-containing polyhydroxy compound (c) as an optional component, and a diluent (B). (2) oligomer (A) having a weight average molecular weight of 1,000
(1) The resin composition according to (1), wherein the acid value of the urethane oligomer (A) is 1 to 300 m.
(4) an epoxy resin (d) having two or more epoxy groups in one molecule and a monocarboxylic acid compound (e) having an ethylenically unsaturated group. (5) The resin composition according to any one of (1) to (3), which contains an unsaturated group-containing polycarboxylic acid resin (C) which is a reaction product with the polybasic acid anhydride (f). An epoxy resin (d) having two or more epoxy groups in one molecule is represented by the formula (2)

[0008]

Embedded image

(In the formula (2), X represents —CH ₂ — or —C
(CH ₃ ) ₂ —, n is an integer of 1 or more, and M represents a hydrogen atom or the following formula (G).

Embedded image

However, when n is 1, M represents the formula (G), and the remainder represents a hydrogen atom. The resin composition according to any one of (1) to (4), which is an epoxy resin (d) represented by the formula (1): (6) The resin composition according to any one of (1) to (5), which contains a photopolymerization initiator (D). (7) (1) to (6) containing a thermosetting component (E)
The resin composition according to any one of the above. (8) The resin composition according to any one of (1) to (7), which is used for a solder resist or an interlayer insulating layer of a printed wiring board. (9) A cured product of the resin composition according to any one of (1) to (8). (10) An article having the cured product layer according to (9). (11) The article according to (10), which is a printed wiring board.
About.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The resin composition of the present invention is a mixture of an oligomer (A) and a diluent (B). The molecular weight of the oligomer (A) used here is preferably 1,000 to 100,000 as a weight average molecular weight, and the acid value thereof is preferably 1 to 300 mgKOH / g.

The oligomer (A) used in the present invention comprises:
As described above, a polyimide precursor (a) having a terminal water anhydride group represented by the general formula (1), a polyol compound (b) as an optional component, and an ethylenically unsaturated group-containing polyhydroxy compound (c) And the reaction product of

The polyimide precursor having a terminal anhydride group, which is the component (a), can be represented, for example, by the general formula (1). The component (a) is, for example, of the general formula (3)

[0014]

Embedded image

(Wherein, R1 is 4 of 2-30 carbon atoms)
Dicarboxylic acid or a derivative thereof (a1) represented by the following general formula (4):

[0016]

Embedded image

(Wherein R ₂ has ₂ to 240 carbon atoms;
Preferably 2 to 60, and more preferably 2 to 30 divalent organic groups) in an organic solvent.

The tetracarboxylic dianhydride represented by the general formula (3) is not particularly limited. Examples thereof include pyromellitic acid, 3,3 ', 4,4'-benzophenonetetracarboxylic acid, and 3,3' , 4,4'-biphenyltetracarboxylic acid, 2,3 ', 3,4'-biphenyltetracarboxylic acid, 2,3', 4,4'-biphenyltetracarboxylic acid, 3,3 ', 4,4' -Diphenylethertetracarboxylic acid, 1,2,5,6-naphthalenetetracarboxylic acid, 2,3,6,7-naphthalenetetracarboxylic acid,
1,4,5,8-naphthalenetetracarboxylic acid, 3,
3 ', 4,4'-diphenylsulfonetetracarboxylic acid, m-terphenyl-3,3', 4,4'-tetracarboxylic acid, 1,1,1,3,3,3-hexafluoro-
2,2-bis (2,3- or 3,4-dicarboxyphenyl) propane, 2,2-bis (2,3- or 3,4-
Dicarboxyphenyl) propane, 2,2-bis [4 ′
-(2,3- or 3,4-dicarboxyphenoxy) phenyl] propane, 1,1,1,3,3,3-hexafluoro-2,2-bis [4 '-(2,3- or 3 , 4-
Dicarboxyphenoxy) phenyl] propane, 2,
3,6,7-anthracenetetracarboxylic acid, 1,2,2
7,8-phenanthrenetetracarboxylic acid, 4,4′-
Dianhydride of aromatic tetracarboxylic acid such as bis (2,3-dicarboxyphenoxy) diphenylmethaneethylene glycol bis (anhydrotrimellitate), the following general formula (5)

[0019]

Embedded image

(Wherein R ₅ and R ₆ are monovalent hydrocarbon groups,
Preferably a hydrocarbon group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 5 carbon atoms or an aryl group having 6 to 10 carbon atoms (phenyl group, tolyl group, naphthyl group);
Each may be the same or different, and “liter” is an integer of 1 or more), an aromatic tetracarboxylic dianhydride, cyclobutenetetracarboxylic acid, butanetetracarboxylic acid, 2,3,5, Examples thereof include aliphatic tetracarboxylic dianhydrides such as 6-pyridinetetracarboxylic acid and 3,4,9,10-pesolenetetracarboxylic acid, and these are used alone or in combination of two or more.

The diamine represented by the general formula (4) is not particularly limited. For example, 2,2-bis- [4-
(4-aminophenoxy) phenyl] propane, 2,2
-Bis- [3- (4-aminophenoxy) phenyl] propane, bis- [4- (4-aminophenoxy) phenyl] sulfone, bis- [4- (3-aminophenoxy)
Phenyl] sulfone, 2,2-bis- [4- (4-aminophenoxy) phenyl] hexafluoropropane,
2,2-bis- [4- (3-aminophenoxy) phenyl] hexafluoropropane, bis [4- (4-aminophenoxy)] biphenyl, bis [4- (3-aminophenoxy)] biphenyl, bis [1 -(4-aminophenoxy)] biphenyl, bis [1- (3-aminophenoxy)] biphenyl, bis [4- (4-aminophenoxy) phenyl] methane, bis [4- (3-aminophenoxy) phenyl] methane , Bis [4- (4-aminophenoxy) phenyl] ether, bis [4- (3-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy)] benzophenone, bis [4- (3-
Aminophenoxy)] benzophenone, bis [4- (4
-Aminophenoxy)] benzanilide, bis [4-
(3-aminophenoxy)] benzanilide, 9,9-
Bis [4- (4-aminophenoxy) phenyl] fluorene, 9,9-bis [4- (3-aminophenoxy) phenyl] fluorene, 4,4 ′-(or 3,4′-,
3,3 ′-, 2,4 ′-, 2,2 ′-) diaminodiphenyl ether, 4,4 ′ (or 3,4 ′-, 3,3 ′)
-, 2,4 '-, 2,2') diaminodiphenylmethane, 4,4'- (or 3,4 '-, 3,3'2,4'
−, 2,2 ′-) diaminodiphenylsulfone, 4,
4'- (or 3,4'-, 3,3'-, 2,4'-,
2,2 ′-) diaminodiphenyl sulfide, P-phenylenediamine, m-phenylenediamine, P-xylylenediamine, m-xylylenediamine, O-tolidine, O-tolidine sulfone, 4,4′methylene-bis-
(2,6-diethylaniline), 4,4′-methylene-
Bis- (2,6-diisopropylaniline), 2,4-
Diaminomesitylene, 1,5-diaminonaphthalene,
4,4'benzophenone diamine, 1,1,1,3
3,3-hexafluoro-2,2-bis (4-aminophenyl) propane, 3,3′-dimethyl-4,4′-diaminodiphenylmethane, 3,3 ′, 5,5′-tetramethyl-4, 4'-diaminodiphenylmethane, 2,2
-Bis (4-aminophenyl) propane, benzidine,
2,6-diaminopyridine, 3,3′-dimethoxybenzidine, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene,
4,4 ′-[1,4-phenylenebis (1-methylethylidene)] bisaniline, 4,4 ′-[1,3-phenylenebis (1-methylethylidene)] bisaniline, 3,
Aromatic diamines such as 5-diaminobenzoic acid, ethylenediamine, tetramethylenediamine, hexamethylenediamine, 1,2-diaminocyclohexane, the following general formula (6)

[0022]

Embedded image

(Wherein R ₇ and R _{8 each} have 1 to 10 carbon atoms)
Which may be the same or different, and R ₉ and R _{10 each} represent a monovalent hydrocarbon group (preferably having 1 to 10 carbon atoms), which may be the same or different. , M is an integer of 1 or more), 1,3-bis (aminomethyl) cyclohexane, Jeffamine D-230, D-400, D-200 manufactured by San Techno Chemical Co., Ltd. , D-40
00, ED-600, ED-900, ED-2001,
And aliphatic diamines such as polyoxyalkylene diamines such as EDR-148. These can be used alone or 2
Used in combination of more than one type.

The polyimide precursor having a terminal anhydride group, which is the component (a), can be produced by various known methods. For example, it can be obtained by reacting the tetracarboxylic anhydride with a diamine in an organic solvent used as required.

The amounts of the tetracarboxylic dianhydride represented by the general formula (3) and the diamine represented by the general formula (4) are 1.0 / 0.5 to 1.0 / 0.5. 99 (mol)
And particularly preferably 1.0 /
It is 0.5 to 1.0 to 0.9 (mol). The weight average molecular weight of the polyamide precursor (a) used in the present invention is preferably from 500 to 100,000.

The organic solvent used in the reaction for producing the polyimide precursor used in the present invention includes, for example, γ-
Lactones such as butyrolactone, γ-valerolactone, γ-caprolactone, γ-heptalactone, α-acetyl-γ-butyrolactone, ε-caprolactone; dioxane, 1,2-dimethoxymethane, diethylene glycol dimethyl (or diethyl, dipropyl, dibutyl) Ethers such as ether, triethylene glycol dimethyl (or diethyl, dipropyl, dibutyl) ether and tetraethylene glycol (or getyl, dipropyl, dibutyl) ether; carbonates such as ethylene carbonate and propylene carbonate; methyl ethyl ketone, methyl isobutyl ketone; Ketones such as cyclohexanone and acetophenone; phenol, cresol,
Phenols such as xylenol; esters such as ethyl acetate, butyl acetate, ethyl cellosolve acetate and butyl cellosolve acetate; hydrocarbons such as toluene, xylene, diethylbenzene and cyclohexane; halogenated hydrocarbons such as trichloroethane, tetrachloroethane and monochlorobenzene. Etc., but lactones and carbonates can be preferably used.

The amount of the organic solvent used is preferably 1 to 10 times (weight ratio) the polyimide precursor to be produced.

Examples of the polyol compound (b) include alkyl polyols, polyester polyols, polyether polyols, acrylic polyols, polybutadiene polyols, phenolic polyols and / or flame retardant polyols. Examples of the alkyl polyol include 1,4-butanediol, 1,6-hexanediol, 1,8-octanediol, neopentyl glycol, cyclohexanedimethanol, trimethylolpropane, and pentaerythritol.

Examples of the polyester polyol include a condensation type polyester polyol, an addition-polymerized polyester polyol, and a polycarbonate polyol. As the condensation type polyester polyol, ethylene glycol, propylene glycol, ethylene glycol,
1,4-butanediol, neopentyl glycol,
Diol compounds such as 1,6-hexanediol, 3-methyl-1,5-pentanediol, 1,9-nonanediol, 1,4-hexanedimethanol, dimer acid diol, and polyethylene glycol, and adipic acid, isophthalic acid, and terephthalic acid It is obtained by a condensation reaction with an organic polybasic acid such as acid or sebacic acid, and has a molecular weight of 100 to 100,00.
0 is preferred.

Examples of the addition-polymerized polyester polyol include polycaprolactone having a molecular weight of 100 to 100.
100,000 is preferred. Polycarbonate polyol is synthesized by direct phosgenation of polyol, transesterification with diphenyl carbonate, and the like, and preferably has a molecular weight of 100 to 100,000.

As the polyether polyol, PEG
, PPG-based, and PTG-based polyols. P
The EG-based polyol is obtained by subjecting ethylene oxide to addition polymerization using a compound having active hydrogen as a reaction initiator, and preferably has a molecular weight of 100 to 100,000. PP
The G-based polyol is obtained by subjecting propylene oxide to addition polymerization using a compound having active hydrogen as a reaction initiator, and preferably has a molecular weight of 100 to 100,000. PT
The G-based polyol is synthesized by cationic polymerization of tetrahydrofuran, and preferably has a molecular weight of 100 to 100,000.

Examples of the polyether polyol other than the above-mentioned polyether polyol include an ethylene oxide adduct or a propylene oxide adduct of bisphenol A, and the molecular weight is preferably 100 to 100,000.

As other polyols, (meth) acryl polyol which is a copolymer of a hydroxyl group-containing (meth) acrylate and another (meth) acrylic ester, and a copolymer of butadiene having a hydroxyl group at a terminal. Polybutadiene polyol, a phenolic polyol containing a phenol molecule in the molecule, an epoxy polyol, a flame-retardant polyol containing a phosphorus atom, a halogen atom and the like, and a molecular weight of 100 to 100,000. preferable.
These polyol compounds can be used alone or in combination of two or more.

Examples of the ethylenically unsaturated group-containing polyhydroxy compound (c) include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycerol di (meth) acrylate, and 4-hydroxybutyl ( (Meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate, caprolactone-modified 2-hydroxyethyl (meth) acrylate, pentaerythritol tri (meth) acrylate )
Acrylate, dipentaerythritol penta (meth)
Examples thereof include (meth) acrylate-based polyhydroxy compounds such as acrylate, and they can be used alone or in combination of two or more.

The oligomer (A) used in the present invention comprises:
For example, it can be manufactured as follows. First, a polyimide precursor (a) or a component (a) having a terminal anhydride group represented by the general formula (1) is reacted with a polyol compound (b) as an optional component to obtain a terminal anhydride group-containing reactant (I). And then reacting the ethylenically unsaturated group-containing polyhydroxy compound (c).

The terminal anhydride group-containing reactant (I) is used in an amount of 0.5 to 0.5 hydroxyl group of the polyol compound (b) based on 1 equivalent of the anhydride group of the polyimide precursor (a) having a terminal anhydride group.
It is preferable to react 0.99 equivalent. The reaction temperature of this esterification reaction is 60 to 150 ° C., and the reaction time is 1 to 10
Time is preferred.

Next, a polyimide precursor (a) having a terminal anhydride group or a reactant (I) having a terminal anhydride group is reacted with an ethylenically unsaturated group-containing polyhydroxy compound (c) to convert the oligomer (A). obtain. Component (c) is added in an amount of 1 to 1 to 1 equivalent of anhydride group of component (a) or reactant (I).
Preferably, 5 moles are reacted. The reaction temperature of the oligomerization reaction is usually from 100 to 100C, preferably from 50 to 90C. At the time of this reaction, the above-mentioned organic solvent or the following reactive diluent (B-2) may be added.

In the present invention, a diluent (B) is used. Specific examples of the diluent (B) include, for example, the above-mentioned organic solvent, butanol, octyl alcohol, ethylene glycol, glycerin, ethylene glycol monomethyl (or monoethyl) ether, triethylene glycol monomethyl (or monoethyl) ether, and tetraethylene glycol. Organic solvents (B-1) such as alcohols such as monomethyl (or monoethyl) ether, carbitol (meth) acrylate, phenoxyethyl (meth) acrylate, acryloyl monophorin, trimethylolpropane tri (meth) acrylate, and pentaerythritol Tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta and hexa (meth) acrylate; Proxy compound (d) and the like Agereraru.

The amount of the components (A) and (B) contained in the resin composition of the present invention is 10 (A) + (B) in total.
The content of (A) and (B) is preferably 10 to 90% by weight, and more preferably 20 to 80% by weight.
The content of (B) is preferably 10 to 90% by weight.

In the present invention, an unsaturated group-containing polycarboxylic acid resin (C) may be used. As described above, the unsaturated group-containing polycarboxylic acid resin (C) includes an epoxy resin (d) having two or more epoxy groups in one molecule and a monocarboxylic acid compound (e) having an ethylenically unsaturated group. It is a reaction product with polybasic acid anhydride (f).

The epoxy resin (d) having two or more epoxy groups in one molecule includes, for example, the above-mentioned general formula (2)
Epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, phenol
Glycidyl ethers such as novolak epoxy resin, cresol / novolak epoxy resin, trisphenolmethane epoxy resin, brominated epoxy resin, biquilenol epoxy resin, biphenol epoxy resin; 3,4-epoxy-6-methylcyclohexylmethyl A tree-type epoxy resin such as -3,4-epoxy-6-methylcyclohexanecarboxylate, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 1-epoxyethyl-3,4-epoxycyclohexane; Glycidyl esters such as diglycidyl phthalate, diglycidyl tetrahydrophthalate and glycidyl dimer; glycidylamines such as tetraglycidyl diaminodiphenylmethane ; The like heterocyclic epoxy resins such as triglycidyl isocyanurate, epoxy resins are preferably represented by the general formula (1).
Note that n in the general formula (2) is calculated from the epoxy equivalent.

The epoxy resin (d) represented by the general formula (2) can be obtained by reacting the alcoholic hydroxyl group of the starting epoxy compound in which M is a hydrogen atom with the epihalohydrin such as epichlorohydrin in the general formula (2). Can be. Raw material epoxy compounds are commercially available, for example, Epicoat series (Epicoat 1009,
1031: Yuka Shell Epoxy Co., Ltd.), Epicron Series (Epiclon N-3050, N-7050: Dainippon Ink & Chemicals, Inc.), DER Series (DE
Bisphenol A type epoxy resin such as R-642U, DER-673MF: manufactured by Dow Chemical Co., Ltd.), YD
Bisphenol F type epoxy resins such as F series (YDF-2004, 2007: manufactured by Toto Kasei Co., Ltd.) and the like.

The reaction between the starting epoxy compound and epihalohydrin is preferably carried out in the presence of dimethyl sulfoxide.
Done. The epihalohydrin may be used in an amount of 1 equivalent or more based on 1 equivalent of the alcoholic hydroxyl group in the raw material epoxy compound. However, when the amount exceeds 15 equivalents to 1 equivalent of the alcoholic hydroxyl group, the effect of increasing the amount is almost negligible, but the volumetric efficiency deteriorates.

In carrying out the reaction, an alkali metal hydroxide is used. As the alkali metal hydroxide, for example, caustic soda, caustic potash, lithium hydroxide, calcium hydroxide and the like can be used, but caustic soda is preferable. The amount of the alkali metal hydroxide used is determined based on the M
Is approximately 1 equivalent to 1 equivalent of an alcohol hydroxyl group to be epoxidized in a raw material epoxy compound in which is a hydrogen atom. When the entire amount of the alcoholic hydroxyl group of the raw material epoxy compound in which M of the compound represented by the formula (2) is a hydrogen atom is epoxidized, it may be used in excess, but 2 equivalents are used per equivalent of the alcoholic hydroxyl group. If it exceeds, the polymer tends to be slightly polymerized.

[0045] The reaction temperature is preferably from 30 to 100 ° C.
When the reaction temperature is lower than 30 ° C., the reaction becomes slow and a long-time reaction is required. If the reaction temperature exceeds 100 ° C., many side reactions occur, which is not preferable.

After completion of the reaction, excess epihalohydrin and dimethyl sulfoxide are distilled off under reduced pressure, and then the resulting resin is dissolved in an organic solvent, and a dehydrohalogenation reaction can be carried out with an alkali metal hydroxide.

The monocarboxylic acid compound (e) having an ethylenically unsaturated group includes, for example, (meth) acrylic acid, acrylic acid dimer and the like, and among them, (meth) acrylic acid is preferable.

The epoxy resin (e) is reacted with the monocarboxylic acid (f) having an ethylenically unsaturated group to obtain an epoxy (meth) acrylate compound. It is preferable to react 0.3 to 1.2 equivalents of the total amount of the carboxyl group of the component (f) to 1 equivalent of the epoxy group of the epoxy resin, and particularly preferably 0.9 to 1.05 equivalent. .

During or after the reaction, as a diluting solvent, aromatic hydrocarbons such as toluene and xylene; ethyl acetate;
Esters such as butyl acetate; ethers such as 1,4-dioxane and tetrahydrofuran; ketones such as methyl ethyl ketone and methyl isobutyl ketone; glycol derivatives such as butyl cellosolve acetate, carbitol acetate, diethylene glycol dimethyl ether, propylene glycol monomethyl ether acetate; cyclohexanone And one or more solvents such as alicyclic hydrocarbons such as cyclohexanol and petroleum solvents such as petroleum ether and petroleum naphtha.

During or after the reaction, one or more of the following reactive diluents (B-2) can be used.

Further, it is preferable to use a catalyst for accelerating the reaction. Examples of the catalyst include triethylamine, benzylmethylamine, methyltriethylammonium chloride, triphenylstibine, triphenylphosphine and the like. The amount used is preferably from 0.1 to 10% by weight based on the reaction raw material mixture,
Particularly preferably, it is 0.3 to 5% by weight.

During the reaction, a polymerization inhibitor is preferably used to prevent polymerization of the ethylenically unsaturated group. Examples of the polymerization inhibitor include methoquinone, hydroquinone, methylhydroquinone, phenothiazine and the like. The amount used is preferably from 0.01 to 1% by weight, particularly preferably from 0.05 to 1% by weight, based on the reaction raw material mixture.
0.5% by weight. The reaction temperature is from 60 to 150 ° C, particularly preferably from 80 to 120 ° C. The reaction time is preferably 5 to 60 hours.

Next, the polybasic acid anhydride (f) is reacted. Examples of the polybasic acid anhydride (f) include, for example, succinic anhydride, maleic anhydride, itaconic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 3-methyl-
Examples include tetrahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride and the like. The amount of the polybasic anhydride to be used is preferably 0.1 to 1 equivalent of the hydroxyl group in the epoxy (meth) acrylate.
The reaction is carried out in an amount of from 0.5 to 1.00 equivalent. The reaction temperature is 60 to 1
The temperature is 50 ° C, particularly preferably 80 to 100 ° C.

The amount of the component (A) + (B) component 1
20 to 300 parts by weight, preferably 3 to 100 parts by weight
A ratio of 0 to 200 parts by weight is appropriate.

In the present invention, a photopolymerization initiator (D) may be used. Examples of the photopolymerization initiator (D) include benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, and benzoin isobutyl ether; acetophenone,
2,2-dimethoxy-2-phenylacetophenone,
2,2-ethoxy-2-phenylacetophenone,
1,1-dichloroacetophenone, 2-hydroxy-2
Such as -methyl-1-phenylpropan-1-one, ethoxy acetophenone, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one and the like Acetophenones; Anthraquinones such as 2-ethylanthraquinone, 2-tert-butylanthraquinone, 2-chloroanthraquinone, and 2-amylanthraquinone; Ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; benzophenones such as benzophenone and 4,4-bismethylaminobenzophenone; and 2,4,6-trimethylbenzoyldiphenylphos Fin oxide are listed.

These can be used alone or as a mixture of two or more. Further, tertiary amines such as triethanolamine and methyldiethanolamine, ethyl N, N-dimethylaminobenzoate, N, N-dimethylaminobenzoate It can be used in combination with an accelerator such as a benzoic acid derivative such as acid isoamyl ester.

The photopolymerization initiator (D) is used in an amount of 0.5 to 20 parts by weight, preferably 2 to 20 parts by weight, based on 100 parts by weight of the total weight of the components (A), (B) and (C). A ratio of 15 parts by weight is preferable.

In the present invention, it is preferable to use a thermosetting component (E) as a curing system component in addition to the components described above.
By using this, a material for a printed wiring board having excellent solder heat resistance and electrical characteristics can be obtained. The thermosetting component (E) used in the present invention is not particularly limited as long as it has a functional group capable of thermosetting with the urethane oligomer (A) and the unsaturated group-containing polycarboxylic acid resin (C) in the molecule. Although not limited, examples thereof include an epoxy resin, a melamine compound, a urea compound, an oxazoline compound, and a phenol compound. As the epoxy resin, specifically, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, trisphenol methane type epoxy resin,
Glycidyl ethers such as brominated epoxy resin, biquilenol type epoxy resin and biphenol type epoxy resin; 3,4-epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclohexanecarboxylate, 3,4-epoxy Cyclohexylmethyl-3,4-epoxycyclohexanecarboxylate,
Alicyclic epoxy resins such as 1-epoxyethyl-3,4-epoxycyclohexane; glycidyl esters such as diglycidyl phthalate, diglycidyl tetrahydrophthalate and glycidyl dimer; glycidylamines such as tetraglycidyl diaminodiphenylmethane And heterocyclic epoxy resins such as triglycidyl isocyanurate. Among them, an epoxy resin having a melting point of 50 ° C. or more is preferable because it can form a tack-free photopolymer film after drying.

Examples of the melamine compound include melamine and a melamine resin which is a polycondensate of melamine and formalin. Examples of the urea compound include urea and urea resins which are polycondensates of urea and formalin.

Examples of the oxazoline compound include 2-oxazoline, 2-methyl-2-oxazoline, 2-phenyl-2-oxazoline, 2,5-dimethyl-2-oxazoline, 5-methyl-2-phenyl-2-oxazoline,
2,4-diphenyloxazoline and the like.

Examples of the phenol compound include phenol, cresol, chilenol, catechol, resorcin, hydroquinone, pyrogallol, resol and the like.

Among these thermosetting components (E), epoxy resins are particularly preferred because of their excellent reactivity with the carboxyl groups in the components (A) and (C) and good adhesion to copper.

The preferable range of the use amount of the thermosetting component (E) is that the functional group of the thermosetting component (E) is usually 0 per carboxyl group in the components (A) and (D). .2
It is a ratio that becomes 3.0 equivalents. Among them, 1.0 is preferred because of its excellent soldering heat resistance and electrical characteristics when it is made into a printed wiring board.
A ratio of up to 1.5 equivalents is preferred.

When an epoxy resin is used as the thermosetting component (E), a curing accelerator for the epoxy resin is used to accelerate the reaction with the carboxyl groups in the components (A) and (C). Is preferred. Specific examples of the curing accelerator for the epoxy resin include 2-methylimidazole, 2-ethyl-3-methylimidazole, 2-undecylimidazole, 2-phenylimidazole, and 1-methylimidazole.
Imidazole compounds such as cyanoethyl-2-ethylimidazole and 1-cyanoethyl-2-undecylimidazole; melamine, guanamine, acetoguanamine, benzoguanamine, ethyldiaminotriazine, 2,4-
Triazine derivatives such as diaminotriazine, 2,4-diamino-6-tolyltriazine, 2,4-diamino-6-xylyltriazine; trimethylamine, triethanolamine, N, N-dimethyloctylamine, pyridine, m-aminophenol And the like; tertiary amines; polyphenols and the like. These curing accelerators can be used alone or in combination.

Further, in the present invention, the above-mentioned urethane oligomer (A), diluent (B), unsaturated group-containing polycarboxylic acid resin (C), photopolymerization initiator (D) and thermosetting component (E) are used. And, if necessary, various additives, for example,
Fillers such as talc, barium sulfate, calcium carbonate, magnesium carbonate, barium titanate, aluminum hydroxide, aluminum oxide, silica, clay and the like; thixotropic agents such as aerosil; phthalocyanine blue;
Coloring agents such as phthalocyanine green and titanium oxide, silicones, fluorine-based leveling agents and defoaming agents; polymerization inhibitors such as hydroquinone and hydroquinone monomethyl ether can be added for the purpose of enhancing various performances of the composition.

The above-mentioned component (E) may be mixed with the resin composition in advance, but it is preferable to use the component (E) before mixing it on a printed circuit board. That is, the two-component type of the main component solution mainly composed of the components (A) and (C) and the epoxy curing accelerator and the like, and the curing agent solution mainly composed of the component (E), When used, it is preferable to mix them.

The resin composition of the present invention can be used, for example, on a polymer film (for example, a film made of polyethylene terephthalate, polypropylene, polyethylene or the like) as a support. 1) can be evaporated and laminated to be used as a photosensitive film.

The resin composition (liquid or film form) of the present invention is useful as an insulating material between layers of electronic parts, as a resist ink such as a solder resist for printed circuit boards, and in addition to a triblock, a paint and a coating. It can also be used as an agent, adhesive or the like. The cured product of the present invention is obtained by curing the above-described resin composition of the present invention by irradiation with energy rays such as ultraviolet rays. Curing by irradiation with energy rays such as ultraviolet rays can be performed by a conventional method. For example, when irradiating ultraviolet rays, low-pressure mercury lamp, high-pressure mercury lamp, ultra-high-pressure mercury lamp,
An ultraviolet generator such as a xenon lamp or an ultraviolet light emitting laser (such as an excimer laser) may be used. The cured product of the resin composition of the present invention can be used as an interlayer insulating material for a permanent resist or a build-up method, for example, as an electric or conductive material such as a printed circuit board.
Used for electronic components. The thickness of the cured product layer is 0.5 to
It is about 160 μm, preferably about 1 to 60 μm.

The printed wiring board of the present invention can be obtained, for example, as follows. That is, when a liquid resin composition is used, the present invention is applied to a substrate for printed wiring with a film thickness of 5 to 160 μm by a method such as a screen printing method, a spray method, a roll coating method, an electrostatic coating method, and a curtain coating method. By applying the composition of, and drying the coating film at a temperature of usually 60 ~ 110 ℃, preferably 60 ~ 100 ℃,
A tack-free coating film can be formed. Thereafter, a photomask on which an exposure pattern such as a negative film is formed is brought into direct contact with the coating film (or placed on the coating film in a non-contact state), and ultraviolet light is usually irradiated at an intensity of about 10 to 2000 mJ / cm ^2. Then, the unexposed portion using a developer described below,
For example, development is performed by spraying, rocking immersion, brushing, scrubbing, or the like. Then, if necessary, further irradiate ultraviolet rays, and then heat-treat at a temperature of usually 100 to 200 ° C., preferably 140 to 180 ° C., so that the resist film has excellent flexibility, heat resistance and solvent resistance. Thus, a printed wiring board having a permanent protective film that satisfies various properties such as acid resistance, adhesion, and electrical properties can be obtained.

Examples of the organic solvent used for the development include halogens such as trichloroethane, aromatic hydrocarbons such as toluene and xylene; esters such as ethyl acetate and butyl acetate; 1,4-dioxane and tetrahydrofuran. Ethers of methyl ethyl ketone,
Ketones such as methyl isobutyl ketone; lactones such as γ-butyrolactone; glycol derivatives such as butyl cellosolve acetate, carbitol acetate, dimethylene glycol dimethyl ether, propylene glycol monomethyl ether acetate; alicyclic hydrocarbons such as cyclohexanone and cyclohexanol; Solvents such as petroleum solvents such as petroleum ether and petroleum naphtha,
As the water and the aqueous alkali solution, an aqueous alkali solution such as potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium phosphate, sodium silicate, ammonia, and amines can be used. Further, as an irradiation light source for photocuring, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like is appropriate. In addition, a laser beam or the like can be used as the active light for exposure.

[0071]

EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples, but it goes without saying that the present invention is not limited to the following Examples. In the following, “parts” means “parts by weight” unless otherwise specified.

(Synthesis Example of Polyimide Precursor (a) Having Terminal Anhydride Group) Synthesis Example 1 2.2-bis [4- (4-aminophenoxy) phenyl] propane 32.8 (0.08 mol) Jeffer 40. Min D-2000 (trade name of San Techno Chemical Co., Ltd., polyoxyalkylenediamine, molecular weight 2000)
0 (0.02 mol) and γ-butyrolactone 537.2
After the mixture was charged to 45 ° C., ethylene glycol bis (anhydrotrimellitate) 61.5 (0.15 mol) was added little by little while maintaining at 43-50 ° C. After the addition, the reaction was continued at 45 ° C. for about 5 hours, then cooled to room temperature, and the solid precursor acid value (mg KOH / g) 167 nonvolatile matter 20% terminal water group-containing polyimide precursor solution (a
-1) was obtained.

(Synthesis Example of Oligomer (A)) Synthesis Example 2 671.5 g of the terminal anhydride group-containing polyimide precursor solution (a-1) obtained in Synthesis Example 1, polytetramethylene glycol (hydroxyl value: 56.1 mg KOH) / G, molecular weight: 20
00) 66.7 g, and reacted at 85 ° C. for 10 hours,
A reaction product (I) containing a terminal anhydride group having an acid value of 93.2 mgKOH / g of a solid content was obtained. Then, 4.25 g of 2-hydroxyethyl acrylate and 0.3 g of methoxyphenol
And reacted at 85 ° C. for about 10 hours. An oligomer (A-1) having a weight average molecular weight of the solid content of about 18,000 (by GPC method) and an acid value of the solid content of 82.3 mgKOH / g and a solid content of 27.7% (A-1) ) Got.

(Unsaturated group-containing polycarboxylic acid resin (C)
Synthesis Example 3 Synthesis Example 3 In the above general formula (2), X is —CH ₂ —, M is a hydrogen atom, and average degree of polymerization n is bisphenol F of 6.2.
After dissolving 380 parts of an epoxy compound of the type (epoxy equivalent: 950 g / eq, softening point: 85 ° C.) and 925 parts of epichlorohydrin in 462.5 parts of dimethyl sulfoxide, 60.9 parts of 98.5% NaOH (70%) was stirred at 70 ° C. (0.5 mol) was added over 100 minutes. After the addition, the reaction was further performed at 70 ° C. for 3 hours. After the completion of the reaction, 250 parts of water was added and washed. After oil-water separation, most of the dimethyl sulfoxide and excess unreacted epichlorohydrin were recovered by distillation under reduced pressure from the oil layer, and then dimethyl sulfoxide was distilled off.
The reaction product containing by-produced salt is treated with methyl isobutyl ketone 75
0 parts, and further add 10 parts of 30% NaOH,
The reaction was performed at 0 ° C. for 1 hour. After the reaction is completed, add 2 parts with 200 parts of water.
Washing was performed once. After oil-water separation, methyl isobutyl ketone was recovered by distillation from the oil layer, and the epoxy equivalent was 310 g / e.
q, an epoxy resin (a) having a softening point of 69 ° C. was obtained. When the obtained epoxy resin (a) was calculated from the epoxy equivalent, about 5 of the 6.2 alcoholic hydroxyl groups in the starting material bisphenol F type epoxy compound were epoxidized. This epoxy resin (a) 3
Charge 10 parts and 251 parts of carbitol acetate,
The mixture was heated and stirred at 90 ° C. and dissolved. 60 ° C.
Cooled to 60 parts of acrylic acid, dimer acid (acid value (m
gKOH / g) = 196) 97 parts, methylhydroquinone 0.8 parts and triphenylphosphine 2.5 parts were added,
The mixture was heated and dissolved at 80 ° C. and reacted at 98 ° C. for 35 hours to obtain an epoxy acrylate having an acid value of 0.5 mg KOH / g and a solid content of 65%. Next, 718.5 parts of this epoxy acrylate, 100 parts of succinic anhydride, and 54 parts of carbitol acetate were charged and reacted at 90 ° C. for 6 hours.
An unsaturated group-containing polycarboxylic acid resin (C-1) having a solid content acid value of 99 mgKOH / g and a solid content of 65% was obtained.

Examples 1 to 12, Comparative Examples 1 to 4 (A-1), (B-
1) were mixed in the mixing ratio shown in Table 1, and then the photopolymerization initiator (D) (Irgacure 90, manufactured by Ciba-Geigy)
7: 2-methyl-1- [4- (methylthio) phenyl]
-2-morpholinopropan-1-one 10 parts and getylthioxanthone 1.2 parts), a reactive diluent (C) (manufactured by Nippon Kayaku Co., Ltd .;
16 parts of dipentaerythritol penta-hexaacrylate mixture), 10 parts of filler (fine silica), 1.2 parts of epoxy curing accelerator (melamine), silicone defoamer (KS-66, manufactured by Shin-Etsu Chemical Co., Ltd.) 0.0 parts were blended in the combinations shown in Table 1, and kneaded using a three-roll mill to prepare main ingredients (blended components ((XA-1) to (XA-3), and (XX-1)).

On the other hand, the thermosetting component (E)
(Epoxy resin) was used as a curing agent.
-1) to (H-4)). At the time of use, the above-mentioned base agent and curing agent were mixed in the combinations shown in Table 3 to prepare a solder resist composition.

Table 1 Ingredients Main ingredients XA-1 XA-2 XA-3 XX-1 A-1 108.3 72.2 54.1 C-1 108 123 130.8 154

Table 2 Ingredients (parts by weight) H-1 H-2 H-3 H-4 Epicoat 1001 * 16630 YR-528 * 2 20 YX-4000 * 3 30 DEN-438 * 430

Note) * 1: Epicoat 1001: manufactured by Yuka Shell Epoxy Co., Ltd.
Bisphenol A epoxy resin (containing carbitol acetate, solid content concentration 75%) * 2; YR-528: manufactured by Toto Kasei Co., Ltd., rubber-modified epoxy resin * 3; YX-4000: manufactured by Yuka Shell Epoxy, bisphenol type Epoxy resin * 4; DEN-438: Dow Chemical Company, phenol novolak epoxy resin

Evaluation method: Each of the obtained resist compositions was evaluated as follows. That is, the resist compositions of Examples and Comparative Examples shown in Table 3 were applied to a printed circuit board (a laminate of an imide film and a copper foil) by screen printing, and dried at 80 ° C. for 20 minutes. Thereafter, a negative film is applied to the substrate, irradiated with ultraviolet rays at an integrated exposure amount of 500 mJ / cm ² using an exposure machine according to a predetermined pattern, and developed with an organic solvent or a 1 wt% Na ₂ CO ₃ aqueous solution. A test substrate was prepared by heat curing at 150 ° C. for 50 minutes. With respect to the obtained test substrate, characteristics such as alkali developability, solder heat resistance, flexibility, heat deterioration resistance, and electroless gold plating resistance were evaluated. Table 3 shows the results. The evaluation method and evaluation criteria are as follows.

(1) Developability: The coating film was dried at 80 ° C. for 60 minutes, and the developability by spray development with a 1% aqueous solution of sodium carbonate at 30 ° C. was evaluated.・: No residue is visually observed. ×: There is a residue visually.

(2) Solder heat resistance: A rosin-based flux was applied to a test substrate, immersed in molten solder at 260 ° C. for 10 seconds, and evaluated by the state of the cured film when peeled off with a cellophane adhesive tape. ○ ・ ・ ・ ・ ・ ・ No abnormality. ×: There is peeling.

(3) Flexibility: Judgment was made in a state where the test substrate was folded at 180 degrees. ○ ・ ・ ・ ・ No crack. △ ・ ・ ・ ・ Slight cracks. C: Cracks were formed in the bent portion and the cured film was separated.

(4) Thermal degradation resistance: The test substrate was left standing at 125 ° C. for 5 days, and then evaluated in a state of 180 ° solid bending. ○ ・ ・ ・ ・ No crack. △ ・ ・ ・ ・ Slight cracks. C: Cracks were formed in the bent portion and the cured film was separated.

(5) Electroless Gold Plating Resistance: The gold plating was performed on the test substrate as described below, and the state was determined by peeling off with a cellophane adhesive tape. ○ ・ ・ ・ ・ No abnormality. Δ: Some peeling was observed. ×: No peeling.

Electroless gold plating method: A test substrate was subjected to 30 ° C. acidic degreasing solution (Metex, manufactured by Nippon MacDermid Co., Ltd.).
L-5B (20 Vol /% aqueous solution) for 3 minutes to degrease, then dipped in running water for 3 minutes and washed with water. Next, the test substrate is immersed in a 14.3 wt% ammonium persulfate aqueous solution at room temperature for 3 minutes, soft-etched, and then placed in running water for 3 minutes.
It was immersed for minutes and washed with water. After the test substrate was immersed in a 10 Vol% sulfuric acid aqueous solution at room temperature for 1 minute, it was immersed in running water for 30 seconds to 1 minute and washed with water. Next, the test substrate was immersed in a 30 ° C. catalyst solution (10 vol% aqueous solution of a metal plate activator 350, manufactured by Meltex Co., Ltd.) for 7 minutes to give a catalyst, and then immersed in running water for 3 minutes and washed with water. . The test substrate to which the catalyst was applied was immersed in a 20 vol% aqueous solution of a nickel plating solution at 85 ° C., pH 4.6) for 20 minutes to perform electroless nickel plating. After the test substrate was immersed in a 10 Vol% sulfuric acid aqueous solution at room temperature for 1 minute, it was immersed in running water for 30 seconds to 1 minute and washed with water. Next, the test substrate was subjected to a 95 ° C. gold plating solution (manufactured by Meltex Co., Ltd., Aulectroless UP15Vol% and potassium cyanide 3V).
immersed in running water for 3 minutes, washed with hot water at 60 ° C. for 3 minutes, and washed with hot water. After sufficient washing with water, the water was thoroughly removed, dried, and a test board electrolessly gold-plated was obtained.

Table 3-1 Example 1 2 3 4 (X) Component XA-1 XA-1 XA-1 XA-1 (H) Component H-1 H-2 H-3 H-4 Developability ○ ○ ○ ○ Solder heat resistance ○ ○ ○ ○ Flexibility ○ ○ ○ ○ Heat deterioration ○ ○ ○ ○ Electroless gold plating resistance ○ ○ ○ ○

Table 3-2 Example 5 678 (X) Component XA-2 XA-2 XA-2 XA-2 (H) Component H-1 H-2 H-3 H-4 Developability ○ ○ ○ ○ Solder heat resistance ○ ○ ○ ○ Flexibility ○ ○ ○ ○ Heat deterioration ○ ○ ○ ○ Electroless gold plating resistance ○ ○ ○ ○

Table 3-3 Example 9 10 11 12 (X) Component XA-3 XA-3 XA-3 XA-3 (H) Component H-1 H-2 H-3 H-4 Developability ○ ○ ○ ○ Solder heat resistance ○ ○ ○ ○ Flexibility ○ ○ ○ ○ Heat deterioration ○ ○ ○ ○ Electroless gold plating resistance ○ ○ ○ ○

Table 3-4 Comparative Example 1 2 3 4 (X) Component XX-1 XX-1 XX-1 XX-1 (H) Component H-1 H-2 H-3 H-4 Developability ○ ○ ○ ○ Solder heat resistance ○ ○ ○ ○ Flexibility △ △ × × Heat deterioration △ △ × × Electroless gold plating resistance ○ ○ ○ ○

As is evident from the results shown in Table 3, the resin composition of the present invention shows good alkali developability, and is excellent in solder heat resistance, flexibility, heat deterioration resistance and electroless gold plating property. Give the membrane.

[0092]

According to the present invention, the cured product is excellent in flexibility, solder heat resistance, heat deterioration resistance, and electroless gold plating resistance, can be developed with an organic solvent or a dilute alkali solution, and is used for a solder resist and an interlayer insulating layer. Thus, a resin composition suitable for was obtained. This resin composition is suitable for a solder resist and an interlayer insulating layer of a printed wiring board, particularly a flexible printed wiring board.

 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 2H025 AA07 AA10 AA13 AA14 AA20 AB15 AC01 AD01 BC13 BC43 BC74 BC83 BC84 BC86 BC92 CB25 CB43 CC03 CC17 FA17 FA29 4J002 CC163 CC183 CD003 CD202 CK051 CM041 EC036 EC046 EC056 EE026 ED026 ED026 FD150 FD157 GP03 GQ01 HA05 4J027 AD03 AD04 AE01 AE02 AE03 AJ01 AJ05 AJ08 CA10 CB10 CC04 CD10

Claims (11)

[Claims] 1. A polyimide precursor (a) having a terminal anhydride group represented by the general formula (1): (Wherein, R ₁ represents a tetravalent organic group having 2 to 30 carbon atoms, R ₂ represents a divalent organic group having 2 to 240 carbon atoms, and n is an integer of 0 or 1 or more. And a diluent (B) obtained by reacting a polyol compound (b) with an ethylenically unsaturated group-containing polyhydroxy compound (c) as optional components. 2. The oligomer (A) having a weight average molecular weight of 1,
The resin composition according to claim 1, wherein the amount is from 000 to 100,000. 3. The oligomer (A) has an acid value of 1 to 300 mgK.
The resin composition according to claim 1, which is OH / g. 4. A reaction product of an epoxy resin (d) having two or more epoxy groups in one molecule, a monocarboxylic acid compound (e) having an ethylenically unsaturated group, and a polybasic anhydride (f). The resin composition according to any one of claims 1 to 3, further comprising an unsaturated group-containing polycarboxylic acid resin (C). 5. An epoxy resin (d) having two or more epoxy groups in one molecule is represented by the formula (2): (In the formula (2), X is —CH ₂ — or —C (CH ₃ ) ₂ —, n is an integer of 1 or more, and M is a hydrogen atom or the following formula (G). ] However, when n is 1, M represents the formula (G), and when n is greater than 1, at least one of M represents the formula (G) and the rest represents a hydrogen atom. The resin composition according to any one of claims 1 to 4, which is an epoxy resin (d) represented by the following formula: 6. The resin composition according to claim 1, further comprising a photopolymerization initiator (D). 7. The resin composition according to claim 1, further comprising a thermosetting component (E). 8. The resin composition according to claim 1, which is used for a solder resist or an interlayer insulating layer of a printed wiring board. 9. A cured product of the resin composition according to any one of claims 1 to 8. 10. An article having the cured product layer according to claim 9. 11. The article according to claim 10, which is a printed wiring board.