JP2001192850A - Surface treating solution for sliding parts, surface treating method for sliding parts and sliding parts - Google Patents
Surface treating solution for sliding parts, surface treating method for sliding parts and sliding partsInfo
- Publication number
- JP2001192850A JP2001192850A JP2000003039A JP2000003039A JP2001192850A JP 2001192850 A JP2001192850 A JP 2001192850A JP 2000003039 A JP2000003039 A JP 2000003039A JP 2000003039 A JP2000003039 A JP 2000003039A JP 2001192850 A JP2001192850 A JP 2001192850A
- Authority
- JP
- Japan
- Prior art keywords
- ions
- ion
- film
- surface treatment
- sliding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 85
- -1 phosphorous ions Chemical class 0.000 claims abstract description 62
- 239000000126 substance Substances 0.000 claims abstract description 16
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 16
- 239000010937 tungsten Substances 0.000 claims abstract description 16
- 229910052796 boron Inorganic materials 0.000 claims abstract description 13
- 229910001453 nickel ion Inorganic materials 0.000 claims abstract description 12
- 150000002500 ions Chemical class 0.000 claims abstract description 11
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 10
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 8
- 239000011733 molybdenum Substances 0.000 claims abstract description 8
- 229910052742 iron Inorganic materials 0.000 claims abstract description 7
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 6
- 229910001456 vanadium ion Inorganic materials 0.000 claims abstract description 6
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 5
- 229910001429 cobalt ion Inorganic materials 0.000 claims abstract description 4
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910001437 manganese ion Inorganic materials 0.000 claims abstract description 4
- 229910052702 rhenium Inorganic materials 0.000 claims abstract description 4
- 239000003381 stabilizer Substances 0.000 claims abstract description 4
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910001430 chromium ion Inorganic materials 0.000 claims abstract description 3
- 229910052737 gold Inorganic materials 0.000 claims abstract description 3
- 239000010931 gold Substances 0.000 claims abstract description 3
- 229910001432 tin ion Inorganic materials 0.000 claims abstract description 3
- 229910052845 zircon Inorganic materials 0.000 claims abstract description 3
- 239000006172 buffering agent Substances 0.000 claims abstract 2
- 238000012545 processing Methods 0.000 claims description 113
- 239000007788 liquid Substances 0.000 claims description 75
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 59
- 238000004381 surface treatment Methods 0.000 claims description 56
- 229910052759 nickel Inorganic materials 0.000 claims description 25
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 17
- 229910052582 BN Inorganic materials 0.000 claims description 16
- 229910052698 phosphorus Inorganic materials 0.000 claims description 15
- 229910021645 metal ion Inorganic materials 0.000 claims description 14
- 239000011574 phosphorus Substances 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 238000007772 electroless plating Methods 0.000 claims description 7
- 239000010419 fine particle Substances 0.000 claims description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- 239000008139 complexing agent Substances 0.000 claims description 6
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 claims description 6
- LCKIEQZJEYYRIY-UHFFFAOYSA-N Titanium ion Chemical compound [Ti+4] LCKIEQZJEYYRIY-UHFFFAOYSA-N 0.000 claims description 5
- 239000012190 activator Substances 0.000 claims description 4
- 238000000354 decomposition reaction Methods 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 230000002269 spontaneous effect Effects 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 claims description 2
- WAEMQWOKJMHJLA-UHFFFAOYSA-N Manganese(2+) Chemical compound [Mn+2] WAEMQWOKJMHJLA-UHFFFAOYSA-N 0.000 claims 1
- RVPVRDXYQKGNMQ-UHFFFAOYSA-N lead(2+) Chemical compound [Pb+2] RVPVRDXYQKGNMQ-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 7
- 229910052763 palladium Inorganic materials 0.000 abstract description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 239000010936 titanium Substances 0.000 abstract description 2
- 229910052719 titanium Inorganic materials 0.000 abstract description 2
- 150000001455 metallic ions Chemical class 0.000 abstract 2
- 230000003213 activating effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 217
- 230000008569 process Effects 0.000 description 48
- 238000005406 washing Methods 0.000 description 43
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 38
- 230000000694 effects Effects 0.000 description 35
- 229910052751 metal Inorganic materials 0.000 description 35
- 239000002184 metal Substances 0.000 description 35
- 230000003746 surface roughness Effects 0.000 description 32
- 229910018104 Ni-P Inorganic materials 0.000 description 30
- 229910018536 Ni—P Inorganic materials 0.000 description 30
- 238000005755 formation reaction Methods 0.000 description 29
- 230000015572 biosynthetic process Effects 0.000 description 28
- 239000000203 mixture Substances 0.000 description 18
- 238000000576 coating method Methods 0.000 description 16
- 238000001035 drying Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- 239000010949 copper Substances 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 13
- 239000002131 composite material Substances 0.000 description 13
- 238000005238 degreasing Methods 0.000 description 13
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 12
- 238000002474 experimental method Methods 0.000 description 12
- 239000002253 acid Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 239000008399 tap water Substances 0.000 description 10
- 235000020679 tap water Nutrition 0.000 description 10
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- 238000005299 abrasion Methods 0.000 description 8
- 238000007654 immersion Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 7
- 239000011734 sodium Substances 0.000 description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 5
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 5
- 238000007788 roughening Methods 0.000 description 5
- 239000000725 suspension Substances 0.000 description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical class OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 4
- 241000080590 Niso Species 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 125000000129 anionic group Chemical group 0.000 description 4
- 230000000844 anti-bacterial effect Effects 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 4
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 4
- 238000006864 oxidative decomposition reaction Methods 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000002378 acidificating effect Effects 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 150000001447 alkali salts Chemical class 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- CPSYWNLKRDURMG-UHFFFAOYSA-L hydron;manganese(2+);phosphate Chemical compound [Mn+2].OP([O-])([O-])=O CPSYWNLKRDURMG-UHFFFAOYSA-L 0.000 description 3
- 229910000398 iron phosphate Inorganic materials 0.000 description 3
- WBJZTOZJJYAKHQ-UHFFFAOYSA-K iron(3+) phosphate Chemical compound [Fe+3].[O-]P([O-])([O-])=O WBJZTOZJJYAKHQ-UHFFFAOYSA-K 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- 229910000677 High-carbon steel Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- ACVSDIKGGNSZDR-UHFFFAOYSA-N [P].[W].[Ni] Chemical compound [P].[W].[Ni] ACVSDIKGGNSZDR-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910017053 inorganic salt Inorganic materials 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- 229940048086 sodium pyrophosphate Drugs 0.000 description 2
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 2
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 2
- 229910000165 zinc phosphate Inorganic materials 0.000 description 2
- GBNDTYKAOXLLID-UHFFFAOYSA-N zirconium(4+) ion Chemical compound [Zr+4] GBNDTYKAOXLLID-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 102100033029 Carbonic anhydrase-related protein 11 Human genes 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical class O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- 239000004705 High-molecular-weight polyethylene Substances 0.000 description 1
- 101000867841 Homo sapiens Carbonic anhydrase-related protein 11 Proteins 0.000 description 1
- 101001075218 Homo sapiens Gastrokine-1 Proteins 0.000 description 1
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- URINYHFMLIGJCL-UHFFFAOYSA-N NCSN Chemical compound NCSN URINYHFMLIGJCL-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 101100219325 Phaseolus vulgaris BA13 gene Proteins 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- PZQNFVCVNORNPG-UHFFFAOYSA-M [Na+].OP(O)([O-])=O.OP(O)(=O)OP(O)(O)=O Chemical compound [Na+].OP(O)([O-])=O.OP(O)(=O)OP(O)(O)=O PZQNFVCVNORNPG-UHFFFAOYSA-M 0.000 description 1
- PHJJWPXKTFKKPD-UHFFFAOYSA-N [Ni+3].[O-]P([O-])[O-] Chemical compound [Ni+3].[O-]P([O-])[O-] PHJJWPXKTFKKPD-UHFFFAOYSA-N 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 235000004279 alanine Nutrition 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000001014 amino acid Nutrition 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- FAPDDOBMIUGHIN-UHFFFAOYSA-K antimony trichloride Chemical compound Cl[Sb](Cl)Cl FAPDDOBMIUGHIN-UHFFFAOYSA-K 0.000 description 1
- KVBCYCWRDBDGBG-UHFFFAOYSA-N azane;dihydrofluoride Chemical compound [NH4+].F.[F-] KVBCYCWRDBDGBG-UHFFFAOYSA-N 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- VDTVZBCTOQDZSH-UHFFFAOYSA-N borane N-ethylethanamine Chemical compound B.CCNCC VDTVZBCTOQDZSH-UHFFFAOYSA-N 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007739 conversion coating Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- CYKLGTUKGYURDP-UHFFFAOYSA-L copper;hydrogen sulfate;hydroxide Chemical compound O.[Cu+2].[O-]S([O-])(=O)=O CYKLGTUKGYURDP-UHFFFAOYSA-L 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000005237 degreasing agent Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 150000004673 fluoride salts Chemical class 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 235000019256 formaldehyde Nutrition 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 150000004677 hydrates Chemical class 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910001389 inorganic alkali salt Inorganic materials 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 229910052981 lead sulfide Inorganic materials 0.000 description 1
- 229940056932 lead sulfide Drugs 0.000 description 1
- HWSZZLVAJGOAAY-UHFFFAOYSA-L lead(II) chloride Chemical compound Cl[Pb]Cl HWSZZLVAJGOAAY-UHFFFAOYSA-L 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LKNLEKUNTUVOML-UHFFFAOYSA-L nickel(2+);sulfate;hydrate Chemical compound O.[Ni+2].[O-]S([O-])(=O)=O LKNLEKUNTUVOML-UHFFFAOYSA-L 0.000 description 1
- BFDHFSHZJLFAMC-UHFFFAOYSA-L nickel(ii) hydroxide Chemical compound [OH-].[OH-].[Ni+2] BFDHFSHZJLFAMC-UHFFFAOYSA-L 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- ACUGTEHQOFWBES-UHFFFAOYSA-M sodium hypophosphite monohydrate Chemical compound O.[Na+].[O-]P=O ACUGTEHQOFWBES-UHFFFAOYSA-M 0.000 description 1
- 235000019832 sodium triphosphate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910001460 tantalum ion Inorganic materials 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、摺動性を高める摺
動部品用表面処理液及び摺動部品の表面処理方法及びそ
の表面処理方法により処理された摺動部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment liquid for a sliding part which enhances slidability, a method for treating a surface of a sliding part, and a sliding part treated by the surface treatment method.
【0002】[0002]
【従来の技術】例えば、自動車エンジン用部品のバルブ
シム、バルブリフター、リテーナ、AT(オートマチッ
クトランスミッション)用部品のスピニングロールなど
に代表される摺動部品は、それが使用される環境や機能
に基づいて耐食性、低摩擦性(フリクション性)、潤滑
性、耐焼付き性、耐摩耗性、耐スカッフィング性など、
様々な特性(以下これらをまとめて摺動性という。)が
要求され、それぞれの金属の特性を生かした銅合金、亜
鉛合金、ステンレススチール、特殊鋼(JISG−44
01、G−4409、G−4403〜G4409、G4
311〜4312、)等の高炭素鋼あるいはクロムやモ
リブデン等を多く含有するSCR鋼やJIS G410
4、G4105、G4202等のSCM鋼が用いられて
いる。さらには、軽量化のためにアルミニウム合金、マ
グネシウム合金や、金属以外にもエンジニアリングプラ
スチックスが用いられたり、耐熱性のためにセラミック
ス等が用いられたりしていた。このような素材から形成
された摺動部品は、その表面に摺動性を向上させるよう
な表面処理が施されているようなものがあった。この表
面処理には、例えばリン酸マンガン系、リン酸亜鉛系、
フッ化塩系、塩基性銅系の結晶性化成皮膜を形成させて
表面処理をするものがあった。この摺動部品の表面上に
おける結晶性の化成皮膜は、比較的厚い皮膜が形成で
き、皮膜の硬度も高かったので耐食性や初期馴み性の点
では有効であった。また、リン酸鉄系の化成皮膜形成剤
によりモリブデン、タングステン、銅イオン等を含有す
るアモルファス(非晶質)鉄系の複合金属酸化皮膜を形
成させて表面処理をするものもあった。この複合金属酸
化皮膜では、より緻密で摩擦係数が低い皮膜とすること
ができた。2. Description of the Related Art For example, sliding parts such as a valve shim of an automobile engine, a valve lifter, a retainer, and a spinning roll of an AT (automatic transmission) part are based on the environment and function in which they are used. Corrosion resistance, low friction (friction), lubrication, seizure resistance, abrasion resistance, scuffing resistance, etc.
Various characteristics (hereinafter collectively referred to as slidability) are required, and copper alloys, zinc alloys, stainless steels, and special steels (JISG-44) that make use of the characteristics of each metal are required.
01, G-4409, G-4403 to G4409, G4
High carbon steel such as 311 to 4312, or SCR steel containing a large amount of chromium or molybdenum, or JIS G410.
SCM steels such as 4, G4105, and G4202 are used. Further, aluminum alloys, magnesium alloys, engineering plastics other than metals have been used for weight reduction, and ceramics and the like have been used for heat resistance. Some sliding parts formed from such a material have been subjected to a surface treatment to improve the slidability on the surface. For this surface treatment, for example, manganese phosphate type, zinc phosphate type,
In some cases, a surface treatment is performed by forming a crystalline chemical conversion film of a fluoride salt or basic copper system. The crystalline chemical conversion film on the surface of this sliding component was effective in terms of corrosion resistance and initial adaptability because a relatively thick film could be formed and the hardness of the film was high. In some cases, an amorphous iron-based composite metal oxide film containing molybdenum, tungsten, copper ions, or the like is formed with an iron phosphate-based chemical conversion film-forming agent to perform surface treatment. With this composite metal oxide film, a film having a higher density and a lower coefficient of friction could be obtained.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、リン酸
マンガン系、リン酸亜鉛系、フッ化塩系、塩基性銅系の
結晶性化成皮膜や、リン酸鉄系の皮膜形成剤にモリブデ
ン、タングステン、銅の金属イオン等を含有する非晶質
系の複合酸化皮膜では、いずれも摺動面の面粗度が粗い
ため金属部品間の摩擦係数が大きく、耐摩耗性、耐焼付
性、潤滑性、及び形成された皮膜の均一性に欠けるとい
う問題があった。However, manganese phosphate-based, zinc phosphate-based, fluoride-based, basic copper-based crystalline chemical conversion films and iron phosphate-based film-forming agents include molybdenum, tungsten, and the like. All amorphous composite oxide films containing copper metal ions, etc. have a large friction coefficient between metal parts due to the rough surface of the sliding surface, and have abrasion resistance, seizure resistance, lubricity, In addition, there is a problem that the formed film lacks uniformity.
【0004】具体的には、金属摺動部品表面に形成され
た化成皮膜の剥離前後の面粗度においてリン酸マンガン
系ではRz値(JIS)2.0〜2.5μm、リン酸鉄
系複合酸化膜においてもRz値0.4〜0.8μmと粗
かった。なお、表面粗さの測定には、株式会社ミツトヨ
製サーフテストSV402を使用した(以下同じ。)。More specifically, the surface roughness of a chemical conversion film formed on the surface of a metal sliding component before and after peeling is Rz value (JIS) 2.0-2.5 μm for manganese phosphate, The oxide film was rough with an Rz value of 0.4 to 0.8 μm. The surface roughness was measured using Surftest SV402 manufactured by Mitutoyo Corporation (the same applies hereinafter).
【0005】また、モリブデン、タングステン、銅等の
金属イオンを含有するリン酸鉄系の化成皮膜形成剤によ
る皮膜ではアモルファス(非晶質)系の複合金属酸化皮
膜となり、緻密で摩擦係数も低い皮膜とすることができ
たが、膜厚が薄く、またエッチングにより摺動部品の素
材表面の面粗度を粗し耐摩耗性を低下させて摺動性が悪
化し、実車に搭載したバルブシムによる実車試験におい
ても2,000km〜3,000kmの走行により剥離
を生じた。また膜厚を厚くしようとすれば結晶性の金属
が成長するためアモルファス性を維持したまま膜厚を厚
くすることは困難であった。[0005] Further, a film made of an iron phosphate chemical conversion film forming agent containing metal ions such as molybdenum, tungsten and copper becomes an amorphous composite metal oxide film, which is dense and has a low coefficient of friction. However, the film thickness is small, and the surface roughness of the material surface of the sliding parts is reduced by etching, the wear resistance is reduced, and the slidability is deteriorated. Also in the test, peeling was caused by running at 2,000 km to 3,000 km. In addition, when trying to increase the film thickness, a crystalline metal grows, so it was difficult to increase the film thickness while maintaining the amorphous property.
【0006】また、これらの化成皮膜の他にも、アルミ
合金製の摺動部品用皮膜においては電解処理法による硬
質アルマイト処理(アルマイトは登録商標名)が、一部
採用されていた。あるいは電気めっき等の皮膜も採用さ
れたが、これらは、コストが高くまた、いずれも均一性
に欠けピンホールを生じたりすることがあるという問題
があった。また、セラミックス、樹脂類等の摺動部品に
おいては、不導電体であり電気メッキができず、硬質ア
ルマイト処理もできないという問題があった。[0006] In addition to these chemical conversion coatings, a hard alumite treatment by an electrolytic treatment (alumite is a registered trademark) has been partially adopted in a coating for sliding parts made of aluminum alloy. Alternatively, films such as electroplating have been employed, but these have the problems of high cost and lack of uniformity, which may cause pinholes. In addition, sliding parts such as ceramics and resins have the problems that they are nonconductive, cannot be electroplated, and cannot be hard anodized.
【0007】この発明は上記課題を解決するものであ
り、鉄、ステンレス、アルミニウム、銅等の合金、ある
いはセラミックス、樹脂等から形成されるさまざまな素
材の摺動部品において、用途に応じた耐食性、低摩擦
性、潤滑性、耐摩耗性、耐焼付性等の特性を備えた皮膜
を形成でき、処理設備が簡易で、薬品管理が容易で且つ
低コストな摺動部品用表面処理液及び摺動部品の表面処
理方法及び摺動部品を提供することを目的とする。The present invention has been made to solve the above-mentioned problems, and has various kinds of sliding parts made of alloys such as iron, stainless steel, aluminum, and copper, or ceramics and resins. A coating with low friction, lubricity, abrasion resistance, seizure resistance, etc., can be formed, the processing equipment is simple, chemical management is easy, and low cost surface treatment liquid for sliding parts and sliding. An object of the present invention is to provide a surface treatment method for a component and a sliding component.
【0008】[0008]
【課題を解決するための手段】本発明者は、上記課題を
解決する手段として、摺動部品の素材の表面粗さを、R
a値(JIS)0.03μm以下、望ましくは、Ra値
0.01μm〜0.02μm程度に小さくし、且つこの
平滑化された素材表面の面粗度を粗すことのない特殊な
摺動部品用処理液で表面処理をすることにより摺動性の
高い摺動部品を製造できる表面処理方法を開発し、この
表面処理方法により表面処理した摺動部品において上記
課題を解決することに成功した。Means for Solving the Problems As a means for solving the above-mentioned problems, the present inventor has proposed a method for measuring the surface roughness of a material of a sliding part by using R
A special sliding part which has an a value (JIS) of 0.03 μm or less, desirably an Ra value of about 0.01 μm to 0.02 μm and does not roughen the surface roughness of the smoothed material surface. We developed a surface treatment method that can produce sliding parts with high slidability by treating the surface with a treatment liquid, and succeeded in solving the above-mentioned problems in sliding parts surface-treated by this surface treatment method.
【0009】まず、摺動部品の優れた摺動特性を発揮す
るためには、平滑度の高い皮膜を表面に形成することが
必要であり、そのためには素地の平滑度を高く維持する
ことが摺動性の高い皮膜を形成する前提であることに着
目した本発明者は、まずその素地表面調整法を検討し
た。ここで、機械による切削、ダイヤモンド砥石等によ
る研磨では、量産性に欠け、面粗度が均一化しないとい
う欠点を有し、面粗度が均一に平滑化されていない摺動
表面には、平滑化された皮膜が形成できない。そこで、
本発明者は、機械的、物理的研磨方法に加え、化学的研
磨方法を採り入れることにより面粗度を高いレベルで均
一にして平滑化させることに成功した。ここで、化学的
研磨法により単一時間内に、エッジ部を研磨することな
く必要なフラット面のみを研磨するためには、研磨性に
優れたコンパウンドと光沢性と平滑性とを同時に与える
特殊なコンパウンド剤が必要となる。具体的には、アル
キルベンゼンスルホン酸ナトリウム、エチレンジアミン
四酢酸四ナトリウム、ポリオキシエチレンオキシプロピ
レングリコールを主基材としてアルカリ無機塩のビルダ
ーを配合した組成を配合した組成のコンパウンドを用い
る。アルカリ無機塩としては、トリポリリン酸ナトリウ
ム、ピロリン酸ソーダなどが用いられる。その結果、こ
の化学的研磨方法により、均一な面粗度を備えた摺動部
品を量産できるようになり、摺動部品の表面の面粗度が
Ra値(JIS)で0.02μm以下、Rz値で0.1
2μm以下、好ましくはRa値0.015μm、Rz値
0.10〜0.12μmに調整される。First, it is necessary to form a film having high smoothness on the surface in order to exhibit excellent sliding characteristics of the sliding component. For this purpose, it is necessary to maintain a high smoothness of the substrate. The present inventor, who paid attention to the premise of forming a film having high slidability, first studied a method for adjusting the surface of the substrate. Here, cutting with a machine or polishing with a diamond whetstone has the drawback of lacking mass productivity and uneven surface roughness, and the sliding surface having an uneven surface roughness is not smooth. Film cannot be formed. Therefore,
The present inventor has succeeded in smoothing the surface by making the surface roughness uniform at a high level by employing a chemical polishing method in addition to the mechanical and physical polishing methods. Here, in order to polish only the required flat surface without polishing the edge portion within a single time by the chemical polishing method, a special compound that simultaneously provides a compound with excellent polishing properties and gloss and smoothness A large amount of compounding agent is required. Specifically, a compound having a composition in which sodium alkylbenzene sulfonate, tetrasodium ethylenediaminetetraacetate, and polyoxyethyleneoxypropylene glycol are used as main bases and a builder of an alkali inorganic salt is used is used. As the alkali inorganic salt, sodium tripolyphosphate, sodium pyrophosphate and the like are used. As a result, this chemical polishing method enables mass production of sliding parts having a uniform surface roughness, and the surface roughness of the sliding parts is 0.02 μm or less in Ra value (JIS), Rz 0.1 in value
It is adjusted to 2 μm or less, preferably Ra value 0.015 μm and Rz value 0.10 to 0.12 μm.
【0010】ここで、望ましい摺動部品の条件の1つと
して、摺動部品間の相対滑り運動部分において各種要因
により局部的に固体接触状態となり摩擦熱の発生により
溶着または固着し、その部分がむしり取られる現象であ
るスカッフィングを生じず、且つ摩擦係数が低いことが
挙げられる。このような高い耐スカッフィング性、低摩
擦性を得るためには、上記のように極めて平滑に形成さ
れた摺動部品の表面上に、その面粗度を皮膜によって粗
さないように面粗度をRa値0.03μm以下、Rz値
0.15μm以下の均一に平滑化された皮膜を形成し、
その皮膜がアモルファス性に富んだ硬質且つ緻密な金属
により形成されることが必要と本発明者は考えた。Here, one of the desirable conditions for the sliding parts is that the relative sliding movement between the sliding parts is locally brought into a solid contact state due to various factors and is welded or fixed by the generation of frictional heat. Scuffing, which is a phenomenon to be removed, does not occur, and the friction coefficient is low. In order to obtain such high scuffing resistance and low friction property, the surface roughness of the sliding component formed extremely smoothly as described above is adjusted so that the surface roughness is not roughened by the coating. To form a uniformly smoothed film having an Ra value of 0.03 μm or less and an Rz value of 0.15 μm or less,
The present inventor considered that the film needs to be formed of a hard and dense metal rich in amorphous property.
【0011】そこで、本発明者は、設備が大掛かりにな
る電気めっきや、電解による硬質アルマイト処理皮膜で
はコストが高く、又用途に応じた特性を備えた皮膜を形
成することができず、さらにいずれも均一性に欠けピン
ホールを生じたりすることがあるという問題があったた
め、これ以外の皮膜で、これと同等あるいはそれ以上の
諸性能を有する皮膜を模索した。そしてこのような皮膜
を開発するために、試作実験を重ねて試行錯誤し、アモ
ルファス性複合金属皮膜とすることが、摺動部品表面に
おいて優れた摺動性を付与することに有効であると考
え、通常の無電解めっきによって平滑な摺動部品の表面
に、その表面粗度を粗らさない硬くて耐摩耗性の高い平
滑な皮膜が形成できると考えた。そこで、本発明者は、
最初市販の無電解めっき用の処理液により処理にするこ
とを考え、実験を行った。Therefore, the inventor of the present invention has found that in the case of electroplating, which requires large-scale equipment, or in the case of a hard alumite-treated film by electrolysis, the cost is high, and a film having characteristics suitable for the application cannot be formed. In addition, there was a problem that the film lacked uniformity and a pinhole was sometimes generated. Therefore, a film having performance equal to or higher than that of the other films was sought. In order to develop such a film, we believe that it is effective to provide excellent slidability on the surface of sliding parts by making trial and error through repeated trial production experiments and making an amorphous composite metal film. It has been considered that a hard and highly wear-resistant smooth film which does not roughen the surface roughness can be formed on the surface of the smooth sliding component by ordinary electroless plating. Therefore, the present inventor
First, an experiment was carried out in consideration of processing using a commercially available processing solution for electroless plating.
【0012】(実験1)ここで、発明者が行った市販の
無電解めっき用の処理液により処理された摺動部品の摺
動皮膜を形成した実験1を説明する。市販の無電解めっ
き用の処理液には、例えば荏原ユージライト株式会社製
のエンパックRE−MU−II(Ni−P系)、ユニパ
ックBN−S、M、R(Ni−B系)、エバシールドE
C(Cu系)、奥野製薬株式会社製のトップニコロンL
PH−S(Ni−P系)、トップケミアロイ66−M、
1、2(Ni−B系)、カパラシド(Cu系)、キザイ
株式会社製のナイコーME−AR(Ni−P系)、ナイ
コーボロン(Ni−B系)、SEL−カッパ(Cu系)
の各Ni−P系、Ni−B系、Cu系の種々の処理液が
用いられている。このうちNi−P系、Ni−B系の各
処理液による処理を以下に説明する。(Experiment 1) Here, Experiment 1 will be described in which the inventor formed a sliding film of a sliding component treated with a commercially available treatment solution for electroless plating. Commercially available processing solutions for electroless plating include, for example, Epack RE-MU-II (Ni-P system), Unipack BN-S, M, R (Ni-B system), Evashield manufactured by Ebara Uzilite Co., Ltd. E
C (Cu-based), Top Nicolon L manufactured by Okuno Pharmaceutical Co., Ltd.
PH-S (Ni-P type), Top Chemialloy 66-M,
1, 2 (Ni-B system), capparaside (Cu system), Niiko ME-AR (Ni-P system), Niikoboron (Ni-B system), SEL-kappa (Cu system) manufactured by Kizai Co., Ltd.
Ni-P-based, Ni-B-based, and Cu-based treatment liquids are used. Among them, the treatment with each of the Ni-P and Ni-B treatment liquids will be described below.
【0013】 Ni−B系処理液である、ユニパック
BN−S、M、R、ナイコーボロン、トップケミアロイ
66−M、1、2に関しては、処理液の温度を63℃〜
65℃に調整し、pHを、6.0から6.5に調整し、
溶解性ニッケル(Ni2+)の濃度を6g/l〜6.5
g/lに調整して処理を行った。[0013] Regarding the Ni-B-based processing liquids, Unipack BN-S, M, R, Nicoboron, Top Chemialloy 66-M, 1, 2, the temperature of the processing liquid is 63 ° C.
Adjust to 65 ° C., adjust the pH from 6.0 to 6.5,
The concentration of soluble nickel (Ni 2+ ) is from 6 g / l to 6.5
g / l and processed.
【0014】 Ni−P系の処理液である、エンパッ
クRE−MU−II、トップニコロンLPH−S、ナイ
コーME−ARに関しては、処理液の温度を89〜91
℃に調整し、pHを、エンパックRE−MU−IIにつ
いては5.0、他の処理液は6.5に調整し、また、溶
解性ニッケル濃度が、エンパックRE−MU−IIにつ
いては7g/lに、他の処理液については、ニッケル濃
度が6.5g/lに維持して処理を行った。[0014] Regarding the Ni-P-based processing liquids, ENPACK RE-MU-II, Top Nicolon LPH-S, and Nikko ME-AR, the temperature of the processing liquid is 89 to 91.
° C, and the pH was adjusted to 5.0 for Enpack RE-MU-II and 6.5 for other treatment solutions, and the soluble nickel concentration was 7 g / kg for Empack RE-MU-II. 1 and the other processing solutions were processed while maintaining the nickel concentration at 6.5 g / l.
【0015】ここでは、代表してナイコーME−AR
(Ni−P系)及びナイコーボロン(Ni−B系)を用
いた実験についてさらに詳細に説明する。テスト方法と
して、使用したテストピースは、Ra値0.01〜0.
02μmに調整され研磨された直径約28〜31mmで
厚さ約2.3〜2.9mmのSCM415製のものを使
用し、各メーカー指定の作業標準に沿って以下の通りの
工程において皮膜形成を行った。なお、メーカー指定の
作業標準の工程は、ナイコーME−AR(Ni−P系)
及びナイコーボロン(Ni−B系)のいずれも浸漬脱
脂、水洗、電解脱脂、水洗、酸活性、水洗、
ナイコーME−AR(Ni−P系)、ナイコーボロン
(Ni−B系)の順に処理をするものである。また、素
材に応じてとの処理工程の間にNi電析ストライク
めっき工程を行うものである。Here, as a representative, the Nikko ME-AR
Experiments using (Ni-P system) and Nicorboron (Ni-B system) will be described in more detail. As a test method, the test piece used had an Ra value of 0.01 to 0.5.
Using a SCM415 having a diameter of about 28 to 31 mm and a thickness of about 2.3 to 2.9 mm adjusted and polished to 02 μm, a film is formed in the following steps according to the work standard specified by each manufacturer. went. The process of the work standard specified by the manufacturer is Niiko ME-AR (Ni-P system).
And Nicoboron (Ni-B type), both immersion degreasing, water washing, electrolytic degreasing, water washing, acid activity, water washing,
Niiko ME-AR (Ni-P system) and Niikoboron (Ni-B system) are processed in this order. In addition, a Ni electrodeposition strike plating step is performed between the processing steps depending on the material.
【0016】ここで、図1は実験1における処理の工程
を示す図である。皮膜形成の処理の工程は、いずれの場
合も図1に示すように上記メーカー指定の作業標準の工
程に準じ、まず脱脂1をし、続いて1回目水洗2、Ni
−P,Ni−B皮膜形成3、2回目水洗4、湯洗5、乾
燥6の順に行った。各工程の詳細は、以下のようであ
る。FIG. 1 is a diagram showing the steps of the processing in Experiment 1. As shown in FIG. 1, in all cases, the film forming process is performed in accordance with the work standard process specified by the manufacturer, followed by first degreasing 1, followed by first water washing 2, Ni
-P, Ni-B film formation 3, second water washing 4, hot water washing 5, drying 6 in this order. Details of each step are as follows.
【0017】脱脂1は、弱アルカリ系脱脂剤を用い、温
度70℃で10分間揺動させながら浸漬した。テストピ
ースの揺動は、ハンドリングによった(以下の揺動につ
いても同様の処理を行った。)。次に1回目水洗2を、
水道水を常時オーバーフローすることにより行った。そ
のときの温度は室温で、2分間揺動させながら浸漬し
た。次に、Ni−P,Ni−B皮膜形成3の処理を行っ
た。Ni−P,Ni−B皮膜形成3の工程では、処理液
はそれぞれナイコーME−AR(Ni−P系)(180
g/l)と、ナイコーボロン(Ni−B系)(180g
/l)を用い、pHは、水酸化アンモニウム(NH4O
H)あるいは硫酸(H2SO4)を適宜添加してメーカ
ー所定のpH6.5とし、溶解性ニッケル濃度を6.0
g/lとした。温度条件はナイコーME−AR(Ni−
P系)の場合で89〜91℃、ナイコーボロン(Ni−
B系)の場合では、63〜65℃とし、それぞれ20分
間揺動させながら浸漬した。その後2回目水洗4を、水
道水を常時オーバーフローすることにより揺動させなが
ら行った。湯洗5は、75〜85℃に加熱した水道水を
常時オーバーフローさせながら2分間揺動させながら浸
漬し、最後に自己熱を利用した自然乾燥による乾燥6を
行った。Degreasing 1 was immersed in a weakly alkaline degreasing agent at 70 ° C. for 10 minutes while rocking. The swing of the test piece was based on handling (the same processing was performed for the following swing). Next, the first washing 2
This was performed by constantly overflowing tap water. The temperature at that time was room temperature, and it was immersed while rocking for 2 minutes. Next, the process of Ni-P, Ni-B film formation 3 was performed. In the process of forming the Ni-P and Ni-B coatings 3, the processing liquid was Nikko ME-AR (Ni-P type) (180).
g / l) and Nicorboron (Ni-B type) (180 g
/ L) using ammonium hydroxide (NH 4 O).
H) or sulfuric acid (H 2 SO 4 ) as appropriate to adjust the pH to 6.5 as specified by the manufacturer, and to adjust the soluble nickel concentration to 6.0.
g / l. The temperature condition is Niiko ME-AR (Ni-
89-91 ° C in the case of P-type, Nicoboron (Ni-
In the case of (B type), the temperature was 63 to 65 ° C., and each was immersed while rocking for 20 minutes. Thereafter, the second washing 4 was performed while the tap water was constantly shaken by overflowing. The hot water washing 5 was performed by immersing tap water heated to 75 to 85 ° C. while oscillating for 2 minutes while always overflowing, and finally drying 6 by natural drying using self-heating.
【0018】実験1の結果、上記工程及び上記条件によ
り形成された皮膜を調べた結果、ナイコーME−AR
(Ni−P系)及びナイコーボロン(Ni−B系)のい
ずれの場合もSCM415製のテストピースに形成され
た皮膜は、膜厚が約5〜10μmで、硬度がHv500
前後の厚くて硬い皮膜が形成された。しかしながら、皮
膜の密着性が悪く、未処理のテストピースのエッジ部分
で軽く擦った引っ掻きテスト程度で簡単に剥離してしま
った。これは、他の市販の処理液においても同様の結果
であった。As a result of the experiment 1, the film formed under the above-mentioned steps and the above-mentioned conditions was examined.
In both cases (Ni-P system) and Nicorboron (Ni-B system), the film formed on the test piece made of SCM415 has a thickness of about 5 to 10 μm and a hardness of Hv500.
A thick and hard film before and after was formed. However, the adhesion of the film was poor, and the film was easily peeled off by a scratch test that was lightly rubbed at the edge of an untreated test piece. The same result was obtained with other commercially available processing solutions.
【0019】この問題は、摺動部品に用いられるクロム
・モリブデンを多量に含有する特殊鋼ステンレス、高炭
素鋼等において、アルミニウム、ニッケル、コバルト、
クロムなどが、摺動部品の金属表面において不動態化皮
膜を形成することに起因すると考えられた。そうであれ
ば、この種の合金においては、混酸(例えばリン酸、硫
酸、硝酸の中から1種以上と酸性フッ化安門等を添加し
たもの)から成る処理液にて金属表面の活性化処理を行
うか、又はメーカーの指定する工程にあるように、その
後に電解法による大電流を流し且つ特殊な浴組成による
電析ストライクめっきによる薄いニッケルまたは亜鉛の
めっき層を形成した後でなければ、ニッケル−リン系及
び、ニッケル−ホウ素系の還元作用を行う皮膜形成方法
においては完全に皮膜が密着せず、剥離しやすいという
ことが判った。そして、実際に活性化処理または電析ス
トライクめっきによる処理を行なった後でニッケル−リ
ン系またはニッケル−ホウ素系の皮膜処理を行うことで
若干摩擦係数は高いが、密着性の高い皮膜の形成をする
ことができた。[0019] This problem is caused by the fact that aluminum, nickel, cobalt, etc. are used in special steel stainless steel, high carbon steel, etc. containing a large amount of chromium / molybdenum used for sliding parts.
It was considered that chromium and the like were caused by forming a passivation film on the metal surface of the sliding component. If so, in the case of this type of alloy, activation of the metal surface with a treatment solution comprising a mixed acid (for example, a mixture of phosphoric acid, sulfuric acid, nitric acid and at least one of acid ammonium fluoride) is added. After processing or as in the process specified by the manufacturer, after applying a large current by electrolysis and forming a thin nickel or zinc plating layer by electrodeposition strike plating with a special bath composition It has been found that in the method of forming a film that performs a nickel-phosphorus-based and nickel-boron-based reducing action, the film is not completely adhered and is easily peeled. Then, a nickel-phosphorous or nickel-boron-based film treatment is performed after the activation treatment or the electrodeposition strike plating treatment, so that the formation of a film having a slightly high friction coefficient but high adhesion is achieved. We were able to.
【0020】しかし、本発明者は、前述のように面粗度
を粗らすことなく摺動皮膜を形成させるという考えか
ら、酸類等によるエッチング活性化処理をすれば摺動部
品の面粗度を悪化させるため、たとえ密着度が高くなる
処理であってもこのような酸類等によるエッチング活性
化処理は採用できず、またメーカー指定の電析ストライ
クめっきを行うことは、処理が大掛かりになり、製造コ
ストも上昇するため、採用できなかった。また、不動態
化皮膜を形成しない金属であっても、酸類等によるエッ
チングは面粗度を粗すために望ましくないと考えた。However, the inventor of the present invention considered that a sliding film is formed without roughening the surface roughness as described above. Therefore, even if the treatment to increase the degree of adhesion, the etching activation treatment using such acids cannot be adopted, and performing the strike plating plating specified by the manufacturer requires a large amount of treatment. It could not be adopted because the manufacturing cost also increased. In addition, even with a metal that does not form a passivation film, it has been considered that etching with acids or the like is not desirable because the surface roughness is roughened.
【0021】そこで、本発明者は、図1における1回目
水洗2の工程と、上記実験1において使用した処理液ナ
イコーME−AR(Ni−P系)、ナイコーボロン(N
i−B系)によるNi−P,Ni−B皮膜形成3の処理
の間に、複合多次元金属、例えばニッケル−タングステ
ン−リン系の複合三次元金属のアモルファス皮膜を用い
て皮膜を形成する工程と、水洗処理の工程を加えて処理
をすることで密着性が良い皮膜が形成されると予想し、
後に詳述するようにニッケル−タングステン−リン系等
の複合三次元金属のアモルファス皮膜を形成したとこ
ろ、摺動部品表面に密着性よく形成されたニッケル−タ
ングステン−リン系等の複合三次元金属のアモルファス
皮膜の上に、ニッケル−リン系又はニッケル−ホウ素系
の還元作用を行う皮膜が、極めて密着性がよく形成され
ることを見出した。Therefore, the inventor of the present invention has proposed the first washing 2 in FIG. 1 and the treatment liquids Nikko ME-AR (Ni-P type) and Niikoboron (N
Step of forming a film using an amorphous film of a composite multi-dimensional metal, for example, a nickel-tungsten-phosphorus-based composite three-dimensional metal, during the process of forming the Ni-P, Ni-B film 3 by the i-B system). And, it is expected that a film with good adhesion will be formed by performing the treatment by adding the water washing process,
As will be described later in detail, when an amorphous film of a composite three-dimensional metal such as a nickel-tungsten-phosphorous system is formed, a composite three-dimensional metal such as a nickel-tungsten-phosphorus system formed with good adhesion on the surface of a sliding component is formed. It has been found that a film performing a nickel-phosphorous or nickel-boron-based reducing action is formed on the amorphous film with extremely good adhesion.
【0022】このようにして密着性が良好に形成された
ニッケル−リン系又はニッケル−ホウ素系の皮膜は、膜
厚も厚く、硬質で光沢性がある皮膜となった。このよう
な硬質で膜厚の厚い皮膜を密着性よく形成することで、
耐食性、初期馴染み性の良い皮膜とすることができた。The nickel-phosphorus-based or nickel-boron-based film thus formed with good adhesion was a thick, hard and glossy film. By forming such a hard and thick film with good adhesion,
A film having good corrosion resistance and initial familiarity could be obtained.
【0023】しかしながら、用途を金属間の摺動部品と
して使用する場合には、膜厚が15μm以上になると皮
膜表面の面粗度が粗く、摩擦係数が過大であることが判
った。摺動部品として使用する場合には、いくら硬質で
あっても摩擦係数が大きければ金属間の摺動による攻撃
に対する耐摩耗性においては必ずしも有効であるとはい
えない。また、従来より例えばカムに接触、摺動するバ
ルブシムのように金属同士が接触する摺動部品の皮膜に
おいては、ニッケル−リン系、ニッケル−ホウ素系の硬
質な皮膜を膜厚が15〜50μm程度になるように形成
していたが、このような皮膜の組織構成においては、ア
モルファス系の組織は失われ、Ni2PからNi3Pへ
と変化した金属粒子層が結晶化され、高い硬度が維持さ
れている。これは、熱処理を加えることによっても同様
の性状となりうるものであるが、皮膜の表面の極一部の
薄い膜層においては、摩擦係数は十分低いと思われる。
しかし、長時間使用することで、この皮膜の表面の極一
部の薄い膜層において形成された摩擦係数の低い部分の
硬度と膜厚の程度では摺動部品間による攻撃により簡単
に剥離され、摩擦係数が高い結晶質の層が露出してしま
うという問題があった。However, it was found that, when used as a sliding part between metals, when the film thickness was 15 μm or more, the surface roughness of the film surface was rough and the friction coefficient was excessive. When used as a sliding part, no matter how hard it is, it is not necessarily effective in terms of abrasion resistance against attack by sliding between metals if the coefficient of friction is large. Further, conventionally, for example, a coating of a sliding part in which metals are in contact with each other, such as a valve shim that contacts and slides on a cam, is formed of a nickel-phosphorous or nickel-boron-based hard coating having a thickness of about 15 to 50 μm. However, in such a structure of the film, the amorphous structure is lost, the metal particle layer changed from Ni 2 P to Ni 3 P is crystallized, and a high hardness is obtained. Has been maintained. Although the same properties can be obtained by applying heat treatment, the coefficient of friction seems to be sufficiently low in a very thin film layer on the surface of the film.
However, by using for a long time, the hardness and the thickness of the low coefficient of friction portion formed in the very thin film layer on the surface of this film are easily peeled off by attack between sliding parts, There is a problem that a crystalline layer having a high coefficient of friction is exposed.
【0024】この結果から本発明者は、摺動部品の表面
皮膜は、低摩擦係数のアモルファス性の皮膜から構成さ
れたものであることが望ましいものと考えた。そして、
上記開発過程において、以下に述べる実施例を通して、
複合多次元金属をアモルファス性の高いナノメータクラ
スの超微粒子金属皮膜を維持したまま皮膜を発展させ、
摺動部品表面をエッチングにより粗さずその平滑性を保
持したまま皮膜を積層させるには、複数の金属イオンの
供給源と、適当な還元剤と、適当な金属錯化剤等を用
い、この処理液のpHを9以上14以下の範囲になるよ
うに浴組成及び処理液のコントロールすることで、摺動
部品の表面を粗さず、極めて緻密で均質な皮膜が形成で
きる具体的方法を見い出した。From these results, the present inventor considered that it is desirable that the surface film of the sliding component should be composed of an amorphous film having a low friction coefficient. And
In the above development process, through the embodiments described below,
Developing multi-dimensional composite metals while maintaining nanometer-class ultra-fine metal coatings with high amorphous properties,
In order to laminate the film while maintaining the smoothness without roughening the sliding component surface by etching, a plurality of metal ion supply sources, an appropriate reducing agent, an appropriate metal complexing agent, etc. are used. By controlling the bath composition and the treatment liquid so that the pH of the treatment liquid is in the range of 9 to 14, a specific method for forming an extremely dense and uniform film without roughening the surface of the sliding component is found. Was.
【0025】また、望ましくは複数種類の金属粒子を複
合的に皮膜中に共析させることが有効であることを見い
出した。さらに望ましくは摺動部品の使用目的に応じて
その特性に応じた金属を皮膜中に保持できるような連続
相をもったマトリックスを構成した皮膜であることも見
出した。そして、このようなマトリックスは、ニッケル
−リン系もしくはニッケル−ホウ素系の複合皮膜が適し
ており、特にタングステンを含有した皮膜は、高い硬度
を実現できることを見出した。It has also been found that it is effective to co-deposit a plurality of types of metal particles in a coating film. More preferably, the present inventors have also found out that the film has a matrix having a continuous phase so that a metal corresponding to the characteristics of the sliding component can be retained in the film according to the purpose of use. Then, it has been found that a nickel-phosphorous or nickel-boron composite film is suitable for such a matrix, and a film containing tungsten in particular can realize high hardness.
【0026】そして、コイン状メタルエッジでの引っ掻
きテスト、流動遠心バレル内において攻撃性の高いアラ
ンダム製の鋭角を有した変形メディアとともに高速回転
させるテストにおいて、皮膜の密着性が高く剥離しにく
い皮膜が形成されるという効果を確認した。In a scratch test with a coin-shaped metal edge, and in a test in which a high-speed rotation is performed together with a highly aggressive deformed media having an acute angle in a fluid centrifugal barrel, a film having high adhesion of the film and having difficulty in peeling is obtained. Has been confirmed.
【0027】このようなアモルファス性の高いナノメー
タクラスの超微粒子金属皮膜が積層された皮膜では、皮
膜自体の耐摩耗性が高くなるばかりでなく、表面が極め
て平滑に形成されることと併せ、摩擦係数が極めて低く
なるため、摺動部品として長期にわたり使用しても低い
摩擦係数を維持するため、高い耐久性を示すことができ
る。[0027] Such a film in which a nanometer-class ultrafine metal film having a high amorphous property is laminated is not only improved in abrasion resistance of the film itself, but also has a very smooth surface and a high friction. Since the coefficient is extremely low, a low friction coefficient is maintained even when used as a sliding component for a long period of time, so that high durability can be exhibited.
【0028】なお、このようなアモルファス性の高いナ
ノメータクラスの超微粒子金属皮膜には不動態化皮膜は
形成されないため、この皮膜の上に別の皮膜を密着性良
く担持することができる。例えば、前述のようなニッケ
ル−リン系又はニッケル−ホウ素系などの皮膜などのよ
うに硬質の皮膜が形成されるが、摺動部品の素材により
不動態化皮膜のため密着性に問題があった皮膜であって
も、本発明による皮膜を介することにより、そのような
密着性の劣る皮膜を外部に担持して密着性の高い2層構
造とすることができる。そのため、接触する摺動部品の
馴染みができるまで外部の層により摺動することで馴染
み性を良くし、この外部の層が摩耗した後に、摩擦係数
が低く耐摩耗性に優れた硬質なアモルファス性の高い材
料から成る内部の層が露出し、この内部の層で摺動する
ことで極めて低い摩擦係数と、極めて高い耐摩耗性を達
成することも見いだした。例えば、自動車エンジンのカ
ムとこれと摺動するシムにおいて適用した場合は、最初
はカムが硬度の高い上層の皮膜と摺動し、カム自体の表
面が平滑にされ、上層の皮膜が摩耗した段階で下層の低
い摩擦係数の皮膜が露出する。その結果、形状的に馴染
みができたカムとシムが極めて摩擦係数が低い平滑度の
高い面において摺動することで、極めて高い耐久性と低
い摩擦係数を得て、極めて長時間低い摩擦係数で摺動を
させることが可能になる。つまり、摺動部品の使用目的
により、アモルファス性の高いナノメータクラスの超微
粒子金属皮膜を維持したまま皮膜を発展させて積層状に
形成したものと、性質の異なる皮膜を外部に密着性よく
形成した皮膜から成る2層構造としたものとを目的によ
って使い分けることができる。Since a passivation film is not formed on a nanometer class ultrafine particle metal film having a high amorphous property, another film can be carried on the film with good adhesion. For example, a hard film is formed, such as a nickel-phosphorous or nickel-boron-based film as described above, but there was a problem in adhesion due to a passivation film depending on the material of the sliding part. Even if it is a film, such a film having poor adhesion can be carried to the outside to form a two-layer structure having high adhesion through the film according to the present invention. For this reason, the sliding parts that are in contact with each other are slid by the outer layer until they become more familiar, and after the outer layer is worn, the hard amorphous material with a low coefficient of friction and excellent wear resistance is used. It has also been found that an inner layer of a material having a high surface tension is exposed and that sliding on this inner layer achieves a very low coefficient of friction and very high wear resistance. For example, when applied to a cam of an automobile engine and a shim sliding with the cam, the cam first slides with a hard upper layer film, the surface of the cam itself is smoothed, and the upper layer film is worn. The lower layer having a low coefficient of friction is exposed. As a result, the cam and shim that have been familiar in shape slide on the surface with a very low coefficient of friction and a high degree of smoothness, resulting in extremely high durability and a low coefficient of friction. It becomes possible to slide. In other words, depending on the purpose of use of the sliding part, a film with different properties was formed with good adhesion to the outside, with a film developed and laminated while maintaining a nanometer-class ultrafine metal film with high amorphousness One having a two-layer structure composed of a film can be used depending on the purpose.
【0029】[0029]
【発明の実施の形態】以下、本発明に係る摺動部品用表
面処理液及び摺動部品の表面処理方法及びこの表面処理
方法で処理された摺動部品を好ましい実施の形態である
実施例により説明する。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a surface treatment liquid for a sliding component, a method for treating a surface of a sliding component, and a sliding component treated by the surface treatment method according to the present invention will be described by way of a preferred embodiment. explain.
【0030】(実施例1)以下に、実施例1の処理例1
の浴組成を表す表1を示す。(Embodiment 1) The following is a processing example 1 of the embodiment 1.
Table 1 showing the bath composition is shown.
【0031】[0031]
【表1】 [Table 1]
【0032】実施例1の処理工程は以下のようである。
ここで図2は、実施例1の処理の工程を示す図である。
処理は、脱脂101、1回目水洗102、Ni−W−P
皮膜形成103、2回目水洗104、湯洗105、乾燥
106の工程により行う。基本的な工程は、Ni−W−
P皮膜形成103を除き実験1と同様である。各工程の
詳細は、以下のようである。The processing steps of the first embodiment are as follows.
FIG. 2 is a diagram illustrating the steps of the processing according to the first embodiment.
The treatment is degreasing 101, first rinse 102, Ni-WP
Film formation 103, second water washing 104, hot water washing 105, and drying 106 are performed. The basic process is Ni-W-
It is the same as Experiment 1 except for the P film formation 103. Details of each step are as follows.
【0033】(イ)脱脂101の工程に関しては、非シ
リケート系の弱アルカリ性のビルダーを基剤とし光沢鏡
面研磨された摺動部品表面の濡れ性に最も重点を置いた
界面活性剤(第一工業製薬社製プライサーフA−215
C)を使用し、また後工程の皮膜構成要素となる金属塩
微粒子(サーフェイステックス社製CT−1)をバイン
ダーとして用いることを特徴とした脱脂処理液とする。
この処理液で70℃で揺動しながら10分間浸漬した。
揺動はハンドリングによった(以下の各実施例における
揺動についても同じである。)。(A) Regarding the degreasing step 101, a surfactant (Daiichi Kogyo Co., Ltd.) which is based on a non-silicate weak alkaline builder and which gives the most importance to the wettability of the sliding component surface polished to a glossy mirror surface is used. Pharmaceutical Plysurf A-215
A degreasing treatment liquid characterized by using C) and using metal salt fine particles (CT-1 manufactured by Surfacetex Co., Ltd.) as a film constituent element in a subsequent step as a binder.
It was immersed in this treatment solution at 70 ° C. for 10 minutes while rocking.
The swing was based on handling (the same applies to the swing in each of the following embodiments).
【0034】(ロ)次に1回目水洗102の処理を水道
水をオーバーフローさせ、揺動させながら2分間浸漬し
て行い、水ハジキ等のないことを確認する。(B) Next, the treatment of the first water washing 102 is performed by overflowing the tap water and immersing it for 2 minutes while oscillating, and confirming that there is no water cissing or the like.
【0035】(ハ)次にNi−W−P皮膜形成103の
処理を行った。浸漬において、処理温度は、89〜95
℃であり、ここでは89〜91℃とし、浸漬時間は15
〜20分とした。また、浸漬中は揺動した。Ni−W−
P皮膜形成103の処理に使用する処理液は、表1に示
すようなものを用いた。(C) Next, a process for forming a Ni-WP film 103 was performed. In the immersion, the processing temperature is 89-95.
° C, here, 89-91 ° C, and the immersion time is 15
2020 minutes. In addition, it rocked during immersion. Ni-W-
The treatment liquid used in the treatment of forming the P film 103 was as shown in Table 1.
【0036】処理例1では、ニッケルイオンとして硫酸
ニッケルの水和物(NiSO4・6H2O)を20g/
l含有する。硫酸ニッケルの水和物は14〜84g/
l、好ましくは20g/l含有させる。タングステンイ
オンとしてタングステン酸ナトリウムの水和物(Na2
WO4・4H2O)を35g/l含有する。タングステ
ン酸ナトリウムの水和物は、16〜98g/l、好まし
くは35g/l含有させる。なお、ニッケルイオンの供
給源としては、塩化ニッケル、酢酸ニッケルなども好ま
しい。また、処理液中に含有される溶解性ニッケルとし
て6〜7g/l、望ましくは6.5g/lであり、処理
例1においては、溶解性ニッケルを6.0〜7.0g/
lに調整した。In processing example 1, nickel sulfate hydrate (NiSO 4 .6H 2 O) as nickel ions was 20 g /
l. The hydrate of nickel sulfate is 14-84 g /
l, preferably 20 g / l. Sodium tungstate hydrate (Na 2
WO 4 · 4H 2 O) and containing 35 g / l. The hydrate of sodium tungstate contains 16 to 98 g / l, preferably 35 g / l. In addition, as a supply source of nickel ions, nickel chloride, nickel acetate, and the like are also preferable. Further, the soluble nickel contained in the treatment liquid is 6 to 7 g / l, preferably 6.5 g / l, and in the processing example 1, the soluble nickel is 6.0 to 7.0 g / l.
Adjusted to l.
【0037】なお、処理液に含有される金属イオンは、
ニッケルイオン、タングステンイオン、リンイオンに限
定されず、ニッケルイオンと、リンイオン又はホウ素イ
オンの中の少なくとも一方の金属イオンと、タングステ
ンイオン、コバルトイオン、パラジウムイオン、レニウ
ムイオン、イットリウムイオン、モリブデンイオン、チ
タンイオン、マンガンイオン、バナジウムイオン、ジル
コンイオン、クロムイオン、銅イオン、金イオン、銀イ
オン、亜鉛イオン、鉄イオン、鉛イオン、錫イオン、白
金イオンの金属イオン類の中から選ばれた少なくとも一
種以上の金属イオンとを含有したものによっても実施が
できる。The metal ions contained in the processing solution are as follows:
Not limited to nickel ion, tungsten ion, phosphorus ion, nickel ion, at least one metal ion of phosphorus ion or boron ion, tungsten ion, cobalt ion, palladium ion, rhenium ion, yttrium ion, molybdenum ion, titanium ion , Manganese ions, vanadium ions, zircon ions, chromium ions, copper ions, gold ions, silver ions, zinc ions, iron ions, lead ions, tin ions, at least one or more metal ions selected from platinum ions It can also be carried out by a material containing a metal ion.
【0038】(ニ)次に還元剤として次亜リン酸ナトリ
ウムの水和物(NaH2PO2・H2O)を15g/l
含有する。次亜リン酸ナトリウムの水和物は、5〜50
g/l、望ましくは15g/lを含有させる。その結
果、次亜リン酸塩中のリンを複合金属皮膜成分中に2〜
15(重量%)、望ましくは、8〜12(重量%)含有
させる。この範囲で配合することにより皮膜のアモルフ
ァス性が低下することなく、高耐食性、高潤滑性、低摩
擦性を維持し得る。(D) 15 g / l of sodium hypophosphite hydrate (NaH 2 PO 2 .H 2 O) as a reducing agent
contains. The hydrate of sodium hypophosphite is 5 to 50
g / l, preferably 15 g / l. As a result, the phosphorus in the hypophosphite is added to the composite metal film component by 2 to 2.
15 (% by weight), preferably 8 to 12 (% by weight). By blending in this range, high corrosion resistance, high lubricity and low friction can be maintained without lowering the amorphousness of the film.
【0039】なお、還元剤は次亜リン酸ナトリウムに限
定されず、亜リン酸ナトリウム、水素化ホウ素のナトリ
ウム塩若しくはカリウム塩、ジメチルアミンボラン、ジ
エチルアミンボラン、ヒドラジン類、ホルムアルデヒド
類、ロッシエル塩類、ブドウ糖類等の中から選択するこ
とができる。The reducing agent is not limited to sodium hypophosphite, but includes sodium phosphite, sodium or potassium borohydride, dimethylamine borane, diethylamine borane, hydrazines, formaldehydes, Rossier salts, glucose and the like. It can be selected from such as types.
【0040】(ホ)本処理例1では錯形成剤として、ク
エン酸(C6H7O8)を20g/l含有する。クエン
酸の濃度は、10〜25g/l、望ましくは20g/l
である。また、エチレンジアミン四酢酸塩類の水和物
(以下EDTA・4H2Oと略記する。)を10g/l
含有する。EDTA・4H2Oは、少なくとも5g/l
〜50g/l、望ましくは、10g/l含有させる。(E) In the present treatment example 1, citric acid (C 6 H 7 O 8 ) is contained as a complexing agent in an amount of 20 g / l. The concentration of citric acid is 10 to 25 g / l, preferably 20 g / l
It is. Also, hydrates of ethylenediaminetetraacetic acid salts
(Hereinafter abbreviated as EDTA · 4H 2 O) at 10 g / l.
contains. EDTA · 4H 2 O is at least 5 g / l
5050 g / l, desirably 10 g / l.
【0041】錯形成剤は、ニッケル、タングステン、リ
ンの金属イオンがリッチに含有させてあるため、皮膜形
成時に最低限必要な金属イオン以外の金属性物質を不活
性なイオンに錯化させることにより、処理液の長期安定
性を計り、形成される皮膜中のニッケル、タングステ
ン、リンの含有率を平均化させる不可欠な要素となる。
また、皮膜化成反応中に生じる鉄分等不純物質を皮膜組
織中に含有させないことも皮膜品質改善策となる。さら
には、水酸化ニッケル及び亜リン酸ニッケルの沈殿を抑
制し、ニッケルイオン、リンイオンの安定化を図り、皮
膜形成を安定させると共に、浴の自然分解を防止し、皮
膜表面のザラつき防止に寄与する。Since the complexing agent contains rich metal ions of nickel, tungsten, and phosphorus, it is possible to complex a metal substance other than the minimum necessary metal ions at the time of film formation into an inactive ion. It is an indispensable factor for measuring the long-term stability of the processing solution and averaging the contents of nickel, tungsten and phosphorus in the formed film.
It is also a measure for improving the quality of the film that the impurity such as iron generated during the film formation reaction is not contained in the film structure. Furthermore, it suppresses precipitation of nickel hydroxide and nickel phosphite, stabilizes nickel ions and phosphorus ions, stabilizes film formation, prevents spontaneous decomposition of the bath, and contributes to preventing roughening of the film surface. I do.
【0042】なお、錯形成剤は、クエン酸、EDTAに
限定されるものではなく、酒石酸・乳酸・グリコール酸
等のオキシカルボン酸及びそのアルカリ塩類、マロン酸
・コハク酸・マレイン酸等のジカルボン酸及びそのアル
カリ塩類、アンモニア・トリエタノールアミン・エチレ
ンジアミン等のアミン、グリシン・アラニン等のアミノ
酸、ピリジン等の中から選択できる。The complexing agent is not limited to citric acid and EDTA, but oxycarboxylic acids such as tartaric acid, lactic acid and glycolic acid and their alkali salts, and dicarboxylic acids such as malonic acid, succinic acid and maleic acid. And alkali salts thereof, amines such as ammonia, triethanolamine and ethylenediamine, amino acids such as glycine and alanine, and pyridine.
【0043】(ト)本処理例1では、pH調整剤を、ア
ンモニアアルカリ塩として塩化アンモニウム(NH4C
l)を5g/l含有する。塩化アンモニウムは、5.3
〜53.5g/l含有することが望ましい。この処理液
は、60℃〜85℃の比較的低温でリンの含有率とアモ
ルファス性を高める効果と、皮膜の生成温度を早める効
果があり、その後に無機アルカリ塩である苛性ソーダ
(NaOH)でpHを最終コントロールして、所定値で
あるpH9〜10に調整する。(G) In the present processing example 1, ammonium chloride (NH 4 C
l) at 5 g / l. Ammonium chloride is 5.3
Desirably, the content is 53.5 g / l. This treatment liquid has the effect of increasing the phosphorus content and the amorphousness at a relatively low temperature of 60 ° C. to 85 ° C. and the effect of accelerating the film formation temperature. Is finally controlled and adjusted to a predetermined value of pH 9 to 10.
【0044】なお、pH調整剤は、アンモニアアルカリ
塩、苛性ソーダに限定されず、炭酸ナトリウム等の無機
アルカリ塩類、アンモニアを含む有機アルカリ塩基、硫
酸・塩酸等の無機酸、スルファミン酸等の有機酸などの
中から選択できる。The pH adjuster is not limited to ammonia alkali salts and caustic soda, but inorganic alkali salts such as sodium carbonate, organic alkali bases containing ammonia, inorganic acids such as sulfuric acid and hydrochloric acid, and organic acids such as sulfamic acid. You can choose from.
【0045】本処理例1では、pH変動を抑制する緩衝
剤として、重合リン酸塩であるピロリン酸ソーダ(Na
4P2O7)と、ホウ素としてホウ酸(H3BO3)含
有することが望ましい。一般に市販されている処理液は
いずれもプロピオン酸、酢酸塩等を含有したpH域が酸
性側のpH4〜6.5域の処理液で、その特徴としては
ニッケルイオンを殆ど錯形成しないモノカルボン酸は摺
動部品の素材と反応する電極界面のpH変動を緩衝、抑
制することによってめっき速度が早まり、即ち単位時間
当たりの皮膜厚が増大するが、皮膜組織中のPの含有量
は低下することからアモルファス性が失われ結晶化し、
初期においての摩擦係数は低いが、長時間の連続した摺
動においては摩擦係数が大きくなる要因となる。In the present treatment example 1, sodium phosphate pyrophosphate (Na
4 P 2 O 7 ) and boric acid (H 3 BO 3 ) as boron. Generally, all commercially available processing liquids are processing liquids containing propionic acid, acetate and the like in the pH range of 4 to 6.5 on the acidic side, and are characterized by a monocarboxylic acid that hardly forms a complex with nickel ions. Means that buffering and suppressing the pH fluctuation at the electrode interface that reacts with the material of the sliding part increases the plating rate, that is, increases the film thickness per unit time, but decreases the P content in the film structure. Loses amorphousity and crystallizes,
Although the coefficient of friction is low in the initial stage, the coefficient of friction increases in continuous sliding for a long time.
【0046】そこで、本処理例1の処理液では、ピロリ
ン酸ソーダを3〜6g/l、ここでは5g/l、ホウ酸
を5〜15g/l、ここでは、10g/l含有したもの
を採用しpHをアルカリ性に維持することによりアモル
ファス性を消失させることなく皮膜速度を高める。Therefore, the treatment liquid of this treatment example 1 contains sodium pyrophosphate 3-6 g / l, here 5 g / l, boric acid 5-15 g / l, here 10 g / l. By maintaining the pH at an alkaline level, the film speed can be increased without losing the amorphous property.
【0047】なお、pH変動を抑制する緩衝剤として、
目的によりホウ酸、炭酸類、酢酸、酪酸、プロピオン
酸、吉草酸、若しくはこれらのアルカリ塩類の中から選
択できる。ここでは炭酸ナトリウム(Na2CO3)を
3g/l含有する。As a buffer for suppressing pH fluctuation,
Depending on the purpose, it can be selected from boric acid, carbonates, acetic acid, butyric acid, propionic acid, valeric acid, or alkali salts thereof. Here, it contains 3 g / l of sodium carbonate (Na 2 CO 3 ).
【0048】なお、自然分解を抑制するために処理液中
の微粒子を吸着する安定化剤として尿素(H2NCSN
H2)が0.1g/l含有される。安定化剤としては、
尿素の他、チオ尿素、或いは硫化鉛・塩化鉛・塩化アン
チモン等の有機吸着剤の中から選ばれた少なくとも一種
以上を含有することが望まれる。Urea (H 2 NCSN) is used as a stabilizer for adsorbing fine particles in the processing solution in order to suppress spontaneous decomposition.
H 2) is contained 0.1 g / l. As a stabilizer,
In addition to urea, it is desired to contain thiourea or at least one or more selected from organic adsorbents such as lead sulfide, lead chloride and antimony chloride.
【0049】また、活性剤として、アニオン系水溶性特
殊ポリマー、カチオン系水溶性特殊ポリマー、アニオン
系エトキシレートαナフトールスルホン酸、ノニオン系
多鎖型高分子量ノニオン活性剤、アニオン系ジアルキル
スルホコハク酸エステルナトリウムエーテル、ノニオン
系高分子量ポリエチレングリコール等の中から選ばれた
少なくとも一種以上を含有することが望ましい。ここで
はアニオン系エトキシレートαナフトールスルホン酸を
1g/l含有する。Examples of the activator include an anionic water-soluble special polymer, a cationic water-soluble special polymer, an anionic ethoxylate α-naphtholsulfonic acid, a nonionic polychain high molecular weight nonionic activator, and an anionic sodium dialkyl sulfosuccinate. It is desirable to contain at least one or more selected from ethers, nonionic high molecular weight polyethylene glycols and the like. Here, 1 g / l of an anionic ethoxylate α-naphtholsulfonic acid is contained.
【0050】さらに、処理例1においては、硫酸銅の水
和物CuSO4・5H2Oを10g/l含有する。硫酸
銅は、銅イオンを供給し、皮膜の耐食性、展延性、接触
抵抗性が良くなり、導電膜としても使用できる。また、
銅イオンを含有すれば皮膜が酸化分解効果による抗菌、
殺菌、腐敗防止効果を得る。さらに銅イオンを含有する
ことで、遠赤外線酸化分解による抗菌効果が生じ水及び
特に水溶性油剤の腐敗防止の効果を生じる。Further, in the treatment example 1, 10 g / l of copper sulfate hydrate CuSO 4 .5H 2 O is contained. Copper sulfate supplies copper ions, improves the corrosion resistance, spreadability, and contact resistance of the film, and can be used as a conductive film. Also,
If copper ion is contained, the film is antibacterial due to its oxidative decomposition effect
Obtains sterilization and rot prevention effects. Further, by containing copper ions, an antibacterial effect by oxidative decomposition of far-infrared rays is generated, and an effect of preventing spoilage of water and especially a water-soluble oil is generated.
【0051】皮膜形成後、2回目水洗104の処理を、
水道水を常時オーバーフローすることにより揺動させな
がら行った。湯洗105は、75〜85℃に加熱した水
道水を常時オーバーフローさせながら2分間揺動させな
がら浸漬し、最後に自己熱を利用した自然乾燥による乾
燥106を行った。After the film is formed, the second water washing 104 is performed.
It was performed while tap water was constantly shaken by overflowing. In the hot water washing 105, tap water heated to 75 to 85 ° C. was immersed while rocking for 2 minutes while constantly overflowing, and finally, drying 106 by natural drying using self-heating was performed.
【0052】上記処理を行った摺動部品は、SCM41
5のテストピースと同様のコイン状メタルエッジでの引
っ掻きテスト、流動遠心バレル内において攻撃性の高い
アランダム製の鋭角を有する変形メディアとともに高速
回転させるテストにおいて、コイン状メタルエッジによ
っては傷が生じず、皮膜が剥離することもなかった。ま
た、流動遠心バレルによるテストによっても皮膜が剥離
するようなことはなかった。上記実験結果から、処理例
1に述べたような表面処理を行った摺動部品では、使用
当初から長期間連続使用した場合の摺動性においても、
安定した低摩擦性が維持できるという効果が確認でき
た。The sliding parts subjected to the above processing are SCM41
Scratching test with coin-shaped metal edge similar to the test piece of No. 5, and high-speed rotation with highly aggressive Alundum-formed deformed media in a fluid centrifugal barrel. No film was peeled off. Also, the film was not peeled off by the test using the fluidized centrifugal barrel. From the above experimental results, in the sliding parts subjected to the surface treatment as described in the processing example 1, the sliding property when used continuously for a long time from the beginning of use also shows
The effect of maintaining stable low friction was confirmed.
【0053】なお、ニッケル−リン若しくはニッケル−
ホウ素による皮膜の形成においては、ニッケル−リン若
しくはニッケル−ホウ素によるマトリックスが形成され
た構造となり、各種の金属を安定して皮膜内に含有させ
ることができるので、含有させる金属イオンを変化させ
ることにより皮膜に含有される金属の構成を変化させ種
々の特性を持たせることができる。It should be noted that nickel-phosphorous or nickel-
In the formation of a film made of boron, a structure is formed in which a matrix made of nickel-phosphorus or nickel-boron is formed, and various metals can be stably contained in the film. The composition of the metal contained in the film can be changed to give various characteristics.
【0054】例えば、本処理例1の処理液のようにタン
グステンを含有すれば、硬度が高まるという効果があ
る。また、銅イオンを含有すれば耐食性、展延性、接触
抵抗性が良くなり、導電膜としても使用できる。また、
本処理例1に記載の銅イオン以外にも、イットリウムイ
オン、チタンイオン、バナジウムイオン、ジルコニウム
イオン、銀イオンの各イオンを含有することによっても
遠赤外線酸化分解による抗菌効果が生じ水及び特に水溶
性油剤の腐敗防止の効果を生じる。また、銅イオン以外
にもチタンイオン、ジルコニウムイオン、銀イオン、白
金イオンを含有することにより酸化分解効果による抗
菌、殺菌、腐敗防止効果を得る。本処理例1の処理液に
含有されたイオン以外においても、チタンイオン、バナ
ジウムイオンを含有すれば超電導効果、高靱性、高融点
を得ることができる。さらに、白金イオン、バナジウム
イオン、イットリウムイオン、チタンイオンを含有する
ことにより触媒効果による接触分解効果があり、例えば
NOx,SOx,CO2等の分解を行う。タンタルイオ
ン、パラジウムイオンを含有することにより耐食、耐摩
耗性が向上し、鉄イオン、コバルトイオン、マンガンイ
オン、ホウ素イオンを含有させることにより皮膜を磁性
材料として使用することができる。また、レニウムイオ
ンを含有すれば高融点を備えた耐熱性材料とすることが
できる。なお、イオン構成は、3種類に限らず4種類以
上の構成とすることもできる。このように処理液中のイ
オンを複数種類のイオンにより構成することで高い摺動
性を備えるとともに、使用目的により処理液に含有させ
る金属イオンの種類を変更しその皮膜の特性を適正なも
のとすることができる。For example, when tungsten is contained as in the processing solution of the present processing example 1, there is an effect that hardness is increased. In addition, when copper ions are contained, corrosion resistance, spreadability, and contact resistance are improved, and they can be used as a conductive film. Also,
In addition to the copper ion described in the present processing example 1, by containing each ion of yttrium ion, titanium ion, vanadium ion, zirconium ion and silver ion, an antibacterial effect by oxidative decomposition of far-infrared ray is generated, and water and especially water-soluble This has the effect of preventing oil from spoiling. Further, by containing titanium ion, zirconium ion, silver ion, and platinum ion in addition to copper ion, antibacterial, sterilization, and rot preventive effects by oxidative decomposition effect are obtained. In addition to the ions contained in the treatment liquid of the present treatment example 1, if a titanium ion or a vanadium ion is contained, a superconducting effect, high toughness, and a high melting point can be obtained. Further, a platinum ion, a vanadium ion, yttrium ion, there is cracking effect catalytic effect by containing titanium ions is carried out for example NOx, SOx, degradation such as CO 2. Corrosion resistance and abrasion resistance are improved by containing tantalum ions and palladium ions, and the film can be used as a magnetic material by containing iron ions, cobalt ions, manganese ions, and boron ions. In addition, a heat-resistant material having a high melting point can be obtained by containing rhenium ions. The ion configuration is not limited to three types, but may be four or more types. In this way, the ion in the processing liquid is composed of a plurality of types of ions to provide high slidability and to change the type of metal ions to be contained in the processing liquid depending on the purpose of use to make the characteristics of the film appropriate. can do.
【0055】さらに、処理例1の皮膜形成では、処理液
のpHが9〜10に維持されるので、酸による摺動部品
の表面のエッチングが行われず、化学的研磨方法により
鏡面処理された摺動部品の面粗度を粗すことがなく、皮
膜表面の面粗度もこれにより高いレベルを維持すること
ができる。そのため、使用開始時においても摩擦係数が
小さいばかりか、ある程度摩耗して皮膜が薄くなって
も、摺動部品の自体が露出しにくく、長時間にわたり摩
擦係数が小さい状態を維持することができる。Further, in the film formation of the processing example 1, since the pH of the processing liquid is maintained at 9 to 10, the surface of the sliding component is not etched by the acid, and the mirror-finished sliding is performed by the chemical polishing method. The surface roughness of the moving part is not roughened, and the surface roughness of the coating surface can be maintained at a high level. Therefore, even at the beginning of use, not only the friction coefficient is small, but even if the film becomes thin due to some wear, the sliding component itself is hardly exposed, and the state where the friction coefficient is small can be maintained for a long time.
【0056】(処理例2)ここで、本実施例1の処理例
2について説明する。表2に処理例2の処理液の配合を
示す。(Processing Example 2) Here, processing example 2 of Embodiment 1 will be described. Table 2 shows the composition of the processing liquid of Processing Example 2.
【0057】[0057]
【表2】 [Table 2]
【0058】処理例2においては、図2のNi−W−P
形成皮膜103の工程の処理液のpHを9〜10とし、
89〜93℃で20分の処理を行った。その結果、密着
性が良好になり、摩擦係数も小さくなった。そして皮膜
表面の光沢性も良く、耐食性、硬度共に良好になった。
また面粗度はRa値0.015μmと良好であった。In processing example 2, the Ni-WP of FIG.
PH of the treatment liquid in the process of forming film 103 is 9 to 10,
The treatment was performed at 89 to 93 ° C for 20 minutes. As a result, the adhesion was improved and the coefficient of friction was reduced. The glossiness of the film surface was good, and both the corrosion resistance and the hardness were good.
The surface roughness was as good as the Ra value of 0.015 μm.
【0059】(処理例3)ここで、実施例1の処理例3
について説明する。表3に処理例3の処理液の配合を示
す。(Processing Example 3) Here, Processing Example 3 of Embodiment 1
Will be described. Table 3 shows the composition of the processing liquid of Processing Example 3.
【0060】[0060]
【表3】 [Table 3]
【0061】処理例3においては、図2のNi−W−P
形成皮膜103の工程の処理液のpHを7〜8.5と
し、89〜93℃で20分の処理を行った。ニッケルイ
オンやタングステンイオンを増加させ錯形成剤であるク
エン酸ナトリウムを増量した。その結果、密着性は良好
であったが、摩擦係数が大きく、表面が白色がかった無
光沢の皮膜となり、目視においても面粗度が粗くなった
ことが分かり、測定値においても面粗度が上昇してRa
値で0.06μm程度となり摺動皮膜には適さない結果
となった。In processing example 3, the Ni-WP of FIG.
The pH of the treatment liquid in the process of forming the coating 103 was adjusted to 7 to 8.5, and treatment was performed at 89 to 93 ° C. for 20 minutes. Nickel ions and tungsten ions were increased to increase the amount of complexing agent sodium citrate. As a result, the adhesion was good, but the coefficient of friction was large, the surface became a dull film with a white tint, and it was found that the surface roughness became rough even by visual inspection. Ra up
The value was about 0.06 μm, which was not suitable for a sliding film.
【0062】なお、pHを9以上に調整したとき、特に
pH11.5以上では良好な皮膜を得ることができた。
そのため、イオンの含有量の差がなくても、pHにより
皮膜の平滑さにpHが重要な影響を与えていることが明
らかになった。つまり、pHが9以上が素材生地の表面
をエッチングにより粗さないため望ましく、特にpH1
1.5以上が平滑度の高い皮膜の形成には望ましいこと
がわかった。When the pH was adjusted to 9 or more, a good film could be obtained particularly at pH 11.5 or more.
Therefore, it has been clarified that the pH has an important influence on the smoothness of the film even when there is no difference in the ion content. That is, a pH of 9 or more is desirable because the surface of the material dough is not roughened by etching.
It was found that 1.5 or more is desirable for forming a film having high smoothness.
【0063】(処理例4)ここで、実施例1の処理例4
について説明する。表4に処理例4の処理液の配合を示
す。(Processing Example 4) Here, Processing Example 4 of Embodiment 1
Will be described. Table 4 shows the composition of the processing liquid of Processing Example 4.
【0064】[0064]
【表4】 [Table 4]
【0065】処理例4においては、図2のNi−W−P
形成皮膜103の工程の処理液のpHを6.5とし、8
9〜93℃で20分の処理を行った。酸性タイプの処理
液を用いて比較のため処理を行ったものである。その結
果、密着性は良好であったが、摩擦性が悪く、酸による
エッチングの影響で無光沢で面粗度がRa値0.06μ
mと上昇し、摺動皮膜には適さない結果となった。In processing example 4, the Ni-WP of FIG.
The pH of the treatment liquid in the process of forming the coating film 103 was set to 6.5 and 8
The treatment was performed at 9 to 93 ° C for 20 minutes. The treatment was performed for comparison using an acidic treatment liquid. As a result, the adhesion was good, but the friction was poor, and the surface was matte and the Ra value was 0.06 μm due to the effect of etching with acid.
m, which is not suitable for a sliding film.
【0066】(処理例5)次に、実施例1の処理例5に
ついて説明する。表5に処理例5の処理液の配合を示
す。(Processing Example 5) Next, a processing example 5 of the first embodiment will be described. Table 5 shows the composition of the processing liquid of Processing Example 5.
【0067】[0067]
【表5】 [Table 5]
【0068】処理例5においては、図2のNi−W−P
形成皮膜103の工程の処理液のpHを6.5とし、8
9〜93℃で20分の処理を行った。このタイプも酸性
タイプであり、特にNiSO4・6H2OとNa2WO
4・2H2Oの含有量を増加させたものである。その結
果、密着性は良好であったが、ニッケルイオン及びタン
グステンイオンは増加しても、酸によるエッチングの影
響から皮膜表面は白色でザラつき無光沢で摩擦性が悪
く、面粗度がRa値0.06μmと上昇し摺動皮膜には
適さないことがわかった。In processing example 5, the Ni-WP of FIG.
The pH of the treatment liquid in the process of forming the coating film 103 was set to 6.5 and 8
The treatment was performed at 9 to 93 ° C for 20 minutes. This type is also acidic type, in particular NiSO 4 · 6H 2 O and Na 2 WO
Is obtained by increasing the content of 4 · 2H 2 O. As a result, the adhesion was good, but even though nickel ions and tungsten ions increased, the surface of the film was white, rough, matte, and poor in friction due to etching by acid, and the surface roughness was Ra value. It was found to be 0.06 μm, which was not suitable for a sliding film.
【0069】(処理例6)次に、実施例1の処理例6に
ついて説明する。表6に処理例6の処理液の配合を示
す。(Processing Example 6) Next, a processing example 6 of the first embodiment will be described. Table 6 shows the composition of the processing liquid of Processing Example 6.
【0070】[0070]
【表6】 [Table 6]
【0071】処理例6においては、図2のNi−W−P
形成皮膜103の工程の処理液のpHを11〜12と
し、89〜93℃で20分の処理を行った。このタイプ
は、アルカリタイプであり、必要な助剤以外を含まない
ものである。その結果、処理例2と略同等の結果で、密
着性が良好になり、摩擦係数も小さくなった。そして皮
膜表面の光沢性も良く、耐食性、硬度共に良好になっ
た。また面粗度はRa値0.015μmと良好であっ
た。但し処理例2より皮膜の膜厚が若干薄目であった。
従って、pHの管理により素材生地の酸によるエッチン
グを防止できることがわかった。そして、処理例6に含
まれておらず、処理例2に含まれている助剤等が皮膜の
膜厚を厚くすることがわかった。In processing example 6, the Ni-WP of FIG.
The pH of the treatment liquid in the process of the formation film 103 was set to 11 to 12, and treatment was performed at 89 to 93 ° C. for 20 minutes. This type is an alkali type and does not contain any other than the necessary auxiliaries. As a result, the adhesion was good and the coefficient of friction was small, almost the same result as in processing example 2. The glossiness of the film surface was good, and both the corrosion resistance and the hardness were good. The surface roughness was as good as the Ra value of 0.015 μm. However, the thickness of the film was slightly thinner than that in the processing example 2.
Therefore, it was found that by controlling the pH, it was possible to prevent the etching of the base material by acid. And it turned out that the auxiliary | assistant etc. which are not included in the processing example 6 but are included in the processing example 2 increase the film thickness of a film | membrane.
【0072】(処理例7)ここで、処理例7について説
明する。表7に処理例7の処理液の配合を示す。(Processing Example 7) Here, processing example 7 will be described. Table 7 shows the composition of the processing liquid of Processing Example 7.
【0073】[0073]
【表7】 [Table 7]
【0074】処理例7の処理液は、Ni−B系の皮膜で
あり、実験1と同様の工程により処理をして、図1のN
i−B形成皮膜3の工程の処理液のpHを11.7と
し、90から92℃で20分の処理を行った。その結
果、光沢、面粗度、摩擦係数の点で良好な皮膜が密着良
く得られた。従って、Ni−B系の皮膜においても、p
Hを11.7に維持すれば、面粗度が良好な皮膜を得ら
れることがわかった。The treatment liquid of the treatment example 7 is a Ni—B-based film, and is treated in the same process as in the experiment 1 to obtain the N-B film shown in FIG.
The pH of the treatment liquid in the process of the i-B forming film 3 was set to 11.7, and the treatment was performed at 90 to 92 ° C. for 20 minutes. As a result, a good film was obtained with good adhesion in terms of gloss, surface roughness and coefficient of friction. Therefore, even in the Ni-B type coating, p
It was found that when H was maintained at 11.7, a film having good surface roughness could be obtained.
【0075】(処理例8)ここで、処理例8について説
明する。表8に処理例8の処理液の配合を示す。(Processing Example 8) Here, processing example 8 will be described. Table 8 shows the composition of the processing liquid of Processing Example 8.
【0076】[0076]
【表8】 [Table 8]
【0077】処理例8においては、実験1と同様の工程
により処理をして、図1のNi−B形成皮膜3の工程の
処理液のpHを13〜14とし、90〜92℃で20分
の処理を行った。その結果、処理例7に比較して、さら
に高いpHにより、さらに光沢、面粗度、摩擦係数の点
で良好な皮膜が密着良く得られることが判った。In the treatment example 8, the treatment was carried out in the same process as in the experiment 1, the pH of the treatment solution in the process of the Ni—B forming film 3 in FIG. Was performed. As a result, it was found that, as compared with the treatment example 7, a film having better adhesion in terms of gloss, surface roughness, and coefficient of friction could be obtained with a higher pH value.
【0078】(処理例9)ここで、処理例9について説
明する。表9に処理例9の処理液の配合を示す。(Processing Example 9) Here, processing example 9 will be described. Table 9 shows the composition of the processing liquid of Processing Example 9.
【0079】[0079]
【表9】 [Table 9]
【0080】処理例9においては、実験1と同様の工程
により処理をして、図1のNi−B形成皮膜3の工程の
処理液のpHメータで測定しながらpHを14〜15と
し、90〜92℃で20分の処理を行った。その結果、
処理例8に比較して、さらに光沢、面粗度、摩擦係数の
点で良好な皮膜が密着良く得られた。但し、pHが14
を超えると処理液の分解が促進されるので、好ましくは
pHが14までであることも判明した。In the treatment example 9, the treatment was carried out in the same manner as in the experiment 1, and the pH was adjusted to 14 to 15 while measuring with the pH meter of the treatment solution in the step of the Ni—B forming film 3 in FIG. A treatment was performed at -92 ° C for 20 minutes. as a result,
As compared with the treatment example 8, a better film was obtained with better adhesion in terms of gloss, surface roughness, and coefficient of friction. However, pH 14
It was also found that the pH was preferably up to 14, since the decomposition of the processing solution was promoted when the pH exceeded 1.
【0081】(実施例2)次に、実施例2の説明をす
る。ここで、図3は、実施例2の処理の工程を示す図で
ある。実施例2の処理工程は、脱脂201、1回目水洗
202、Ni−W−P皮膜形成203、2回目水洗20
4、Ni−W−P−BN皮膜形成205、3回目水洗2
06、湯洗207、乾燥208の各工程からなる。な
お、2回目水洗204の工程は省略することができる。
実施例2では、図1に示す実施例1のNi−W−P皮膜
形成103の処理の後に、実施例1の浴組成にさらに窒
化ホウ素(BN)の粒子を分散させた懸濁液であるBN
スラリー(日新リフラテック株式会社)を実施例1の処
理液に添加した処理液を用いた皮膜形成の処理を行うも
のである。BNスラリー等の懸濁液は、水系の液体に窒
化ホウ素等の微粒子を高分子系のポリマー、乳化剤、活
性剤等により十分分散しているので、これを処理液に混
入し攪拌することで窒化ホウ素等の微粒子が容易に処理
液内に分散させることができる。このように、処理液に
BNスラリーを0.5g/l添加し、この処理液によ
り、水洗後に、さらに浸漬処理をするものである。処理
工程は実施例1と、Ni−W−P−BN皮膜形成20
5、3回目水洗206を除き、同一の工程であるので、
これらの説明は省略し、Ni−W−P−BN皮膜形成2
05の処理の工程のみを説明する。(Embodiment 2) Next, Embodiment 2 will be described. Here, FIG. 3 is a diagram illustrating the steps of the processing of the second embodiment. The processing steps of Example 2 include degreasing 201, first rinsing 202, Ni-WP film formation 203, and second rinsing 20.
4. Ni-WP-BN film formation 205, third water washing 2
06, hot water washing 207, and drying 208. The step of the second water washing 204 can be omitted.
Example 2 is a suspension in which particles of boron nitride (BN) are further dispersed in the bath composition of Example 1 after the treatment of forming the Ni-WP film 103 of Example 1 shown in FIG. 1. BN
This is a process for forming a film using a processing solution obtained by adding a slurry (Nissin Refurtec) to the processing solution of Example 1. In a suspension such as a BN slurry, fine particles such as boron nitride are sufficiently dispersed in a water-based liquid by a polymer-based polymer, an emulsifier, an activator, and the like. Fine particles such as boron can be easily dispersed in the processing solution. As described above, 0.5 g / l of the BN slurry is added to the treatment liquid, and the treatment liquid is further subjected to immersion treatment after washing with water. The processing steps are the same as those in Example 1 and the formation of the Ni-WP-BN film 20
Since it is the same process except for the fifth and third washing 206,
These explanations are omitted, and Ni-WP-BN film formation 2
Only the process step 05 will be described.
【0082】Ni−W−P−BN皮膜形成205の処理
の工程における、処理液への浸漬は、実施例1の処理液
による浸漬と同様、揺動しながら90℃、5分間行う。In the process of forming the Ni—WP—BN film 205, the immersion in the treatment liquid is performed at 90 ° C. for 5 minutes while rocking, as in the immersion with the treatment liquid of the first embodiment.
【0083】なお、処理液に添加する粒子は、窒化ホウ
素に限定されず、アルミナ・二酸化ケイ素・三酸化タン
グステン・ジルコニア・二酸化チタン等の分散粒子、又
は黒鉛・二硫化モリブデン・フッ素樹脂等のいずれかの
中から選択できる。また、添加する粒子は、懸濁液に加
工されたものに限らず、粉末状の粒子であってもよい
が、懸濁液とすると処理液への分散が容易になるという
効果がある。The particles added to the treatment liquid are not limited to boron nitride, but may be any of dispersed particles of alumina, silicon dioxide, tungsten trioxide, zirconia, titanium dioxide, etc., or graphite, molybdenum disulfide, fluororesin, etc. You can choose from Further, the particles to be added are not limited to those processed into a suspension, and may be powdery particles. However, a suspension has the effect of facilitating dispersion in a treatment liquid.
【0084】実施例2では、上記述べたような表面処理
を行うことで、実施例1に述べた表面処理法により形成
された皮膜に比べ、膜厚が厚くなり、面粗度が若干粗れ
るといえるが、硬度としては同等な硬度を備える。そし
て、皮膜内に取り込まれた窒化ホウ素の微粒子の働きで
摩擦係数が下がる。従って、面粗度は多少は粗れるもの
の摩擦係数が低下することで摺動性は良くなり、同等の
硬度を有し、膜厚も厚いため耐摩耗性の点では望ましい
特性となる。さらに、窒化ホウ素を含有させれば耐熱性
が向上し金型等に応用することもできるという効果もあ
る。In the second embodiment, by performing the above-described surface treatment, the film thickness is increased and the surface roughness is slightly increased as compared with the film formed by the surface treatment method described in the first embodiment. It can be said, however, that it has an equivalent hardness. Then, the coefficient of friction is lowered by the action of the fine particles of boron nitride taken into the film. Therefore, although the surface roughness is somewhat roughened, the sliding property is improved by lowering the friction coefficient, the hardness is the same, and the film thickness is large, which is a desirable characteristic in terms of wear resistance. Further, when boron nitride is contained, there is an effect that the heat resistance is improved and it can be applied to a mold or the like.
【0085】(実施例3)次に、実施例3の説明をす
る。ここで、図4は実施例3の処理の工程を示す図であ
る。実施例3における処理は、脱脂301、1回目水洗
302、Ni−W−P−BN皮膜形成303、2回目水
洗304、湯洗305、乾燥306の工程から成る。実
施例2では、図2に示す実施例1のNi−W−P皮膜形
成203の処理の後に、浴組成にBNスラリーを0.5
g/l添加した処理液により処理をするNi−W−P−
BN皮膜形成205の処理したが、実施例3において
は、実施例1の処理液にBNスラリーを添加した浴組成
で、一度に浸漬、皮膜形成の処理をするNi−W−P−
BN皮膜形成303の処理をするものである。従って、
Ni−W−P−BN皮膜形成303の処理の工程以外
は、実施例2と同様の処理を行うためその説明は省略
し、Ni−W−P−BN皮膜形成303の処理の工程に
ついてのみ説明する。Third Embodiment Next, a third embodiment will be described. Here, FIG. 4 is a diagram showing the steps of the processing of the third embodiment. The treatment in the third embodiment includes the steps of degreasing 301, first washing 302, formation of a Ni-WP-BN film 303, second washing 304, hot washing 305, and drying 306. In Example 2, the BN slurry was added to the bath composition by 0.5 after the treatment of forming the Ni-WP film 203 of Example 1 shown in FIG.
g / l Ni-WP-
Although the BN film formation 205 was treated, in Example 3, Ni-WP- which was immersed and formed a film at a time with a bath composition in which the BN slurry was added to the treatment liquid of Example 1 was used.
The BN film formation 303 is performed. Therefore,
Except for the process of forming the Ni-WP-BN film 303, the same process as that of the second embodiment is performed, so that the description thereof is omitted, and only the process of the process of forming the Ni-WP-BN film 303 is described. I do.
【0086】Ni−W−P−BN皮膜形成303の処理
の工程の浴組成を説明する。実施例1のNi−W−P皮
膜形成103(図2参照)や実施例2のNi−W−P皮
膜形成203の処理工程で用いる処理液では、Ni+2
を6.0〜7.0g/lに調整した処理液を用いて処理
するが、処理が継続されると溶解性ニッケルが消費され
るため、処理の継続によって溶解性ニッケルが希釈され
る。そのため、適宜高濃度の硫酸ニッケルを補充して溶
解性ニッケル濃度を所定範囲まで上昇させるが、その
際、溶解性ニッケルが3.6g/lにまで低下した処理
液を回収して廃棄する必要がある。この回収された溶解
性ニッケルが3.6g/lにまで低下した処理液にBN
スラリーを0.5g/l添加することで、実施例3のN
i−W−P−BN皮膜形成303の処理に用いる処理液
が調製できる。pHは、pH9.0に調整する。浸漬
は、揺動しながら90℃、5分間行う。又、皮膜形成
後、同様に2回目水洗304、湯洗305、乾燥306
を行う。The bath composition in the process of forming the Ni-WP-BN film 303 will be described. In the processing liquid used in the process of forming the Ni—WP film 103 (see FIG. 2) in Example 1 and the process of forming the Ni—WP film 203 in Example 2, Ni + 2
Is treated using a treatment solution adjusted to 6.0 to 7.0 g / l. However, if the treatment is continued, the soluble nickel is consumed. Therefore, the treatment is continued to dilute the soluble nickel. Therefore, a high concentration of nickel sulfate is appropriately replenished to raise the soluble nickel concentration to a predetermined range. At this time, it is necessary to collect and dispose of the processing solution in which the soluble nickel has dropped to 3.6 g / l. is there. BN was added to the treatment solution in which the recovered soluble nickel was reduced to 3.6 g / l.
By adding 0.5 g / l of the slurry, the N
A processing solution used for the process of forming the i-WP-BN film 303 can be prepared. The pH is adjusted to pH 9.0. The immersion is performed at 90 ° C. for 5 minutes while rocking. After the film is formed, a second water washing 304, a hot water washing 305, and a drying 306 are similarly performed.
I do.
【0087】なお、この場合も処理液に分散させる粒子
は、窒化ホウ素に限定されず、アルミナ・二酸化ケイ素
・三酸化タングステン・ジルコニア・二酸化チタン等の
分散粒子、又は黒鉛・二硫化モリブデン・フッ素樹脂等
のいずれかの中から選択できる。また、添加する粒子
は、懸濁液に加工されたものに限らず、粉末状の粒子で
あってもよい。In this case as well, the particles dispersed in the treatment liquid are not limited to boron nitride, but are dispersed particles of alumina, silicon dioxide, tungsten trioxide, zirconia, titanium dioxide, etc., or graphite, molybdenum disulfide, fluorine resin. And so on. The particles to be added are not limited to those processed into a suspension, but may be powdery particles.
【0088】実施例3の工程による処理を行うことで、
実施例1に述べた表面処理法により形成された皮膜に比
べ、膜厚が厚くなり、面粗度が若干粗れるといえるが、
硬度としては同等な硬度を備える。そして、皮膜内に取
り込まれた窒化ホウ素の微粒子の働きで摩擦係数が下が
る。従って、面粗度は多少は粗れるものの摩擦係数が低
下することで摺動性は良くなり、同等の硬度を有し、膜
厚も厚いため耐摩耗性の点では望ましい特性となる。さ
らに、窒化ホウ素を含有させれば耐熱性が向上し金型等
に応用することもできるという効果もある。By performing the processing according to the process of the third embodiment,
Compared to the film formed by the surface treatment method described in Example 1, it can be said that the film thickness is large and the surface roughness is slightly rough.
Hardness is equivalent. Then, the coefficient of friction is lowered by the action of the fine particles of boron nitride taken into the film. Therefore, although the surface roughness is somewhat roughened, the sliding property is improved by lowering the friction coefficient, the hardness is the same, and the film thickness is large, which is a desirable characteristic in terms of wear resistance. Further, when boron nitride is contained, there is an effect that the heat resistance is improved and it can be applied to a mold or the like.
【0089】なお、実施例2と実施例3の皮膜自体は、
その表面においては特性的に違いがない。しかしなが
ら、実施例3においては、Ni−W−P皮膜形成の処理
において、処理の継続により減少した溶解性ニッケルを
補充するため、硫酸ニッケル(NiSO4・6H2O)
を補充する必要があるが、その際溶解性ニッケル濃度が
低減した処理液を一部廃棄し、廃棄した処理液の量と同
じ量の新しい硫酸ニッケル(NiSO4・6H2O)を
補充して入れ替える。この際に廃棄された溶解性ニッケ
ル濃度が3.6g/l程度に低減した処理液であって
も、実施例3の表面処理法には使用できる。そのため、
実施例1あるいは実施例2における処理により廃棄され
た処理液を再利用することができる。従って、廃棄する
廃水の量を減らすことができるため廃水の処理が容易に
なる。そして、廃水処理によるコストが削減できるとい
う効果がある。The coatings of Example 2 and Example 3 were:
There is no difference in characteristics on the surface. However, in Example 3, in the processing of Ni-W-P film formation, in order to replenish the reduced solubility of nickel by continued treatment, nickel sulfate (NiSO 4 · 6H 2 O)
The it is necessary to replenish, that time discard part a treatment liquid soluble nickel concentration is reduced, supplemented with new nickel sulfate in the same amount as the amount of waste and treatment liquid (NiSO 4 · 6H 2 O) Replace it. At this time, even the processing solution discarded in which the concentration of soluble nickel is reduced to about 3.6 g / l can be used for the surface treatment method of Example 3. for that reason,
The processing liquid discarded by the processing in the first embodiment or the second embodiment can be reused. Therefore, since the amount of wastewater to be discarded can be reduced, the treatment of wastewater becomes easy. And there is an effect that the cost by wastewater treatment can be reduced.
【0090】(実施例4)次に、実施例4について説明
する。ここで、図5は、実施例4の処理の工程を示す図
である。実施例4における処理の工程は、脱脂401、
1回目水洗402、Ni−W−P皮膜形成403、2回
目水洗404、Ni−P,Ni−B皮膜形成405、3
回目水洗406、湯洗407、乾燥408から成る。実
施例4における処理の工程は、図2に示す実施例1のN
i−W−P皮膜形成103の処理により皮膜が形成され
た後に、2回目水洗104の後にニッケル−リン系又
は、ニッケル−ホウ素系の皮膜を形成する処理を加えた
ものである。(Embodiment 4) Next, Embodiment 4 will be described. Here, FIG. 5 is a diagram illustrating the steps of the processing of the fourth embodiment. The processing steps in Example 4 are degreasing 401,
First water wash 402, Ni-WP film formation 403, second water wash 404, Ni-P, Ni-B film formation 405,3
It comprises a second water washing 406, a hot water washing 407, and a drying 408. The processing steps in the fourth embodiment are the same as those in the first embodiment shown in FIG.
After the film is formed by the process of forming the i-W-P film 103, a process of forming a nickel-phosphorous or nickel-boron-based film is added after the second water washing 104.
【0091】実施例1で述べたようなと同様なNi−W
−P皮膜形成403の工程が終了した時点で、2回目水
洗404をし、実験例1に示す処理液でNi−P,Ni
−B皮膜形成405の処理をする。このときの条件は、
ナイコーME−AR(Ni−P系)、(180g/l)
若しくはナイコーボロン(Ni−B系)(180g/
l)を用い、pHはメーカー所定のpH6.5とし、溶
解性ニッケルを6.5g/lとした。温度条件を、ナイ
コーME−AR(Ni−P系)で90〜92℃、ナイコ
ーボロン(Ni−B系)では、63〜65℃とし、それ
ぞれ20分間揺動させながら浸漬した。そして、実験例
1と同様、3回目水洗406を、水道水を常時オーバー
フローすることにより揺動させながら行った。湯洗40
7は、75〜85℃に加熱した水道水を常時オーバーフ
ローさせながら2分間揺動させながら浸漬し、最後に自
己熱を利用した自然乾燥による乾燥408を行った。The same Ni-W as described in the first embodiment
At the time when the step of forming the -P film 403 is completed, a second water washing 404 is performed, and the Ni-P, Ni
-The process of forming the B film 405 is performed. The condition at this time is
Nikko ME-AR (Ni-P type), (180 g / l)
Alternatively, Nikon boron (Ni-B type) (180 g /
The pH was adjusted to 6.5 as specified by the manufacturer, and the soluble nickel was adjusted to 6.5 g / l. The temperature conditions were 90-92 ° C for Niiko ME-AR (Ni-P type) and 63-65 ° C for Niikoboron (Ni-B type). Then, similarly to Experimental Example 1, the third water washing 406 was performed while the tap water was constantly shaken by overflowing. 40
For No. 7, tap water heated to 75 to 85 ° C. was immersed while rocking for 2 minutes while constantly overflowing, and finally dried 408 by natural drying using self-heat.
【0092】なおこの場合の処理液は、上記処理液に限
定されず、無電解めっき用の処理液である市販の例えば
荏原ユージライト株式会社製のエンパックRE−MU−
II(Ni−P系)、ユニパックBN−S、M、R(N
i−B系)、エバシールドEC(Cu系)、奥野製薬株
式会社製のトップニコロンLPH−S(Ni−P系)、
トップケミアロイ66−M、1、2(Ni−B系)、カ
パラシド(Cu系)、キザイ株式会社製のナイコーME
−AR(Ni−P系)、ナイコーボロン(Ni−B
系)、SEL−カッパ(Cu系)の各Ni−P系、Ni
−B系、Cu系の種々の処理液が用いられている。この
うちNi−P系、Ni−B系の各処理液をはじめ、種々
の無電解めっき用の処理液を用いることができるのはい
うまでもない。The processing solution in this case is not limited to the above-mentioned processing solution, but is a commercially available processing solution for electroless plating, for example, ENPACK RE-MU- manufactured by Ebara Uzilite Co., Ltd.
II (Ni-P type), Unipack BN-S, M, R (N
i-B system), Evashield EC (Cu system), Top Nicolon LPH-S (Ni-P system) manufactured by Okuno Pharmaceutical Co., Ltd.,
Top Chemialloy 66-M, 1, 2 (Ni-B system), Capallaside (Cu system), Niiko ME manufactured by Kisai Co., Ltd.
-AR (Ni-P type), Niikoboron (Ni-B
System), SEL-kappa (Cu system) Ni-P system, Ni
Various processing liquids of -B type and Cu type are used. Of these, it goes without saying that various processing solutions for electroless plating can be used, including Ni-P-based and Ni-B-based processing solutions.
【0093】実施例4による処理によれば、アモルファ
ス性の高い微粒子金属皮膜の上に、一定の膜厚の硬質な
ニッケル−リン系又はニッケル−ホウ素系、或いは銅系
などの皮膜を密着して形成できる。そのため、接触する
摺動部品の馴染みができるまで外部の層により摺動する
ことで馴染み性を良くし、この外部の層が摩耗した後
に、低摩擦性と耐摩耗性に優れた硬質なアモルファス性
の高い材料から成る内部の層が露出し、この内部の層で
摺動することで極めて低い摩擦性と、極めて高い耐摩耗
性を達成することができた。According to the treatment according to the fourth embodiment, a hard nickel-phosphorous, nickel-boron, or copper-based film having a constant film thickness is adhered on the fine amorphous metal film. Can be formed. For this reason, the sliding parts that are in contact with each other are slid by the outer layer until they become more familiar, and after the outer layer is worn out, the hard amorphous material with low friction and excellent wear resistance The inner layer made of a material having a high abrasion resistance was exposed, and extremely low friction and extremely high wear resistance could be achieved by sliding with the inner layer.
【0094】(実施例5)次に、実施例5について説明
する。ここで、図6(a),(b)は、実施例5の処理
の工程を示す図である。実施例5の処理は、1つは図6
(a)に示すように、脱脂501、1回目水洗502、
Ni−W−P−BN皮膜形成503、2回目水洗50
4、Ni−P,Ni−B皮膜形成505、3回目水洗5
06、湯洗507、乾燥508の処理工程から成る。も
う1つは、図6(b)に示すように、脱脂509、1回
目水洗510、Ni−W−P皮膜形成511、2回目水
洗512、Ni−W−P−B皮膜形成513、3回目水
洗514、Ni−P,Ni−B皮膜形成515、4回目
水洗516、湯洗517、乾燥518の処理工程から成
る。つまり実施例2〜実施例3によりNi−W−P−B
N皮膜が形成された後に、Ni−P,Ni−B皮膜を形
成するものである。従って、図6(a)に示す処理50
1〜504は、図4に示す実施例2の処理301〜30
4と同様であり、図6(b)に示す処理509〜514
は、図3に示す実施例3の処理201〜206と同様で
あるためその説明は省略する。(Embodiment 5) Next, Embodiment 5 will be described. Here, FIGS. 6A and 6B are diagrams illustrating the steps of the processing of the fifth embodiment. One of the processes of the fifth embodiment is shown in FIG.
As shown in (a), degreasing 501, first washing 502,
Ni-WP-BN film formation 503, second water washing 50
4. Ni-P, Ni-B film formation 505, third water washing 5
06, hot water washing 507, and drying 508. The other is, as shown in FIG. 6B, degreasing 509, first rinsing 510, Ni-WP film formation 511, second rinsing 512, Ni-WPB film formation 513, third time The process comprises the steps of washing 514, forming Ni-P and Ni-B films 515, fourth washing 516, hot water 517, and drying 518. That is, according to the second and third embodiments, Ni-WPB
After the N film is formed, the Ni-P and Ni-B films are formed. Therefore, the process 50 shown in FIG.
1 to 504 are processes 301 to 30 of the second embodiment shown in FIG.
4 and the processing 509 to 514 shown in FIG.
Are the same as the processes 201 to 206 of the third embodiment shown in FIG.
【0095】実施例2〜3で述べたように、Ni−W−
P−BNによる複合多次元金属皮膜形成の処理の工程が
終了し水洗が終了した段階で、Ni−P,Ni−B皮膜
形成505(図6(a))、515(図6(b))の処
理を行う。Ni−P,Ni−B皮膜形成505(図6
(a))、515(図6(b))の処理は、実験例1に
示す処理液で処理をする。このときの条件は、ナイコー
ME−AR(Ni−P系)(180g/l)処理液と、
同じくナイコーボロン(Ni−B系)(180g/l)
を用い、pHはメーカー所定のpH6.5とし、溶解性
ニッケルを6.5g/lとした。温度条件は、ナイコー
ME−ARで90〜92℃、ナイコーボロンでは、63
〜65℃とし、それぞれ20分間揺動させながら浸漬し
た。そして、実験例1と同様、3回目水洗506(図6
(a))または4回目水洗516(図6(b))を、水
道水を常時オーバーフローすることにより揺動させなが
ら行った。湯洗507(図6(a))、517(図6
(b))は、75〜85℃に加熱した水道水を常時オー
バーフローさせながら2分間揺動させながら浸漬し、最
後に自己熱を利用した自然乾燥による乾燥508(図6
(a))、518(図6(b))を行った。As described in Examples 2-3, Ni-W-
At the stage when the process of forming the composite multidimensional metal film by P-BN is completed and the washing is completed, Ni-P, Ni-B film formation 505 (FIG. 6 (a)) and 515 (FIG. 6 (b)) Is performed. Ni-P, Ni-B film formation 505 (FIG. 6)
(A)) The processing of 515 (FIG. 6 (b)) is performed with the processing liquid shown in Experimental Example 1. The conditions at this time were as follows: Niiko ME-AR (Ni-P system) (180 g / l) processing solution,
Similarly, Nikon boron (Ni-B type) (180 g / l)
The pH was adjusted to 6.5 as specified by the manufacturer, and the soluble nickel was adjusted to 6.5 g / l. The temperature conditions are 90-92 ° C. for Niiko ME-AR and 63 for Niikoboron.
6565 ° C., and immersed while rocking each for 20 minutes. Then, similarly to Experimental Example 1, the third washing 506 (FIG. 6)
(A)) or the fourth rinsing 516 (FIG. 6 (b)) was performed while tap water constantly overflowing and rocking. Hot water washing 507 (FIG. 6A), 517 (FIG.
(B)) is immersed in tap water heated to 75 to 85 ° C. while oscillating for 2 minutes while constantly overflowing, and finally drying 508 by natural drying using self-heating (FIG. 6).
(A)) and 518 (FIG. 6 (b)).
【0096】実施例5のような工程により処理をするこ
とでさらにアモルファス性の高いナノメータクラスの超
微粒子金属皮膜の上に、一定の膜厚の硬質なニッケル−
リン系又はニッケル−ホウ素系などの皮膜を密着して形
成できた。そのため、接触する摺動部品の馴染みができ
るまで外部の層により摺動することで馴染み性を良く
し、この外部の層が摩耗した後に、低摩擦性と耐摩耗性
に極めて優れた硬質なアモルファス性の高いナノメータ
クラスの超微粒子金属材料から成る内部の層が露出し、
この内部の層で摺動することで極めて低い摩擦性と、極
めて高い耐摩耗性を達成することができた。By performing the treatment in accordance with the steps as in Example 5, a hard nickel-based metal film having a certain film thickness is formed on a nanometer-class ultrafine metal film having a higher amorphous property.
A phosphorus-based or nickel-boron-based film could be formed in close contact. For this reason, the sliding parts that are in contact with each other are slid by the outer layer until they become familiar, and after the outer layer is worn, a hard amorphous material with extremely low friction and excellent wear resistance is obtained. The inner layer composed of highly nanometer class ultra-fine metal material is exposed,
By sliding with this inner layer, extremely low friction and extremely high wear resistance could be achieved.
【0097】以上本発明を実施例により説明したが、本
発明は上記実施例に限定されるものではなく、特許請求
の範囲を逸脱しない範囲で変形して実施できることはい
うまでもない。例えば、実施例2又は実施例3において
分散させる粒子に銅粉、粉末ゴム、珪砂等を用いること
で、摩擦係数を高めスリップを防止するようなこともで
きる。Although the present invention has been described with reference to the embodiment, it is needless to say that the present invention is not limited to the above-described embodiment, and can be modified and implemented without departing from the scope of the claims. For example, by using copper powder, powder rubber, silica sand, or the like for the particles to be dispersed in Example 2 or Example 3, it is possible to increase the friction coefficient and prevent slip.
【0098】[0098]
【発明の効果】請求項1に係る発明の摺動部品用表面処
理液によれば、摺動部品の面粗度をエッチング等で粗ら
すことなく、極めて均質で硬度が高く、緻密なアモルフ
ァス性の高い皮膜を形成する表面処理を行うことができ
るという効果がある。また、錯形成剤により、処理液自
体も安定した品質とすることができるため、薬品管理も
容易になる。従って、このような摺動部品用表面処理液
により形成された皮膜をもった摺動部品では、アモルフ
ァス性の高いナノメータクラスの超微粒子金属皮膜が積
層された皮膜となり、皮膜自体の耐摩耗性が高くなるば
かりでなく、表面が極めて平滑に形成されることと併
せ、摩擦係数が極めて低くなるため、摺動部品として長
期にわたり使用しても、低い摩擦性を維持しつつ高い耐
久性を示すという効果を奏する。さらに、ニッケル−リ
ン若しくはニッケル−ホウ素のマトリックスが形成され
た構造に各種の金属を安定して配置できるので、摺動部
品の目的に併せてその皮膜の構成を変化させることがで
きるという効果がある。According to the surface treatment liquid for sliding parts according to the first aspect of the present invention, the surface roughness of the sliding parts is not roughened by etching or the like, but is extremely uniform, high in hardness and dense and amorphous. There is an effect that a surface treatment for forming a highly-reactive film can be performed. In addition, since the processing solution itself can be made to have a stable quality by the complex forming agent, chemical management is also facilitated. Therefore, a sliding part having a film formed by such a surface treatment liquid for a sliding part is a film in which a nanometer-class ultrafine metal film having a high amorphous property is laminated, and the abrasion resistance of the film itself is reduced. In addition to being high, the friction coefficient is extremely low, in addition to the fact that the surface is formed extremely smooth, so that even if used as a sliding component for a long time, it shows high durability while maintaining low friction. It works. Furthermore, since various metals can be stably arranged in the structure in which the matrix of nickel-phosphorus or nickel-boron is formed, there is an effect that the configuration of the coating can be changed according to the purpose of the sliding component. .
【0099】請求項2に係る発明の摺動部品用表面処理
液によれば、請求項1に係る発明の摺動部品用表面処理
液の効果に加え、リンイオン又はホウ素イオンをバラン
ス良く配合することができるという効果がある。According to the surface treatment liquid for sliding parts of the second aspect of the present invention, in addition to the effects of the surface treatment liquid for the sliding parts of the first aspect, phosphorus ions or boron ions are blended in a well-balanced manner. There is an effect that can be.
【0100】請求項3に係る発明の摺動部品用表面処理
液によれば、請求項1又は請求項2に係る発明の摺動部
品用表面処理液の効果に加え、タングステンイオンを含
有させることで極めて摺動部品の表面への密着性を高め
ることができ、それ自身で摺動性の高い皮膜を形成する
ことができるばかりでなく、密着性の劣る他の皮膜を密
着良く担持することができるため、密着性の劣る異種の
皮膜を密着性良く形成させることができるという効果が
ある。According to the surface treatment liquid for a sliding component of the third aspect of the present invention, in addition to the effect of the surface treatment solution for a sliding component of the first or second aspect of the invention, tungsten ions are contained. In this way, it is possible to extremely enhance the adhesion to the surface of the sliding component, and not only to form a film having high slidability on its own, but also to carry another film having poor adhesion with good adhesion. Therefore, there is an effect that a heterogeneous film having poor adhesion can be formed with good adhesion.
【0101】請求項4に係る発明の摺動部品用表面処理
液によれば、請求項1乃至請求項3のいずれかに記載の
摺動部品用表面処理液の効果に加え、特にアモルファス
性の高い摺動特性の良い皮膜を形成することができると
いう効果がある。According to the surface treatment liquid for sliding parts of the invention according to claim 4, in addition to the effect of the surface treatment liquid for sliding parts according to any one of claims 1 to 3, especially the amorphous property There is an effect that a good film having high sliding characteristics can be formed.
【0102】請求項5に係る発明の摺動部品用表面処理
液によれば、請求項1乃至請求項4のいずれかに記載の
摺動部品用表面処理液の効果に加え、含有する粒子の特
性により摺動性をさらに高めることができるという効果
がある。According to the surface treatment liquid for sliding parts of the invention according to claim 5, in addition to the effect of the surface treatment liquid for sliding parts according to any one of claims 1 to 4, in addition to the effects of the particles contained therein, There is an effect that the slidability can be further enhanced by the characteristics.
【0103】請求項6に係る発明の摺動部品の表面処理
方法によれば、請求項1乃至請求項5のいずれかに記載
の摺動部品用表面処理液を用いることで、平滑に研磨さ
れた摺動部品の表面と相俟って、極めて摺動性の高い摺
動部品の表面処理を行うことができるという効果があ
る。According to the surface treatment method for a sliding part of the invention according to the sixth aspect, by using the surface treatment liquid for a sliding part according to any one of the first to fifth aspects, the surface is smoothly polished. In combination with the surface of the sliding component, the surface treatment of the sliding component having extremely high slidability can be performed.
【0104】請求項7に係る発明の摺動部品の表面処理
方法によれば、請求項6に記載の摺動部品の表面処理方
法の効果に加え、Ra値が0.03以下に研磨されるこ
とで、極めて平滑に形成された摺動部品の表面に、その
面粗度を粗すことがない平滑な皮膜を形成でき、摺動部
品の表面に極めて摺動性の良好な表面処理を行うことが
できるという効果がある。According to the surface treatment method for a sliding component of the invention according to claim 7, in addition to the effect of the surface treatment method for a sliding component according to claim 6, the Ra value is polished to 0.03 or less. This makes it possible to form a smooth coating on the surface of the extremely smooth sliding component without roughening the surface roughness, and to perform a surface treatment with extremely good slidability on the surface of the sliding component. There is an effect that can be.
【0105】請求項8に係る発明の摺動部品の表面処理
方法によれば、請求項6又は請求項7に記載の摺動部品
の表面処理方法の効果に加え、量産性、安定性に優れた
平滑な摺動部品の表面処理を行うことができるという効
果がある。According to the surface treatment method for a sliding component of the invention according to the eighth aspect, in addition to the effect of the surface treatment method for a sliding component according to the sixth or seventh aspect, excellent mass productivity and stability are obtained. There is an effect that surface treatment of smooth sliding parts can be performed.
【0106】請求項9に係る発明の摺動部品の表面処理
方法によれば、請求項6乃至請求項8のいずれかに記載
の摺動部品の表面処理方法の効果に加え、性質の異なる
皮膜をその表面に密着性よく形成でき、それぞれの皮膜
の性質を生かした、摺動性の高い摺動部品の表面処理を
行うことができるという効果がある。According to the surface treatment method for a sliding component according to the ninth aspect of the present invention, in addition to the effect of the surface treatment method for a sliding component according to any one of the sixth to eighth aspects, a film having different properties is provided. Can be formed on the surface with good adhesion, and there is an effect that surface treatment of a sliding component having high slidability utilizing the properties of the respective films can be performed.
【0107】請求項10に係る発明の摺動部品によれ
ば、請求項6乃至請求項9のいずれかに記載の摺動部品
の処理方法により表面処理がなされた摺動性の高い摺動
部品とすることができるという効果がある。According to a tenth aspect of the present invention, there is provided a sliding component having a high slidability, the surface of which is treated by the method of any of the sixth to ninth aspects. There is an effect that can be.
【図1】実験1における処理の工程を示す図である。FIG. 1 is a diagram showing the steps of processing in Experiment 1.
【図2】実施例1の処理の工程を示す図である。FIG. 2 is a diagram showing the steps of the processing of Example 1.
【図3】実施例2の処理の工程を示す図である。FIG. 3 is a diagram showing a process of processing in a second embodiment.
【図4】実施例3の処理の工程を示す図である。FIG. 4 is a diagram showing a process of a process according to a third embodiment.
【図5】実施例4の処理の工程を示す図である。FIG. 5 is a diagram illustrating a process of processing according to a fourth embodiment.
【図6】(a)実施例5の処理の工程の例を示す図であ
る。 (b)実施例5の処理の工程の他の例を示す図である。FIG. 6A is a diagram illustrating an example of a process of a process according to a fifth embodiment. (B) It is a figure which shows another example of the process of the process of Example 5.
101…脱脂、102…1回目水洗、103…Ni−W
−P皮膜形成、104…2回目水洗、105…湯洗、1
06…乾燥101: degreasing, 102: first washing with water, 103: Ni-W
-P film formation, 104: second water washing, 105: hot water washing, 1
06 ... Dry
フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C09D 201/00 C09D 201/00 Fターム(参考) 4J038 AA011 CD092 HA036 HA216 HA356 HA446 HA476 KA02 NA01 NA11 PB06 PB07 PC02 PC03 4K022 AA02 AA48 BA01 BA02 BA03 BA04 BA05 BA06 BA07 BA08 BA09 BA11 BA12 BA13 BA14 BA15 BA16 BA17 BA18 BA19 BA20 BA21 BA22 BA24 BA25 BA26 BA28 BA32 BA33 BA34 BA36 CA11 CA28 DA01 DB01 DB02 DB03 DB04 DB05 DB06 DB07 Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat II (reference) C09D 201/00 C09D 201/00 F term (reference) 4J038 AA011 CD092 HA036 HA216 HA356 HA446 HA476 KA02 NA01 NA11 PB06 PB07 PC02 PC03 4K022 AA02 AA48 BA01 BA02 BA03 BA04 BA05 BA06 BA07 BA08 BA09 BA11 BA12 BA13 BA14 BA15 BA16 BA17 BA18 BA19 BA20 BA21 BA22 BA24 BA25 BA26 BA28 BA32 BA33 BA34 BA36 CA11 CA28 DA01 DB01 DB02 DB03 DB04 DB05 DB06 DB07
Claims (10)
然分解を抑制するために処理液中の微粒子を吸着する安
定化剤と、pH変動を抑制するための緩衝剤と、活性剤
とを含有して構成され、 ニッケルイオンと、 リンイオン又はホウ素イオンの中の少なくとも一方の金
属イオンと、 タングステンイオン、コバルトイオン、パラジウムイオ
ン、レニウムイオン、イットリウムイオン、モリブデン
イオン、チタンイオン、マンガンイオン、バナジウムイ
オン、ジルコンイオン、クロムイオン、銅イオン、金イ
オン、銀イオン、亜鉛イオン、鉄イオン、鉛イオン、錫
イオン、白金イオンの金属イオン類の中から選ばれた少
なくとも一種以上の金属イオンとを含有し、 pHが9以上14以下になるように調整されたことを特
徴とする摺動部品用表面処理液。1. A reducing agent, a complexing agent for metal ions, a stabilizer for adsorbing fine particles in a processing solution for suppressing spontaneous decomposition, a buffering agent for suppressing pH fluctuation, and an activator. And nickel ions, at least one metal ion of phosphorus ions or boron ions, tungsten ion, cobalt ion, palladium ion, rhenium ion, yttrium ion, molybdenum ion, titanium ion, manganese ion, At least one metal ion selected from the group consisting of vanadium ion, zircon ion, chromium ion, copper ion, gold ion, silver ion, zinc ion, iron ion, lead ion, tin ion and platinum ion A surface for sliding parts, characterized in that the pH is adjusted to be 9 or more and 14 or less. Management solution.
れかの金属イオンは、還元剤として含有されたことを特
徴とする請求項1に記載の摺動部品用表面処理液。2. The surface treatment liquid for a sliding part according to claim 1, wherein the metal ion of either the phosphorus ion or the boron ion is contained as a reducing agent.
種のイオン、若しくはニッケルイオン、タングステンイ
オン、ホウ素イオンの3種のイオンを含有したことを特
徴とする請求項1又は請求項2に記載の摺動部品用表面
処理液。3. The surface treatment liquid for a sliding part includes nickel ions, tungsten ions, and phosphorus ions.
The surface treatment liquid for a sliding component according to claim 1, wherein the surface treatment liquid contains a species ion or three types of ions, a nickel ion, a tungsten ion, and a boron ion.
になるように含有したことを特徴とする請求項1乃至請
求項3のいずれかに記載の摺動部品用表面処理液。4. The surface treatment liquid for a sliding part, wherein the content of phosphorus is 3 to 15% by weight of the formed film component.
The surface treatment liquid for a sliding component according to any one of claims 1 to 3, wherein the surface treatment liquid is contained so as to be:
ニア・二酸化チタン等の酸化物、黒鉛、二硫化モリブデ
ン、窒化ホウ素、フッ素樹脂のいずれかの中から選ばれ
た一種以上の粒子を分散させたことを特徴とする請求項
1乃至請求項4のいずれかに記載の摺動部品用表面処理
液。5. The surface treatment liquid for a sliding component is selected from the group consisting of oxides such as alumina, silicon dioxide, tungsten trioxide, zirconia, and titanium dioxide, graphite, molybdenum disulfide, boron nitride, and fluororesin. The surface treatment liquid for a sliding component according to claim 1, wherein one or more selected particles are dispersed.
の摺動部品用表面処理液を用いて、平滑に研磨された摺
動部品の表面に、無電解めっきにより皮膜を形成するこ
とを特徴とする摺動部品の表面処理方法。6. A film is formed by electroless plating on a smooth polished surface of a sliding component using the surface treating solution for a sliding component according to claim 1. A surface treatment method for a sliding component.
は、Ra値が0.03μm以下になるように研磨された
ことを特徴とする請求項6に記載の摺動部品の表面処理
方法。7. The method according to claim 6, wherein the surface of the sliding component to be subjected to the surface treatment is polished so that the Ra value becomes 0.03 μm or less. .
は、機械的研磨方法による研磨の後に化学的研磨方法に
より研磨されたことを特徴とする請求項6又は請求項7
に記載の摺動部品の表面処理方法。8. The surface of the sliding part to be subjected to the surface treatment is polished by a chemical polishing method after being polished by a mechanical polishing method.
The surface treatment method for a sliding component according to item 1.
の表面処理方法により形成された皮膜の上に、ニッケル
及びリン、又はニッケル及びホウ素を含有した無電解ニ
ッケルめっきによる皮膜をさらに形成することを特徴と
する摺動部品の表面処理方法。9. A film formed by electroless nickel plating containing nickel and phosphorus or nickel and boron on the film formed by the surface treatment method according to claim 6. A surface treatment method for a sliding component.
載された摺動部品の表面処理方法により処理されたこと
を特徴とする摺動部品。10. A sliding component which has been treated by the surface treatment method for a sliding component according to claim 6. Description:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000003039A JP2001192850A (en) | 2000-01-11 | 2000-01-11 | Surface treating solution for sliding parts, surface treating method for sliding parts and sliding parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000003039A JP2001192850A (en) | 2000-01-11 | 2000-01-11 | Surface treating solution for sliding parts, surface treating method for sliding parts and sliding parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001192850A true JP2001192850A (en) | 2001-07-17 |
Family
ID=18532053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000003039A Withdrawn JP2001192850A (en) | 2000-01-11 | 2000-01-11 | Surface treating solution for sliding parts, surface treating method for sliding parts and sliding parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001192850A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004024985A1 (en) * | 2002-09-11 | 2004-03-25 | Inspire Technology Resource Management Corporation | Electroless-plating solution, method of electroless plating with the same, and object plated by electroless plating |
| JP2004124261A (en) * | 2002-10-04 | 2004-04-22 | Enthone Inc | Electroless precipitation method for metal |
| JP2005350686A (en) * | 2004-06-08 | 2005-12-22 | Gunma Univ | Mechanical parts |
| JP2007056346A (en) * | 2005-08-26 | 2007-03-08 | Matsushita Electric Ind Co Ltd | Electroless nickel plating bath and electroless plating method using the same |
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| JP2013253282A (en) * | 2012-06-06 | 2013-12-19 | Kanto Gakuin | Electroless plating bath and electroless plated film |
| WO2014017636A1 (en) | 2012-07-26 | 2014-01-30 | 株式会社ミクニ | Electric pump |
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| CN104451614A (en) * | 2014-10-30 | 2015-03-25 | 天津大学 | Preparation method of nickel coated graphite and application of nickel coated graphite in copper-based nickel coated graphite composite material |
| JP2017529409A (en) * | 2014-06-23 | 2017-10-05 | サウスワイヤー・カンパニー・リミテッド・ライアビリティ・カンパニーSouthwire Company,Llc | UV resistant superhydrophobic coating composition |
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2000
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004024985A1 (en) * | 2002-09-11 | 2004-03-25 | Inspire Technology Resource Management Corporation | Electroless-plating solution, method of electroless plating with the same, and object plated by electroless plating |
| JP2004124261A (en) * | 2002-10-04 | 2004-04-22 | Enthone Inc | Electroless precipitation method for metal |
| JP2005350686A (en) * | 2004-06-08 | 2005-12-22 | Gunma Univ | Mechanical parts |
| JP2007056346A (en) * | 2005-08-26 | 2007-03-08 | Matsushita Electric Ind Co Ltd | Electroless nickel plating bath and electroless plating method using the same |
| JP2008266788A (en) * | 2007-03-29 | 2008-11-06 | Ebara Corp | Electroless plating bath and method for producing high-temperature apparatus member using the bath |
| JP2013253282A (en) * | 2012-06-06 | 2013-12-19 | Kanto Gakuin | Electroless plating bath and electroless plated film |
| WO2014017636A1 (en) | 2012-07-26 | 2014-01-30 | 株式会社ミクニ | Electric pump |
| WO2014017633A1 (en) | 2012-07-26 | 2014-01-30 | 株式会社ミクニ | Electric pump |
| JP2017529409A (en) * | 2014-06-23 | 2017-10-05 | サウスワイヤー・カンパニー・リミテッド・ライアビリティ・カンパニーSouthwire Company,Llc | UV resistant superhydrophobic coating composition |
| CN104451614A (en) * | 2014-10-30 | 2015-03-25 | 天津大学 | Preparation method of nickel coated graphite and application of nickel coated graphite in copper-based nickel coated graphite composite material |
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