JP2001125136A - Liquid crystal display device and method of manufacturing the same - Google Patents

Abstract

(57) Abstract: A method for manufacturing a liquid crystal display device, in which a first substrate and a second substrate are opposed to each other and bonded with a certain gap via a spacer, and a liquid crystal is injected into the gap. hand,
A liquid crystal display device having good characteristics can be manufactured at a low cost by a simple manufacturing process. SOLUTION: On a first substrate 1 on which a transparent electrode 6 and a TFT 31 are formed, a photosensitive polyimide film 8 is formed on a substantially entire surface to a predetermined thickness. By performing half exposure and development using a predetermined mask, a pixel region 30 occupied by the transparent electrode 6 is formed.
Is partially removed in the thickness direction. The polyimide film 8 left on the first substrate 1 is fired and polymerized. The surface of the polyimide film 8 is rubbed to align the liquid crystal 19.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a liquid crystal display device and a method for manufacturing the same. More specifically, the present invention relates to an active matrix type liquid crystal display device including a thin film transistor (hereinafter, referred to as “TFT”) for each pixel and a method for manufacturing the same.

[0002]

2. Description of the Related Art A general active matrix type color liquid crystal display device has a substrate on which a transparent electrode (pixel electrode) divided for each pixel and a TFT as a switching element are formed (this is called an "active matrix substrate"). .)
And a substrate formed by overlapping a color filter and a transparent electrode (common electrode) commonly connected to a plurality of pixels (this is referred to as a “color filter substrate”). It is manufactured by bonding with a certain gap through the gap and injecting liquid crystal into the gap.

The active matrix substrate is manufactured, for example, as follows. As shown in FIG. 4A, a gate electrode 102 is formed on a TFT region 131 of a transparent insulating substrate 101, and then a gate insulating film 103 is formed so as to cover the whole area on the substrate 101. Further TF
An a-Si (amorphous silicon) layer 104 serving as a channel on the T region 131 so as to overlap with the gate electrode 102;
And an n ⁺ -Si (n-type amorphous silicon) layer 105 serving as source / drain regions. Next, the substrate 101
ITO (tin-added indium oxide) to cover the whole area
And a source / drain wiring 107 made of metal are formed on the TFT region 131.
To form Then, after forming a groove 110 for separating the source / drain, a SiNx film (silicon nitride film) 118 is deposited on the substrate 101 as an insulating protective film by a CVD (chemical vapor deposition) method. As shown in FIG.
A resist 119 is provided on the TFT region 131 by performing photolithography, and as shown in FIG. 4C, a portion of the SiNx film 118 on the pixel region 130 is removed by etching using the resist 119 as a mask. The reason why the SiNx film 118 on the pixel region 130 is removed in this way is to prevent an excessive voltage drop from occurring in the insulating protective film during operation and to apply an appropriate voltage to the liquid crystal layer. . After removing the resist 119, as shown in FIG. 4D, an alignment film 121 made of polyimide is formed so as to cover substantially the entire area on the substrate 101.
Rubbing is applied to the surface of. The purpose of providing the alignment film 121 subjected to the rubbing treatment in this way is to align the liquid crystal injected between the substrates in a desired direction.

On the other hand, in the color filter substrate, a light-shielding film is formed in a lattice pattern on a transparent insulating substrate, and three colors of R (red), G (green), and B (blue) are formed in gaps of the lattice. The color filters are formed, and a transparent electrode layer and an alignment film are formed on the color filters so as to overlap each other.

[0005] A large number of transparent spheres made of glass or plastic are used as spacers provided between the active matrix substrate and the color filter substrate.

[0006]

In this type of liquid crystal display device, it is strongly desired to simplify the manufacturing process and reduce the manufacturing cost. However, when the active matrix substrate is manufactured as described above, there is a problem that the manufacturing process is complicated and the cost is high. In addition,
A method of omitting the photolithography (resist coating) step by applying an acrylic photosensitive resin as an insulating protective film instead of the SiNx film has been proposed (Japanese Patent Application Laid-Open No. 9-152625). Since it is necessary to provide a film, the simplification of the manufacturing process cannot be said to be sufficient.

Further, when transparent spheres are used as spacers as described above, liquid crystal molecules are not arranged in a desired direction, but arranged in the shape of each transparent sphere, and light leakage occurs around each transparent sphere. Characteristic problem. In addition, the color filter material is laminated on the color filter substrate in a pillar shape,
A method using the support as a spacer has been proposed (JP-A-11-183915). However, since the transparent electrode layer will be provided after the formation of the projecting support,
Electric leakage may occur between the active matrix substrate and the color filter substrate, and the yield may be reduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a liquid crystal display device which has good characteristics and can be manufactured at a low cost by a simple manufacturing process. Another object of the present invention is to provide a liquid crystal display device having favorable characteristics which can be manufactured at a low cost by a simple manufacturing process.

[0009]

In order to achieve the above object, a method of manufacturing a liquid crystal display device according to the present invention comprises a transparent electrode divided for each pixel and a TF connected to the transparent electrode.
Manufacture of a liquid crystal display device in which a first substrate on which a T is formed and a second substrate on which a transparent electrode is formed are opposed to each other and bonded with a certain gap through a spacer, and a liquid crystal is injected into the gap. Forming a photosensitive polyimide film to a predetermined thickness on substantially the entire surface of the first substrate on which the transparent electrode and the TFT are formed; and performing half-exposure and development using a predetermined mask. Performing a step of partially removing the polyimide film in the pixel region occupied by the transparent electrode in the thickness direction, and a step of firing and polymerizing the polyimide film remaining on the first substrate; A step of rubbing the surface of the polyimide film to align the liquid crystal.

In the method of manufacturing a liquid crystal display device according to the present invention,
On the first substrate, a polyimide film in a pixel region is used as an alignment film, and a polyimide film in a region other than the pixel region is used as an insulating protective film. Since the surface of the polyimide film in the pixel region is rubbed, it works effectively as an alignment film.
Moreover, since the polyimide film in the pixel region is partially removed in the thickness direction, an excessive voltage drop does not occur during operation, and an appropriate voltage is applied to the liquid crystal layer. Since the polyimide film in the region other than the pixel region is not etched or the like and is provided above the electrode layer, it works effectively as an insulating protective film. Therefore, the characteristics of the liquid crystal display device are improved. Further, in this method of manufacturing a liquid crystal display device, the insulating protective film and the alignment film are simultaneously formed in parallel with the same material, so that the manufacturing process is simplified as compared with the conventional example, and the liquid crystal display device is manufactured. Produced at low cost.

Further, according to the method of manufacturing a liquid crystal display device of the present invention, the first substrate on which the transparent electrode divided for each pixel and the TFT connected to the transparent electrode are formed, and the second substrate on which the transparent electrode is formed are provided. A method of manufacturing a liquid crystal display device in which a substrate is opposed to each other and bonded with a certain gap via a spacer, and a liquid crystal is injected into the gap. A step of forming a non-photosensitive polyimide film to a predetermined thickness over substantially the entire surface, a step of firing and polymerizing the polyimide film on the first substrate, and performing photolithography and etching;
A step of partially removing the polyimide film in the thickness direction of the pixel region occupied by the transparent electrode, and a step of rubbing the surface of the polyimide film left on the first substrate to align the liquid crystal. It is characterized by having.

In the method for manufacturing a liquid crystal display device according to the present invention,
Similarly to the above, the polyimide film in the pixel region on the first substrate is used as an alignment film, and the polyimide film in a region other than the pixel region is used as an insulating protective film. Since the surface of the polyimide film in the pixel region is rubbed, it works effectively as an alignment film. Moreover, since the polyimide film in the pixel region is partially removed in the thickness direction, an excessive voltage drop does not occur during operation, and an appropriate voltage is applied to the liquid crystal layer. Since the polyimide film in the region other than the pixel region is not etched or the like and is provided above the electrode layer, it works effectively as an insulating protective film. Therefore, the characteristics of the liquid crystal display device are improved. Further, in this method of manufacturing a liquid crystal display device, the insulating protective film and the alignment film are simultaneously formed in parallel with the same material, so that the manufacturing process is simplified as compared with the conventional example, and the liquid crystal display device is manufactured. Produced at low cost. In the present invention, since the polyimide film is non-photosensitive, the material (physical properties)
And the photosensitive group has no adverse effect.

In one embodiment of the method of manufacturing a liquid crystal display device, the polyimide film left on the first substrate is used as the spacer.

In the method of manufacturing a liquid crystal display device according to the embodiment, since the polyimide film left on the first substrate is used as the spacer, the insulating protective film, the alignment film, and the spacer are formed of the same material in parallel. That is, it was formed. As a result, it is not necessary to separately insert a spacer between the first substrate and the second substrate. Therefore, the manufacturing process is further simplified, and the liquid crystal display device is manufactured at lower cost. In addition, since there is no spacer in the pixel region, there is no possibility that light leaks through the spacer in the pixel region.

According to the liquid crystal display device of the present invention, a transparent electrode divided for each pixel and a TFT connected to the transparent electrode are provided.
Is formed on the first substrate and the second substrate on which the transparent electrode is formed.
A liquid crystal display device in which a liquid crystal is injected into the gap with a predetermined gap therebetween via a spacer, and a pixel region occupied by the transparent electrode on the first substrate and the TFT An alignment film and an insulating protection film made of the same polyimide resin are respectively formed in the TFT regions occupied by the TFT region, and the thickness of the polyimide resin in the pixel region is set to be smaller than the thickness of the polyimide resin in the TFT region. Features.

In the liquid crystal display device of the present invention, the polyimide film in the TFT region is arbitrarily set within a range required by the required gap (cell gap) between the first substrate and the second substrate and the manufacturing process. In addition, since it is provided above the electrode layer, it works effectively as an insulating protective film. In addition, since the thickness of the polyimide resin in the pixel region is set to be smaller than the thickness of the polyimide film in the TFT region, an excessive voltage drop does not occur in the polyimide film in the pixel region during operation, and an appropriate voltage is applied to the liquid crystal layer. A voltage is applied. Therefore,
The characteristics of the liquid crystal display are improved. Further, in this liquid crystal display device, since the insulating protective film and the alignment film are made of the same polyimide material, they can be formed simultaneously in parallel.
Therefore, this liquid crystal display device is manufactured at a low cost by a simple manufacturing process.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a liquid crystal display device and a method of manufacturing the same according to the present invention will be described in detail with reference to the drawings.

An active matrix type color liquid crystal display device is to be manufactured. As shown in FIG. 2, this liquid crystal display device has a first substrate (hereinafter referred to as an “active matrix substrate”) on which a transparent electrode (pixel electrode) 6 divided for each pixel and a TFT 31 serving as a switching element are formed.
That. And 1) a transparent electrode (common electrode) commonly connected to a color filter (not shown) and a plurality of pixels.
(Not shown) and a second substrate (hereinafter, referred to as a “color filter substrate”) 20 which is formed by being overlapped with each other,
These substrates 1 and 20 are bonded together with a certain gap through a spacer 8a, and a liquid crystal 19 is injected into the gap to produce the substrate.

The active matrix substrate 1 is manufactured, for example, as shown in FIG. First, as shown in FIG. 1A, a TFT on a transparent insulating substrate 1 made of glass is used.
A gate electrode 2 is formed on the region 31, and then a gate insulating film 3 is formed so as to cover the entire region on the substrate 1. Further, an a-Si (amorphous silicon) layer 4 serving as a channel and an n ⁺ -Si (n-type amorphous silicon) layer serving as a source / drain region are formed on the TFT region 31 so as to overlap the gate electrode 2. 5 is formed. Next, a transparent electrode layer 6 made of ITO (tin-added indium oxide) is formed so as to cover the whole area on the substrate 1, and then, a source / drain wiring 7 made of metal is formed on the TFT region 31. Then, in order to separate the source / drain, a groove 10 extending from the surface of the source / drain wiring 7 to the surface of the a-Si layer 4 is formed. Thereafter, a photosensitive polyimide film 8 is applied to substantially the entire surface of the substrate 1 by a spin method to a predetermined thickness, for example, a thickness of 5 μm. Note that a printing method may be used. According to the spin method or the printing method, a film can be easily formed on almost the entire surface even with a large-area substrate. As the photosensitive polyimide material, for example, HD-6000 series (positive type) manufactured by Hitachi Chemical DuPont Microsystems Co., Ltd. is used. This photosensitive polyimide material can use a general i-line or g-line as an exposure wavelength, so that a general exposure apparatus can be used. Therefore, no capital investment for a special exposure apparatus is required, and there is no increase in cost. Various types of photosensitive polyimide materials can be selected depending on the exposure wavelength, dielectric constant, exposure type (negative or positive), coefficient of thermal expansion, developer, and the like.

Next, as shown in FIG. 1B, half exposure is performed using a predetermined mask. More specifically, the TFT region 31 is shielded from light, and the pixel region 30 is subjected to half exposure (lighter than usual exposure). In regions where the polyimide film 8 is to be completely removed in the thickness direction, such as regions where electrode terminals are provided (not shown), normal intensity exposure is performed.
Subsequently, development is performed using an alkaline solution or an organic solvent. Thus, the polyimide film 8 in the TFT region 31 is left as it is as the insulating protective film and the spacer 8a by utilizing the difference in the etching rate between the unexposed area, the half-exposed area, and the normally-exposed area. The polyimide film 8 in the region 30 is partially removed in the thickness direction. In a region (not shown) where the electrode terminals are provided, the polyimide film 8 is completely removed in the thickness direction. The partial removal of the polyimide film 8 on the pixel region 30 in the thickness direction in this way prevents an excessive voltage drop from occurring in the polyimide film during operation and applies an appropriate voltage to the liquid crystal layer. That's why.
Subsequently, the polyimide film (including polyamic acid or the like) 8 left on the substrate 1 is fired at a temperature of about 350 ° C. to be polymerized. Although a plurality of types of films are already formed on the substrate 1, the firing temperature is a temperature at which no problem occurs.
Thereafter, a rubbing treatment is performed on the surface of the polyimide film 8.
Thus, the portion 8b of the polyimide film 8 left on the pixel region 30 has the function of an alignment film. The liquid crystal injected between the substrates can be aligned in a desired direction by the alignment film 8b. From the viewpoint of the above-described prevention of voltage drop and the stability of the process, the thickness of the polyimide film 8b left on the pixel region 30 is desirably 600 ° to 1000 °.

On the other hand, although not shown in detail, the color filter substrate 20 has a light-shielding film formed in a lattice pattern on a transparent insulating substrate by a known method, and R (red), G A color filter of three colors (green) and B (blue) is formed, and a transparent electrode layer and an alignment film are formed on the color filters.

Thereafter, as shown in FIG. 2, the active matrix substrate 1 and the color filter substrate 20 are bonded together with a gap of about 5 μm via a spacer 8a, and a liquid crystal 19 is injected into the gap. At this time, since the polyimide film 8a in the TFT region 31 on the active matrix substrate 1 is used as a spacer, it is not necessary to separately insert a spacer between the substrates 1 and 20.

The polyimide film 8a in the TFT region 31 on the active matrix substrate 1 is not etched, has a predetermined thickness, and is provided above the electrode layer, so that it can be effectively used as an insulating protective film. work. Further, the polyimide film 8b in the pixel region 30 effectively works as an alignment film because the surface is rubbed. Moreover, since the thickness of the polyimide film 8b in the pixel region 30 is set smaller than the thickness of the polyimide film 8a in the TFT region 31, an excessive voltage drop may occur in the polyimide film 8b of the pixel region 30 during operation. Instead, an appropriate voltage is applied to the liquid crystal layer. Moreover, since the spacers 8a are not formed in the pixel region 30, there is no possibility that light leaks through the spacers in the pixel region 30. As a result, the characteristics of the liquid crystal display device are improved.

Further, in this manufacturing method, since the alignment film, the insulating protective film and the spacer are formed simultaneously and in parallel with the same polyimide material 8, the manufacturing process can be simplified as compared with the conventional example. A liquid crystal display device can be manufactured at low cost.

FIG. 3 shows another method for manufacturing the active matrix substrate 1. First, as shown in FIG. 3A, a gate electrode 2 and other layers 3, 4 are formed on a transparent insulating substrate 1 made of glass, just like the example of FIG.
5, 6 and 7 are formed, and a trench 10 for separating between source and drain is formed. Thereafter, a substantially non-photosensitive polyimide film 18 is applied to substantially the entire surface of the substrate 1 by a spin method to a predetermined thickness, for example, a thickness of 5 μm. Subsequently, the polyimide film 18 on the substrate 1 is baked at a temperature of about 350 ° C. to be polymerized.

Next, as shown in FIG. 3B, a resist pattern 9 is formed on the polyimide film 18 of the substrate 1 by performing photolithography. Specifically, after applying a positive resist on the entire surface, light is shielded on the TFT region 31,
Half exposure (weaker exposure than usual) is performed on the pixel region 30. In regions where the polyimide film 8 is to be completely removed in the thickness direction, such as regions where electrode terminals are provided (not shown), normal intensity exposure is performed. This gives T
While the resist 9a in the FT region 31 is left as it is, the resist 9b in the pixel region 30 is partially removed in the thickness direction. Also, a region where the electrode terminals are provided (not shown)
For example, the resist is completely removed in the thickness direction. Subsequently, etching (for example, ashing) is performed to leave the polyimide film 18 in the TFT region 31 as an insulating protective film and a spacer 18a as shown in FIG. Partially removed in the vertical direction. In a region (not shown) where the electrode terminals are provided, the polyimide film 18 may be used.
Is completely removed in the thickness direction. Thereafter, a rubbing treatment is performed on the surface of the polyimide film 18. As a result, the portion 1 of the polyimide film 18 left on the pixel region 30
8b has the function of an alignment film.

After that, as shown in FIG. 2, the active matrix substrate 1 and the color filter substrate 20 are bonded together with a gap of about 5 μm via a spacer 18a, and a liquid crystal 19 is injected into the gap. At this time, since the polyimide film 18a in the TFT region 31 on the active matrix substrate 1 is used as a spacer, the substrates 1, 2
There is no need to insert a separate spacer between zeros.

The polyimide film 18a in the TFT region 31 on the active matrix substrate 1 is not etched, has a predetermined thickness, and is provided above the electrode layer, so that it can be effectively used as an insulating protective film. work. Also,
Since the surface of the polyimide film 18b in the pixel region 30 is rubbed, it works effectively as an alignment film. In addition, the thickness of the polyimide film 18b in the pixel region 30 is set to be smaller than the thickness of the polyimide film 18a in the TFT region 31.
An appropriate voltage is applied to the liquid crystal layer without causing an excessive voltage drop. Moreover, the spacer 1 is provided in the pixel region 30.
Since 8a is not formed, there is no possibility that light leaks through the spacer in the pixel region 30. As a result of these,
The characteristics of the liquid crystal display are improved.

In this manufacturing method, the alignment film, the insulating protective film, and the spacer are formed simultaneously and in parallel with the same polyimide material 18, so that the manufacturing process can be simplified as compared with the conventional example. A liquid crystal display device can be manufactured at low cost.

Further, in this example, since the polyimide film 18 is non-photosensitive, the choice of materials (physical properties) is widened, and no adverse effect is caused by the photosensitive group.

In order to provide a region where the polyimide film 18 is left as it is, a region where the polyimide film 18 is partially left in the thickness direction, and a region where the polyimide film 18 is not completely present in the thickness direction, in addition to the above, photolithography is used. It is conceivable to perform the etching separately and perform the half etching and the complete etching separately. Alternatively, the polyimide film 18 may be provided only in a region excluding the region where the electrode terminals are provided by a printing method, and ordinary photolithography and half etching may be performed.

In the example shown in FIGS. 1 and 3, the spacers 8a, 18
The thickness of “a” was 5 μm, but is not limited to this. The thickness of the spacer can be arbitrarily set as long as the required gap (cell gap) between the active matrix substrate 1 and the color filter substrate 20 and the manufacturing process allow. Further, the position where the spacer is provided is not limited to the TFT region 31, and may be a region where a wiring connected to the TFT is provided.

[0033]

As is clear from the above, according to the method for manufacturing a liquid crystal display device of the present invention, the polyimide film in the pixel region on the first substrate is partially removed in the thickness direction. An appropriate voltage is applied to the liquid crystal layer without excessive voltage drop during operation. Since the polyimide film in the region other than the pixel region is not etched or the like and is provided above the electrode layer, it works effectively as an insulating protective film. Therefore, the characteristics of the liquid crystal display device are improved. Further, in this method of manufacturing a liquid crystal display device, the insulating protective film and the alignment film are simultaneously formed in parallel with the same material, so that the manufacturing process is simplified as compared with the conventional example, and the liquid crystal display device is manufactured. Produced at low cost.

In one embodiment of the method of manufacturing a liquid crystal display device, since the polyimide film left on the first substrate is used as a spacer, the insulating protective film, the alignment film, and the spacer are made of the same material in parallel. It is formed. As a result, it is not necessary to separately insert a spacer between the first substrate and the second substrate. Therefore, the manufacturing process is further simplified, and the liquid crystal display device is manufactured at lower cost. In addition, since there is no spacer in the pixel region, there is no possibility that light leaks through the spacer in the pixel region.

In the liquid crystal display device of the present invention, TF
The polyimide film in the T region is arbitrarily set within a range allowed by the required gap (cell gap) between the first substrate and the second substrate and the manufacturing process, and is provided above the electrode layer. Work effectively as an insulating protective film. In addition, since the thickness of the polyimide resin in the pixel region is set to be smaller than the thickness of the polyimide film in the TFT region, an excessive voltage drop does not occur in the polyimide film in the pixel region during operation, and an appropriate voltage is applied to the liquid crystal layer. A voltage is applied. Therefore, the characteristics of the liquid crystal display device are improved. Also,
In this liquid crystal display device, since the insulating protective film and the alignment film are made of the same polyimide material, they can be formed simultaneously in parallel. Therefore, this liquid crystal display device is manufactured at a low cost by a simple manufacturing process.

[Brief description of the drawings]

FIG. 1 is a process diagram illustrating a method for manufacturing a liquid crystal display device according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a manufactured liquid crystal display device.

FIG. 3 is a process diagram illustrating a method for manufacturing a liquid crystal display device according to another embodiment of the present invention.

FIG. 4 is a process diagram illustrating a method for manufacturing a conventional liquid crystal display device.

[Explanation of symbols]

 Reference Signs List 8 photosensitive polyimide film 18 non-photosensitive polyimide film 30 pixel area 31 TFT area

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G09F 9/30 338 G09F 9/35 308 9/35 308 G02F 1/136 500 F term (reference) 2H090 HB08X HB08Y HC08 HC12 LA02 MB01 2H092 JA24 JB01 NA27 PA02 PA03 PA08 5C094 AA42 AA43 AA44 BA03 BA43 CA19 CA24 EA03 EA04 EA05 EA07 EC00 ED20 FB01 FB15 GB01 5G435 AA17 BB12 CC12 KK05

Claims (4)

[Claims] A first substrate on which a transparent electrode divided for each pixel and a TFT connected to the transparent electrode are formed, and a second substrate on which the transparent electrode is formed are opposed to each other;
A method for manufacturing a liquid crystal display device in which a liquid crystal display device is bonded with a certain gap through a spacer and a liquid crystal is injected into the gap, wherein the transparent electrode and the TFT are formed on a first substrate.
A step of forming a photosensitive polyimide film to a predetermined thickness on substantially the entire surface, and performing half exposure and development using a predetermined mask,
A step of partially removing the polyimide film in the pixel region occupied by the transparent electrode in the thickness direction; a step of firing and polymerizing the polyimide film remaining on the first substrate; and aligning the liquid crystal. Rubbing the surface of the polyimide film in order to manufacture the liquid crystal display device. 2. A first substrate on which a transparent electrode divided for each pixel and a TFT connected to the transparent electrode are formed, and a second substrate on which a transparent electrode is formed are opposed to each other.
A method for manufacturing a liquid crystal display device in which a liquid crystal display device is bonded with a certain gap through a spacer and a liquid crystal is injected into the gap, wherein the transparent electrode and the TFT are formed on a first substrate.
A step of forming a non-photosensitive polyimide film to a predetermined thickness on substantially the entire surface; a step of baking and polymerizing the polyimide film on the first substrate; and performing photolithography and etching to occupy the transparent electrode. A step of partially removing the polyimide film in the pixel region in the thickness direction, and a step of rubbing the surface of the polyimide film left on the first substrate to align the liquid crystal. Of manufacturing a liquid crystal display device. 3. The method for manufacturing a liquid crystal display device according to claim 1, wherein the polyimide film left on the first substrate is used as the spacer. 4. A first substrate on which a transparent electrode divided for each pixel and a TFT connected to the transparent electrode are formed, and a second substrate on which the transparent electrode is formed are opposed to each other.
In a liquid crystal display device in which liquid crystal is injected into the gap with a certain gap through a spacer, a pixel area occupied by the transparent electrode and a TFT area occupied by the TFT on the first substrate are respectively the same. A liquid crystal display device comprising: an alignment film made of a polyimide resin; and an insulating protective film, wherein a thickness of the polyimide resin in the pixel region is set smaller than a thickness of the polyimide resin in the TFT region.