JP2001244669A - Heat dissipation structure of electronic components - Google Patents

Abstract

(57) [Problem] To reduce the temperature rise difference between a plurality of electronic components attached to a heat radiating plate, to share a heat radiating plate, and to simplify a heat radiating structure and assembling work. An electronic component (3, 4) having a different heat value mounted on a printed board (1), a main radiator plate (2) attached to the printed board (1) along the electronic components (3, 4), and a main radiator plate (2) are provided. An auxiliary heat radiating plate having a heat radiating area of a size based on a heat generation amount of each of the electronic components and attached to the main heat radiating plate so as to face the electronic components therebetween; The components 3 and 4 and the auxiliary heat radiating plates 5 and 6 are fixed to the main heat radiating plate 2 with one mounting screw 7 and 8, respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiation structure for electronic components mounted on a printed circuit board.

[0002]

2. Description of the Related Art FIG. 5 is a perspective view illustrating a state in which a heat radiating plate having a heat radiating structure for a conventional electronic component and an electronic component are mounted on a printed circuit board. Hereinafter, a conventional technique will be described with reference to FIG.

A circuit pattern (not shown) is formed on the printed circuit board 51. Electronic components 53 and 54 that generate heat during operation are mounted on the printed circuit board 51 and connected (soldered) to the circuit pattern. ing. Also,
The printed circuit board 51 is provided with a plurality of mounting holes (not shown) for mounting the heat sink 52 near the electronic components 53 and 54.

The heat radiating plate 52 is formed of, for example, aluminum or the like having excellent heat conductivity, and has a substantially rectangular heat radiating plate main body 52a and the heat radiating plate main body 52a near both ends of one side of the heat radiating plate main body 52a. And a pair of mounting legs 52b provided substantially vertically. The attachment leg 52b is provided with an attachment hole 52c for attaching the heat sink 52 to the printed circuit board 51.

The heat radiating plate 52 is mounted on the printed circuit board 51 such that a plurality of mounting holes (not shown) provided in the printed circuit board 51 and the mounting holes 52c are aligned.
Are mounted substantially vertically with mounting screws (not shown), for example. And, in the heat sink body 52a,
Electronic components 53 and 54 that generate heat during operation are fixed.

As described above, by directly fixing the electronic components 53 and 54 to the heat radiating plate 52, heat generated from the electronic components 53 and 54 during operation is transmitted to the heat radiating plate 52 and radiated to the outside from the heat radiating plate 52. The electronic component 5
3, 54 temperature rise can be suppressed.

FIG. 6 is a perspective view illustrating a state in which a heat radiating plate of another conventional heat radiating structure for electronic components and an electronic component are mounted on a printed circuit board. Hereinafter, another conventional technique will be described with reference to FIG.

FIG. 6 shows another conventional heat radiating structure for an electronic component, which is different from FIG. 5 described above in that a printed circuit board 5 is provided at an end opposite to a pair of mounting legs 52b of a heat radiating plate main body 52a.
The difference is that a flat plate portion 52d is provided integrally with the electronic component 1, and the heat radiating structure of the electronic component excluding the flat plate portion 52d is the same as that of FIG. 5, and the same reference numerals as those of FIG.

That is, the heat radiating plate 52 includes a heat radiating plate main body 52a and a flat plate portion 52d provided integrally with each other, and is formed so that its cross section is substantially L-shaped.
Even if the height of the mounted component on the first device is limited to a low level, the heat dissipation structure is easy to secure a heat dissipation area.

[0010]

In the conventional heat dissipation structure of an electronic component shown in FIG. 5, when the electronic components 53 and 54 mounted on the printed circuit board 51 generate a large amount of heat during operation, the heat dissipation plate 52 is provided. It is necessary to increase the heat radiating area to make it easy to radiate heat from the heat radiating plate 52 to the outside. However, when the mounting height on the printed circuit board 51 is limited, the required height of the radiator plate body 52a cannot be secured, so that the heat radiating area is insufficient, and the heat generated from the electronic components 53, 54 during operation is reduced. In addition, there is a problem that the temperature of the electronic components 53 and 54 rises because the heat cannot be sufficiently released to the outside from the heat radiating plate 52, which may lead to deterioration and a shortened life of the electronic components 53 and 54.

In another conventional heat radiating structure for an electronic component shown in FIG. 6, the heat radiating plate 52 has a heat radiating plate main body 52a and a flat plate portion 52d provided integrally with each other.
Even when the mounting height on the top 1 is limited, the heat radiation area can be increased by the amount corresponding to the flat portion 52d as compared with the heat radiation structure of the electronic component of the conventional example of FIG. However, the heat sink 5
2 is attached to the printed circuit board 51 only at a pair of attachment legs 52b provided at both ends of one side of the heat sink body 52a substantially perpendicular to the heat sink body 52a. When an external force is applied to the side remote from the plate body 52a, stress is applied to the mounting leg 52b and the circuit pattern connection (soldering) part of the printed circuit board 51 to the electronic components 53 and 54 fixed to the heat sink body 52a. The printed circuit board 51 may be cracked,
There has been a problem that cracks may occur in the circuit pattern connection (soldering) portions of the printed circuit boards 51 and 54 and the printed circuit board 51.

In the heat dissipation structure of the conventional electronic component shown in FIG. 5 and the heat dissipation structure of the other conventional electronic component shown in FIG.
When the amount of heat generated by the electronic component 54 is larger than that of the electronic component 53, the heat radiation area of the radiator plate 52 to which the electronic components 53 and 54 are fixed is substantially the same, so that the temperature of the electronic component 54 rises, There is a possibility that the deterioration and life of the 54 will be shortened. In order to improve this, the temperature of the electronic component 54 can be lowered by increasing the heat radiation area of the heat radiating plate 52 (not shown) only in the portion where the electronic component 54 is fixed. It can be used only when the amount of heat radiation of the electronic component 54 is larger than that of the component 53. Conversely, when the heat generated by the electronic component 53 is larger than that of the electronic component 54, a heat radiating plate 52 (not shown) having an increased heat radiating area only at the portion where the electronic component 53 is fixed is required. Further, in order to share the above two kinds of heat sinks with one heat sink 52, the heat dissipation area of the heat sink 52 may be increased by both the electronic components 53 and 54. And the material cost of the heat sink 52 increases.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a temperature difference between a plurality of electronic components having different heat values attached to a heat sink. It is another object of the present invention to provide a heat radiation structure for electronic components in which the heat radiation plate is reduced and the heat radiation plate is shared.

[0014]

According to the present invention, there is provided a heat radiation structure for an electronic component, comprising: an electronic component mounted on a printed circuit board; a main heat radiation plate mounted on the printed circuit board along the electronic component; An auxiliary heat radiator attached to the main heat radiator so as to face the electronic component with the heat radiator interposed therebetween, and the electronic component and the auxiliary heat radiator are fixed to the main heat radiator by one common fixing means. It is characterized by having done.

Further, according to the present invention, there is provided a heat radiating structure for an electronic component, comprising: a plurality of electronic components having different calorific values mounted on a printed board; and a main radiating plate attached to the printed board along the plurality of electronic components. And a plurality of auxiliary heat radiators having different heat radiating areas attached to the main heat radiator so as to face the plurality of electronic components with the main heat radiator interposed therebetween, and the auxiliary heat radiator is provided for each of the electronic components. Characterized in that it has a heat radiation area of a size based on the heat generation amount.

Further, the auxiliary heat radiating plate of the electronic component heat radiating structure of the present invention has a mounting leg for fixing the auxiliary heat radiating plate to the printed circuit board, and the common fixing means attaches to the main heat radiating plate. The main radiating plate is supported substantially vertically to the printed circuit board by being fixed and fixed to the printed circuit board by the mounting leg portion.

Further, in the auxiliary heat radiating plate of the heat radiating structure for an electronic component according to the present invention, a notch for disposing another electronic component on the printed substrate is provided at an edge portion in contact with the printed substrate. It is characterized by having.

Further, the auxiliary heat radiating plate of the electronic component heat radiating structure according to the present invention comprises an auxiliary heat radiating plate main body which is in contact with the main heat radiating plate, and a plurality of flat plate portions formed integrally with the auxiliary heat radiating plate main body. The flat plate portion is provided with a plurality of ventilation holes.

Further, the common fixing means of the heat radiating structure of the electronic component of the present invention is a mounting screw, and the electronic component and the main heat radiating plate are provided with through holes for the mounting screw, and the auxiliary heat radiating plate is provided. The board is provided with a mounting hole for the mounting screw, and the mounting screw is inserted into the mounting hole through the through hole from the electronic component side, and the electronic component and the auxiliary heat sink are connected to the mounting hole. Are attached to the main heat sink.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIG. 1 is a perspective view illustrating a heat dissipation structure of an electronic component according to a first embodiment of the present invention. FIG. 2 is a perspective view illustrating a state in which a main radiator plate, an auxiliary radiator plate, and an electronic component of the heat radiating structure of the electronic component according to the first embodiment of the present invention are mounted on a printed circuit board. The heat dissipation structure of the electronic component of the present invention will be described below with reference to FIG.

A circuit pattern (not shown) is formed on the printed circuit board 1. Electronic components 3 and 4 that generate heat during operation are mounted on the printed circuit board 1 and connected (soldered) to the circuit pattern. ing. The printed circuit board 1 has a main heat sink 2 near the electronic components 3 and 4.
Are provided with a plurality of mounting holes (not shown).

The main heat radiating plate 2 is formed of, for example, aluminum and the like having excellent thermal conductivity, and has a substantially rectangular main heat radiating plate main body 2a and the main heat radiating plate main body 2a near both ends of one side of the main heat radiating plate main body 2a. 2a and a pair of mounting legs 2b provided substantially perpendicular to the mounting leg 2a. The mounting leg 2b is provided with a mounting hole 2c for mounting the main heat sink 2 to the printed circuit board 1. The main radiating plate 2 is mounted on the printed circuit board 1 by, for example, mounting screws (not shown) with the positions of the plurality of mounting holes (not shown) provided in the printed circuit board 1 and the mounting holes 2c aligned. It is mounted almost vertically. Electronic components 3 and 4 that generate heat during operation are fixed to the main heat sink main body 2a.

The auxiliary radiator plate 5 is connected to the main radiator plate body 2.
a of the main heat sink main body 2 facing the electronic component 3
a, the electronic component 3 and the auxiliary heat sink 5
Is fixed to the main heat sink main body 2a by one mounting screw 7 (common fixing means). Similarly, the auxiliary heat sink 6 is attached to the main heat sink main body 2a so as to face the electronic component 4 with the main heat sink main body 2a interposed therebetween, and the electronic component 4 and the auxiliary heat sink 6 are The main heat sink main body 2 is fixed by one mounting screw 8 (common fixing means).
a.

The electronic component 3 and the electronic component 4 generate different amounts of heat, and the auxiliary radiator plate 5 and the auxiliary radiator plate 6 have a size based on the respective heat generation amounts of the electronic component 3 and the electronic component 4. It has a heat dissipation area. That is, since the electronic component 4 generates a larger amount of heat than the electronic component 3, the heat radiating area of the auxiliary heat radiating plate 6 is larger than the heat radiating area of the auxiliary heat radiating plate 5.

The auxiliary heat radiating plates 5 and 6 are provided with mounting legs (described later) for fixing the auxiliary heat radiating plates 5 and 6 to the printed circuit board 1 at an edge portion in contact with the printed circuit board 1. The main heat radiating plate 2 is fixed to the main heat radiating plate 2 by mounting screws 7 and 8 (common fixing means) and is fixed to the printed circuit board 1 by the mounting leg portions (described later). It is supported substantially perpendicular to the printed circuit board 1.

Next, referring to FIG. 2, a description will be given below of how the main radiator plate, the auxiliary radiator plate, and the electronic component of the electronic component radiating structure according to the first embodiment of the present invention are mounted on a printed circuit board. I do. The main heat radiating plate 2 is formed of, for example, aluminum and the like having excellent thermal conductivity, and has a substantially rectangular main heat radiating plate main body 2a and the main heat radiating plate main body 2a near both ends of one side of the main heat radiating plate main body 2a. And a pair of mounting legs 2b provided substantially vertically. The mounting leg 2b is provided with a mounting hole 2c for mounting the main heat sink 2 to the printed circuit board 1. The main radiating plate 2 is mounted on the printed circuit board 1 by, for example, mounting screws (not shown) with the positions of the plurality of mounting holes (not shown) provided in the printed circuit board 1 and the mounting holes 2c aligned. It is mounted almost vertically. The main heat radiating plate main body 2a has through holes 2d, 2 for mounting screws 7, 8 (common fixing means).
e is provided.

The printed circuit board 1 has electronic components 3,
4 are mounted on the printed circuit board 1 and provided with mounting holes 1b and 1c for connection (soldering) with a circuit pattern (not shown) formed on the printed circuit board 1. The lead portions 3b, 4b of the electronic components 3, 4 are inserted into the mounting holes 1b, 1c, and the through holes 3a, 4a for the mounting screws 7, 8 provided in the electronic components 3, 4 and the main radiator plate. With the positions of the through holes 2d and 2e for the mounting screws 7 and 8 provided in the main body 2a aligned, the printed circuit board 1
Is connected (soldered) to a circuit pattern (not shown) formed on the substrate.

The auxiliary heat radiating plate 5 will be described in more detail. The auxiliary heat radiating plate 5 includes an auxiliary heat radiating plate main body 5a in contact with the main heat radiating plate main body 2a, and an auxiliary heat radiating plate main body 5a.
The auxiliary heat sink body 5a is provided with mounting holes 5c for the mounting screws 7, and each of the plurality of flat plate portions 5b is The auxiliary heat sink 5
Mounting leg 5 for fixing the
d.

Similarly, the auxiliary heat radiating plate 6 will be described in more detail. The auxiliary heat radiating plate 6 includes an auxiliary heat radiating plate main body 6a in contact with the main heat radiating plate main body 2a, and an auxiliary heat radiating plate main body 6a.
a and a plurality of flat plate portions 6b integrally formed, the auxiliary heat sink body 6a is provided with mounting holes 6c for the mounting screws 8, and each of the plurality of flat plate portions 6b is A mounting leg 6d for fixing the auxiliary heat radiating plate 6 to the printed circuit board 1 is provided at an edge portion in contact with the printed circuit board 1. By making the area of the flat plate portion 6b larger than the area of the flat plate portion 5b, the heat radiation area of the auxiliary radiator plate 6 is made larger than that of the auxiliary radiator plate 5.

The printed circuit board 1 has mounting holes 1 for fixing the auxiliary heat sinks 5 and 6 to the printed circuit board 1.
d, 1e are provided. And auxiliary heat sinks 5, 6
The mounting legs 5d and 6d of the auxiliary heat sinks 5 and 6 are inserted into the mounting holes 1d and 1e, respectively.
a, 6a with the mounting holes 5c, 6c for the mounting screws 7, 8 and the through holes 2d, 2e for the mounting screws 7, 8 provided in the main heat sink main body 2a aligned. It is fixed to the printed circuit board 1.

As described above, the main radiator plate 2 is
And electronic components 3, 4 and auxiliary heat sinks 5, 6 are attached,
The mounting screws 7, 8 are provided with through holes 3 a, 4 a of the electronic components 3, 4 and the through holes 2 d of the main heat sink 2 from the side of the electronic components 3, 4.
2e through which the mounting holes 5c, 6 of the auxiliary heat sinks 5, 6 are inserted.
The electronic components 3 and 4 and the auxiliary heat radiating plates 5 and 6 are fixed to the main heat radiating plate 2 in a state of being inserted into the main heat radiating plate 2.

In the heat radiating structure for an electronic component according to the first embodiment of the present invention shown in FIGS.
The shape of the auxiliary heat radiating plates 5 and 6 is merely an example, and is not limited to this. For example, although the case where the cross-sectional shape of the auxiliary heat radiating plates 5 and 6 is substantially U-shaped is described, it may be substantially L-shaped.

Although two electronic parts 3 and 4 have been described, the quantity is not limited to this, and is not limited to one.
Or three or more. Further, the case has been described in which the heat generation amount of the electronic component 4 is larger than the heat generation amount of the electronic component 3 and the heat radiation area of the auxiliary heat radiating plate 6 is larger than the heat radiation area of the auxiliary heat radiating plate 5. However, the present invention is not limited to this. ,
Conversely, the heat value of the electronic component 3 may be larger than the heat value of the electronic component 4, and the heat radiating area of the auxiliary heat radiating plate 5 may be larger than the heat radiating area of the auxiliary heat radiating plate 6. Further, the positions and shapes of the mounting legs 5d and 6d of the auxiliary heat radiating plates 5 and 6 are not limited thereto.

[Second Embodiment] FIG. 3 is a perspective view for explaining a heat radiation structure of an electronic component according to a second embodiment of the present invention. Compared with the heat radiating structure of the electronic component according to the first embodiment of FIG. 1, the same portions are denoted by the same reference numerals, and description thereof will be omitted. Only different points from FIG. 1 will be described below.

In FIG. 1, the printed circuit board 1 is disposed substantially horizontally on a device (not shown).
The printed circuit board 1 is disposed substantially vertically on a device (not shown), and the plurality of flat plate portions 5b and 6b of the auxiliary heat sinks 5 and 6 are disposed substantially horizontally on the device (not shown).

Also, electronic components 11 and 12 are arranged on the printed board 1 at the edges of the plurality of flat plates 5b and 6b of the auxiliary heat radiating plates 5 and 6 shown in FIG. Notches 5e and 6e are provided respectively. As a result, in the printed circuit board 1,
The electronic component 1 is also provided in a region where the auxiliary heat radiating plates 5 and 6 are provided.
1 and 12 can be mounted, and the electronic component mounting density of the printed circuit board 1 is improved.
Can be reduced in size.

The plurality of flat plate portions 5b of the auxiliary radiator plates 5, 6 of FIG. 3 are provided on the plurality of flat plate portions 5b, 6b of the auxiliary radiator plates 5, 6 arranged substantially horizontally on a device (not shown). , 6
A plurality of ventilation holes 5f and 6f are provided to improve the ventilation in the vertical direction around b. As a result, the air permeability around the plurality of flat plate portions 5b, 6b of the auxiliary heat radiating plates 5, 6 becomes poor, and the heat radiation of the electronic components 11, 12 mounted on the printed circuit board 1 may be impaired. Can be improved.

In the heat dissipating structure for electronic parts according to the second embodiment of the present invention shown in FIG. 3, the printed circuit board 1 is disposed substantially vertically to a device (not shown), but is not limited to this. . Further, the main radiator plate 2 and the auxiliary radiator plate 5,
The shape of 6 is an example to the last, and is not limited to this. For example, although the case where the cross-sectional shape of the auxiliary heat radiating plates 5 and 6 is substantially U-shaped is described, it may be substantially L-shaped.

Although two electronic components 3 and 4 have been described, the quantity is not limited to this, and is not limited to one.
Or three or more. Further, the case has been described in which the heat generation amount of the electronic component 4 is larger than the heat generation amount of the electronic component 3 and the heat radiation area of the auxiliary heat radiating plate 6 is larger than the heat radiation area of the auxiliary heat radiating plate 5. However, the present invention is not limited to this. ,
Conversely, the heat value of the electronic component 3 may be larger than the heat value of the electronic component 4, and the heat radiating area of the auxiliary heat radiating plate 5 may be larger than the heat radiating area of the auxiliary heat radiating plate 6. Notches 5e, 6 provided in the plurality of flat plates 5b, 6b of the auxiliary heat radiating plates 5, 6 are provided.
The position and shape of e are merely examples, and the present invention is not limited thereto. Further, a plurality of ventilation holes 5f, 5f, provided in the plurality of flat plate portions 5b, 6b of the auxiliary heat radiation plates 5, 6 are provided.
6f describes the case where two round holes are provided, but the shape and the number of holes are not limited to this, and may be one or three or more.

[Third Embodiment] FIG. 4 is a perspective view illustrating a heat dissipation structure of an electronic component according to a third embodiment of the present invention. Compared with the heat dissipation structure of the electronic component according to the first embodiment shown in FIG. 1, only the differences from FIG. 1 will be described below.

In FIG. 1, a main radiator plate 2, electronic components 3, 4 and auxiliary radiator plates 5, 6 are mounted on a printed circuit board 1, and mounting screws 7, 8 (common fixing means) are mounted on the electronic components 3, 4 side. The auxiliary heat sinks 5, 6 are inserted through the through holes 3a, 4a of the electronic components 3, 4 and the through holes 2d, 2e of the main heat sink 2.
When the electronic components 3 and 4 and the auxiliary radiating plates 5 and 6 are inserted into the mounting holes 5c and 6c of the
It is fixed to.

FIG. 4 differs from FIG. 1 in that fixing clips 9 and 10 (common fixing means) are used as an example of a fixing method instead of the mounting screws 7 and 8 (common fixing means).
The electronic components 3 and 4 and the auxiliary heat sinks 5 and 6
Are fixed to the main heat sink 2. Other parts are the same as those in FIG. 1, and the same parts are denoted by the same reference numerals and description thereof will be omitted.

In the heat radiating structure for an electronic component according to the third embodiment of the present invention shown in FIG. 4, the shapes of the main heat radiating plate 2 and the auxiliary heat radiating plates 5 and 6 are merely examples and are not limited thereto. It does not do. For example, although the case where the cross-sectional shape of the auxiliary heat radiating plates 5 and 6 is substantially U-shaped is described, it may be substantially L-shaped.

Although two electronic components 3 and 4 have been described, the quantity is not limited to this, and is not limited to one.
Or three or more. Further, the case has been described in which the heat generation amount of the electronic component 4 is larger than the heat generation amount of the electronic component 3 and the heat radiation area of the auxiliary heat radiating plate 6 is larger than the heat radiation area of the auxiliary heat radiating plate 5. However, the present invention is not limited to this. ,
Conversely, the heat value of the electronic component 3 may be larger than the heat value of the electronic component 4, and the heat radiating area of the auxiliary heat radiating plate 5 may be larger than the heat radiating area of the auxiliary heat radiating plate 6. Further, as an example of the fixing method, the case where the fixing clips 9 and 10 are used has been described, but the present invention is not limited to this.

[0045]

According to the heat dissipation structure for electronic parts of the present invention,
An electronic component mounted on a printed board, a main heat sink attached to the printed board along the electronic component, and a main heat sink attached to the main heat sink facing the electronic component with the main heat sink interposed therebetween. Wherein the electronic component and the auxiliary radiator plate are fixed to the main radiator plate by one common fixing means.

Therefore, the electronic component and the auxiliary heat radiating plate can be fixed to the main heat radiating plate by one common fixing means, so that the heat radiating structure can be simplified, and the electronic component and the auxiliary heat radiating plate can be fixed. It is possible to simplify the assembling work for fixing to the main heat sink.

According to the heat radiating structure for electronic parts of the present invention, a plurality of electronic parts having different heat values mounted on a printed board and a main part mounted on the printed board along the plurality of electronic parts are provided. A heat radiating plate, and a plurality of auxiliary heat radiating plates having different heat radiating areas attached to the main heat radiating plate so as to face the plurality of electronic components with the main heat radiating plate interposed therebetween; It has a heat radiation area of a size based on the heat value of each component.

Therefore, based on the heat values of a plurality of electronic components having different heat values attached to the main heat radiating plate, a plurality of auxiliary heat radiating plates having different heat radiating areas are selected and mounted, so that the heat value is reduced. By reducing the difference in temperature rise between each of a plurality of different electronic components, it is possible to improve the possibility that the temperature of the electronic component that generates a large amount of heat increases, leading to deterioration and shortening of the life of the electronic component. By combining the main radiator plate and a plurality of auxiliary radiator plates having different heat radiating areas, the auxiliary radiator plate can be selected based on the heat radiation amount of each electronic component. Can be achieved.

According to the heat radiating structure for an electronic component of the present invention, the auxiliary heat radiating plate includes a mounting leg for fixing the auxiliary heat radiating plate to the printed circuit board. By being fixed to the heat sink and fixed to the printed circuit board by the mounting legs,
The main radiator plate is supported substantially perpendicularly to the printed circuit board.

Therefore, the main radiator plate is supported substantially vertically to the printed board by the auxiliary radiator plate, so that the main radiator plate is attached to the printed board and fixed to the main radiator plate. Stress is applied to the connected electronic component and the circuit pattern connection (soldering) portion of the printed circuit board, which may cause cracks in the printed circuit board or cracks in the circuit pattern connection (soldering) portion of the electronic component and the printed circuit board. Some things can be improved.

According to the heat radiating structure for an electronic component of the present invention, the auxiliary heat radiating plate has a notch at an edge portion in contact with the printed circuit board for disposing another electronic component on the printed circuit board. The present invention is characterized in that a unit is provided.

Accordingly, it is possible to mount electronic components on the printed circuit board also in the area where the auxiliary radiator plate is provided, so that the density of electronic components mounted on the printed circuit board is improved, and the size of the printed circuit board is reduced. Can be achieved.

Further, according to the heat radiating structure for an electronic component of the present invention, the auxiliary heat radiating plate includes an auxiliary heat radiating plate main body which is in contact with the main heat radiating plate, and a plurality of flat plates formed integrally with the auxiliary heat radiating plate main body. And a plurality of ventilation holes are provided in the flat plate portion.

Therefore, it is possible to improve the problem that the air permeability around the plurality of flat plate portions of the auxiliary heat radiating plate is deteriorated, and the heat radiation of the electronic components mounted on the printed circuit board may be impaired.

Further, according to the heat radiating structure for an electronic component of the present invention, the common fixing means is a mounting screw, and the electronic component and the main heat radiating plate are provided with through holes for the mounting screw. The auxiliary heat sink is provided with a mounting hole for the mounting screw, and the mounting screw is inserted into the mounting hole through the through hole from the electronic component side. A heat radiating plate is attached to the main heat radiating plate.

Therefore, since the electronic component and the auxiliary heat sink can be fixed to the main heat sink with one mounting screw, the heat dissipation structure can be simplified, and the electronic component and the auxiliary heat sink can be connected to each other. It is possible to simplify the assembling work for fixing to the main heat sink.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a heat dissipation structure of an electronic component according to a first embodiment of the present invention.

FIG. 2 is a perspective view illustrating a state in which a main radiator plate, an auxiliary radiator plate, and an electronic component of the heat radiating structure of the electronic component according to the first embodiment of the present invention are mounted on a printed circuit board.

FIG. 3 is a perspective view illustrating a heat radiation structure of an electronic component according to a second embodiment of the present invention.

FIG. 4 is a perspective view illustrating a heat radiation structure of an electronic component according to a third embodiment of the present invention.

FIG. 5 is a perspective view illustrating a state in which a heat radiating plate having a heat radiating structure for a conventional electronic component and an electronic component are mounted on a printed circuit board.

FIG. 6 is a perspective view illustrating a state in which a heat radiating plate and an electronic component of another conventional heat radiating structure for an electronic component are mounted on a printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Main heat sink 3, 4 Electronic component 5, 6 Auxiliary heat sink 5a, 6a Auxiliary heat sink main body 5b, 6b Flat plate part 5c, 6c Mounting hole 5d, 6d Mounting leg part 5e, 6e Notch part 5f, 6f Ventilation holes 7, 8 Mounting screws (common fixing means) 9, 10 Fixing clips (common fixing means)

Claims (6)

[Claims] An electronic component mounted on a printed circuit board;
A main radiator plate attached to the printed circuit board along the electronic component; and an auxiliary radiator plate attached to the main radiator plate facing the electronic component with the main radiator plate interposed therebetween. A heat radiating structure for an electronic component, wherein the component and the auxiliary heat radiating plate are fixed to the main heat radiating plate by one common fixing means. 2. A plurality of electronic components having different heat values mounted on a printed board, a main radiator attached to the printed board along the plurality of electronic components, and the main radiator interposed therebetween. A plurality of auxiliary heat radiating plates having different heat radiating areas attached to the main heat radiating plate in opposition to the plurality of electronic components, wherein the auxiliary heat radiating plate has a heat radiating size based on a heat value of each of the electronic components. The heat radiating structure for an electronic component according to claim 1, wherein the heat radiating structure has an area. 3. The auxiliary radiator plate includes a mounting leg for fixing the auxiliary radiator plate to the printed circuit board.
By being fixed to the main heat radiating plate by the common fixing means and being fixed to the printed circuit board by the mounting legs, the main heat radiating plate is supported substantially perpendicularly to the printed circuit board. The heat radiating structure for an electronic component according to claim 1 or 2, wherein 4. A notch for arranging another electronic component on the printed circuit board is provided at an edge of the auxiliary heat radiating plate in contact with the printed circuit board. A heat dissipation structure for an electronic component according to any one of claims 1 to 3. 5. The auxiliary heat radiating plate includes an auxiliary heat radiating plate main body that is in contact with the main heat radiating plate, and a plurality of flat plate portions integrally formed with the auxiliary radiating plate main body. The heat radiating structure for an electronic component according to claim 1, further comprising: 6. The common fixing means is a mounting screw, wherein the electronic component and the main heat sink have through holes for the mounting screw, and the auxiliary heat sink has a mounting hole for the mounting screw. A hole is provided, and the electronic component and the auxiliary radiator plate are attached to the main radiator plate in a state where the mounting screw is inserted into the mount hole through the through hole from the electronic component side. The heat radiating structure for an electronic component according to claim 1, wherein: