JP2001272922A - Electro-optical device manufacturing method and electro-optical device manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for eliminating development unevenness in a paddle development step used in a manufacturing process of a liquid crystal device and an apparatus optimal for the method. SOLUTION: In a paddle developing step of a rectangular substrate, a plurality of developing solution outflow tubes are provided, and the plurality of developing solution outflow tubes are moved so as to equally share and scan the rectangular substrate surface. The time difference required for placing the developer is minimized. The apparatus for this purpose includes a transport system for transporting a rectangular substrate, a substrate support unit capable of rotating the substrate, and a plurality of developer outlet pipes movable along the surface of the rectangular substrate. In addition, the cleaning process can be performed simultaneously with the paddle development.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electro-optical device and an apparatus for manufacturing an electro-optical device used for manufacturing an electro-optical device. More specifically, the present invention relates to a resist developing process when a pattern is formed on a rectangular substrate constituting an electro-optical panel by a photolithography method.

[0002]

2. Description of the Related Art Pattern formation on a rectangular substrate by a photolithography method is widely used, for example, in manufacturing a substrate of a liquid crystal device which is a kind of electro-optical device. Photolithography is a kind of photographic technology. After applying a resist on a substrate, a predetermined pattern is exposed to light, and through a process such as development processing with a developer, post baking, and cooling, the desired pattern is formed on the substrate. This is a method of obtaining the pattern.

[0003] In the case of performing a developing process using a developing solution, a method of contacting the substrate with the developing solution includes a dip method in which the developing solution is stored in a liquid tank and the substrate is immersed in the liquid tank. The dip method has a drawback that the developing solution deteriorates as the developing process proceeds, resulting in uneven development. As a means for solving this drawback, there is a shower system in which development is performed while supplying a large amount of a developing solution onto the surface of the substrate in a shower shape.
In the shower system, fresh developer is always supplied, but the consumption of the developer becomes enormous, and new equipment is required to collect and reuse the developer.

[0004] Alternatively, as another method, a developing solution is supplied from a paddle (developing solution outflow pipe) to the substrate surface, and a liquid level of the developing solution is formed on the substrate surface by utilizing the surface tension of the developing solution. A paddle method of performing a development process while holding for a certain period of time has also been used.

The paddle method has an advantage that the amount of the developer used for one development can be greatly reduced and an advantage that the maintenance is easy as compared with the dip method and the shower method. This method is widely used as a method for manufacturing an optical device.

In the paddle type developing method, a method is also employed in which a developing solution is dropped from a plurality of developing solution discharge nozzles provided in a developing solution supply tube onto the substrate surface while moving a developing solution outflow tube along the substrate surface. Have been.

In the above-mentioned paddle type developing method, it is important to prevent the development from becoming non-uniform and causing uneven development. In order to prevent the development unevenness, it is necessary to uniformly supply the same amount of the developing solution of good quality without deterioration to the substrate surface.

[0008]

In manufacturing an electro-optical device, a large number of electro-optical panels are generally chamfered from one mother substrate. 2. Description of the Related Art In a manufacturing apparatus of an electro-optical device, a transport system in which a rectangular mother substrate is transported in a long side direction of the substrate and sequentially goes through a predetermined process is adopted. By moving the mother substrate in the long side direction, the substrate can be stably transported and the space for the apparatus can be reduced. The developing solution applying step, the developing processing step, and the developing solution cleaning step are also performed in one developing device, but the substrate is moved one by one in a direction along the long side of the substrate and goes through each step. .

In the developing solution application step, a developing solution outflow pipe is arranged in parallel with the short side of the mother substrate, and as the rectangular mother substrate is conveyed in the long side direction, the short side at one end of the mother substrate is removed from the other side. When the developer is supplied to the short side of the end,
There is a time lag between when the developing solution starts to be supplied from one end surface of the mother substrate and when the developing solution is completely supplied to the other end surface of the mother substrate, which causes uneven development. For example, when moving the developer outflow tube at a speed of 80 mm per second on the surface of a substrate having a long side of 500 mm, the required time is 6.25 seconds, and the portion where the developer is supplied first and the last , The development time differs by 6.25 seconds. If the relative movement speed of the developer outflow tube and the substrate transport is increased and the developer is supplied onto the substrate in a short time, the wettability between the substrate and the developer is poor. After that, it does not spread smoothly, and a so-called liquid shortage phenomenon occurs.

If a difference occurs in the development time (the time when the developer is supplied to the entire surface of the substrate after the developer is supplied to the substrate, and the predetermined time on the substrate, and the time when the developer is held), the difference in the surface of the substrate In the above, there is a difference in the width of the resist pattern obtained. That is, due to the variation in the resist pattern, the dimension of the pattern finally formed on the substrate varies within the substrate surface.

Considering an active matrix type liquid crystal device as an example of an electro-optical device, a TFD (Thin Film Diode) element or a TFT (Thin) used as a liquid crystal driving element.
In Film Transistor Variations in element pattern dimensions mean that switching characteristics vary. Therefore, when the TFD element is a two-terminal element in which an insulating layer is interposed between a pair of conductive films, and one of the conductive films is formed in a tantalum (Ta) pattern, the width of the tantalum pattern is two. It is about 0.5 μm, and the variation in pattern width is required to be within ± 0.2 μm. Also,
When a chromium (Cr) pattern forming the other conductive film is formed, the width of the chromium pattern is about 3.0 μm, and the variation in pattern width is required to be within ± 0.2 μm.

When a tantalum pattern or a chromium pattern is formed on the whole surface of a substrate by a sputtering method and then a tantalum pattern or a chromium pattern for a TFD element is formed by a photolithography method, a time required for developing a resist pattern is required. Is usually about 50 to 60 seconds. Ideally, it is desirable that the entire surface of the substrate is subjected to the development processing within the same range for the same time. If a development time difference of 6.25 seconds occurs for a development time of about 50 to 60 seconds, a difference of 10% or more occurs, and it is not expected to obtain a uniform resist pattern in the substrate surface.

In order to increase the production efficiency, the size of a mother substrate for a liquid crystal device has become larger and larger, and the difference in development time has become a serious problem. There is a need for a processing method that can accommodate a large mother substrate, uses a small amount of a developing solution, can uniformly apply the developing solution over the entire mother substrate in a short time, and reduces the difference in developing time.

[0014]

A method of manufacturing an electro-optical device according to the present invention is a method of manufacturing an electro-optical device which develops a resist on a rectangular substrate on which a resist exposed to a predetermined pattern is formed by using a developing solution. A step of horizontally supporting the substrate, supplying the developing solution while moving a plurality of developing solution outflow tubes in parallel with the substrate surface, and holding and developing for a predetermined time. And

When a developer is placed on a rectangular substrate, if the developer is sprayed using a plurality of developer outlet pipes, the time required for spraying is shortened accordingly, and the portion where the developer is first placed is placed. And the time difference between the last portion and the portion to be placed can be reduced, and the developing time at each portion of the substrate surface can be made more uniform. Even when the size of the substrate is increased, it is possible to reduce the time required for spraying the developer.

The developing step may further include a step of cleaning the substrate.

Further, in the present invention, as the plurality of developer outflow pipes, for example, those which are branched from one main pipe to at least two branch pipes can be used. One main
The structure is simplified to form a book, and at the tip end, two branch pipes are branched into a developer outflow pipe. Supply time can be shortened.

Further, in the method of manufacturing an electro-optical device according to the present invention, a means for performing development while moving the two developing solution outflow tubes from both ends of the substrate toward the center is adopted. can do.

Alternatively, a developing method may be employed in which the two developing solution outflow tubes are moved from the center of the substrate toward both ends.

Further, a method in which one of the two developer outflow tubes is moved from the center of the substrate toward one end and the other is moved from one end of the substrate toward the center. It may be. In any case, the required time can be reduced to half as compared with the case where one developer outlet pipe is used.

It is preferable to use a developing solution outlet pipe having a plurality of developing solution discharge nozzles on the side of the developing solution outlet pipe facing the substrate.

This is because the developing solution is uniformly placed on the entire surface of the substrate in as short a time as possible. Further, in the present invention, the time for the developer outflow tube to move on the surface of the rectangular substrate,
It is preferable that the development time is within 10%.

The time required for the development processing of the resist pattern is usually about 50 to 60 seconds, and no remarkable development unevenness is recognized when the development time is within 10%.

An apparatus for manufacturing an electro-optical device according to the present invention is an apparatus for manufacturing an electro-optical device having a rectangular substrate, comprising: a transport system for transporting the substrate; a substrate support for horizontally supporting the substrate; In parallel with the substrate surface, a plurality of developer outflow pipes that are relatively movable with respect to the substrate and have a plurality of developer discharge nozzles, and a cleaning unit that cleans the developer on the substrate surface, It is provided.

It is preferable that the cleaning means is formed by water washing in which pure water is sprayed on the substrate. At this time, it is preferable that the developing solution outflow pipe and the washing nozzle are arranged on the substrate supporting portion, and the developing solution is placed on the substrate, and the washing process can be performed immediately after leaving the developing solution for a predetermined time. On the same substrate supporting part, if it is configured so that the developer mounting step and the cleaning step can be performed continuously, the continuity of the work is secured,
In addition, variations in the development time can be suppressed.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for manufacturing an electro-optical device according to the present invention and an apparatus for manufacturing an electro-optical device suitable for use in the manufacturing method will be described in detail.

FIG. 1 is a process diagram showing a part of a manufacturing process of an electro-optical device, mainly focusing on a resist pattern developing process.

The manufacturing process of the electro-optical device of the present invention can be summarized as follows. After a predetermined film is formed on the entire surface of a mother substrate made of transparent glass or plastic, a resist is applied on this film ( Step a). Next, the resist is exposed using a predetermined mask to print a pattern (step b). A developer is supplied onto the substrate on which the pattern has been printed, and after maintaining the developer for a predetermined time, the substrate is washed to leave a necessary resist pattern portion on the film (step c). This is a central step of the present invention. The developing process includes a process of supplying a developing solution to the surface of the substrate, holding the developing solution for a certain period of time, performing a developing process, and then washing the substrate with pure water and dehydrating the substrate. Next, the remaining resist pattern is baked at a low temperature (step d) and further cooled (step e) to obtain a desired resist pattern.

First, an apparatus used in the above-described series of development processing steps will be described.

FIG. 2 is a sectional view showing an example of a resist developing apparatus which is an apparatus for manufacturing an electro-optical device according to the present invention. FIG.
3 is a plan view of the developing device of FIG.

The electro-optical device manufacturing apparatus shown in FIG. 2 includes a developing chamber 1 disposed at the center, a loading chamber 2 and a loading chamber 2 disposed adjacent to the substrate loading side and the substrate loading side of the developing chamber 1, respectively. 3, a substrate transport system 4 for transporting the substrate 10 through these chambers, and a developing chamber 1 for flowing and placing the developer on the surface of the substrate 10 transported by the substrate transport system 4. And a developer supply system 6 including a metering pump 63 for quantitatively feeding the developer into the developer outflow pipe 5, a transfer of the substrate 10, and a metering pump 63.
And a control unit 7 for controlling the delivery of the developing solution according to the transfer timing of the substrate 10.

The substrate transport system 4 includes a rotating shaft 41 and rollers 4
It is configured by arranging a number of roller units composed of two along the transport line 40. A substrate loading port 130 is formed in the loading partition 11 that partitions the developing chamber 1 and the loading chamber 2, and a substrate loading port 140 is formed in the loading partition 13 that partitions the developing chamber 1 and the loading chamber 3. Have been. The substrate 10 is transferred by the transfer system 4 to the substrate loading port 1.
After entering the developing chamber 1 through the developing chamber 30 and performing a predetermined developing process as described later, the substrate is unloaded from the substrate outlet 140.

The substrate 10 which has entered the developing chamber 1 is transferred onto a rotatable substrate supporting portion 8 which supports the substrate horizontally and performs a developing process including a cleaning process for cleaning the developing solution. Will be The substrate 10 transported into the developing chamber 1 is transferred from the transport roller 42 to the substrate support 8. The substrate supporting portion 8 is capable of holding the substrate 10 by suction, for example, by a vacuum chuck mechanism. The substrate support unit 8 includes a hydraulic push-up mechanism (not shown), and when the substrate 10 is suction-held, pushes the substrate 10 above the surface of the transport roller 42. Thereafter, the developer is supplied onto the substrate from the developer outlet pipe.

The developer outflow pipe 5 will be described. The developer outflow pipe 5 may be installed parallel to the transport line 40 (parallel to the direction in which the substrate is transported), or at right angles to the transport line 40 (at right angles to the direction in which the substrate is transported). May be installed. In FIG. 2 and FIG. 3, the two developer outlet pipes 5 are mounted so as to be perpendicular to the direction in which the substrate is transported. The developer outflow pipe 5 is provided with a support arm 51.
Support rail 5 attached to the ceiling of the developing chamber 1 by
4 is movably attached to the substrate 10 in a suspended state, and is configured to be able to move from the edge of the substrate 10 to the edge of the substrate 10 by a driving device (not shown).

Although the example in which the developer outflow pipe 5 is supported from the ceiling in a suspended state has been described, a structure in which the developer outflow pipe 5 is supported by being raised from below may be used.

The developing solution outflow pipe 5 is composed of at least two or more developing solution outflow pipes, each of which can move on a non-overlapping part of the plane of the substrate. It is configured to be mobile.

The developer outlet pipe 5 is connected to a main pipe 50 of the developer supply system 6 via a flexible hose 53. The inner diameter of the developer outflow tube 5 is about 6 to 10 mm, and the length is substantially equal to the length of the substrate 10 in the short side direction. A plurality of developing solution discharge nozzles 52 are provided at respective positions of the developing solution outflow pipes 5 facing the substrate 10. The diameter of the developer discharge nozzle 52 is, for example, 1 when developing a novolak-based resist with an aqueous alkaline solution.
mm, and the interval between the developer discharge nozzles 52 is 2 to 4 mm.
mm. However, these values are not particularly limited, and the type of developer, the discharge temperature,
The distance may be determined as appropriate in consideration of the distance between the developing solution discharge nozzle 52 and the like.

The developing solution supply system 6 includes a developing solution tank 61 disposed outside the apparatus for manufacturing the liquid crystal device of the present invention, and a supply pipe for supplying the developing solution from the developing solution tank 61 to the developing solution outflow pipe 5. 62. A metering pump 63, a filter 64, a solenoid valve 65, and a suck back 66 are inserted in this order in the middle of the supply path of the developer through the supply pipe 62.

The developing solution tank 61 is purged with an inert gas such as nitrogen to prevent the developing solution from reacting with air and being oxidized and deteriorated. The developer tank 61 is supplied with a new developer as needed.

The metering pump 63 supplies the developing solution from the developing solution tank 61 to the developing solution outflow pipe 5 quantitatively. The metering pump 63 includes a flow controller (not shown). When the solenoid valve 65 is opened by a signal from the control unit 7, the developing solution is sent to the developing solution outflow pipe 5, and a predetermined amount of developing solution is supplied from each developing solution discharge nozzle 52. Is discharged. When the size of the substrate 10 or the type of the developing solution is changed, the flow controller is appropriately adjusted through the control unit so that a predetermined amount of the developing solution is supplied.

The filter 64 is for removing foreign matter that is mixed in the developing solution, and a conventionally known filter can be used.

The suck back 66 is for reducing the pressure of the developing solution in the pipe to a negative pressure when the electromagnetic valve 65 is closed to prevent the developing solution from dropping from the developing solution discharge nozzle 52.

In the developing chamber 1 of the present apparatus, the developing solution is placed on the substrate, the developing solution is placed on the substrate for a predetermined time, and then the cleaning process corresponding to the latter half of the developing process is performed. The substrate supporting unit 8 is provided with an electric rotating mechanism (not shown), and rotates the suction-held substrate 10 by using pure water for cleaning sprayed from a water washing nozzle 9 disposed immediately above the center of the substrate 10. The surface of the substrate is cleaned, and pure water is blown off from the substrate by using the centrifugal force of rotation. When the cleaning is completed, the substrate supporting unit 8 is lowered again to the level of the transport rollers 42, the substrate 10 is placed on the transport rollers 42 on the unloading chamber 3 side, and transported to the unloading chamber 3.

Next, a description will be given of a method of development processing when a liquid crystal device is manufactured using the manufacturing apparatus for an electro-optical device shown in FIG.

FIG. 3 is a diagram showing a plan view of the developing apparatus 1 of the electro-optical device manufacturing apparatus shown in FIG. The substrate 10 to which the photoresist has been applied and the resist has been exposed in a predetermined pattern is carried into the developing chamber 1 from the carry-in chamber 2 by the substrate transport system 4. The substrate 10 carried into the developing chamber 1 is placed on the substrate support 8. The developer is quantitatively discharged from one short side (the right end in FIG. 3) which is one end of the substrate 10 and the two developer outflow tubes 5a and 5b arranged on the center of the substrate 10, and at the same time, the developer outflow tube 5a, 5
b moves at a predetermined speed in a direction of the other short side (the left end in FIG. 3) opposite to one short side which is the other end of the substrate 10 at a predetermined interval. During this time, the developer dropped on the surface of the substrate 10 spreads over the entire surface of the substrate on which the resist is applied, and forms a uniform liquid with a constant thickness due to surface tension.

In the example shown in FIG. 3, the developer outlet pipe 5b and the developer outlet pipe 5a are branched from the main pipe, and the main pipe is connected to the main pipe of the developer supply system 6 via the flexible tube 54. 50. As described above, the two developer outflow pipes 5a and 5b are arranged in parallel at a constant distance from each other, and are configured so that the surface of the substrate 10 can be divided into two parts to apply the developer. I have.

FIG. 4 is a schematic view for explaining how the developer outflow pipes 5a and 5b move. Developer outflow pipes 5a, 5b
Is suspended by a support rail 54 provided in the developing chamber 1 via a support arm 51, and is moved in a direction F or a direction opposite to the direction F by a driving device (not shown). Of course, the developing solution outflow pipes 5a and 5b may be supported from below via the support arm 51.

At this time, the moving direction of the developer outflow tubes 5a and 5b is such that the developer outflow tube 5a is directed from one end (the right end in FIG. 5) of the substrate 10 to the center as shown in detail in FIG. The outflow pipe 5b is moved in the direction of F in the figure from the center of the substrate 10 to the other end (the left end in FIG. 5). 2
This is because the developer outflow pipes 5a and 5b cover the surface of the substrate 10 half by half to reduce the time difference between the formation of the liquid pool.

As a result, the time difference between the formations of the liquid reservoirs is reduced, and as a result, the portion where the first developing solution is placed (the portion indicated by the symbol S at the right end and the center in FIG. 5) and the portion where the developing solution is placed last The development time difference between the portion (the center portion and the portion indicated by the symbol E at the left end in FIG. 5) becomes small, and uneven development can be avoided.

FIGS. 6 and 7 show another example of the arrangement and movement of the developer outflow pipes 5a and 5b when the surface of the substrate 10 is covered in half by the two developer outflow pipes 5a and 5b. Show. In FIG. 6, two developer outflow pipes 5a and 5b are arranged at both ends of the substrate 10, and are configured to move at the same speed toward the center of the substrate 10.

In FIG. 7, two developer outlet pipes 5a and 5b are provided.
Are arranged at the center of the substrate 10 and are configured to move toward opposite ends of the substrate 10 in opposite directions at the same speed. In any case, the surface of the substrate 10 is covered in half by the two developer outlet pipes 5a and 5b, so that the time difference between the formation of the liquid pool can be reduced.

In any case, the developer outflow pipe 5
If the direction in which a and 5b are moved is along the short side of the substrate 10 (perpendicular to the arrow F in FIG. 5), it is possible to further reduce the time difference between the formations of the liquid.

Here, the case where there are two developer outflow pipes has been described. However, if more developer outflow pipes are arranged depending on the size of the substrate, the development time can be substantially reduced at an arbitrary position on the substrate surface. Uniform development processing can be performed while keeping the temperature constant.

FIG. 8 shows a process of forming a liquid bank of the developing solution obtained by moving the developing solution outflow pipes 5a and 5b as shown in FIGS. First, the developer dropped onto one end S on the substrate 10 by the developer outlet pipe 5a spreads to the periphery to form a liquid reservoir 20a by surface tension, and the central part S on the substrate 10 is formed by the developer outlet pipe 5b. The developer dropped on the surface spreads to the periphery, and the surface tension causes the liquid 20b to rise.
(See FIG. 8A). As the developer outflow pipes 5 and 5b move, the liquid reservoirs 20a and 20b also sequentially expand (see FIG. 8B), and when the developer outflow pipe 5b reaches the other end on the substrate 10, as shown in FIG. The liquid 20 is formed over the entire surface of the substrate 10.

After the liquid 20 is formed on the entire surface of the substrate 10, the supply of the developing solution is stopped and the developing process is performed for a predetermined time. When the developing process is completed, pure water for cleaning is sprayed from a water spray nozzle 9 attached to the ceiling of the developing chamber 1 while rotating the substrate supporting portion 8 shown in FIG.
0 surface is thoroughly washed. The substrate 10 after cleaning is
The substrate is again transported to the unloading chamber 3 by the substrate transport system 4 and sent to the next step. As the washing water, pure water having high purity is preferable.

In the present invention, the developing time is defined as the time from when the developing solution is supplied from one end of the substrate to the time when the developing solution is supplied to the other end and is maintained for a certain period of time before the cleaning of the substrate is started. Up to.

In this series of steps, all the steps such as transport / rotation of the substrate 10, movement of the developer outflow pipe 5, discharge of the developer, and discharge of the washing water are automatically controlled by the signal from the control unit 7. be able to.

(Specific Example of Liquid Crystal Device) An active matrix type liquid crystal device will be described as an example of an electro-optical device manufactured using the method of manufacturing an electro-optical device and the developing device of the present invention. This liquid crystal device includes a TFD element as a switching element.

FIG. 9 is a diagram showing a partial configuration of a liquid crystal device provided with an electro-optical device obtained by the manufacturing method of the present invention and using a TFD element as a switching element. FIG.
In order to make each layer and each member large enough to be recognized in the drawings, the scale of each layer and each member is shown differently from the actual one.

As shown in FIG. 9, in the liquid crystal device 100, an element substrate (lower substrate) 11 having a TFD element 25 is provided.
1 and a color filter substrate (upper substrate) 121 provided with a color filter layer 18 are bonded at a predetermined interval via a sealing material (not shown) at a peripheral portion of each substrate. A liquid crystal layer (not shown) is sandwiched between the substrate 111 and the color filter substrate 121. The element substrate 111 mainly includes a transparent substrate 110 made of glass or plastic, and a pixel electrode 28 and a TFD element 25 formed thereon. The color filter substrate 121 mainly includes a transparent substrate 120 made of glass or the like, a color filter layer 18 and a transparent electrode 19 laminated on the lower surface side (liquid crystal layer side).

As shown in FIG. 9, a plurality of pixel electrodes 28 are arranged in a matrix on a substrate 110, and a TFD element 25 for driving these pixel electrodes 28 is arranged for each pixel electrode 28. ing. On the substrate 110, a TFD is provided between the pixel electrode 28 and the TFD element 25.
A plurality of wiring portions 21 for connecting the elements for each column or row are provided.

On the surface of the substrate 120 on the liquid crystal layer side, the color pixels 18 a and the light-shielding layer (black matrix) 18
b, a color filter layer 18 is formed.
The color pixels 18a are formed by a coloring material method, a dyeing method, a transfer method, a printing method, and the like. For example, R (red), G (green),
Three colors B (blue) are arranged in a predetermined pattern. The light-shielding layer 18b is formed at a portion where the color pixels 18a are not formed, and is made of a metal such as chrome, a color resist in which a black pigment is dispersed, or the like. On the liquid crystal layer side of the color filter layer 18, a plurality of transparent electrodes 19 made of, for example, indium tin oxide (ITO) are formed in a strip shape, and each transparent electrode 19 is provided on the element substrate 110. It is provided so as to intersect with the wiring part 21. Further, a protective film, an insulating film, and the like are formed between the color filter layer 18 and the transparent electrode 19, but are omitted in the drawing for simplification.

In the liquid crystal device 100, the transparent electrodes 19,
The scanning signal is applied to one of the wiring portions 21 and the data signal is applied to the other.

Although an alignment film is formed on the liquid crystal layer side of the pixel electrode 28 and on the liquid crystal layer side of the transparent electrode 19, they are omitted in the drawing for simplicity. Further, between the element substrate 111 and the color filter substrate 121, a large number of spherical spacers are arranged in order to equalize the cell gap of the liquid crystal cell, but are omitted in the drawing. Also, the element substrate 11
1. a retardation plate outside the color filter substrate 121;
Although an optical element such as a polarizing plate is provided, it is omitted in the drawing.

With reference to the element substrate 111 of the liquid crystal device 100, a method for manufacturing an electro-optical device according to the present invention will be described.

FIG. 10 is a plan view showing an example of a TFD element used in a liquid crystal device. FIG. 10 is an enlarged view of a portion near one liquid crystal driving element of one pixel 30 constituting the liquid crystal device. FIG. 11 is a diagram showing a cross-sectional structure of the TFD element shown in FIG. 10 along line AA ′.

In FIGS. 10 and 11, the TFD element 2
Reference numeral 5 denotes a tantalum pattern 22, which is a first conductive film, and an insulating film 2 made of a tantalum anodic oxide film formed on the insulating film formed on the substrate 110 as a base layer 31 in this order.
4 and a TFD structure composed of a chromium pattern 26 as a second conductive film. Tantalum pattern 22
Is connected to the first conductive film of the wiring portion 21 formed on the substrate 110, and the chromium pattern 26 is partially connected to the corner of the transparent pixel electrode 28 made of indium tin oxide or the like. ing. The thickness of the tantalum pattern 22 is about 150 nm, the thickness of the insulating film 24 is about 50 nm,
The thickness of the chrome pattern 26 is about 80 to 100 nm.

A large number of such pixels 30 are arranged in a matrix to form one liquid crystal screen. In a liquid crystal device manufacturing process, a method of simultaneously forming a large number of liquid crystal screens on a single substrate is employed.

Such a TFD element 25 is formed through the following steps.

FIG. 12 shows a process for forming a TFD element on a transparent substrate made of glass or the like. First, in step (a), the size is (for example, 470).
A tantalum (Ta) film as a base layer 31 is deposited on the entire surface of the substrate by sputtering on a glass substrate 110 of × 600) mm, and then thermally oxidized to a thickness of about 50 to 200 μm. A tantalum film is formed. By forming the base layer 31 in this manner, it is possible to improve the adhesion between the substrate 110 and a tantalum film, which is a component of a TFD element described later,
It is also possible to prevent diffusion of impurities from the substrate 110 to the tantalum film. If the diffusion of impurities into the tantalum film does not pose a problem, the formation of the underlayer 31 can be omitted.

Then, a tantalum target containing 0.1 to 6 atomic% of tungsten is used as the first conductive film on the underlayer 31 and the first conductive film is formed by sputtering.
A tantalum alloy film 122 having a thickness of about 00 to 500 nm is formed.

Next, in the step (b), the tantalum alloy film 122 formed in the step (a) is patterned by photoetching to form a tantalum pattern of the wiring portion 21 and a tantalum pattern 22 of the element portion.

In order to pattern the tantalum alloy film 122 by photoetching, a photoresist is applied to the surface of the tantalum alloy film 122 on the substrate 110 (FIG. 1a) according to the process shown in FIG. The resist is exposed with a mask (FIG. 1b), subjected to a development process using a developer (FIG. 1c), post-baked (FIG. 1d), and cooled to obtain a resist pattern.
Next, by etching the substrate 110 on which the resist pattern is mounted, a tantalum pattern of the wiring portion 21 and a tantalum pattern 22 of the element portion shown in FIG. 12B are obtained.

To explain the conditions of the paddle developing process in more detail, a photoresist is applied to a thickness of 1.3 μm.
Next, after a predetermined pattern is exposed, development processing is performed.

A developing solution is placed on the substrate, and the substrate is left standing for 60 seconds to perform a developing process. While rotating the substrate supporting portion 8, pure water is sprayed from the washing nozzle 9 to wash the substrate. The development processing ends. Next, in step (c) shown in FIG. 12, a thickness of about 20 to 70 μm is formed on the tantalum pattern of the wiring portion 21 and the tantalum pattern 22 of the element portion obtained in the step of FIG. An insulating film 24 made of a tantalum oxide film is formed.

Next, in step (d) shown in FIG.
Tantalum pattern 22 of element portion obtained in step 2 (c)
The second insulating film 24 is formed so as to partially overlap the insulating film 24 formed thereon.
A chromium (Cr) pattern 26 to be a conductive film is formed. The chrome pattern 26 has a thickness of 50 to 300 μm.

When forming the chromium pattern 26 so as to partially overlap the insulating film 24, first, a chromium film is formed by sputtering over the entire surface, and then the chromium film is patterned by photoetching. The photo-etching process is the same as the above-described photo-etching of the tantalum alloy film, and therefore, detailed description is omitted.

Finally, in a step (e) shown in FIG. 12, a transparent pixel electrode 28 made of ITO having a thickness of 30 to 200 nm is formed so that the chromium pattern 26 and a part thereof overlap.

When the pixel electrode 28 is formed, similarly to the case of forming the tantalum pattern or the chromium pattern, first, an ITO film is formed on the entire surface by sputtering, and then the ITO film is formed.
The O film is patterned by photoetching. The photo-etching process is the same as the above-described photo-etching of the tantalum alloy film, and therefore, detailed description is omitted.

Thus, the TFD element 25 is obtained in the region where the tantalum pattern 22, the insulating film 24, and the chromium pattern 26 of the element portion overlap. The width of the tantalum pattern 22 of the TFD element 25 thus obtained is 2.5 μm ± 0.10 μm, and the width of the chromium pattern 26 is 3.0 μm ± 0.15 μm. Good results have been obtained, and a uniform element having no variation in characteristics as a TFD element within the liquid crystal panel surface can be obtained.

The element substrate 111 obtained as described above
After the pixels are aligned with the other substrate, for example, the color filter substrate 121, and are adhered at predetermined intervals, the liquid crystal is sealed between the two substrates to form a liquid crystal panel, and then the liquid crystal is driven. The liquid crystal device 100 is obtained by connecting an external circuit and the like to the liquid crystal panel.

As a specific example of the electro-optical device manufactured by the manufacturing method and the manufacturing apparatus according to the present invention, the step of patterning the element of the liquid crystal device has been described, but the present invention is not limited to this. It can be applied to a process of obtaining a pattern using another resist as a mask.

Further, as a specific example of the electro-optical device manufactured by the manufacturing method and the manufacturing apparatus of the present invention, a liquid crystal device has been described as an example in the present embodiment, but the present invention is not limited to this. For example, E manufactured from a rectangular substrate
The present invention is applicable to a method and a device for manufacturing an electro-optical device such as an L (electroluminescence) device, a field emission diode panel, and a plasma display panel.

[0084]

According to the method of manufacturing an electro-optical device of the present invention, when a developer is placed on an exposed resist film,
Since the time difference can be minimized, a uniform resist pattern can be obtained without development unevenness.

[Brief description of the drawings]

FIG. 1 is a process diagram showing a part of a manufacturing process of an electro-optical device with a focus on a development process of a resist pattern.

FIG. 2 is a cross-sectional view illustrating an example of an apparatus for manufacturing an electro-optical device according to the invention.

FIG. 3 is a diagram showing a planar arrangement as viewed from above, centering on a developing chamber 1 of the electro-optical device manufacturing apparatus shown in FIG.

FIG. 4 is a schematic view illustrating a state in which a developer outflow tube 5 moves.

FIG. 5 is a diagram for explaining a moving direction of a developer outflow tube 5;

FIG. 6 is a view for explaining another example of the moving direction of the developer outflow tube 5;

FIG. 7 is a view for explaining another example of the moving direction of the developer outlet pipe 5.

FIG. 8 is a view showing a process of forming a paddle of a developer.

FIG. 9 is a perspective view showing a partial structure of a liquid crystal device.

FIG. 10 is a plan view showing an example of a TFD element used for a liquid crystal device.

11 is a diagram showing a cross-sectional structure along a line AA ′ of the TFD element shown in FIG.

FIG. 12 is a diagram illustrating a step of forming a TFD element.

[Explanation of symbols]

 1 ····· Developing room 2 ······ Loading room 3 ·············································· Transfer line 5, 5a, 5b ···· ·························································································································· Support rail ... developer supply system 61 ... developer tank 62 ... supply side piping 63 ... metering pump 64 ... filter 65 ... solenoid valve 66 ... ····· Suck back 7 ······ Control unit 8 ······ Substrate support unit 9 ······ Sprinkling nozzle 10 ······· Substrate 18 ····· Color filter layer 18a ... Color pixel 18b ... Light-shielding layer 19 ... Transparent electrode 20,20a, 20b ... 21 Wiring part 22 Tantalum pattern 24 Insulating film 25 TFD element 26 Chrome pattern 28 Pixel electrode 30 ... Pixel 31... Underlayer 100... Liquid crystal device 110, 120.

Claims (10)

[Claims] 1. A method for manufacturing an electro-optical device for developing a resist on a rectangular substrate having a resist exposed to a predetermined pattern on a rectangular substrate, using a developer, wherein the substrate is supported horizontally, and A method for manufacturing an electro-optical device, comprising a step of supplying the developing solution while moving a liquid outflow tube in parallel with the surface of the substrate, and holding and developing the developing solution for a predetermined time. 2. The method of manufacturing an electro-optical device according to claim 1, wherein said developing step further includes a step of cleaning said substrate. 3. The method for manufacturing an electro-optical device according to claim 1, wherein the plurality of developer outlet pipes are at least two or more branch pipes branched from one main pipe. . 4. The plurality of developer outlet pipes are two,
2. The developing process according to claim 1, wherein the two developer outlet pipes are moved from both ends of the substrate toward the center thereof.
A method for manufacturing an electro-optical device according to claim 2. 5. The plurality of developer outflow pipes are two,
3. The method of manufacturing an electro-optical device according to claim 1, wherein the developing process is performed while moving the two developer outflow tubes from the center of the substrate toward both ends of the substrate facing each other. . 6. The plurality of developer outflow pipes are two,
One of the developing solution outflow pipes is moved toward one end from the center of the substrate, and the other one is developed while moving from the other end facing the one end of the substrate toward the center. The method for manufacturing an electro-optical device according to claim 1 or 2, wherein 7. The method for manufacturing an electro-optical device according to claim 1, wherein a time required for the plurality of developer outlet tubes to move is within 10% of a developing time. . 8. An apparatus for manufacturing an electro-optical device having a rectangular substrate, comprising: a transport system that transports the substrate; a substrate support that horizontally supports the substrate;
An electro-optic comprising: a plurality of developer outlet pipes movable relative to the substrate and having a plurality of developer discharge nozzles; and cleaning means for cleaning the developer on the substrate surface. Equipment manufacturing equipment. 9. The cleaning means according to claim 8, wherein said cleaning means comprises a washing nozzle for spraying pure water onto said substrate surface.
An apparatus for manufacturing the electro-optical device according to the above. 10. The apparatus for manufacturing an electro-optical device according to claim 9, wherein the developing solution outflow pipe and the washing nozzle are arranged on the substrate support.