JP2001297878A - Manufacturing method of organic EL panel - Google Patents
Manufacturing method of organic EL panelInfo
- Publication number
- JP2001297878A JP2001297878A JP2000117193A JP2000117193A JP2001297878A JP 2001297878 A JP2001297878 A JP 2001297878A JP 2000117193 A JP2000117193 A JP 2000117193A JP 2000117193 A JP2000117193 A JP 2000117193A JP 2001297878 A JP2001297878 A JP 2001297878A
- Authority
- JP
- Japan
- Prior art keywords
- organic
- substrate
- cutting
- panel
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 238000007789 sealing Methods 0.000 claims abstract description 50
- 238000005520 cutting process Methods 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000012044 organic layer Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 22
- 239000011521 glass Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 238000005488 sandblasting Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】
【課題】 製造工程を簡素化することで生産性を高め、
有機ELパネルの製造コストを低減することが可能な有
機ELパネルの製造方法を提供する。
【解決手段】 有機EL素子形成工程は、透光性の支持
基板19上に、有機層4を透明電極3と背面電極5とに
より挟持してなる有機EL素子18を複数箇所に形成す
る。有機EL素子封止工程は、有機層4の数に応じた第
1,第2の凹部20,21を備える封止基板22を用意
し、有機EL素子18と第1の凹部20とが対向し、透
明電極3及び背面電極5の各引き出し部となる電極部1
3,17と第2の凹部21とが対向するように支持基板
19上に封止基板22を配設するとともに、支持基板1
19と封止基板22とを接着する。第1切断工程は、支
持基板19及び封止基板22を切断し個々の有機ELパ
ネル1を得る。第2の切断工程は、第2の凹部21に対
応する箇所を切断し透明電極3及び背面電極5における
各電極部13,17を露出させる。
(57) [Summary] [PROBLEMS] To improve productivity by simplifying the manufacturing process,
Provided is a method for manufacturing an organic EL panel that can reduce the manufacturing cost of the organic EL panel. SOLUTION: In an organic EL element formation step, an organic EL element 18 in which an organic layer 4 is sandwiched between a transparent electrode 3 and a back electrode 5 is formed at a plurality of places on a translucent support substrate 19. In the organic EL element sealing step, a sealing substrate 22 having first and second concave portions 20 and 21 corresponding to the number of the organic layers 4 is prepared, and the organic EL element 18 and the first concave portion 20 face each other. Electrode portion 1 serving as a lead portion of transparent electrode 3 and back electrode 5
The sealing substrate 22 is disposed on the supporting substrate 19 so that the third and the third concave portions 21 face the second concave portion 21.
19 and the sealing substrate 22 are bonded. In the first cutting step, the support substrate 19 and the sealing substrate 22 are cut to obtain individual organic EL panels 1. In the second cutting step, a portion corresponding to the second concave portion 21 is cut to expose the electrode portions 13 and 17 of the transparent electrode 3 and the back electrode 5.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、少なくとも一方が
透光性の一対の電極により挟持され所定の発光をなす有
機EL素子(有機エレクトロルミネッセンス素子)を備
えた有機ELパネルの製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an organic EL panel provided with an organic EL element (organic electroluminescence element) which emits a predetermined light emission, at least one of which is sandwiched between a pair of translucent electrodes. is there.
【0002】[0002]
【従来の技術】有機ELパネルの構造を図3,図4を用
いて説明する。有機ELパネル1は、ガラス基板2上に
ITO(indium tin oxide)等によって透明電極(陽
極)3を形成し、透明電極3上に正孔注入層,正孔輸送
層,発光層及び電子輸送層を順次積層形成してなる有機
層4を形成し、この有機層4上にアルミ(Al)等の背面
電極(陰極)5を形成し、透明電極3,有機層4及び背
面電極5を覆うようにガラス材料からなる凹部形状の封
止キャップ6を支持基板2上に紫外線硬化型の接着剤7
を介し気密的に配設することで構成されるもので、有機
ELパネル1は、透明電極3と背面電極5との間に、直
流電圧を印加することによって前記発光層が所定の発光
をなすものである。また、有機ELパネル1は、発光領
域の輪郭を鮮明に表示するため、または透明電極3と背
面電極5との絶縁を確保するために、ポリイミド系等の
絶縁層8が透明電極3の周縁部に若干重なるようにガラ
ス基板2上に形成されている。2. Description of the Related Art The structure of an organic EL panel will be described with reference to FIGS. In the organic EL panel 1, a transparent electrode (anode) 3 is formed on a glass substrate 2 by ITO (indium tin oxide) or the like, and a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer are formed on the transparent electrode 3. Are sequentially laminated, an organic layer 4 is formed, a back electrode (cathode) 5 of aluminum (Al) or the like is formed on the organic layer 4, and the transparent electrode 3, the organic layer 4, and the back electrode 5 are covered. A sealing cap 6 having a concave shape made of a glass material is provided on the support substrate 2 with an ultraviolet-curing adhesive 7.
In the organic EL panel 1, the light emitting layer emits a predetermined light by applying a DC voltage between the transparent electrode 3 and the back electrode 5. Things. In addition, the organic EL panel 1 includes a polyimide-based insulating layer 8 formed on the periphery of the transparent electrode 3 in order to clearly display the outline of the light emitting region or to ensure insulation between the transparent electrode 3 and the back electrode 5. Are formed on the glass substrate 2 so as to slightly overlap with the substrate.
【0003】また有機ELパネル1は、透明電極3及び
背面電極5から延長形成された電極群9が、長方形形状
からなるガラス基板2の一辺に集中配設されるととも
に、このガラス基板2における電極部9の形成領域10
が封止キャップ6から露出するように構成されている。In the organic EL panel 1, an electrode group 9 extended from the transparent electrode 3 and the back electrode 5 is arranged on one side of a rectangular glass substrate 2, and the electrodes on the glass substrate 2 are formed. Forming area 10 of part 9
Are configured to be exposed from the sealing cap 6.
【0004】[0004]
【発明が解決しようとする課題】かかる有機ELパネル
1の製造方法としては、ガラス基板2となる支持基板上
の複数箇所に、透明電極3,絶縁層8,有機層4及び背
面電極5を適宜方法によって順次形成して有機EL素子
を得て、前記各有機EL素子を個々に用意した封止キャ
ップ6で覆った後、前記支持基板2をスクライブ法によ
って切断して個々の有機ELパネル1を得るようにして
いる。As a method of manufacturing such an organic EL panel 1, a transparent electrode 3, an insulating layer 8, an organic layer 4, and a back electrode 5 are appropriately provided at a plurality of positions on a supporting substrate serving as a glass substrate 2. The organic EL elements are sequentially formed by the method, and the organic EL elements are covered with individually prepared sealing caps 6, and then the support substrate 2 is cut by a scribe method to separate the individual organic EL panels 1. I'm trying to get.
【0005】即ち、電極群9の形成領域10が封止キャ
ップ6の外側に露出するように、個々の前記有機EL素
子に封止キャップ6を配設する必要があるため、生産性
が悪く有機ELパネル1の製造コストを高くしてしまう
といった問題点を有している。また、個々の封止キャッ
プ6を得る場合に、大型のガラス基板によるマルチ取り
が一般的であるため、封止キャップ6の製造工程におい
て、封止キャップ6専用に切断工程後の面取り工程や洗
浄工程が必要となり、製造工程が煩雑になってしまうと
いった問題点を有している。That is, since it is necessary to dispose the sealing cap 6 on each of the organic EL elements so that the formation region 10 of the electrode group 9 is exposed outside the sealing cap 6, the productivity is low and There is a problem that the manufacturing cost of the EL panel 1 is increased. In addition, when individual sealing caps 6 are obtained, multi-cutting using a large glass substrate is generally performed. Therefore, in the manufacturing process of the sealing cap 6, a chamfering step after the cutting step and a cleaning There is a problem that a process is required and the manufacturing process becomes complicated.
【0006】そこで、本発明は、前述した問題点に着目
し、製造工程を簡素化することで生産性を高め、有機E
L素子の製造コストを低減することが可能な有機ELパ
ネルの製造方法を提供するものである。Accordingly, the present invention focuses on the above-mentioned problems and simplifies the manufacturing process to increase the productivity and improve the organic E
An object of the present invention is to provide a method for manufacturing an organic EL panel that can reduce the manufacturing cost of an L element.
【0007】[0007]
【課題を解決するための手段】本発明は、前記課題を解
決するため、透光性の支持基板上に、少なくとも発光層
を含む有機層を一対の電極により挟持してなる有機EL
素子を複数箇所に形成する有機EL素子形成工程と、前
記有機EL素子の数に応じた第1,第2の凹部を備える
封止基板を用意し、前記有機EL素子と前記第1の凹部
とが対向し、前記電極と電気的に接続された引き出し部
と前記第2の凹部とが対向するように前記支持基板上に
前記封止基板を配設するとともに、前記支持基板と前記
封止基板とを接着する有機EL素子封止工程と、前記支
持基板及び前記封止基板の所定箇所を切断し、個々の有
機ELパネルを得る第1切断工程と、前記第2の凹部に
対応する箇所を切断し前記引き出し部を露出させる第2
切断工程と、を含む有機ELパネルの製造方法である。According to the present invention, there is provided an organic EL device comprising a light-transmitting support substrate and an organic layer including at least a light-emitting layer sandwiched between a pair of electrodes.
An organic EL element forming step of forming elements at a plurality of locations, and a sealing substrate having first and second concave portions corresponding to the number of the organic EL elements are prepared, and the organic EL element, the first concave portion, And the sealing substrate is disposed on the support substrate such that the lead portion electrically connected to the electrode and the second concave portion face each other, and the support substrate and the sealing substrate An organic EL element sealing step of bonding the first and second substrates, a first cutting step of cutting predetermined portions of the support substrate and the sealing substrate to obtain individual organic EL panels, and a portion corresponding to the second recess. Second cutting and exposing the drawer portion
And a cutting step.
【0008】また、前記封止基板をガラス材料から構成
し、前記第1,第2の凹部をサンドブラスト法,切削及
びエッチング法の何れかにより形成してなるものであ
る。Further, the sealing substrate is made of a glass material, and the first and second concave portions are formed by any one of a sandblasting method, a cutting and an etching method.
【0009】また、前記第1,第2の切断工程は、スク
ライブ法による切断工程である。Further, the first and second cutting steps are cutting steps by a scribe method.
【0010】[0010]
【発明の実施の形態】以下、本発明の実施の形態を添付
図面に基づき説明するが、従来例と同一もしくは相当箇
所には同一符号を付してその詳細な説明は省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The same or corresponding parts as those in the conventional example are denoted by the same reference numerals, and detailed description thereof will be omitted.
【0011】図1において、有機ELパネル1は、ガラ
ス基板2,透明電極3,絶縁層8,有機層4,背面電極
5及び封止キャップ6から構成されている。In FIG. 1, an organic EL panel 1 includes a glass substrate 2, a transparent electrode 3, an insulating layer 8, an organic layer 4, a back electrode 5, and a sealing cap 6.
【0012】ガラス基板2は、長方形形状からなる平板
部材である。The glass substrate 2 is a rectangular flat plate member.
【0013】透明電極3は、ガラス基板2上にITO等
の導電性材料によって構成され、日の字型の表示セグメ
ント部11と、個々のセグメントからそれぞれ引き出し
形成されたリード部12と、リード部12の終端部に設
けられる電極部(引き出し部)13とを備えている。電
極部13は、ガラス基板2の一辺に集中的に配設され
る。The transparent electrode 3 is made of a conductive material such as ITO on the glass substrate 2 and has a display segment portion 11 in the shape of a star, a lead portion 12 drawn out from each segment, and a lead portion. And an electrode portion (lead portion) 13 provided at the terminal end of the reference numeral 12. The electrode portions 13 are intensively arranged on one side of the glass substrate 2.
【0014】絶縁層8は、ポリイミド系等の絶縁材料か
らなり、表示セグメント部11に対応した窓部14と、
背面電極5の後述する電極部に対応する切り欠き部15
とを有し、発光領域の輪郭を鮮明に表示するため、透明
電極3の表示セグメント部11の周縁部と若干重なるよ
うに窓部14が形成され、また、透明電極3と背面電極
5との絶縁を確保するためにリード部12上を覆うよう
に配設される。The insulating layer 8 is made of an insulating material such as polyimide and has a window portion 14 corresponding to the display segment portion 11,
Notch 15 corresponding to an electrode portion of back electrode 5 described later
In order to clearly display the outline of the light emitting region, a window 14 is formed so as to slightly overlap with the periphery of the display segment 11 of the transparent electrode 3. It is provided so as to cover the lead portion 12 to ensure insulation.
【0015】有機層4は、少なくとも発光層を有するも
のであれば良いが、本発明の実施の形態においては正孔
注入層,正孔輸送層,発光層及び電子輸送層を順次積層
形成してなるものである。有機層4は、絶縁層8におけ
る窓部14の形成箇所に所定の大きさをもって配設され
る。The organic layer 4 may have at least a light emitting layer. In the embodiment of the present invention, a hole injection layer, a hole transport layer, a light emitting layer and an electron transport layer are sequentially formed. It becomes. The organic layer 4 is provided at a position where the window 14 is formed in the insulating layer 8 with a predetermined size.
【0016】背面電極5は、アルミ等の非透光性の導電
性材料から構成され、有機層4上に配設される。背面電
極5は、透明電極3における各電極部13が形成される
ガラス基板2の一辺に設けられるリード部16と電気的
に接続される。尚、リード部16の終端部には、電極部
(引き出し部)17が設けられ、リード部16及び電極
部17は透明電極3と同材料により形成される。The back electrode 5 is made of a non-light-transmitting conductive material such as aluminum, and is provided on the organic layer 4. The back electrode 5 is electrically connected to a lead portion 16 provided on one side of the glass substrate 2 on which the respective electrode portions 13 of the transparent electrode 3 are formed. Note that an electrode portion (lead portion) 17 is provided at the end of the lead portion 16, and the lead portion 16 and the electrode portion 17 are formed of the same material as the transparent electrode 3.
【0017】封止キャップ6は、透明電極3,絶縁層
8,有機層4及び背面電極5からなる有機EL素子18
を収納するための凹部形状の収納空間Sを有し、透明電
極3の電極部13及び背面電極5の電極部17が露出す
るようにガラス基板2よりも若干小さ目に構成されてい
る。封止キャップ6は、ガラス基板2上に紫外線硬化型
の接着剤7によって気密的に配設される。The sealing cap 6 is composed of an organic EL element 18 comprising a transparent electrode 3, an insulating layer 8, an organic layer 4, and a back electrode 5.
Of the transparent electrode 3 and the electrode part 17 of the back electrode 5 are slightly smaller than the glass substrate 2 so that the electrode part 13 of the transparent electrode 3 and the electrode part 17 of the back electrode 5 are exposed. The sealing cap 6 is hermetically disposed on the glass substrate 2 with an ultraviolet-curable adhesive 7.
【0018】以上の各部によって有機ELパネル1が構
成される。An organic EL panel 1 is constituted by the above components.
【0019】次に、図2を用いて有機ELパネル1の製
造方法を説明する。尚、図2において、絶縁層8は省略
し図示しないものとする。Next, a method of manufacturing the organic EL panel 1 will be described with reference to FIG. In FIG. 2, the insulating layer 8 is omitted and not shown.
【0020】先ず、透明電極3,絶縁層8,有機層4及
び背面電極5からなる有機EL素子18を、ガラス基板
2となる支持基板19上の複数箇所に蒸着もしくはスパ
ッタリング法等の手段により形成する「有機EL素子形
成工程,図2(a)」。First, an organic EL element 18 including a transparent electrode 3, an insulating layer 8, an organic layer 4, and a back electrode 5 is formed at a plurality of locations on a support substrate 19 serving as the glass substrate 2 by means such as vapor deposition or sputtering. "Organic EL element forming step, FIG. 2 (a)".
【0021】そして、サンドブラスト法,切削及びエッ
チング法の何れかにより、有機EL素子18の大きさに
対応し収納空間Sとなる第1の凹部20と、第1の凹部
20と同等な方法により形成され、透明電極3及び背面
電極5の各電極部13,17の形成領域10の大きさに
対応する第2の凹部21とを備えた封止基板22を用意
する「図2(a)」。Then, the first concave portion 20 corresponding to the size of the organic EL element 18 and serving as the storage space S and a method equivalent to the first concave portion 20 are formed by one of the sandblasting method, the cutting and the etching method. Then, a sealing substrate 22 having a second concave portion 21 corresponding to the size of the formation region 10 of each of the electrode portions 13 and 17 of the transparent electrode 3 and the back electrode 5 is prepared (FIG. 2A).
【0022】次に、封止基板22における支持基板19
との当接面23に接着剤7を塗布し、第1の凹部20が
有機EL素子18に対応し、また第2の凹部21が形成
領域10に対応するように、封止基板22を支持基板1
9上に接着固定することで有機ELパネル1を複数有す
るマルチ基板24が得られる「有機EL素子封止工程,
図2(b)」。Next, the supporting substrate 19 in the sealing substrate 22
The adhesive 7 is applied to the contact surface 23 of the sealing substrate 22, and the sealing substrate 22 is supported so that the first recess 20 corresponds to the organic EL element 18 and the second recess 21 corresponds to the formation region 10. Substrate 1
The multi-substrate 24 having a plurality of the organic EL panels 1 is obtained by bonding and fixing on the organic EL element 9.
FIG. 2 (b).
【0023】次に、第2の凹部21の底面25の幅Wに
対応する箇所の封止基板22の表面と、有機ELパネル
1の区画領域に応じた支持基板19及び封止基板22の
表面とに、スクライバによって切断溝26を形成する
「図2(b)」。Next, the surface of the sealing substrate 22 corresponding to the width W of the bottom surface 25 of the second concave portion 21 and the surfaces of the supporting substrate 19 and the sealing substrate 22 corresponding to the partitioned area of the organic EL panel 1 Then, the cutting groove 26 is formed by a scriber (FIG. 2B).
【0024】次に、マルチ基板24において、第2の凹
部21における外側に位置する切断溝26と、有機EL
パネル1の区画領域に応じた切断溝26との形成位置を
切断し、マルチ基板24を個々の有機ELパネル1に分
割する「第1切断工程,図2(c)」。Next, in the multi-substrate 24, a cutting groove 26 located outside the second recess 21 and an organic EL
A “first cutting step, FIG. 2C”, in which the formation positions of the cutting grooves 26 corresponding to the divided areas of the panel 1 are cut, and the multi-substrate 24 is divided into individual organic EL panels 1
【0025】前述した切断工程により個々に分割された
有機ELパネル1は、第2の凹部21の形成箇所におい
て、底面25が片持ち状態にて存在する構成であるた
め、第2の凹部21における内側に位置する切断溝26
の形成位置を切断する「第2の切断工程,図2
(d)」。The organic EL panel 1 divided by the above-described cutting step has a configuration in which the bottom surface 25 is cantilevered at the location where the second concave portion 21 is formed. Cutting groove 26 located inside
2 at the second cutting step, FIG.
(D). "
【0026】従って、底面25が除去されることで、各
電極部13,17の形成領域10が露出する有機ELパ
ネル1が得られることになる「第2の切断工程,図2
(e)」。Accordingly, by removing the bottom surface 25, the organic EL panel 1 in which the formation regions 10 of the electrode portions 13 and 17 are exposed is obtained.
(E). "
【0027】かかる有機ELパネル1の製造方法は、透
光性の支持基板19上に、透明電極3,絶縁層8,有機
層4及び背面電極5からなる有機EL素子18を複数箇
所に形成する有機EL素子形成工程と、有機EL素子1
8と対応した数の第1,第2の凹部20,21を備える
透光性の封止基板22を用意し、有機EL素子18と第
1の凹部20とが対向し、また透明電極3及び背面電極
5の引き出し部となる各電極部13,17と第2の凹部
21とが対向するように支持基板19上に封止基板22
を配設するとともに、支持基板19と封止基板22とを
接着する有機EL素子封止工程と、支持基板19及び封
止基板22を切断し、個々の有機ELパネル1を得る第
1切断工程と、第2の凹部21に対応する箇所を切断し
各電極部13,17を露出させる第2切断工程とを含む
ものであり、個々の封止キャップを有機EL素子に合わ
せて配設した従来の製造方法に比べ、第2の凹部21に
対応する箇所を切断するといった簡単な製造方法によっ
て、各電極部13,17が外部に露出する有機ELパネ
ル1を得ることが可能となる。また、マルチ基板24か
らの切断工程のみで個々の有機ELパネル1を得ること
ができることから、生産性を向上させるとともに、製造
コストを低減させることが可能となる。In the method of manufacturing the organic EL panel 1, an organic EL element 18 including a transparent electrode 3, an insulating layer 8, an organic layer 4, and a back electrode 5 is formed at a plurality of locations on a translucent support substrate 19. Organic EL element forming step and organic EL element 1
A translucent sealing substrate 22 having a number of first and second concave portions 20 and 21 corresponding to 8 is prepared, and the organic EL element 18 and the first concave portion 20 face each other. The sealing substrate 22 is placed on the support substrate 19 so that the electrode portions 13 and 17 serving as the lead-out portions of the back electrode 5 and the second concave portion 21 face each other.
And an organic EL element sealing step of bonding the support substrate 19 and the sealing substrate 22 to each other, and a first cutting step of cutting the support substrate 19 and the sealing substrate 22 to obtain individual organic EL panels 1 And a second cutting step of cutting a portion corresponding to the second concave portion 21 to expose each of the electrode portions 13 and 17, and a conventional method in which individual sealing caps are arranged in accordance with the organic EL element. The organic EL panel 1 in which the electrode portions 13 and 17 are exposed to the outside can be obtained by a simple manufacturing method such as cutting the portion corresponding to the second concave portion 21 as compared with the manufacturing method described in (1). Further, since the individual organic EL panels 1 can be obtained only by the step of cutting from the multi-substrate 24, it is possible to improve the productivity and reduce the manufacturing cost.
【0028】また、本発明の有機ELパネル1の製造方
法では、従来の製造工程のように封止キャップ6を形成
する場合に生じる切断工程後の面取り工程や洗浄工程が
不要となる。また有機ELパネル1の切断部分における
面取り及び洗浄工程を第2切断工程後にまとめて行うこ
とができることから、作業効率を向上させることが可能
である。Further, in the method of manufacturing the organic EL panel 1 according to the present invention, a chamfering step and a cleaning step after the cutting step which occur when the sealing cap 6 is formed as in the conventional manufacturing step are not required. In addition, since the chamfering and cleaning steps in the cut portion of the organic EL panel 1 can be performed collectively after the second cutting step, it is possible to improve work efficiency.
【0029】また、封止基板22をガラス材料から構成
し、第1,第2の凹部20,21をサンドブラスト法,
切削及びエッチング法の何れかにより形成することで、
大量生産に優れ、安価に封止キャップ6を得ることが可
能となる。The sealing substrate 22 is made of a glass material, and the first and second concave portions 20 and 21 are formed by a sand blast method.
By forming either by cutting or etching method,
It is excellent in mass production, and the sealing cap 6 can be obtained at low cost.
【0030】また、第1,第2の切断工程は、スクライ
ブ法による切断工程を採用することで、高価な設備を使
用しなくとも、個々の有機ELパネル1を得ることが可
能となり、製造コストの低減を更に可能とする。In the first and second cutting steps, a cutting step by a scribe method is adopted, so that individual organic EL panels 1 can be obtained without using expensive equipment, and the manufacturing cost is reduced. Can be further reduced.
【0031】尚、本発明の実施の形態では、日の字型の
表示形態を例に挙げているが、例えば1つの有機EL素
子を単に発光させる有機ELパネルの製造方法であって
も有効であり、本発明は前述した表示形態に限定される
ものではない。In the embodiment of the present invention, a display in the form of a sun character is taken as an example. However, for example, a method of manufacturing an organic EL panel in which one organic EL element simply emits light is also effective. Thus, the present invention is not limited to the above-described display mode.
【0032】[0032]
【発明の効果】本発明は、透光性の支持基板上に、少な
くとも発光層を含む有機層を一対の電極により挟持して
なる有機EL素子を複数箇所に形成する有機EL素子形
成工程と、前記有機EL素子の数に応じた第1,第2の
凹部を備える封止基板を用意し、前記有機EL素子と前
記第1の凹部とが対向し、前記電極と電気的に接続され
た引き出し部と前記第2の凹部とが対向するように前記
支持基板上に前記封止基板を配設するとともに、前記支
持基板と前記封止基板とを接着する有機EL素子封止工
程と、前記支持基板及び前記封止基板の所定箇所を切断
し、個々の有機ELパネルを得る第1切断工程と、前記
第2の凹部に対応する箇所を切断し前記引き出し部を露
出させる第2切断工程と、を含むものであり、生産性に
優れ、製造コストを低減させることが可能な有機ELパ
ネルの製造方法を提供する。According to the present invention, there is provided an organic EL element forming step of forming an organic EL element in which at least an organic layer including a light emitting layer is sandwiched between a pair of electrodes on a light-transmitting support substrate, at a plurality of locations; A sealing substrate having first and second concave portions corresponding to the number of the organic EL elements is prepared, and the organic EL element and the first concave section are opposed to each other and are electrically connected to the electrodes. An organic EL element sealing step of arranging the sealing substrate on the support substrate such that the portion faces the second concave portion, and bonding the support substrate and the sealing substrate; A first cutting step of cutting a predetermined portion of the substrate and the sealing substrate to obtain an individual organic EL panel, and a second cutting step of cutting a portion corresponding to the second recess and exposing the lead portion; With excellent productivity and manufacturing cost To provide a method of manufacturing an organic EL panel capable of reducing.
【0033】また、前記封止基板はガラス材料から構成
し、前記第1,第2の凹部をサンドブラスト法,切削及
びエッチング法の何れかにより形成してなるものであ
り、大量生産に優れ、安価に封止キャップを得ることが
可能となる。Further, the sealing substrate is made of a glass material, and the first and second concave portions are formed by any one of a sandblasting method, a cutting and an etching method, and is excellent in mass production and inexpensive. It becomes possible to obtain a sealing cap.
【0034】また、前記第1,第2の切断工程は、スク
ライブ法による切断工程であることから、安価な設備に
よって、個々の有機ELパネルを得ることが可能とな
り、製造コストの低減を更に可能とする。Further, since the first and second cutting steps are cutting steps by a scribe method, individual organic EL panels can be obtained with inexpensive equipment, and the manufacturing cost can be further reduced. And
【図1】本発明の実施の形態における有機ELパネルを
示す斜視図。FIG. 1 is a perspective view showing an organic EL panel according to an embodiment of the present invention.
【図2】同上実施の形態の有機ELパネルの製造方法を
示す図。FIG. 2 is a diagram showing a method for manufacturing the organic EL panel according to the embodiment.
【図3】従来の有機ELパネルを示す要部部分断面図。FIG. 3 is a partial cross-sectional view showing a main part of a conventional organic EL panel.
【図4】従来の有機ELパネルを示す平面図。FIG. 4 is a plan view showing a conventional organic EL panel.
1 有機ELパネル 2 ガラス基板 3 透明電極 4 有機層 5 背面電極 7 接着剤 13,17 電極部(引き出し部) 18 有機EL素子 19 支持基板 20 第1の凹部 21 第2の凹部 22 封止基板 25 底面 26 切断溝 DESCRIPTION OF SYMBOLS 1 Organic EL panel 2 Glass substrate 3 Transparent electrode 4 Organic layer 5 Back electrode 7 Adhesive 13, 17 Electrode part (lead-out part) 18 Organic EL element 19 Support substrate 20 First concave part 21 Second concave part 22 Sealing substrate 25 Bottom 26 Cutting groove
Claims (3)
層を含む有機層を一対の電極により挟持してなる有機E
L素子を複数箇所に形成する有機EL素子形成工程と、
前記有機EL素子の数に応じた第1,第2の凹部を備え
る封止基板を用意し、前記有機EL素子と前記第1の凹
部とが対向し、前記電極と電気的に接続された引き出し
部と前記第2の凹部とが対向するように前記支持基板上
に前記封止基板を配設するとともに、前記支持基板と前
記封止基板とを接着する有機EL素子封止工程と、前記
支持基板及び前記封止基板の所定箇所を切断し、個々の
有機ELパネルを得る第1切断工程と、前記第2の凹部
に対応する箇所を切断し前記引き出し部を露出させる第
2切断工程と、を含む有機ELパネルの製造方法。1. An organic EL device comprising a light-transmitting support substrate and an organic layer including at least a light-emitting layer sandwiched between a pair of electrodes.
An organic EL element forming step of forming an L element at a plurality of locations;
A sealing substrate having first and second concave portions corresponding to the number of the organic EL elements is prepared, and the organic EL element and the first concave section are opposed to each other and are electrically connected to the electrodes. An organic EL element sealing step of arranging the sealing substrate on the support substrate such that the portion faces the second concave portion, and bonding the support substrate and the sealing substrate; A first cutting step of cutting a predetermined portion of the substrate and the sealing substrate to obtain an individual organic EL panel, and a second cutting step of cutting a portion corresponding to the second recess and exposing the lead portion; A method for manufacturing an organic EL panel, comprising:
前記第1,第2の凹部をサンドブラスト法,切削及びエ
ッチング法の何れかにより形成してなることを特徴とす
る請求項1に記載の有機ELパネルの製造方法。2. The sealing substrate is made of a glass material,
2. The method for manufacturing an organic EL panel according to claim 1, wherein the first and second concave portions are formed by any one of a sandblasting method, a cutting and an etching method.
ブ法による切断工程であることを特徴とする請求項1に
記載の有機ELパネルの製造方法。3. The method according to claim 1, wherein the first and second cutting steps are cutting steps by a scribe method.
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|---|---|---|---|
| JP2000117193A JP3620706B2 (en) | 2000-04-13 | 2000-04-13 | Manufacturing method of organic EL panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000117193A JP3620706B2 (en) | 2000-04-13 | 2000-04-13 | Manufacturing method of organic EL panel |
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|---|---|
| JP2001297878A true JP2001297878A (en) | 2001-10-26 |
| JP3620706B2 JP3620706B2 (en) | 2005-02-16 |
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ID=18628547
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|---|---|---|---|
| JP2000117193A Expired - Fee Related JP3620706B2 (en) | 2000-04-13 | 2000-04-13 | Manufacturing method of organic EL panel |
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| Country | Link |
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