JP2001221529A - Cooling system and electronic apparatus - Google Patents
Cooling system and electronic apparatusInfo
- Publication number
- JP2001221529A JP2001221529A JP2000032091A JP2000032091A JP2001221529A JP 2001221529 A JP2001221529 A JP 2001221529A JP 2000032091 A JP2000032091 A JP 2000032091A JP 2000032091 A JP2000032091 A JP 2000032091A JP 2001221529 A JP2001221529 A JP 2001221529A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- cylinder
- cylinders
- hydrogen
- slide member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 52
- 239000001257 hydrogen Substances 0.000 claims abstract description 44
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 44
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 40
- 230000001172 regenerating effect Effects 0.000 claims abstract description 5
- 239000007789 gas Substances 0.000 claims description 6
- 238000010248 power generation Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 description 13
- 239000000956 alloy Substances 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000008929 regeneration Effects 0.000 description 5
- 238000011069 regeneration method Methods 0.000 description 5
- 150000002431 hydrogen Chemical class 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Sorption Type Refrigeration Machines (AREA)
- Power Sources (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、例えばパーソナル
コンピュータ装置に内蔵されたマイクロプロセッサのよ
うな部材の冷却に適用して好適な冷却装置と、この冷却
装置を備えた電子機器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device suitable for cooling a member such as a microprocessor incorporated in, for example, a personal computer, and an electronic apparatus provided with the cooling device.
【0002】[0002]
【従来の技術】従来、パーソナルコンピュータ装置等が
備えるマイクロプロセッサは、動作中の発熱量が大き
く、一般には何らかの冷却装置を取付けるようにしてあ
る。例えば、モータにより回転するファンをマイクロプ
ロセッサの近傍に配置して、そのファンの回転で、マイ
クロプロセッサの近傍の空気を、コンピュータ装置の外
部に排出させて、マイクロプロセッサを冷却させる構成
としたものがある。2. Description of the Related Art Conventionally, a microprocessor included in a personal computer device or the like generates a large amount of heat during operation, and is generally provided with some type of cooling device. For example, there is a configuration in which a fan rotated by a motor is arranged near a microprocessor, and the rotation of the fan discharges air near the microprocessor to the outside of the computer device to cool the microprocessor. is there.
【0003】[0003]
【発明が解決しようとする課題】ところが、このような
ファンを使用した冷却装置は、ファンを回転させるのに
電力が必要であり、コンピュータ装置の消費電力を増大
させてしまう問題がある。また、ある程度の冷却効果を
得るためには、比較的大型のファンが必要であり、ファ
ンの回転に伴ってある程度の騒音が発生する問題があ
る。さらに、マイクロプロセッサを冷却した空気を、装
置の外部に排出させる必要があり、その排出される空気
の熱で、コンピュータ装置が設置された部屋の温度を上
昇させてしまう問題がある。However, a cooling device using such a fan requires electric power to rotate the fan, and has a problem that the power consumption of the computer device is increased. In addition, a relatively large fan is required to obtain a certain cooling effect, and there is a problem that a certain amount of noise is generated as the fan rotates. Further, it is necessary to discharge the air having cooled the microprocessor to the outside of the device, and there is a problem that the heat of the discharged air raises the temperature of the room where the computer device is installed.
【0004】また、従来の冷却装置は、例えばモータな
どを使用してファンを強制的に回転させて空気流を発生
させる構成であるため、冷却動作中には、そのファンの
駆動などのために常時電力が必要である問題があった。Further, since the conventional cooling device has a configuration in which a fan is forcibly rotated by using, for example, a motor to generate an air flow, during cooling operation, the fan is required to drive the fan. There was a problem that constant power was required.
【0005】なお、ここではコンピュータ装置のマイク
ロプロセッサを例にして説明したが、その機器の動作中
に発熱する種々の電子機器に同様な問題が存在する。[0005] Although a microprocessor of a computer device has been described here as an example, various electronic devices that generate heat during operation of the device have similar problems.
【0006】本発明の目的は、電子機器が備える発熱部
を、少ない電力で効率良く冷却できるようにすることに
ある。SUMMARY OF THE INVENTION It is an object of the present invention to efficiently cool a heat generating portion provided in an electronic device with a small amount of power.
【0007】[0007]
【課題を解決するための手段】本発明の冷却装置は、所
定の発熱部からの熱が一端部に伝わり、他端部が放熱部
に近接した複数のシリンダと、複数のシリンダ内に配置
されて、一端部と他端部との間で自由に移動可能で、水
素吸蔵部材が取付けられたスライド部材と、各シリンダ
の一端部と別のシリンダの他端部とを導通可能に順に接
続し、その途中に熱再生手段を配置した複数の接続部材
とを備えたものである。According to the cooling device of the present invention, heat from a predetermined heat generating portion is transmitted to one end, and the other end is disposed in a plurality of cylinders close to the heat radiating portion and in the plurality of cylinders. And a slide member that is freely movable between one end and the other end, and on which a hydrogen storage member is attached, and one end of each cylinder and the other end of another cylinder are sequentially connected in a conductive manner. , A plurality of connecting members in which a heat regenerating means is arranged in the middle.
【0008】本発明の冷却装置によると、発熱部の発熱
により各シリンダ内の一端部側が加熱されることで、各
シリンダ内のスライド部材に取付けられた水素吸蔵部材
が加熱されて、その水素吸蔵部材が吸収して貯蔵してい
た水素が、シリンダ内の一端部側に放出される。この水
素の放出で、シリンダ内のスライド部材から一端部まで
の間の圧力が高くなり、その圧力でスライド部材が他端
側に押し出されて移動する。そして、スライド部材が他
端部側に移動すると、その他端部に近接した放熱部によ
る放熱で、スライド部材が冷却されて、シリンダ内の水
素を吸収するようになり、シリンダ内のスライド部材か
ら一端部までの間の圧力が低くなり、スライド部材が元
の位置に戻るように移動する。このスライド部材の往復
動が、冷却動作を行う限り繰り返される。According to the cooling device of the present invention, one end of each cylinder is heated by the heat generated by the heat generating portion, so that the hydrogen absorbing member attached to the slide member in each cylinder is heated, and the hydrogen absorbing member is heated. Hydrogen absorbed and stored by the member is released to one end of the cylinder. Due to this release of hydrogen, the pressure between the slide member in the cylinder and one end increases, and the slide member is pushed to the other end and moved by the pressure. When the slide member moves to the other end, the slide member is cooled by the heat radiation by the heat dissipating portion close to the other end, and absorbs hydrogen in the cylinder. The pressure between the parts decreases, and the slide member moves to return to the original position. This reciprocation of the slide member is repeated as long as the cooling operation is performed.
【0009】本発明の電子機器は、機器の作動により発
熱する発熱部材と、発熱部材からの熱が一端部に伝わる
複数のシリンダと、複数のシリンダの他端部に伝わる熱
を排出する放熱手段と、複数のシリンダ内に配置され
て、一端部と他端部との間で自由に移動可能で、水素吸
蔵部材が取付けられたスライド部材と、各シリンダの一
端部と別のシリンダの他端部とを導通可能に順に接続
し、その途中に熱再生手段を配置した複数の接続部材と
を備えたものである。The electronic device according to the present invention includes a heat generating member that generates heat by operation of the device, a plurality of cylinders transmitting heat from the heat generating member to one end, and a heat radiating means for discharging heat transmitted to the other end of the plurality of cylinders. And a slide member arranged in a plurality of cylinders, freely movable between one end and the other end, and having a hydrogen storage member attached thereto, and one end of each cylinder and the other end of another cylinder And a plurality of connecting members which are connected in order so as to be able to conduct, and a heat regenerating means is arranged on the way.
【0010】本発明の電子機器によると、機器が作動し
て発熱部材が発熱することで、各シリンダ内の一端部側
が加熱され、各シリンダ内のスライド部材に取付けられ
た水素吸蔵部材が加熱されて、その水素吸蔵部材が吸収
して貯蔵していた水素が、シリンダ内の一端部側に放出
される。この水素の放出で、シリンダ内のスライド部材
から一端部までの間の圧力が高くなり、その圧力でスラ
イド部材が他端側に押し出されて移動する。そして、ス
ライド部材が他端部側に移動すると、その他端部に近接
した放熱部による放熱で、スライド部材が冷却されて、
シリンダ内の水素を吸収するようになり、シリンダ内の
スライド部材から一端部までの間の圧力が低くなり、ス
ライド部材が元の位置に戻るように移動する。このスラ
イド部材の往復動が、冷却動作を行う限り繰り返され
る。According to the electronic apparatus of the present invention, when the apparatus is operated and the heat generating member generates heat, one end side in each cylinder is heated, and the hydrogen storage member attached to the slide member in each cylinder is heated. Thus, the hydrogen absorbed and stored by the hydrogen storage member is released to one end side in the cylinder. Due to this release of hydrogen, the pressure between the slide member in the cylinder and one end increases, and the slide member is pushed to the other end and moved by the pressure. Then, when the slide member moves to the other end, the slide member is cooled by heat radiation by the heat radiating portion near the other end,
Hydrogen in the cylinder is absorbed, the pressure between the slide member and one end in the cylinder decreases, and the slide member moves back to its original position. This reciprocation of the slide member is repeated as long as the cooling operation is performed.
【0011】[0011]
【発明の実施の形態】以下、本発明の一実施の形態を、
図1〜図4を参照して説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described.
This will be described with reference to FIGS.
【0012】本実施の形態においては、内部に発熱体を
備えた電子機器としたものである。即ち、例えば図4に
示すように、ここでは電子機器としていわゆるデスクト
ップ型のパーソナルコンピュータ装置1に適用した例と
してある。このパーソナルコンピュータ装置1は、本体
部2とディスプレイ部3とキーボード部4とで構成さ
れ、本体部2内の回路基板5の所定位置にマイクロプロ
セッサ6が配置してある。In the present embodiment, the electronic device is provided with a heating element inside. That is, as shown in FIG. 4, for example, an example in which the present invention is applied to a so-called desktop personal computer device 1 as an electronic device is shown. The personal computer device 1 includes a main body 2, a display 3, and a keyboard 4, and a microprocessor 6 is disposed at a predetermined position on a circuit board 5 in the main body 2.
【0013】マイクロプロセッサ6は、パーソナルコン
ピュータ装置1を作動させたとき、装置内で必要な演算
処理を実行する半導体素子の1つであり、作動中には比
較的高い温度に発熱する発熱体となる。ここで本例にお
いては、このマイクロプロセッサ6の周囲に冷却部10
及び放熱板7を配置して、マイクロプロセッサ6を冷却
する構成としてある。具体的には、例えばマイクロプロ
セッサ6の上に冷却部10を載せて、その冷却部10の
上に更に放熱板7を載せてある。放熱板7としては、例
えばアルミ板などの熱伝導性の高い金属部材を、空気と
広い面積で接触する形状としてある。そして本例の冷却
部10は、水素吸蔵合金の特性を利用して冷却動作を行
う機構としてある。The microprocessor 6 is one of semiconductor elements for executing necessary arithmetic processing in the personal computer 1 when the personal computer 1 is operated. The microprocessor 6 includes a heating element that generates heat at a relatively high temperature during operation. Become. Here, in this example, a cooling unit 10 is provided around the microprocessor 6.
The heat radiating plate 7 is arranged to cool the microprocessor 6. Specifically, for example, the cooling unit 10 is mounted on the microprocessor 6, and the radiator plate 7 is further mounted on the cooling unit 10. The heat radiating plate 7 has a shape in which a metal member having high thermal conductivity such as an aluminum plate is brought into contact with air over a wide area. And the cooling part 10 of this example is a mechanism which performs a cooling operation using the characteristic of a hydrogen storage alloy.
【0014】図1は、回路基板上のマイクロプロセッサ
6の上に配置された冷却部10を示す図である。本例の
冷却部10は、4つのシリンダ11,12,13,14
で構成される。マイクロプロセッサ6の上には、この4
つのシリンダ11,12,13,14が四角形に並べ
て、直立させて配置してある。なお、以下の説明では各
シリンダ11〜14のマイクロプロセッサ6側の端部を
一端部と称し、反対側の端部(放熱板7が配置された
側)を他端部と称する。FIG. 1 is a diagram showing a cooling unit 10 arranged on a microprocessor 6 on a circuit board. The cooling unit 10 of the present example has four cylinders 11, 12, 13, 14
It consists of. On the microprocessor 6, this 4
The two cylinders 11, 12, 13, 14 are arranged in a square and arranged upright. In the following description, the end on the microprocessor 6 side of each of the cylinders 11 to 14 is referred to as one end, and the opposite end (the side on which the heat radiating plate 7 is disposed) is referred to as the other end.
【0015】各シリンダ11〜14の内部には、スライ
ダが一端部側と他端部側との間で自由に可動できる状態
で配置してある。このスライダについては後述する。そ
して、各シリンダ11〜14は、パイプ状の接続部3
1,33,35,37を介して相互に接続してある。即
ち、第1のシリンダ11の一端部は、接続部31を介し
て第2のシリンダ12の他端部に接続してあり、第2の
シリンダ12の一端部は、接続部33を介して第3のシ
リンダ13の他端部に接続してあり、第3のシリンダ1
3の一端部は、接続部35を介して第4のシリンダ14
の他端部に接続してあり、第4のシリンダ14の一端部
は、接続部37を介して第1のシリンダ11の他端部に
接続してある。各接続部31,33,35,37の途中
には、熱再生交換器32,34,36,38が配置して
ある。A slider is arranged inside each of the cylinders 11 to 14 so as to be freely movable between one end and the other end. This slider will be described later. Each of the cylinders 11 to 14 has a pipe-shaped connecting portion 3.
They are interconnected via 1, 33, 35, 37. That is, one end of the first cylinder 11 is connected to the other end of the second cylinder 12 via the connection part 31, and one end of the second cylinder 12 is connected to the other end via the connection part 33. The third cylinder 13 is connected to the other end of the third cylinder 13.
3 is connected to the fourth cylinder 14 via the connecting portion 35.
, And one end of the fourth cylinder 14 is connected to the other end of the first cylinder 11 via a connection portion 37. Heat regeneration exchangers 32, 34, 36, and 38 are arranged in the middle of each of the connection parts 31, 33, 35, and 37.
【0016】それぞれの熱再生交換器32,34,3
6,38は、接続されたパイプの一端側と他端側との間
で、熱の移動を少なくした状態で流体(気体)が自由に
移動できる状態にしたものである。熱再生交換器32,
34,36,38の具体的な構成としては、例えばメッ
シュ状の金属を内部に配置する構成にしたり、スポンジ
状の樹脂を充填する構成などがある。パイプの内部に充
填される流体の特性によって、適切な構成を選択すれば
良い。The respective heat regeneration exchangers 32, 34, 3
Reference numerals 6 and 38 denote a state in which a fluid (gas) can freely move between one end and the other end of the connected pipe while heat transfer is reduced. Heat regeneration exchanger 32,
Specific examples of the configuration of 34, 36, and 38 include, for example, a configuration in which a mesh-like metal is disposed inside, and a configuration in which a sponge-like resin is filled. An appropriate configuration may be selected depending on the characteristics of the fluid filled in the pipe.
【0017】図2は、4つのシリンダ11〜14の内部
を展開した状態で示した図である。第1のシリンダ11
の内部には、一端部11aと他端部11bとの間で自由
に移動可能なスライド部材であるスライダ21が配置し
てある。このスライダ21には、水素吸蔵合金部21a
が取付けてある。水素吸蔵合金部21aは、常温付近の
温度で気体中の水素を吸収し、加熱されるとその吸収し
た水素を気体中に放出する性質を持つ合金で構成され
る。具体的には、例えば水素を吸収する金属と活性化す
る金属との組み合わせからなり、水素分子は活性化され
た原子状となった金属格子のすき間にとらえられる。水
素吸蔵合金部21aが吸蔵できる水素の量は、温度によ
って異なる。この水素吸蔵合金は、種々の組成のものが
開発されていて、例えばニッケル合金が知られている。FIG. 2 is a diagram showing the inside of the four cylinders 11 to 14 in a developed state. First cylinder 11
A slider 21, which is a slide member that can freely move between one end 11a and the other end 11b, is disposed inside the slider. The slider 21 has a hydrogen storage alloy portion 21a
Is installed. The hydrogen storage alloy portion 21a is made of an alloy having a property of absorbing hydrogen in a gas at a temperature near normal temperature and releasing the absorbed hydrogen into the gas when heated. Specifically, for example, it is composed of a combination of a metal that absorbs hydrogen and a metal that activates, and hydrogen molecules are captured in the gaps of the activated metal lattice. The amount of hydrogen that the hydrogen storage alloy portion 21a can store depends on the temperature. Various compositions of this hydrogen storage alloy have been developed, and for example, nickel alloys are known.
【0018】図3は、スライダ21の形状の例を示した
ものである。円筒形のシリンダ11内に配置される円盤
状のスライダ21は、ニッケル等の金属で形成された格
子状の枠部材21bに、粒子状の水素吸蔵合金21aを
保持させるようにしてある。その粒子状の水素吸蔵合金
21aを保持させる具体的な機構については示さない
が、シリンダ内の気体と効率良く接触できるように保持
させるのが好ましい。FIG. 3 shows an example of the shape of the slider 21. The disk-shaped slider 21 disposed in the cylindrical cylinder 11 is configured to hold a particulate hydrogen storage alloy 21a on a lattice-shaped frame member 21b formed of a metal such as nickel. Although a specific mechanism for holding the particulate hydrogen storage alloy 21a is not shown, it is preferable to hold the hydrogen storage alloy 21a so that it can efficiently contact the gas in the cylinder.
【0019】第2,第3,第4のシリンダ12,13,
14についても、同様の形状のスライダ22,23,2
4が一端部と他端部との間で自由に移動可能に配置して
あり、それぞれのスライダ22,23,24に水素吸蔵
合金部22a,23a,24aが取付けてある。The second, third, and fourth cylinders 12, 13,
14, the sliders 22, 23, 2 having the same shape
A slider 4 is disposed so as to be freely movable between one end and the other end, and hydrogen storage alloy portions 22a, 23a, 24a are attached to the respective sliders 22, 23, 24.
【0020】各スライダ21〜24は、各シリンダ内で
一端部11a,12a,13a,14a側に移動したと
き、その一端部でシリンダを蓋する部材の突起部11
d,12d,13d,14dと接触するようにしてあ
り、他端部11b,12b,13b,14b側に移動し
たときにも、その他端部でシリンダを蓋する部材の突起
部11e,12e,13e,14eと接触するようにし
てある。このように接触することで、スライダが一端部
に接触している状態では、外部(本例の場合にはマイク
ロプロセッサ6)からシリンダの一端部11a,12
a,13a,14aに伝わる熱が、スライダに迅速に伝
わる。また、スライダが他端部に接触している状態で
は、その他端部の近傍に配置された放熱板7に、スライ
ダが持つ熱を迅速に伝えて放熱させることができる。図
2では、第1のシリンダ11内ではスライダ21を一端
部11aの突起11dと接触した位置で示してあり、第
3のシリンダ13内ではスライダ23を他端部13bの
突起13dと接触した位置で示してあり、第2,第4の
シリンダ12,14内ではスライダ22,24を中間の
位置で示してある。When each of the sliders 21 to 24 is moved to the one end 11a, 12a, 13a, 14a side in each cylinder, the protrusion 11 of the member that covers the cylinder at one end thereof.
d, 12d, 13d, and 14d, and when they move to the other ends 11b, 12b, 13b, and 14b, the protrusions 11e, 12e, and 13e of the member that covers the cylinder at the other end. , 14e. With such contact, when the slider is in contact with one end, the one end 11a, 12a of the cylinder is externally (in this case, the microprocessor 6).
The heat transmitted to a, 13a, and 14a is quickly transmitted to the slider. When the slider is in contact with the other end, the heat of the slider can be quickly transmitted to the heat radiating plate 7 arranged near the other end to radiate the heat. In FIG. 2, the slider 21 is shown in a position where the slider 21 is in contact with the protrusion 11 d of the one end 11 a in the first cylinder 11, and the slider 23 is in contact with the protrusion 13 d of the other end 13 b in the third cylinder 13. In the second and fourth cylinders 12, 14, the sliders 22, 24 are shown at intermediate positions.
【0021】また本例の各スライダ21〜24の外周部
の一部には着磁させた部分を形成させてあり、スライダ
がシリンダ内で移動する際に、その着磁させた部分がシ
リンダの内壁と接触する部分には、図2に示すように、
コイル11c,12c,13c,14cが配置してあ
る。そして、スライダが移動した際の磁場変化でコイル
11c,12c,13c,14cに得られる電圧信号
を、本例の機器が備える電源回路(図示せず)が取り出
せるようにしてある。Further, a magnetized portion is formed on a part of the outer peripheral portion of each of the sliders 21 to 24 of the present embodiment. When the slider moves in the cylinder, the magnetized portion is formed on the cylinder. As shown in FIG. 2,
The coils 11c, 12c, 13c, 14c are arranged. Then, a power supply circuit (not shown) included in the device of the present embodiment can extract a voltage signal obtained in the coils 11c, 12c, 13c, and 14c by a magnetic field change when the slider moves.
【0022】次に、このように構成される冷却部10の
冷却動作を、図2を参照して説明する。ここでは、各シ
リンダ内のスライダ21〜24と一端部11a〜14a
との間の空間の圧力をPhとし、スライダ21〜24と
他端部11b〜14bとの間の空間の圧力をPcとす
る。Next, the cooling operation of the cooling unit 10 thus configured will be described with reference to FIG. Here, the sliders 21 to 24 in each cylinder and one end portions 11a to 14a
And the pressure in the space between the sliders 21 to 24 and the other ends 11b to 14b is Pc.
【0023】まず、この冷却部10の下側(但し位置関
係によっては必ずしも下側とは限らない)に位置するマ
イクロプロセッサ6が発熱することで、各シリンダ11
〜14の一端部11a〜14aが加熱されて、シリンダ
内のスライダ21〜24についても加熱される。このス
ライダ21〜24が加熱されることで、各スライダ21
〜24に取付けられた水素吸蔵合金部21a,22a,
23a,24aが吸蔵した水素が、各シリンダ内の一端
部寄りの空間に放出される。First, the microprocessor 6 located below the cooling unit 10 (although not necessarily lower depending on the positional relationship) generates heat, so that each cylinder 11
Are heated, and the sliders 21 to 24 in the cylinder are also heated. When the sliders 21 to 24 are heated, each slider 21
To hydrogen storage alloy parts 21a, 22a,
The hydrogen occluded by 23a and 24a is released to a space near one end in each cylinder.
【0024】このようにシリンダ内で水素が放出される
ことで、各スライダ21〜24と一端部11a〜14a
との間のシリンダ内の圧力Phが、シリンダの反対側の
圧力Pcよりも高くなる。これにより各スライダ21〜
24は他端部11b〜14b側に押し出されるように移
動する。そして、この移動により各スライダ21〜24
が他端部11b〜14b側の突起11e〜14eと接触
する状態になることで、各スライダ21〜24が持つ熱
が他端部11b〜14bに接続された放熱板7に奪われ
て、各スライダ21〜24の温度が低下する。By releasing hydrogen in the cylinder in this way, each slider 21 to 24 and one end 11a to 14a
Is higher than the pressure Pc on the opposite side of the cylinder. As a result, each of the sliders 21 to 21
24 moves so as to be pushed to the other end portions 11b to 14b. This movement causes each of the sliders 21 to 24 to move.
Is brought into contact with the protrusions 11e to 14e on the other end portions 11b to 14b side, the heat of the sliders 21 to 24 is taken by the radiator plate 7 connected to the other end portions 11b to 14b. The temperature of the sliders 21 to 24 decreases.
【0025】このスライダ21〜24の温度低下で、各
スライダ21〜24に取付けられた水素吸蔵合金部21
a,22a,23a,24aが水素を吸収し始め、各ス
ライダ21〜24と一端部11a〜14aとの間のシリ
ンダ内の圧力Phが低下し始める。ここで、スライダの
移動時に低温側(他端部側)の圧力Pcを高温側(一端
部側)の圧力Phと同じとしておくことで、今度は一端
部側の圧力Phが圧力Pcより低くなり、スライダ21
〜24を一端部11a〜14aに吸い寄せる力が発生
し、各スライダ21〜24か一端部11a〜14a側に
移動する。When the temperature of the sliders 21 to 24 drops, the hydrogen storage alloy portions 21 attached to the sliders 21 to 24
a, 22a, 23a, and 24a start absorbing hydrogen, and the pressure Ph in the cylinder between each of the sliders 21 to 24 and the one end 11a to 14a starts to decrease. Here, by setting the pressure Pc on the low temperature side (the other end side) to be the same as the pressure Ph on the high temperature side (the one end side) when the slider is moved, the pressure Ph on the one end side becomes lower than the pressure Pc. , Slider 21
-24 are attracted to the one ends 11a-14a, and the sliders 21-24 move to the one ends 11a-14a.
【0026】ここまでが各シリンダ内のスライダの1サ
イクルの動きであり、マイクロプロセッサ6が発熱し続
ける限り、この往復動を繰り返し、マイクロプロセッサ
6が持つ熱が放熱板7から外部に放熱される。ここで、
各シリンダ内は、熱再生交換器32,34,36,38
が取付けられた接続部31,33,35,37で相互に
接続されていることで、1つのシリンダ内での圧力上昇
と隣のシリンダ内での圧力低下とが連動するようにな
り、4つのシリンダ11〜14内でのスライダ21〜2
4の動きが所定の位相差を持って行われるようになり、
良好に各スライダ21〜24が往復動を行うようにな
る。特に本例のように4つのシリンダを持った構成とす
ることで、スライダの1往復の動作を360度とする
と、1つ毎に90度の位相差を持って作動することにな
り、図2に示したような各スライダの位置関係となって
作動し、良好に作動する。This is the movement of the slider in each cylinder in one cycle. This reciprocation is repeated as long as the microprocessor 6 continues to generate heat, and the heat of the microprocessor 6 is radiated to the outside from the radiator plate 7. . here,
Inside each cylinder, heat regeneration exchangers 32, 34, 36, 38
Are connected to each other by the connection portions 31, 33, 35, and 37 to which the pressure rises in one cylinder and the pressure drop in the next cylinder interlock. Sliders 21 to 2 in cylinders 11 to 14
4 is performed with a predetermined phase difference,
The sliders 21 to 24 can reciprocate satisfactorily. In particular, by adopting a configuration having four cylinders as in this example, if one reciprocating operation of the slider is 360 degrees, each slider operates with a phase difference of 90 degrees. It operates with the positional relationship of each slider as shown in FIG.
【0027】このように本例の電子機器(パーソナルコ
ンピュータ装置1)に取付けられた冷却部10による
と、内部の発熱体(マイクロプロセッサ)が発する熱を
機器の外部に排出して、冷却を行うことができる。特
に、本例のようなパーソナルコンピュータ装置のマイク
ロプロセッサのように、発熱部が特定の1箇所(又は数
カ所)に集中している場合に効率の良い冷却ができ、こ
の種の小型の電子機器に好適である。また、冷却時の作
動音としては、密閉された空間である冷却部内でスライ
ダが往復をする音だけであり、ファン装置などで冷却を
行う場合に比べて非常に静かである。As described above, according to the cooling unit 10 attached to the electronic apparatus (personal computer apparatus 1) of the present embodiment, the heat generated by the internal heating element (microprocessor) is discharged to the outside of the apparatus to perform cooling. be able to. In particular, when the heat-generating portion is concentrated at a specific one place (or several places), such as a microprocessor of a personal computer device as in this example, efficient cooling can be performed, and this kind of small-sized electronic equipment can be used. It is suitable. Further, the only operation sound during cooling is the sound of the slider reciprocating in the cooling section, which is a closed space, and is much quieter than when cooling is performed by a fan device or the like.
【0028】そして本例においては、各シリンダ11〜
14内でのスライダ21〜24の動きに伴って、コイル
11c〜14cで発生する電圧信号を電力として取り出
すことで、冷却動作に伴った発電を行うようになり、機
器の作動に伴う熱で電力を得ることが可能になる。この
場合、得られた電力は、例えば電源回路に接続された二
次電池に充電させたり、或いはコンピュータ装置1を作
動させる電力として直接使用することが考えられる。こ
のように発電された電力を有効に活用することで、結果
的に機器の消費電力を低減させることができる効果を有
する。In this embodiment, each of the cylinders 11 to 11
The voltage signals generated in the coils 11c to 14c are taken out as electric power in accordance with the movement of the sliders 21 to 24 in the motor 14, so that the electric power is generated in accordance with the cooling operation. Can be obtained. In this case, it is conceivable that the obtained power is used to charge a secondary battery connected to a power supply circuit, for example, or is used directly as power for operating the computer device 1. By effectively utilizing the power thus generated, there is an effect that the power consumption of the device can be reduced as a result.
【0029】なお上述した実施の形態では、冷却部を構
成するシリンダとして、4本のシリンダを配置して相互
に接続させる構成としたが、同様の冷却動作で作動可能
であれば、他の本数のシリンダで構成させても良い。ま
た、スライダの往復動から電力を取り出す手段として、
上述した実施の形態ではシリンダに取付けたコイルを使
用したが、他の手段を使用しても良い。例えば、スライ
ダの往復動から、何らかのリンク機構等を使用して回転
力を得るようにして、その回転力で発電機を駆動するよ
うにしても良い。In the above-described embodiment, four cylinders are arranged and connected to each other as the cylinders constituting the cooling unit. However, if the same cooling operation is possible, other cylinders may be used. May be constituted by the cylinder. Also, as means for extracting electric power from the reciprocating movement of the slider,
In the above embodiment, the coil attached to the cylinder is used, but other means may be used. For example, from a reciprocating motion of the slider, a torque may be obtained by using some kind of link mechanism or the like, and the generator may be driven by the torque.
【0030】また上述した実施の形態では、機器の内部
に本例の冷却部だけを冷却機構として配置したが、他の
冷却用の機構と組み合わせるようにしても良い。例え
ば、冷却用のファンで装置の内部全体を冷却させなが
ら、本例の冷却部で特に発熱温度の高い部分を集中的に
冷却させても良い。この場合のファンを駆動させる電源
として、冷却部で発生した電力を使用しても良い。In the above-described embodiment, only the cooling section of the present embodiment is arranged as a cooling mechanism inside the device, but it may be combined with another cooling mechanism. For example, while cooling the entire inside of the apparatus with a cooling fan, the cooling section of the present embodiment may intensively cool a portion having a particularly high heat generation temperature. In this case, the power generated by the cooling unit may be used as a power supply for driving the fan.
【0031】さらに上述した実施の形態では、デスクト
ップ型のパーソナルコンピュータ装置内のマイクロプロ
セッサの冷却装置とした例を説明したが、ノート型など
の携帯用のパーソナルコンピュータ装置などの他の形状
のコンピュータ装置用の冷却装置としても良く、或いは
機器内の特定箇所が特に高温に発熱する機器であれば、
コンピュータ装置以外のその他の各種電子機器における
冷却装置としても使用できることは勿論である。Further, in the above-described embodiment, an example has been described in which a cooling device for a microprocessor in a desktop personal computer device is used. However, a computer device of another shape such as a portable personal computer device such as a notebook computer is described. If it is a device that generates heat at a particular location in the device,
Of course, it can also be used as a cooling device in various other electronic devices other than the computer device.
【0032】[0032]
【発明の効果】本発明の冷却装置によると、シリンダ内
のスライド部材の加熱と冷却で、そのスライド部材に取
付けられた水素吸蔵部材からの水素の放出と吸収が繰り
返され、シリンダ内の圧力上昇と低下が繰り返され、ス
ライド部材がシリンダ内で往復動を繰り返すようにな
り、そのスライド部材のシリンダ内での往復動で、発熱
部を効率良く冷却することができる。According to the cooling device of the present invention, the heating and cooling of the slide member in the cylinder repeatedly releases and absorbs hydrogen from the hydrogen storage member attached to the slide member, thereby increasing the pressure in the cylinder. The slide member repeats the reciprocating motion in the cylinder, and the heat generating portion can be efficiently cooled by the reciprocating motion of the slide member in the cylinder.
【0033】この場合、スライド部材の往復動に伴って
電力を得る発電手段を備えたことで、発熱部を熱源とし
た発電装置として機能するようになる。In this case, by providing the power generating means for obtaining the electric power with the reciprocating movement of the slide member, the device functions as a power generating device using the heat generating portion as a heat source.
【0034】また本発明の電子機器によると、シリンダ
内のスライド部材の加熱と冷却で、そのスライド部材に
取付けられた水素吸蔵部材からの水素の放出と吸収が繰
り返され、シリンダ内の圧力上昇と低下が繰り返され、
スライド部材がシリンダ内で往復動を繰り返すようにな
り、そのスライド部材のシリンダ内での往復動で、機器
内の発熱部材を効率良く冷却することができる。Further, according to the electronic apparatus of the present invention, the heating and cooling of the slide member in the cylinder repeatedly releases and absorbs hydrogen from the hydrogen storage member attached to the slide member, thereby increasing the pressure in the cylinder and increasing the pressure. The decline is repeated,
The slide member repeats reciprocating motion in the cylinder, and the heat generating member in the device can be efficiently cooled by the reciprocating motion of the slide member in the cylinder.
【0035】この場合、スライド部材の往復動に伴って
電力を得る発電手段を備えたことで、機器の動作に伴う
発熱で発電を行うことができ、得られた電力を機器の動
作用電源の一部としたり、機器が内蔵する二次電池を充
電させる等することで、機器の動作に伴って発生する熱
を電力として変換して有効に活用することが可能にな
る。In this case, by providing the power generation means for obtaining electric power with the reciprocating movement of the slide member, it is possible to generate electric power by the heat generated by the operation of the equipment, and to use the obtained electric power as the power supply for operating the equipment. By making it a part or by charging a secondary battery incorporated in the device, it becomes possible to convert heat generated due to the operation of the device into electric power and use it effectively.
【図1】本発明の一実施の形態による冷却部の構成を示
す斜視図である。FIG. 1 is a perspective view illustrating a configuration of a cooling unit according to an embodiment of the present invention.
【図2】本発明の一実施の形態による冷却部の内部を展
開して示す断面図である。FIG. 2 is an exploded cross-sectional view showing the inside of a cooling unit according to the embodiment of the present invention.
【図3】本発明の一実施の形態によるスライダの例を示
す斜視図である。FIG. 3 is a perspective view showing an example of a slider according to one embodiment of the present invention.
【図4】本発明の一実施の形態による電子機器の例を一
部破断して示す斜視図である。FIG. 4 is a perspective view showing an example of an electronic apparatus according to an embodiment of the present invention, with a part thereof cut away.
1…パーソナルコンピュータ装置、5…回路基板、6…
マイクロプロセッサ、7…放熱板、10…冷却部、11
…第1のシリンダ、12…第2のシリンダ、13…第3
のシリンダ、14…第4のシリンダ、11c,12c,
13c,14c…コイル、21,22,23,24…ス
ライダ、21a,22a,23a,24a…水素吸蔵合
金部、31,33,35,37…接続部、32,34,
36,38…熱再生交換器1. Personal computer device, 5. Circuit board, 6.
Microprocessor, 7: heat sink, 10: cooling unit, 11
... first cylinder, 12 ... second cylinder, 13 ... third
, The fourth cylinder, 11c, 12c,
13c, 14c: coil, 21, 22, 23, 24: slider, 21a, 22a, 23a, 24a: hydrogen storage alloy part, 31, 33, 35, 37 ... connection part, 32, 34,
36, 38 ... heat regeneration exchanger
Claims (6)
り、他端部が放熱部に近接した複数のシリンダと、 上記複数のシリンダ内に配置されて、一端部と他端部と
の間で自由に移動可能で、水素吸蔵部材が取付けられた
スライド部材と、 上記各シリンダの一端部と別のシリンダの他端部とを導
通可能に順に接続し、その途中に熱再生手段を配置した
複数の接続部材とを備えた冷却装置。1. A method according to claim 1, wherein heat from a predetermined heat generating portion is transmitted to one end portion, and the other end portion is disposed in the plurality of cylinders adjacent to the heat radiating portion. Between the cylinder and the other end of another cylinder are connected in order to allow conduction, and a heat regenerating means is arranged in the middle of the slide member. A cooling device comprising: a plurality of connecting members;
発熱部からシリンダの一端部に伝わる熱で加熱されたと
き、吸蔵した水素を放出し、上記他端部でその伝わる熱
を放熱させたとき、気体中の水素を吸収する特性の部材
とした冷却装置。2. The cooling device according to claim 1, wherein the hydrogen storage member attached to the slide member releases the stored hydrogen when heated by heat transmitted from the heat generating portion to one end of the cylinder. A cooling device having a characteristic of absorbing hydrogen in a gas when the heat transmitted from the other end is radiated.
る発電手段を備えた冷却装置。3. The cooling device according to claim 1, further comprising: a power generation unit that obtains electric power with movement of the slide unit in the cylinder.
と、 上記複数のシリンダの他端部に伝わる熱を排出する放熱
手段と、 上記複数のシリンダ内に配置されて、一端部と他端部と
の間で自由に移動可能で、水素吸蔵部材が取付けられた
スライド部材と、 上記各シリンダの一端部と別のシリンダの他端部とを導
通可能に順に接続し、その途中に熱再生手段を配置した
複数の接続部材とを備えた電子機器。4. A heat generating member that generates heat by operation of an apparatus, a plurality of cylinders to which heat from the heat generating member is transmitted to one end, a radiator for discharging heat transferred to the other end of the plurality of cylinders, A slide member disposed in a plurality of cylinders, freely movable between one end and the other end, and having a hydrogen storage member attached thereto; one end of each of the cylinders and the other end of another cylinder An electronic device comprising: a plurality of connection members that are connected in a conductive manner in order and a heat regenerating unit is arranged in the middle of the connection.
発熱部からシリンダの一端部に伝わる熱で加熱されたと
き、吸蔵した水素を放出し、上記他端部でその伝わる熱
を放熱させたとき、気体中の水素を吸収する特性の部材
とした電子機器。5. The electronic device according to claim 4, wherein the hydrogen storage member attached to the slide member releases the stored hydrogen when heated by heat transmitted from the heat generating portion to one end of the cylinder. An electronic device which is a member having a characteristic of absorbing hydrogen in a gas when the transmitted heat is radiated at the other end.
る発電手段を備えた電子機器。6. The electronic device according to claim 4, further comprising: a power generation unit that obtains electric power with movement of the slide unit in the cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000032091A JP4345176B2 (en) | 2000-02-09 | 2000-02-09 | Cooling device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000032091A JP4345176B2 (en) | 2000-02-09 | 2000-02-09 | Cooling device and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001221529A true JP2001221529A (en) | 2001-08-17 |
| JP4345176B2 JP4345176B2 (en) | 2009-10-14 |
Family
ID=18556747
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000032091A Expired - Fee Related JP4345176B2 (en) | 2000-02-09 | 2000-02-09 | Cooling device and electronic equipment |
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| Country | Link |
|---|---|
| JP (1) | JP4345176B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7369409B2 (en) | 2003-12-15 | 2008-05-06 | Sony Computer Entertainment Inc. | Apparatus, method, and control program for cooling electronic devices |
| JP2017037890A (en) * | 2015-08-07 | 2017-02-16 | 株式会社フジクラ | Laser system and laser equipment cooling method |
-
2000
- 2000-02-09 JP JP2000032091A patent/JP4345176B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7369409B2 (en) | 2003-12-15 | 2008-05-06 | Sony Computer Entertainment Inc. | Apparatus, method, and control program for cooling electronic devices |
| JP2017037890A (en) * | 2015-08-07 | 2017-02-16 | 株式会社フジクラ | Laser system and laser equipment cooling method |
| WO2017026194A1 (en) * | 2015-08-07 | 2017-02-16 | 株式会社フジクラ | Laser system and method for cooling laser device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4345176B2 (en) | 2009-10-14 |
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