[go: up one dir, main page]

JP2001307559A - Wiring material and structure of its connection - Google Patents

Wiring material and structure of its connection

Info

Publication number
JP2001307559A
JP2001307559A JP2000118432A JP2000118432A JP2001307559A JP 2001307559 A JP2001307559 A JP 2001307559A JP 2000118432 A JP2000118432 A JP 2000118432A JP 2000118432 A JP2000118432 A JP 2000118432A JP 2001307559 A JP2001307559 A JP 2001307559A
Authority
JP
Japan
Prior art keywords
conductor
electric wire
resin
core wire
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2000118432A
Other languages
Japanese (ja)
Inventor
Norihiko Tamai
紀彦 玉井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2000118432A priority Critical patent/JP2001307559A/en
Priority to US09/824,169 priority patent/US20010035297A1/en
Publication of JP2001307559A publication Critical patent/JP2001307559A/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/0009Details relating to the conductive cores
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/0009Details relating to the conductive cores
    • H01B7/0018Strip or foil conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/08Flat or ribbon cables
    • H01B7/0838Parallel wires, sandwiched between two insulating layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/025Contact members formed by the conductors of a cable end
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/0455PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Conductors (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a new electrical wire and a flat cable whose conductive part is made of new material. SOLUTION: A core-wire of the electrical wire and a conductor of the flat cable are constituted with high-conductive resin. Also, at the tip of the core-wire of the electrical wire, a terminal is integrated.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、自動車用として好
適に用いられる電線およびフラットケーブルからなる配
線材に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring member comprising an electric wire and a flat cable which are suitably used for an automobile.

【0002】[0002]

【従来の技術】従来、図6(A)(B)に示すように、
電線1は、銅線からなる撚線あるいは単芯線を芯線1a
とし、該芯線1aを絶縁樹脂からなる絶縁被覆1bで被
覆した構成からなる。該電線同士の接続は、電線端末の
絶縁被覆1bを皮剥ぎして芯線1aを露出させ、該芯線
を端子金具2を圧着あるいは圧接で接続して、他の電線
端末に接続した端子金具とコネクタ接続で接続している
場合が多い。
2. Description of the Related Art Conventionally, as shown in FIGS.
The electric wire 1 is made of a stranded wire or a single core wire made of copper
And the core wire 1a is covered with an insulating coating 1b made of an insulating resin. The connection between the electric wires is performed by peeling the insulating coating 1b of the electric wire end to expose the core wire 1a, connecting the core wire by crimping or press-fitting the terminal metal fitting 2, and connecting the terminal metal to the other electric wire terminal with a connector. Often connected by a connection.

【0003】また、図7に示すフラットケーブル5で
は、銅箔からなる導体5aを細帯状に切断し、これを一
定間隔をあけて平行配置し、その両面を絶縁樹脂フィル
ム5b、5cでラミネートしている。このフラットケー
ブル5はプリント基板の導体と接続する場合は、基板上
に固定したコネクタを用いて接続されている場合が多
い。図6に示す電線1をプリント基板の導体と接続する
場合も、基板上に搭載したコネクタを介して接続されて
いる場合が多い。
In a flat cable 5 shown in FIG. 7, a conductor 5a made of copper foil is cut into a narrow band, and these are arranged in parallel at regular intervals, and both surfaces thereof are laminated with insulating resin films 5b and 5c. ing. When this flat cable 5 is connected to a conductor on a printed board, it is often connected using a connector fixed on the board. When the electric wire 1 shown in FIG. 6 is connected to a conductor of a printed circuit board, it is often connected via a connector mounted on the circuit board.

【0004】[0004]

【発明が解決しようとする課題】上記のように、電線を
他の電線またはECU等の他の機器に接続する場合に
は、端子金具を必要とし、かつ、該端子金具との接続の
為に電線の皮剥工程および端子金具の圧着あるいは圧接
工程が必要となり、部品点数が増加すると共に、作業工
数が増加しコスト高となる問題がある。
As described above, when connecting an electric wire to another electric wire or another device such as an ECU, a terminal fitting is required, and the connection with the terminal fitting is required. A wire stripping step and a crimping or press-fitting step of the terminal fittings are required, resulting in an increase in the number of parts, an increase in the number of work steps, and an increase in cost.

【0005】また、プリント基板にフラットケーブルや
電線を接続する場合にはコネクタを必要とし、この場合
も部品点数が増加すると共に、作業工数が増加しコスト
高となる問題がある。
Further, when a flat cable or an electric wire is connected to a printed circuit board, a connector is required. In this case as well, the number of parts increases, the number of work steps increases, and the cost increases.

【0006】また、電線またはフラットハーネスを廃棄
処分する際、導体が金属材料、絶縁被覆材が樹脂材料
で、異種材料より構成されるため、分別工程を必要と
し、リサイクル性の点で問題がある。
Further, when the electric wire or the flat harness is disposed of, the conductor is made of a metal material and the insulating coating material is made of a resin material. .

【0007】本発明は上記問題を鑑みてなされたもの
で、導体と絶縁被覆を同一素材から形成することにより
電線やフラットケーブルの製造コストを低下させると共
に廃棄時の分別作業を不要としてリサイクル性に富ま
せ、かつ、他の電気部品との接続時には、必要部品点数
の削減と作業工数を低減を図ることを課題としている。
[0007] The present invention has been made in view of the above problems, and by forming the conductor and the insulating coating from the same material, it is possible to reduce the manufacturing cost of electric wires and flat cables and to eliminate the need for sorting work at the time of disposal, thereby improving recyclability. It is an object of the present invention to reduce the number of necessary parts and reduce the number of work steps when enriching and connecting to other electric parts.

【0008】[0008]

【課題を解決するための手段】上記課題を解決するた
め、本発明は、高導電性樹脂からなる丸棒状の芯線の外
周を、絶縁性樹脂からなる絶縁被覆部で被覆している電
線からなる配線材を提供している。
In order to solve the above-mentioned problems, the present invention comprises an electric wire in which the outer periphery of a round rod-shaped core wire made of a highly conductive resin is covered with an insulating coating made of an insulating resin. We provide wiring materials.

【0009】上記芯線の端末を絶縁被覆部から突出さ
せ、その先端に端子部を一体的に成形している。該端子
部は芯線を偏平化してタブ形状のオス端子部としてもよ
いし、円環形状としてアース接続用の丸端子としてもよ
い。
The terminal of the core wire is projected from the insulating coating portion, and the terminal portion is integrally formed at the end. The terminal portion may be a tab-shaped male terminal portion by flattening the core wire, or may be a circular terminal for earth connection as an annular shape.

【0010】上記芯線の端末にタブを形成する場合は、
絶縁被覆を皮剥ぎして芯線を露出させ、該芯線をプレス
あるいは加熱成形でタブ形状としている。あるいは、高
導電性樹脂で芯線を成形する時に予め芯線端末にタブを
成形しておいてもよいし、丸端子部やメス端子部を成形
しておいてもよい。
When forming a tab at the end of the core wire,
The insulating coating is peeled to expose the core wire, and the core wire is formed into a tab shape by press or heat molding. Alternatively, when forming the core wire with a highly conductive resin, a tab may be formed in advance at the core wire terminal, or a round terminal portion or a female terminal portion may be formed.

【0011】このように、電線の芯線端末に端子部を設
けておくと、他の電線あるいは他の電気部品と接続する
とき、該電線の芯線端末に端子部を一体に成形している
ため、端子金具を接続する必要がなくなり、部品点数の
削減を図れると共に端子金具の接続作業を無くすことが
できる。
As described above, when the terminal portion is provided at the core end of the electric wire, the terminal portion is integrally formed with the core end of the electric wire when the terminal portion is connected to another electric wire or another electric component. It is not necessary to connect the terminal fittings, so that the number of parts can be reduced and the connection work of the terminal fittings can be eliminated.

【0012】また、本発明は、高導電性樹脂かならなる
帯状の導体を所定の間隔をあけて平行配列し、絶縁フィ
ルムを両面に被せてラミネートしているフラットケーブ
ルからなる配線材を提供している。
Further, the present invention provides a wiring member comprising a flat cable in which strip-shaped conductors made of a highly conductive resin are arranged in parallel at predetermined intervals, and insulating films are covered on both sides and laminated. ing.

【0013】上記電線またはフラットハーネスに使用す
る高導電性樹脂は、特開平10−237331号、特開
平11−342522号に開示されている、熱可塑性樹
脂中で、銅、ニッケル、鉄等からなる金属繊維を混入さ
せたものと、鉛フリーハンダ(低融点半田)とCu粉等
の低融点合金を分散させた導電性樹脂組成物からなる。
The highly conductive resin used for the electric wire or the flat harness is made of a thermoplastic resin disclosed in JP-A-10-237331 and JP-A-11-342522 and is made of copper, nickel, iron or the like. It is made of a conductive resin composition in which metal fibers are mixed, a lead-free solder (low-melting solder) and a low-melting alloy such as Cu powder dispersed therein.

【0014】導電性の金属繊維が配合される熱可塑性樹
脂としては、プロピレン、ポリエチレン、ポリスチレ
ン、アクリロニトリル・ブタジエン・スチレン樹脂、変
性ポリフェニレンオキサイド樹脂、ポリブチレンテレフ
タレート樹脂、ポリエチレンテレフタレート樹脂、ポリ
アミド樹脂、芳香族ポリアミド樹脂、ポリフェニレンサ
ルファイド樹脂、液晶ポリマー、ポリエーテルイミド、
ポリベンゾイミダゾール、ポリエーテルエーテルケト
ン、ポリエーテルサルフォン等の樹脂を単独あるいはブ
レンドして用いることが可能であり、特にアクリロニト
リル・ブタジエン・スチレン樹脂、ポリブチレンテレフ
タレート樹脂が好適に用いられる。
The thermoplastic resin to which conductive metal fibers are blended includes propylene, polyethylene, polystyrene, acrylonitrile / butadiene / styrene resin, modified polyphenylene oxide resin, polybutylene terephthalate resin, polyethylene terephthalate resin, polyamide resin, aromatic resin Polyamide resin, polyphenylene sulfide resin, liquid crystal polymer, polyetherimide,
Resins such as polybenzimidazole, polyetheretherketone, and polyethersulfone can be used alone or as a blend, and acrylonitrile-butadiene-styrene resin and polybutylene terephthalate resin are particularly preferably used.

【0015】上記熱可塑性樹脂に混合して分散させると
共にネットワーク状に接合させる低融点合金は、融点が
100℃以上、好ましくは200℃以上で、射出成形時
に溶融する合金を使用され、Sn−Pb系、Sn−Ag
−Pb系、Sn−Bi系、Sn−Bi−In系、Bi−
Pb系、Bi−Sn系、Sn−Cu系、Sn−Cu−N
i−P系、Sn−Ag系、Sn−Bi−Pb系、Sn−
In系のものが挙げられる。
The low melting point alloy to be mixed and dispersed in the thermoplastic resin and bonded in a network is an alloy having a melting point of 100 ° C. or higher, preferably 200 ° C. or higher and melting at the time of injection molding. System, Sn-Ag
-Pb system, Sn-Bi system, Sn-Bi-In system, Bi-
Pb-based, Bi-Sn-based, Sn-Cu-based, Sn-Cu-N
i-P system, Sn-Ag system, Sn-Bi-Pb system, Sn-
In-based materials may be mentioned.

【0016】上記高導電性樹脂を導体とする電線は、金
型による1回目の射出成形(1色目)で高導電性樹脂で
芯線を成形し、該芯線を引き抜きながら其の外周に絶縁
樹脂を被覆して絶縁被覆を形成する2工程で製造してい
る。フラットケーブルも、高導電性樹脂を成形して細帯
状の導体を成形し、該導体を平行に引き抜きながら、そ
の両面に絶縁フィルムをラミネートして製造している。
The above-mentioned electric wire having a highly conductive resin as a conductor is formed by molding a core wire with a highly conductive resin in a first injection molding (first color) using a mold, and then pulling out the core wire and applying an insulating resin to an outer periphery thereof. It is manufactured in two steps of coating and forming an insulating coating. Flat cables are also manufactured by molding a highly conductive resin to form a strip-shaped conductor, and pulling out the conductor in parallel while laminating insulating films on both surfaces thereof.

【0017】上記した電線あるいはフラットケーブルを
プリント基板の導体と接続する時は、電線の芯線あるい
はフラットケーブルの導体を、プリント基板の導体およ
び基板に連通させて穿設した貫通穴に載置し、加熱によ
り貫通穴に高導電性樹脂を溶融して充填することにより
接続している。よって、プリント基板の導体と電線ある
はフラットケーブルとを接続するときに必要としていた
コネクタを不要とすることができる。このため、接続部
品を削除できるとともに、接続に必要とされる作業工数
も削除できるため、製品完成までのコストを大幅に削減
するこができる。
When the above-mentioned electric wire or flat cable is connected to the conductor of the printed circuit board, the core wire of the electric wire or the conductor of the flat cable is placed in a through hole formed so as to communicate with the conductor of the printed circuit board and the substrate. The connection is established by heating and filling the through hole with a highly conductive resin. Therefore, the connector required when connecting the conductor of the printed circuit board and the electric wire or the flat cable can be eliminated. For this reason, the connection parts can be eliminated and the number of work steps required for the connection can be eliminated, so that the cost until the product is completed can be greatly reduced.

【0018】また、電線の芯線あるいはフラットケーブ
ルの導体を高導電性樹脂で成形すると、絶縁性樹脂から
なる絶縁被覆と同種材料となり、廃棄処分時に分別工程
がなくなり、リサイクル性を高めることができる。
Further, when the core of the electric wire or the conductor of the flat cable is molded with a highly conductive resin, the same material as the insulating coating made of the insulating resin is used, so that there is no sorting step at the time of disposal and the recyclability can be improved.

【0019】[0019]

【発明の実施の形態】以下、本発明の実施形態を図面を
参照して説明する。図1乃至図3は第1実施形態の電線
10からなる配線材を示す。該電線10は高導電性樹脂
より芯線11を形成し、絶縁性樹脂からなる絶縁被覆部
12で被覆して構成としている。
Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show a wiring member made of the electric wire 10 of the first embodiment. The electric wire 10 has a configuration in which a core wire 11 is formed from a highly conductive resin and is covered with an insulating coating portion 12 made of an insulating resin.

【0020】図2(A)(B)は上記電線10の端末に
オス端子部のタブ11aを芯線11に一体に成形したも
のである。該タブ11aは、図2(A)に示すように電
線10の端末の絶縁被覆部12を皮剥ぎして芯線11を
露出させ、該露出した芯線11を加熱しながらプレスす
ることにより、芯線11を偏平状に変形させ、図2
(B)に示すように、絶縁被覆12より突出させた芯線
11自体にオス端子部となるタブ11aを形成してい
る。かつ、必要に応じて、該タブ11aの一部に係止穴
11bを打ち抜き加工で穿設している。なお、電線10
が定尺の場合には、予め芯線成形段階で、両端にタブ1
1aおよび係止穴11bを成形しておき、該芯線11に
対して絶縁被覆12を両端のタブ11aを除いて被覆し
てもよい。
FIGS. 2A and 2B show the terminal of the electric wire 10 and the tab 11a of the male terminal portion formed integrally with the core wire 11. FIG. As shown in FIG. 2 (A), the tab 11a is peeled off at the end of the electric wire 10 to expose the core wire 11 and is pressed while heating the exposed core wire 11 so that the core wire 11 is pressed. Is deformed into a flat shape, and FIG.
As shown in (B), a tab 11a serving as a male terminal portion is formed on the core wire 11 protruding from the insulating coating 12. Further, if necessary, a locking hole 11b is formed in a part of the tab 11a by punching. The electric wire 10
When is a fixed size, tabs 1
Alternatively, the core wire 11 may be covered with the insulating coating 12 except for the tabs 11a at both ends.

【0021】上記電線10を他の従来の電線と接続する
場合には、相手方電線の端末に接続してメス端子部に挿
入係止して接続することができる。また、図3(A)に
示すように、複数の電線10の端末のタブ11aを重ね
合わせて加熱し、互いに溶着させて端末集中スプライス
を形成することができる。さらに、図3(B)に示すよ
うに、プリント基板20と電線10とを接続する場合、
基板20および導体21に連通して設けた貫通穴20
a、21a上に電線10のタブ11aを重ね、この状態
で加熱することによりタブ11aを溶融して、貫通穴2
0a、21aに充填してリベット状として接続する。さ
らに、図3(C)に示すように、芯線11の先端に丸端
子11cを予め成形している場合には、アース端子とし
て用い、車体25にボルト26で締め付け固定する。
When the above-mentioned electric wire 10 is connected to another conventional electric wire, the electric wire 10 can be connected to the terminal of the other electric wire, inserted into the female terminal portion and locked. In addition, as shown in FIG. 3A, terminal tabs 11a of a plurality of electric wires 10 can be overlapped and heated and welded to each other to form a terminal concentrated splice. Further, as shown in FIG. 3B, when connecting the printed circuit board 20 and the electric wire 10,
Through hole 20 provided in communication with substrate 20 and conductor 21
The tab 11a of the electric wire 10 is superimposed on the a and 21a, and the tab 11a is melted by heating in this state, so that the through hole 2
0a and 21a are filled and connected as rivets. Furthermore, as shown in FIG. 3 (C), when the round terminal 11c is formed at the tip of the core wire 11 in advance, it is used as an earth terminal and is fixed to the vehicle body 25 by bolts 26.

【0022】図4は第2実施形態のフラットケーブル3
0からなる配線材を示す。該フラットケーブル30で
は、高導電性樹脂かならなる帯状の導体31を所定の間
隔をあけて平行配列し、その両面に絶縁フィルム32、
33を被せてラミネートしている。このフラットケーブ
ル30も、他の電気部品と接続する端部は絶縁フィルム
32、33を剥離して導体31を露出させている。な
お、電線の場合と同様に、端末に導体31を露出させた
状態で予め成形してもよい。
FIG. 4 shows a flat cable 3 according to a second embodiment.
0 indicates a wiring member. In the flat cable 30, strip-shaped conductors 31 made of a highly conductive resin are arranged in parallel at predetermined intervals, and insulating films 32,
33 and laminated. The ends of the flat cable 30 that are connected to other electrical components also have the insulating films 32 and 33 peeled off to expose the conductor 31. Note that, similarly to the case of the electric wire, the conductor 31 may be formed in advance in a state where the conductor 31 is exposed to the terminal.

【0023】上記フラットケーブル30をプリント基板
20に接続する場合、電線の場合と同様に、図5に示す
ように、基板20および導体21に連通して設けた貫通
穴20a、21a上に導体31を重ね、この状態で加熱
することにより導体31を溶融して、貫通穴20a、2
1aに充填してリベット状として接続する。なお、1つ
のプリント基板20の導体21に、第1実施形態の電線
10の芯線11と第2実施形態のフラットケーブル30
の導体31とを上記手法により接続させてもよい。
When the flat cable 30 is connected to the printed circuit board 20, as shown in FIG. 5, the conductor 31 is provided on through holes 20a, 21a provided in communication with the board 20 and the conductor 21, as shown in FIG. The conductor 31 is melted by heating in this state, and the through holes 20a, 2a
Fill 1a and connect as a rivet. The conductor 21 of one printed circuit board 20 is connected to the core wire 11 of the electric wire 10 of the first embodiment and the flat cable 30 of the second embodiment.
May be connected by the above method.

【0024】[0024]

【発明の効果】以上の説明により明らかなように、本発
明によれば、電線の芯線およびフラットケーブルの導体
として、従来の銅に代えて、高導電性樹脂を用いている
ため、上記芯線や導体を加熱することにより、プリント
基板の導体等に直接溶着させて接続させることができ
る。よって、従来必要とされたコネクタ接続を不要とす
ることができる。
As is apparent from the above description, according to the present invention, a high conductive resin is used in place of the conventional copper as the core of the electric wire and the conductor of the flat cable. By heating the conductor, the conductor can be directly welded and connected to the conductor or the like of the printed circuit board. Therefore, the connector connection conventionally required can be eliminated.

【0025】また、電線では絶縁被覆部から突出させた
芯線端末をタブ等の端子部として予め形成しておくと、
端子金具との接続が不要となり、部品点数の削減と接続
工程の削減とを図ることができる。
In the case of an electric wire, if the core terminal protruding from the insulating coating portion is formed in advance as a terminal portion such as a tab,
The connection with the terminal fitting becomes unnecessary, and the number of components and the number of connection steps can be reduced.

【0026】電線およびフラットケーブルとも、導電部
に銅等の金属に代替して高導電性樹脂を使用して、従来
は異種材料(金属と樹脂)より構成されている配線材
を、同種材料(高導電性樹脂と絶縁性樹脂)より構成し
た配線材としているため、廃棄処分の際に、材料の分別
工程を必要とせず、リサイクル性を高めることができ
る。
Both electric wires and flat cables use a highly conductive resin instead of a metal such as copper for the conductive portion, and replace the wiring material conventionally formed of different materials (metal and resin) with the same material (metal and resin). Since the wiring member is made of a highly conductive resin and an insulating resin), a recyclability can be improved without the necessity of a material separation step at the time of disposal.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 第1実施形態の電線を示す一部破断斜視図で
ある。
FIG. 1 is a partially broken perspective view showing an electric wire according to a first embodiment.

【図2】 (A)(B)は上記電線の芯線にタブを形成
する工程を示す斜視図である。
FIGS. 2A and 2B are perspective views showing a step of forming a tab on a core wire of the electric wire.

【図3】 (A)(B)(C)は上記電線の使用例を示
す概略図である。
FIGS. 3A, 3B, and 3C are schematic diagrams showing examples of using the electric wire.

【図4】 第2実施形態のフラットケーブルを示す斜視
図である。
FIG. 4 is a perspective view showing a flat cable according to a second embodiment.

【図5】 上記フラットケーブルをプリント基板と接続
する状態を示す断面図である。
FIG. 5 is a cross-sectional view showing a state where the flat cable is connected to a printed circuit board.

【図6】 (A)は従来の電線を示す斜視図、(B)は
電線に端子を接続した状態を示す側面図である。
FIG. 6A is a perspective view showing a conventional electric wire, and FIG. 6B is a side view showing a state where a terminal is connected to the electric wire.

【図7】 従来のフラットケーブルを示す図面である。FIG. 7 is a drawing showing a conventional flat cable.

【符号の説明】[Explanation of symbols]

10 電線 11 芯線 11a タブ 12 絶縁被覆部 20 基板 21 導体 30 フラットケーブル 31 導体 32、33、絶縁フィルム DESCRIPTION OF SYMBOLS 10 Electric wire 11 Core wire 11a Tab 12 Insulation coating part 20 Substrate 21 Conductor 30 Flat cable 31 Conductor 32, 33, insulating film

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 高導電性樹脂からなる丸棒状の芯線の外
周を、絶縁性樹脂からなる絶縁被覆層で被覆している電
線からなる配線材。
1. A wiring member comprising an electric wire in which an outer periphery of a round bar-shaped core wire made of a highly conductive resin is covered with an insulating coating layer made of an insulating resin.
【請求項2】 上記芯線の端末を絶縁被覆層から突出さ
せ、突出部分に端子部を一体成形している請求項1に記
載の配線材。
2. The wiring member according to claim 1, wherein a terminal of the core wire protrudes from the insulating coating layer, and a terminal portion is integrally formed with the protruding portion.
【請求項3】 高導電性樹脂かならなる帯状の導体を所
定の間隔をあけて平行配列し、絶縁フィルムを両面に被
せてラミネートしているフラットケーブルからなる配線
材。
3. A wiring member comprising a flat cable in which strip-shaped conductors made of a highly conductive resin are arranged in parallel at a predetermined interval, and laminated with an insulating film covering both sides.
【請求項4】 請求項1及至請求項3のいずれか1項に
記載の配線材の芯線あるいは導体を、プリント基板に穿
設した貫通穴に溶着させて、プリント基板の導体と接続
している配線材の接続構造。
4. The core wire or conductor of the wiring member according to any one of claims 1 to 3 is welded to a through hole formed in the printed circuit board and connected to the conductor of the printed circuit board. Wiring material connection structure.
JP2000118432A 2000-04-19 2000-04-19 Wiring material and structure of its connection Abandoned JP2001307559A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000118432A JP2001307559A (en) 2000-04-19 2000-04-19 Wiring material and structure of its connection
US09/824,169 US20010035297A1 (en) 2000-04-19 2001-04-02 Wiring material and connecting structure of said wiring material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000118432A JP2001307559A (en) 2000-04-19 2000-04-19 Wiring material and structure of its connection

Publications (1)

Publication Number Publication Date
JP2001307559A true JP2001307559A (en) 2001-11-02

Family

ID=18629569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000118432A Abandoned JP2001307559A (en) 2000-04-19 2000-04-19 Wiring material and structure of its connection

Country Status (2)

Country Link
US (1) US20010035297A1 (en)
JP (1) JP2001307559A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080333A (en) * 2008-09-26 2010-04-08 Sumitomo Wiring Syst Ltd Electric wire with terminal metal fitting, and terminal metal fitting
US9379510B2 (en) 2010-03-15 2016-06-28 Yazaki Corporation Method for manufacturing circuit body and wire harness

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004094763A2 (en) 2003-04-16 2004-11-04 Integral Technologies, Inc. Low cost inductor devices manufactured from conductive loaded resin-based materials
JP3970202B2 (en) * 2003-05-07 2007-09-05 三菱電機株式会社 Manufacturing method of electric wire for rotating electrical machine
JP5475568B2 (en) * 2010-06-18 2014-04-16 矢崎総業株式会社 Integrated shield protector and wire harness
WO2018022379A1 (en) * 2016-07-28 2018-02-01 3M Innovative Properties Company Electrical cable
CN107995796A (en) * 2017-11-01 2018-05-04 福州市鼓楼区智搜信息科技有限公司 A kind of connection structure of circuit board and conducting wire
CN107995786A (en) * 2017-11-01 2018-05-04 福州市鼓楼区智搜信息科技有限公司 A kind of fixed connection structure of circuit board and conducting wire
JP7249201B2 (en) * 2019-05-17 2023-03-30 日本航空電子工業株式会社 Connection method, connection structure, contact and connector
CN111180108B (en) * 2020-01-20 2022-05-03 东莞泰欣照明有限公司 a conductive tube

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080333A (en) * 2008-09-26 2010-04-08 Sumitomo Wiring Syst Ltd Electric wire with terminal metal fitting, and terminal metal fitting
US9379510B2 (en) 2010-03-15 2016-06-28 Yazaki Corporation Method for manufacturing circuit body and wire harness

Also Published As

Publication number Publication date
US20010035297A1 (en) 2001-11-01

Similar Documents

Publication Publication Date Title
KR102606536B1 (en) electrical harness assembly
TWI399003B (en) A method for terminating a condutor of a cable to a tail portion of a contact terminal
US20030096520A1 (en) Press-fit bus bar distributing power
CN105390905B (en) Cover the joint method of skin electric wire
JP2001307559A (en) Wiring material and structure of its connection
US5423474A (en) Electric wire joining method
US4302065A (en) Flat cable assembly and methods of terminating and connectorizing the cable of same
JP2000251961A (en) Crimp terminal and method of manufacturing crimp terminal
CN111133638B (en) Electrical device and method for manufacturing a stranded wire contact mechanism for an electrical device
US20030221866A1 (en) Micro-coaxial cable assembly and method for making the same
JP2008210563A (en) Multi-core coaxial cable and method of manufacturing multi-core coaxial cable
JP4080207B2 (en) Fusible link
JP3976627B2 (en) Manufacturing method of electrical junction box
JPH11220823A (en) Busbar structure of electrical junction box
JP3501074B2 (en) Circuit body and junction box containing the circuit body
JP4070114B2 (en) Flat cable connection structure
JP3506094B2 (en) Connection structure between the internal circuit of the junction box and electric wires
JP4949571B2 (en) Wire harness
JP2001333519A (en) Circuit body and junction box housing the circuit body
JP2002184485A (en) Multi-core wiring member with connection body and method of manufacturing the same
JPH0424832B2 (en)
JP4016608B2 (en) Circuit body and junction box for automobile having the circuit body
JP2002359912A (en) Circuit unit and automotive junction box having the circuit unit
JP2017004975A (en) Method of joining covered conductors
JPS5832795B2 (en) Continuous substrate for matrix wiring

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20041220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20050111

A762 Written abandonment of application

Free format text: JAPANESE INTERMEDIATE CODE: A762

Effective date: 20050301