JP2001319903A - Grinding device chuck - Google Patents

Abstract

(57) [PROBLEMS] In a chuck using a conventional airbag, a chuck plate often slightly tilts due to air pressure, so that the accuracy of the uniformity of the semiconductor wafer and the outer periphery of the semiconductor wafer are improved. Polishing had occurred. Kind Code: A1 A chuck fixed to a tip of a spindle shaft of a polishing apparatus for attaching a semiconductor wafer, the chuck base having a concave portion, a guide ring movably fitted into the concave portion of the chuck base, and a guide. A chuck plate that is movably fitted inside the ring, an airbag interposed between the chuck plate and the chuck base, and a plurality of chuck bases that finely adjust an interval interposed between the chuck plate and the chuck base. Air cylinder means and a plurality of guide ring air cylinder means for finely adjusting the spacing interposed between the concave portion of the chuck base and the guide ring.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a wrapping machine,
The present invention relates to a chuck for attaching a semiconductor wafer to a lower end of a spindle shaft of a polishing machine such as a polishing machine, and more specifically, to eliminate inclination during polishing of a semiconductor wafer and to have ultra-high precision uniformity. The present invention relates to a chuck for a polishing apparatus that performs polishing and eliminates any polishing dripping that appears on the outer peripheral edge during the polishing.

[0002]

2. Description of the Related Art Hitherto, a chuck for polishing a semiconductor wafer by pressing it with an air bag has been already developed as a chuck of this kind of polishing apparatus.

[0003]

However, the semiconductor wafers required these days are extremely thin with the miniaturization of products, the diameter is increased from the viewpoint of productivity, and the entire surface from the viewpoint of the yield is ultra-high precision. This is a finishing process that performs mirror finishing and flattening with uniformity.In a chuck using a conventional airbag, the chuck plate often slightly tilts due to the air pressure of the airbag, and the semiconductor wafer has to be inclined. In addition to the problem of uniformity accuracy, there is also a problem that polishing sag occurs on the outer periphery of the semiconductor wafer.

[0004]

SUMMARY OF THE INVENTION In view of the above-mentioned problems, the present invention is directed to a chuck fixed to the tip of a spindle shaft of a polishing apparatus for attaching a semiconductor wafer and having a recessed portion. Chuck base, a guide ring movably fitted into the recessed portion of the chuck base, a chuck plate movably fitted inside the guide ring, an airbag interposed between the chuck plate and the chuck base, A plurality of air cylinder means for finely adjusting the distance between the chuck plate and the chuck base; and a plurality of guides for finely adjusting the distance between the concave portion of the chuck base and the guide ring A ring air cylinder means is provided.

Accordingly, an object of the present invention is to improve the accuracy of the uniformity of a semiconductor wafer, eliminate the occurrence of polishing dripping that appears on the outer peripheral edge, and provide an ultra-high accuracy uniformity over the entire surface of the semiconductor wafer. The invention provides and provides a vacuum chuck for performing the above-mentioned polishing processing.

[0006]

The present invention provides an air bag having a plurality of air cylinder means for a chuck base for finely adjusting the distance between a chuck plate and a chuck base, in addition to an air bag for pressing the middle of a semiconductor wafer. By flattening the chuck base inclined from the relationship of the air pressure and providing a plurality of guide ring air cylinder means for finely adjusting the gap between the concave portion of the chuck base and the guide ring, Fine adjustment of the guide ring located in the periphery, so that the polished surface of the semiconductor wafer and the lower surface of the guide ring are flush with each other, so that polishing is prevented and the entire surface is polished with ultra-high precision and uniform flatness It is to be processed.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the chuck for a polishing apparatus according to the present invention will be specifically described below with reference to the drawings of the embodiments.

FIG. 1 is an explanatory view showing a cross section for explaining an embodiment of a chuck for a polishing apparatus according to the present invention.

The present invention relates to a chuck for attaching a semiconductor wafer to a lower end of a spindle shaft of a polishing apparatus such as a lapping machine or a polishing machine. More specifically, the present invention relates to a chuck for polishing a semiconductor wafer during polishing. The present invention relates to a chuck for a polishing apparatus which has an ultra-high precision uniformity and is polished, and has no polishing dripping which appears on the outer peripheral edge during the polishing, and has a concave portion 1a on its lower surface. Chuck base 1, a guide ring 2 which is vertically movably fitted around the outer periphery of the concave portion 1 a of the chuck base 1, and the guide ring 2.
A chuck plate 3 which is fitted in the inside of the chuck movably in the vertical direction, an airbag 4 interposed between an upper surface of the chuck plate 3 and a lower surface of the chuck base 1, and the chuck plate 3 and the chuck base 1. A plurality of chuck base air cylinder means 5 for finely adjusting an interval interposed therebetween; And a guide ring air cylinder means 6.

That is, in the polishing apparatus chuck of the present invention, a semiconductor wafer W is adhered to the lower surface by means of water bonding or the like, and is fixed to a lower end of a spindle shaft vertically suspended from above the polishing apparatus so as to be vertically movable. The semiconductor wafer W is polished between a lapping plate or a polishing plate disposed below and polished.

As shown in FIG. 1, the chuck base 1 is made of metal or ceramics and has a substantially cup shape having a concave portion 1a on its lower surface. It is fixed to the lower end of the shaft.

Next, the guide ring 2 protects the outer peripheral edge of the semiconductor wafer W during polishing, and has a protective layer 2 on its surface.
a is provided by means of sticking or the like, and is fitted to the outer periphery of the concave portion 1a of the chuck base 1 so as to be freely movable in the vertical direction.

Next, the chuck plate 3 is movably fitted in the vertical direction inside the guide ring 2 to be fitted into the concave portion 1a of the chuck base 1, and the surface of the semiconductor wafer W is attached to the surface by means of water bonding or the like. It is to stick.

The airbag 4 is interposed between the upper surface of the chuck plate 3 and the lower surface of the chuck base 1. As shown in FIG. The airbag 4 may be provided with an air piping system (not shown).
The air pressure may be controlled by linking with.

Next, a plurality of air cylinder means 5 for chuck base are provided on the chuck base 1 by air cylinders 5a.
Are fixed in a penetrating state, and an air piston 5b extending from the air cylinder 5a so as to be able to advance and retreat is fixed to the back surface of the chuck plate 3. Each air cylinder 5a is connected to an air piping system (not shown). ) To control the air pressure. At least three sets of air cylinder means 5 for chuck bases are provided.
In the illustrated case, by providing four sets, the distance between the chuck base 1 and the chuck plate 3 in all directions can be finely adjusted.

Further, the plurality of air cylinder means 6 for the guide ring form a groove in the outer periphery of the concave portion 1a of the chuck base 1 and fix the air cylinder 6a, so that the air cylinder 6a can advance and retreat from the air cylinder 6a. The extended air piston 6b is fixed to the back surface of the guide ring 2, and the air cylinder 6a is connected to an air piping system (not shown) to control the air pressure. Air cylinder means 6 for guide ring
By providing at least three sets, and in the case shown, four sets, the distance between the chuck base 1 and the guide ring 2 in all directions can be finely adjusted.

In this state, the semiconductor wafer W is polished between the wrapping plate and the polishing plate by pressing the semiconductor wafer W between the lapping plate and the polishing plate. The chuck base 1 and the chuck plate 3
Is made flat by moving the air piston 5b of the air cylinder means 5 for chuck base forward and backward.

Further, the protective layer 2 on the surface of the guide ring 2
a is constantly flush with the surface of the semiconductor wafer W being polished, so that there is no polishing dripping of the semiconductor wafer W. In this case, the gap between the chuck base 1 and the guide ring 2 is made flat by moving the air piston 6b of the air cylinder means 6 for guide ring forward and backward to eliminate the height of the surface of the guide ring and the surface of the semiconductor wafer. That is, there is no polishing dripping that has occurred on the outer peripheral edge of the semiconductor wafer, which has conventionally occurred.

[0019]

The chuck for a polishing apparatus of the present invention constructed as described above can sufficiently cope with recent semiconductor wafers requiring ultra-high-quality polishing and finishing, and in particular, the flatness and uniformity of the semiconductor wafer. Of the accuracy of
The present invention is an epoch-making and effective invention that improves productivity and yield by eliminating polishing dripping that appears on the outer peripheral edge of a semiconductor wafer.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a cross section for explaining an embodiment of a polishing apparatus chuck of the present invention.

[Explanation of symbols]

 W Semiconductor wafer 1 Chuck base 1a Depression 2 Guide ring 2a Protective layer 3 Chuck plate 4 Air bag 5 Air cylinder means for chuck base 5a Air cylinder 5b Air piston 6 Air cylinder means for guide ring 6a Air cylinder 6b Air piston

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasuo Matsumoto 3-5-6 Konan, Minato-ku, Tokyo Lapmaster STF Co., Ltd. F term (reference) 3C058 AA12 AB04 CB01 CB02 DA17

Claims (1)

[Claims] 1. A chuck fixed to a tip of a spindle shaft of a polishing apparatus for attaching a semiconductor wafer, comprising a substantially cup-shaped chuck base having a concave portion on a lower surface, and an outer periphery of the concave portion of the chuck base. A guide ring that is movably fitted in the up and down direction, a chuck plate that is movably fitted in the up and down direction inside the guide ring, and an airbag interposed between the upper surface of the chuck plate and the lower surface of the chuck base. A plurality of chuck base air cylinder means for finely adjusting an interval interposed between the chuck plate and the chuck base; and an interval interposed between an outer periphery of a concave portion of the chuck base and a guide ring. And a plurality of air cylinder means for a guide ring for finely adjusting the size of the chuck.