[go: up one dir, main page]

JP2002093206A - LED signal light - Google Patents

LED signal light

Info

Publication number
JP2002093206A
JP2002093206A JP2000281501A JP2000281501A JP2002093206A JP 2002093206 A JP2002093206 A JP 2002093206A JP 2000281501 A JP2000281501 A JP 2000281501A JP 2000281501 A JP2000281501 A JP 2000281501A JP 2002093206 A JP2002093206 A JP 2002093206A
Authority
JP
Japan
Prior art keywords
substrate
led
heat
led lamp
conductive sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000281501A
Other languages
Japanese (ja)
Inventor
Hiroyuki Ito
博之 伊藤
Masaki Umemoto
雅樹 梅本
Masahiro Akimoto
政洋 秋元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2000281501A priority Critical patent/JP2002093206A/en
Publication of JP2002093206A publication Critical patent/JP2002093206A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B61RAILWAYS
    • B61LGUIDING RAILWAY TRAFFIC; ENSURING THE SAFETY OF RAILWAY TRAFFIC
    • B61L5/00Local operating mechanisms for points or track-mounted scotch-blocks; Visible or audible signals; Local operating mechanisms for visible or audible signals
    • B61L5/12Visible signals
    • B61L5/18Light signals; Mechanisms associated therewith, e.g. blinders
    • B61L5/1809Daylight signals
    • B61L5/1854Mounting and focussing of the light source in a lamp, fixing means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B61RAILWAYS
    • B61LGUIDING RAILWAY TRAFFIC; ENSURING THE SAFETY OF RAILWAY TRAFFIC
    • B61L2207/00Features of light signals
    • B61L2207/02Features of light signals using light-emitting diodes [LEDs]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Traffic Control Systems (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

(57)【要約】 (修正有) 【課題】 大電力化され一個あたりの発熱量が増加した
LEDランプを光源として採用したLED信号灯具にお
いて、基板の小型化により集中する発熱を熱伝導にバラ
ツキのない状態で放熱可能とする。 【解決手段】 LEDランプを保持する基板3を点灯時
の発熱を伝導するのに充分な板厚を有する金属板で自立
構造として形成し、LEDランプ2が取付けられた状態
とした基板3を絶縁性熱伝導シート5を介して放熱フィ
ン4上に載置し、基板3と絶縁性熱伝導シート5とを、
反射鏡を兼ねる構成とした樹脂製のプレッシャープレー
ト6で放熱フィンに圧接挟持して取付けた構成としたL
ED信号灯1とした。
(57) [Summary] (with correction) [Problem] In an LED signal lighting device employing an LED lamp as a light source, the power consumption of which is increased due to an increase in power consumption, the heat generated due to the miniaturization of a substrate is dispersed in heat conduction. Heat can be dissipated in the absence of heat. SOLUTION: A substrate 3 holding an LED lamp is formed as a self-standing structure by a metal plate having a sufficient thickness to conduct heat generated at the time of lighting, and the substrate 3 in a state where the LED lamp 2 is mounted is insulated. The substrate 3 and the insulating heat conductive sheet 5 are placed on the heat radiation fins 4 via the conductive heat conductive sheet 5,
L, which is configured so as to be pressed and held to the radiation fins by a resin pressure plate 6 which also functions as a reflecting mirror.
ED signal light 1 was used.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、鉄道信号、道路交
通信号など交通機関において使用される信号灯具に関す
るものであり、詳細には、光源としてLEDランプを採
用する信号灯具の構成に係るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a signal light used in a transportation system such as a railway signal and a road traffic signal, and more particularly to a signal light adopting an LED lamp as a light source. is there.

【0002】[0002]

【従来の技術】従来のLEDランプを光源として採用す
るLED信号灯具90の構成の例を示すものが図3であ
り、例えばプリント配線基板で給電パターンが形成され
た基板92上に、必要数のLEDランプ91を搭載し、
この基板92をレンズ93とハウジング94とで構成さ
れる灯体内に収納するものであった。
2. Description of the Related Art FIG. 3 shows an example of a configuration of an LED signal lamp 90 employing a conventional LED lamp as a light source. For example, a required number of LED signal lamps 90 are provided on a substrate 92 on which a power supply pattern is formed by a printed wiring board. Equipped with LED lamp 91,
This substrate 92 was housed in a lamp body composed of a lens 93 and a housing 94.

【0003】このときに、従来のLEDランプ91にお
いては1個あたりの消費電力(例えば0.1W)も少な
く、これに伴い光量も少ないものであったので、LED
信号灯具90として必要とされる光量を確保するために
は、LEDランプ91の多数(例えば200個)が要求
され、これにより前記基板92は前記レンズ93とほぼ
同面積を持つものとされていた。
At this time, in the conventional LED lamp 91, the power consumption (for example, 0.1 W) per lamp is small, and accordingly, the light amount is small.
In order to secure the light quantity required for the signal lamp 90, a large number (for example, 200) of LED lamps 91 are required, whereby the substrate 92 has substantially the same area as the lens 93. .

【0004】[0004]

【発明が解決しようとする課題】しかしながら、近年に
いたり、前記LEDランプ91の1個あたりの大電力化
(例えば0.5W)が可能となり、これに伴い1つの灯
具あたりのLEDランプ91の使用数の低減(例えば2
0個)が可能となり、例えば組立て工数の低減によるコ
ストダウンなどの効果が期待できる状況となっている。
However, in recent years, it has become possible to increase the power (for example, 0.5 W) per LED lamp 91 and to use the LED lamp 91 per lamp. Number reduction (eg 2
0) is possible, and an effect such as cost reduction by reducing the number of assembly steps can be expected.

【0005】この場合、上記大電力化したLEDランプ
91を採用すると、当然に、前記基板92の面積も狭く
することが可能となるが、その一方で、狭い面積に発熱
が集中するものとなり、従来の構成では放熱不能となっ
て、大電力化されたLEDランプ91が採用できず、従
って、工数低減によるコストダウンなども実施できない
という問題点を生じていた。
In this case, if the above-described LED lamp 91 having a large power is used, the area of the substrate 92 can be naturally reduced. On the other hand, heat is concentrated on a small area. In the conventional configuration, the heat cannot be dissipated, and the LED lamp 91 having a large power cannot be used. Therefore, there is a problem that the cost cannot be reduced by reducing the number of steps.

【0006】また、如何に1個あたりのLEDランプ9
1が小電力とはいえ、使用する数が膨大であるので総合
の発熱量は多く、従って灯具90内の温度上昇は高いも
のとなる。この点を解決しようと、ハウジング94の背
面に放熱フィン95を取付けたものも存在するが、この
場合、樹脂製の基板92の介在などによりLEDランプ
91に発生する熱を直接に放散するものとは成らずそれ
程の効果は期待できず、例えばLEDランプ91の寿命
の短命化などを生じる懸念も生じるものである。
[0006] In addition, how to use one LED lamp 9
Although 1 is a small electric power, the total number of heats to be used is enormous since the number of used electric power is enormous, so that the temperature rise in the lamp 90 is high. In order to solve this problem, there is a type in which a heat radiating fin 95 is attached to the back surface of the housing 94. In this case, the heat generated in the LED lamp 91 is directly radiated due to the interposition of a resin substrate 92 or the like. Therefore, such effects cannot be expected, and for example, there is a concern that the life of the LED lamp 91 is shortened.

【0007】[0007]

【課題を解決するための手段】本発明は、前記した従来
の課題を解決するための具体的手段として、複数のLE
Dランプを光源として採用するLED信号灯具におい
て、前記LEDランプを保持する基板を少なくとも前記
LEDランプの点灯時の発熱を伝導するのに充分な板厚
を有する金属板で自立構造として形成し、前記LEDラ
ンプが取付けられた状態とした前記基板を絶縁性熱伝導
シートを介して放熱フィン上に載置し、前記基板と前記
絶縁性熱伝導シートとを、反射鏡を兼ねる構成とした樹
脂製のプレッシャープレートで前記放熱フィンに圧接挟
持して取付けた構成としたことを特徴とするLED信号
灯を提供することで課題を解決するものである。
The present invention provides a plurality of LEs as specific means for solving the above-mentioned conventional problems.
In an LED signal lighting device employing a D lamp as a light source, a substrate holding the LED lamp is formed as a self-standing structure with a metal plate having a thickness sufficient to conduct heat generated at least when the LED lamp is turned on, The substrate with the LED lamp mounted thereon is placed on a radiating fin via an insulating heat conductive sheet, and the substrate and the insulating heat conductive sheet are made of resin having a configuration also serving as a reflector. An object of the present invention is to solve the problem by providing an LED signal light characterized in that a pressure plate is attached to the radiation fin by being pressed and held by a pressure plate.

【0008】[0008]

【発明の実施の形態】つぎに、本発明を図に示す実施形
態に基づいて詳細に説明する。図1および図2に符号1
で示すものは本発明に係るLED信号灯具であり、この
LED信号灯具1は複数のLEDランプ2を光源として
採用するものである点は従来例のものと同様である。
Next, the present invention will be described in detail based on an embodiment shown in the drawings. 1 and FIG.
An LED signal lamp according to the present invention is indicated by a symbol. This LED signal lamp 1 employs a plurality of LED lamps 2 as a light source, which is the same as the conventional example.

【0009】ここで、本発明のLED信号灯具1は従来
例のものに比べて高消費電力としたLEDランプ2を採
用するものであり、これにより前記LEDランプ2の使
用数は、例えば100個から20個と激減し、これに伴
い、組立て工数の低減などによる生産性の向上が可能な
ものとしている。
Here, the LED signal lamp 1 of the present invention employs the LED lamp 2 having higher power consumption than that of the conventional example, whereby the number of the LED lamps 2 used is, for example, 100. The number is greatly reduced to 20 units, and accordingly, the productivity can be improved by reducing the number of assembling steps.

【0010】この場合、従来例でも説明したように、L
EDランプ2の使用数の減少に伴い、基板3の小型化を
来たし、当然にLEDランプ2を点灯したときの発熱が
小面積に集中し、LEDランプ2に対して冷却の必要性
を生じるものとなるが、本発明では、以下に説明する構
成とすることでLEDランプ2に対して必要充分な冷却
を行うことを可能とするものである。
In this case, as described in the conventional example, L
With the decrease in the number of ED lamps 2 used, the size of the substrate 3 has been reduced. Naturally, the heat generated when the LED lamps 2 are turned on is concentrated on a small area, which necessitates cooling of the LED lamps 2. However, according to the present invention, it is possible to perform necessary and sufficient cooling on the LED lamp 2 by employing the configuration described below.

【0011】図2は、本発明の要部の構成を、図面が煩
雑化するのを避けるためにLEDランプ2の数を減ずる
など簡略化して示すものであり、本発明においては前記
LEDランプ2に電力を供給し、且つ、所定位置に保持
するための基板3は、前記LEDランプ2が点灯時に生
じる発熱を伝導するのに充分な板厚を有する金属板で形
成されている。
FIG. 2 shows the structure of the main part of the present invention in a simplified manner such as by reducing the number of LED lamps 2 in order to avoid complicating the drawing. The substrate 3 for supplying power to the LED and holding the LED at a predetermined position is formed of a metal plate having a thickness sufficient to conduct heat generated when the LED lamp 2 is turned on.

【0012】このときに、前記基板3は、従来例の基板
に如くに樹脂板上に銅箔が貼着されて形成されたもので
はなく、金属板自体をプレス加工、あるいは、エッチン
グ加工などで所望の形状に切抜き、基板3とするもので
あり、この基板3にLEDランプ2の端子をカシメ止
め、リベット止め、スポット溶接止めなど適宜な手段で
止着することで給電と保持を行うものである。
At this time, the substrate 3 is not formed by bonding a copper foil on a resin plate as in the case of the conventional substrate, but is formed by pressing or etching the metal plate itself. The substrate is cut out into a desired shape to form a substrate 3. The terminals of the LED lamps 2 are fixed to the substrate 3 by appropriate means such as caulking, riveting, spot welding, etc., to supply and hold power. is there.

【0013】以上の機能を果すためには基板3は、それ
自体が所定の形状を保ち自立していることが望ましい
が、基板3の機能としてはLEDランプ2に正電位、負
電位を伝導するものである以上、少なくとも2枚から構
成せざるを得ないものである。よって、正電位側の部分
と負電位側との部分とを適宜な位置でブリッジ状に接続
して1枚としておき、LEDランプ2の取付が終った時
点で前記ブリッジ状の部分を切除しても良いものであ
る。
In order to fulfill the above functions, it is desirable that the substrate 3 is self-supporting while maintaining a predetermined shape. However, the function of the substrate 3 is to transmit a positive potential and a negative potential to the LED lamp 2. Therefore, at least two sheets must be formed. Therefore, the portion on the positive potential side and the portion on the negative potential side are connected in a bridge at an appropriate position to form a single piece, and when the LED lamp 2 is mounted, the bridge-like portion is cut off. Is also good.

【0014】以上のようにLEDランプ2が取付けられ
た基板3は、更に放熱フィン4に取付けられ放熱が行わ
れるものとなるが、前記放熱フィン4はアルミニウムな
ど熱伝導性に優れる金属部材で形成されているので、基
板3と放熱フィン4とを直接に取付けたのでは短絡を生
じるものとなる。
The substrate 3 on which the LED lamps 2 are mounted as described above is further mounted on the radiating fins 4 to radiate heat. The radiating fins 4 are formed of a metal member having excellent thermal conductivity such as aluminum. Therefore, if the substrate 3 and the radiation fins 4 are directly attached, a short circuit occurs.

【0015】そこで、前記基板3と放熱フィン4との間
には絶縁性熱伝導シート5を挟み、上記した短絡を防止
するものとされるが、このように絶縁性熱伝導シート5
を挟む構成では、前記絶縁性熱伝導シート5の基板3お
よび放熱フィン4との密着性により熱の導電効率が大き
く左右されるものとなるなどして、製品にバラツキを生
じる可能性が高いものとなる。尚、本発明では前記絶縁
性熱伝導シート5として、ボロンナイトライドとシリコ
ンゴムとを基材としたものを採用している。
Therefore, the insulating heat conductive sheet 5 is sandwiched between the substrate 3 and the heat radiation fins 4 to prevent the above-mentioned short circuit.
In such a configuration, the heat conduction efficiency is greatly affected by the adhesion between the insulating heat conductive sheet 5 and the substrate 3 and the radiating fins 4. Becomes In the present invention, as the insulating heat conductive sheet 5, a sheet having a base material of boron nitride and silicon rubber is employed.

【0016】よって、本発明では、上記を解決する手段
として、プレッシャープレート6を用意するものであ
り、このプレッシャープレート6は絶縁性の樹脂で形成
され、前記LEDランプ2に対応する部分には略すり鉢
状とした開口部6aが設けられ、前記LEDランプ2に
触れることなく、直接に基板3に接触可能とされてい
る。
Therefore, in the present invention, as a means for solving the above, a pressure plate 6 is prepared, and the pressure plate 6 is formed of an insulating resin, and a portion corresponding to the LED lamp 2 is substantially provided. A mortar-shaped opening 6a is provided, and can directly contact the substrate 3 without touching the LED lamp 2.

【0017】同時に、前記LEDランプ2の発光方向側
となる表面にはアルミニウムの真空蒸着などによる反射
膜6bが形成されていて、前記開口部6aの部分がLE
Dランプ2から側方に放射された光を照射方向側に向け
て反射する反射鏡の作用を成すものとされている。
At the same time, a reflective film 6b is formed on the surface of the LED lamp 2 on the light emitting direction side by vacuum evaporation of aluminum or the like, and the opening 6a is
It functions as a reflecting mirror that reflects the light radiated laterally from the D lamp 2 toward the irradiation direction.

【0018】加えて、前記プレッシャープレート6には
取付穴6cが設けられ、ネジ7により前記放熱フィン4
に螺着が可能な構成とされている。尚、前記基板3にお
いては、プレッシャープレート6を放熱フィン4に螺着
するときのネジ7に対して接触をすることのないものと
されている。また、前記プレッシャープレート6には基
板3、放熱フィン4、絶縁性熱伝導シート5との位置合
せを行うためのボス6dが設けられている。
In addition, the pressure plate 6 is provided with a mounting hole 6c.
Is configured to be screwed into the device. The substrate 3 does not come into contact with the screw 7 when the pressure plate 6 is screwed to the radiation fin 4. Further, the pressure plate 6 is provided with a boss 6 d for positioning the substrate 3, the radiation fins 4, and the insulating heat conductive sheet 5.

【0019】このようにすることで、本発明のLED信
号灯具1においては、放熱フィン4に絶縁性熱伝導シー
ト5を介して基板3の取付を行う場合には、放熱フィン
4とプレッシャープレート6とで基板3および絶縁性熱
伝導シート5を挟んで行うものとなる。
By doing so, in the LED signal lamp 1 of the present invention, when the substrate 3 is attached to the radiating fin 4 via the insulating heat conductive sheet 5, the radiating fin 4 and the pressure plate 6 are attached. Is performed with the substrate 3 and the insulating heat conductive sheet 5 interposed therebetween.

【0020】このときの、基板3および絶縁性熱伝導シ
ート5が、放熱フィン4およびプレッシャープレート6
に挟まれる圧力は、ネジ7の締付け強度に依存するもの
となる。従って、ネジ7の締付け強度をトルクドライバ
ーなどで一定のトルクあるいはそれ以上として管理すれ
ば、絶縁性熱伝導シート5が基板3と放熱フィン4とに
挟まれる圧力は一定以上の値が確保され、即ち、意図す
る熱伝導性が確保されるものとなる。
At this time, the substrate 3 and the insulating heat conductive sheet 5 are combined with the radiation fins 4 and the pressure plate 6.
Is dependent on the tightening strength of the screw 7. Therefore, if the tightening strength of the screw 7 is controlled as a constant torque or more by a torque driver or the like, the pressure at which the insulating heat conductive sheet 5 is sandwiched between the substrate 3 and the radiation fins 4 is maintained at a value equal to or more than a certain value. That is, the intended thermal conductivity is ensured.

【0021】尚、図1中に符号8で示すものは黄のLE
D信号灯具を構成する部分である筐体であり、符号9で
示すものは同様なアウターレンズであり、符号10で示
すものはインナーレンズであるが、本発明には直接に関
与する部分ではないので、ここでの詳細な説明は省略す
る。
In FIG. 1, reference numeral 8 denotes a yellow LE.
The housing which is a part of the D signal lamp is shown, the one denoted by reference numeral 9 is a similar outer lens, and the one denoted by reference numeral 10 is an inner lens, but is not a part directly involved in the present invention. Therefore, detailed description here is omitted.

【0022】[0022]

【発明の効果】以上に説明したように本発明により、L
EDランプを保持する基板を少なくともLEDランプの
点灯時の発熱を伝導するのに充分な板厚を有する金属板
で自立構造として形成し、前記LEDランプが取付けら
れた状態とした前記基板を絶縁性熱伝導シートを介して
放熱フィン上に載置し、前記基板と前記絶縁性熱伝導シ
ートとを、反射鏡を兼ねる構成とした樹脂製のプレッシ
ャープレートで前記放熱フィンに圧接挟持して取付けた
構成としたLED信号灯としたことで、大電力化され一
個あたりの発熱量が増加したLEDランプを光源として
採用するときにも、基板の小型化により集中する発熱を
熱伝導にバラツキのない状態で放熱可能とし、もって、
LEDランプ使用数の低減により部品数、組立工数の低
減を可能とし、この種のLED信号灯具の生産性の向上
とコストダウンとに極めて優れた効果を奏するものであ
る。
As described above, according to the present invention, L
The substrate holding the ED lamp is formed of a metal plate having a thickness sufficient to at least conduct heat generated when the LED lamp is turned on, and has a self-standing structure. A configuration in which the substrate and the insulating heat conductive sheet are placed on the heat radiating fin via a heat conductive sheet, and the substrate and the insulating heat conductive sheet are pressed and sandwiched between the heat radiating fins with a resin pressure plate configured to also serve as a reflecting mirror. When using LED lamps with high power and increased heat generation per unit as the light source, the heat generated due to the downsizing of the board is radiated without unevenness in heat conduction Possible,
By reducing the number of LED lamps used, the number of parts and the number of assembly steps can be reduced, and this type of LED signal lamp has extremely excellent effects on productivity and cost reduction.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明に係るLED信号灯具の実施形態を示
す断面図である。
FIG. 1 is a sectional view showing an embodiment of an LED signal lamp according to the present invention.

【図2】 同じ実施形態の要部を一部を分解した状態で
示す斜視図である。
FIG. 2 is a perspective view showing a main part of the same embodiment in a partially exploded state.

【図3】 従来例を示す断面図である。FIG. 3 is a sectional view showing a conventional example.

【符号の説明】[Explanation of symbols]

1……LED信号灯具 2……LEDランプ 3……基板 4……放熱フィン 5……絶縁性熱伝導シート 6……プレッシャープレート 6a……開口部 6b……反射膜 6c……取付穴 6d……ボス 7……ネジ DESCRIPTION OF SYMBOLS 1 ... LED signal lamp 2 ... LED lamp 3 ... Substrate 4 ... Heat radiating fin 5 ... Insulating heat conductive sheet 6 ... Pressure plate 6a ... Opening 6b ... Reflection film 6c ... Mounting hole 6d ... … Boss 7 …… Screw

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H01L 33/00 G08G 1/095 M 5H180 // B61L 5/12 F21Y 101:02 G08G 1/095 F21Q 3/00 Z F21Y 101:02 F21S 1/02 G (72)発明者 秋元 政洋 東京都目黒区中目黒2丁目9番13号 スタ ンレー電気株式会社内 Fターム(参考) 3K014 AA01 LA01 LB04 3K080 AA07 AA12 BA07 BE07 5C094 AA35 BA25 CA19 5F041 AA33 DB01 DC07 DC12 DC22 DC55 DC81 FF16 5G435 AA12 BB04 EE05 EE13 EE33 FF03 GG44 5H180 HH14 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01L 33/00 G08G 1/095 M 5H180 // B61L 5/12 F21Y 101: 02 G08G 1/095 F21Q 3 / 00Z F21Y 101: 02 F21S 1/02 G (72) Inventor Masahiro Akimoto 2-9-13 Nakameguro, Meguro-ku, Tokyo F-term within Stanley Electric Co., Ltd. 3K014 AA01 LA01 LB04 3K080 AA07 AA12 BA07 BE07 5C094 AA35 BA25 CA19 5F041 AA33 DB01 DC07 DC12 DC22 DC55 DC81 FF16 5G435 AA12 BB04 EE05 EE13 EE33 FF03 GG44 5H180 HH14

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 複数のLEDランプを光源として採用す
るLED信号灯具において、前記LEDランプを保持す
る基板を少なくとも前記LEDランプの点灯時の発熱を
伝導するのに充分な板厚を有する金属板で自立構造とし
て形成し、前記LEDランプが取付けられた状態とした
前記基板を絶縁性熱伝導シートを介して放熱フィン上に
載置し、前記基板と前記絶縁性熱伝導シートとを、反射
鏡を兼ねる構成とした樹脂製のプレッシャープレートで
前記放熱フィンに圧接挟持して取付けた構成としたこと
を特徴とするLED信号灯具。
1. An LED signal lamp employing a plurality of LED lamps as a light source, wherein a substrate holding the LED lamps is a metal plate having a thickness sufficient to conduct heat generated when the LED lamps are turned on. The substrate, which is formed as a self-supporting structure and has the LED lamp mounted thereon, is placed on a radiating fin via an insulating heat conductive sheet, and the substrate and the insulating heat conductive sheet are connected to a reflecting mirror. An LED signal light fixture comprising a resin pressure plate that also serves as a pressure plate and is attached to the radiation fins by pressure.
JP2000281501A 2000-09-18 2000-09-18 LED signal light Pending JP2002093206A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000281501A JP2002093206A (en) 2000-09-18 2000-09-18 LED signal light

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000281501A JP2002093206A (en) 2000-09-18 2000-09-18 LED signal light

Publications (1)

Publication Number Publication Date
JP2002093206A true JP2002093206A (en) 2002-03-29

Family

ID=18766146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000281501A Pending JP2002093206A (en) 2000-09-18 2000-09-18 LED signal light

Country Status (1)

Country Link
JP (1) JP2002093206A (en)

Cited By (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003331601A (en) * 2002-04-04 2003-11-21 Aitec Co Ltd Light emitting diode flashlight
JP2004179048A (en) * 2002-11-28 2004-06-24 Toshiba Lighting & Technology Corp LED lighting unit and LED lighting fixture
WO2004068596A1 (en) * 2003-01-25 2004-08-12 Nam-Young Kim Lamp module with light emitting diode
JP2005063754A (en) * 2003-08-08 2005-03-10 Mitsubishi Electric Corp head lamp
JP2006509372A (en) * 2002-12-06 2006-03-16 クリー インコーポレイテッド Composite leadframe LED package and method of manufacturing the same This application is US Provisional Patent Application No. 60 / 431,523, filed December 6, 2002, entitled "Leadframe based LEDor semiconductor packaging package". Claims the benefit of filing date to the US Patent and Trademark Office.
JP2006120833A (en) * 2004-10-21 2006-05-11 Harvatek Corp Package structure of electro-optic semiconductor
WO2006090858A1 (en) * 2005-02-24 2006-08-31 Litehouse Technologies Corporation Light emitting device and light emitting object using the same
US7114837B2 (en) 2003-04-08 2006-10-03 Koito Manufacturing Co., Ltd. Headlamp for vehicle
JP2006331817A (en) * 2005-05-25 2006-12-07 Matsushita Electric Works Ltd Light emitting device and luminaire using it
JP2007257951A (en) * 2006-03-22 2007-10-04 Honda Motor Co Ltd Vehicle lighting
WO2007126074A1 (en) 2006-04-28 2007-11-08 Shimane Prefectural Government Semiconductor light emitting module, device, and its manufacturing method
EP1670072A4 (en) * 2003-09-19 2007-12-12 Matsushita Electric Industrial Co Ltd LIGHTING DEVICE
JP2007335420A (en) * 2006-03-03 2007-12-27 Matsushita Electric Works Ltd Lighting fixture
JP2008047385A (en) * 2006-08-14 2008-02-28 Ichikoh Ind Ltd Vehicle lighting
DE202006017583U1 (en) * 2006-11-17 2008-03-27 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH lighting device
WO2008055422A1 (en) * 2006-11-10 2008-05-15 Shenzhen Gasun Energy Technology Co., Ltd. High-luminance led street lamp
JP2008130232A (en) * 2006-11-16 2008-06-05 Stanley Electric Co Ltd LED lights for vehicles
JP2008153080A (en) * 2006-12-18 2008-07-03 Ichikoh Ind Ltd Light emitting diode fixing structure
JP2008204692A (en) * 2007-02-19 2008-09-04 Toshiba Lighting & Technology Corp lighting equipment
KR100857058B1 (en) * 2007-08-13 2008-09-05 이영섭 Cooling structure of street light using light emitting diode
JP2008210655A (en) * 2007-02-27 2008-09-11 Iwasaki Electric Co Ltd Security light
JP2008210593A (en) * 2007-02-23 2008-09-11 Matsushita Electric Works Ltd Illuminating device
JP2008288221A (en) * 2008-08-22 2008-11-27 Koito Mfg Co Ltd Lighting fixture for vehicle
JP2009081092A (en) * 2007-09-27 2009-04-16 Toyoda Gosei Co Ltd Light source device
WO2009070951A1 (en) * 2007-12-03 2009-06-11 Cheng, Yi-Ju Led high-power street lamp structure
JP2009205834A (en) * 2008-02-26 2009-09-10 Ichikoh Ind Ltd Lighting fixture for vehicle
JP2009231023A (en) * 2008-03-21 2009-10-08 Ccs Inc Light irradiating device
US7607806B2 (en) 2005-10-05 2009-10-27 Ichikoh Industries, Ltd. Vehicle lamp
JP2009289749A (en) * 2008-05-28 2009-12-10 Osram Sylvania Inc Rear-mounted light emitting diode module for automobile rear combination lamp
WO2009150711A1 (en) * 2008-06-10 2009-12-17 スワン電器株式会社 Lighting apparatus
WO2010004702A1 (en) * 2008-07-07 2010-01-14 パナソニック株式会社 Bulb-type lighting source
JP2010049951A (en) * 2008-08-22 2010-03-04 Eye Lighting Syst Corp Led illumination fixture
JP2010049830A (en) * 2008-08-19 2010-03-04 Toyoda Gosei Co Ltd Led lighting apparatus
JP2010055938A (en) * 2008-08-28 2010-03-11 Toshiba Lighting & Technology Corp Lighting apparatus
KR100954997B1 (en) 2009-05-19 2010-04-27 주식회사 케이디파워 Led illumination lamp
JP2010125897A (en) * 2008-11-25 2010-06-10 Yamaha Motor Co Ltd Motorcycle
US7736016B2 (en) 2007-10-25 2010-06-15 Toyoda Gosei Co., Ltd. Light source unit
FR2940679A1 (en) * 2008-12-31 2010-07-02 Finan Trading Company ELECTROLUMINESCENT DIODE LIGHTING SYSTEM.
JP2010153402A (en) * 2010-04-02 2010-07-08 Stanley Electric Co Ltd Lighting fixture
WO2010087877A1 (en) * 2009-01-28 2010-08-05 Relume Technologies, Inc. Led light engine with finned modules for heat transfer
WO2010090314A1 (en) * 2009-02-09 2010-08-12 株式会社ケノス Led substrate mounting device
JP2010182486A (en) * 2009-02-04 2010-08-19 Koito Mfg Co Ltd Lighting tool for vehicle
KR100993902B1 (en) 2008-01-31 2010-11-11 알티전자 주식회사 Light emitting diode package
JP2010262846A (en) * 2009-05-08 2010-11-18 Mitsubishi Electric Corp lighting equipment
JP2011023194A (en) * 2009-07-15 2011-02-03 Jimbo Electric Co Ltd Led lighting system
JP2011076781A (en) * 2009-09-29 2011-04-14 Casio Computer Co Ltd Light source device, and projector
US7950796B2 (en) 2006-10-18 2011-05-31 Seiko Epson Corporation Light emitting device, method of manufacturing light emitting device, and ink jet recording apparatus
JP2011119094A (en) * 2009-12-02 2011-06-16 Koito Mfg Co Ltd Lighting fixture for vehicle
WO2011077828A1 (en) * 2009-12-21 2011-06-30 シャープ株式会社 Lighting device
WO2011099633A1 (en) * 2010-02-15 2011-08-18 矢崎総業株式会社 Backlight unit for vehicles and display device for vehicles
CN102168817A (en) * 2010-02-26 2011-08-31 东芝照明技术株式会社 Bulb lamp and lighting equipment
JP2011228042A (en) * 2010-04-16 2011-11-10 Panasonic Electric Works Co Ltd lighting equipment
JP2011230751A (en) * 2010-04-09 2011-11-17 Lecip Holdings Corp Led lighting fixture
JP2011243502A (en) * 2010-05-20 2011-12-01 Ichikoh Ind Ltd Vehicle lighting device
KR101094251B1 (en) * 2009-09-30 2011-12-19 허재원 LED module illuminated from all directions
JP2012508404A (en) * 2009-02-09 2012-04-05 ホエジョウ・ライト・エンジン・リミテッド Light Emitting Diode Light Array on Mesh Platform
US8167463B2 (en) 2002-09-04 2012-05-01 Cree, Inc. Power surface mount light emitting die package
US8188488B2 (en) 2003-05-27 2012-05-29 Cree, Inc. Power surface mount light emitting die package
CN102506334A (en) * 2008-06-10 2012-06-20 斯万电器株式会社 Illumination device
JP2012182192A (en) * 2011-02-28 2012-09-20 Panasonic Corp LED unit and lighting apparatus using the same
JP2012208205A (en) * 2011-03-29 2012-10-25 Casio Comput Co Ltd Semiconductor light source device and projector
US8308331B2 (en) 2005-06-14 2012-11-13 Cree, Inc. LED backlighting for displays
JP2012230906A (en) * 2005-09-27 2012-11-22 Koninkl Philips Electronics Nv Led lighting fixture
US8337062B2 (en) 2008-03-28 2012-12-25 Stanley Electric Co., Ltd. LED lighting unit and vehicle lamp
CN102943969A (en) * 2012-11-21 2013-02-27 深圳华瀚新能源材料有限公司 Light-emitting diode (LED) lamp using heat conduction high-polymer material for heat dissipation
CN102997084A (en) * 2011-09-16 2013-03-27 松下电器产业株式会社 LED unit and LED illuminating appliance using the same
JP2013077577A (en) * 2013-01-11 2013-04-25 Toshiba Lighting & Technology Corp Bulb type lamp and lighting fixture
JP2013165082A (en) * 2013-05-31 2013-08-22 Toshiba Lighting & Technology Corp Lighting device
US8678618B2 (en) 2009-09-25 2014-03-25 Toshiba Lighting & Technology Corporation Self-ballasted lamp having a light-transmissive member in contact with light emitting elements and lighting equipment incorporating the same
JP2014063694A (en) * 2012-09-24 2014-04-10 Ichikoh Ind Ltd Vehicular headlamp
TWI449863B (en) * 2010-12-27 2014-08-21
TWI454637B (en) * 2011-03-07 2014-10-01
JP2016507143A (en) * 2013-02-14 2016-03-07 チザラ リヒトシステーメ ゲーエムベーハーZizala Lichtsysteme GmbH Optical module for vehicle headlamps
CN105864703A (en) * 2015-02-05 2016-08-17 现代自动车株式会社 Battery charging status indicator for electric vehicle
JP2017191648A (en) * 2016-04-11 2017-10-19 カルソニックカンセイ株式会社 LED lights
JP2017191647A (en) * 2016-04-11 2017-10-19 カルソニックカンセイ株式会社 Led lighting fixture
USRE47011E1 (en) 2002-05-29 2018-08-28 Optolum, Inc. Light emitting diode light source
USRE47025E1 (en) 2002-05-29 2018-09-04 Optolum, Inc. Light emitting diode light source
KR20220092171A (en) * 2020-12-24 2022-07-01 우리산업 주식회사 LED Photocatalyst Sterilizer for a Vehicle Seats

Cited By (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003331601A (en) * 2002-04-04 2003-11-21 Aitec Co Ltd Light emitting diode flashlight
USRE47025E1 (en) 2002-05-29 2018-09-04 Optolum, Inc. Light emitting diode light source
USRE47011E1 (en) 2002-05-29 2018-08-28 Optolum, Inc. Light emitting diode light source
US8167463B2 (en) 2002-09-04 2012-05-01 Cree, Inc. Power surface mount light emitting die package
US8710514B2 (en) 2002-09-04 2014-04-29 Cree, Inc. Power surface mount light emitting die package
US8530915B2 (en) 2002-09-04 2013-09-10 Cree, Inc. Power surface mount light emitting die package
US8622582B2 (en) 2002-09-04 2014-01-07 Cree, Inc. Power surface mount light emitting die package
US8608349B2 (en) 2002-09-04 2013-12-17 Cree, Inc. Power surface mount light emitting die package
JP2004179048A (en) * 2002-11-28 2004-06-24 Toshiba Lighting & Technology Corp LED lighting unit and LED lighting fixture
JP4757495B2 (en) * 2002-12-06 2011-08-24 クリー インコーポレイテッド Composite lead frame LED package and manufacturing method thereof
US7692206B2 (en) 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
JP2006509372A (en) * 2002-12-06 2006-03-16 クリー インコーポレイテッド Composite leadframe LED package and method of manufacturing the same This application is US Provisional Patent Application No. 60 / 431,523, filed December 6, 2002, entitled "Leadframe based LEDor semiconductor packaging package". Claims the benefit of filing date to the US Patent and Trademark Office.
WO2004068596A1 (en) * 2003-01-25 2004-08-12 Nam-Young Kim Lamp module with light emitting diode
US7114837B2 (en) 2003-04-08 2006-10-03 Koito Manufacturing Co., Ltd. Headlamp for vehicle
US8188488B2 (en) 2003-05-27 2012-05-29 Cree, Inc. Power surface mount light emitting die package
JP2005063754A (en) * 2003-08-08 2005-03-10 Mitsubishi Electric Corp head lamp
EP1670072A4 (en) * 2003-09-19 2007-12-12 Matsushita Electric Industrial Co Ltd LIGHTING DEVICE
TWI495143B (en) * 2003-10-22 2015-08-01 Cree Inc Power surface mount light-emitting die package
TWI392105B (en) * 2003-10-22 2013-04-01 Cree Inc Power surface mount light-emitting die package
JP2006120833A (en) * 2004-10-21 2006-05-11 Harvatek Corp Package structure of electro-optic semiconductor
WO2006090858A1 (en) * 2005-02-24 2006-08-31 Litehouse Technologies Corporation Light emitting device and light emitting object using the same
JP2006331817A (en) * 2005-05-25 2006-12-07 Matsushita Electric Works Ltd Light emitting device and luminaire using it
US8308331B2 (en) 2005-06-14 2012-11-13 Cree, Inc. LED backlighting for displays
JP2012230906A (en) * 2005-09-27 2012-11-22 Koninkl Philips Electronics Nv Led lighting fixture
US7607806B2 (en) 2005-10-05 2009-10-27 Ichikoh Industries, Ltd. Vehicle lamp
JP2007335420A (en) * 2006-03-03 2007-12-27 Matsushita Electric Works Ltd Lighting fixture
JP2007257951A (en) * 2006-03-22 2007-10-04 Honda Motor Co Ltd Vehicle lighting
WO2007126074A1 (en) 2006-04-28 2007-11-08 Shimane Prefectural Government Semiconductor light emitting module, device, and its manufacturing method
JP2008047385A (en) * 2006-08-14 2008-02-28 Ichikoh Ind Ltd Vehicle lighting
US8220916B2 (en) 2006-10-18 2012-07-17 Seiko Epson Corporation Light emitting device, method of manufacturing light emitting device, and ink jet recording apparatus
US8882257B2 (en) 2006-10-18 2014-11-11 Seiko Epson Corporation Light emitting device, method of manufacturing light emitting device, and ink jet recording apparatus
US7950796B2 (en) 2006-10-18 2011-05-31 Seiko Epson Corporation Light emitting device, method of manufacturing light emitting device, and ink jet recording apparatus
WO2008055422A1 (en) * 2006-11-10 2008-05-15 Shenzhen Gasun Energy Technology Co., Ltd. High-luminance led street lamp
JP2008130232A (en) * 2006-11-16 2008-06-05 Stanley Electric Co Ltd LED lights for vehicles
DE202006017583U1 (en) * 2006-11-17 2008-03-27 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH lighting device
US7868339B2 (en) 2006-11-17 2011-01-11 Osram Gesellschaft mit beschränkter Haftung Illuminating device
JP2008153080A (en) * 2006-12-18 2008-07-03 Ichikoh Ind Ltd Light emitting diode fixing structure
JP2008204692A (en) * 2007-02-19 2008-09-04 Toshiba Lighting & Technology Corp lighting equipment
JP2008210593A (en) * 2007-02-23 2008-09-11 Matsushita Electric Works Ltd Illuminating device
JP2008210655A (en) * 2007-02-27 2008-09-11 Iwasaki Electric Co Ltd Security light
KR100857058B1 (en) * 2007-08-13 2008-09-05 이영섭 Cooling structure of street light using light emitting diode
JP2009081092A (en) * 2007-09-27 2009-04-16 Toyoda Gosei Co Ltd Light source device
US7938561B2 (en) 2007-09-27 2011-05-10 Toyoda Gosei Co., Ltd. Light source unit
US7736016B2 (en) 2007-10-25 2010-06-15 Toyoda Gosei Co., Ltd. Light source unit
WO2009070951A1 (en) * 2007-12-03 2009-06-11 Cheng, Yi-Ju Led high-power street lamp structure
KR100993902B1 (en) 2008-01-31 2010-11-11 알티전자 주식회사 Light emitting diode package
JP2009205834A (en) * 2008-02-26 2009-09-10 Ichikoh Ind Ltd Lighting fixture for vehicle
JP2009231023A (en) * 2008-03-21 2009-10-08 Ccs Inc Light irradiating device
US8337062B2 (en) 2008-03-28 2012-12-25 Stanley Electric Co., Ltd. LED lighting unit and vehicle lamp
JP2009289749A (en) * 2008-05-28 2009-12-10 Osram Sylvania Inc Rear-mounted light emitting diode module for automobile rear combination lamp
JP4549437B2 (en) * 2008-06-10 2010-09-22 スワン電器株式会社 lighting equipment
CN102506334A (en) * 2008-06-10 2012-06-20 斯万电器株式会社 Illumination device
JPWO2009150711A1 (en) * 2008-06-10 2011-11-04 スワン電器株式会社 lighting equipment
CN102506334B (en) * 2008-06-10 2014-11-12 斯万电器株式会社 Illumination device
WO2009150711A1 (en) * 2008-06-10 2009-12-17 スワン電器株式会社 Lighting apparatus
JP5129329B2 (en) * 2008-07-07 2013-01-30 パナソニック株式会社 Light source for bulb-type lighting
EP2309168A4 (en) * 2008-07-07 2013-12-04 Panasonic Corp BULB TYPE LIGHTING SOURCE
US8337049B2 (en) 2008-07-07 2012-12-25 Panasonic Corporation Bulb-type lighting source
WO2010004702A1 (en) * 2008-07-07 2010-01-14 パナソニック株式会社 Bulb-type lighting source
JP2010049830A (en) * 2008-08-19 2010-03-04 Toyoda Gosei Co Ltd Led lighting apparatus
JP2010049951A (en) * 2008-08-22 2010-03-04 Eye Lighting Syst Corp Led illumination fixture
JP2008288221A (en) * 2008-08-22 2008-11-27 Koito Mfg Co Ltd Lighting fixture for vehicle
JP2010055938A (en) * 2008-08-28 2010-03-11 Toshiba Lighting & Technology Corp Lighting apparatus
JP2010125897A (en) * 2008-11-25 2010-06-10 Yamaha Motor Co Ltd Motorcycle
WO2010076435A1 (en) * 2008-12-31 2010-07-08 Finan Trading Company Lighting system with electroluminescent diodes
FR2940679A1 (en) * 2008-12-31 2010-07-02 Finan Trading Company ELECTROLUMINESCENT DIODE LIGHTING SYSTEM.
US8632210B2 (en) 2009-01-28 2014-01-21 Relume Technologies, Inc. LED engine of finned boxes for heat transfer
WO2010087877A1 (en) * 2009-01-28 2010-08-05 Relume Technologies, Inc. Led light engine with finned modules for heat transfer
JP2010182486A (en) * 2009-02-04 2010-08-19 Koito Mfg Co Ltd Lighting tool for vehicle
JP2012508404A (en) * 2009-02-09 2012-04-05 ホエジョウ・ライト・エンジン・リミテッド Light Emitting Diode Light Array on Mesh Platform
WO2010090314A1 (en) * 2009-02-09 2010-08-12 株式会社ケノス Led substrate mounting device
JP2010262846A (en) * 2009-05-08 2010-11-18 Mitsubishi Electric Corp lighting equipment
KR100954997B1 (en) 2009-05-19 2010-04-27 주식회사 케이디파워 Led illumination lamp
JP2011023194A (en) * 2009-07-15 2011-02-03 Jimbo Electric Co Ltd Led lighting system
US8998457B2 (en) 2009-09-25 2015-04-07 Toshiba Lighting & Technology Corporation Self-ballasted lamp and lighting equipment having a support portion in contact with an inner circumference of a base body
US8678618B2 (en) 2009-09-25 2014-03-25 Toshiba Lighting & Technology Corporation Self-ballasted lamp having a light-transmissive member in contact with light emitting elements and lighting equipment incorporating the same
JP2011076781A (en) * 2009-09-29 2011-04-14 Casio Computer Co Ltd Light source device, and projector
KR101094251B1 (en) * 2009-09-30 2011-12-19 허재원 LED module illuminated from all directions
JP2011119094A (en) * 2009-12-02 2011-06-16 Koito Mfg Co Ltd Lighting fixture for vehicle
WO2011077828A1 (en) * 2009-12-21 2011-06-30 シャープ株式会社 Lighting device
JP2011129452A (en) * 2009-12-21 2011-06-30 Sharp Corp Lighting device
WO2011099633A1 (en) * 2010-02-15 2011-08-18 矢崎総業株式会社 Backlight unit for vehicles and display device for vehicles
JP2011165624A (en) * 2010-02-15 2011-08-25 Yazaki Corp Vehicular backlight unit and vehicular display device
JP2011181248A (en) * 2010-02-26 2011-09-15 Toshiba Lighting & Technology Corp Bulb-shaped lamp and lighting fixture
US8500316B2 (en) 2010-02-26 2013-08-06 Toshiba Lighting & Technology Corporation Self-ballasted lamp and lighting equipment
CN102168817A (en) * 2010-02-26 2011-08-31 东芝照明技术株式会社 Bulb lamp and lighting equipment
JP2010153402A (en) * 2010-04-02 2010-07-08 Stanley Electric Co Ltd Lighting fixture
JP2011230751A (en) * 2010-04-09 2011-11-17 Lecip Holdings Corp Led lighting fixture
JP2011228042A (en) * 2010-04-16 2011-11-10 Panasonic Electric Works Co Ltd lighting equipment
JP2011243502A (en) * 2010-05-20 2011-12-01 Ichikoh Ind Ltd Vehicle lighting device
TWI449863B (en) * 2010-12-27 2014-08-21
JP2012182192A (en) * 2011-02-28 2012-09-20 Panasonic Corp LED unit and lighting apparatus using the same
TWI454637B (en) * 2011-03-07 2014-10-01
JP2012208205A (en) * 2011-03-29 2012-10-25 Casio Comput Co Ltd Semiconductor light source device and projector
CN102997084A (en) * 2011-09-16 2013-03-27 松下电器产业株式会社 LED unit and LED illuminating appliance using the same
JP2014063694A (en) * 2012-09-24 2014-04-10 Ichikoh Ind Ltd Vehicular headlamp
CN102943969A (en) * 2012-11-21 2013-02-27 深圳华瀚新能源材料有限公司 Light-emitting diode (LED) lamp using heat conduction high-polymer material for heat dissipation
JP2013077577A (en) * 2013-01-11 2013-04-25 Toshiba Lighting & Technology Corp Bulb type lamp and lighting fixture
JP2016507143A (en) * 2013-02-14 2016-03-07 チザラ リヒトシステーメ ゲーエムベーハーZizala Lichtsysteme GmbH Optical module for vehicle headlamps
JP2013165082A (en) * 2013-05-31 2013-08-22 Toshiba Lighting & Technology Corp Lighting device
US9590435B2 (en) 2015-02-05 2017-03-07 Hyundai Motor Company Battery charging status indicator for electric vehicle
CN105864703A (en) * 2015-02-05 2016-08-17 现代自动车株式会社 Battery charging status indicator for electric vehicle
CN105864703B (en) * 2015-02-05 2020-04-28 现代自动车株式会社 Battery state of charge indicator for electric vehicle
JP2017191648A (en) * 2016-04-11 2017-10-19 カルソニックカンセイ株式会社 LED lights
JP2017191647A (en) * 2016-04-11 2017-10-19 カルソニックカンセイ株式会社 Led lighting fixture
KR20220092171A (en) * 2020-12-24 2022-07-01 우리산업 주식회사 LED Photocatalyst Sterilizer for a Vehicle Seats
KR102567852B1 (en) * 2020-12-24 2023-08-17 우리산업 주식회사 LED Photocatalyst Sterilizer for a Vehicle Seats

Similar Documents

Publication Publication Date Title
JP2002093206A (en) LED signal light
JP4258321B2 (en) Vehicle lighting
JP5409217B2 (en) Vehicle lighting
US10634329B2 (en) Lamp unit and manufacturing method thereof
JP4662361B2 (en) Light source module
JP5805929B2 (en) Light source unit
JP4605789B2 (en) Light emitting module and vehicle lamp
JP2004006364A (en) Apparatus for supporting a light emitting diode for an automotive signaling system and a method of manufacturing this apparatus
JP2008016362A (en) Light emitting module and vehicle lamp
JP5537833B2 (en) lighting equipment
JP5320554B2 (en) Lamp apparatus and lighting apparatus
JP2007311760A (en) Led module
JP2015220034A (en) LED module and vehicle lamp provided with the same
JP2005109228A (en) LED device and LED lighting device
JP5479054B2 (en) Vehicle lighting
WO2022092256A1 (en) Vehicle lamp
US20250012421A1 (en) Vehicular lamp
JP2006253197A (en) Light irradiation module
JP2020047565A (en) Lamp fitting unit and vehicle lamp fitting
WO2022113948A1 (en) Vehicle lamp
CN116324269A (en) Vehicle Lamps
JP5409212B2 (en) Vehicle lighting
JP2004228529A (en) Heat radiating structure of heat radiating electronic component and lighting equipment using the same
JP2001044517A (en) Light emitting device
CN222363775U (en) LED headlights with ceramic light source panels

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20040415

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040420

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20041214