JP2002094166A - Light source device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To propose a light source device having excellent accuracy and being capable of positioning a laser diode chip. SOLUTION: In the light source device for an optical head device, projecting sections 8 for positioning the first and second laser diode chips are formed to the top face 700 of a sub-mount 7, and the projecting sections 8 for positioning have the rear-side side faces 81a, 822a and 83a of the first projecting section 81, the second projecting section 82 and the third projecting section 83 prescribing positions in the direction of the optical axes of laser beams L1 and L2 emitted from the first and second laser diode chips 61 and 62 and the left-right side faces 821a and 821b of the partitioning section 821 of the second projecting section 82 prescribing a position orthogonal in the direction of the optical axis. Accordingly, the positions in the direction of these optical axes and the position orthogonal in the direction of the optical axis and the spaces of each luminous point can be positioned accurately only by installing the first and second laser diode chips 61 and 62 to the projecting sections 8 for positioning of the sub-mount 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a light source device suitable for use as a light source of optical equipment utilizing laser light. More specifically, the present invention relates to a technique for positioning a laser diode chip in a light source device.

[0002]

2. Description of the Related Art Optical devices utilizing laser light include:
For example, there is an optical head device for reproducing different types of optical recording disks such as a CD and a DVD. In such an optical head device, a laser beam having a wavelength of 650 nm is required for reproducing a DVD, and a CD-R has a low reflectance in a wavelength band of 650 nm.
A laser beam of a wavelength is required.

Therefore, an optical head device for reproducing a DVD and reproducing and recording a CD-R has a wavelength of 65 nm.
There is known a so-called two-wavelength optical head device equipped with a light source device that emits a laser beam of 0 nm and a laser beam of a wavelength of 780 nm. A light source device used in such a two-wavelength optical head device is called a monolithic type in which two lasers are formed on one semiconductor chip, and a hybrid type in which two laser diode chips are mounted on one substrate. Things are known.

Here, it is necessary to accurately position the laser diode chip on the substrate. For this purpose, for example, in a hybrid type light source device, a passive alignment method in which each laser diode chip is mounted in accordance with a positioning mark on a base, or an active alignment method in which a laser diode chip is positioned while emitting light in an LED mode. Thus, the positioning of the two laser diode chips is performed.

As a method of positioning a laser diode chip, as disclosed in Japanese Patent Application Laid-Open No. 8-339570, a guide groove is previously carved in a substrate, and two laser diode chips are mounted in the guide groove. Therefore, an arrangement technique for precisely defining the interval between the two is known.

[0006]

Here, as the optical head device becomes thinner, it is necessary to increase the positioning accuracy of the laser diode chip of the light source device. For example,
The gap between the light emitting points of the two laser diodes is several μm
It is necessary to keep it below. In the hybrid type,
Since the mounting accuracy of a general-purpose mounting device is about ± 20 μm, the yield is deteriorated in the passive alignment method. In a mounting device that can be mounted with high precision,
Since the tact time for mounting components is significantly reduced, this affects the capital investment and productivity.

On the other hand, as described in the above-mentioned publication, a guide groove is preliminarily carved in the substrate, and two laser diode chips are mounted in the guide groove, so that the distance between the light emitting points can be precisely defined. However, there is a problem that the positioning accuracy in the optical axis direction cannot be improved.

[0008] In view of such problems, an object of the present invention is to propose a light source device capable of accurately positioning a laser diode chip.

[0009]

According to the present invention, there is provided a light source device having at least one laser diode chip and a semiconductor substrate on which the laser diode chip is mounted. A positioning projection for positioning the laser diode chip is formed on the surface.

Here, the positioning projection can be formed from a photosensitive resin laminated on the surface of the semiconductor substrate.

The typical positioning projection defines a first side surface that defines a position in the optical axis direction of laser light emitted from the laser diode chip, and a position in a direction perpendicular to the optical axis direction. In this case, the emission surface of the laser diode chip is pressed against the first side surface, and one side surface orthogonal to the emission surface of the laser diode chip is placed on the second side. By pressing against the side surface, the laser diode chip is positioned.

When a plurality of laser diode chips, for example, first and second laser diode chips are mounted, first and second positioning projections for positioning each of them are formed. good.

In this case, as a method of positioning the laser diode chip, the first laser diode chip is pressed against the first and second side surfaces of the first positioning projection to perform positioning. The second laser diode chip can be positioned by sliding the second laser diode chip along the first side surface while pressing the second laser diode chip against the first side surface. According to this method, the second laser diode chip can be positioned by adjusting only the one axial direction with reference to the first side surface, so that the adjustment of the light emitting point interval is simplified.

Next, in the light source device according to the present invention, a concave portion for laser light passage is engraved on the surface of the semiconductor substrate, and the concave portion for laser light passage is formed from the position of the first side surface in the positioning projection. It may be configured to extend in the emission direction of the laser light. According to this configuration, it is possible to prevent the laser light emitted at a predetermined divergence angle from being blocked (vignetting) by the surface of the semiconductor substrate.

[0015] Alternatively, the laser diode chip may be mounted with a spacer member interposed between the surfaces of the semiconductor substrate. In this configuration,
By arranging the laser diode chip at a higher position from the surface of the semiconductor substrate by the spacer member, it is possible to prevent the laser light emitted at a predetermined divergence angle from being blocked (vignetting) by the surface of the semiconductor substrate. it can.

Next, when a laser diode chip is mounted on a submount mounted on the surface of a semiconductor substrate, that is, the semiconductor substrate is composed of a first semiconductor substrate and a surface of the first semiconductor substrate. In the case where the second semiconductor substrate is stacked, the positioning projections may be formed on the surface of the second semiconductor substrate.

On the other hand, when positioning the optical element whose relative position to the laser diode chip is defined by using the positioning projection, the positioning projection is used to position the optical element. What is necessary is just to form a 3rd side surface.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an example of an optical head device equipped with a light source device according to the present invention will be described with reference to the drawings.

(Overall Structure) FIGS. 1A and 1B
It is a top view and a sectional view showing the optical head device of the present example.
The optical head device 1 is a two-wavelength optical head device that uses a laser beam having a wavelength of 650 nm and a laser beam having a wavelength of 780 nm to record and reproduce information on and from an optical recording medium 2 such as a CD or a DVD. It has a wiring board 3 made of metal such as iron or aluminum, on which various components are mounted. This wiring board 3 is supported by a frame 4. The frame 4 has a circular main shaft guide hole 41 formed at one side end thereof, and a U-shaped sub shaft guide groove 42 opened laterally at the other side end.

On the side of an information recording / reproducing device (not shown) on which the optical head device 1 is mounted, a main shaft 43 and a sub shaft 44 extending in parallel are arranged. The optical head device 1 has a main shaft 4
3 is mounted on the information recording / reproducing apparatus side in a state of being bridged between the main shaft 43 and the sub shaft 44 so that the main shaft 3 is passed through the main shaft guide hole 41 and the sub shaft 44 is passed through the sub shaft guide groove 42. You. Along these main shaft 43 and sub shaft 44,
The optical head device 1 can reciprocate in the radial direction of the optical recording medium 2.

A light source device 9 integrated with a laser and a light receiving element as shown in FIG. 2A is mounted on the surface of the wiring board 3 on the side of the sub-shaft guide groove 42. The light source device 9 includes a semiconductor substrate 10 laminated and adhered to the surface of the wiring substrate 3 with an adhesive such as an Ag paste, and the semiconductor substrate 10.
A submount 7 laminated and adhered to the surface of the submount 7, and a first and a second
Laser diode chips 61 and 62 are provided. The first laser diode chip 61 emits a laser beam having a wavelength of 650 nm, and the second laser diode chip 62
Emits a laser beam having a wavelength of 780 nm.

In the semiconductor substrate 10, a light receiving element 13 having a light receiving surface 13a for signal reproduction and a signal operation circuit are formed. A light receiving element 131 for laser monitoring is built in the submount 7. The bonding wire 1 is provided between the electrode terminal 14 formed on the light source device 9 side and the electrode terminal 15 formed on the surface of the wiring board 3.
6.

On the other hand, a magnetic objective lens driving mechanism 17 is mounted on the surface of the wiring board 3 on the side of the main shaft guide 41. The objective lens driving mechanism 17 includes a lens holder 19 that holds an objective lens 18, a support shaft 20 that supports the lens holder 19 movably in a tracking direction and a focusing direction, and a lens holder 1.
And a magnetic drive circuit for generating a magnetic force for moving the magnetic head 9 in the tracking direction and the focusing direction. The magnetic drive circuit includes magnets 23a, 23b, 23c, and 23d attached to upright portions 22a, 22b, 22c, and 22d formed on the bent yoke plate 22, and a drive coil (see FIG. Not shown). The objective lens driving mechanism of this configuration of the shaft sliding rotation type is known.

On the optical path from the laser diode chips 61, 62 to the objective lens 18, the first diffraction grating 25,
A second diffraction grating 26, a collimating lens 27, and a rising mirror 28 are arranged. First diffraction grating 25
Is the wavelength 7 emitted from the laser diode chip 62.
This is a wavelength-selective diffraction grating that divides only the 80 nm laser light into three beams, and the second diffraction grating 26 changes the optical path of the return light from the optical recording medium 2 and receives light via the total reflection mirror 29. It is a wavelength-selective hologram element for guiding to the light receiving surface 13a of the element 13. The rising mirror 28 reflects the emitted laser light collimated by the collimating lens 27 at a right angle and guides the emitted laser light to the objective lens 18.

Here, in this example, the light source device 9, the diffraction gratings 25 and 26, and the collimating lens 27 are mounted on the wiring board 3 by using a component holder 30 for holding these members in a positioned state. . As shown in FIG. 2B, the component holder 30 is a photosensitive glass frame in which a flat plate is cut out in a U-shape as a whole, and the light source device 9, the diffraction grating 25, There is provided an unevenness or a window for holding the collimator lens 26 and the collimator lens 27 at a predetermined position in a predetermined posture. Therefore, the light source device 9 and the diffraction grating 2
By simply mounting the components 5, 26 and the collimating lens 27 on the component holder 30, the alignment of the optical axes between these members and the position adjustment in the optical axis direction are automatically performed.

A cover 31 is attached to a part of the component holder 30 to which the light source device 9 is attached, and protects the light source device 9 in a sealed state. A total reflection mirror 29 is attached to the back surface of the cover 31.

In the optical head device configured as described above,
When information is reproduced from a DVD as the optical recording medium 2, the wavelength is set to 65
When a laser beam having a wavelength of 780 nm is emitted from the second laser diode chip 62 when information is recorded on a CD-R as the optical recording medium 2, a laser beam having a wavelength of 780 nm is emitted. Different types of optical recording media 2
Information reproduction, information recording, and the like.

(Positioning Mechanism of Light Source Device) FIG. 3 shows two laser diode chips 6 in the light source device 9 of this embodiment.
It is explanatory drawing for showing the positioning mechanism of 1 and 62. FIG. 4 is a process diagram showing a mounting process of the laser diode chips 61 and 62. FIG. 5 is a perspective view showing a submount wafer on which positioning projections are formed.

First, as shown in FIG. 3A, the first laser diode chip 61 has a substantially rectangular parallelepiped shape.
A front emission surface 612 where a first front emission point S1 for emitting the first laser light L1 is located, a rear emission surface 614 where a rear emission point is located, and left and right side surfaces 613 and 615.
And an upper surface 616 on which a P electrode is formed and a lower surface 611 on which an N electrode is formed. In the first laser diode chip 61, on the emission surface 612, the first front light emitting point S1 is located on the upper surface 616 side of the P electrode, and the arrangement is fixed with the P electrode on the upper side, so that the P side up. It is called. The monitor laser light is emitted backward from the rear emission surface 614.

Next, the second laser diode chip 62
Has a substantially rectangular parallelepiped shape smaller than the first laser diode chip, and has a front emission surface 622 where a second front emission point S2 for emitting the second laser light L2 is located, and a rear emission point. Rear emission surface 624, left and right side surfaces 623 and 625, and upper surface 626 on which a P electrode is formed
And a lower surface 621 on which an N electrode is formed. This second laser diode chip 62 also has a front emission surface 6.
At 22, the second front emission point S2 is located on the upper surface 6 of the P electrode.
It is located on the 26 side, and its arrangement is P side up with the P electrode arranged above. The monitor laser light is emitted backward from the rear emission surface 624.

On the upper surface 700 of the submount 7, first rectangular projections 8 formed by laminating resist materials are formed.
1, a T-shaped second convex portion 82, and a rectangular parallelepiped third convex portion 83 stand upright. These projections constitute a positioning projection 8 for positioning the first and second laser diode chips 61 and 62. A monitor light receiving element 131 is formed behind the first and second laser diode chips 61 and 62 on the upper surface 700 of the submount.

Referring also to FIG. 3B, the positioning projection 8
Will be described in more detail. The second projection 82 of the positioning projection 8 located at the center is formed by a lateral wall portion 822 extending left and right.
And a partition wall portion 821 extending rearward at a right angle from the center of the rear side surface 822a. This second projection 8
2 is provided on one side with a first projection 81 at a certain interval.
Are arranged, and the rear side surface 81a is
2 is located on the same plane as the rear side surface 822a. Similarly, the third convex portions 83 are also spaced apart from each other by a predetermined distance.
2, and the rear side surface 83a is also flush with the rear side surface 822a of the second projection 82.

Here, the partition part 821 of the second convex part 82
Left and right side surfaces 821a and 821b are perpendicular to the submount surface and parallel to each other, and define the position of the first and second laser diode chips 61 and 62 in the direction orthogonal to the optical axis. . Further, each of the projections 81, 8
The rear side surfaces 81a, 822a, and 83a of 2, 83 define the position of the laser diode chip in the optical axis direction.

Next, the mounting process of the first and second laser diode chips 61 and 62 will be described with reference to FIG. First, a submount wafer in which a plurality of submounts 7 are formed in a lattice shape is manufactured. A monitor light receiving element 131 is also built in each submount 7.

In step ST1, a photosensitive resist material is applied to a portion where the positioning projection 8 is to be formed.
As the resist material, a liquid or film material is used. In step ST2, the resist material is pre-baked, and then exposed and developed in steps ST3 and ST4, and then post-baked in step ST5.
As a result, as shown in FIG. 5, the submount 7 has the positioning projections 8, ie, the first projections 81, the second projections 82, and the third projections 83 formed thereon. 70 can be obtained. The positioning projection 8 is formed with the mask accuracy at the time of exposure, and has a thickness of several μm to 300 μm.
μm.

In step ST6, the sub-mount wafer 70 is firstly diced to have a size suitable for handling in the next step. In step ST7, a first laser diode chip (LD) is attached to each sub-mount 7.
1) 61 and a second laser diode chip (LD
2) The 62 is mounted at a position defined by the positioning projection 8 and positioned.

In step ST8, the AuSn film serving as a fusing agent formed on either the first laser diode chip (LD1) 61 and the second laser diode chip (LD2) 62 or the submount 7 is heated and hardened. Thereby, the first laser diode chip (L
D1) 61 and a second laser diode chip (LD
2) Fix 62 to submount 7.

Next, in step ST9, secondary dicing is performed to cut the submount 7 to a predetermined size.

(Effect of this embodiment) As described above,
In the light source device 9 of the optical head device of this example, the submount 7
Of the first laser diode chips 61 and 62 from a photosensitive resin by an exposure technique using a photomask.
The positioning projection 8 is provided with a first projection 81 that defines the position of the laser beams L1 and L2 emitted from the first and second laser diode chips 61 and 62 in the optical axis direction. , The rear side surfaces 81a, 822a, 83a of the second convex portion 82 and the third convex portion 83, and the right and left side surfaces 821a of the partitioning portion 821 of the second convex portion 82 defining a position orthogonal to the optical axis direction. , 821b. For this reason,
If the first and second laser diode chips 61 and 62 are mounted on the submount 7, the positions in the optical axis direction and the positions orthogonal to the optical axis direction, and the intervals between the light emitting points can be accurately positioned. Can be. Therefore, high-precision positioning can be performed at an assembly level in which the laser diode chips 61 and 62 are mounted on the submount 7 without using a high-precision mounting device.

When positioning the two laser diodes, the two laser diodes were positioned and fixed by the positioning projection 8 in the step ST7 shown in FIG. 4A, but as shown in FIG. 4B. As described above, in step ST71, first, the first laser diode 61 is positioned by the positioning projection 8, and in step ST72, the second laser diode 62 is mounted and the position is adjusted. And the second laser diode 62
May be determined.

That is, in step ST72, as shown in FIG. 6, in the submount 7 where the first laser diode 61 is positioned by the positioning projection 8,
The second laser diode 62 is held by the suction probe 90. In this state, the first and second laser diodes 61 and 62 are caused to emit light simultaneously in the LED mode, or the positions are adjusted while monitoring the respective positions with images using the alignment marks. At this time, the position adjustment is performed by the second projection 82 of the positioning projection 8,
This is performed by moving the second laser diode 62 in the uniaxial direction indicated by the arrow H while holding the second laser diode 62 along the reference surface defined by the rear side surfaces 822a and 83a of the third convex portion 83 with the suction probe 90. it can. Therefore, the adjustment of the interval between the light emitting points of the first and second laser diodes 61 and 62 can be performed by simple adjustment only in one axial direction.

(Modification of Light Source Device) FIGS. 7, 8, and 9
7 is a perspective view showing a modified example of each light source device.

In the above embodiment, the first and second laser diode chips 61 and 62 are fixed by P side up with the P electrode side up, but the heat generated from the light emitting point is efficiently radiated. Therefore, the P electrode can be fixed upside down with the P electrode surface facing the submount 7 and P side down.

As shown in FIGS. 7A and 7B, in the light source device 9A, the first and second laser diode chips 61 and 62 are fixed by P side down.
The first and second front emission points S1 and S2 are located on the submount 7A side.

On the surface 701 of the submount 7A, the first
And a first projection 81, a second projection 82, and a third projection 83 forming the positioning projection 8 for positioning the second laser diode chips 61 and 62, and the rear side surface is formed. Laser light passing recesses 711 and 712 are formed by etching or dicing from the positions of 81a, 822a and 83a.

In the light source device 9A formed as described above, since the first and second concave portions 711 and 712 for passing the laser beam are formed, the first side fixed down by the P side down.
In addition, it is possible to prevent the laser beams L1 and L2 emitted from the second laser diode chips 61 and 62 at a predetermined divergence angle from being blocked by the surface 701 of the submount 7 (vignetting). In addition, the positioning projection 8 allows the first and second laser diode chips 61 and 62 to be positioned.

On the other hand, instead of forming the concave portions 711 and 712 for passing the laser beam on the surface of the semiconductor substrate 10, the first and second laser diode chips 61 and 62 are P-side down by using a spacer member. It can also be fixed. In addition, the laser diode chips 61 and 6
2 is a light receiving element 1 instead of being mounted on the submount 7A.
3 and the signal operation circuit can be directly mounted on the semiconductor substrate 10.

As shown in FIGS. 8A and 8B, in the light source device 9B, the semiconductor substrate 10 on which the light receiving element 13 is formed is formed.
A shows the first and second laser diode chips 61,
62 is fixed at the P side down, and the first and second
Are located on the semiconductor substrate 10A side.

The first surface 101 of the semiconductor substrate 10A
In addition, a positioning projection 8 for positioning the second laser diode chips 61 and 62 is formed. The first and second laser diode chips 61 and 62 are mounted on the positioning projection 8 with spacer members 91 and 92 formed of metal or semiconductor therebetween.
The spacer members 91 and 92 are formed narrower than the widths of the first and second laser diode chips 61 and 62,
Each front emission surface 611, 621 and side surface 61
3, 615, 623, and 625. Therefore, the first and second laser diode chips 61 and 62 are arranged at a position higher than the surface 101 of the semiconductor substrate 10A by the spacer members 91 and 92 while being positioned by the positioning projections 8. Laser light emitted at a predetermined divergence angle can be prevented from being blocked (vignetted) by the surface of the semiconductor substrate.

Further, since the light receiving element 13 is formed on the surface 101 of the semiconductor substrate 10A, the first and second laser diodes 61 and 62 are positioned by the positioning projection 8 so that the first and second laser diodes 61 and 62 are positioned. The positioning of the second laser diodes 61 and 62 and the light receiving element 13 can be performed.

[Other Embodiments] Here, for example, the first laser light and the second laser light are shared by using a polarizing beam splitter made of a prism composite as disclosed in Japanese Patent Application Laid-Open No. 10-149559. The positioning mechanism of the present invention can also be applied to a light source device of an optical system configured to guide the light to the optical path.

In this case, as shown in FIG. 9A, the light source device 9D includes a first submount 71 on which a first laser diode chip 61 is mounted on a surface 702 of a semiconductor substrate 7C, and a second A second sub-mount 72 on which the laser diode chip 62 is mounted, and a prism composite polarization beam splitter 280 that reflects the first laser light L1 and transmits the second laser light L2 to guide it to a common optical path. And a positioning projection 84.

As shown in FIG. 9B, the semiconductor substrate 7C
The positioning projections 84 formed on the surface 702 of the second submount 7 are respectively provided with a first positioning portion 841 for positioning the L-shaped first submount 71 and a second submount 7.
2 and a third positioning portion 843 for positioning the polarization beam splitter 280. Therefore, the first
And by mounting the second submounts 71 and 72 and the polarization beam splitter 280 on the semiconductor substrate 7C,
First and second laser diode chips 61, 62,
Positioning between the polarizing beam splitters 280 can be performed.

Further, as shown in FIG. 9C, after positioning the polarizing beam splitter 280 and the first submount 71, the second submount 72 is held by the suction probe 90, and the positioning projection is formed. If the unit 84 is moved in one axis direction while being pressed against the reference surface of the second positioning unit 842 in the direction of the emission surface, the positioning adjustment can be easily performed.

The above example is for a light source device of an optical head device for recording and reproducing CDs and DVDs, but other optical devices, for example, a laser diode chip and an optical fiber are accurately positioned. Needless to say, the present invention can be applied to a light source device such as an optical communication module that needs to be performed.

[0056]

As described above, in the light source device of the present invention, the positioning projection for positioning the laser diode chip is formed on the surface of the semiconductor substrate. Such a configuration includes a side surface that defines a position in the optical axis direction of the laser light emitted from the laser diode chip, and a side surface that defines a position orthogonal to the optical axis direction.

Therefore, when the laser diode chip is pressed against the positioning projection, the position in the optical axis direction and the position orthogonal to the optical axis direction can be accurately positioned, and the light emitting point interval between the plurality of laser diodes can be accurately determined. Can be positioned.

Therefore, without using a high-precision mounting device,
The laser diode chip can be positioned with high accuracy by a simple operation.

[Brief description of the drawings]

FIGS. 1A and 1B are a plan view and a cross-sectional view showing an example of an optical head device on which a light source device to which the present invention is applied is mounted.

FIGS. 2A and 2B are a plan view of the light source device shown in FIG. 1 and a perspective view showing an optical component mounted on a component holder.

FIGS. 3A and 3B are a perspective view and a plan view showing a positioning mechanism of first and second laser diode chips in the light source device shown in FIG.

FIG. 4 is a process diagram showing a mounting process of first and second laser diode chips.

FIG. 5 is a perspective view showing a submount wafer on which positioning protrusions are formed.

FIG. 6 is a perspective view showing adjustment of a light emitting point interval of first and second laser diode chips in the light source device shown in FIG. 1;

FIGS. 7A and 7B are a perspective view and a plan view showing a modification of the light source device shown in FIG.

8A and 8B are a perspective view and a plan view showing another modified example of the light source device shown in FIG.

FIGS. 9A, 9B, and 9C are a perspective view, a plan view, and an explanatory view showing another example of the light source device.

[Explanation of symbols]

 Reference Signs List 1 optical head device 2 optical recording medium 3 wiring substrate 7 submount 8 positioning projection 9 light source device 10 semiconductor substrate 13 light receiving element 17 objective lens driving mechanism 18 objective lens 19 lens holder 20 support shaft 22 bending yoke 25, 26 diffraction grating 27 Collimating lens 28 Stand-up mirror 29 Total reflection mirror 30 Parts holder 61 First laser diode chip 62 Second laser diode chip 70 Submount wafer 81 First convex part 82 Second convex part 83 Third convex part 90 Suction probe 131 Monitor light receiving element 611, 621 Lower surface 612, 622 Front emission surface 614, 624 Rear emission surface 613, 615, 623, 625 Side surface 616, 626, 700 Upper surface 821 Partition wall portion 822 Side wall portion 81a, 822a, 83a Rear side 21a, 821b side L1 first laser beam L2 second laser light S1 first forward emission point S2 second forward light emitting point

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masao Takemura 10801 Hara-mura, Suwa-gun, Nagano F-term in Sukyo Minami Plant of Sankyo Seiki Seisakusho Co., Ltd. 5D119 AA39 AA41 BA01 FA05 FA08 FA34 PA04 5F073 AB06 AB15 AB21 AB25 AB27 AB29 BA05 FA02 FA13 FA16 FA22 FA23

Claims (9)

[Claims] 1. A light source device having at least one laser diode chip and a semiconductor substrate on which the laser diode chip is mounted, wherein a positioning projection for positioning the laser diode chip is provided on a surface of the semiconductor substrate. A light source device, characterized in that a part is formed. 2. The light source device according to claim 1, wherein the positioning projection is formed of a photosensitive resin laminated on the surface of the semiconductor substrate. 3. The first positioning device according to claim 1, wherein the positioning projection defines a position of a laser beam emitted from the laser diode chip in an optical axis direction.
And a second side surface that defines a position in a direction orthogonal to the optical axis direction. An emission surface of the laser diode chip is pressed against the first side surface, and an emission surface of the laser diode chip is provided. A light source device, wherein the laser diode chip is positioned by pressing one side surface perpendicular to the second side surface to the second side surface. 4. The laser diode chip according to claim 3, wherein the laser diode chip includes first and second laser diode chips, and the positioning projection has first and second laser diodes for positioning the first and second laser diodes. A light source device comprising a second positioning projection. 5. The laser light passage recess according to claim 1, wherein a laser light passage recess is formed in the surface of the semiconductor substrate. Wherein the light source device extends from the position of the first side surface in the emission direction of the laser light. 6. The light source device according to claim 1, wherein the laser diode chip is mounted on a spacer member mounted on a surface of the semiconductor substrate. 7. The semiconductor substrate according to claim 1, wherein the semiconductor substrate includes a first semiconductor substrate, and a second semiconductor substrate stacked and disposed on a surface of the first semiconductor substrate. A light source device, wherein the positioning projection is formed on a surface of the second semiconductor substrate. 8. The positioning projection according to claim 1, wherein the positioning projection has a third side surface for positioning an optical element whose relative position with respect to the laser diode chip is defined. A light source device comprising: a light source; 9. The laser diode chip positioning method for a light source device according to claim 4, wherein the first laser diode chip is pressed against the first and second side surfaces of the first positioning projection. In this state, the second laser diode chip is slid along the first side surface while pressing the second laser diode chip against the first side surface, thereby positioning the second laser diode chip. A method for positioning a laser diode chip of a light source device.