JP2002141405A - Substrate transfer device - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To prevent particles from adhering, to prevent the substrate from being damaged, and to accurately set the position where the substrate is placed in a horizontal state. SOLUTION: A base of a U-shaped flat plate member 2 is fixed at a predetermined position of a hand main body 1, and a fixed engaging member 3 is provided at two front ends of the flat plate member 2 and a movable engaging member 4 is provided at the base. The inclined surface member 5 and the auxiliary engagement member 6 are provided in this order at symmetric positions with respect to the movable engagement member 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer apparatus, and more particularly, to a substrate transfer apparatus that holds a peripheral portion of a substrate at a plurality of positions and transfers the substrate in this state.

[0002]

2. Description of the Related Art Conventionally, as a substrate transfer device for transferring a substrate such as a semiconductor wafer, (1) a device having a suction hand for suctioning a back surface of a substrate, and (2) a plurality of engagements having a V-shaped groove. One having a chuck hand that grips the peripheral portion of the substrate at a plurality of positions using members. (3) A plurality of engaging members having a V-shaped groove in this state are temporarily supported on the back surface of the substrate by support pins. Having a chuck hand for gripping the peripheral portion of a substrate at a plurality of positions (Japanese Patent Laid-Open No.
No. 0-209243), and (4) a plurality of grooves each having a V-shaped groove and having a longer lower projection of a pair of projections for forming the V-shaped groove. (See Japanese Patent Laid-Open No. 2000-683), which temporarily supports the substrate with a long projection using the above-mentioned engaging member, and then grips the peripheral edge of the substrate at a plurality of locations with a V-shaped groove.
No. 52) has been proposed.

[0003] Regardless of the structure of the substrate transfer apparatus employed, the substrate can be reliably held, and the substrate can be transferred to a desired position in this state.

[0004]

In the case of adopting the substrate transfer device having the above-mentioned constitutions (1) and (3), the back surface of the substrate comes into contact with the suction hand or the support pin. As a result, there is a disadvantage that particles adhere to the substrate. This disadvantage is remarkable when a semiconductor wafer that requires high cleanliness is used as the substrate.

When the substrate transfer device having the above configuration (2) is employed, it is possible to prevent the particles from adhering because only the peripheral portion of the substrate is gripped. When the support position of the substrate and the position of the V-shaped groove of the chuck hand coincide with each other, as shown by a two-dot chain line in FIG. Can be given and received. However, when the position of the V-shaped groove of the chuck hand is lower than the supporting position of the substrate, as shown by the solid line in FIG. 19, the substrate may be pressed downward when transferring the substrate. And there is a disadvantage that an extra external force is applied to the substrate. When a semiconductor wafer is used as the substrate, the semiconductor wafer will be damaged in the worst case.

In the case of employing the substrate transfer device having the structure (4), when the substrate in the horizontal state is gripped by the chuck hand, there is an error in the position in the horizontal plane as shown by a solid line in FIG. In this case, there is a possibility that the V-shaped grooves of all the engaging members cannot be simultaneously engaged with the peripheral portion of the substrate when clamping (gripping) by the engaging members. As a result, the substrate bites into the previously formed V-shaped groove, and if a semiconductor wafer is employed as the substrate, the semiconductor wafer may be damaged.

Further, when the substrate is transported by using the substrate transporting apparatus having the configuration (4) and the substrate is placed in a state of standing upright, as shown in FIG. When the V-shaped groove of the joining member and the V-shaped groove of the receiving member for receiving the substrate are displaced in a direction orthogonal to the surface of the substrate, due to this deviation, the solid line in FIG. The substrate is deflected as shown by. As a result, when a semiconductor wafer is used as the substrate, the semiconductor wafer may be damaged.

Further, when the substrate is transported by using the substrate transporting device having the configuration (4) and the substrate is placed in a horizontal state, the engaging member is moved in a direction away from the center of the substrate. Since the gripping of the substrate is released, there is a possibility that the substrate may move as shown by a solid line in FIG. 22, and there is no guarantee that the substrate will necessarily move. There is an inconvenience that you cannot do it.

Further, when the substrate transfer device having the structure (4) is employed, the peripheral portion of the substrate is engaged with the V-shaped groove as shown in FIGS. The longer the protrusions slide, the longer the possibility of the particles adhering to the substrate. In addition, B is a margin distance for displacement of the substrate.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is possible to prevent particles from adhering, prevent the substrate from being damaged, and keep the substrate in a horizontal state. It is an object of the present invention to provide a substrate transfer device capable of accurately setting a placement position.

[0011]

According to a first aspect of the present invention, there is provided a substrate transport apparatus for gripping a peripheral portion of a substrate at a plurality of locations and transporting the substrate in this state. At least one fixed engagement member provided at a predetermined position and having a V-shaped groove engageable with a peripheral portion of the substrate;
At least one movable member which is provided at another predetermined position of the flat plate member, has a V-shaped groove which can be engaged with a peripheral portion of the substrate, and is configured to be able to reciprocate substantially toward the center of the gripped substrate. The engaging member and the flat plate member are provided at other predetermined positions, and are configured to be able to reciprocate substantially toward the center of the substrate gripped to engage with a predetermined position close to the engaging position by the movable engaging member. And an auxiliary engagement member having an engagement surface substantially orthogonal to the peripheral edge of the substrate, and a drive unit for operating the movable engagement member and the auxiliary engagement member independently of each other.

However, the sum of the number of fixed engagement members and the number of movable engagement members is set to 3 or more in order to stably hold the substrate when the V-shaped groove is straight. Preferably. However, when the V-shaped groove is formed in a curved shape along the peripheral portion of the substrate, even if both the number of the fixed engagement members and the number of the movable engagement members are set to 1, Can be stably gripped. .

According to a second aspect of the present invention, in the substrate transfer apparatus, the flat plate member is provided at a predetermined position close to the fixed engaging member and the movable engaging member, and gradually lowers toward substantially the center of the gripped substrate. It further includes an inclined surface member having a tapered surface.

According to a third aspect of the present invention, the auxiliary engaging member is provided at predetermined positions symmetrical to each other with respect to the movable engaging member.

According to a fourth aspect of the present invention, in the substrate transfer apparatus, the auxiliary engagement member is provided at a predetermined position close to one side with respect to the movable engagement member.

According to a fifth aspect of the present invention, the inclined surface member employs a member fixed at a predetermined position on a flat plate member.

According to a sixth aspect of the present invention, as the substrate transfer device, the inclined surface member is configured to operate following the operation of the movable engagement member.

According to a seventh aspect of the present invention, there is provided a substrate transfer apparatus having a plurality of the flat plate members and arranging the flat plate members at predetermined intervals in a thickness direction.

According to a eighth aspect of the present invention, in the substrate transfer apparatus, all the movable engaging members are simultaneously operated as the driving unit.
One that simultaneously operates all the auxiliary engagement members is employed.

[0020]

According to the substrate transfer apparatus of the first aspect, the peripheral portion of the substrate is gripped at a plurality of positions, and the substrate is transported in this state. At least one fixed engaging member having a V-shaped groove capable of engaging with the substrate, and having a V-shaped groove provided at another predetermined position and capable of engaging with the peripheral portion of the substrate, and being gripped. The peripheral edge of the substrate can be gripped by at least one movable engagement member configured to be able to reciprocate substantially toward the center of the substrate, so that the front and back surfaces of the substrate can be kept in a non-contact state. Thus, the adhesion of particles can be prevented or significantly suppressed. And it is provided at another predetermined position of the flat plate member, and is configured to be able to reciprocate toward a substantially center of the substrate gripped to engage with a predetermined position close to the engagement position by the movable engagement member,
In addition, an auxiliary engagement member having an engagement surface substantially perpendicular to the peripheral edge of the substrate can correct the displacement of the substrate in a horizontal state, and eliminates the influence of the displacement when the substrate is placed in a vertical state. can do.

Accordingly, it is possible to prevent particles from adhering, to prevent the substrate from being damaged, and to accurately set the position where the substrate is placed in a horizontal state.

According to the second aspect of the present invention, the flat plate member is provided at a predetermined position close to the fixed engaging member and the movable engaging member, and gradually moves toward the substantially center of the gripped substrate. Since it further includes an inclined surface member having a tapered surface that becomes lower, in addition to the effect of claim 1, it is possible to support only the peripheral portion of the substrate by the inclined surface member before gripping by the engaging member, and thus, the particle Adhesion can be more reliably prevented.

According to the third aspect of the present invention, the auxiliary engaging member is provided at a predetermined position symmetrical to each other with respect to the movable engaging member.
It is possible to reliably eliminate the positional shift regardless of the shift of the substrate in the horizontal state.

According to the fourth aspect of the present invention, the auxiliary engaging member is provided at a predetermined position close to one side with respect to the movable engaging member. By minimizing the complexity of the configuration, it is possible to reliably eliminate the displacement regardless of the displacement of the substrate in the horizontal state.

According to the fifth aspect of the present invention, since the inclined surface member which is fixed to a predetermined position of the flat plate member is adopted as the inclined surface member, in addition to the effect of the second aspect, the peripheral edge of the substrate is also provided. Generation of particles can be suppressed by reducing the sliding range.

According to the sixth aspect of the present invention, the inclined surface member is configured to operate following the operation of the movable engagement member. Can be achieved.

In the substrate transfer apparatus according to the seventh aspect, since the plurality of flat members are provided and these flat members are arranged at predetermined intervals in the thickness direction, any one of the first to sixth aspects is preferred. In addition to the above operation, a plurality of substrates can be transferred at the same time.

According to the substrate transfer apparatus of the present invention, the drive unit is configured to operate all the movable engagement members simultaneously and simultaneously operate all the auxiliary engagement members. In addition to the operation of item 7, the control can be simplified and the configuration can be simplified.

[0029]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a substrate transfer apparatus according to an embodiment of the present invention.

FIG. 1 is a perspective view showing a main part (chuck hand) of an embodiment of the substrate transfer apparatus of the present invention, and FIG. 2 is a perspective view showing a state of supporting a substrate to be transferred. The chuck hand is moved by a conventionally known industrial robot or the like, and the posture is changed as necessary.

In this chuck hand, a base of a U-shaped flat plate member 2 is fixed to a predetermined position of a hand main body 1, a fixed engaging member 3 is fixed to two distal ends of the flat plate member 2, and a movable engagement is formed to the base. A member 4 is provided. The inclined surface member 5 and the auxiliary engagement member 6 are provided in this order at symmetrical positions with respect to the movable engagement member 4.

The flat plate member 2 includes a substrate 7 to be conveyed.
And the thickness is set as thin as possible. Of course, the planar shape is set to a size suitable for holding a substrate (for example, a semiconductor wafer) 7 to be transferred.

The fixed engaging member 3 is a member fixed to the front end of the flat plate member 2, and extends in parallel with the flat plate member 2 so that it can be engaged only with the peripheral edge of the substrate 7 to be conveyed. In addition to the groove 3a, the protrusion 3b on the plate member side is formed longer than the groove 3a and longer than the other protrusion 3c. In addition, the groove 3a is the substrate 7 to be transferred.
The direction of the fixed engagement member 3 is set so as to face the tangential direction of the peripheral portion.

The movable engagement member 4 is a member provided so as to be able to advance and retreat in the radial direction of the substrate 7 to be conveyed by a conventionally known driving mechanism (not shown), and has a V-shape extending parallel to the flat plate member 2. Having a groove 4a,
Are formed to have the same length. The direction of the movable engagement member 4 is set such that the groove 4a faces the tangential direction of the peripheral portion of the substrate 7 to be transported.

The inclined surface member 5 is a member extending in parallel with the moving direction of the movable engagement member 4, and the upper surface thereof is inclined so that the side closer to the center of the substrate 7 to be conveyed approaches the flat plate member 2. A fixed position and a long position so that the movable engagement member 4 can be engaged with the peripheral edge of the substrate 7 to support the substrate 7 even when the movable engagement member 4 is moved away from the center of the substrate 7 to be transported. Is set.

The auxiliary engaging member 6 is a member provided so as to be able to advance and retreat in a direction parallel to the moving direction of the movable engaging member 4 by a conventionally known driving mechanism (not shown).
Has a plane engaging surface 6a extending in a direction orthogonal to the upper surface of the first surface.

A drive mechanism (not shown) is provided so that the movable engagement member 4 and the auxiliary engagement member 6 can be moved forward and backward independently of each other.

The operation of the chuck hand having the above configuration is as follows.

When the substrate 7 supported in a horizontal state is lifted and gripped by the chuck hand, first, the chuck hand is moved below the substrate 7,
By raising the chuck hand as it is, the peripheral edge of the substrate 7 is supported by the projection 3 b of the fixed engagement member 3 and the inclined surface member 5.

The movable engagement member 4 is moved (moved forward) toward the center of the substrate 7 so that the V-shaped groove 3a of the fixed engagement member 3 and the V-shaped The movable engagement member 4 is further moved forward by engaging the movable engagement member 4 with the groove 4a so that the periphery of the substrate 7
It can be gripped by the V-shaped groove 4a of the movable engagement member 4 and the V-shaped groove 3a. In this state, the substrate 7 is separated from the inclined surface member 5.

By performing the operation reverse to the above, the substrate 7 can be supported at a predetermined position in a horizontal state apart from the chuck hand.

Further description will be given.

In the following, a case where both the number of the inclined surface members 5 and the number of the auxiliary engagement members 6 are set to 1 will be described. Further, the protrusion 3b of the fixed engagement member 3
Is set short, and an inclined surface member 5 is provided corresponding to each fixed engagement member 3.

When gripping a substrate supported horizontally at a predetermined position such as a cassette, first, FIG.
As shown in FIG. 7, only the peripheral portion of the substrate 7 is supported by the three inclined surface members 5.

Next, as shown in FIGS. 5 and 6, by moving only the auxiliary engagement member 6 forward, the peripheral portion of the substrate 7 is engaged with the V-shaped groove 3a of the fixed engagement member 3. .

In performing this operation, there is a possibility that the position of the substrate 7 in the horizontal plane is shifted as shown by a solid line in FIG. 7 (the substrate 7 is normally gripped by the fixed engagement member 3 and the movable engagement member 4). There is a possibility that the position of the substrate before gripping is shifted from the position of the substrate).

However, by operating the auxiliary engaging member 6 to apply a pressing force to the substrate 7, the solid line → the alternate long and short dash line →
As shown by the two-dot chain line, the displacement of the substrate 7 can be eliminated.

Therefore, an excessive force acts on a local portion of the substrate 7 due to the forward movement of the movable engagement member 4 in a state where there is a displacement, and the substrate 7 is damaged due to this force. It is possible to prevent inconvenience that there is a possibility.

Thereafter, by moving the movable engaging member 4 forward, as shown in FIGS. 8 and 9, the peripheral edge of the substrate 7 is moved to the V-shaped groove 3a of the fixed engaging member 3 and the movable engaging member. 4 can be gripped by the V-shaped groove 4a.

When the peripheral edge of the substrate 7 is engaged with the grooves 3a, 4a in this manner, the relative movement of the grooves 3a, 4a and the inclined surface member 5 allows the peripheral edge of the substrate 7 to move. Since the sliding distance of the part is the distance from the engagement with the protruding parts of the grooves 3a, 4a to the engagement with the innermost part, the sliding distance can be greatly reduced as compared with the conventional device. The possibility of particle adhesion can be greatly reduced. (A) in FIG. 10A showing the state before clamping, (B) in FIG. 10 showing the state after clamping, and A ′ in FIG. 10 (B). , And FIG.

Therefore, in this gripping state, the chuck hand can be arbitrarily changed in posture and conveyed to an arbitrary position.

The substrate 7 in the horizontal state is directly transferred to the substrate support 8.
In order to release the engagement with the substrate 7 immediately by moving the movable engagement member 4 backward, the substrate 7 may be displaced depending on the frictional resistance between the substrate 7 and the movable engagement member 4. It may move following the movable engagement member 4 and cause a position error.

However, as shown in FIG. 11A, the movable engagement member 4 is moved in a state where the auxiliary engagement member 6 is moved forward.
Is moved back, and then the auxiliary engagement member 6 is moved back, so that the grip of the substrate 7 can be released without causing a positional shift of the substrate 7. Next, the substrate 7 is pressed against the positioning member 8a by moving the chuck hand in the horizontal direction to release the engagement with the fixed engagement member 3 (FIG. 1).
Then, the substrate 7 can be supplied to the substrate support 8 by lowering the chuck hand (see FIG. 14).

When the substrate 7 in the vertical state is supplied to the substrate supporting portion 9 as it is, the posture of the chuck hand is controlled so that the movable engaging portion 4 is located below the substrate 7, and the substrate supporting portion 9 is controlled. Move to just above 9. In this state, there is no guarantee that the V-shaped groove 9a of the substrate support 9 and the peripheral edge of the substrate 7 face each other without error.

However, as shown in FIG. 15A, the movable engaging member 4 is moved backward, and the auxiliary engaging member 6 is moved forward to hold the substrate 7, and the chuck hand is held in this state. Is lowered to engage the substrate 7 with the V-shaped groove 9 a of the substrate support 9, so that the substrate 7 can be connected to the V-shaped groove of the substrate support 9 without locally distorting the substrate 7. (See (B) in FIG. 15). Thereafter, the engagement between the fixed engagement member 3 and the substrate 7 is released, and the chuck hand can be pulled out by moving the chuck hand in the horizontal direction and then moving it downward. {C in FIG. reference}.

When the substrate 7 in the vertical state is taken out from the substrate supporting portion 9 by the chuck hand, the posture of the chuck hand is controlled so that the movable engaging portion 4 is positioned below the substrate 7, and the chuck hand is moved to the substrate position. Move to the position corresponding to 7. In this state, there is no guarantee that the V-shaped groove 4a of the movable engagement member 4 and the peripheral edge of the substrate 7 face each other without error.

However, as shown in FIG. 16A, the fixed engaging member 3 and the substrate 7 are engaged, and in this state, the auxiliary engaging member 6 is moved forward to engage with the substrate 7. Then, the substrate 7 is gripped {see FIG. 16 (B)}.
The substrate 7 can be taken out by raising the chuck hand (see (C) in FIG. 16). Although not shown, the substrate 7 can be gripped by the movable engagement member 4 and the fixed engagement member 3 by moving the movable engagement member 4 forward.

When the operations shown in FIGS. 15 and 16 are performed, even if the positions of the V-shaped groove 4a of the movable engagement member 4 and the V-shaped groove 9a of the substrate support 9 are shifted. Since the substrate 7 is not directly exchanged between the groove 4a and the groove 9a, but is engaged by the auxiliary engaging member 6, the substrate 7 is moved by a distance corresponding to a positional error between the grooves. 7 can be moved smoothly with the peripheral edge of the substrate 7 still engaged with the auxiliary engagement member 6, and the peripheral edge of the substrate 7 can be moved between the groove 4a and the groove 9a without giving local distortion. Can be sent and received.

As a result, the substrate 7 can be gripped and released in a state in which adhesion of particles is significantly reduced, and the substrate 7 can be delivered and received without local distortion. Can be set accurately.

FIG. 17 is a perspective view showing a main part (chuck hand) of another embodiment of the substrate transfer apparatus of the present invention, and FIG.
FIG. 3 is a perspective view showing a state of supporting a substrate to be transferred.

This chuck hand is different from the chuck hand of FIG. 1 in that four flat plate members 2 are provided at predetermined positions of a hand body 1 at predetermined intervals in the thickness direction, and provided on each flat plate member 2. The only difference is that the numbers of the inclined surface members 5 and the auxiliary engagement members 6 are both set to one.

In this case, a driving source for driving the movable engaging member 4 and a driving source for driving the auxiliary engaging member 6 may be provided for each flat plate member. It is preferable to provide a drive source so as to operate simultaneously and to provide a drive source so as to operate all the auxiliary engagement members 6 simultaneously, so that the configuration can be simplified.

When this embodiment is adopted, four substrates 7 can be transported at a time, and the same operation as that of the embodiment of FIG. 1 can be achieved for each substrate 7.

The number of the plate members 2 can be arbitrarily set.

[0065]

According to the first aspect of the present invention, it is possible to prevent particles from adhering, prevent the substrate from being damaged, and accurately set the position where the substrate is placed in a horizontal state. It has the unique effect of being able to.

According to the second aspect of the present invention, in addition to the effect of the first aspect, only the peripheral portion of the substrate can be supported by the inclined surface member before being gripped by the engaging member, and thus the adhesion of particles can be more reliably prevented. It has a specific effect that it can be performed.

The third aspect of the present invention has a unique effect that the positional deviation can be surely eliminated irrespective of the displacement of the substrate in the horizontal state, in addition to the effect of the first aspect.

According to a fourth aspect of the present invention, in addition to the effect of the first aspect, it is possible to minimize the complication of the configuration and to surely eliminate the positional shift regardless of the shift of the substrate in the horizontal state. Has a unique effect.

According to the fifth aspect of the invention, in addition to the effect of the second aspect, it is possible to reduce the range in which the peripheral edge of the substrate slides, thereby suppressing the generation of particles.

The sixth aspect of the invention has the same effect as the second aspect.

The invention of claim 7 is the invention of claims 1 to 6
In addition to any one of the above effects, a unique effect that a plurality of substrates can be transferred at the same time is achieved.

According to the invention of claim 8, in addition to the effect of claim 7, there is a special effect that the control can be simplified and the configuration can be simplified.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main part (a chuck hand) of an embodiment of a substrate transfer apparatus according to the present invention.

FIG. 2 is a perspective view showing a state of supporting a substrate to be transferred.

FIG. 3 is a schematic plan view illustrating substrate reception in a horizontal state.

FIG. 4 is a schematic side view of the same.

FIG. 5 is a schematic plan view showing a state in which a substrate in a horizontal state is pressed by an auxiliary engagement member.

FIG. 6 is a schematic side view of the same.

FIG. 7 is a schematic plan view illustrating correction of a displacement of a substrate in a horizontal plane.

FIG. 8 is a schematic plan view showing a state in which the substrate and the movable engagement member in a horizontal state are engaged.

FIG. 9 is a schematic side view of the above.

FIG. 10 is a schematic side view illustrating a reduction in a sliding distance of a substrate with respect to a V-shaped groove.

FIG. 11 is a schematic side view illustrating release of gripping of a substrate in a horizontal state.

FIG. 12 is a schematic plan view illustrating positioning of a substrate in a horizontal state where gripping is released.

FIG. 13 is a schematic side view of the above.

FIG. 14 is a schematic side view illustrating supply to a substrate support.

FIG. 15 is a schematic side view illustrating supply of a substrate in a vertical state to a substrate support.

FIG. 16 is a schematic side view illustrating removal of a substrate in a vertical state from a substrate support.

FIG. 17 is a perspective view showing a main part (chuck hand) of another embodiment of the substrate transfer apparatus of the present invention.

FIG. 18 is a perspective view showing a state of supporting a substrate to be transferred.

FIG. 19 is a diagram illustrating the occurrence of inconvenience caused by a conventional substrate transfer device.

FIG. 20 is a diagram illustrating another problem caused by the conventional substrate transfer device.

FIG. 21 is a diagram illustrating the occurrence of still another inconvenience caused by the conventional substrate transfer device.

FIG. 22 is a diagram illustrating the occurrence of still another inconvenience caused by the conventional substrate transfer device.

FIG. 23 is a diagram illustrating the occurrence of still another inconvenience caused by the conventional substrate transfer device.

[Explanation of symbols]

 Reference Signs List 2 flat plate member 3 fixed engagement member 3a V-shaped groove 4 movable engagement member 4a V-shaped groove 5 inclined surface member 6 auxiliary engagement member 6a plane engagement surface 7 substrate

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3C007 DS01 DS06 ES04 ET08 EV03 EV07 EV23 EW03 NS09 NS11 NS17 3F061 AA01 AA04 BA04 BB08 BE03 BE12 BE43 BF04 DB00 DB04 DB06 5F031 CA02 GA03 GA13 GA14 GA15 PA23

Claims (8)

[Claims] An apparatus for gripping a peripheral portion of a substrate (7) at a plurality of positions and transporting the substrate (7) in this state, wherein a plate member (2) having a predetermined shape and a flat plate member (2) are formed. At least one fixed engaging member (3) provided at a predetermined position and having a V-shaped groove (3a) engageable with a peripheral portion of the substrate (7); and another predetermined position of the flat plate member (2). Provided on the substrate (7)
At least one movable engagement member (4) having a V-shaped groove (4a) engageable with a peripheral portion of the substrate, and configured to be able to reciprocate substantially toward the center of the gripped substrate (7). Toward the approximate center of the substrate (7), which is provided at another predetermined position of the flat plate member (2) and is gripped to engage with a predetermined position close to the engagement position by the movable engagement member (4). An auxiliary engagement member (6) configured to be reciprocally movable and having an engagement surface (6a) substantially orthogonal to a peripheral portion of the substrate (7); a movable engagement member (4) and an auxiliary engagement member (6). And a drive unit that operates independently of each other. 2. The flat plate member (2) is provided at a predetermined position close to the fixed engagement member (3) and the movable engagement member (4), and is directed substantially toward the center of the gripped substrate (7). The substrate transfer device according to claim 1, further comprising an inclined surface member (5) having a tapered surface that gradually decreases. 3. The substrate transfer apparatus according to claim 1, wherein the auxiliary engagement members are provided at predetermined positions symmetric with respect to the movable engagement member. 4. The substrate transfer device according to claim 1, wherein the auxiliary engagement member is provided at a predetermined position close to one side with respect to the movable engagement member. 5. The substrate transfer device according to claim 2, wherein the inclined surface member is fixed to a predetermined position of the flat plate member. 6. The substrate transfer apparatus according to claim 2, wherein the inclined surface member (5) is configured to operate in accordance with an operation of the movable engagement member (4). 7. The apparatus according to claim 1, comprising a plurality of said flat plate members, and said flat plate members arranged at predetermined intervals in a thickness direction. The substrate transfer device according to any one of the preceding claims. 8. The substrate transfer apparatus according to claim 7, wherein the drive unit simultaneously operates all the movable engagement members and simultaneously operates all the auxiliary engagement members. .