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JP2002100431A - Pressure contact connector - Google Patents

Pressure contact connector

Info

Publication number
JP2002100431A
JP2002100431A JP2000288907A JP2000288907A JP2002100431A JP 2002100431 A JP2002100431 A JP 2002100431A JP 2000288907 A JP2000288907 A JP 2000288907A JP 2000288907 A JP2000288907 A JP 2000288907A JP 2002100431 A JP2002100431 A JP 2002100431A
Authority
JP
Japan
Prior art keywords
spring element
circuit board
electronic circuit
press
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000288907A
Other languages
Japanese (ja)
Inventor
Yuichiro Sasaki
勇一郎 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP2000288907A priority Critical patent/JP2002100431A/en
Priority to US10/380,142 priority patent/US20030176113A1/en
Priority to EP01967696A priority patent/EP1326308B1/en
Priority to KR10-2003-7004090A priority patent/KR20030036813A/en
Priority to CNA018193706A priority patent/CN1476655A/en
Priority to AT01967696T priority patent/ATE388505T1/en
Priority to PCT/JP2001/008041 priority patent/WO2002025778A1/en
Priority to DE60133114T priority patent/DE60133114T2/en
Publication of JP2002100431A publication Critical patent/JP2002100431A/en
Priority to NO20031288A priority patent/NO326388B1/en
Pending legal-status Critical Current

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a pressure contact connector with reduced height and capable of improving positioning accuracy and assemblability and connectable with low load. SOLUTION: An insulating housing 20 is interposed between a flat electronic circuit board 1 and an electrically connected object 10, conductive spring elements 26 are fitted into plural through-holes 21 thereof, the diameter from the lower end part of one end part to the central part of each of the spring elements 26 is set larger than that of the upper end part of the other end part, and the central part through the upper end part of the spring element 26 is projected from the surface of the housing 20. A cap 27 is fitted to the lower end part of each spring element 26, a plug 28 is fitted to and supported by the upper end part of each spring element 26, and each cap 27, and each plug 28 are brought into contact with an electrode 2 of the electronic circuit board 1 and an electrode 11 of the electrically connected object 10, respectively. Since the pressure contact holding type connector is interposed between the electronic circuit board 1 and the electrically connected object 10 via the housings 20, the connector can be built in or mounted to the electronic circuit board 1 itself, and the positioning accuracy and ease of assembly can be improved.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子回路基板と液
晶モジュール、電子回路基板と電子回路基板、各種IC
パッケージと電子回路基板、電子回路基板と携帯電話用
のマイクやスピーカ等との電気的な接続に用いられる圧
接挟持型コネクタに関するものである。
The present invention relates to an electronic circuit board and a liquid crystal module, an electronic circuit board and an electronic circuit board, and various ICs.
The present invention relates to a press-clamping connector used for electrical connection between a package and an electronic circuit board, and between an electronic circuit board and a microphone or speaker for a mobile phone.

【0002】[0002]

【従来の技術】従来、携帯電話用の電子回路基板と液晶
モジュールとを電気的に導通する場合には、図示しない
が、断面略半小判形あるいは断面略U字形を呈した弾性
エラストマーの湾曲した表面に複数本の金属細線を一列
に並べ備えた圧接挟持型コネクタを使用したり、又は特
開平7‐161401号公報の電気接続用コネクタピン
を使用している。
2. Description of the Related Art Conventionally, when electrically connecting an electronic circuit board for a cellular phone to a liquid crystal module, although not shown, a curved elastic elastomer having a substantially semi-oval cross section or a substantially U-shaped cross section is used. A press-clamping connector having a plurality of thin metal wires arranged in a row on the surface is used, or an electrical connector pin disclosed in Japanese Patent Application Laid-Open No. 7-161401 is used.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、従来の
圧接挟持型コネクタや電気接続用コネクタピンは、ホル
ダを省略した状態で電子回路基板と液晶モジュールとの
間に介在されるので、電子回路基板自体に実装すること
ができず、位置決め精度やアセンブリ(assembl
y)性の悪化を招くおそれが少なくない。さらに、近年
における携帯電話の薄型化、軽量化、小型化に伴い、圧
接挟持型コネクタや電気接続用コネクタピンの高さ寸法
を小さくする必要があるが、高さ寸法(現在は5mm程
度)を問題なく小さくするのは非常に困難であり、低荷
重で接続することも同様に困難である。
However, the conventional press-clamp type connector and the connector pin for electrical connection are interposed between the electronic circuit board and the liquid crystal module without the holder, so that the electronic circuit board itself is not provided. Can not be mounted on positioning accuracy and assembly (assembl)
y) There is a lot of possibility that the property may be deteriorated. Furthermore, with the recent trend toward thinner, lighter, and smaller mobile phones, it is necessary to reduce the height of the press-clamp-type connector and the connector pin for electrical connection, but the height (currently about 5 mm) is required. It is very difficult to make it small without problems, and it is also difficult to make connections with low loads.

【0004】本発明は、上記に鑑みなされたもので、位
置決め精度やアセンブリ性を向上させ、高さ寸法を小さ
くし、しかも、低荷重の接続をも可能とする圧接挟持型
コネクタを提供することを目的としている。
SUMMARY OF THE INVENTION The present invention has been made in view of the above, and has as its object to provide a press-contact pinching type connector capable of improving positioning accuracy and assemblability, reducing a height dimension, and enabling connection with a low load. It is an object.

【0005】[0005]

【課題を解決するための手段】請求項1記載の発明にお
いては、上記課題を達成するため、対向する電極の間に
挟持されるものであって、厚さ方向に配向された複数の
貫通孔を有する絶縁性のハウジングの各貫通孔に、少な
くとも一端部の径が他端部の径よりも大きく形成され、
一端部にキャップ又は栓を有し、他端部が上記ハウジン
グの表面から突出するようにして設けられた導電性のス
プリング素子を嵌め入れてなることを特徴としている。
According to the first aspect of the present invention, in order to achieve the above object, a plurality of through holes which are sandwiched between opposed electrodes and are oriented in a thickness direction. In each of the through holes of the insulating housing having a diameter of at least one end is formed larger than the diameter of the other end,
One end has a cap or a stopper, and the other end is fitted with a conductive spring element provided so as to protrude from the surface of the housing.

【0006】なお、少なくとも一端部の径が他端部の径
よりも大きく形成された上記スプリング素子に代え、一
端部と他端部の径が共にこれらをつなぐ中央部の径より
も小さく形成されたスプリング素子を使用することがで
きる。また、上記各貫通孔を、縮径孔、最縮径孔、及び
これら縮径孔と最縮径孔とを連接するテーパ孔から構成
することができる。また、上記スプリング素子の一端部
に設けられたキャップ又は栓を、上記ハウジングよりも
突出させることができる。
It is to be noted that, in place of the above-mentioned spring element in which at least one end has a diameter larger than the diameter of the other end, the diameters of one end and the other end are both smaller than the diameter of a central portion connecting them. Spring elements can be used. In addition, each of the through holes can be formed of a reduced diameter hole, a most reduced diameter hole, and a tapered hole connecting the reduced diameter hole and the most reduced diameter hole. Further, a cap or a stopper provided at one end of the spring element can be made to protrude from the housing.

【0007】ここで、特許請求の範囲における電極を有
する電気的接合物としては、液晶モジュール、表面実装
型(QFP、BGA、LGA等)等の各種ICパッケー
ジ、各種回路基板、携帯電話や電子機器用のマイク、ス
ピーカ等の各種電子部品が含まれる。ハウジングは、長
方形、正方形、多角形、楕円形、小判形等に形成するこ
とができる。また、栓の端部は、湾曲していても良い
し、断面略へ字状に屈曲傾斜していても良い。
[0007] Here, the electrical joint having electrodes in the claims includes various IC packages such as a liquid crystal module, a surface mount type (QFP, BGA, LGA, etc.), various circuit boards, mobile phones and electronic devices. Various electronic components such as a microphone and a speaker are included. The housing can be formed in a rectangle, square, polygon, ellipse, oval, and the like. The end of the plug may be curved, or may be bent and inclined in a substantially cross-sectional shape.

【0008】[0008]

【発明の実施の形態】以下、図面を参照して本発明の好
ましい実施形態を説明すると、本実施形態における圧接
挟持型コネクタは、図1ないし図3に示すように、平坦
な電子回路基板1と電気接合物10との間に、絶縁性の
ハウジング20を介在してその複数の貫通孔21には導
電性のスプリング素子26をそれぞれ嵌入し、各スプリ
ング素子26の一端部である下端部から中央部に亘る径
を他端部である上端部の径よりも拡径に形成し、このス
プリング素子26の中央部から上端部をハウジング20
の表面から突出させ、各スプリング素子26の下端部に
キャップ27を嵌着するとともに、各スプリング素子2
6の上端部に栓28を嵌着支持させ、各キャップ27を
電子回路基板1の電極2に、各栓28を電気接合物10
の電極11にそれぞれ接触させるようにしている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to the accompanying drawings. As shown in FIGS. A conductive spring element 26 is inserted into each of the plurality of through-holes 21 with an insulating housing 20 interposed between the electrical joint 10 and the electrical joint 10. The diameter over the central portion is formed larger than the diameter of the upper end portion which is the other end portion, and the upper end portion of the spring element 26 from the central portion to the housing 20 is formed.
The cap 27 is fitted to the lower end of each spring element 26, and each spring element 2
A plug 28 is fitted and supported on the upper end of the electronic component 6, and each cap 27 is attached to the electrode 2 of the electronic circuit board 1, and each plug 28 is connected to the electrical joint 10.
, Respectively.

【0009】電子回路基板1は、図1に示すように、例
えばプリント配線板からなり、表面に複数の電極2が平
坦に配列されている。電気接合物10は、同図に示すよ
うに、例えば液晶モジュールからなり、下方の電子回路
基板1の表面に近接対向する。この電気接合物10は、
ITO電極からなる複数の電極11を並べ備えている。
As shown in FIG. 1, the electronic circuit board 1 is made of, for example, a printed wiring board, and has a plurality of electrodes 2 arranged on the surface thereof in a flat manner. As shown in the figure, the electric joint 10 is formed of, for example, a liquid crystal module, and is closely opposed to the lower surface of the electronic circuit board 1. This electric conjugate 10
A plurality of electrodes 11 composed of ITO electrodes are arranged.

【0010】ハウジング20は、図1や図2に示すよう
に、所定の材料を使用して薄い単層あるいは複層の平面
長方形に成形され、長手方向に小径の貫通孔21が所定
のピッチ(例えば、0.5mm〜1.27mm)で一列に
並べて上下厚さ方向に穿孔されている。細長い板状のハ
ウジング20は、耐熱性、寸法安定性、成形性等に優れ
る汎用のエンジニアリングプラスチック(例えば、AB
S樹脂、ポリカーボネート、ポリプロピレン、塩ビ、ポ
リエチレン等)を使用して成形されている。これらの材
料の中でも、加工性やコスト等を考慮すると、ABS樹
脂が最適である。各貫通孔21は、図3に示すように、
電子回路基板1側に位置するテーパ状の拡径孔22、縮
径孔23、テーパ孔24、及び電気接合物10側に位置
する最縮径孔25から一体連続的に形成され、キャップ
27や栓28の挿入の容易化を確保したり、抜けを防止
する。
As shown in FIG. 1 and FIG. 2, the housing 20 is formed into a thin single-layer or multiple-layer planar rectangle using a predetermined material, and a small-diameter through-hole 21 is formed in a longitudinal direction at a predetermined pitch ( (For example, 0.5 mm to 1.27 mm). The elongated plate-shaped housing 20 is made of a general-purpose engineering plastic (for example, AB) having excellent heat resistance, dimensional stability, moldability, and the like.
S resin, polycarbonate, polypropylene, polyvinyl chloride, polyethylene, etc.). Among these materials, the ABS resin is most suitable in consideration of workability, cost, and the like. As shown in FIG.
The tapered large-diameter hole 22, the reduced-diameter hole 23, the tapered hole 24 located on the side of the electronic circuit board 1, and the smallest-diameter hole 25 located on the side of the electric joint 10 are formed integrally and continuously. The facilitation of the insertion of the stopper 28 is ensured, and the stopper 28 is prevented from coming off.

【0011】複数本のスプリング素子26は、電子回路
基板1、検査回路基板、表面実装型のICパッケージ、
液晶モジュール(ITO、TAB、COF電極)との接続
の場合には、これらの電極数と同本数とされる。各スプ
リング素子26は、図3に示すように、例えば直径30
〜100μm、好ましくは30〜70μmの金属細線が
等ピッチ(例えば、50μm)で巻回されることで略円錐
状を呈した弾性のコイル状に形成され、貫通孔21から
脱落しないようになっている。このスプリング素子26
を形成する金属細線としては、リン青銅、銅、ステンレ
ス、ベリリウム銅、ピアノ線等の金属線、あるいはこれ
らの金属線に金メッキした金属細線があげられる。金属
細線の直径を30〜70μmとするのは、この値の範囲
を選択すれば、低コストや低荷重接続の実現が容易とな
るからである。
The plurality of spring elements 26 include an electronic circuit board 1, an inspection circuit board, a surface mount type IC package,
In the case of connection with a liquid crystal module (ITO, TAB, COF electrodes), the number is the same as the number of these electrodes. Each spring element 26 has a diameter of, for example, 30 as shown in FIG.
A thin metal wire having a diameter of about 100 μm, preferably 30 to 70 μm is wound at an equal pitch (for example, 50 μm) so as to be formed in an elastic coil shape having a substantially conical shape so as not to fall out of the through hole 21. I have. This spring element 26
May be metal wires such as phosphor bronze, copper, stainless steel, beryllium copper, piano wire, or thin metal wires obtained by plating these metal wires with gold. The reason why the diameter of the thin metal wire is set to 30 to 70 μm is that if this value range is selected, low cost and low load connection can be easily realized.

【0012】各スプリング素子26の長さとしては、例
えば1.0〜3.0mm、好ましくは1.0〜1.8m
mが良く、長さの半分程度がハウジング20の表面から
露出するのが望ましい。係る範囲とすれば、外部からの
ノイズによる悪影響を回避し、弾性特性を維持すること
が可能になる。また、各スプリング素子26のリング状
を呈した上端部の径は、下端部から中央部の径よりも縮
径に形成される。具体的には、最近の電極11の低ピッ
チ化を考慮し、下端部や中央部の径の0.5〜0.8
倍、0.6〜0.8倍程度、より具体的には0.2〜
0.4mm、好ましくは0.3〜0.4mm程度に形成
される。
The length of each spring element 26 is, for example, 1.0 to 3.0 mm, preferably 1.0 to 1.8 m.
It is desirable that m is good and about half of the length is exposed from the surface of the housing 20. Within such a range, adverse effects due to external noise can be avoided and elastic characteristics can be maintained. The diameter of the ring-shaped upper end of each spring element 26 is formed smaller than the diameter of the center from the lower end. Specifically, in consideration of the recent pitch reduction of the electrode 11, the diameter of the lower end portion and the center portion is 0.5 to 0.8.
Times, about 0.6-0.8 times, more specifically 0.2-
It is formed to 0.4 mm, preferably about 0.3 to 0.4 mm.

【0013】各キャップ27は、図2や図3に示すよう
に、例えば金メッキされた導電性の材料を用いて断面略
U字形に形成され、ハウジング20から僅かに突出した
部分(突出量は、0.1〜0.3mm、好ましくは0.
1〜0.2mm程度)が電子回路基板1の電極2に接触
したり、電子回路基板1の電極2にクリームハンダから
なるハンダ層等を介して適宜固定されて導通を確実化す
る。さらに、各栓28は、同図に示すように、例えば金
メッキされた導電性の真鍮や導電性エラストマー等を用
いて基本的には略ピン状、略螺子状に形成され、電気接
合物10の電極11に接触する拡径の頭部上端面が半円
弧状に湾曲形成されている。この栓28の頭部上端面
は、3〜5本の複数の小円錐状、小角錐状等に形成する
こともできる。
As shown in FIGS. 2 and 3, each cap 27 is formed to have a substantially U-shaped cross section using, for example, a gold-plated conductive material, and a portion slightly protruding from the housing 20 (the amount of protrusion is 0.1-0.3 mm, preferably 0.1-0.3 mm.
(Approximately 1 to 0.2 mm) is in contact with the electrode 2 of the electronic circuit board 1 or is appropriately fixed to the electrode 2 of the electronic circuit board 1 via a solder layer made of cream solder or the like to ensure conduction. Further, as shown in the figure, each stopper 28 is basically formed in a substantially pin-like or substantially screw-like shape using, for example, gold-plated conductive brass or a conductive elastomer. The upper end surface of the enlarged diameter head that comes into contact with the electrode 11 is curved and formed in a semicircular shape. The upper end surface of the head of the plug 28 may be formed in a shape of 3 to 5 small cones, small pyramids, or the like.

【0014】上記構成において、電子回路基板1に圧接
挟持型コネクタを位置決め固定し、電子回路基板1と電
気接合物10とに圧接挟持型コネクタを位置決め挟持さ
せ、電子回路基板1の各電極2とスプリング素子26の
キャップ27を面接触させるとともに、電気接合物10
の各電極11とスプリング素子26の栓28を面接触さ
せる。そして、電子回路基板1に対して電気接合物10
を少々加圧圧縮すれば、各スプリング素子26が圧縮変
形し、電子回路基板1と電気接合物10をスプリング素
子26を介して電気的に導通することができる(図1参
照)。
In the above configuration, the press-clamp type connector is positioned and fixed to the electronic circuit board 1, the press-clamp type connector is positioned and clamped between the electronic circuit board 1 and the electric joint 10, and the electrodes 2 of the electronic circuit board 1 are connected to each other. The cap 27 of the spring element 26 is brought into surface contact with the electrical joint 10.
Each electrode 11 is brought into surface contact with the plug 28 of the spring element 26. Then, the electric joint 10 is connected to the electronic circuit board 1.
Is slightly compressed and compressed, each spring element 26 is compressed and deformed, and the electronic circuit board 1 and the electrical joint 10 can be electrically connected via the spring element 26 (see FIG. 1).

【0015】上記構成によれば、電子回路基板1と電気
接合物10との間に圧接挟持型コネクタをハウジング2
0を介して介在するので、電子回路基板1自体に圧接挟
持型コネクタを簡単に組み込んだり、実装することがで
き、位置決め精度やアセンブリ性を著しく向上させるこ
とが可能となる。また、圧接挟持型コネクタの高さ寸法
を問題なく小さくする(1.50mm〜1.75mm程
度)ことができ、低抵抗、低荷重接続(例えば、40g〜
60g/pin程度)も大いに期待できる。
According to the above construction, the press-clamp type connector is provided between the electronic circuit board 1 and the electric joint 10 in the housing 2.
Since the connector is interposed via the pin 0, the press-connecting connector can be easily incorporated or mounted on the electronic circuit board 1 itself, and the positioning accuracy and the assemblability can be significantly improved. Further, the height dimension of the press-contact pinch type connector can be reduced without any problem (about 1.50 mm to 1.75 mm), and a low-resistance, low-load connection (for example, 40 g to
(About 60 g / pin) can be greatly expected.

【0016】また、各貫通孔21の縮径孔23に安定性
と実装性に優れるキャップ27を嵌着して塞ぎ、かつ栓
28を電気接合物10の電極11に面接触させるので、
安定した導通が大いに期待できる。また、栓28の頭部
を半球状、半楕球状とするので、例えスプリング素子2
6が前後左右に少々傾斜していても、導通の安定性を確
保することができる。さらに、各栓28の頭部を複数の
小円錐状、小角錐状とすれば、電子回路基板1間の接続
等、特に電極2に半田メッキされている場合等、半田の
酸化膜を破り、確実な導通が可能となる。さらにまた、
栓28の頭部付近の周面にエンドレスの溝を凹み成形
し、この溝にスプリング素子26の端部を嵌着するの
で、スプリング素子26が実に外れにくい。
Further, a cap 27 having excellent stability and mountability is fitted and closed in the reduced-diameter hole 23 of each through-hole 21 and the plug 28 is brought into surface contact with the electrode 11 of the electric joint 10.
Stable conduction can be greatly expected. In addition, since the head of the stopper 28 is formed in a hemispherical or semi-elliptical shape, for example, the spring element 2
Even if 6 is slightly inclined forward, backward, left and right, the stability of conduction can be ensured. Furthermore, if the head of each plug 28 is formed in a plurality of small cones or small pyramids, the oxide film of the solder is broken when the connection between the electronic circuit boards 1 is performed, especially when the electrodes 2 are plated with solder. Reliable conduction can be achieved. Furthermore,
An endless groove is formed in the peripheral surface near the head of the plug 28 by recessing, and the end of the spring element 26 is fitted into this groove, so that the spring element 26 is hardly detached.

【0017】次に、図4ないし図6は本発明の第2の実
施形態を示すもので、本実施形態においては、電子回路
基板1と電気接合物10との間にハウジング20を介在
してその複数の貫通孔21にはスプリング素子26をそ
れぞれ嵌入し、各スプリング素子26の上下両端部の径
よりも中央部の径を拡径に形成し、このスプリング素子
26の上下両端部をハウジング20の表面から突出させ
て断面略凸字形の栓28をそれぞれ嵌着支持させ、ハウ
ジング20から突出した下方の栓28を電子回路基板1
の電極2に、ハウジング20から突出した上方の栓28
を電気接合物10の電極11にそれぞれ面接触させるよ
うにしている。
FIGS. 4 to 6 show a second embodiment of the present invention. In this embodiment, a housing 20 is interposed between an electronic circuit board 1 and an electric joint 10. A spring element 26 is fitted into each of the plurality of through holes 21, and the diameter of the center of the spring element 26 is made larger than the diameter of the upper and lower ends of each spring element 26. The plug 28 projecting from the surface of the electronic circuit board 1 is fitted to and supported by a plug 28 having a substantially convex cross section.
Of the upper plug 28 projecting from the housing 20
Are brought into surface contact with the electrodes 11 of the electric joint 10 respectively.

【0018】ハウジング20は、同図に示すように、組
立の便宜を図るため、一対のハウジング板29を備え、
この一対のハウジング板29が上下に積層されることに
より平面長方形に成形されている。各貫通孔21は、図
6に示すように、電子回路基板1側に位置するテーパ孔
24、縮径孔23、及びテーパ孔24から一体連続的に
形成されている。その他の部分については、上記実施形
態と同様であるので説明を省略する。本実施形態におい
ても上記実施形態と同様の作用効果が期待でき、しか
も、各貫通孔21の両端部に位置するテーパ孔24がそ
れぞれ狭くなっているので、スプリング素子26の脱落
等をきわめて有効に防止することができる。
As shown in FIG. 2, the housing 20 includes a pair of housing plates 29 for convenience of assembly.
The pair of housing plates 29 are vertically stacked to form a flat rectangular shape. As shown in FIG. 6, each through-hole 21 is formed integrally and continuously from the tapered hole 24, the reduced diameter hole 23, and the tapered hole 24 located on the electronic circuit board 1 side. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted. In this embodiment, the same operation and effect as those of the above embodiment can be expected. Further, since the tapered holes 24 located at both ends of each through hole 21 are narrowed, dropping of the spring element 26 and the like can be extremely effectively performed. Can be prevented.

【0019】次に、図7ないし図9は本発明の第3の実
施形態を示すもので、この場合には、平坦な電子回路基
板1と電気接合物10との間に、絶縁性のハウジング2
0を介在してその複数の貫通孔21には導電性のスプリ
ング素子26をそれぞれ嵌入し、各スプリング素子26
の下端部から中央部に亘る径を上端部の径よりも拡径に
形成するとともに、このスプリング素子26の中央部か
ら上端部をハウジング20の表面から突出させ、各スプ
リング素子26の下端部に栓28を嵌着し、この栓28
の突出部分を電子回路基板1の電極2に、各スプリング
素子26の上端部を電気接合物10の電極11にそれぞ
れ接触させるようにしている。その他の部分について
は、上記実施形態と同様であるので説明を省略する。
Next, FIGS. 7 to 9 show a third embodiment of the present invention. In this case, an insulating housing is provided between a flat electronic circuit board 1 and an electric joint 10. 2
The conductive spring elements 26 are respectively fitted into the plurality of through holes 21 with the spring elements 26 interposed therebetween.
The diameter from the lower end to the center of the spring element 26 is formed to be larger than the diameter of the upper end, and the upper end of the spring element 26 projects from the surface of the housing 20 from the center to the lower end of each spring element 26. The stopper 28 is fitted, and this stopper 28
The protruding portion is brought into contact with the electrode 2 of the electronic circuit board 1, and the upper end of each spring element 26 is brought into contact with the electrode 11 of the electric joint 10. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

【0020】次に、図10(a)、(b)は本発明の第4の
実施形態を示すもので、この場合には、ハウジング20
の両側面に略三角形状のスリット30をスプリング素子
26の本数に応じてそれぞれ切り欠き形成し、ハウジン
グ20をスプリング素子26毎に分割することができる
ようにしている。その他の部分については、上記実施形
態と同様であるので説明を省略する。本実施形態におい
ても上記実施形態と同様の作用効果が期待でき、しか
も、スリット30を用いてハウジング20をスプリング
素子26毎に容易に割り、不要なスプリング素子26を
ユーザが簡単に省くことができるので、組立性、実装
性、及び作業性を大幅に向上させることが可能になる。
Next, FIGS. 10 (a) and 10 (b) show a fourth embodiment of the present invention.
The slits 30 having a substantially triangular shape are formed on both side surfaces of each of the spring elements 26 according to the number of the spring elements 26 so that the housing 20 can be divided for each spring element 26. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted. In this embodiment, the same operation and effect as those of the above embodiment can be expected. In addition, the housing 20 can be easily divided for each spring element 26 by using the slit 30, and the unnecessary spring element 26 can be easily omitted by the user. Therefore, the assembling property, mounting property, and workability can be significantly improved.

【0021】次に、図11は本発明の第5の実施形態を
示すもので、この場合には、電子回路基板1に図示しな
い一対の位置決め孔を穿孔するとともに、ハウジング2
0の下面両端に位置決めピン31をそれぞれ植設し、こ
れら位置決め孔と位置決めピン31を用いて電子回路基
板1に圧接挟持型コネクタを位置決め嵌合固定するよう
にしている。その他の部分については、上記実施形態と
同様であるので説明を省略する。本実施形態によれば、
簡易な構成で圧接挟持型コネクタの位置決め精度や実装
性をさらに向上させることができる。
FIG. 11 shows a fifth embodiment of the present invention. In this case, a pair of positioning holes (not shown) are formed in the electronic circuit board 1 and the housing 2
Positioning pins 31 are planted at both ends of the lower surface of the electronic circuit board 0, respectively, and the press-connecting-type connector is positioned and fixed to the electronic circuit board 1 by using the positioning holes and the positioning pins 31. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted. According to the present embodiment,
With a simple configuration, the positioning accuracy and mountability of the press-connecting connector can be further improved.

【0022】[0022]

【実施例】以下、本発明に係る圧接挟持型コネクタの実
施例を説明する。 実施例1 電子回路基板に第1の実施形態の圧接挟持型コネクタを
ハンダクリームを用いて位置決め固定し、電子回路基板
と電気接合物とに圧接挟持型コネクタを位置決め挟持さ
せ、電子回路基板の各電極とキャップを面接触させると
ともに、電気接合物の各電極と栓を面接触させた。
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of a press-connecting connector according to the present invention. Example 1 The press-clamp-type connector of the first embodiment was positioned and fixed on an electronic circuit board using a solder cream, and the press-clamp-type connector was positioned and clamped between the electronic circuit board and the electric joint. The electrode was brought into surface contact with the cap, and each electrode of the electrical conjugate was brought into surface contact with the plug.

【0023】圧接挟持型コネクタのハウジングはABS
樹脂を用いて高さ0.95mmに成形し、複数の貫通孔
は1.0mmピッチで一列に10個並べて穿孔成形し
た。各貫通孔は、拡径孔φ0.75mm、縮径孔φ0.
60mm、テーパ孔φ0.60mm〜φ0.40mm、
及び最縮径孔φ0.40mmの大きさに形成した。ま
た、ハウジングの複数の貫通孔には、スプリング素子を
高さ1.50mmで組み込んだ。
The housing of the crimping type connector is ABS
The resin was molded to a height of 0.95 mm, and a plurality of through holes were formed in a line at a pitch of 1.0 mm by arranging ten through holes. Each through-hole has an enlarged diameter hole φ0.75 mm, a reduced diameter hole φ0.
60mm, taper hole φ0.60mm ~ φ0.40mm,
And the diameter of the smallest diameter hole was 0.40 mm. Further, a spring element having a height of 1.50 mm was incorporated in the plurality of through holes of the housing.

【0024】各スプリング素子を形成する金属細線とし
ては、真鍮からなる金属線に金メッキをニッケル下地メ
ッキを介し施した金属細線を用いた。各スプリング素子
は、長さ1.75mmとし、ハウジングの表面から0.
8mm露出させた。各スプリング素子の下端部から中央
部の径はφ0.60mmとし、上端部の径はφ0.40
mmとした。さらに、キャップと栓とを各スプリング素
子と同様の材料で形成し、圧接挟持型コネクタの高さを
1.75mmとした。
As the thin metal wire forming each spring element, a thin metal wire obtained by applying gold plating to a metal wire made of brass via a nickel base plating was used. Each spring element has a length of 1.75 mm and extends from the surface of the housing at a distance of 0.75 mm.
8 mm was exposed. The diameter from the lower end to the center of each spring element is φ0.60 mm, and the diameter at the upper end is φ0.40.
mm. Further, the cap and the stopper were formed of the same material as each spring element, and the height of the press-connecting connector was 1.75 mm.

【0025】電子回路基板と電気接合物とに圧接挟持型
コネクタを位置決め挟持させたら、電子回路基板に対し
て電気接合物を加圧圧縮し、電子回路基板と電気接合物
とを電気的に導通した。この際の圧接挟持型コネクタの
圧縮量と荷重の関係を図12のグラフにまとめた。同図
において、縦軸は荷重を示し、横軸は圧縮量を示す。
[0025] After positioning and holding the press-clamp-type connector between the electronic circuit board and the electric joint, the electric joint is pressurized and compressed against the electronic circuit board to electrically connect the electronic circuit board and the electric joint. did. The relationship between the amount of compression and the load of the press-connecting connector at this time is summarized in the graph of FIG. In the figure, the vertical axis indicates the load, and the horizontal axis indicates the amount of compression.

【0026】図12からも明らかなように、本実施例の
圧接挟持型コネクタによれば、10本のスプリング素子
を0.5mm圧縮した場合の荷重を6N前後、すなわ
ち、スプリング素子1本当たりの荷重を60g前後とす
ることができ、低荷重で接続することができた。これに
対し、従来の圧接挟持型コネクタの場合、図示しない
が、10本の接続子を0.5mm圧縮した場合の荷重は
10N、接続子1本当たりの荷重は100gになり、こ
れ以下の低荷重で接続することはできなかった。
As is clear from FIG. 12, according to the press-connecting type connector of this embodiment, the load when 10 spring elements are compressed by 0.5 mm is about 6N, that is, per spring element. The load could be about 60 g, and the connection could be made with a low load. On the other hand, in the case of the conventional press-clamp type connector, although not shown, the load when 10 connectors are compressed by 0.5 mm is 10 N, and the load per connector is 100 g. Connection could not be made by load.

【0027】実施例2 電子回路基板に第3の実施形態の圧接挟持型コネクタを
ハンダクリームを用いて位置決め固定し、電子回路基板
と電気接合物とに圧接挟持型コネクタを位置決め挟持さ
せ、電子回路基板の各電極とスプリング素子のキャップ
を面接触させるとともに、電気接合物の各電極とスプリ
ング素子の上端部を面接触させた。
Example 2 The press-clamp type connector according to the third embodiment is positioned and fixed on an electronic circuit board using a solder cream, and the press-clamp type connector is positioned and clamped between the electronic circuit board and the electric joint. Each electrode of the substrate was brought into surface contact with the cap of the spring element, and each electrode of the electrical joint was brought into surface contact with the upper end of the spring element.

【0028】圧接挟持型コネクタのハウジングはABS
樹脂を用いて高さ0.95mmに成形し、複数の貫通孔
は1.0mmピッチで一列に10個並べて穿孔成形し
た。各貫通孔は、拡径孔φ0.75mm、縮径孔φ0.
60mm、テーパ孔φ0.60mm〜φ0.40mm、
及び最縮径孔φ0.40mmの大きさに形成した。ま
た、ハウジングの複数の貫通孔には、スプリング素子を
高さ1.75mmで組み込んだ。
The housing of the crimping connector is made of ABS
The resin was molded to a height of 0.95 mm, and a plurality of through holes were formed in a line at a pitch of 1.0 mm by arranging ten through holes. Each through-hole has an enlarged diameter hole φ0.75 mm, a reduced diameter hole φ0.
60mm, taper hole φ0.60mm ~ φ0.40mm,
And the diameter of the smallest diameter hole was 0.40 mm. Further, a spring element having a height of 1.75 mm was incorporated in the plurality of through holes of the housing.

【0029】各スプリング素子を形成する金属細線とし
ては、真鍮からなる金属線に金メッキをニッケル下地メ
ッキを介し施した金属細線を用いた。各スプリング素子
は、長さ1.75mmとし、ハウジングの表面から0.
8mm露出させた。各スプリング素子の下端部から中央
部の径はφ0.60mmとし、上端部の径はφ0.40
mmとした。さらに、キャップは各スプリング素子と同
様の材料で形成した。
As the thin metal wire forming each spring element, a thin metal wire obtained by applying a gold plating to a metal wire made of brass via a nickel base plating was used. Each spring element has a length of 1.75 mm and extends from the surface of the housing at a distance of 0.75 mm.
8 mm was exposed. The diameter from the lower end to the center of each spring element is φ0.60 mm, and the diameter at the upper end is φ0.40.
mm. Further, the cap was formed of the same material as each spring element.

【0030】電子回路基板と電気接合物とに圧接挟持型
コネクタを位置決め挟持させたら、電子回路基板に対し
て電気接合物を加圧圧縮し、電子回路基板と電気接合物
とを電気的に導通した。この際の圧接挟持型コネクタの
圧縮量と荷重の関係を図12のグラフにまとめた。
When the press-connecting connector is positioned and sandwiched between the electronic circuit board and the electric joint, the electric joint is pressed and compressed against the electronic circuit board to electrically connect the electronic circuit board and the electric joint. did. The relationship between the amount of compression and the load of the press-connecting connector at this time is summarized in the graph of FIG.

【0031】[0031]

【発明の効果】以上のように本発明によれば、圧接挟持
型コネクタの位置決め精度やアセンブリ性等を向上させ
ることができるという効果がある。また、圧接挟持型コ
ネクタの高さ寸法を小さくし、しかも、低荷重接続も可
能となる。
As described above, according to the present invention, there is an effect that the positioning accuracy and the assemblability of the press-contact and pinch type connector can be improved. In addition, the height of the press-connecting connector can be reduced, and a low-load connection is also possible.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る圧接挟持型コネクタの実施形態を
示す部分断面説明図である。
FIG. 1 is a partially sectional explanatory view showing an embodiment of a press-contact and pinch type connector according to the present invention.

【図2】本発明に係る圧接挟持型コネクタの実施形態を
示す斜視説明図である。
FIG. 2 is a perspective explanatory view showing an embodiment of a press-contact and pinch type connector according to the present invention.

【図3】本発明に係る圧接挟持型コネクタの実施形態を
示す要部断面説明図である。
FIG. 3 is an explanatory cross-sectional view of a main part showing an embodiment of the press-contact pinching connector according to the present invention.

【図4】本発明に係る圧接挟持型コネクタの第2の実施
形態を示す部分断面説明図である。
FIG. 4 is a partial cross-sectional explanatory view showing a second embodiment of the press-clamping connector according to the present invention.

【図5】本発明に係る圧接挟持型コネクタの第2の実施
形態を示す斜視説明図である。
FIG. 5 is an explanatory perspective view showing a second embodiment of the press-contact pinching type connector according to the present invention.

【図6】本発明に係る圧接挟持型コネクタの第2の実施
形態を示す要部断面説明図である。
FIG. 6 is an explanatory cross-sectional view of a main part of a second embodiment of the press-contact and pinch type connector according to the present invention.

【図7】本発明に係る圧接挟持型コネクタの第3の実施
形態を示す部分断面説明図である。
FIG. 7 is an explanatory partial sectional view showing a third embodiment of the press-contact and pinch type connector according to the present invention.

【図8】本発明に係る圧接挟持型コネクタの第3の実施
形態を示す斜視説明図である。
FIG. 8 is an explanatory perspective view showing a third embodiment of a press-contact pinching connector according to the present invention.

【図9】本発明に係る圧接挟持型コネクタの第3の実施
形態を示す要部断面説明図である。
FIG. 9 is an explanatory sectional view showing a main part of a third embodiment of a press-contact pinching connector according to the present invention.

【図10】本発明に係る圧接挟持型コネクタの第4の実
施形態を示す説明図で、(a)図は平面図、(b)図は側面
図である。
FIGS. 10A and 10B are explanatory views showing a fourth embodiment of a press-clamping connector according to the present invention, wherein FIG. 10A is a plan view and FIG. 10B is a side view.

【図11】本発明に係る圧接挟持型コネクタの第5の実
施形態を示す側面図である。
FIG. 11 is a side view showing a press-contact pinching connector according to a fifth embodiment of the present invention.

【図12】本発明に係る圧接挟持型コネクタの実施例を
示すグラフである。
FIG. 12 is a graph showing an embodiment of a press-clamping type connector according to the present invention.

【符号の説明】[Explanation of symbols]

1 電子回路基板 2 電極 10 電気接合物 11 電極 20 ハウジング 21 貫通孔 22 拡径孔 23 縮径孔 24 テーパ孔 25 最縮径孔 26 スプリング素子 27 キャップ 28 栓 DESCRIPTION OF SYMBOLS 1 Electronic circuit board 2 Electrode 10 Electric joint 11 Electrode 20 Housing 21 Through hole 22 Enlarged hole 23 Reduced diameter hole 24 Tapered hole 25 Most reduced diameter hole 26 Spring element 27 Cap 28 Plug

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 対向する電極の間に挟持される圧接挟持
型コネクタであって、 厚さ方向に配向された複数の貫通孔を有する絶縁性のハ
ウジングの各貫通孔に、少なくとも一端部の径が他端部
の径よりも大きく形成され、一端部にキャップ又は栓を
有し、他端部が上記ハウジングの表面から突出するよう
にして設けられた導電性のスプリング素子を嵌め入れて
なることを特徴とする圧接挟持型コネクタ。
1. A pressure-clamping connector to be clamped between opposing electrodes, wherein at least one end of each of the through-holes of an insulating housing having a plurality of through-holes oriented in a thickness direction is provided. Is formed to be larger than the diameter of the other end, has a cap or plug at one end, and is fitted with a conductive spring element provided so that the other end protrudes from the surface of the housing. A press-clamp type connector characterized by the following characteristics.
【請求項2】 請求項1記載の圧接挟持型コネクタにお
いて、少なくとも一端部の径が他端部の径よりも大きく
形成された上記スプリング素子に代え、一端部と他端部
の径が共にこれらをつなぐ中央部の径よりも小さく形成
されたスプリング素子を用いた圧接挟持型コネクタ。
2. The press-clamping connector according to claim 1, wherein at least one end has a diameter larger than that of the other end instead of the spring element. A press-clamping connector using a spring element formed to be smaller than the diameter of the central part connecting the two.
【請求項3】 上記各貫通孔が、縮径孔、最縮径孔、及
びこれら縮径孔と最縮径孔とを連接するテーパ孔からな
る請求項1又は2記載の圧接挟持型コネクタ。
3. The press-clamping connector according to claim 1, wherein each of the through holes comprises a reduced diameter hole, a most reduced diameter hole, and a tapered hole connecting the reduced diameter hole and the most reduced diameter hole.
【請求項4】 上記スプリング素子の一端部に設けられ
たキャップ又は栓が上記ハウジングよりも突出している
請求項1、2、又は3記載の圧接挟持型コネクタ。
4. The press-clamping connector according to claim 1, wherein a cap or a stopper provided at one end of the spring element projects beyond the housing.
JP2000288907A 2000-09-22 2000-09-22 Pressure contact connector Pending JP2002100431A (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2000288907A JP2002100431A (en) 2000-09-22 2000-09-22 Pressure contact connector
US10/380,142 US20030176113A1 (en) 2000-09-22 2001-09-17 Spring element, press-clamped connector, and holder with probe for electro-acoustic component
EP01967696A EP1326308B1 (en) 2000-09-22 2001-09-17 Spring element, press-clamped connector, and holder with probe for electro-acoustic component
KR10-2003-7004090A KR20030036813A (en) 2000-09-22 2001-09-17 Spring element, press-clamped connector, and holder with probe for electro-acoustic component
CNA018193706A CN1476655A (en) 2000-09-22 2001-09-17 Spring elements, crimp-clamp connectors and electro-acoustic component holders with built-in probes
AT01967696T ATE388505T1 (en) 2000-09-22 2001-09-17 SPRING ELEMENT, PRESSURE CLAMP CONNECTOR AND HOLDER WITH PROBE FOR ELECTROACOUSTIC COMPONENT
PCT/JP2001/008041 WO2002025778A1 (en) 2000-09-22 2001-09-17 Spring element, press-clamped connector, and holder with probe for electro-acoustic component
DE60133114T DE60133114T2 (en) 2000-09-22 2001-09-17 SPRING ELEMENT, PRESSURE TERMINAL CONNECTORS AND HOLDER WITH PROBE FOR ELECTRO-ACOUSTIC COMPONENT
NO20031288A NO326388B1 (en) 2000-09-22 2003-03-20 Spring element and electroacoustic part holder with built-in probes

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007066887A (en) * 2005-08-31 2007-03-15 Yokowo Co Ltd Connector
US7201613B2 (en) 2003-03-18 2007-04-10 Shin-Etsu Polymer Co., Ltd. Pressure contact holding-type connector
JP2007173073A (en) * 2005-12-22 2007-07-05 Shin Etsu Polymer Co Ltd Drip-proof connector and its connection structure
JP2007287690A (en) * 2006-04-14 2007-11-01 Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi Connector for electrical connection and electronic device using the same
CN100397706C (en) * 2003-11-28 2008-06-25 小岛压力加工工业株式会社 Contact device
JP2009198921A (en) * 2008-02-22 2009-09-03 National Institute Of Advanced Industrial & Technology Optical module
JP2010146954A (en) * 2008-12-22 2010-07-01 Shin Etsu Polymer Co Ltd Connection structure of insulation displacement connector
JP2012240640A (en) * 2011-05-24 2012-12-10 Advics Co Ltd Actuator for hydraulic pressure control of brake
CN111082240A (en) * 2019-11-27 2020-04-28 青岛特来电新能源科技有限公司 Conductive connection structure of charging plug, charging plug and charging terminal

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10214649A (en) * 1997-01-30 1998-08-11 Yokowo Co Ltd Spring connector and device using spring connector
JPH10312845A (en) * 1997-05-09 1998-11-24 Yokowo Co Ltd Spring connector and device using the same
JP2000510640A (en) * 1996-05-10 2000-08-15 エー―テック・アクチェンゲゼルシャフト Connection stand

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000510640A (en) * 1996-05-10 2000-08-15 エー―テック・アクチェンゲゼルシャフト Connection stand
JPH10214649A (en) * 1997-01-30 1998-08-11 Yokowo Co Ltd Spring connector and device using spring connector
JPH10312845A (en) * 1997-05-09 1998-11-24 Yokowo Co Ltd Spring connector and device using the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7201613B2 (en) 2003-03-18 2007-04-10 Shin-Etsu Polymer Co., Ltd. Pressure contact holding-type connector
CN100397706C (en) * 2003-11-28 2008-06-25 小岛压力加工工业株式会社 Contact device
JP2007066887A (en) * 2005-08-31 2007-03-15 Yokowo Co Ltd Connector
JP2007173073A (en) * 2005-12-22 2007-07-05 Shin Etsu Polymer Co Ltd Drip-proof connector and its connection structure
JP2007287690A (en) * 2006-04-14 2007-11-01 Kofukin Seimitsu Kogyo (Shenzhen) Yugenkoshi Connector for electrical connection and electronic device using the same
JP2009198921A (en) * 2008-02-22 2009-09-03 National Institute Of Advanced Industrial & Technology Optical module
JP2010146954A (en) * 2008-12-22 2010-07-01 Shin Etsu Polymer Co Ltd Connection structure of insulation displacement connector
JP2012240640A (en) * 2011-05-24 2012-12-10 Advics Co Ltd Actuator for hydraulic pressure control of brake
CN111082240A (en) * 2019-11-27 2020-04-28 青岛特来电新能源科技有限公司 Conductive connection structure of charging plug, charging plug and charging terminal

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