JP2002118776A - Image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image pickup device, that can reduce the number of the components, can be made compact and can align a lens and an image pickup element in the direction of the optical axis and in a direction at right angles with respect to the direction of the optical axis without adjustment. SOLUTION: In an image pickup unit 2, an electrode 2g is placed on the side of the unit 2 facing a light-receiving face 2d and placing the image pickup element 2b at a fixed position with respect to a printed circuit board PC attains ease of electrical connection. Furthermore, a leg 1b of an optical member 1 permits sure setting of the light-receiving face 2d of the image pickup element 2b to a focal position and the optical axis of a convex lens section 1a, in the case that a light transparent protective plate 2a is placed on the face on which the light receiving face 2d of the image pickup element 2b is located. The protective plate 2a can prevent the light receiving face 2d from being damaged in the case of transporting or assembling of the image pickup element 2b, while transmitting an optical image made incident onto the light-receiving face 2d through itself.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an imaging device,
In particular, the present invention relates to an imaging device that can be installed in a mobile phone, a personal computer, and the like.

[0002]

2. Description of the Related Art In recent years, digital image data can be easily handled due to improvements in CPU performance and image processing technology. In particular, mobile phones and P
In the DA, models with a display capable of displaying images are on the market, and a dramatic improvement in wireless communication speed can be expected in the near future.
It is expected that image data is frequently transferred between DAs.

At present, after a subject image is converted into image data by a digital still camera or the like, such image data is transferred via the Internet via a personal computer or the like. However, in such an embodiment, in order to transfer image data, both a digital still camera and a personal computer must be provided. On the other hand, there is an attempt to mount an image pickup device such as a CCD on a mobile phone. According to such an approach, it is not necessary to own a digital still camera or a personal computer, and it is possible to easily capture an image using a portable mobile phone and send it to the other party.

[0004]

However, at present, if a function of a digital still camera, which is much larger than a mobile phone, is provided to the mobile phone, the mobile phone itself becomes large and heavy, and cannot be easily carried. There is a problem. In addition, the manufacturing cost increases accordingly.

In particular, even if the photographing optical system, which is a main component of the digital still camera, and the image sensor are unitized, the light receiving surface of the image sensor must not be properly set at the focal position of the image optical system. However, the problem is how to adjust it. For example, when the image sensor and the imaging optical system are installed on the same substrate, measures such as making the substrate ceramic are necessary to ensure sufficient relative positioning accuracy in order to maintain a good focus state. Becomes However, there is a problem that the ceramic substrate is expensive, thereby increasing the manufacturing cost. Further, there is a case where the variation in the thickness of the adhesive when the imaging optical system and the image sensor are attached to the substrate cannot be ignored.

On the other hand, if a less expensive substrate made of, for example, an epoxy resin is used, the manufacturing cost of the substrate itself can be suppressed. However, since it is difficult to improve the dimensional accuracy of the substrate (including deformation due to temperature change),
It is highly expected that the relative positioning accuracy between the imaging device and the imaging optical system will be reduced in combination with the above-described variation in the adhesive thickness, and therefore, a separate adjustment mechanism is required to maintain a good focus state. As a result, there is a problem that the manufacturing cost is increased. Further, the problems of the prior art will be pointed out with examples.

FIG. 10 is a cross-sectional view of an example of a prior art image pickup device. The image pickup device 1 is mounted on an epoxy substrate PC.
10 are arranged, and are connected to the image processing IC circuit 111 arranged on the rear surface of the substrate PC by a number of wires W from terminals (not shown) on the upper surface.

[0008] A first housing 101 is arranged so as to cover the image pickup device 110, and a second housing 102 is mounted on the first housing 101, and is fastened to the substrate with bolts 103.
An infrared cut filter 104 is arranged between the first housing 101 and the second housing 102.

The upper portion of the second housing 102 is cylindrical, and a male screw 10a is formed on the inner surface thereof.
By screwing 5 a, the lens barrel 105 containing the lens 106 is attached to the second housing 102 so that the position in the optical axis direction can be adjusted. Lens barrel 105
Has a narrowed portion 105b at the top.

As described above, the conventional imaging apparatus is a relatively large-sized apparatus including a large number of components. Therefore, not only the above-described problem of the manufacturing cost is required, but also it takes time to assemble these components, and at the time of assembling. The image sensor 110 and the lens 10 are rotated while the lens barrel 105 is rotated.
It is also necessary to adjust the relative position with respect to 6. In addition, since the terminals of the image sensor 110 are connected to the image processing IC circuit 111 by so-called wire bonding using a large number of wires, there is a problem that it takes time to perform the connection.

The present invention has been made in view of such a problem, and can reduce the number of parts while being inexpensive.
It is an object of the present invention to provide an image pickup apparatus that can be reduced in size, can reduce the time and labor required for adjustment during assembly, and can also avoid the influence of dust and the like.

[0012]

An imaging device according to the present invention is an imaging device arranged on a substrate, including an imaging device having a light receiving surface on which pixels are arranged, and mounted on the substrate. An imaging unit, a lens unit that forms a subject image on the light receiving surface of the imaging device, and an optical member integrally formed with a support unit that supports the lens unit, the imaging unit, An electrode connected to a conductor extending from the pixel through the inside of the image sensor and / or along the side surface is provided on a side facing the light receiving surface, and provided by a support portion of the optical member. In the case where a protective plate capable of transmitting light is provided on the surface on which the light receiving surface of the image sensor is formed, or on the surface on which the light receiving surface of the image sensor is formed, Opposing surface and optical axis direction of the lens unit Wherein the positioning is performed.

[0013]

The image pickup apparatus of the present invention is an image pickup apparatus arranged on a substrate, including an image pickup device having a light receiving surface on which pixels are arranged, and an image pickup unit mounted on the substrate, A lens unit that forms a subject image on a light receiving surface of an image sensor; and an optical member integrally formed with a support unit that supports the lens unit, wherein the imaging unit performs the imaging from the pixels. An electrode connected to a conductor extending through the inside of the element and / or along the side surface is provided on a side facing the light receiving surface, and a light receiving portion of the image sensor is supported by the support of the optical member. When a protective plate capable of transmitting light is provided on the surface on which the surface is formed, or on the surface on which the light receiving surface of the image sensor is formed, a surface of the protective plate facing the lens unit; Positioning in the optical axis direction with the lens Is shall.

That is, since an electrode connected to a conductor extending from the pixel through the inside of the image pickup device and / or along the side surface is provided on the side facing the light receiving surface. By placing the image sensor at a fixed position with respect to the substrate, electrical connection can be easily achieved, and it is not necessary to perform complicated wire bonding or the like as in the related art, so that the assembling property is improved and the apparatus is downsized. Also contribute to. Further, in the case where a protective plate capable of transmitting light is provided on the surface on which the light receiving surface of the image sensor is formed, or on the surface on which the light receiving surface of the image sensor is formed, by the support of the optical member. Since the surface of the protection plate facing the lens unit and the positioning of the lens unit in the optical axis direction are performed, the light receiving surface of the image sensor is located at the in-focus position of the lens unit even when assembled without adjustment. Can be accurately set, and a configuration such as an adjusting mechanism is not required, so that the number of parts can be reduced and the size of the apparatus can be reduced. In addition, when the protection plate is provided, the optical image incident on the light receiving surface can be transmitted, and the light receiving surface can be prevented from being damaged by the protection plate when the imaging device is transported or assembled.

Further, if positioning of the light receiving surface in the direction perpendicular to the optical axis of the lens unit with respect to the optical axis of the lens unit is performed by a surface parallel to the optical axis of the lens unit in the support unit of the optical member, It is not necessary to perform the positioning adjustment in the right angle direction, and the assembling property is further improved. Preferably, the parallel surfaces are two surfaces or curved surfaces extending in different directions, because positioning in the direction perpendicular to the optical axis can be uniquely performed.

Further, if there is a gap between the optical member and the substrate, interference between the optical member and the substrate at the time of assembly can be prevented, and a shift of the focus position can be suppressed.

Furthermore, if small holes are formed in portions other than the lens portion of the optical member, it is possible to prevent large dust from entering while ensuring air permeability.

Preferably, the lens portion of the optical member is a positive lens having a stop on the object side and having a surface with a strong curvature on the image side.

Further, if at least a part of the optical member other than the lens portion is made of a member having a light-shielding property, unnecessary light which is not involved in image formation is incident on the light receiving surface of the image pickup device. Can be suppressed.

Further, when the optical member has a structure in which the surface roughness of the inner surface of at least a portion other than the lens portion is roughened, unnecessary reflection of light which is not involved in image formation is suppressed, and light receiving by the image pickup device is suppressed. The incidence on the surface can be suppressed.

Further, the angle formed by at least a part of the inner surface of the support portion of the optical member from the lens portion toward the image sensor and the light receiving surface of the image sensor is 90.
When it is less than the degree, reflection of unnecessary light not involved in image formation on the inner surface of the support portion can be suppressed, and incidence on the light receiving surface of the image sensor can be suppressed.

Further, when a light-shielding member having an opening is disposed between the lens portion of the optical member and the protection plate, unnecessary light not involved in image formation is incident on the light-receiving surface of the image sensor. Can be suppressed.

Further, if the protective plate is formed of an infrared absorbing member, it is not necessary to separately provide an infrared absorbing filter, and the configuration is further simplified.

Further, when at least the lens portion of the optical member is formed of an infrared absorbing member, there is no need to separately provide an infrared filter, and the configuration can be simplified.

Further, if at least one surface of the lens portion of the optical member is provided with a coating having an infrared cut characteristic, it is not necessary to separately provide an infrared filter, and the configuration can be simplified.

[0026]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram illustrating an imaging device according to the first embodiment. FIG. 2 is a view of the image pickup device of FIG. 1 cut along a line II-II and viewed in a direction indicated by an arrow.
Such an imaging device includes an optical member 1 and an imaging unit 2.

The optical member 1 is made of a transparent resin material.
It is integrally formed of a square tubular leg 1b, a rectangular plate-shaped upper portion 1c for closing the upper end of the leg 1b, and a convex lens portion 1a formed at the center of the upper portion 1c. In addition, on the upper surface of the upper surface portion 1c, around the convex lens portion 1a, an aperture plate 3 made of a light shielding member and defining the F number of the convex lens portion 1a is arranged. The leg 1b and the upper surface 1c form a support.

As is apparent from FIG. 2, a notch 1d is formed inside the lower end of the leg 1b of the optical member 1, and the notch 1d has a shoulder (a protection plate 2a to be described later) of the image pickup unit 2. Are engaged. The lower end of the leg 1b and the board PC
A gap Δ is formed between the optical member 1 and the upper surface of the imaging unit 2 instead of the substrate PC. Such attachment is preferably performed using an adhesive, but is not limited thereto. Note that the protection plate 2a is not an essential component of the imaging unit 2, and in the case of an imaging unit without the protection plate 2a, the notch 1d is engaged with the shoulder of the imaging element 2b.

FIG. 7 is a diagram for explaining in detail the positioning structure of the optical member and the image pickup unit according to the present embodiment. Although the optical member 1 is shown in a separated state in FIG. 7, when the optical member 1 and the imaging unit 2 are assembled, as described above, the convex lens is engaged with the notch 1 d of the optical member 1 by engaging the upper surface of the protective plate 2. Part 1a and light receiving surface 2b of image sensor 2b
(FIG. 2) can be achieved. Further, the four inner surfaces 1f and 1g of the leg 1b below the notch 1d abut on the side surface of the imaging unit 2 so that the convex lens portion 1a and the light receiving surface 2b (FIG. 2) of the imaging device 2b are perpendicular to the optical axis. Directional positioning can be achieved.

FIG. 8 is a view showing a modification of the positioning structure between the optical member and the image pickup unit. In contrast to the embodiment of FIG. 7, a cutout 1e is formed in the center of the four lower edges of the leg 1b 'of the optical member 1', thereby forming the inner surfaces 1f ', 1f.
The only difference is that g ′ is reduced. Inner surface 1f ',
1g ′ is in contact with the side surface of the imaging unit 2, whereby positioning of the convex lens portion 1a and the light receiving surface 2b (FIG. 2) of the imaging element 2b in the direction perpendicular to the optical axis can be achieved. The positioning of the convex lens portion 1a and the light receiving surface 2b of the image sensor 2b in the direction perpendicular to the optical axis is performed by at least one inner surface 1f, 1g (or 1f ', 1g') extending in at least a different direction. Therefore, it is not necessary to finish all the inner surfaces with high precision because the contact is sufficiently achieved. Thereby, manufacturing costs can be reduced.

As shown in FIG. 2, the imaging unit 2
The upper and lower surfaces of the imaging element 2b such as a CD or CMOS are made of glass or resin (the material is not limited to these).
Is sandwiched between a protective plate 2a and a plate 2c made of glass or resin (the material need not be transparent, and the material is not limited to these).

At the center of the upper surface of the image sensor 2b, a light receiving surface 2d
(FIG. 1) is formed, and a terminal 2f for outputting an electric signal from a pixel (not shown) on the light receiving surface 2d, which is arranged near both sides of the upper surface of the image pickup device 2b, is connected to a conductor. A certain wiring 2e extends outward through the space between the protection plate 2a and the wiring 2e extends downward along the side surface of the imaging unit 2 and goes around the lower surface of the protection plate 2c to terminate. are doing. At the end, an electrode 2g projecting downward and coming into contact with a copper foil (not shown) on the substrate PC is formed. The copper foil is connected to a predetermined circuit on the substrate PC such as an A / D conversion circuit (not shown).

FIG. 9 is a sectional view showing a modification of the image pickup unit. The imaging unit 2 ′ according to the modification has a different wiring configuration. That is, the wiring 2e ', which is a conductor, is connected to the imaging element 2b and the terminal 2f which is arranged near both sides of the upper surface of the imaging element 2b' and outputs an electric signal from a pixel (not shown) on the light receiving surface 2d. It penetrates through the inside of the protection plate 2c to reach its lower surface, and terminates at the electrode 2g.

The operation of this embodiment will be described. The convex lens section 1a of the optical member 1
An image is formed on the light receiving surface 2d of b. The imaging element 2b outputs an electric signal according to the amount of received light via the wiring 2e,
This is processed by an A / D conversion circuit or an image processing circuit so that it can be output as an image signal.

Here, the convex lens portion 1a of the optical member 1,
If the distance L between the light receiving surface 2d of the image sensor 2b and the light receiving surface 2d is not within a predetermined narrow range, an image obtained from the image pickup device will be blurred. In the present embodiment, since the optical member 1 is not mounted on the substrate PC but mounted on the imaging unit 2, the precision of the leg 1b of the optical member 1 and the thickness of the protection plate 2a are managed. By doing so, the above-described distance L can be kept within a predetermined range. Therefore, it is not necessary to adjust the focusing position of the convex lens portion 1a at the time of assembly. Here, the predetermined range is defined as the difference between the light receiving surface 2d of the image sensor 2b and the image point of the convex lens portion 1a of the optical member 1 as ± F × 2 in air conversion length.
It refers to a range of about P (F: F number of lens unit, P: pixel pitch of the image sensor).

Further, the image pickup device 2b includes a transparent protective plate 2
a and 2c, the image pickup device 2 including the light receiving surface 2d can be secured when the image pickup device 2b is transported or assembled while securing the transmission of the optical image incident on the light receiving surface 2d.
b can prevent the upper and lower surfaces from being damaged. Further, in the present embodiment shown in FIG. 2, the wiring 2e from the light receiving surface 2d of the image sensor 2b is taken out through the space between the light receiving surface 2d and the upper protective plate 2a, and is taken out from the lower protective plate 2a. 2c, the electrode 2
g, is connected to the wiring (copper foil) of the substrate PC,
In the modification shown in FIG. 9, the wiring 2e 'from the light receiving surface 2d of the imaging element 2b penetrates the inside of the imaging element 2b and the protection plate 2c to the lower surface thereof, and the wiring (e.g., wiring) of the substrate PC via the electrode 2g. (Copper foil), the electrical connection is achieved only by installing the imaging unit 2 on the substrate PC.

Further, in the present embodiment, the aperture plate 3
Is provided on the incident surface side of the convex lens portion 1a, so that the light beam incident on the image sensor 2b is incident at an angle close to vertical,
That is, it can be made close to telecentric, whereby a high-quality image can be obtained. The shape of the convex lens portion 1a is a positive lens shape having a surface with a strong curvature facing the image side, so that the aperture plate 3 and the convex lens portion 1 are formed.
The distance from the principal point of “a” can be made large, and a desirable configuration closer to telecentricity can be obtained. In the present embodiment, the convex lens portion 1a has a positive meniscus shape with the convex surface facing the object side. The lens data of the convex lens portion 1a is shown below.

[Table 1] For the symbols in the table, f is the focal length (mm) of the entire system,
F is the F number, ω is the half angle of view (°), r is the radius of curvature (m
m) and d are the axial top surface intervals (mm), nd is the refractive index for d-line, and νd is the Abbe number.

The surface No. The asterisk * indicates an aspherical surface, and the aspherical surface has a vertex curvature of C,
The conic constant is K, and the aspheric coefficients are A ₄ , A ₆ , A ₈ , A ₁₀ , A
₁₂ is represented by the following equation.

(Equation 1)

(Equation 2)

It is conceivable that the image pickup unit 2 is sealed and protected by the optical member 1 in the assembled state. In this case, however, there is a concern about the influence of the compression and expansion of the internal air due to the temperature change. Therefore, by providing a small hole communicating with the outside in any one of the optical members 1, it is possible to avoid the influence of the compression and expansion of the internal air. It should be noted that a large external foreign substance cannot enter the inside through the small hole.

As a modification of the present embodiment, the protection plate 2a
Alternatively, by making the material of the optical member 1 a member capable of absorbing infrared rays, it is possible to eliminate the need to separately provide an infrared absorption filter and to further simplify the configuration of the imaging device. Alternatively, a similar effect can be obtained by coating the surface of the protection plate 2a or the convex lens 1a of the optical member 1 with infrared rays.

FIGS. 3 to 6 are sectional views of an optical member according to the second embodiment. As in the embodiment described above,
If the convex lens portion 1a and the leg portion 1b are formed of an integral transparent material, unnecessary light that has entered from the outside may enter the light receiving surface 2d of the image sensor 2b, causing ghosts and flares, thereby deteriorating the image quality. is there. Therefore, the second
In the embodiment, such a disadvantage is suppressed by configuring a part of the optical member with a member having a light shielding property.

In the embodiment shown in FIG. 3A, the leg 1b and the upper surface 1c other than the lens 1a are formed of a light-shielding resin, and the convex lens 1a formed of a transparent resin is formed by injection molding. Are integrated. According to such a configuration, incidence of unnecessary light from the outside is suppressed. Further, since the upper surface portion 1c also has a light shielding property, an aperture effect can be obtained, and the aperture plate 3 can be omitted. The convex lens portion 1a
Although the refractive index and the lens shape change due to temperature changes, the image point position fluctuates, but the material that expands or contracts so as to eliminate it is used for the leg 1b to improve the temperature characteristics of the entire imaging device. Can be done.

In the embodiment shown in FIG. 3B, a resin having a light-shielding property is integrated by injection molding so as to be arranged outside the optical member 1. In the embodiment shown in FIG. 3C, a resin having a light-shielding property is integrated by injection molding so as to be arranged inside the optical member 1. The effect is that unnecessary unnecessary light from the outside can be cut, and at the same time, the aperture can also be used.

In the embodiment shown in FIG. 4, a light-shielding plate 4 serving as a light-shielding member is provided between the convex lens 1a and the image pickup unit 2 so that unnecessary light reflected on the inner surface of the optical member 1 is removed.
b can be suppressed from being incident on the light receiving surface 2d. It is preferable that the light shielding plate 4 is provided with a rectangular opening 4a according to the shape of the light receiving surface 2d. Further, FIGS. 3 (a) to 3 (c)
When combined with this configuration, unnecessary light from outside can be cut off,
A good image without ghost or flare can be obtained.

In the embodiment shown in FIG. 5, the influence of the internal reflection is suppressed by increasing the roughness of the inner surface of the leg portion 1b of the optical member 1. As a method of increasing the roughness,
It is conceivable to treat the resin surface with mechanical processing or a chemical treating agent. However, as shown in FIG. 5B showing the optical member separated vertically, forming irregularities extending in the direction of removing the mold. Thus, it is conceivable to improve the roughness of the inner surface of the leg 1b. Further, when the configurations of FIGS. 3A to 3C and the configuration of FIG.
The effect of internal reflection can be suppressed, and a better image free of ghost and flare can be obtained.

In the embodiment shown in FIG.
When the light having an angle of view larger than the required angle of view is incident on the lens portion 1a of the optical member 1 by reducing the angle θ between the optical element b and the image pickup device 2b (especially the light receiving surface), the incident light is reflected on the inner surface of the optical member. The reflected light can be prevented from reaching the light receiving surface 2d of the image sensor 2b. In this configuration, when the light shielding plate 4 shown in FIG. 4 is installed between the convex lens 1 and the imaging unit 2, the effect is further increased. Further, when the configurations shown in FIGS. 3A to 3C and the configuration shown in FIG. 4 are also combined, it is possible to cut unnecessary light from outside and suppress the influence of internal reflection,
A better image without ghosts and flares can be obtained.

Although the present invention has been described with reference to the embodiments, it should be understood that the present invention should not be construed as being limited to the above-described embodiments, and that modifications and improvements can be made as appropriate. is there. It is considered that the imaging device of the present invention can be incorporated in various devices such as a mobile phone, a personal computer, a PDA, an AV device, a television, and home appliances.

[0048]

According to the present invention, the number of components can be reduced, the size can be reduced, and the positioning of the lens and the image pickup device in the optical axis direction and in the direction perpendicular to the optical axis can be performed without adjustment, for example, while being inexpensive. By doing so, it is possible to provide an image pickup apparatus that can reduce the trouble of adjustment at the time of assembling and can avoid the influence of dust and the like.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating an imaging apparatus according to a first embodiment.

FIG. 2 is a view of the imaging device of FIG. 1 cut along a line II-II and viewed in a direction of an arrow.

FIG. 3 is a sectional view of an optical member according to a second embodiment.

FIG. 4 is a sectional view of an optical member according to a second embodiment.

FIG. 5 is a sectional view of an optical member according to a second embodiment.

FIG. 6 is a sectional view of an optical member according to a second embodiment.

FIG. 7 is a diagram for explaining in detail a positioning configuration of the optical member and the imaging unit according to the embodiment;

FIG. 8 is a diagram illustrating a modification of the positioning configuration of the optical member and the imaging unit.

FIG. 9 is a cross-sectional view illustrating a modification of the imaging unit.

FIG. 10 is a cross-sectional view of an example of a conventional imaging device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 1 'Optical member 1a Convex lens part 1b Leg part 2, 2' Imaging unit 2a, 2b Protective plate 2b Image sensor 2d Light receiving surface 3 Aperture plate 4 Light shielding plate

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Masafumi Mizukami 2970 Ishikawacho, Hachioji-shi, Tokyo Inside Konica Corporation (72) Inventor Hiroyuki Hattori 2970 Ishikawacho, Hachioji-shi, Tokyo Inside Konica Corporation (72) Inventor Susumu Yamaguchi 2970 Ishikawacho, Hachioji-shi, Tokyo F-term within Konica Corporation (reference) 2H087 KA01 PA01 PA17 PB01 QA03 QA07 QA12 QA32 RA05 RA13 RA34 RA44 UA01 5C022 AB43 AB51 AC42 AC63 AC70 AC78 5C024 CX01 CY47 CY48 CY47 CY47 CY47 CY47 CY47 CY47

Claims (12)

[Claims] 1. An image pickup device arranged on a substrate, comprising: an image pickup device having a light receiving surface on which pixels are arranged; an image pickup unit mounted on the substrate; and a light receiving surface of the image pickup device A lens unit that forms a subject image on the optical unit, and an optical member integrally formed with a supporting unit that supports the lens unit. And / or an electrode connected to a conductor extending along a side surface is provided on a side facing the light receiving surface, and a light receiving surface of the image sensor is formed by a support of the optical member. If a protective plate capable of transmitting light is provided on a surface or a surface on which the light receiving surface of the image sensor is formed, a surface of the protective plate facing the lens unit,
An image pickup device, wherein positioning with respect to the lens unit in the optical axis direction is performed. 2. The positioning of the light receiving surface in a direction perpendicular to the optical axis with respect to the optical axis of the lens unit is performed by a surface parallel to the optical axis of the lens unit in the support unit of the optical member. The imaging device according to claim 1. 3. The imaging device according to claim 1, wherein there is a gap between the optical member and the substrate. 4. A part other than the lens part of the optical member,
4. A small hole is formed.
The imaging device according to any one of the above. 5. The lens unit according to claim 1, wherein the lens unit of the optical member is a positive lens having a stop on the object side and a surface with a strong curvature facing the image side. Imaging device. 6. The imaging device according to claim 1, wherein at least a part of the optical member other than the lens portion is formed of a member having a light-shielding property. 7. The imaging device according to claim 1, wherein the optical member has a structure in which at least a portion other than the lens portion has a roughened inner surface. 8. An angle between at least a part of an inner surface of the supporting portion of the optical member from the lens portion toward the image sensor and a light receiving surface of the image sensor is less than 90 degrees. The imaging device according to claim 1. 9. The imaging device according to claim 1, wherein a light-shielding member having an opening is arranged between the lens portion of the optical member and the protection plate. 10. The imaging device according to claim 1, wherein the protection plate is formed of an infrared absorbing member. 11. The imaging device according to claim 1, wherein at least the lens portion of the optical member is formed of an infrared absorbing member. 12. The imaging device according to claim 1, wherein at least one surface of the lens portion of the optical member is provided with a coating having an infrared cut characteristic.