JP2002289729A - Pin standing resin substrate, method for manufacturing pin standing resin substrate, pin and method for manufacturing pin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pin standing resin substrate where a pin is hard to be broken even if stressed, a method for manufacturing the pin standing resin substrate, the pin for the pin standing substrate, and a method for manufacturing the pin. SOLUTION: The pin standing resin substrate 11 comprises a resin substrate 13 having a pin pad 17AP that is composed of resin or the like and exposed in a main plane 13A and many pins 1 bonded to the pin pad 17AP with solder HD. The pin 1 is subjected to heat treatment to heat it to 600-900 deg.C. In addition, the pin 1 has rod-like part 1A and a large diameter part 1B including the spherical surface that balloons in the direction opposite to this rod-like part 1A. The large diameter part 1B or the like is soldered to the pin pad 17AP.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin-standing resin substrate on which pins as input / output terminals are erected, a method of manufacturing the pin-standing resin substrate, and an input / output terminal used for the pin-standing substrate. The present invention relates to a pin and a method for manufacturing the pin, and more particularly to a pin-equipped resin substrate having improved bonding strength between the pin and the resin substrate, a method for manufacturing the pin-equipped resin substrate, and a bonding strength with the resin substrate. Can improve the pin,
And a method of manufacturing the pin.

[0002]

2. Description of the Related Art Conventionally, pins as input / output terminals have been
2. Description of the Related Art There is known a pin-equipped resin substrate erected on a resin substrate made of a resin or a composite material containing a resin. For example, a pin standing resin substrate 201 whose partial cross-sectional view is shown in FIG. This pin standing resin substrate 201
Is composed of a substantially rectangular, substantially plate-shaped resin substrate 203 and a number of pins 221 standing upright.

[0003] Among them, a resin substrate 203 has a resin insulating layer 205 in which a wiring layer (not shown) is formed inside or on the surface.
On the main surface 203A side (upper side in the figure), a number of pin pads 209 exposed from the solder resist layer 207 are formed. On the other hand, the pin 221 is made of, for example, a 194 alloy, and has a substantially cylindrical rod-shaped portion 221A and a substantially disc-shaped large-diameter portion 2 formed at the end on the pin pad 209 side.
21B. And this pin 221
The entire large-diameter portion 221B and a part of the rod-shaped portion 221A on the large-diameter portion 221B side are fixed to the resin substrate 203 by being joined to the pin pad 209 by solder HD. The pin 221 may be made of a copper-based metal such as pure copper, phosphor bronze, nickel silver, beryllium copper, Kovar (Fe-Ni-Co alloy),
A pin made of an iron-based metal such as a 2 alloy (Fe-42 wt% Ni alloy) is used.

[0004]

However, such a pin-upstanding resin substrate 201 has a low bonding strength between the pin 221 and the pin pad 209 when a stress is applied to the pin 221. May be destroyed.

The present invention has been made in view of the above circumstances, and has a pin-standing resin substrate which is hardly broken even when stress is applied to the pin, a method of manufacturing the pin-standing resin substrate,
An object of the present invention is to provide a pin used for a pin standing substrate and a method for manufacturing the pin.

[0006]

Means for Solving the Problems, Actions and Effects The means for solving the problem is a resin made of a resin or a composite material containing a resin having a substantially plate shape having a main surface, and having a pin pad exposed on the main surface. A substrate and a pin soldered to the pin pad are provided, and the pin is softened by heat treatment by heating, and is made of a rod-shaped portion and the same material as the rod-shaped portion. A large-diameter portion formed at one end of the rod-shaped portion, and at least the large-diameter portion is soldered to the pin pad.

A pin is generally obtained by forming a wire into a predetermined shape. However, when the material is formed into a wire having a predetermined diameter, the pin is processed by drawing or the like, and thus becomes hard due to processing distortion.
In addition, it is hardened by processing for forming a large diameter portion. For this reason, it is considered that the pin is harder than the material itself. On the other hand, according to the present invention, the pins are softened by heat treatment by heating as compared to before the heat treatment. For this reason, when stress is applied to the pin, the pin itself is deformed and absorbs the stress, so that the stress applied to the joint portion between the pin and the resinous substrate and the stress applied to the resinous substrate body can be reduced. Therefore, even if stress is applied to the pins, this pin-standing resin substrate is not easily broken and has high reliability.

[0008] By the way, in a pin-erected ceramic substrate in which a pin is erected on a ceramic substrate, a pin has been conventionally heat-treated at a high temperature.
This is because the pins are usually brazed to the ceramic substrate, and are naturally exposed to a high temperature of about 800 ° C. during the bonding. On the other hand, in the case of the resin substrate with the pins standing, the pins are soldered at a low temperature of about 200 to 300 ° C. in consideration of the heat resistance of the resin substrate, so that the pins themselves may be particularly exposed to a high temperature. No, and therefore the pin was hard and could not absorb as much stress.

However, in the present invention, as described above, since the pins are heat-treated and softened, the stress applied to the pins is easily absorbed, and the pin-standing resin substrate is not easily broken. As the material of the pin, any metal material may be used as long as the rod portion and the large-diameter portion are the same material. For example, pure copper (oxygen-free copper), 194 alloy (copper alloy), phosphor bronze , Nickel-base, brass, and the like, and iron-base metals such as Kovar (iron-nickel-cobalt alloy) and 42 alloy (iron-nickel alloy).

Still another solution is to provide a resin substrate having a substantially plate shape having a main surface, made of resin or a composite material containing a resin, having a pin pad exposed on the main surface, and a solder on the pin pad. A pin that has been subjected to a heat treatment of heating to 600 ° C. or more, and is made of the same material as the rod-shaped part, and has a diameter larger than that of the rod-shaped part. And a large-diameter portion formed at one end, wherein at least the large-diameter portion is soldered to the pin pad.

The pin is generally considered to be harder than the material itself due to processing distortion during molding. On the other hand, according to the present invention, the pins are subjected to a heat treatment of heating to 600 ° C. or higher. For this reason, when stress is applied to the pin, the pin itself is deformed and absorbs the stress, so that the stress applied to the joint portion between the pin and the resinous substrate and the stress applied to the resinous substrate body can be reduced. Therefore, even if stress is applied to the pins, this pin-standing resin substrate is not easily broken and has high reliability.

Still another solution is to provide a resin substrate having a substantially plate shape having a main surface, made of a resin or a composite material containing a resin, having a pin pad exposed on the main surface, and soldering to the pin pad. The pin has been subjected to a heat treatment of heating to 600 ° C. or more and 900 ° C. or less, and is made of the same material as the rod-shaped part, and has a diameter larger than that of the rod-shaped part. A large-diameter portion formed at one end of the portion, and at least the large-diameter portion is soldered to the pin pad.

According to the present invention, the pin is set at a temperature of 600 ° C. or more.
Since the heat treatment for heating to 00 ° C. or less has been performed, the pin is softer than a pin not subjected to such heat treatment. For this reason, when stress is applied to the pin, the pin itself is deformed and absorbs the stress, so that the stress applied to the joint portion between the pin and the resinous substrate and the stress applied to the resinous substrate body can be reduced. Therefore, even if stress is applied to the pins, this pin-standing resin substrate is not easily broken and has high reliability.

By the way, in a pin-standing ceramic substrate in which a pin is erected on a ceramic substrate, a pin has been heat-treated at a high temperature.
This is because the pins are usually brazed to the ceramic substrate and are naturally exposed to high temperatures during the bonding. On the other hand, in the case of the pin-standing resin substrate, since the pins are soldered at a low temperature of about 200 ° C. in consideration of the heat resistance of the resin substrate, the pins are not particularly exposed to a high temperature. Was hard and could not absorb as much stress.

However, in the present invention, as described above, since the pins are heat-treated at a high temperature and become soft,
The stress applied to the pin is easily absorbed, and the pin-standing resin substrate is not easily broken. As the material of the pin, any material may be used as long as the rod-shaped portion and the large-diameter portion are the same material. For example, pure copper (oxygen-free copper), 194 alloy (copper alloy), phosphor bronze, Copper-based metals such as nickel silver and brass, Kovar (iron / nickel / cobalt alloy), 42 alloy (iron / nickel)
Iron alloys such as nickel alloy).

Still another solution is to provide a resin plate having a substantially plate shape having a main surface, made of resin or a composite material containing resin, and having a pin pad exposed on the main surface, and a solder joint to the pin pad. A pin-shaped portion made of Kovar or 42 alloy, wherein the pin has been subjected to a heat treatment of heating to 700 ° C. or more,
It is made of the same material as this rod-shaped part, and is larger in diameter than this rod-shaped part.
A large-diameter portion formed at one end of the rod-shaped portion, and at least the large-diameter portion is soldered to the pin pad.

The pin made of Kovar or 42 alloy is harder than the material itself without processing distortion due to processing distortion during molding. On the other hand, according to the present invention, the pin made of Kovar or the like is subjected to a heat treatment of heating to 700 ° C. or more. For this reason, the pin is reliably and sufficiently softened. For this reason, when stress is applied to the pin made of Kovar or the like, the pin itself is deformed and absorbs the stress, so that the stress applied to the joint between the pin and the resin substrate and the stress applied to the resin substrate main body are reduced. be able to. Therefore, even if stress is applied to the pins, this pin-standing resin substrate is not easily broken and has high reliability. In particular, when heated to 900 ° C. or higher, particularly high connection reliability such as a sufficiently high tensile strength can be obtained. In addition, Kovar and 4
The heat treatment of the two alloys may be appropriately selected within a range lower than the melting points, but if the treatment is performed at an excessively high temperature, it is preferable to set the temperature to, for example, 1100 ° C. or less in consideration of the fact that heating is expensive.

Still another solution is to provide a resin plate having a substantially plate shape having a main surface, made of resin or a composite material containing resin, and having a pin pad exposed on the main surface, and a solder joint to the pin pad. A pin made of Kovar or 42 alloy, and made of the same material as the bar, formed larger in diameter than the bar, and formed at one end of the bar. Large diameter part,
A Vickers hardness Hv ≦ 200, and at least the large-diameter portion is a pin-standing resin substrate soldered to the pin pad.

As described above, a pin obtained by molding a wire into a predetermined shape has a processing distortion when a Kovar or 42 alloy material is formed into a wire having a predetermined diameter and a processing for forming a large diameter portion. It is considered that the pin is harder than the material itself because the pin is work-hardened by the method and the like. It is considered that the hardness of the pin made of Kovar or 42 alloy is Vickers hardness Hv> 200, for example, about Hv = 250. Even if such a hard pin is fixed to the resin substrate by soldering, when stress is applied to the pin, it is considered that the pin is hard to be deformed because it is hard, and is likely to be broken between the pin and the resin substrate.

On the other hand, according to the present invention, the pin is a soft pin having a Vickers hardness Hv ≦ 200 while being a pin made of Kovar or 42 alloy. For this reason, when stress is applied to the pin, the pin itself is deformed and absorbs the stress, so that the stress applied to the joint portion between the pin and the resinous substrate and the stress applied to the resinous substrate body can be reduced. Therefore, even if stress is applied to the pins, this pin-standing resin substrate is not easily broken and has high reliability. In order to set the pin to Vickers hardness Hv ≦ 200, any method may be used. However, the pin is manufactured by a method that does not harden such as casting, and is formed by a normal method such as using a press and then heated. Method,
For example, a method of heating with a pin placed in a high-frequency electromagnetic field,
A method of irradiating a laser beam to heat a pin, a method of putting a pin into a furnace having a heater and heating the pin with radiant heat, and the like are given.

The above-mentioned pin-standing resin substrate,
It is preferable that the pin is a resin-made resin substrate provided with a pin standing which has been subjected to a heat treatment for reducing Vickers hardness.

In the present invention, since the pins are subjected to heat treatment for reducing the Vickers hardness, the pins are manufactured by a normal manufacturing method and the Vickers hardness is reduced by the subsequent heat treatment. Thus, an inexpensive pin-made resin substrate can be obtained.

Further, it is preferable that the pin-standing resin substrate is a pin-standing resin substrate which has been subjected to a heat treatment for passing through a belt furnace. If the heat treatment is performed in a belt furnace, the entire pins can be uniformly and reliably heated and heat-treated, and the processing can be performed at a low cost, so that an inexpensive pin-made resin substrate can be obtained.

The solder used for soldering the pins is determined in consideration of the heat resistance of the resin substrate with the pins mounted thereon, the soldering temperature when electronic components such as IC chips are mounted on the resin substrate with the pins mounted, and the like. May be selected appropriately. For example, Sn
/ Sb solder, Pb / Sn solder, Sn / Ag solder and the like. These solders have C
u, Ag, Bi, Au, Pb, In, Al, As, etc. are also included. Therefore, in the pin-made resin substrate according to any one of the above, the solder is Sn / S
It is preferable to use a pin-made resin substrate that is one of b-based solder, Pb / Sn-based solder, and Sn / Ag-based solder. Above all, Sn / Sb-based solder has a slightly lower wettability than Pb / Sn-based solder and has a property that it is relatively hard to spread and spread. It is preferable in that it can be performed.

[0025] Further, in any of the above-mentioned pin standing resin substrates, it is preferable that the pins are made of pin standing resin substrates that are mechanically polished prior to the heat treatment. When the pin is manufactured by a press or the like, burrs or the like may be formed at various places or sharp corners may be formed. Such burrs and sharp corners are easily peeled off and become fine metal powder and adhere to various parts of the substrate or other electronic components, which may cause a short circuit or poor insulation. Removal of burrs or chamfering of sharp corners is performed by polishing. Such mechanical polishing may be performed before or after the heat treatment of the pin. However, when such mechanical polishing is performed, the pin surface becomes hard due to the collision of media, abrasive grains, and the like with the pin surface. Therefore, if mechanical polishing is performed after softening the pin by heat treatment, it is not preferable because the softened pin is hardened again.

On the other hand, if the mechanical polishing is performed prior to the heat treatment as described above, even if the pins are hardened by the mechanical polishing, the pins can be softened by the heat treatment. Can be eliminated.
Examples of mechanical polishing include barrel polishing, sand blast, shot blast, water jet containing abrasive particles, liquid honing, and polishing with a brush containing an abrasive. Among them, barrel polishing is preferably used as mechanical polishing. According to barrel polishing, a large number of pins can be processed simultaneously and inexpensively, and burrs and chamfering can be uniformly performed on each pin.

[0027] Further, in the pin-made resin substrate according to any one of the above, the pins have an average value of 30 ° oblique tensile strength per unit area of the pin pad of 31.8 N / m.
It is preferable to use a resin substrate with pins standing up to m2. In such a pin-made resin substrate, the connection strength of the pins is high, and even if stress is applied to the pins, the pins are not easily broken,
High reliability.

[0028] Further, in the pin standing resin substrate according to any of the above, the pin has a minimum value of 30 ° oblique tensile strength per unit area of the pin pad of 28.3 N / m.
It is preferable to use a resin substrate with pins standing up to m2. With such a pin-standing resin substrate, the connection strength of the pins is high, and there is no extremely low connection strength due to the variation of the connection strength. Therefore, even if stress is applied to the pins, the pins are not easily broken, and the reliability is particularly high. Is high.

[0029] Further, the pin-erected resin substrate according to any of the above, wherein the large-diameter portion of the pin includes a spherical surface bulging in a direction opposite to the rod-shaped portion side. It is good to

According to the present invention, since the large-diameter portion of the pin has a spherical surface bulging in the direction opposite to the rod-like portion side, the pin and the pin pad are in a state in which the spherical surface of the large-diameter portion faces the pin pad side. And soldered. As a result, a larger amount of solder can be secured between the large-diameter portion of the pin and the pin pad than a pin having a large-diameter portion, such as a nail-head-shaped pin. Can be improved. Further, since the large-diameter portion has a shape including a spherical surface, when stress is applied to the pin, the stress is not concentrated at a specific point, but is easily absorbed by the entire joint.
Therefore, the stress applied to the pin body and the stress applied to the resin substrate body can be reduced. Furthermore, the pins are softened by heat treatment at high temperature, so when stress is applied to the pins, the pins themselves deform and absorb the stress,
The stress applied to the joint between the pin and the resin substrate and the stress applied to the resin substrate main body can be reduced. Therefore,
This pin-standing resin substrate, due to these synergistic effects,
Even if stress is applied to the pin, the pin is not easily broken and has high reliability.

Further, in the pin-equipped resin substrate according to any of the above, the resin substrate has a concave portion on the main surface at which the pin pad is exposed at least at the bottom,
The pin may be a pin-standing resin substrate in which at least the large-diameter portion is housed in the recess and at least a part of the rod-shaped portion projects from the main surface.

In order to increase the bonding strength between the pin and the resin substrate, generally, the height of the large diameter portion (length in the axial direction) is increased, and the amount of solder for bonding the pin and the pin pad is increased. It is preferable to secure a large amount. However, if the height of the large-diameter portion is increased, the gap between the pin-standing resin substrate and the socket or the like tends to be large when the pin is inserted into the socket or the like because the large-diameter portion is present. On the other hand, the pin-erected resin substrate of the present invention has a recess in which the pin pad is exposed at least at the bottom, and the large-diameter portion of the pin is housed in this recess. Therefore, when the pin is inserted into the socket or the like, the gap between the pin standing resin substrate and the socket or the like can be reduced even though the pin has a large diameter portion.

Another solution is to provide a rod-shaped part and a large-diameter part made of the same material as the rod-shaped part, having a diameter larger than the rod-shaped part and formed at one end of the rod-shaped part. A pin heat treatment step of softening the pins by applying heat treatment by heating, and a resin substrate having a substantially plate shape having a main surface, made of resin or a composite material containing resin, and having a pin pad exposed on the main surface. A pin fixing step of contacting the pin pad with the large diameter portion of the pin and soldering the pin pad and at least the large diameter portion of the pin to the pin pad. Is the way.

According to the present invention, in the pin heat treatment step, heat treatment for heating the pins is performed to soften the pins. Then, in the pin fixing step, the pin that is no longer softened is soldered to a pin pad of the resin substrate. Therefore, when the stress is applied to the pins of the manufactured pin standing wiring board, the pins themselves easily absorb the stress, so that the stress applied to the joint between the pin and the resin substrate or the resin substrate body is reduced. be able to. Therefore, according to this manufacturing method, it is possible to manufacture a pin-standing resin substrate that is not easily broken even when stress is applied to the pins.

Still another solution is to have a rod-shaped portion and a large-diameter portion made of the same material as the rod-shaped portion, having a diameter larger than that of the rod-shaped portion, and formed at one end of the rod-shaped portion. A pin heat treatment step of heating the pins to 600 ° C. or higher, and a resin substrate having a substantially plate shape having a main surface, made of resin or a composite material containing resin, and having a pin pad exposed on the main surface. A pin fixing step of contacting the pin pad with the large-diameter portion of the pin, and soldering the pin pad and at least the large-diameter portion of the pin to the pin pad. It is a manufacturing method.

According to the present invention, in the pin heat treatment step, heat treatment for heating the pin to 600 ° C. or more is performed.
This makes the pins softer. Then, in the pin fixing step, the pin that is no longer softened is soldered to a pin pad of the resin substrate. Therefore, when the stress is applied to the pins of the manufactured pin standing wiring board, the pins themselves easily absorb the stress, so that the stress applied to the joint between the pin and the resin substrate or the resin substrate body is reduced. be able to. Therefore, according to this manufacturing method, it is possible to manufacture a pin-standing resin substrate that is not easily broken even when stress is applied to the pins.

Another solution is to form a rod-shaped part and a large-diameter part made of the same material as the rod-shaped part and having a diameter larger than that of the rod-shaped part and formed at one end of the rod-shaped part. A pin heat treatment step of performing a heat treatment of heating the pin having a temperature of 600 ° C. or more and 900 ° C. or less, and forming a substantially plate shape having a main surface, comprising a resin or a composite material containing a resin, and exposing the pin pad exposed to the main surface. A pin fixing step of bringing the large-diameter portion of the pin into contact with the pin pad of the resin-made substrate and soldering the pin pad and at least the large-diameter portion of the pin. This is a method for manufacturing a resin substrate.

According to the present invention, in the pin heat treatment step, since the heat treatment for heating the pin to 600 ° C. or more and 900 ° C. or less is performed, the pin is softened. Then, in the pin fixing step, the pin that is no longer softened is soldered to a pin pad of the resin substrate. Therefore, when the stress is applied to the pins of the manufactured pin standing wiring board, the pins themselves easily absorb the stress, so that the stress applied to the joint between the pin and the resin substrate or the resin substrate body is reduced. be able to. Therefore, according to this manufacturing method, it is possible to manufacture a pin-standing resin substrate that is not easily broken even when stress is applied to the pins.

Still another solution is Kovar or 4
A pin having a rod-shaped portion made of two alloys and a large-diameter portion made of the same material as the rod-shaped portion and having a diameter larger than that of the rod-shaped portion and formed at one end of the rod-shaped portion, A pin heat treatment step of performing a heat treatment of heating, and a substantially plate-like shape having a main surface, made of a resin or a composite material containing a resin, of the resin substrate having the pin pad exposed on the main surface, the pin pad A pin fixing step of soldering the pin pad and at least the large-diameter portion of the pin by bringing the large-diameter portion of the pin into contact with the large-diameter portion of the pin.

According to the present invention, in the pin heat treatment step, a heat treatment for heating the pin made of Kovar or 42 alloy to 700 ° C. or more is performed, whereby the pin is reliably and sufficiently softened. Then, in the pin fixing step, the pin that is no longer softened is soldered to a pin pad of the resin substrate. Therefore, when the stress is applied to the pins of the manufactured pin standing wiring board, the pins themselves easily absorb the stress, so that the stress applied to the joint between the pin and the resin substrate or the resin substrate body is reduced. be able to. Therefore, according to this manufacturing method, it is possible to manufacture a pin-standing resin substrate that is not easily broken even when stress is applied to the pins. In addition, the heat treatment of Kovar or 42 alloy may be appropriately selected within a range lower than the melting points thereof. However, if the treatment is performed at an excessively high temperature, the heating may be costly. Is preferred.

Yet another solution is Kovar or 4
The Vickers hardness is defined as the hardness of a pin having a rod-shaped portion made of an alloy No. 2 and a large-diameter portion formed at one end of the rod-shaped portion made of the same material as the rod-shaped portion and having a diameter larger than that of the rod-shaped portion. A pin hardness lowering step of reducing to Hv ≦ 200, and a substantially plate shape having a main surface, made of resin or a composite material containing resin, and a resin substrate having a pin pad exposed on the main surface; A pin fixing step of soldering the pin pad and at least the large-diameter portion of the pin by bringing the large-diameter portion of the pin into contact with the large-diameter portion of the pin.

According to the present invention, the Vickers hardness of the pin is reduced to Hv ≦ 200 in the pin hardness reduction step while using the pin of Kovar or 42 alloy. Then, in the pin fixing step, the pins whose hardness has been reduced and are no longer hardened are soldered to pin pads of the resin substrate. Therefore, when the stress is applied to the pins of the manufactured pin standing wiring board, the pins themselves easily absorb the stress, so that the stress applied to the joint between the pin and the resin substrate or the resin substrate body is reduced. be able to. Therefore, according to this manufacturing method, it is possible to manufacture a pin-standing resin substrate that is not easily broken even when stress is applied to the pins.

In the above-mentioned method of manufacturing a pin-equipped resin substrate, the pin hardness lowering step is a pin heat-treating step of lowering Vickers hardness by heat treatment for heating the pin. Good.

This is because, when the Vickers hardness of the pins is reduced by heat treatment, many pins can be easily processed under uniform conditions.

Further, in the above-mentioned method for manufacturing a pin-standing resin substrate, the pin hardness lowering step is a method for manufacturing a pin-standing resin substrate for lowering Vickers hardness by heat treatment for passing a pin through a belt furnace. Is preferred. If the heat treatment is performed in a belt furnace, the entire pins can be uniformly and reliably heated and heat-treated, and the processing can be performed at a low cost, so that an inexpensive pin-made resin substrate can be obtained.

Further, any one of the above-described methods for manufacturing a pin-standing resin substrate, wherein the pin-standing resin includes a mechanical polishing step of mechanically polishing the pins prior to the pin heat treatment step. It is preferable to use a method for manufacturing a substrate.

When the pin is manufactured by a press or the like, burrs or the like may be formed at various places or sharp corners may be formed. Such burrs and sharp corners are easily peeled off and become fine metal powder and adhere to various parts of the substrate or other electronic components, which may cause a short circuit or poor insulation. Removal of burrs or chamfering of sharp corners is performed by polishing. Such mechanical polishing can be performed before or after the heat treatment of the pin. However, when such mechanical polishing is performed, the pin surface becomes hard due to the collision of media, abrasive grains, and the like with the pin surface. Therefore, if mechanical polishing is performed after softening the pin by heat treatment, it is not preferable because the softened pin is hardened again.

On the other hand, in the present invention, since the mechanical polishing step is provided prior to the pin heat treatment step, even if the pin is hardened by the mechanical polishing, the pin can be softened by the heat treatment. And the soft pin can be fixed. As described above, examples of the mechanical polishing step include various steps such as barrel polishing, sand blast, shot blast, water jet containing abrasive particles, liquid honing, and polishing with a brush body containing an abrasive.

In particular, in the above-mentioned method for producing a pin-standing resin substrate, the mechanical polishing step is a barrel-polishing step of subjecting the pins to barrel polishing. Is preferred.

In the present invention, a barrel polishing step of performing barrel polishing is employed as the mechanical polishing step. This is because barrel polishing is advantageous in that a large number of pins can be processed simultaneously and inexpensively, and burrs can be removed and chamfered uniformly for each pin.

Still another solution is that, of the resin substrate having a substantially plate shape having a main surface, made of resin or a composite material containing resin, and having a pin pad exposed on the main surface, A pin having a rod-shaped portion made of Kovar or 42 alloy, and a large-diameter portion made of the same material as the rod-shaped portion and having a diameter larger than that of the rod-shaped portion and formed at one end of the rod-shaped portion. , Vickers hardness Hv
A method for manufacturing a pin-standing resin substrate comprising a pin fixing step of contacting the large-diameter portion of a pin having a hardness of ≦ 200 and soldering at least the large-diameter portion of the pin pad and the pin. is there.

According to the present invention, a soft pin having a Vickers hardness Hv ≦ 200 is used even though the pin is made of Kovar or 42 alloy. Therefore, even if a stress is applied to the pin, the pin is deformed and the stress is relaxed. The connection strength between the pin and the resin substrate is increased, and a highly reliable pin standing resin substrate can be obtained.

Further, in the method for manufacturing a pin-erected resin substrate according to any one of the above, the pin heat treatment step includes:
It is preferable to adopt a method of manufacturing a pin-standing resin substrate for performing a heat treatment for heating a pin having the large-diameter portion including a spherical surface bulging in a direction opposite to the rod-shaped portion.

According to the present invention, in the pin fixing step, the pin having the large diameter portion including the spherical surface is soldered by bringing the large diameter portion into contact with the pin pad, so that the manufactured pin standing substrate is manufactured. However, even when stress is applied to the pin, the stress is easily absorbed in the entire joint. For this reason, the stress applied to the pin body or the resin substrate body can be reduced. In addition, since the pin having the large diameter portion including the spherical surface is fixed to the pin pad, a large amount of solder can be secured between them and the joining strength of these can be improved. Furthermore, since the pins are softened in the pin heat treatment process, when stress is applied to the pins, the pins themselves also absorb the stress, reducing the stress applied to the joint between the pin and the resin substrate or the resin substrate body. be able to. Therefore, due to the synergistic effects, according to the manufacturing method of the present invention, it is possible to manufacture a pin-standing resin substrate that is not easily broken even when stress is applied to the pins.

Still another solution is a pin used for a pin standing board in which pins as input / output terminals are erected on the board, and is made of a rod-shaped part and the same material as the rod-shaped part. A pin having a large diameter and a large diameter portion formed at one end of the rod-shaped portion, which is softened by heat treatment by heating.

Since the pin of the present invention is softened by heat treatment by heating, it is softer than a pin not subjected to such heat treatment. For this reason, when a pin-made resin substrate using this pin is manufactured, the pin-made resin substrate easily absorbs the stress when the stress is applied to the pin. , And the stress applied to the resin substrate body can be reduced. Therefore, when a pin-made resin substrate is manufactured using the pins of the present invention, even if stress is applied to the pins, the pins are hardly broken and a highly reliable pin-formed resin substrate can be obtained.

Still another solution is a pin used for a pin standing board in which a pin as an input / output terminal is erected on the board. The pin is made of the same material as that of the bar. A pin having a large diameter and a large diameter portion formed at one end of the rod-shaped portion, and subjected to a heat treatment of heating to 600 ° C. or more.

Since the pin of the present invention has been subjected to the heat treatment for heating to 600 ° C. or higher, it is softer than the pin not subjected to such heat treatment. For this reason,
When a pin-standing resin substrate using these pins is manufactured, the pin-standing resin substrate easily absorbs stress when stress is applied to the pin. And the stress applied to the resin substrate body can be reduced. Therefore, when a pin-made resin substrate is manufactured using the pins of the present invention, even if stress is applied to the pins, the pins are hardly broken and a highly reliable pin-formed resin substrate can be obtained.

Another solution is a pin used for a pin standing board in which pins as input / output terminals are erected on the board. The pin is made of the same material as the stick. A pin having a larger diameter and a larger diameter portion formed at one end of the rod-shaped portion, and subjected to a heat treatment of heating to 600 ° C. or more and 900 ° C. or less.

Since the pins of the present invention have been subjected to a heat treatment of heating to 600 ° C. or more and 900 ° C. or less, they are softer than pins that have not been subjected to such heat treatment. For this reason, when a pin-made resin substrate using this pin is manufactured, the pin-made resin substrate easily absorbs the stress when the stress is applied to the pin. , And the stress applied to the resin substrate body can be reduced. Therefore, when a pin-made resin substrate is manufactured using the pins of the present invention, even if stress is applied to the pins, the pins are hardly broken and a highly reliable pin-formed resin substrate can be obtained.

Still another solution is a pin used for a pin standing board in which pins serving as input / output terminals are erected on the board, and is made of a rod-shaped portion made of Kovar or 42 alloy, and a material made of the same material as the rod-shaped portion. And a larger diameter portion formed at one end of the rod portion and having a diameter larger than that of the rod portion.
This pin is subjected to a heat treatment of heating to 0 ° C. or higher.

Since the pin made of Kovar or 42 alloy of the present invention has been subjected to a heat treatment for heating to 700 ° C. or more, it is softer than a pin made of Kovar or the like not subjected to such heat treatment. For this reason, when a pin-made resin substrate using this pin is manufactured, the pin-made resin substrate easily absorbs the stress when the stress is applied to the pin. , And the stress applied to the resin substrate body can be reduced. Therefore, when a pin-made resin substrate is manufactured using the pins of the present invention, even if stress is applied to the pins, the pins are hardly broken and a highly reliable pin-formed resin substrate can be obtained.

Still another solution is a pin used for a pin standing board in which pins as input / output terminals are erected on the board, and a rod-shaped part made of Kovar or 42 alloy, and a rod-shaped part made of the same material as the rod-shaped part. A pin having a Vickers hardness Hv ≦ 200 having a diameter larger than the rod-shaped portion and a large-diameter portion formed at one end of the rod-shaped portion.

The pin of the present invention is a pin made of Kovar or 42 alloy, but has a Vickers hardness Hv ≦ 200.
Is a soft pin. For this reason, when manufacturing a pin-standing resin substrate in which this pin is soldered and fixed to a resin substrate, the pin-standing resin substrate tends to absorb the stress itself when the pin is stressed. The stress applied to the joint between the pin and the resin substrate and the resin substrate main body can be reduced. Therefore, when a pin-made resin substrate is manufactured using the pins of the present invention, even if stress is applied to the pins, the pins are hardly broken and a highly reliable pin-formed resin substrate can be obtained.

It is preferable that the above-mentioned pin is a pin whose Vickers hardness is reduced by a heat treatment for heating the pin.

The pin of the present invention has a Vickers hardness reduced by heat treatment. Therefore, there is no need to use pins with low hardness from the beginning, and pins are manufactured by a normal manufacturing method,
Since the Vickers hardness is reduced by the subsequent heat treatment, easily available pins can be used, and inexpensive pins can be obtained.

The pin according to any one of the above,
Preferably, the pins are mechanically polished prior to the heat treatment. Since the pin may have burrs or sharp corners at the time of manufacture, the burrs are removed or the corners are chamfered in advance by mechanical polishing such as barrel polishing.
Such mechanical polishing may be performed before or after the heat treatment of the pin. However, when such mechanical polishing is performed,
Since the pin surface becomes harder due to collision with media, abrasive grains, etc., it is not preferable to perform mechanical polishing after the heat treatment, since the softened pin will be hardened again.

On the other hand, if the mechanical polishing is performed prior to the heat treatment as described above, even if the pins are hardened by the mechanical polishing, the pins can be softened by the heat treatment. Can be eliminated. Among mechanical polishing, it is preferable to use barrel polishing. This is because barrel polishing can treat a large number of pins simultaneously and inexpensively, and can uniformly remove burrs and chamfer each pin.

Further, in any one of the above-mentioned pins, the large-diameter portion may be a pin including a spherical surface bulging in a direction opposite to the rod-like portion.

When a pin standing board using the pin of the present invention is manufactured, the stress is easily absorbed at the joint between the pin and the board when stress is applied to the pin. The stress applied to the substrate body can be reduced. Also, a large amount of solder can be secured between the large diameter portion including the spherical surface and the pin pad, so that the bonding strength of these can be improved. Therefore, if a pin standing substrate is manufactured using the pin of the present invention, the pin is hardly broken even when stress is applied due to a synergistic effect with the fact that the pin is heat-treated at a high temperature and becomes soft, and the reliability is reduced. A high pin standing resin substrate can be obtained.

Another solution is a method of manufacturing a pin used for a pin standing board in which a pin as an input / output terminal is erected on a board. The pin is formed of a bar and the same material as the bar. A pin manufacturing method comprising a heat treatment step of heating and softening a pin having a diameter larger than the rod-shaped portion and having a large-diameter portion formed at one end of the rod-shaped portion.

According to the present invention, in the heat treatment step, heat treatment for heating the pins is performed to soften the pins. Therefore, when a pin standing substrate is manufactured using such pins, when stress is applied to the pins, the pins themselves absorb the stress and reduce the stress applied to the joint between the pins and the substrate or the substrate body. be able to. Therefore, if a pin standing substrate is manufactured using the pins manufactured by this manufacturing method, even if stress is applied to the pins, the pins are hardly broken and a highly reliable pin standing substrate can be obtained.

Still another solution is a method of manufacturing a pin used for a pin-standing substrate in which pins as input / output terminals are erected on a substrate, the rod-shaped portion being made of the same material as the rod-shaped portion. A pin manufacturing method comprising a heat treatment step of performing a heat treatment of heating a pin having a diameter larger than a rod-shaped portion and having a large-diameter portion formed at one end of the rod-shaped portion to 600 ° C. or more.

According to the present invention, in the heat treatment step, the number of pins
Since the heat treatment for heating to 00 ° C. or higher is performed, the pins become softer than before the heat treatment. Therefore, when a pin standing substrate is manufactured using such pins, when stress is applied to the pins, the pins themselves absorb the stress and reduce the stress applied to the joint between the pins and the substrate or the substrate body. be able to. Therefore, if a pin standing substrate is manufactured using the pins manufactured by this manufacturing method, even if stress is applied to the pins, the pins are hardly broken and a highly reliable pin standing substrate can be obtained.

Another solution is a method of manufacturing a pin used for a pin-standing board in which pins as input / output terminals are erected on a board, comprising a rod portion and the same material as the rod portion. A pin having a diameter larger than the rod-shaped portion and a large-diameter portion formed at one end of the rod-shaped portion is placed at 600 ° C.
This is a pin manufacturing method including a heat treatment step of performing a heat treatment of heating to a temperature of 00 ° C. or less.

According to the present invention, in the heat treatment step, the pins
Since the heat treatment for heating to a temperature of not less than 00 ° C and not more than 900 ° C is performed, the pins become softer than before the heat treatment. Therefore, when a pin standing substrate is manufactured using such pins, when stress is applied to the pins, the pins themselves absorb the stress and reduce the stress applied to the joint between the pins and the substrate or the substrate body. be able to. Therefore, if a pin standing board is manufactured using the pins manufactured by this manufacturing method,
Even when stress is applied to the pins, the pins are hardly broken and a highly reliable pin standing substrate can be obtained.

Still another solution is a method of manufacturing a pin used for a pin standing board in which a pin as an input / output terminal is erected on a board, comprising: a rod-shaped portion made of Kovar or 42 alloy; It is made of the same material, is larger in diameter than the rod portion, and a large diameter portion formed at one end of the rod portion,
Is a method for manufacturing a pin, comprising a heat treatment step of performing a heat treatment of heating a pin having a temperature of 700 ° C. or higher.

According to the present invention, in the heat treatment step, the pin made of Kovar or 42 alloy is heat-treated to be heated to 700 ° C. or more. It will be soft enough. Therefore, when a pin standing substrate is manufactured using such pins, when stress is applied to the pins, the pins themselves absorb the stress and reduce the stress applied to the joint between the pins and the substrate or the substrate body. be able to. Therefore, if a pin standing board is manufactured using the pins manufactured by this manufacturing method,
Even when stress is applied to the pins, the pins are hardly broken and a highly reliable pin standing substrate can be obtained.

Still another solution is a method of manufacturing a pin for use as a pin standing board in which pins as input / output terminals are erected on a board, comprising: a rod-shaped portion made of Kovar or 42 alloy; A pin hardness reduction step of reducing the hardness of a pin having the same material and having a diameter larger than the rod-shaped portion and having a large-diameter portion formed at one end of the rod-shaped portion to Vickers hardness Hv ≦ 200. This is a method for manufacturing a pin.

The method of manufacturing a pin according to the present invention includes a step of lowering the pin hardness to lower the Vickers hardness. Therefore, it is not necessary to use a low-hardness pin from the beginning, and a hard pin can be formed by a normal manufacturing method. Since it is manufactured or obtained and the Vickers hardness is reduced thereafter, pins that can be easily obtained or manufactured can be used, and soft pins can be manufactured at low cost.

Further, in the above pin manufacturing method, the pin hardness lowering step may be a pin manufacturing method which is a heat treatment step of lowering Vickers hardness by heat treatment for heating the pin.

Further, in the above pin manufacturing method, it is preferable that the heat treatment step is a pin manufacturing method in which the heat treatment is performed by passing through a belt furnace. If the heat treatment is performed in a belt furnace, the pins can be uniformly and reliably heated and heat-treated, and can be processed at low cost, so that the pins can be manufactured at lower cost.

Further, when the large-diameter portion of the pin has a shape including a spherical surface bulging in the direction opposite to the direction of the rod-shaped portion, the pin-standing substrate manufactured using this pin has no stress on the pin. When the pin is applied, the stress is absorbed at the joint between the pin and the substrate, and the stress applied to the pin main body and the substrate main body can be reduced. Further, a large amount of solder can be secured between the large diameter portion including the spherical surface and the pin pad. Therefore,
If a pin standing board is manufactured using the pin manufactured by the above manufacturing method, the pin is softened, and even if stress is applied to the pin, the pin is hardly destroyed, and the reliability is improved. A high pin standing substrate can be provided.

Further, the method for manufacturing a pin according to any one of the above, wherein the method further includes a mechanical polishing step of mechanically polishing the pin prior to the heat treatment step.

When a pin is manufactured by a press or the like, burrs or the like may be formed at various places or sharp corners may be formed. Such burrs and sharp corners are easily peeled off and become fine metal powder and adhere to various parts of the substrate or other electronic components, which may cause a short circuit or poor insulation. Removal of burrs or chamfering of sharp corners is performed by polishing. Such mechanical polishing can be performed before or after the heat treatment of the pin. However, when such mechanical polishing is performed, the pin surface becomes hard due to the collision of media, abrasive grains, and the like with the pin surface. Therefore, if mechanical polishing is performed after softening the pin by heat treatment, it is not preferable because the softened pin is hardened again.

On the other hand, in the present invention, since the mechanical polishing step is provided prior to the heat treatment step of the pin, even if the pin is hardened by the mechanical polishing, the pin can be softened by the heat treatment. A soft pin free of the influence of polishing can be manufactured.

In particular, in the pin manufacturing method described above, it is preferable that the mechanical polishing step is a barrel manufacturing method in which the pins are barrel-polished.

In the present invention, a barrel polishing step of performing barrel polishing is employed as the mechanical polishing step. This is because barrel polishing is advantageous in that a large number of pins can be processed simultaneously and inexpensively, and burrs can be removed and chamfered uniformly for each pin.

[0089]

Embodiment 1 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a pin 1 of the present embodiment. The pin 1 is made of a 194 alloy, and a Ni plating layer having a thickness of about 3.34 μm is formed on the surface thereof, and an Au plating layer having a thickness of about 0.35 μm is further formed thereon. (Not shown). Pin 1
Is composed of a rod-shaped portion 1A and a large-diameter portion 1B formed at one end thereof. The rod-shaped portion 1A has a diameter of about 0.45 mm and a height (length in the axial direction) of 3.01 m.
m has a substantially cylindrical shape. On the other hand, the large diameter portion 1B is
It has a shape including a spherical surface bulging in the direction opposite to the A-side, and more specifically, a shape bulging in a substantially hemispherical shape in a direction opposite to the rod-shaped portion 1A. The maximum diameter of the large diameter portion 1B is about 1.1 mm, and its height (length in the axial direction) is 0.34 mm. Also, this pin 1
It is a heat-treated one that is heated to 00 ° C to 900 ° C and gradually cooled.

Such a pin 1 has a substantially hemispherical large-diameter portion 1.
In the pin-standing board in which the large-diameter portion 1B (spherical surface) is solder-joined to the board because of having B, when stress is applied to the pin 1, the stress is easily absorbed in the entire joint portion. For this reason, the stress applied to the pin 1 main body and the substrate main body can be reduced. In addition, since a large amount of solder for joining the pin 1 and the substrate can be secured, the joining strength of these can be improved.

Further, this pin 1 is used at a temperature of 600 ° C. to 900 ° C.
Since it is heat-treated to be heated to ° C., it is softer than a pin that has not been heat-treated. For this reason, if a pin standing substrate is manufactured using this pin 1, the pin standing substrate will
Since the stress itself is easily absorbed, the stress applied to the joint between the pin 1 and the substrate and the substrate body can be reduced.
Therefore, if a pin standing substrate is manufactured using the pins 1, even if stress is applied to the pins 1, the pin standing substrate is hardly broken and a highly reliable pin standing substrate can be obtained.

Next, a method of manufacturing the pin 1 will be described.
This will be described with reference to FIGS. First, a wire MT having a substantially circular cross section made of a 194 alloy is prepared (see FIG. 2A). Then, in the first gripping step, FIG.
As shown in (1), the wire MT is held by the press dies P1 and P2 such that a part of the wire MT protrudes. Next, in a first pressing step, as shown in FIG.
2 and a press die P3 to form a large-diameter portion 1B 'having a larger diameter than the wire MT and including a spherical surface at the tip.

Next, in the second gripping step, as shown in FIG. 3A, the wire MT is gripped again by the press dies P1 and P2 such that a part of the wire MT protrudes newly. Next, the second
In the pressing step, as shown in FIG. 3B, pressing is performed again to further increase the large-diameter portion 1B '. Thereby, the large diameter portion 1B of the pin 1 is formed. By performing the pressing a plurality of times (two times in this example) in this manner, a large-diameter portion 1B having a large height (length in the axial direction) can be formed.

Next, in a cutting step, the wire MT is cut at a predetermined position to form a rod portion 1A having substantially the same diameter as the wire MT.
After cutting, use a pin 1 to remove burrs and chamfer sharp corners.
Then, the surface is smoothed by barrel polishing and chemical etching using a known method. Specifically, in the barrel polishing step, as shown in FIG. 4, a known rotary barrel polishing apparatus BF is used, together with a medium BM made of alumina balls having a diameter of 3.0 to 5.0 mm, and a rotary container BC.
A number of pins 1 are put into the inside, and barrel polishing is performed by rotating as shown by an arrow BT for several hours. Thereby, the burrs of the pin 1 are removed and the sharp corners are chamfered. Since the media BM collides with the pin 1 during barrel polishing, the surface of the pin 1 is hardened by work hardening. Next, in the surface smoothing process by chemical etching, the pin 1 subjected to barrel polishing is immersed in an acidic solution, and a part of the surface is dissolved and removed to smooth the surface. The surface smoothing treatment is also preferable in that the medium BM or the like adhered to the pin 1 can be removed so that the pin 1 does not enter the surface.

Next, in a heat treatment step, the pin 1 is heated to 600 ° C.
A heat treatment for heating to 900 ° C. is performed. More specifically, in the present embodiment, the temperature of the pin 1 is increased by about 26 ° C.
At a maximum temperature of 634 ° C., and maintained at a heating temperature of 600 ° C. or more for 5 minutes or more, and then gradually cooled at a temperature lowering speed of about 13 ° C./min. Thereafter, in order to prevent oxidation of the pin 1, the surface of the pin 1 is plated with Ni, and a thickness of 0.04 μm or more (about 0.35 μm in the present embodiment) is further applied thereon.
Au plating is performed so that the Ni plating layer and A
When the u plating layer is formed, the pin 1 is completed.

In this manufacturing method, the pin 1
Is heated to 600 ° C. or more and 900 ° C. or less and then gradually cooled, so that the pin 1 becomes softer than before the heat treatment. Pin 1 becomes soft like this
This is because the heat treatment removes the processing strain generated when the wire MT is formed from the 94 alloy and the residual stress caused by the processing strain generated when the large-diameter portion 1B of the pin 1 is formed from the wire MT. Can be When the pin 1 becomes soft, as described below, the pin standing board using the pin 1
The pin 1 itself is deformed to absorb the stress, and the stress applied to the joint between the pin 1 and the substrate or the substrate body can be reduced.

In particular, in this embodiment, heat treatment is performed after deburring and chamfering of the pin 1 in the barrel polishing step. For this reason, even if the pin is worked and hardened by the barrel polishing as described above, the residual stress is removed by the heat treatment, so that the influence of the barrel polishing can be eliminated. Therefore, when barrel polishing is performed after heat treatment,
It is more preferable that the softened pin 1 is hardened again by barrel polishing.

Further, since the pin 1 manufactured by this manufacturing method has the large-diameter portion 1B including the spherical surface, the pin standing substrate using the pin 1 Stress can be absorbed by the entire joint between the pin 1 and the substrate, and the stress applied to the pin 1 main body and the substrate main body can be reduced. Further, a large amount of solder can be secured between the large-diameter portion 1B of the pin 1 and the substrate, and the bonding strength between them can be improved. That is, the pin 1 manufactured by this manufacturing method
When a pin standing substrate is manufactured by using the method described above, even if a stress is applied to the pin 1, the pin standing substrate is hardly broken and a highly reliable pin standing substrate can be obtained.

Next, the pin-made resin substrate 11 of this embodiment will be described with reference to FIG. FIG. 5 (a)
FIG. 5 shows a side view of the resin substrate 11 with the pins erected, and FIG.
(B) shows a partially enlarged sectional view thereof. The pin-standing resin substrate 11 is a substantially rectangular, substantially plate-shaped resin substrate 13.
And a number of the pins 1 erected thereon.

The resin substrate 13 has a plurality of resin insulating layers 15A and 15B made of epoxy resin laminated thereon.
Further, it is a resin multilayer wiring board having a solder resist layer 21 made of epoxy resin laminated on its surface. Conductive layers 17A and 17B such as wiring and pads are formed between the resin insulating layers 15A and 15B and between the resin insulating layer 15A and the solder resist layer 21, respectively. Also, the conductor layers 17A, 1A are provided on the resin insulation layers 15A, 15B.
A large number of via conductors 19 and through-hole conductors (not shown) are formed to connect the 7Bs.

In the solder resist layer 21 forming the main surface 13A of the resin substrate 13, a large number of openings 21K are formed at predetermined positions. In the opening 21K, the pin pad 17AP of the conductor layer 17A formed between the resin insulating layer 15A and the solder resist layer 21 is exposed. On the other hand, the pin 1 has a large diameter portion 1B.
The (large spherical surface) is directed toward the pin pad 17AP of the resin substrate 13 and the entire large-diameter portion 1B and a part of the rod-shaped portion 1A on the large-diameter portion 1B side are soldered to the pin pad 17AP with solder HD (Sn 95%
−Sb5%), so that the resin substrate 13
It is fixed to.

The pin 1 having the substantially hemispherical large-diameter portion 1B is formed of the pin-erected resin substrate 11 as shown in FIG.
Is bonded to the resin substrate 13 with the solder HD so as to face the pin pad 17AP side of the resin substrate 13. For this reason, even if stress is applied to the pin 1, the stress is easily absorbed in the entire joint portion, so that the stress applied to the pin 1 main body and the stress applied to the resin substrate 13 main body can be reduced. Also, since a large amount of solder HD is secured between the large-diameter portion 1B and the pin pad 17AP, the bonding strength of these can be increased.

Further, the temperature of the pin 1 is 600 ° C. or more and 900 ° C.
Since the heat treatment for heating and slow cooling is performed below, the pin 1 is softer than the pin 1 not subjected to such heat treatment. For this reason, when stress is applied to the pin 1, the pin 1 itself deforms and absorbs the stress.
And the stress applied to the joint between the pin pad 17AP and the resin substrate 13 can be reduced.
In addition, slow cooling means cooling gradually. Due to these synergistic effects, the pin-erected resin substrate 11 is less likely to be broken even when stress is applied to the pins 1 and has high reliability.

In particular, in this pin standing resin substrate 11,
After deburring and chamfering the pin 1 in the barrel polishing step, the pin 1 which was subjected to heat treatment was soldered and fixed. In other words, since the effect of the work hardening of the pin due to barrel polishing is eliminated and the pin 1 which is sufficiently softened is used, the pin-standing resin substrate 11 is hardly broken even when stress is applied to the pin 1. , Especially reliable.

Next, the relationship between the temperature of the heat treatment applied to the pin 1 and the bonding strength between the pin 1 and the resin substrate 13 will be described with reference to Table 1. In order to investigate the difference in the bonding strength between the pin 1 and the resin substrate 13 due to the difference in the temperature of the heat treatment applied to the pin, the following investigation was conducted. First, as described above, a first holding step, a first pressing step, a second holding step, a second pressing step, and a cutting step are performed.
A barrel polishing process and a surface smoothing process by chemical etching are performed to remove the pin 1 from the 194 alloy wire rod MT.
Were formed in large numbers. Next, in a pin heat treatment step,
Maximum 470 ° C, 550 ° C, 634 ° C, 740 ° C, 880
C. or 950.degree. C., and then gradually cooled to obtain six types of pins 1 having different heat treatment temperatures. Thereafter, a Ni-Au plating layer was formed on the surface of each of the pins 1. Then, in the pin fixing step of the method for manufacturing the pin-standing resin substrate 11 described later, the various pins 1 were separately soldered to the resin substrate 13 to manufacture the pin-standing resin substrate 11. It should be noted that for each pin 1 having the same heat treatment temperature, five pin standing resin substrates 11 are provided, that is,
A total of 6 × 5 = 30 pin standing resin substrates 11 were manufactured.

Next, a tensile test of the pins 1 was performed on each of the pin-made resin substrates 11. More specifically, any one of a large number of pins 1 erected on the pin erected resin substrate 11 is pulled and pulled, and the joint between the pin 1 and the pin pad 17AP is not broken, and the pin 1A of the pin 1 is used. Pin 1
Those that were broken were judged to have passed because the strength of the joint was judged to be sufficiently high. On the other hand, as a result of pulling pin 1
What was broken at the joint between the pin 1 and the pin pad 17AP was judged as having a low strength at the joint, and was rejected. In addition, a tensile test was performed on ten pins 1 for each pin standing resin substrate 11. Therefore, a total of 50 pins 1 were heat-treated at the same temperature.
The test was performed. Further, in addition to the pin 1 made of the 194 alloy described above, the pin 1 made of pure copper was examined in the same manner as the pin 1 made of the 194 alloy. The results are summarized in Table 1.

[0107]

[Table 1]

As is clear from Table 1, both the pin 1 made of 194 alloy and the pin 1 made of pure copper were rejected as the heat treatment temperature was increased.
The number of (pin 1 broken between pin 1 and pin pad 17AP) decreases. And the temperature of the heat treatment is 63
At 4 ° C, 740 ° C, 880 ° C, and 950 ° C, 194
None of the pins 1 made of an alloy or the pins 1 made of pure copper failed. From these results, if heat treatment is performed at least at a temperature of 550 ° C. or more,
It can be seen that the effect appears and the pin 1 and the pin pad 17AP are not easily broken. Further, it can be seen that if the heat treatment is performed at a temperature of 634 ° C. or higher, there is almost no destruction between the pin 1 and the pin pad 17AP.

In the above investigation, the upper limit temperature was set to 950.
This is because the pin 1 itself melts at an excessively high temperature. From the above results, when the temperature of the heat treatment is 550 ° C. or more, more preferably 600 ° C. or more, the pin 1 becomes sufficiently soft, and as a result, the bonding strength between the pin 1 and the pin pad 17AP increases. Further, the temperature of the heat treatment is preferably set to 900 ° C. or less in consideration of the melting point of the pin 1, the cost for the heat treatment, and the like.

Next, a method of manufacturing the above-described pin-standing resin substrate 11 will be described with reference to FIG. First, a pin 1 having a rod-shaped portion 1A and a large-diameter portion 1B is prepared. Specifically, as described above, the first gripping step, the first pressing step, the second gripping step, the second pressing step, and the cutting step are performed, and further, barrel polishing is performed prior to the pin heat treatment step described below. And the step of surface smoothing treatment by chemical etching are performed to form the pin 1 from the 194 alloy wire rod MT.

Next, in a pin heat treatment step,
A heat treatment of heating to 00 ° C to 900 ° C is performed. Specifically, as described above, the pin 1 is heated at a heating rate of about 26 ° C.
/ Minute, heating to a maximum temperature of 634 ° C., maintaining a heating state of 600 ° C. or more for 5 minutes or more, and then gradually cooling at a temperature lowering speed of about 13 ° C./minute. As a result, the processing distortion due to pressing, barrel polishing, or the like is removed from the pin 1, and the pin 1 is sufficiently softened. Thereafter, in order to prevent oxidation of the pin 1, a surface thereof is plated with a Ni plating having a thickness of about 3.34 μm, and further thereon is plated with Au having a thickness of about 0.35 μm.

Next, the resin substrate 13 is prepared. The resin substrate 13 is formed on the resin insulating layer 1 by a known method.
5 and the conductor layer 17 may be alternately formed, and further, the solder resist layer 21 may be formed. Then, in the solder printing step, as shown in FIG.
A predetermined amount of solder paste H is placed on the pin pad 17AP.
DP (Sn 95%, Sb 5%) is printed.

Next, in the mounting step, as shown in FIG. 6B, the pins 1 are respectively set on pin setting jigs PJ, and a resin substrate on which solder paste HDP is printed is placed thereon. 13 is aligned and placed, and pin 1
Large diameter portion 1B is brought into contact with the pin pad 17AP. Then, the weight WT is placed thereon, and the resin substrate 13 is pressed. Next, in a reflow process, the resin substrate 13 placed on the pin stand jig PJ is put into a reflow furnace, and FIG.
As shown in (c), when the solder paste HDP is melted and the large diameter portion 1B of the pin 1 and the like are soldered to the pin pad 17AP, the above-mentioned pin-standing resin substrate 11 is completed. In this embodiment, the solder printing step, the placing step, and the reflow step correspond to a pin fixing step.

In this manufacturing method, in the pin heat treatment step, the pin 1 is subjected to a heat treatment for gradually cooling from a heating state of 600 ° C. or more and 900 ° C. or less, so that the pin 1 becomes softer than before the heat treatment. Therefore, when the stress is applied to the pin 1, the pin 1 itself absorbs the stress, and the joint portion between the pin 1 and the resin substrate 13 and the resin substrate 13 main body are manufactured. Can be reduced. In this manufacturing method, the large-diameter portion 1B including the spherical surface is used.
Is brought into contact with the pin pad 17AP and soldered, so that when the stress is applied to the pin 1, the manufactured pin-standing resin substrate 11 has an entire joint portion between the pin 1 and the resin substrate 13. Absorbs stress and allows the pin 1 body and resin substrate 1
3 The stress applied to the main body can be reduced. Also, a large amount of solder HD can be secured between the large diameter portion 1B of the pin 1 and the pin pad 17AP, so that the strength of the joint can be improved. Therefore, according to this manufacturing method, even if a stress is applied to the pin 1, it is possible to manufacture the pin standing resin substrate 11 which is hard to be broken and has high reliability.

(Embodiment 2) Next, a second embodiment will be described with reference to FIG. The description of the same parts as in the first embodiment will be omitted or simplified. The pin 1 of the present embodiment is the same as the pin 1 of the first embodiment, and the method of manufacturing the pin 1 is also the same (see FIGS. 1 to 4).

On the other hand, the pin-erected resin substrate 111 is
As shown in the figure, the resin substrate 113 is different from the resin substrate 13 of the first embodiment. FIG. 7A is a side view of the pin standing resin substrate 111, and FIG. 7B is a partially enlarged cross-sectional view thereof. This pin standing resin substrate 111
Is composed of a substantially rectangular, substantially plate-shaped resin substrate 113 and a number of pins 1 erected thereon.

The resin substrate 113 includes a plurality of resin insulating layers 115A, 115B, 11 made of epoxy resin.
This is a resin multilayer wiring board in which 5C and 115D are laminated. Between the resin insulating layer 115B and the resin insulating layer 115C,
In addition, conductor layers 117A and 117B such as wirings and pads are formed between the resin insulating layers 115C and 115D. In addition, these conductor layers 117
A and 117B are connected to each other, and a large number of through-hole conductors 119 are formed in the resin insulating layer 115C. In the main surface 113A of the resin substrate 113, a concave portion 1 penetrating the two resin insulating layers 115A and 115B on the main surface 113A side is provided.
A large number 21 are formed at predetermined positions. The pin pad 117AP of the conductor layer 117A is exposed at the bottom of the recess 121.

On the other hand, the pin 1 has a large diameter portion 1B (spherical surface).
Toward the pin pad 117AP exposed at the bottom of the concave portion 121, and the large-diameter portion 1B of the entire
A part of the side is fixed to the resin substrate 113 by being joined to the pin pad 117AP with solder HD. In the pin 1, the entire large-diameter portion 1B and the rod-shaped portion 1
A part of A is housed in each of the recesses 121.
Also, almost all of the solder HD for joining the pin 1 and the pin pad 117AP is housed in the recess 121.

[0119] Such a pin standing resin substrate 111 is
As in the first embodiment, the pin 1 having the substantially hemispherical large-diameter portion 1B is joined to the resin substrate 113 by solder HD with the large-diameter portion 1B facing the pin pad 117AP. For this reason, even if a stress is applied to the pin 1, the stress is easily absorbed in the entire joint portion, so that the stress applied to the pin 1 main body and the stress applied to the resin substrate 113 main body can be reduced. Also, pin 1 and pin pad 117AP
Since a large amount of solder HD is secured at the joint portion between the two, the joining strength of these can be improved.

Further, the temperature of the pin 1 is 600 ° C. or more and 900 ° C.
Since the heat treatment for gradually cooling from the following heating state is performed, the pin 1 is softer than the pin 1 not subjected to such heat treatment. For this reason, when stress is applied to the pin 1, the pin 1 itself deforms and absorbs the stress.
The stress applied to the joint between the pin 1 and the resin substrate 113 and the stress applied to the resin substrate 113 body can be reduced. Due to these synergistic effects, the pin-standing resin substrate 111 is less likely to be broken even when stress is applied to the pins 1 and has high reliability.

Further, this pin-standing resin substrate 111
Is a concave portion 121 in which the pin pad 117AP is exposed at the bottom.
The large diameter portion 1B of the pin 1 is housed in the recess 121. Therefore, when the pin 1 is inserted into the socket or the like, despite the formation of the large-diameter portion 1B on the pin 1, the gap between the pin standing resin substrate 111 and the socket or the like can be reduced.

Next, a method of manufacturing the pin standing resin substrate 111 of the present embodiment will be described. First, as in the first embodiment, a pin 1 having a rod-shaped portion 1A and a large-diameter portion 1B is prepared, and the pin 1 is heated to 600 ° C. in a pin heat treatment step.
Heat to ~ 900 ° C and then slowly cool. Then, pin 1
A Ni—Au plating layer is formed on the surface of the substrate. Next, the resin substrate 13 manufactured by a known method is prepared.
Then, in the solder ball charging step, the resin substrate 1
13, a solder ball is put into each concave portion 121, and the solder ball is melted to form a pin pad 117AP.
To be fixed.

Next, in the pin setting jig mounting step, the pins 1 are set on the pin setting jigs PJ, respectively, and are positioned and mounted on the resin substrate 113. Next, in a reflow process, the pin stand jig PJ, the resin substrate 113, and the like are put into a reflow furnace, the solder is melted again, and the large-diameter portion 1B of the pin 1 is removed from the pin pad 117AP.
Then, the resin substrate 111 with the pins standing is completed. In this embodiment, the solder ball charging step, the pin setting jig placing step, and the reflow step correspond to a pin fixing step.

Also in this embodiment, since the pin 1 is subjected to the heat treatment for gradually cooling the pin 1 from the heating state of 600 ° C. to 900 ° C. in the pin heat treatment step, the pin 1 becomes softer than before the heat treatment. Therefore, when the stress is applied to the pin 1, the pin 1 itself absorbs the stress, and the joint portion between the pin 1 and the resin substrate 113 and the resin substrate 113 main body are manufactured. Can be reduced.

Further, since the large-diameter portion 1B including the spherical surface is soldered by being brought into contact with the pin pad 117AP, when the stress is applied to the pin 1, the manufactured pin standing resin substrate 111 Stress can be absorbed by the entire joint between the resin substrate 1 and the resin substrate 113, and the stress applied to the pin 1 main body and the resin substrate 113 main body can be reduced. In addition, a large amount of solder HD can be secured between the large diameter portion 1B including the spherical surface and the pin pad 117AP, and the bonding strength can be improved. Therefore, even if stress is applied to the pin 1, it is difficult to break the pin 1 and a highly reliable pin-standing resin substrate 111 can be manufactured.

(Embodiment 3) Next, a third embodiment will be described. In the first and second embodiments, the pins 1 made of a copper-based metal such as 194 alloy or pure copper (oxygen-free copper) are used to be soldered upright on a resin substrate. In that a pin made of Kovar (iron-nickel-cobalt alloy, 29Ni-16Co-Fe) is used. In the first and second embodiments, the pin 1 is used, in which the large-diameter portion 1B bulges in a substantially hemispherical shape in the direction opposite to the direction of the rod-shaped portion 1A. The point that a so-called nail head shaped pin having a substantially disk shape is used, and the dimensions of the pin and the pin pad are different. However, the other parts are almost the same as those in the first and second embodiments. Therefore, the different parts will be mainly described, and the description of the same parts will be omitted or simplified.

The pin 301 used in the third embodiment is made of Kovar as described above, and as shown in FIG. 8, a rod-shaped portion 301A and a large-diameter portion formed at one end (upper end in the drawing). 301B. The pin 301 is a pin smaller than the pin 1 used in the first and second embodiments, and the rod portion 301A has a substantially cylindrical shape having a diameter of 0.31 mm and a height (length in the axial direction) of 1.83 mm. Make On the other hand, the large-diameter portion 301B has a diameter of 0.65 mm and a thickness of 0.20 mm.
And the pin 301 is a so-called nail head-shaped pin.

The pin 301 is manufactured by a known method of forming a large-diameter portion 301B by pressing using a Kovar wire. After the pins 301 are formed, a step of barrel polishing (see FIG. 4) and a step of surface smoothing by chemical etching are performed. Further, in the pin heat treatment step, as shown in FIG. 9, the pin 301 housed in the tray TR is placed on a belt BL that is stretched between rollers RO1 and RO2 and moves at a predetermined speed, and the heater HT is heated. Is passed through the belt furnace FP having a predetermined temperature profile to perform heat treatment for heating and slow cooling.
Specifically, the pin 301 is set at a belt speed of 150 mm.
/ Min, heated to a maximum temperature of 792 ° C., maintained at a heating temperature of 780 ° C. or more for 4.5 minutes or more, and then gradually cooled.

As a result, the pins 301 become softer than before the heat treatment. That is, the hardness is reduced. The pin 301, which is hardened by work hardening when forming a wire from a Kovar raw material by drawing or the like, or work hardening when forming the large-diameter portion 301B, and further hardened by work hardening by barrel polishing, is softened by heat treatment. it is conceivable that.

Next, the pin-standing resin substrate 311 on which the pins 301 are erected will be described. As shown in FIG. 10A, this pin-standing resin substrate 311 has one surface (upper surface in the figure) of the substantially rectangular plate-shaped resin substrate 313.
A large number of pins 301 subjected to a heat treatment are erected. This resin substrate 313 is a resin multilayer wiring substrate in which a plurality of resin insulating layers 315A and 315B made of epoxy resin are laminated, and a solder resist layer 321 made of epoxy resin is further laminated on the surface thereof. Between the resin insulating layers 315A and 315B or the resin insulating layer 315A
Conductive layers 317A and 317B such as wirings and pads are formed between the layers between the solder resist layer 321 and the solder resist layer 321, respectively. Further, a large number of via conductors 319 and through-hole conductors (not shown) are formed in the resin insulating layers 315A and 315B to connect the conductor layers 317A and 317B to each other.

In the solder resist layer 321 forming the main surface 313A of the resin substrate 313, a large number of openings 321K are formed at predetermined positions. The opening 321K has a diameter of 1.0 mm, and the pin pad 317AP forming a part of the conductor layer 317A is exposed therein.
The pin 301 has a large-diameter portion 301 </ b> B
The end surface (the lower surface in the figure) and the side surface of the large-diameter portion 301B are fixed to the resin substrate 313 by being joined to the pin pad 301AP with solder HD toward the AP side. In addition, on the surface (the upper surface in the figure) of the large-diameter portion 301B on the rod-shaped portion side,
The solder HD does not spread or slightly spreads.

In the pin standing resin substrate 311, since the pins 301 have been subjected to the above-described heat treatment at a high temperature,
It is softer than the pin 301 which has not been subjected to such heat treatment, that is, hardened by work hardening. Therefore, when stress is applied to the pin 301,
Since the pin 301 itself is deformed to absorb the stress, the pin 3
The stress applied to the joint between the first substrate 01 and the pin pad 317AP and the stress applied to the resin substrate 313 body can be reduced, and destruction at these portions can be prevented. Therefore, even if stress is applied to the pins 301, the pin-standing resin substrate 311 is not easily broken and has high reliability.

[0133] Also in this pin standing resin substrate 311, the pins 301 subjected to heat treatment after deburring and chamfering the pins 301 in the barrel polishing step were fixed by soldering. That is, since the pin 301 which has been sufficiently softened is used without the influence of the work hardening of the pin due to the barrel polishing, the pin standing resin substrate 311
1 is hardly broken even when stress is applied, and is particularly high in reliability.

Next, the temperature of the heat treatment applied to the Kovar pins 301 and the hardness of the pins 301 (Vickers hardness H
v) and the relationship between the bonding strength between the pin 301 and the resin substrate 313 will be described. In order to investigate the difference in the Vickers hardness Hv of the pin 301 and the difference in the bonding strength between the pin 301 and the resin substrate 313 due to the difference in the temperature of the heat treatment applied to the pin, the following investigation was performed. First, as described above, the pins 301 were formed by a known method, and a surface smoothing process was performed by barrel polishing and chemical etching to form a number of pins 301 made of Kovar.

Next, while changing the temperature profile of the belt furnace FP shown in FIG. 9, the feed speed of the belt BL is selected from two types (300 mm / min, 150 mm / min), and the pins 301 are heated in the pin heat treatment step. , Up to 792 ° C, up to 350 ° C, 382 ° C, 582
C., 593.degree. C., 795.degree. C., 940.degree. C., and 945.degree. C., respectively, and then slowly cooled down.
01 was obtained. For these nine types of pins 301 (5 each), a micro-Vickers measuring device (AKASHI M
Vickers hardness Hv at the tip 301AT (see FIG. 8) of the rod portion 301A was measured by VK-E2, measurement conditions: load 500 g, 15 seconds. The result is
In addition to Table 2, FIG. 11 shows the relationship between the maximum temperature of the heat treatment and the average value of Vickers hardness.

[0136]

[Table 2]

As is clear from Table 2 and the graph in FIG. 11, the Vickers hardness Hv of the pin 301 made of Kovar has a Vickers hardness Hv both at room temperature without heat treatment and when the maximum temperature of heat treatment is 593 ° C. or less. The average value is as high as about 250, that is, the pin is in a hard state. On the other hand, irrespective of the belt speed, if the temperature of the heat treatment is set higher than this, the Vickers hardness Hv drops sharply,
Heat-treated with a maximum temperature of 600 ° C or higher, especially 7
Those subjected to a heat treatment of not less than 00 ° C., specifically, those subjected to a heat treatment of 795 ° C., 792 ° C., 940 ° C., or 945 ° C. at the highest temperature, all have a Vickers hardness Hv
Is 200 or less, specifically, 170 or less at the highest value, and 150 or less at the average value. That is,
It can be seen that the pins are softened by the heat treatment. Pin 30
It is considered that No. 1 was softened by the heat treatment.

Thereafter, Ni (2.7 to 3.3 μm) and Au (0.28 to
(0.39 μm). The Vickers hardness Hv increases by about 10 to 20 due to the formation of the Ni—Au plating layer, although it varies depending on the thickness of the plating layer. However, even if the increase in hardness due to plating is considered, the decrease in hardness due to the heat treatment clearly appears. And
The pins 301 were solder-bonded to the resin substrate 313, respectively, to produce pin-standing resin substrates 311. In addition, for each pin 301 having the same heat treatment condition, 3
Of the three resin pins 311, that is, 9 × 3
= 27 pin standing resin substrates 311 were manufactured.

Next, a tensile test of the pins 301 was performed on each of the resin-made substrates 311 with the pins standing. Specifically, a large number of pins 3 erected on the pin erected resin substrate 311
01 is sandwiched and pulled in a direction inclined at an angle of 30 degrees with respect to the axis of the pin, that is, a direction orthogonal to the main surface 313A of the resin substrate 313. The test was performed on ten pins 301 for each pin-standing resin substrate 311 to measure the strength when the pin 301 was broken or the connection between the pin 301 and the resin substrate 313 was broken. Therefore, a total of 30 pins 301 subjected to the heat treatment at the same temperature were tested. These results are shown in Table 3, and FIG. 12 shows a change in the average value of the tensile strength.

[0140]

[Table 3]

As is apparent from Table 3 and the graph of FIG. 12, the pin 301 made of Kovar has a low tensile strength at room temperature where no heat treatment is performed and when the maximum temperature of heat treatment is 593 ° C. or less. . On the other hand, irrespective of the belt speed, the temperature of the heat treatment was raised and the heat treatment was performed at a maximum temperature of 600 ° C. or more, particularly, the heat treatment was performed at a temperature of 700 ° C. or more.
It can be seen that the tensile strength of each of those subjected to the heat treatment at ℃, 792 ° C, 940 ° C, or 945 ° C is improved to an average value of 25N or more.

As one guide for judging whether the tensile strength of the pin is appropriate, the tensile strength must be at least 22.2 N (=
2.27 kgf) or more in some cases. Even with this requirement, when the maximum temperature is less than 600 ° C., the minimum value is a low value of about 12 to 14 N, which indicates that some of the requirements cannot be satisfied. On the other hand, heat treatment with a maximum temperature of 600 ° C. or more,
Specifically, the maximum temperature is 795 ° C, 792 ° C, 940 ° C,
Or 945 ° C, the lowest value was 2
It exceeds 2.2N, and it can be seen that this requirement (standard) can be satisfied for any pin. In particular, those having a maximum temperature of 900 ° C. or more, specifically 940 ° C. and 945 ° C.
In this case, the tensile strength is particularly high at an average value of 30 N or more and at a minimum value of 24 N or more, so that it is possible to obtain a highly reliable pin standing resin substrate 311.

From the above test results, the heat treatment was performed at the maximum temperature of 60.
0 ° C. or higher, and the higher the maximum temperature, the higher the tensile strength tends to be.
It turns out that it is more preferable that the temperature is set to not less than ° C. In particular, when the maximum temperature is 900 ° C. or higher, it is understood that the tensile strength can be as high as 30 N or higher. On the other hand, as the upper limit of the maximum temperature, the melting point of Kovar is about 1450 ° C., so it needs to be lower than this. However, heat treatment at high temperature requires corresponding equipment and cost.
A temperature as low as possible is preferable, and a heat treatment at 1100 ° C. or lower, more preferably 1000 ° C. or lower is preferable.

The relationship between the Vickers hardness Hv (average value) of the pin and the 30-degree oblique tensile strength (average value) is shown in FIG.
3 is shown in the graph. As is clear from the graph of this scatter diagram, a pin standing resin to which a soft pin 301 having a Vickers hardness Hv of a pin of 200 or less, further Hv ≦ 170, specifically, an average value of Hv ≦ 150 is soldered and fixed. It can be seen that in the substrate made, the tensile strength is improved to 25N or more on average. Therefore, as in the present embodiment, the strength of the connection between the pin and the resin substrate is increased by using a pin having a Vickers hardness Hv ≦ 200, more preferably Hv ≦ 170, instead of using the pin that has been heat-treated. It can be seen that the reliability of the resin substrate 311 can be improved. In addition, when the pin 301 made of 42 alloy (42Ni-Fe) was examined, almost the same results were obtained.

Next, the results shown in Table 3 above are divided by the area of the pin pad 317AP to calculate the 30 ° oblique tensile strength per unit area of the pin pad, as shown in Table 4. The diameter of the pin pad 317AP is 1.
Since it is 0 mm, the tensile strength shown in Table 4 is a value obtained by dividing the area by the area of the pin pad 317AP (= π / 4).

[0146]

[Table 4]

[0147] From the results in Table 4, the 30 degree oblique tensile strength per unit area of the pin pad also indicates that the pin 301
When the room temperature and the maximum temperature of the heat treatment are 593 ° C. or lower, the tensile strength is low. On the other hand, those subjected to a heat treatment at a maximum temperature of 600 ° C. or more, particularly those subjected to a heat treatment at a temperature of 700 ° C. or more, specifically,
It can be seen that the 30 ° oblique tensile strength per unit area of the pin pad is improved to an average value of 31.8 N / mm 2 or more in any of the samples subjected to the heat treatment at ° C., 792 ° C., 940 ° C., or 945 ° C.

As for the minimum value, the maximum temperature is 60
Heat treatment at 0 ° C or higher, specifically, 795 ° C at maximum temperature, 7
When the temperature was set to 92 ° C., 940 ° C., or 945 ° C., the lowest value exceeded 28.3 N / mm 2, indicating that the lowest value could be increased for any pin.
In particular, those having a maximum temperature of 900 ° C. or more, specifically 94
At 0 ° C. and 945 ° C., the 30 ° oblique tensile strength per unit area of the pin pad was 38.2 N / mm on average.
2 or more, at least 30.6 N / mm2 or more at the minimum, and a highly reliable pin-equipped resin substrate 311 can be obtained.

The manufacture of the pin-erected resin substrate 311 of this embodiment is the same as in the first and second embodiments. That is, a pin 301 made of Kovar is manufactured, subjected to a barrel polishing process and a surface smoothing process, and then subjected to the heat treatment as described above, and then to Ni plating and Au plating. Separately,
As shown in FIG. 14A, the above-mentioned resin substrate 313 is prepared. In this figure, the form of the resin substrate 313 is shown in a simplified manner. This resin substrate 313 is
By a known method, the resin insulating layer 3 not shown in FIG.
15 and the conductor layers 317 may be alternately formed, and further, a solder resist layer 321 may be formed (see FIG. 10).

Thereafter, the pins 301 are fixed to the resin substrate 313. More specifically, in the solder printing process,
As shown in FIG. 4A, a predetermined amount of solder paste HDP (Sn) is formed on the pin pad 317AP of the resin substrate 313.
95% -Sb 5%, melting point 235-240 ° C.). Next, in the mounting step, as shown in FIG. 14B, a pin insertion hole PJ formed in the pin stand jig PJ is formed.
H, each of the pins 301 is set, and a resin substrate 313 on which the solder paste HDP is printed is positioned and mounted thereon, and the large-diameter portion 301B of the pin 301 is placed on the solder paste HDP on the pin pad 317AP. Abut. Then, the weight WT is placed thereon, and the resin substrate 3
Hold down 13. Further, in the reflow step, the resin substrate 313 placed on the pin setting jig PJ is put into a reflow furnace, and heated to a maximum of 260 to 265 ° C. to melt the solder paste HDP. As shown, the large diameter portion 301B of the pin 301 is connected to the pin pad 317A.
If soldered to P, the resin substrate 311 with the pins standing up
Is completed.

In the above, the present invention has been described in each of the first and second embodiments.
Although the present invention has been described with reference to 2 and 3, the present invention is not limited to the above-described embodiment, and may be configured without departing from the gist of the present invention.
Needless to say, the present invention can be applied with appropriate changes. For example, in each of the first and second embodiments, the substantially hemispherical large-diameter portion 1B is used.
Although the pin 1 having the above is shown, the large-diameter portion 1 </ b> B may be formed in another shape, for example, a substantially disk shape as in the third embodiment.
Even if the pin has such a shape, the pin is heat-treated at a high temperature and becomes soft, so that the pin is hardly broken when stress is applied to the pin, and the highly reliable pin standing resin substrates 11 and 111 are provided. It can be.

The shape of the large-diameter portion 1B may be, for example, a substantially disk-shaped disk portion formed at the end of the rod-shaped portion and a silver brazing material, for example. And a substantially hemispherical hemispherical portion bulging in the opposite direction. Even with such a shape, the same effects as those described in the first and second embodiments can be obtained. Furthermore, Kovar or 4 used in Embodiment 3
A pin made of two alloys may have a substantially hemispherical large-diameter portion as in the first and second embodiments. In each of the above embodiments, Sn / Sb solder is used as the solder HD, but Pb / Sn solder or Sn / Ag solder can be used.

[Brief description of the drawings]

FIG. 1 is an overall view showing a pin according to a first embodiment.

FIGS. 2A and 2B are diagrams illustrating a method of manufacturing the pin according to the first embodiment, in which FIG. 2A is a diagram illustrating a state in which a wire is sandwiched between press dies, and FIG. It is explanatory drawing which shows a mode that the part was formed.

3A and 3B are diagrams illustrating a method of manufacturing the pin according to the first embodiment, and FIG. 3A is an explanatory diagram illustrating a state in which a wire having a part of a large-diameter portion formed is re-clamped by a press die; () Is an explanatory view showing a state in which a large-diameter portion is formed by pressing.

FIG. 4 is a schematic view of a barrel polishing step of barrel polishing pins.

5A and 5B are diagrams illustrating a pin-erected resin substrate according to the first embodiment, in which FIG. 5A is a side view and FIG. 5B is a partially enlarged cross-sectional view.

6A and 6B are diagrams illustrating a method of manufacturing the resin resin substrate with pins erected according to the first embodiment, and FIG. 6A is an explanatory diagram illustrating a state in which a solder paste is applied to a pin pad of the resin substrate;
(B) is an explanatory view showing a state in which a resin substrate is overlapped on a pin setting jig and a large diameter portion of a pin is brought into contact with a solder paste. It is explanatory drawing which shows a mode that it attached.

7A and 7B are diagrams illustrating a pin-erected resin substrate according to a second embodiment, in which FIG. 7A is a side view and FIG. 7B is a partially enlarged cross-sectional view.

FIG. 8 is a side view showing the shape of a pin according to the third embodiment.

FIG. 9 is an explanatory view showing a state in which a pin is subjected to a heat treatment.

10A and 10B show a pin-erected resin substrate according to a third embodiment, wherein FIG. 10A is a side view and FIG. 10B is a partially enlarged cross-sectional view.

FIG. 11 is a graph showing the relationship between the maximum temperature of heat treatment and the average value of Vickers hardness Hv in pins made of Kovar having different heat treatment conditions.

FIG. 12 is a graph showing the relationship between the maximum temperature of heat treatment and the average value of tensile strength in an oblique 30-degree tensile test of a pin-erected resin substrate on which pins made of Kovar having different heat treatment conditions are erected.

FIG. 13 shows a Vickers hardness Hv of a pin made of Kovar.
5 is a graph showing the relationship between the pin strength and the average value of tensile strength in a 30-degree oblique tensile test of a resin-made pin-standing substrate on which it is erected.

14A and 14B show a pin fixing step in the method of manufacturing a pin-erected resin substrate according to the third embodiment, wherein FIG. 14A shows a state where a solder paste is applied to a pin pad of the resin substrate;
(B) is an explanatory view showing a state in which the pin setting jig and the resin substrate are overlapped and the large diameter portion of the pin is brought into contact with the solder paste, and (c) is a state in which the pin is soldered to the pin pad by reflow. is there.

FIG. 15 is a partially enlarged cross-sectional view showing a pin-standing resin substrate according to the related art.

[Explanation of symbols]

1,301 pin 1A, 301A rod-shaped portion 1B, 301B Large diameter portion 11,111,311 Pin standing resin substrate 13,113,313 Resin substrate 13A, 113A, 313A (of resin substrate)
Main surface 17AP, 117AP, 317AP Pin pad 121, 321 recess HD solder

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E317 AA01 BB02 CC08 GG11 5E319 AB10 AC02 BB05 BB07 BB08 CC33 CD31 GG11

Claims (30)

[Claims] 1. A resin substrate having a substantially plate shape having a main surface, made of resin or a composite material containing resin, having a pin pad exposed on the main surface, and a pin soldered to the pin pad. The pin is softened by heat treatment by heating, and is made of the same material as the rod-shaped part, and has a diameter larger than that of the rod-shaped part.
A large-diameter portion formed at one end of the rod-shaped portion, wherein at least the large-diameter portion is soldered to the pin pad. 2. A resin substrate having a substantially plate shape having a main surface, made of resin or a composite material containing resin, having a pin pad exposed on the main surface, and a pin soldered to the pin pad. The pin has been subjected to a heat treatment of heating to 600 ° C. or more, and is made of the same material as the rod-shaped part, and has a diameter larger than that of the rod-shaped part.
A large-diameter portion formed at one end of the rod-shaped portion, wherein at least the large-diameter portion is soldered to the pin pad. 3. A resin substrate having a substantially plate shape having a main surface, made of resin or a composite material containing resin, having a pin pad exposed on the main surface, and a pin soldered to the pin pad. The pin has been subjected to a heat treatment of heating to 600 ° C. or more and 900 ° C. or less, and is made of the same material as the rod-shaped portion, and has a diameter larger than that of the rod-shaped portion.
A large-diameter portion formed at one end of the rod-shaped portion, wherein at least the large-diameter portion is soldered to the pin pad. 4. A resin substrate having a substantially plate shape having a main surface, made of resin or a composite material containing resin, having a pin pad exposed on the main surface, and a pin soldered to the pin pad. The pin has been subjected to a heat treatment of heating to 700 ° C. or higher, a rod portion made of Kovar or 42 alloy, and the same material as the rod portion, and has a diameter larger than that of the rod portion.
A large-diameter portion formed at one end of the rod-shaped portion, wherein at least the large-diameter portion is soldered to the pin pad. 5. A resin substrate having a substantially plate shape having a main surface, made of resin or a composite material containing resin, having a pin pad exposed on the main surface, and a pin soldered to the pin pad. The pin has a rod-shaped part made of Kovar or 42 alloy, and the same material as the rod-shaped part, and has a diameter larger than that of the rod-shaped part.
A pin upright resin having a Vickers hardness Hv ≦ 200, and at least the large diameter portion is soldered to the pin pad. Substrate. 6. The pin-equipped resin substrate according to claim 5, wherein said pins are heat-treated to reduce Vickers hardness. 7. The pin-erected resin substrate according to claim 1, wherein the large-diameter portion of the pin has a spherical surface that expands in a direction opposite to the rod-shaped portion. Includes pin-standing resin substrate. 8. The pin-erected resin substrate according to claim 1, wherein said resin substrate has a concave portion on said main surface at which said pin pad is exposed at least at the bottom. The pin is a pin-made resin substrate in which at least the large-diameter portion is housed in the recess, and at least a part of the rod-shaped portion protrudes from the main surface. 9. A rod-shaped part and the same material as the rod-shaped part,
A pin heat treatment step of softening a pin having a diameter larger than the rod-shaped portion and having a large-diameter portion formed at one end of the rod-shaped portion by heating, and a substantially plate shape having a main surface The resin pad is made of a resin or a composite material containing a resin and has a pin pad exposed on the main surface. A pin fixing step of soldering at least the large-diameter portion of the above. 10. A pin having a rod-shaped portion and a large-diameter portion formed of the same material as the rod-shaped portion and having a diameter larger than that of the rod-shaped portion and formed at one end of the rod-shaped portion, is heated at 600 ° C. A pin heat treatment step of performing a heat treatment of heating as described above, and a resin plate having a substantially plate shape having a main surface, made of resin or a composite material containing resin, and having a pin pad exposed on the main surface, A pin fixing step of soldering the pin pad and at least the large-diameter portion of the pin by contacting the large-diameter portion of the pin with the pin. 11. A pin having a rod-shaped portion and a large-diameter portion made of the same material as the rod-shaped portion and having a diameter larger than that of the rod-shaped portion and formed at one end of the rod-shaped portion, is heated at 600 ° C. More than 9
A pin heat treatment step of performing a heat treatment of heating to 00 ° C. or less, of a resin substrate having a substantially plate shape having a main surface, made of resin or a composite material containing resin, and having a pin pad exposed on the main surface, A pin fixing step of contacting the large-diameter portion of the pin with the pin pad and soldering the pin pad and at least the large-diameter portion of the pin to the pin pad. 12. A rod-shaped part made of Kovar or 42 alloy, and a large-diameter part made of the same material as the rod-shaped part and having a diameter larger than that of the rod-shaped part and formed at one end of the rod-shaped part. A pin heat treatment step of performing a heat treatment of heating the pin having a temperature of at least 700 ° C .; and a resin having a substantially plate shape having a main surface, made of resin or a composite material containing resin, and having a pin pad exposed on the main surface. A pin-fixing resin substrate comprising: a pin fixing step of bringing the large-diameter portion of the pin into contact with the pin pad of the substrate and soldering the pin pad and at least the large-diameter portion of the pin. Manufacturing method. 13. A rod-shaped part made of Kovar or 42 alloy, and a large-diameter part made of the same material as the rod-shaped part and having a diameter larger than that of the rod-shaped part and formed at one end of the rod-shaped part. A pin hardness lowering step of reducing the hardness of the pin having the Vickers hardness Hv ≦ 200, and is formed of a resin or a composite material containing a resin, having a substantially plate shape having a main surface,
A pin fixation in which a large-diameter portion of the pin is brought into contact with the pin pad of the resin substrate having the pin pad exposed on the main surface, and the pin pad and at least the large-diameter portion of the pin are soldered. And a method for manufacturing a pin-erected resin substrate, comprising: 14. The method according to claim 13, wherein the step of reducing the pin hardness is a pin heat treatment step of reducing the Vickers hardness by a heat treatment for heating the pins. A method of manufacturing a substrate. 15. The ninth to twelfth and fourteenth aspects of the present invention.
The method for manufacturing a pin-standing resin substrate according to any one of claims 1 to 3, further comprising a mechanical polishing step of mechanically polishing the pins prior to the pin heat treatment step. . 16. A resin substrate having a substantially plate shape having a main surface, made of a resin or a composite material containing a resin, and having a pin pad exposed on the main surface, wherein the pin pad is made of Kovar or 42 alloy. And a pin having a larger diameter formed at one end of the rod, the rod having a Vickers hardness Hv ≦ A method for manufacturing a pin-standing resin substrate, comprising: a pin fixing step of contacting the large-diameter portion of a pin having a hardness of 200 and soldering at least the large-diameter portion of the pin pad and the pin. 17. A pin used for a pin standing board in which pins as input / output terminals are erected on the board, the rod being made of the same material as the rod, having a diameter larger than that of the rod,
A pin having a large-diameter portion formed at one end of the rod-shaped portion, and heat-treated by heating to be softened. 18. A pin used for a pin standing board in which pins as input / output terminals are erected on a board, the pin being made of the same material as the bar, and having a diameter larger than that of the bar.
A pin having a large-diameter portion formed at one end of the rod portion, the pin having been subjected to a heat treatment of heating to 600 ° C. or more. 19. A pin used for a pin standing board having pins as input / output terminals erected on the board, the rod being made of the same material as the rod, having a diameter larger than that of the rod,
A pin having a large-diameter portion formed at one end of the rod-shaped portion, and having been subjected to a heat treatment of heating to 600 ° C. or more and 900 ° C. or less. 20. A pin used for a pin standing board having pins serving as input / output terminals standing on the board, wherein the pin is a Kovar or 4 pin.
A rod-shaped part made of two alloys, and the same material as the rod-shaped part, which is larger in diameter than this rod-shaped part,
A pin having a large-diameter portion formed at one end of the rod-shaped portion and having been subjected to a heat treatment of heating to 700 ° C. or more. 21. A pin used for a pin standing board in which pins as input / output terminals are erected on a board, comprising: a rod-shaped portion made of Kovar or 42 alloy; and a rod-shaped portion made of the same material as the rod-shaped portion. Larger in diameter,
A pin having a large diameter portion formed at one end of the rod portion, and having a Vickers hardness Hv ≦ 200. 22. The pin according to claim 21, wherein Vickers hardness is reduced by heat treatment for heating the pin. 23. The pin according to claim 17, wherein the large-diameter portion includes a spherical surface bulging in a direction opposite to the rod-shaped portion. 24. A method of manufacturing a pin for use as a pin standing board in which pins as input / output terminals are erected on a board, comprising: a rod-shaped part; and the same material as the rod-shaped part, and having a larger diameter than the rod-shaped part. And a heat treatment step of softening the pin having a large diameter portion formed at one end of the rod portion by heating the pin. 25. A method of manufacturing a pin for use as a pin standing board, wherein pins as input / output terminals are erected on the board, comprising: a rod-shaped part; and the same material as the rod-shaped part, and having a larger diameter than the rod-shaped part. A pin having a large-diameter portion formed at one end of the rod-shaped portion, and a heat treatment step of performing a heat treatment of heating the pin to 600 ° C. or more. 26. A method of manufacturing a pin for use on a pin-standing substrate, wherein pins as input / output terminals are erected on the substrate, the rod comprising a rod-shaped part and the same material as the rod-shaped part, and having a larger diameter than the rod-shaped part. A pin manufacturing method comprising a heat treatment step of performing a heat treatment of heating a pin having a large diameter portion formed at one end of the rod portion to a temperature of 600 ° C. or more and 900 ° C. or less. 27. A method of manufacturing a pin for use as a pin standing board having pins serving as input / output terminals standing on the board, comprising: a rod portion made of Kovar or 42 alloy; and the same material as the rod portion; A pin having a larger diameter than the rod-shaped portion and having a large-diameter portion formed at one end of the rod-shaped portion,
A method for manufacturing a pin, comprising a heat treatment step of performing a heat treatment of heating to 700 ° C. or higher. 28. A method of manufacturing a pin used for a pin standing board having pins serving as input / output terminals standing on the board, comprising: a rod portion made of Kovar or 42 alloy; and the same material as the rod portion. A method for manufacturing a pin, comprising: a pin hardness reduction step of reducing the hardness of a pin having a diameter larger than the rod-shaped portion and having a large-diameter portion formed at one end of the rod-shaped portion to Vickers hardness Hv ≦ 200. 29. The method of manufacturing a pin according to claim 28, wherein the step of reducing the pin hardness is a heat treatment step of reducing the Vickers hardness by a heat treatment for heating the pin. 30. Claims 24 to 27 and claim 2
The method of manufacturing a pin according to any one of claims 9, wherein a mechanical polishing step of mechanically polishing the pin is performed prior to the heat treatment step.