JP2002232177A - Shielding structure for electronic unit case - Google Patents
Shielding structure for electronic unit caseInfo
- Publication number
- JP2002232177A JP2002232177A JP2001028770A JP2001028770A JP2002232177A JP 2002232177 A JP2002232177 A JP 2002232177A JP 2001028770 A JP2001028770 A JP 2001028770A JP 2001028770 A JP2001028770 A JP 2001028770A JP 2002232177 A JP2002232177 A JP 2002232177A
- Authority
- JP
- Japan
- Prior art keywords
- case
- electronic device
- device case
- electronic
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011888 foil Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 abstract description 46
- 229920005989 resin Polymers 0.000 abstract description 46
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 230000003068 static effect Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 230000005611 electricity Effects 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229920001940 conductive polymer Polymers 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は各種電子機器に於い
て、当該電子機器ケース内壁面にアルミ箔板、金属箔板
等でなるシールド部材を形成し、外部からの電波信号や
ノイズ信号又は静電気信号による障害を防止すべくした
新規な電子機器ケースのシールド構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to various electronic devices, in which a shielding member made of an aluminum foil plate, a metal foil plate, or the like is formed on the inner wall surface of the electronic device case so that an external radio signal, noise signal, or static electricity is formed. The present invention relates to a novel electronic device case shield structure for preventing a failure due to a signal.
【0002】[0002]
【従来の技術】従来の技術は、例えば、自動車用電装機
器である場合、当該機器ケースの底面部には基板が固定
され、この基板上に各種電子回路や電子部品又はユニッ
トが装着されている。そして、当該機器ケースは、金属
又は樹脂で成形されてなるものである。而して、外部か
ら当該自動車用電装機器に対して、電波信号やノイズ雑
音又は静電気信号が入力された場合、当該機器ケース内
に配置されている各種電子回路や電子部品又はユニット
に、これらの信号が付与され各障害が発生し、当該自動
車用電装機器が誤動作することがあった。2. Description of the Related Art In the prior art, for example, in the case of electrical equipment for automobiles, a board is fixed to the bottom of the equipment case, and various electronic circuits, electronic components or units are mounted on the board. . The device case is made of metal or resin. Thus, when a radio signal, noise noise, or an electrostatic signal is input from the outside to the vehicle electrical equipment, these electronic circuits, electronic components, or units disposed in the equipment case are provided with these signals. When a signal was given, each failure occurred, and the automotive electrical equipment sometimes malfunctioned.
【0003】[0003]
【発明が解決しようとする課題】上記、従来の技術によ
れば、次の課題が存在した。 各種電子機器に於いて、電波やノイズ又は静電気によ
る各障害を防止するためには、電子機器ケースの底部の
基板上に装着した各種電子回路や電子部品又はユニット
のすべてをそれぞれ各個のシールドケースで保護する必
要があり、各個のシールドケースを多数個用意しなけれ
ばならないと共に、当該シールドケースを設置する工数
が増大し、当該電子機器ケース自体が大型化する問題点
があった。 各種電子機器に於いて、電波やノイズ又は静電気によ
る各障害を防止する構造を備えていない場合は、当該各
種電子機器が電波等の障害に晒され当該電子機器が所期
の機能を果さない問題点があった。 各種電子機器ケースを金属鍍金処理する方法もある
が、この場合、当該電子機器ケース全体に鍍金が付き、
機器ケースの外観は塗装等が必要となり、また、機器ケ
ース内側に於いて、塗装の不要な部位はマスキング工程
が必要である等種々の問題点があった。According to the above prior art, there are the following problems. In various electronic devices, in order to prevent failures due to radio waves, noise, or static electricity, all of the various electronic circuits, electronic components, or units mounted on the board at the bottom of the electronic device case must be individually shielded. There is a problem that it is necessary to protect, a large number of shield cases must be prepared for each case, the number of steps for installing the shield case increases, and the electronic device case itself becomes large. If various electronic devices do not have a structure to prevent each obstacle due to radio waves, noise, or static electricity, the various electronic devices are exposed to obstacles such as radio waves, and the electronic devices do not perform their intended functions. There was a problem. There is also a method of metal-plating various electronic device cases, but in this case, the entire electronic device case is plated,
There are various problems such as the appearance of the equipment case requiring painting and the like, and the inside of the equipment case not requiring painting requires a masking step.
【0004】[0004]
【課題を解決するための手段】本発明は、従来の各種電
子機器ケースに簡単な構成を付加することにより、当該
電子機器ケース内に装備した電子回路や電子部品又はユ
ニットを電波やノイズ又は静電気障害から防止する技術
であって、上述した課題を解決することを目的としたも
のであり、次の構成、手段を採用した。SUMMARY OF THE INVENTION According to the present invention, an electronic circuit, an electronic component, or a unit provided in a case of an electronic device is provided with a radio wave, a noise, or a static electricity by adding a simple configuration to a conventional case of various electronic devices. A technique for preventing a failure, which is intended to solve the above-described problem, employs the following configuration and means.
【0005】請求項1記載の発明によれば、電子機器ケ
ースの内壁面にシールド部材を形成したことを特徴とす
る電子機器ケースのシールド構造である。According to the first aspect of the present invention, there is provided a shield structure for an electronic device case, wherein a shield member is formed on an inner wall surface of the electronic device case.
【0006】請求項2記載の発明によれば、前記シール
ド部材が金属箔板でなることを特徴とする請求項1記載
の電子機器ケースのシールド構造である。According to a second aspect of the present invention, there is provided the shield structure for an electronic device case according to the first aspect, wherein the shield member is made of a metal foil plate.
【0007】請求項3記載の発明によれば、前記電子機
器ケースが高速道路用自動料金計算システム(ETS)
機器ケースでなることを特徴とする請求項1又は2記載
の電子機器ケースのシールド構造である。According to the third aspect of the present invention, the electronic equipment case is an expressway automatic toll calculation system (ETS).
The shield structure for an electronic device case according to claim 1 or 2, wherein the shield structure comprises an device case.
【0008】請求項4記載の発明によれば、電子機器ケ
ースがナビゲーション機器ケースでなることを特徴とす
る請求項1又は2記載の電子機器ケースのシールド構造
である。According to the fourth aspect of the present invention, a shielding structure for an electronic device case according to claim 1 or 2, wherein the electronic device case is characterized by comprising the navigation device case.
【0009】請求項5記載の発明によれば、電子機器ケ
ースがパソコンケースでなることを特徴とする請求項1
又は2記載の電子機器ケースのシールド構造である。According to the fifth aspect of the invention, claim 1 electronic device case is characterized by comprising a computer case
Or a shield structure of the electronic device case according to 2.
【0010】[0010]
【発明の実施の形態】以下、本発明に係る電子機器ケー
スのシールド構造の実施の形態について、添付図面に基
づいて説明する。図1及び2は本発明に係る電子機器ケ
ースのシールド構造の実施の形態1及び2を示す斜視図
である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a shield structure for an electronic device case according to the present invention will be described below with reference to the accompanying drawings. 1 and 2 are perspective views showing Embodiments 1 and 2 of a shield structure of an electronic device case according to the present invention.
【0011】[0011]
【発明の実施の形態1】図1は基板を固定していない状
態に於ける樹脂ケースの例を示すもので、1は略立方体
形状を有した樹脂ケースである。該樹脂ケース1は例え
ば、電子機器ケースであって、高速道路用自動料金計算
システム(ETS)機器ケースやナビゲーション機器ケ
ース又はパソコンケース等各種の電気通信や自動車関連
の電子機器ケース等である。First Embodiment FIG. 1 shows an example of a resin case in which a substrate is not fixed, and 1 is a resin case having a substantially cubic shape. The resin case 1 is, for example, an electronic device case, such as an electronic device case related to various telecommunications and automobiles, such as an automatic toll calculation system (ETS) device case for an expressway, a navigation device case, or a personal computer case.
【0012】前記略立方体形状を有した樹脂ケース1
は、内面は1つの底面部2aと4つの内側面部2b〜2
e及び1つの上蓋下面部(開示せず)で構成され、これら
5つの側壁面全体にシールド部材2を一体形成する。該
シールド部材2は、例えばアルミ箔板、銅箔板、鍍箔板
等の薄い金属板で構成され、また、該シールド部材2は
電波、ノイズ、電磁波又は静電気等シールド材料、すなわ
ち、ポリマ−に導電性の粉末を分散させて得られる複合
導電材料等である。そして、当該シールド部材2は、不
要な電波やノイズ又は静電気のエネルギーを吸収し、反
射させて、表面からのエネルギー伝播を妨げる機能を有
する。A resin case 1 having a substantially cubic shape.
The inner surface has one bottom surface portion 2a and four inner surface portions 2b to 2
e and one lower surface of the upper lid (not shown), and the shield member 2 is integrally formed on these five side walls. The shield member 2 is made of a thin metal plate such as an aluminum foil plate, a copper foil plate, a plating plate, or the like. The shield member 2 is made of a shielding material such as radio waves, noise, electromagnetic waves or static electricity, that is, a polymer. It is a composite conductive material obtained by dispersing conductive powder. The shield member 2 has a function of absorbing and reflecting unnecessary radio wave, noise, or static energy, thereby preventing energy transmission from the surface.
【0013】上記シールド部材2を前記電子機器の樹脂
ケース1の底面部2a及び4つの内側面部2b〜2eに
一体形成する方法としては、当該樹脂ケース1の5つの
側壁面全体に導電性高分子皮膜を形成する表面処理を行
なう。また、導電性フィラーを当該電子機器の樹脂ケー
ス1の材料内に混入して複合化による当該樹脂ケース1
を導電化する方法がある。ここで、前記導電性高分子皮
膜はカーボンブラック、銀、銅等の微粒子を多量に配合
した高分子材料でなる。As a method for integrally forming the shield member 2 on the bottom surface 2a and the four inner side surfaces 2b to 2e of the resin case 1 of the electronic device, a conductive polymer is formed on the entire five side walls of the resin case 1. performing a surface treatment for forming a film. In addition, a conductive filler is mixed into the material of the resin case 1 of the electronic device to form the resin case 1 by compounding.
There is a method in which conductive the. Here, the conductive polymer film is made of a polymer material containing a large amount of fine particles such as carbon black, silver, and copper.
【0014】2fは前記シールド部材2の表面に多数個
設けた孔であり、当該孔2fから樹脂ケース1の側壁面
全体2a〜2eの一部が露出されており、前記樹脂ケー
ス1を成形時当該孔2fから樹脂がはみ出しこれによ
り、当該シールド部材2と該樹脂ケース1の密着度を高
めている。なお、本発明に係る電子機器ケースのシール
ド構造は、前記シールド部材2に孔2fを設けなくて
も、技術的効果は達成できるものである。Reference numeral 2f denotes a plurality of holes provided on the surface of the shield member 2, and a part of the entire side wall surface 2a to 2e of the resin case 1 is exposed from the hole 2f. The resin protrudes from the hole 2f, thereby increasing the degree of adhesion between the shield member 2 and the resin case 1. In addition, in the shield structure of the electronic device case according to the present invention, technical effects can be achieved without providing the hole 2f in the shield member 2.
【0015】次に前記本発明に係る電子機器ケースのシ
ールド構造の実施の形態1に於ける生産方法を概説すれ
ば、先づ所定の形状、例えば、略立方体形状ケースを成
形する成形金型に樹脂材料を流し込みこれが固定化され
て、樹脂ケース1が完成する。そして、当該樹脂ケース
1は内面が底面部2a、右内側面部2b、左内側面部2
c、前内側面部2d、後内側面部2e及び上蓋下面部
(開示せず)で構成されており、これらの総称がいわゆる
側壁面部2a〜2eである。Next, an outline of the production method in the first embodiment of the shield structure of the electronic device case according to the present invention will be described. First, a molding die for molding a case having a predetermined shape, for example, a substantially cubic shape. The resin material is poured and fixed, and the resin case 1 is completed. The resin case 1 has an inner surface with a bottom surface 2a, a right inner surface 2b, and a left inner surface 2
c, front inner surface 2d, rear inner surface 2e, and lower surface of upper lid
(Not disclosed), and these are collectively referred to as so-called side wall surfaces 2a to 2e.
【0016】而して、前記シールド部材2、例えば、ア
ルミ箔、銅箔、錫箔の薄い金属箔板である場合、前記樹
脂ケース(上蓋)1の成形時、当該アルミ箔等の薄い金
属板2を成形したものを成形金型にセットし樹脂材料の
射出により一体化させ、固形化し、当該アルミ箔等の薄
い金属箔板2を前記樹脂ケース1のそれぞれの底面部2
a、4つの内側面部2a〜2eにアルミ箔等薄い金属板
2を形成する。このようにして、本発明の実施の形態1
に示す電子機器ケースのシールド構造が完成する。When the shield member 2 is made of a thin metal foil, such as an aluminum foil, a copper foil, or a tin foil, when the resin case (top cover) 1 is formed, the thin metal plate 2 made of the aluminum foil or the like is used. Is set in a molding die, integrated by injection of a resin material, solidified, and the thin metal foil plate 2 such as the aluminum foil is placed on the bottom surface 2 of each of the resin cases 1.
a, A thin metal plate 2 such as an aluminum foil is formed on the four inner side surfaces 2a to 2e. Thus, Embodiment 1 of the present invention
The shield structure of the electronic device case shown in FIG.
【0017】そして、本発明に係る実施の形態1に基づ
く電子機器ケースのシールド構造に於いては、外部から
電波信号やノイズ信号又は静電気信号が入力された場
合、これらの信号は樹脂ケース1の底面部2a、4つの
内側面部2b〜2eに形成したシールド部材2により吸
収又は反射され、当該電子機器ケース1の内部に設置し
た各種電子部品や電子回路又はユニット(開示せず)に障
害を与えることはなく電波信号やノイズ信号又は静電気
信号から保護される。当該各種電子部品や電子回路又は
ユニットは、例えば、高速道路用自動料金計算システム
(ETS)機器ケース、ナビゲーション機器ケース、パソ
コンケース等で構成されるものである。In the electronic device case shield structure according to the first embodiment of the present invention, when a radio signal, a noise signal, or an electrostatic signal is input from outside, these signals are transmitted to the resin case 1. Absorbed or reflected by the shield member 2 formed on the bottom surface portion 2a and the four inner side surface portions 2b to 2e, and impairs various electronic components, electronic circuits or units (not shown) installed inside the electronic device case 1. It is protected from radio signals, noise signals or electrostatic signals. The various electronic components or electronic circuits or units are, for example, an automatic toll calculation system for a highway.
(ETS) It is composed of a device case, a navigation device case, a personal computer case and the like.
【0018】[0018]
【発明の実施の形態2】図2は電子回路基板3を備えた
電子機器ケースであって、樹脂で成形されている。4は
略立方体形状を有した上蓋であって、樹脂ケースとして
の役目がある。該樹脂ケース、すなわち上蓋4は、例え
ば、電子機器ケースであって、高速道路用自動料金計算
システム(ETS)機器ケースやナビゲーション機器ケー
ス又はパソコンケース等各種の電子、通信や自動車関連
の機器ケース等である。Embodiment 2 FIG. 2 shows an electronic device case provided with an electronic circuit board 3, which is formed of resin. Reference numeral 4 denotes an upper lid having a substantially cubic shape, which serves as a resin case. The resin case, that is, the upper cover 4 is, for example, an electronic device case, and various electronic, communication, and automobile-related device cases such as an expressway automatic toll calculation system (ETS) device case, a navigation device case, and a personal computer case. It is.
【0019】前記上蓋4は底面部4aが開放されてお
り、内面は1つの蓋下面部4fと、4つの内側面部4b
〜4eで構成され、これら1つの蓋下面部4f及び4つ
の内側面部4b〜4eの全体にシールド部材5を形成し
て構成する。該シールド部材5は、例えばアルミ箔板等
の薄い金属板で構成され、また、該シールド部材5は電
波、ノイズ、電磁波又は静電気等シールド材料、すなわ
ち、ポリマ−に導電性の粉末を分散させて得られる複合
導電材料等である。そして、当該シールド部材5は、不
要な電波やノイズ又は静電気のエネルギーを吸収し、反
射させて、表面からのエネルギー伝播を妨げる機能を有
する。The upper lid 4 has an open bottom surface 4a, and the inner surface has one lid lower surface portion 4f and four inner surface portions 4b.
To 4e, and the shield member 5 is formed on the entire lid lower surface portion 4f and the four inner surface portions 4b to 4e. The shield member 5 is made of, for example, a thin metal plate such as an aluminum foil plate. The shield member 5 is formed by dispersing conductive powder in a shielding material such as radio waves, noise, electromagnetic waves or static electricity, that is, a polymer. The resulting composite conductive material and the like. The shield member 5 has a function of absorbing and reflecting unnecessary radio wave, noise, or static energy, thereby preventing energy transmission from the surface.
【0020】上記シールド部材5を前記電子機器の樹脂
ケース(上蓋)4の内側面部4b〜4e及び蓋下面部4f
に一体形成する方法としては、当該樹脂ケース4の5つ
の内側面部4b〜4e、4fに導電性高分子皮膜を形成
する表面処理を行なう。また、導電性フィラーを当該電
子機器の樹脂ケース4(上蓋)の材料内に混入して複合
化による当該樹脂ケース4(上蓋)を導電化する方法が
ある。ここで、前記導電性高分子皮膜はカーボンブラッ
ク、銀、銅等の微粒子を多量に配合した高分子材料でな
る。The shield member 5 is connected to the inner surface portions 4b to 4e of the resin case (upper lid) 4 of the electronic device and the lower surface portion 4f of the lid.
As a method of integrally forming the resin case 4, a surface treatment for forming a conductive polymer film on the five inner side surfaces 4b to 4e and 4f of the resin case 4 is performed. Further, a conductive filler and a method of electrification guide the resin case 4 of the electronic device the resin case 4 by the material composite is mixed in the (upper lid) (lid). Here, the conductive polymer film is made of a polymer material containing a large amount of fine particles such as carbon black, silver, and copper.
【0021】尚図中、前記シールド部材5の構造は前記
発明の実施の形態1と同一であるのでその説明を省略す
る。In the figure, the structure of the shield member 5 is the same as that of the first embodiment of the present invention, and the description is omitted.
【0022】次に前記本発明に係る電子機器ケースのシ
ールド構造の実施の形態2に於ける生産方法を概説すれ
ば、先づ所定の形状、例えば、略立方体形状ケースを成
形する成形金型に樹脂材料を流し込みこれが固定化され
て、樹脂ケース(上蓋)4が完成する。そして、当該樹
脂ケース(上蓋)4は内面が右内側面部4b、左内側面
部4c、前内側面部4d、後内側面部4e及び蓋下面部
4fで構成されており、これらの総称がいわゆる側壁面
部である。Next, the production method in the second embodiment of the shield structure for an electronic device case according to the present invention will be outlined. First, a molding die for molding a case having a predetermined shape, for example, a substantially cubic shape, is used. The resin material is poured and fixed, and the resin case (upper lid) 4 is completed. The resin case (upper lid) 4 has an inner surface composed of a right inner surface 4b, a left inner surface 4c, a front inner surface 4d, a rear inner surface 4e, and a lid lower surface 4f. is there.
【0023】而して、前記シールド部材5、例えば、ア
ルミ箔、銅箔、錫箔等の薄い金属板である場合、前記樹
脂ケース(上蓋)4の成形時、当該アルミ箔等の薄い金
属板5を成形したものを成形金型にセットし樹脂材料の
射出により一体化させ、固形化し、前記樹脂ケース(上
蓋)4のそれぞれの内側面部4b〜4e及び蓋下面部4
fにアルミ箔等の薄い金属板を形成する。このようにし
て、本発明の実施の形態2に示す電子機器ケースのシー
ルド構造が完成する。When the shielding member 5 is a thin metal plate such as an aluminum foil, a copper foil, or a tin foil, the thin metal plate 5 such as the aluminum foil is formed when the resin case (top lid) 4 is formed. Is set in a molding die, integrated by injection of a resin material, solidified, and the respective inner surface portions 4b to 4e and the lower surface portion 4 of the resin case (upper lid) 4 are formed.
A thin metal plate such as an aluminum foil is formed on f. Thus, the shield structure of the electronic device case according to the second embodiment of the present invention is completed.
【0024】本発明に係る電子機器ケースのシールド構
造の実施の形態2は特に、前記電子回路基板3を備えた
ことが特徴であり、該電子回路基板3は上面部3aに各
種電子回路6aや電子部品6b等を装着し、高速道路用
自動料金計算システム(ETS)機器やナビゲーション機
器等の基板を構成するものである。The second embodiment of the shield structure of the electronic device case according to the present invention is characterized in that the electronic circuit board 3 is provided with the above-mentioned electronic circuit board 3. The electronic components 6b and the like are mounted thereon to constitute a board for an automatic toll calculation system (ETS) device for an expressway, a navigation device, and the like.
【0025】前記上蓋4の左右前後の外壁部4g〜4j
は上面部4kから垂下しており、該外壁部4g、4hの
一部に係合孔4l、4mのそれぞれを配備している。そ
して対向して配備した該係合孔4l、4mは、前記電子
回路基板3の左右に形成した突起3b、3cのそれぞれ
を係止し、当該電子回路6aや電子部品6bを備えた電
子回路基板3は前記樹脂ケース(上蓋)4に固定され
る。The left, right, front and rear outer walls 4g to 4j of the upper lid 4
Is suspended from the upper surface 4k, and engagement holes 41 and 4m are respectively provided in a part of the outer wall portions 4g and 4h. The engaging holes 41 and 4m disposed opposite to each other lock the projections 3b and 3c formed on the left and right sides of the electronic circuit board 3, respectively, and provide an electronic circuit board including the electronic circuit 6a and the electronic component 6b. 3 is fixed to the resin case (top lid) 4.
【0026】そして、本発明に係る実施の形態2に基づ
く電子機器ケースのシールド構造に於いては、外部から
電波信号やノイズ信号又は静電気信号が入力された場
合、これらの信号は樹脂ケース(上蓋)4の内側面部4
b〜4e及び蓋下面部4fに形成したシールド部材5に
より吸収又は反射され、当該樹脂ケース1の内部に設置
した各種電子部品6bや電子回路6a又はユニット(開
示せず)に障害を与えることはなく電波信号やノイズ信
号又は静電気信号から保護される。当該各種電子部品6
bや電子回路6a又はユニットは、例えば、高速道路用
自動料金計算システム(ETS)機器ケース、ナビゲー
ション機器ケース、パソコンケース等の内部に配置構成
されるものである。In the shield structure of the electronic device case according to the second embodiment of the present invention, when a radio signal, a noise signal, or an electrostatic signal is input from outside, these signals are transmitted to the resin case (top cover). ) 4 inner surface part 4
It is absorbed or reflected by the shield members 5 formed on the b to 4e and the lower surface 4f of the lid, and does not impair the various electronic components 6b, the electronic circuit 6a or the unit (not shown) installed inside the resin case 1. And is protected from radio signals, noise signals or electrostatic signals. Various electronic components 6
The electronic circuit 6a or the electronic circuit 6a or the unit is arranged and configured inside, for example, an expressway automatic toll calculation system (ETS) equipment case, a navigation equipment case, a personal computer case, and the like.
【0027】[0027]
【発明の効果】本発明に係る電子機器ケースのシールド
構造は叙上の構成、動作を有するので次の効果がある。The shield structure of the electronic device case according to the present invention has the above-described configuration and operation, and thus has the following effects.
【0028】請求項1記載の発明によれば、電子機器ケ
ースの内壁面にシールド部材を形成したことを特徴とす
る電子機器ケースのシールド構造を提供する。請求項2
記載の発明によれば、前記シールド部材が金属箔板でな
ることを特徴とする請求項1記載の電子機器ケースのシ
ールド構造を提供する。請求項3記載の発明によれば、
前記電子機器ケースが高速道路用自動料金計算システム
機器(ETS)ケースでなることを特徴とする請求項1
又は2記載の電子機器ケースのシールド構造を提供す
る。請求項4記載の発明によれば、電子機器ケースがナ
ビゲーション機器ケースでなることを特徴とする請求項
1又は2記載の電子機器ケースのシールド構造を提供す
る。請求項5記載の発明によれば、電子機器ケースがパ
ソコンケースでなることを特徴とする請求項1又は2記
載の電子機器ケースのシールド構造を提供する。 電子機器ケースの底部の基板上に装着した各種電子回
路や電子部品又はユニットのすべてをそれぞれ各個のシ
ールドケースで保護する必要がなく、また各個のシール
ドケースを多数個用意することもなく、当該シールド部
材を設置する工数が少なく、かつ当該電子機器ケース自
体の小型化を図ることができる。 本発明によれば、電波やノイズ又は静電気による各障
害を完全に防止する構造を備えているので、当該各種電
子機器が電波等の障害に晒されることなく当該電子機器
が所期の機能を果すことができ電子部品等の交換作業が
不要となる。 本発明によれば、各種電子機器ケースを金属鍍金処理
する方法も必要もなく、また、当該金属鍍金処理に基づ
く欠点を排除し、簡単な手順でシールド成形された電子
機器ケースを生産できる。According to the first aspect of the present invention, there is provided a shield structure for an electronic device case, wherein a shield member is formed on an inner wall surface of the electronic device case. Claim 2
According to the invention described above, the shield structure of the electronic device case according to claim 1, wherein the shield member is made of a metal foil plate. According to the invention described in claim 3,
2. The electronic equipment case comprises an expressway automatic toll calculation system equipment (ETS) case.
Or a shield structure for an electronic device case according to 2. According to the fourth aspect of the present invention, there is provided a shield structure for an electronic device case according to the first or second aspect, wherein the electronic device case is a navigation device case. According to a fifth aspect of the present invention, there is provided the electronic device case shielding structure according to the first or second aspect, wherein the electronic device case is a personal computer case. It is not necessary to protect all of the various electronic circuits, electronic components or units mounted on the board at the bottom of the electronic device case with each shield case, and there is no need to prepare a large number of each shield case. The number of steps for installing the members is small, and the size of the electronic device case itself can be reduced. According to the present invention, since a structure for completely preventing each trouble due to radio waves, noise, or static electricity is provided, the various electronic devices perform their intended functions without being exposed to troubles such as radio waves. This eliminates the need to replace electronic components and the like. ADVANTAGE OF THE INVENTION According to this invention, the method of metal-plating various electronic device cases is unnecessary, and the defect based on the said metal-plating process is eliminated, and the electronic device case which carried out shield molding by a simple procedure can be produced.
【図1】本発明に係る電子機器ケースのシールド構造の
実施の形態1を示す斜視図である。FIG. 1 is a perspective view showing a first embodiment of a shield structure of an electronic device case according to the present invention.
【図2】本発明に係る電子機器ケースのシールド構造の
実施の形態2を示す斜視図である。FIG. 2 is a perspective view showing Embodiment 2 of a shield structure of an electronic device case according to the present invention.
1 樹脂ケース 2 シールド部材 2a 樹脂ケースの底面部 2b 樹脂ケースの右内側面部 2c 樹脂ケースの左内側面部 2d 樹脂ケースの前内側面部 2e 樹脂ケースの後内側面部 2f 孔 3 電子回路基板 3a 電子回路基板の上面部 3b、3c 突起 4 樹脂ケース(上蓋) 4a 底面部 4b 右内側面部 4c 左内側面部 4d 前内側面部 4e 後内側面部 4f 蓋下面部 4g〜4j 外壁部 4l、4m 係合孔 5 シールド部材 6a 電子回路 6b 電子部品 REFERENCE SIGNS LIST 1 resin case 2 shield member 2 a bottom surface of resin case 2 b right inner surface of resin case 2 c left inner surface of resin case 2 d front inner surface of resin case 2 e rear inner surface of resin case 2 f hole 3 electronic circuit board 3 a electronic circuit board 3b, 3c Projection 4 Resin case (upper lid) 4a Bottom part 4b Right inner side part 4c Left inner side part 4d Front inner side part 4e Rear inner side part 4f Cover lower part part 4g-4j Outer wall part 41, 4m Engagement hole 5 Shield member 6a Electronic circuit 6b Electronic component
Claims (5)
形成したことを特徴とする電子機器ケースのシールド構
造。1. A shield structure for an electronic device case, wherein a shield member is formed on an inner wall surface of the electronic device case.
特徴とする請求項1記載の電子機器ケースのシールド構
造。2. The shield structure for an electronic device case according to claim 1, wherein said shield member is made of a metal foil plate.
計算システム機器(ETS)ケースでなることを特徴と
する請求項1又は2記載の電子機器ケースのシールド構
造。3. The shield structure for an electronic device case according to claim 1, wherein the electronic device case is an ETS case for an automatic toll calculation system for an expressway.
スでなることを特徴とする請求項1又は2記載の電子機
器ケースのシールド構造。4. The shield structure for an electronic device case according to claim 1, wherein the electronic device case is a navigation device case.
とを特徴とする請求項1又は2記載の電子機器ケースの
シールド構造。5. The shield structure for an electronic device case according to claim 1, wherein the electronic device case is a personal computer case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001028770A JP2002232177A (en) | 2001-02-05 | 2001-02-05 | Shielding structure for electronic unit case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001028770A JP2002232177A (en) | 2001-02-05 | 2001-02-05 | Shielding structure for electronic unit case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002232177A true JP2002232177A (en) | 2002-08-16 |
Family
ID=18893211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001028770A Withdrawn JP2002232177A (en) | 2001-02-05 | 2001-02-05 | Shielding structure for electronic unit case |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002232177A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007281235A (en) * | 2006-04-07 | 2007-10-25 | Nec Tokin Corp | Surface mount capacitor |
| US7411787B2 (en) | 2005-12-02 | 2008-08-12 | Hitachi, Ltd. | Storage control device |
-
2001
- 2001-02-05 JP JP2001028770A patent/JP2002232177A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7411787B2 (en) | 2005-12-02 | 2008-08-12 | Hitachi, Ltd. | Storage control device |
| JP2007281235A (en) * | 2006-04-07 | 2007-10-25 | Nec Tokin Corp | Surface mount capacitor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20080513 |