JP2002324302A - Thin film magnetic head and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin film magnetic head which can control its slot height easily, and its manufacturing method. SOLUTION: The connection of the middle section 17b and the tip 17c specifying the recording track width at the upper magnetic pole 17 is positioned at the slit height zero position (TH0 position) that is used as the standard of the slit height. A level difference is provided there changing almost at a right angle. The middle section 17b in this connection is made sufficiently wider than the tip 17c of the connection. The photoresist pattern for forming the tip 17c can be prevented from spreading, and a fine recording track width is made feasible. The wide middle section 17b can prevent the magnetic flux generated in the yoke 17a from saturating before it reaches the tip 17c, and a sufficient over-writing property can be secured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin-film magnetic head having at least an inductive magnetic transducer for writing and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as the areal recording density of a hard disk drive has been improved, the performance of a thin film magnetic head has been required to be improved. As the thin film magnetic head, a composite thin film having a structure in which a recording head having an inductive magnetic transducer for writing and a reproducing head having a magnetoresistive (MR) element for reading is stacked. Magnetic heads are widely used. As an MR element, an anisotropic magnetoresistance (hereinafter, AMR) is used.
stive). An AMR element using the effect and a GMR element using a giant magnetoresistance (hereinafter, referred to as GMR (Giant Magneto Resistive)) effect. A reproducing head using an AMR element is called an AMR head or simply an MR head. A reproducing head using a GMR element is a GMR head.
Called the head. The AMR head is used as a reproducing head having a surface recording density exceeding 1 gigabit / (inch) ² , and the GMR head is used as a surface recording density of 3 gigabit / (inch) ^2.
(Inch) Used as a playback head exceeding ² .

An AMR head is an AM head having an AMR effect.
An R film is provided. The GMR head uses the GM
This is replaced with a GMR film having the R effect, and is similar in structure to the AMR head. However, the GMR film has an AM
It shows a larger resistance change when the same external magnetic field is applied than the R film. For this reason, it is said that the GMR head can increase the reproduction output by about 3 to 5 times as compared with the AMR head.

As a method for improving the performance of the reproducing head, a method of changing the MR film from an AMR film to a material having excellent magnetoresistance such as a GMR film, or a method of optimizing a pattern width of the MR film, particularly an MR height. There are methods. The MR height refers to the length (height) from the end of the MR element on the air bearing surface side to the end on the opposite side, and is controlled by the amount of polishing when processing the air bearing surface. .
The air bearing surface referred to here is a surface of the thin-film magnetic head facing the magnetic recording medium, and is also called a track surface.

On the other hand, as the performance of the reproducing head is improved, the performance of the recording head is also required to be improved. The factors that determine the performance of the recording head are Throat H
eight: TH). The throat height refers to the length (height) of the magnetic pole portion from the air bearing surface to the edge of the insulating layer that electrically separates the thin-film coil for generating magnetic flux.
In order to improve the performance of the recording head, it is desired to reduce the throat height. This throat height is also controlled by the amount of polishing when processing the air bearing surface.

In order to increase the recording density of the performance of the recording head, it is necessary to increase the track density in the magnetic recording medium. To do this, a lower magnetic pole (bottom pole) formed above and below the write gap
It is necessary to realize a recording head with a narrow track structure in which the width of the top pole (top pole) on the air bearing surface is reduced from several microns to submicron order.
Semiconductor processing technology is used to achieve this.

Here, referring to FIGS. 39 to 44,
As an example of a conventional method of manufacturing a thin film magnetic head, an example of a method of manufacturing a composite thin film magnetic head will be described.

In this manufacturing method, first, as shown in FIG.
So, for example, Altic (Al ^TwoO^Three・ TiC)
For example, alumina (Al)^TwoO^Three)
The insulating layer 102 is formed with a thickness of about 5 to 10 μm.
accumulate. Next, an insulating layer 102
The unit shield layer 103 is formed. Next, the lower shield layer
103, for example, alumina is formed to a thickness of 100 to 200 nm.
To form a shield gap film 104
I do. Next, on the shield gap film 104,
An MR film 105 for constituting an MR element is
Formed to the desired thickness with high-precision photolithography
Patterning. Next, on both sides of the MR film 105,
A lead electrode layer electrically connected to the MR film 105;
After forming a lead layer (not shown),
Layer, shield gap film 104 and MR film 105
Then, a shield gap film 106 is formed, and the MR film 105 is formed.
Is embedded in the shield gap films 104 and 106. Next
Next, the read head and the recording
A magnetic material used for both of the heads, for example, Permalloy (N
iFe) upper shield and lower magnetic pole (hereinafter, lower part)
Recorded as a magnetic pole. ) 107 is formed.

Next, as shown in FIG.
On the recording gap layer 108, an insulating film, for example, an alumina film is formed. On the recording gap layer 108, a photoresist layer 109 is formed in a predetermined pattern by high-precision photolithography. Next, a first-layer thin-film coil 110 for an inductive recording head made of, for example, copper (Cu) is formed on the photoresist layer 109 by, for example, a plating method. Next, the photoresist layer 1
The photoresist layer 111 is formed in a predetermined pattern by high-precision photolithography so as to cover the coil 09 and the coil 110. Next, for flattening the coils 110 and insulating between the coils 110, for example, 250 ° C.
Heat treatment at a temperature of Next, a second-layer thin-film coil 112 made of, for example, copper is formed on the photoresist layer 111 by, for example, a plating method. Next, a photoresist layer 113 is formed in a predetermined pattern on the photoresist layer 111 and the coil 112 by high-precision photolithography.
For insulation between layers, for example, heat treatment is performed at a temperature of 250 ° C.

Next, as shown in FIG.
At a position behind 0, 112 (right side in FIG. 41), in order to form a magnetic path, the recording gap layer 108 is partially etched to form an opening 108a. Next, the recording gap layer 108 and the photoresist layer 10
An upper yoke and upper magnetic pole (hereinafter, referred to as permalloy) made of a magnetic material for a recording head, for example,
It is described as an upper magnetic pole. ) 114 is selectively formed. The upper magnetic pole 114 is in contact with the lower magnetic pole 107 at the opening 108a and is magnetically connected thereto. Next, using the upper magnetic pole 114 as a mask, the recording gap layer 108 and the lower magnetic pole 107 are moved to about 0.
After etching by about 5 μm, an overcoat layer 115 made of, for example, alumina is formed on the upper magnetic pole 114. Finally, the slider is machined to form a track surface (air bearing surface) 1 of the recording head and the reproducing head.
20 are formed to complete the thin-film magnetic head.

FIGS. 42 to 44 show the structure of a completed thin film magnetic head. Here, FIG. 42 shows a cross section of the thin film magnetic head perpendicular to the air bearing surface 120, FIG. 43 shows an enlarged cross section of the magnetic pole portion parallel to the air bearing surface 120, and FIG. 44 shows a plan view. 39 to 42 correspond to a cross section taken along line AA 'in FIG. 42 to FIG.
4, illustration of the overcoat layer 115 is omitted.

In order to improve the performance of a thin-film magnetic head,
Throat height TH, apex angle θ, magnetic pole width P2W and magnetic pole length P2L shown in FIGS. 42 and 43
It is important that they be accurately formed. Here, the Apex Angle (θ) is the photoresist layer 1
This is the angle formed by the straight line connecting the corners of the side surfaces of the track surfaces 09, 111, and 113 and the upper surface of the upper magnetic pole 114. The magnetic pole width P2W defines the recording track width on the recording medium. The magnetic pole length P2L indicates the thickness of the magnetic pole.
In FIG. 42 and FIG. 44, the “TH0 position” is the edge on the track surface side of the photoresist layer 109 which is an insulating layer for electrically separating the thin-film coils 110 and 112, and the throat height TH Reference position 0 is shown.

As shown in FIG. 43, the upper magnetic pole 114,
A structure in which the respective sidewalls of the recording gap layer 108 and a part of the lower magnetic pole 107 are vertically formed in a self-aligned manner is called a trim (Trim) structure. According to this trim structure, it is possible to prevent the effective track width from increasing due to the spread of the magnetic flux generated when writing in a narrow track. As shown in FIG. 43, this M
A lead layer 121 as an extraction electrode layer electrically connected to the R film 105 is provided. However, FIGS.
2 and FIG. 44, the illustration of the lead layer 121 is omitted.

FIG. 45 shows a planar structure of the upper magnetic pole 114. As shown in FIG.
Is the yoke portion 114a occupying most of the portion, and the magnetic pole width P
Pole tip part 1 having a substantially constant width W1 as 2W
14b. At the connecting portion between the yoke portion 114a and the pole tip portion 114b, the yoke portion 114a
Has an angle α with respect to a plane parallel to the air bearing surface 120, and the outer edge of the pole tip portion 114 b has an angle β with respect to a plane parallel to the air bearing surface 120 in the connection portion. . Here, α is, for example, about 45 degrees, and β is 90 degrees. The width of the pole tip portion 114b defines the recording track width on the recording medium. The pole tip portion 114b has a portion F on the front side (the air bearing surface 120 side) from the TH0 position.
And a portion R on the rear side (on the yoke portion 114a side) of the TH0 position. As can be seen from FIG.
Extends over the flat recording gap layer 108 and
And the yoke portion 114a are formed of a photoresist layer 109,
It extends over a coil portion (hereinafter referred to as an apex portion) which is covered with 111 and 113 and rises in a mountain shape.

The shape of the upper magnetic pole is described, for example, in JP-A-8-249614.

[0016]

The magnetic pole width P2W is required to be accurately formed in order to determine the track width of the recording head. In particular, in recent years, in order to enable high areal density recording, that is, to form a recording head having a narrow track structure, fine processing of setting the magnetic pole width P2W of the upper magnetic pole to a size of 1.0 μm or less is required. You.

As a method of forming the upper magnetic pole, for example, as shown in Japanese Patent Application Laid-Open No. 7-262519,
A frame plating method is used. When the upper magnetic pole 114 is formed by frame plating, first, a thin electrode film made of, for example, permalloy is entirely formed on the apex portion by, for example, sputtering. Next, a photoresist is applied thereon and patterned by a photolithography process to form a frame (outer frame) for plating. Then, the upper magnetic pole 114 is formed by plating using the previously formed electrode film as a seed layer.

Incidentally, there is a height difference of, for example, 7 to 10 μm or more between the apex portion and other portions. On this apex portion, a photoresist is applied in a thickness of 3 to 4 μm. If the thickness of the photoresist on the apex portion is required to be at least 3 μm or more, the photoresist having fluidity is gathered on the lower side, so that the photoresist having a thickness of, for example, 8 to 10 μm or more below the apex portion. A resist film is formed.

As described above, in order to form a narrow track, it is necessary to form a frame pattern having a width of about 1.0 μm using a photoresist film. That is, 8 ~
With a photoresist film having a thickness of 10 μm or more,
A fine pattern having a width of 1.0 μm or less must be formed. However, it is extremely difficult in the manufacturing process to form such a thick photoresist pattern with a narrow pattern width.

Furthermore, at the time of photolithographic exposure,
Exposure light is reflected by a base electrode film as a seed layer,
The photoresist is also exposed to the reflected light, causing the photoresist pattern to be distorted and the like, making it impossible to obtain a sharp and accurate photoresist pattern. As a result, the upper magnetic pole cannot be formed in a desired shape, for example, the side wall of the upper magnetic pole has a rounded shape. In particular, as shown in FIG. 46, the magnetic pole width P2W is further reduced to W1 '
Then, it becomes more difficult to obtain the desired width W1 '. This is because, at the portion R of the pole tip portion 114b extending on the apex portion, the reflected light reflected by the base electrode film and returned is not only the vertically reflected light but also the apex portion. Reflected light from the oblique direction or the lateral direction from the slope of the portion is also included, and as a result of these reflected lights affecting the photosensitivity of the photoresist layer, the photoresist pattern width defining the magnetic pole width P2W becomes the expected width. This is because the value becomes larger than the value and the shape becomes the shape shown by the broken line in FIG. A portion R of the pole tip portion 114b which is located forward of the TH0 position.
Is a very important factor in defining the track width on the recording medium. For this reason, if the width of the portion R is larger than the above value W2, a target minute track width cannot be obtained.

[0021] Such a problem is described in the above-mentioned JP-A-8-24.
The same applies to the magnetic head described in Japanese Patent No. 9614. In the magnetic head described in this publication, T
Since the magnetic pole width gradually changes from the H0 position toward the yoke, the reflected light from the oblique direction or the lateral direction from the slope of the apex portion affects the photosensitivity of the photoresist layer. This is because the width of the portion cannot be accurately controlled.

As shown in FIG. 46, the yoke portion 114a of the pole tip portion 114b is shifted from the TH0 position.
The portion R up to the connecting portion with the portion F is a portion F in front of the TH0 position.
And the cross-sectional area is small, the magnetic flux from the yoke portion 114a is saturated in the portion R,
It is not possible to sufficiently reach the portion F defining the track width. For this reason, the overwrite characteristics, that is,
When data is already overwritten on a recording medium and data is further overwritten, the characteristics are low, for example, about 10 to 20 dB, and there is a problem that sufficient overwrite characteristics cannot be secured.

The present invention has been made in view of such a problem, and an object of the present invention is to enable accurate control of the magnetic pole width and obtain sufficient overwrite characteristics even when the magnetic pole width is reduced. And a method of manufacturing the same.

[0024]

According to the present invention, there is provided a thin-film magnetic head comprising: a recording gap layer; and a predetermined region of the recording gap layer on a side close to a recording medium, which is in contact with the surface of the recording gap layer. An insulating film pattern disposed thereon, and two magnetic poles having an air bearing surface facing the recording medium and facing each other via a recording gap layer, and are magnetically coupled to each other in a back gap region opposite to the air bearing surface. And a thin-film coil portion disposed between the first and second magnetic layers, and the first magnetic layer has a recording track width of a recording medium. A magnetic pole tip portion extending from the air bearing surface to a predetermined position on the insulating film pattern so as to be in contact with the recording gap layer and the insulating film pattern; A magnetic pole coupling portion disposed in the back gap region so as to be in contact with the conductive layer, and a yoke portion for magnetically coupling the magnetic pole tip portion and the magnetic pole coupling portion, and further, An insulating film covering the inner surface of the concave space surrounded by the recording gap layer and the insulating film pattern, the magnetic pole tip portion, and the magnetic pole connection portion, and the edge of the insulating film pattern on the recording medium side is an air bearing surface. And the surface of the tip of the magnetic pole opposite to the recording gap layer and the end surface of the insulating film are flattened so as to be flush with each other.

In the method of manufacturing a thin-film magnetic head according to the present invention, a step of forming a recording gap layer and a step of contacting a surface of the recording gap layer with a predetermined area of the recording gap layer near the recording medium. Forming a first and second magnetic layers including an air bearing surface facing the recording medium and two magnetic poles facing each other via a recording gap layer by using an air bearing surface. Forming the first magnetic layer so as to be magnetically coupled to each other at the opposite back gap region; and forming a thin film coil portion between the first and second magnetic layers. The forming step has a constant width portion that defines the recording track width of the recording medium, and is formed on the air bearing surface so as to be in contact with the recording gap layer and the insulating film pattern. Forming a magnetic pole tip portion over a predetermined position on the insulating film pattern, forming a magnetic pole connection portion in the back gap region so as to be in contact with the second magnetic layer, and forming the magnetic pole tip portion and the magnetic pole connection portion. Forming a yoke portion to be magnetically coupled, the method further comprising:
Forming an insulating film so as to cover the inner surface of the concave space surrounded by the recording gap layer and the insulating film pattern, the magnetic pole tip, and the magnetic pole coupling portion; and opposing the recording gap layer at the magnetic pole tip. Flattening such that the surface on the side thereof is at least flush with the end face of the insulating film. In the step of forming the insulating film pattern, the edge of the insulating film pattern on the recording medium side is a reference position with respect to the air bearing surface. The insulating film pattern is formed so as to define the following.

In the thin film magnetic head or the method of manufacturing the same according to the present invention, the reference position with respect to the air bearing surface is defined by the edge of the insulating film pattern on the recording medium side.

The thin-film magnetic head according to the present invention further includes an insulating layer disposed so as to embed the thin-film coil portion in the concave space covered with the insulating film. The magnetic pole connection portion may be planarized so as to be flush with the surface on the side opposite to the recording gap layer and the end surface of the insulating film.

The method of manufacturing a thin-film magnetic head according to the present invention further includes a step of forming an insulating layer in a concave space covered with the insulating film and burying the thin-film coil portion.
In the flattening step, the surface of the insulating layer is also flattened so as to be flush with the surface of the magnetic pole tip portion and the magnetic pole coupling portion on the side opposite to the recording gap layer and the end surface of the insulating film. Is also good.

[0029]

Embodiments of the present invention will be described below in detail with reference to the drawings.

First Embodiment First, referring to FIGS. 1 to 8, a method of manufacturing a composite thin film magnetic head as a method of manufacturing a thin film magnetic head according to a first embodiment of the present invention will be described. Will be described. The thin-film magnetic head according to the present embodiment is embodied by the method for manufacturing a thin-film magnetic head according to the present embodiment, and will be described together. 1 to 7, (a) shows a cross section perpendicular to the air bearing surface, and (b) shows a cross section of a magnetic pole portion parallel to the air bearing surface. FIG. 8 shows a plan configuration of the composite type thin film magnetic head.

In the manufacturing method according to the present embodiment, first,
As shown in FIG. 1, for example, Altic (Al_TwoO_Three
On a substrate 1 made of TiC, for example, alumina (Al)
_TwoO _Three) Having a thickness of about 3 to 5 μm.
Is deposited. Next, a photoresist film is formed on the insulating layer 2.
Permalloy (NiFe) as a mask by plating
Is selectively formed with a thickness of about 3 μm, and
The lower shield layer 3 is formed.

Next, on the lower shield layer 3, for example, alumina is sputter-deposited with a thickness of 100 to 200 nm to form a shield gap film 4. Next, an MR film 5 for forming an MR element for reproduction is formed on the shield gap film 4 to a thickness of several tens nm or less, and is formed into a desired shape by high-precision photolithography. Next, a lead layer (not shown) is formed on both sides of the MR film 5 as an extraction electrode layer electrically connected to the MR film 5. Then, a shield gap film 6 is formed, and the MR film 5 is embedded in the shield gap films 4 and 6.

Next, as shown in FIG. 2, an upper shield and lower magnetic pole (hereinafter, referred to as a lower magnetic pole) 7 made of, for example, permalloy is formed on the shield gap film 6 by about 3 to 4 times.
It is selectively formed with a thickness of μm. Here, the lower magnetic pole 7 is one of the “at least two magnetic layers” in the present invention.
Corresponding to one.

Next, an inorganic insulating film, for example, a silicon oxide film (SiO ₂ ) having a thickness of about 1 to ₂ μm is formed on the lower magnetic pole 7, and is tapered and selectively patterned. An insulating layer 8 for defining the apex angle and the throat height is formed. The insulating layer 8 is not limited to a silicon oxide film, but may be an alumina film,
Another inorganic insulating film such as a silicon nitride film (SiN) may be used. The above film is formed by sputtering or CVD (Ch
emical vapor deposition) method. Next, a recording gap layer 9 made of an insulating film, for example, an alumina film is formed on the lower magnetic pole 7 and the insulating layer 8.

Next, as shown in FIG. 3, copper (C) is formed on the recording gap layer 9 by, for example, electrolytic plating.
The first-layer thin-film coil 10 for an inductive recording head of u) is formed with a thickness of 2 to 3 μm.

Next, as shown in FIG. 4, a photoresist layer 11 is formed on the recording gap layer 9 and the coil 10.
A predetermined pattern is formed by high-precision photolithography. Next, heat treatment is performed at a temperature of, for example, 250 ° C. for flattening the coils 10 and insulating the coils 10 from each other.

Next, a second-layer thin-film coil 12 made of, for example, copper and having a thickness of 2 to 3 μm is formed on the photoresist layer 11 by, for example, electrolytic plating. Next, a photoresist layer 13 is formed in a predetermined pattern on the photoresist layer 11 and the coil 12 by high-precision photolithography. Heat treatment at a temperature of ° C.

Next, as shown in FIG.
At a position behind (right side in FIG. 5A) the recording gap layer 9 is partially etched to form an opening 9a in order to form a magnetic path. Next, before forming the upper magnetic pole, a NiFe-based alloy of a high saturation magnetic flux density material is formed to a thickness of about 70 nm by, for example, sputtering, and an electrode film (not shown) serving as a seed layer in the electrolytic plating method To form Next, a photoresist is applied on the above-mentioned electrode film, patterned by photolithography, and a photoresist pattern (not shown) serving as a frame (outer frame) for forming an upper magnetic pole by a frame plating method is formed. Form. Next, using this photoresist pattern as a mask, and using the previously formed electrode film as a seed layer, an upper yoke / upper magnetic pole (hereinafter referred to as an upper magnetic pole) 17 of about 3 to 5 μm is formed by electrolytic plating.
Then, the photoresist pattern is removed. The upper magnetic pole 17 has, for example, a planar shape as shown in FIG. 9 and is magnetically connected to the lower magnetic pole 7 at the opening 9a. The upper magnetic pole 17 is made of, for example, permalloy (NiF
e) or iron nitride (FeN). The shape of the upper magnetic pole 17 will be described later. Here, the upper magnetic pole 17
Corresponds to “at least one magnetic layer of the two magnetic layers” in the present invention.

Next, as shown in FIG.
Is used as a mask, the recording gap layer 9 and the lower magnetic pole 7 are etched by about 0.5 μm by, for example, ion milling to form a trim structure.

Next, as shown in FIG. 7, an overcoat layer 1 made of, for example, alumina is formed so as to cover the entire surface.
8 is formed. Finally, machine the slider,
The air bearing surfaces (track surfaces) of the recording head and the reproducing head are formed to complete the thin-film magnetic head.

FIG. 8 is a plan view of a thin-film magnetic head manufactured by the manufacturing method according to the present embodiment. In addition,
In this figure, the overcoat layer 18 is omitted. As shown in this figure, the throat height TH depends on the insulating layer 8.
From the magnetic pole portion side edge (TH0 position) to the air bearing surface 20. FIGS. 1 to 7 correspond to the cross sections taken along the line AA 'in FIG.

FIG. 9 shows a planar structure of the upper magnetic pole 17. As shown in this figure, the upper magnetic pole 17 has a width W3 and occupies most of the upper magnetic pole 17.
a, an intermediate portion 17b having a substantially constant width W1, and W1
And a tip portion 17c having a substantially constant width W2. The centers of the yoke portion 17a, the intermediate portion 17b, and the tip portion 17c in the width direction coincide with each other. In a connection portion between the yoke portion 17a and the intermediate portion 17b, an outer edge of the yoke portion 17a forms an angle α with a plane parallel to the air bearing surface 20, and in the connection portion,
The side edge surface of the intermediate portion 17b forms an angle β with a plane parallel to the air bearing surface 20. The width of the intermediate portion 17b is substantially constant regardless of the position, and the width of the tip portion 17c is also substantially constant regardless of the position. In the present embodiment, α is, for example, about 45 degrees, and β is substantially 90 degrees.

The middle part 17b and the tip part 17 of the upper magnetic pole 17
The connection portion with c is located at the TH0 position or at a predetermined position within a range of ± 0.5 μm with respect to the TH0 position. The width of the intermediate portion 17b in the connection portion is W
On the other hand, the width of the distal end portion 17c in the connecting portion is W2 smaller than W1. In other words, the TH0 position or plus / minus 0.5 μm with respect to the TH0 position
At a predetermined position within the range, a step in the width direction exists between the intermediate portion 17b and the tip portion 17c. An end surface (hereinafter, referred to as a step surface) 21 of the step portion on the side of the intermediate portion 17b forms an angle γ with a side edge surface of the intermediate portion 17b,
The direction of the side edge surface of the tip 17c (that is, the tip 17c
Extending direction) and the angle δ. In the present embodiment, angles γ and δ are both substantially 90 degrees. That is, the step surface 21 between the distal end portion 17c and the intermediate portion 17b forms a plane, and is substantially orthogonal to the side edge surface of the distal end portion 17c. Here, “substantially perpendicular” means that the angle δ between the main portion of the side edge surface of the distal end portion 17c and the main portion of the step surface 21 is substantially 90 degrees, and the angle of the distal end portion 17c is approximately 90 degrees. This is intended to include not only a case where a corner portion where the side edge surface and the step surface 21 intersect has a sharp edge but also a case where it is rounded. The angle δ is preferably in the range of, for example, 75 to 120 degrees. The rounded shape of the corner may occur even if a portion corresponding to the corner in a mask for forming a photoresist pattern has a sharp edge. Further, even if the angle of the portion corresponding to the corner in the mask for forming the photoresist pattern is set to exactly 90 degrees, if the exposure amount in the photolithography step is increased, the upper magnetic pole 17 formed by this is increased. May spread up to 110 to 120 degrees. Here, the tip portion 17c of the upper magnetic pole 17 corresponds to the "first magnetic layer portion" in the present invention, the intermediate portion 17b corresponds to the "second magnetic layer portion" in the present invention, and the yoke portion 17a corresponds to the book. This corresponds to the “third magnetic layer portion” in the invention. Also, a part of the insulating layer 8 and the recording gap layer 9 (TH0
Part behind the position) and the photoresist layer 11,
A set of 13 corresponds to the “insulating layer” in the present invention.

As can be seen from FIG. 7, the tip portion 17c extends above the flat recording gap layer 9, and the intermediate portion 17b and the yoke portion 17a rise in a hill shape composed of the photoresist layers 11, 13 and the like. Extending over the apex portion. The width W2 of the tip portion 17c corresponds to the magnetic pole width P2W and defines the track width on the recording medium.

The dimensions of each part shown in FIG.
For example, the following values are preferable. Length L1 of yoke part 17a = 10 to 40 μm Length L2 of middle part 17b = 3.0 to 5.0 μm Length L3 of tip part 17c (= throat height TH) =
0.5 to 1.0 μm Width W1 of middle part 17b = 2.0 to 4.0 μm Width W2 of tip part 17c = 0.6 to 1.2 μm Width W3 of yoke part 17a = 20 to 40 μm

The thin-film magnetic head having the upper magnetic pole 17 having such a shape exhibits high performance in overwrite characteristics. That is, the upper magnetic pole 17 is
As shown in the figure, the width of the intermediate portion 17b connected to the front end portion 17c at the TH0 position has a width W1 that is considerably larger than the width W2 of the front end portion 17c that defines the track width on the recording medium. The volume of the portion 17b is larger than that of the portion R in the conventional case (FIG. 45). For this reason, the magnetic flux generated in the yoke portion 17a by the thin film coils 10 and 12 does not saturate in the intermediate portion 17b, but the tip portion 17c
To reach enough. Therefore, even if the tip portion 17c corresponds to a narrow track width of, for example, submicron, a sufficient size can be obtained as a magnetic flux for overwriting. That is, it is possible to secure a sufficient overwrite characteristic while realizing a narrow track.

FIG. 12 shows a comparison between the overwrite characteristics of the conventional thin film magnetic head and the overwrite characteristics of the thin film magnetic head of the present embodiment. 35A shows an upper magnetic pole 114 having a shape as shown in FIG.
FIG. 9B shows the overwrite characteristics of the conventional thin film magnetic head having the upper magnetic pole 17 having the shape shown in FIG.
4 shows the overwrite characteristics of the thin-film magnetic head according to the present embodiment having the following. As shown in this figure, the value of the conventional thin film magnetic head was 26.0 dB, whereas the value of the thin film magnetic head of the present embodiment was 35.5 dB.
Is obtained, and the overwrite characteristics are improved.

Further, the thin-film magnetic head having the upper magnetic pole 17 having the above-described shape can be used in a manufacturing process.
It has the following advantages. That is, as shown in FIG. 10, in the upper magnetic pole 17 in the thin-film magnetic head of the present embodiment, the step surface 21 between the front end portion 17c and the intermediate portion 17b substantially at the TH0 position is in contact with the side edge surface of the front end portion 17c. The angle δ is approximately 90 degrees. For this reason, obliquely and laterally reflected light from the apex portion, which is generated when the photoresist is selectively exposed and patterned using a mask in the photolithography process, is positive with respect to the TH0 position or the TH0 position. / Minus 0.5μm
Step surface 21 and tip portion 17 at a predetermined position within the range
Most of the corners formed by the side edge surface of c at approximately 90 degrees are blocked, and it is difficult to reach the photoresist region for forming the tip portion 17c. For this reason, the tip 17
An increase in the pattern width of the photoresist region for forming c can be suppressed. Specifically, FIG.
As shown in the figure, the length d1 of the portion (broken line in the figure) of the length of the tip portion 17c in the longitudinal direction that is wider than the intended target width W2 at the tip portion 17c can be extremely small. is there.

On the other hand, for example, as shown in FIG. 11, when the angle δ formed by the step surface 21 at the TH0 position with the side edge surface of the tip portion 17c is much larger than 90 degrees (for example, 130 degrees or more). In this case, the effect of blocking the reflected light at the corners described above is reduced, and the length d2 of the portion (broken line in the drawing) of the tip portion 17c that is wider than the intended target width W2 is further increased.

As described above, according to the thin-film magnetic head of the present embodiment, it is possible to prevent the pattern width of the photoresist region for forming the tip portion 17c of the upper magnetic pole 17 from being widened. The width of the tip portion 17c that defines the write track width can be set to substantially the target value W2, and the write track width can be reduced.

As described above, according to the thin-film magnetic head of this embodiment, the tip portion 17c of the upper magnetic pole 17 is located at the TH0 position or at a predetermined position within a range of ± 0.5 μm with respect to the TH0 position. A step in the width direction which changes substantially at a right angle is provided between the intermediate portion 17b and the width of the intermediate portion 17b.
7c, the width of the photoresist pattern for forming the tip portion 17c can be prevented from spreading and the writing track width can be reduced, and the magnetic flux generated in the yoke portion 17a can be reduced. Saturation before reaching the tip portion 17c can be prevented, and sufficient overwrite characteristics can be ensured.

In this embodiment, since the insulating layer 8 for defining the throat height TH is formed of an inorganic insulating film, the heat treatment at a temperature of about 250 ° C. when forming the coils 10 and 12 is performed. There is no occurrence of position fluctuation (pattern shift) at the edge of the insulating layer 8 and deterioration of the profile. Therefore, the throat height can be accurately controlled. Further, accurate control of the MR height and accurate control of the apex angle θ are also possible.

In this embodiment, the insulating layer 8 for defining the throat height is formed of an inorganic insulating film.
When the recording gap layer 9 and the lower magnetic pole 7 are etched to form a trim structure, there is no variation in the position of the insulating layer 8, which also allows accurate control of the throat height.

According to the present embodiment, the thick insulating layer 8 is formed between the lower magnetic pole (upper shield) 7 and the thin-film coils 10 and 12 in addition to the thin recording gap layer 9. A large dielectric strength can be obtained between the lower magnetic pole (upper shield) 7 and the thin-film coils 10 and 12, and the leakage of the magnetic flux from the thin-film coils 10 and 12 can be reduced.

In this embodiment, the upper magnetic pole 1
For example, NiFe or iron nitride (FeN) is used as 7, but in addition, a high saturation magnetic flux density material such as amorphous Fe—Co—Zr may be used,
These materials may be used in combination of two or more. Also, as the lower magnetic pole 7, a magnetic material in which NiFe and the above-mentioned high saturation magnetic flux density material are laminated may be used.

The upper magnetic pole 17 is not limited to the shape shown in FIG. 9, but may be shaped as shown in FIGS. 13 to 15, for example.

FIG. 13 shows the intermediate portion 17 at the TH0 position.
13B is a plan view of the upper magnetic pole 17 when both outer corners of the step surface 21 in FIG. The structure of the part other than the chamfered part is the same as in the case of FIG. In this case, the width of the step surface 21 after chamfering is set to W1.

FIG. 14 shows the step surface 21 at the TH0 position.
Is a plan view of the upper magnetic pole 17 when an angle δ formed between the upper magnetic pole 17 and the side edge surface of the tip portion 17c is larger than 90 degrees. Angle δ is
For example, 90 to 150 degrees, more preferably 90 to 1 degrees.
The range is 20 degrees.

FIG. 15 is a plan view of the upper magnetic pole 17 when the angle γ between the side edge surface of the intermediate portion 17b and the plane parallel to the air bearing surface 20 is smaller than 90 degrees. Angle γ
Is preferably in the range of, for example, 70 to 80 degrees.

It should be noted that in FIGS.
The connection position between 7c and the intermediate portion 17b does not have to exactly coincide with the TH0 position, and may be shifted from the TH0 position within a range of, for example, about ± 0.5 μm.

In the thin-film magnetic head having the upper magnetic pole 17 shown in FIGS. 13 to 15, the same effects as those of the thin-film magnetic head having the upper magnetic pole 17 shown in FIG. 9 can be obtained. .

[Second Embodiment] Next, a second embodiment of the present invention will be described.
An embodiment will be described.

First, a method of manufacturing a composite thin film magnetic head as a method of manufacturing a thin film magnetic head according to a second embodiment of the present invention will be described with reference to FIGS. The thin-film magnetic head according to the present embodiment
Since the present invention is embodied by the method of manufacturing a thin-film magnetic head according to the present embodiment, it will be described together. 16 to 19, (a) shows a cross section perpendicular to the air bearing surface, and (b) shows a cross section of the magnetic pole portion parallel to the air bearing surface. In these drawings, the same parts as those in the above embodiments are denoted by the same reference numerals.

In the method of manufacturing a thin-film magnetic head according to the present embodiment, the steps up to the point where the lower magnetic pole 7 shown in FIG. 16 is formed are the same as those shown in FIG.
Since the steps up to the middle of the process are the same, the description is omitted.

In this embodiment, when the formation of the lower magnetic pole 7 is completed as shown in FIG. 16, then, as shown in FIG. 17, the recording gap layer 9 is formed, and the throat height is formed thereon. An insulating film pattern 25 for defining TH is formed. Next, at a position behind (in the right side in FIG. 17A) the region where the thin film coil 29 is to be formed in a later step, the recording gap layer 9 is partially etched to form a magnetic path, and the opening 9b is formed. (Back gap region) is formed. Next, an upper pole tip 27a which forms a part of the upper magnetic pole is selectively formed in a region from the insulating film pattern 25 to a side facing the track (air bearing surface) by, for example, electrolytic plating. I do. At this time, at the same time, the magnetic path forming pattern 27 is also formed in the opening 9b.
b is formed. As the upper pole tip 27a and the magnetic path forming pattern 27b, for example, a permalloy (NiFe) -based alloy or iron nitride (Fe
An N) -based alloy or the like is used. Here, the lower magnetic pole 7 corresponds to one of the “at least two magnetic layers” or the “second magnetic layer” in the present invention, and the magnetic path forming pattern 2
7b corresponds to the "fourth magnetic layer portion" or the "magnetic path connecting portion" in the present invention.

The upper pole tip 27a and the magnetic path forming pattern 27b are formed, for example, as follows.
That is, first, a NiFe-based alloy, which is a high saturation magnetic flux density material, is formed to a thickness of about 70 nm by, for example, sputtering, and an electrode film (not shown) serving as a seed layer in the electrolytic plating method is formed. Next, on the above electrode film,
A photoresist is applied, patterned by photolithography, and a photoresist pattern (not shown) is formed by frame plating. Next, using the photoresist pattern as a mask and the electrode film formed earlier as a seed layer, the upper pole tip 27a and the magnetic path forming pattern 27b are formed by electroplating to about 3 to
After forming a thickness of 5 μm, the photoresist pattern is removed. The upper pole tip 27a has a shape as shown in FIGS. 20 and 21, for example. The shape of the upper pole tip 27a will be described later.

Next, using the upper pole tip 27a as a mask, the recording gap layer 9 and the lower magnetic pole 7 are etched by about 0.3 to 0.5 μm by, for example, ion milling to obtain an effective track width at the time of writing. A trim structure for suppressing spread is formed.

Next, after an insulating film 28 such as an alumina film is formed to a thickness of about 0.5 to 1.5 μm on the whole, an inductive type made of copper (Cu) is formed by, for example, electrolytic plating. The thin film coil 29 for the recording head is 2-3 μm.
m. Next, an insulating film 30 such as an alumina film is formed on the entire surface to a thickness of about 3 to 4 μm, and the entire surface is polished and flattened by, for example, a CMP (chemical mechanical polishing) method. The surface of the path forming pattern 27b is exposed.

Next, as shown in FIG. 18, the upper yoke and upper magnetic pole (hereinafter referred to as upper magnetic pole) 27c is formed by electrolytic plating in the same process as that for the upper pole tip 27a and the magnetic path forming pattern 27b. About 3-5 μm
Formed to a thickness of The upper magnetic pole 27c is, for example, as shown in FIG.
The opening 9b is in contact with the lower magnetic pole 7 and is magnetically connected to the upper pole tip 27a in the opening 9b. As the upper magnetic pole 17, for example, permalloy (NiFe) or iron nitride (FeN), which is a highly saturated magnetic material, is used. Here, the upper magnetic pole 27c corresponds to the "third magnetic layer portion" or the "yoke portion" in the present invention.

Next, an overcoat layer 38 made of, for example, alumina is formed so as to cover the whole. Finally, the slider is machined to form air bearing surfaces (track surfaces) of the recording head and the reproducing head, thereby completing the thin-film magnetic head.

Although only one layer of the thin-film coil 29 is formed here, as shown in FIG. 19, the second-layer thin-film coil 35 is formed on the insulating layer 30 covering the thin-film coil 29. After being formed and covered with the photoresist layer 36, the upper magnetic pole 37 may be selectively formed thereon.

FIG. 20 shows a plan structure of the upper magnetic pole 27c and the upper pole tip 27a, and FIG. 21 shows a plan structure of the upper pole tip 27a. As shown in FIG. 20, the upper magnetic pole 27c has a width W3 and occupies most of the upper magnetic pole 27c, and a connecting portion partially connected to and connected to the upper pole tip 27a. 27c (2). Yoke 27c (1)
Of the upper magnetic pole 17 in the first embodiment.
This is the same as the yoke part 17a. The width of the connecting portion 27c (2) is wider than the width of the intermediate portion 17b of the upper magnetic pole 17 in the first embodiment. The centers of the yoke portion 17a and the connection portion 27c (2) in the width direction coincide with each other.

As shown in FIG. 21, the upper pole tip 27a is connected to the tip 27a (1) for defining the write track width on the recording medium and the connection 27c (2) of the upper magnetic pole 27c. And an intermediate portion 27a (2). Middle part 2
7a (2) is the upper magnetic pole 1 in the first embodiment.
7 has the same width W1 as the intermediate portion 17b, and the length is L4. The distal end portion 27a (1) has the same width W2 as the distal end portion 17c in the first embodiment. Tip 27a
The connecting portion between (1) and the intermediate portion 27a (2) substantially coincides with the TH0 position, and at the same time, the connecting portion 27c (2) of the upper magnetic pole 27c.
At the front side (air bearing surface side). At this connecting portion (ie, approximately at the TH0 position), the width of the intermediate portion 27a (2) is W1,
The width of 7a (1) is W2 smaller than W1. That is, at the TH0 position or at a predetermined position within a range of ± 0.5 μm with respect to the TH0 position, there is a step in the width direction between the intermediate portion 27a (2) and the tip portion 27a (1). ing. Intermediate portion 27a (2) in this step portion
Side step surface 21 is at an angle γ1 with the side surface of intermediate portion 27a (2).
And forms an angle δ with the side edge surface of the tip portion 27a (1). In the present embodiment, angles γ1 and δ are both 90 degrees. That is, the intermediate portion 27a (2) and the tip portion 27
a (1) are both rectangular, and the step surface 21 is the tip 2
7a (1) is substantially perpendicular to the side edge surface. Here, the tip 27a (1) is the "first magnetic layer portion" in the present invention.
, The middle portion 27a (2) corresponds to the “second magnetic layer portion” in the present invention, the upper pole tip 27a corresponds to the “magnetic pole tip portion” in the present invention, and the upper pole tip 27a Forming pattern 27b and upper magnetic pole 27
The aggregate of c corresponds to the “one magnetic layer of the two magnetic layers” or the “first magnetic layer” in the present invention. Further, a part of the recording gap layer 9 (a part behind the TH0 position) corresponds to the “first insulating layer” in the present invention, and the insulating film pattern 25 corresponds to the “second insulating layer” in the present invention. The insulating film 28 is the “third insulating layer” in the present invention.
, The insulating layer 30 corresponds to the “fourth insulating layer” in the present invention, and an aggregate of these corresponds to the “insulating layer” in the present invention.

As is clear from FIGS. 18 and 20,
The tip portion 27a (1) extends over the flat recording gap layer 9, and the intermediate portion 27a (2) is located over the insulating pattern 25.

It is to be noted that, for example, the following values are preferable as the dimensions of each part shown in FIG. Width W1 of middle portion 27a (2) = 2.0-5.0 μm Length L4 of middle portion 27a (2) = 1.0-5.0 μm Width W2 of tip portion 27a (1) = 0.4-1 .2 μm Width W3 of yoke portion 17a = 30 to 40 μm Length of connection portion 27c (2) = 3.0 to 5.0 μm

The thin-film magnetic head having the upper magnetic pole 17 having such a shape exhibits high performance in overwrite characteristics for the same reason as in the first embodiment. Further, the thin-film magnetic head having the upper magnetic pole 27c and the upper pole tip 27a having such a shape is as follows.
The same advantages as in the case of the first embodiment can be obtained in the manufacturing process.

That is, according to the thin-film magnetic head of this embodiment, the tip portion 27a (1) of the upper pole tip 27a
The width of the write track can be reduced by preventing the pattern width of the photoresist for forming the pattern from being widened, and the magnetic flux generated in the yoke portion 27c (1) causes the tip portion 27a (1) of the upper pole tip 27a. ) Can be prevented from saturating before reaching, and sufficient overwrite characteristics can be secured.

In this embodiment, the upper magnetic pole 27c
Can be formed on a flat portion after CMP polishing, so that a photoresist pattern can be formed with high accuracy by photolithography.

In this embodiment, since the thick insulating film 28 made of alumina or the like is formed between the recording gap layer 9 and the thin-film coil 10, the gap between the thin-film coil 10 and the lower magnetic pole 7 is formed. The dielectric strength can be increased, and the leakage of magnetic flux from the thin-film coil 10 can be reduced.

The upper magnetic pole 27c and the upper pole tip 27a are not limited to the shapes shown in FIGS. 20 and 21, but may be shaped as shown in FIGS. 22 to 24, for example.

FIG. 22 shows the step surface 21 of the intermediate portion 27a (2).
Pole tip 27 when chamfering both outside corners
It is a top view of a. The structure other than the chamfer is shown in FIG.
Is the same as The chamfer angle η is preferably, for example, 30 to 60 degrees with respect to the step surface 21.

FIG. 23 shows a connection 27c of the upper magnetic pole 27c.
(2) and middle part 27a of upper pole tip 27a (2)
FIG. 24 shows a planar configuration of the upper pole tip 27a in a case where the upper pole tip has a taper. In these figures, the taper angle γ of the connection portion 27c (2) of the upper magnetic pole 27c is, for example, in the range of 45 to 60 degrees with respect to the edge surface 22 of the connection portion 27c (2), The taper angle γ1 of the portion 27a (2) is preferably in the range of, for example, 60 to 80 degrees with respect to the step surface 21.

In the thin-film magnetic head having the upper magnetic pole 27c and the upper pole tip 27a shown in FIGS. 22 to 24, the upper magnetic pole 27 shown in FIG.
The same effect as in the case of the thin-film magnetic head having c and the upper pole tip 27a can be obtained.

The connecting portion 27c (2) of the upper magnetic pole 27c
Of the front edge surface 22 (air bearing surface side) of the upper pole tip 27 coincides with the TH0 position.
a does not have to exactly match the position of the step surface 21 of the connecting portion 2a, for example, as shown in FIG.
The position of the edge surface 22 of 7c (2) may be shifted backward (the side opposite to the air bearing surface) from the position of the step surface 21.

The connection 27c (2) of the upper magnetic pole 27c in the second embodiment (FIG. 20) is not indispensable. For example, as shown in FIG.
7c is composed of only the yoke portion 27c (1), and the yoke portion 27c is placed on the intermediate portion 27a (2) of the upper pole tip 27a.
Part of (1) may be overlapped.
Also in this case, the position of the front edge surface 22 of the yoke portion 27c (1) is equal to the TH0 position.
It is not necessary to exactly match the position of the step surface 21 of the upper pole tip 27a with the position of the front edge surface 22 of the yoke portion 27c (1) as shown in FIG. The position may be shifted backward (the side opposite to the air bearing surface) from the position of the surface 21.

[Third Embodiment] Next, a third embodiment of the present invention will be described.
An embodiment will be described.

FIG. 28 shows a plan configuration of the upper magnetic pole 27c and the upper pole tip 27a of the thin-film magnetic head according to the third embodiment of the present invention, and FIG. 29 is an enlarged view of a main part in FIG. is there. In these figures, the same components as those shown in FIG. 20 in the second embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

As shown in FIGS. 28 and 29, in the present embodiment, the connection portion 27c (2) of the upper magnetic pole 27c is
The front end (air bearing surface side) of the edge surface 22 extends beyond the position of the step surface 21 of the upper pole tip 27a so as to overlap with a part of the front end portion 27a (1). ing. The edge surface 22 of the connection portion 27c (2) in this overlapped portion is
The extension direction of (1), that is, the side edge surface 2 of the tip 27a (1).
3 is orthogonal to the direction. Further, in the present embodiment, T
The position corresponding to the position H0 is not the position of the step surface 21 of the upper pole tip 27a, but the position of the edge surface 22 of the connecting portion 27c (2). Other configurations and manufacturing methods are the same as those in the second embodiment. For example, the cross-sectional structure along a plane passing through the distal end portion 27a (1) and perpendicular to the air bearing surface 21 is shown in FIG. This is the same as that shown in FIG.

As described with reference to FIG. 18, the photolithography process for forming the upper pole tip 27a and the photolithography process for forming the upper magnetic pole 27c are performed completely separately. For this reason, even if the corners of the photoresist are rounded due to poor exposure conditions in the photolithography process for forming the upper pole tip 27a, for example, as shown in FIG. Even if the intersection portion 24 of the tip portion 27a (1) with the side edge surface 23 does not become a sharp right angle but is rounded, the tip portion 27a (1) may be rounded.
a (1) connection portion 27c between side edge surface 23 and upper magnetic pole 27c
(2) always means a sharp right angle. That is, the leading end 27a that defines the track width of the recording medium
The width of (1) can be set to exactly W1 over the entire area from the position of TH0 to the air bearing surface 20 (the entire area of the throat height TH). Therefore, even when the width W1 of the tip portion 27a (1) is reduced to 1 μm or less and further to 0.5 μm or less with the reduction of the track width, the width W1 of the tip portion 27a (1) near the TH0 position is reduced. Does not spread. In particular, even when the throat height TH is reduced from about 1 μm to 0.5 to 0.2 μm in order to obtain a higher performance thin-film magnetic head, an accurate design value width W1 can be obtained over the entire throat height TH. It is possible to guarantee. As a result, the width of the recording track on the recording medium can be accurately controlled, and the occurrence of a side write phenomenon in which data to be written on one track is also written on an adjacent track can be effectively prevented. it can.

In the present embodiment, the tip 27a
Right behind the TH0 position in (1), a connecting portion 2 extending at a right angle
7c (2) and the intermediate portion 27a (2) immediately behind the step surface 21, so that a sufficient magnetic volume is secured by these. For this reason, the magnetic flux generated in the yoke portion 27c (1)
It is possible to effectively prevent saturation before reaching the tip portion 27a (1), and to secure sufficient overwrite characteristics.

Note that, as in this embodiment, the upper magnetic pole 2
When the edge surface 22 of the connecting portion 27c (2) of FIG. 7c is located beyond the step surface 21 of the upper pole tip 27a, the shapes of the upper pole tip 27a and the upper magnetic pole 27c are as shown in FIG. It is not limited to what is shown. For example, as shown in FIG.
The connecting portion 27c (2) and the intermediate portion 27a (2) of the upper pole tip 27a may have a tapered shape. The taper angle of the connection portion 27c (2) of the upper magnetic pole 27c and the intermediate portion 27a of the upper pole tip 27a
The taper angle in (2) is preferably the same as in the case of FIG. 23 described above.

Further, as shown in FIG.
The upper magnetic pole 27c is composed of only the yoke portion 27c (1) except for the connection portion 27c (2) from the 7c, and the edge surface 22 of the yoke portion 27c (1) extends beyond the step surface 21 of the upper pole tip 27a. So that the yoke part 2 is located on the part 27a (1).
7c (1) may be overlapped.

For example, as shown in FIG. 32, the step surface 21 of the upper pole tip 27a may form an angle of 90 degrees or more with the side edge surface 23 of the tip 27a (1). However, it is preferable that the step surface 21 forms 90 degrees with the side edge surface 23.

In the second and third embodiments, the upper magnetic pole portion of the thin-film magnetic head is divided into two parts, the upper magnetic pole 27c and the upper pole tip 27a, and the entire thin-film magnetic head is formed. The case of having the cross-sectional structure as shown in FIG. 19 has been described, but the present invention is not limited to this, and the following fourth and fifth embodiments will be described.
It may have a structure as shown in the embodiment.

[Fourth Embodiment] Next, FIGS.
With reference to FIG. 5, a method of manufacturing a composite thin film magnetic head as a method of manufacturing a thin film magnetic head according to a fourth embodiment of the present invention will be described. The thin-film magnetic head according to the present embodiment is embodied by the method for manufacturing a thin-film magnetic head according to the present embodiment, and will be described together. 33A to 35A show a cross section perpendicular to the air bearing surface, and FIG. 33B shows a cross section of the magnetic pole portion parallel to the air bearing surface. In these drawings, the same parts as those in the above embodiments are denoted by the same reference numerals.

In the method of manufacturing the thin-film magnetic head according to the present embodiment, the steps up to the step of forming the lower magnetic pole 7 in FIG. 33 are the same as those in FIG.
3 to the middle of FIG. 3, and a description thereof will be omitted.

In this embodiment, when the formation of the lower magnetic pole 7 is completed as shown in FIG. 33, the lower pole tip 41a and the lower connecting portion 41b are then placed on the lower magnetic pole 7 by about 2.0 to 2 mm. It is formed with a thickness of 0.5 μm. Here, the lower pole tip 41a is formed so that its tip on the air bearing surface side is near the MR (GMR) height zero position, and at the same time, the opposite side of the air bearing surface is the throat height zero position. To do. The lower pole tip 41a and the lower connecting portion 41b may be formed of a plating film of NiFe or the like, and may be formed of FeN, FeZrN.
It may be formed by a sputtered film of P, CoFeN or the like. Here, an aggregate of the lower magnetic pole 7, the lower pole tip 41a, and the lower connecting portion 41b corresponds to one of "at least two magnetic layers" in the present invention.

Subsequently, an insulating film 42 having a thickness of 0.3 to 0.6 μm made of an insulating material such as alumina is formed on the entire surface by, for example, a sputtering method or a CVD method.

Next, a first layer for an inductive recording head made of, for example, copper (Cu) is formed in a concave region formed between the lower pole tip 41a and the lower connecting portion 41b by, for example, electrolytic plating. 1.5-2.5μ thin film coil 43
m. At this time, simultaneously, the lower connecting portion 41
A coil connection portion 43C for connecting the thin-film coil 43 to a second-layer thin-film coil described later is formed in the rear region (the right region in the drawing) of b.

Next, after an insulating layer 44 made of an insulating material, for example, alumina and having a thickness of 3.0 to 4.0 μm is formed on the entire surface by sputtering, the surface is flattened by, for example, CMP, and the lower pole tip 41a is formed. And lower connection 4
The surface of 1b is exposed.

Next, as shown in FIG. 34, a film thickness of, for example, 0.2 to
A recording gap layer 9 of 0.3 μm is formed. The recording gap layer 9 is made of aluminum nitride (Al) in addition to alumina.
N), a silicon oxide-based material, a silicon nitride-based material, or the like. Subsequently, the recording gap layer 9 is patterned by photolithography to form an opening 9a for connection between the upper magnetic pole and the lower magnetic pole, and the recording gap layer 9 and the insulating layer 44 are patterned to form a coil connecting portion 43C. The opening 9b which reaches is formed.

Subsequently, an upper pole tip 45a and an upper connecting portion 45b for magnetically connecting the upper magnetic pole and the lower magnetic pole are formed on the recording gap layer 9. At this time, the upper connection portion 45b is formed so as to overlap with and contact the lower connection portion 41b. On the other hand, the upper pole tip 45a is formed to extend rearward from the air bearing surface longer than the lower pole tip 41a. The upper pole tip 45a is connected to the third pole tip.
As in the case of the embodiment (FIG. 28, etc.), an intermediate portion 27a (2) for securing a magnetic volume, a tip portion 27a (1) for defining a track width, and It is formed to have a step surface 21. The planar shape of the upper pole tip 45a is shown in FIGS.
Alternatively, the shape is as shown in FIG. Further, in the upper pole tip 45a, the step surface 21 is positioned at the rear edge surface of the lower pole tip 41a (that is, TH0).
Position) is located slightly behind.

Subsequently, using the upper pole tip 45a as a mask, the surrounding recording gap layer 9 and lower pole tip 41a are etched in a self-aligned manner. That is, RIE using a chlorine-based gas (Cl ₂ , CF ₄ , BCl ₂ , SF _6, etc.) using the upper pole tip 45 a as a mask.
After selectively removing the recording gap layer 9, the exposed lower pole tip 41a is again etched by about 0.3 to 0.6 μm by, for example, Ar ion milling to form a trim structure.

Subsequently, an insulating layer 46 made of, for example, alumina having a thickness of about 0.3 to 0.6 μm is formed on the entire surface by, for example, a sputtering method or a CVD method. Subsequently, a second-layer thin film for an inductive recording head made of, for example, copper (Cu) is formed on the insulating film 46 in the recess formed by the upper pole tip 45a and the upper connecting portion 45b by, for example, electrolytic plating. The coil 47 is formed with a thickness of 1.5 to 2.5 μm. At this time, at the same time, a coil connecting portion 47C that contacts the coil connecting portion 43C via the opening 9b is formed.

Subsequently, an insulating layer 48 made of, for example, alumina having a thickness of about 3 to 4 μm is formed on the entire surface by, for example, a sputtering method or a CVD method. The insulating layer 48 and the insulating film 46 are not limited to alumina, but may be silicon dioxide (SiO 2).
₂ ) or other insulating materials such as silicon nitride (SiN).

Subsequently, the insulating layer 48 and the insulating film 46 are polished by, eg, CMP so that the surfaces of the upper pole tip 45a and the upper connecting portion 45b are exposed, and the surfaces of the insulating layer 48 and the insulating film 46 are polished. And the respective surfaces of the upper pole tip 45a and the upper connecting portion 45b are flattened so as to form the same surface.

Next, as shown in FIG. 35, using the same material as the upper pole tip 45a, for example, the upper magnetic pole 49 is selected to a thickness of about 3 to 4 μm by a method such as an electrolytic plating method or a sputtering method. It is formed. At this time, a part of the upper magnetic pole 49 overlaps with a part of the upper pole tip 45a, and the position of the front edge side (air bearing surface side) of the upper magnetic pole 49 is set to the lower pole tip 41.
The position coincides with the position of the rear edge of “a” (that is, the TH0 position). Also, the rear end of the upper magnetic pole 49 is made to reach the upper connecting portion 45b.
Thereby, the upper magnetic pole 49 is connected to the upper pole tip 45a.
And is magnetically connected to the lower magnetic pole 7 via the upper connecting portion 45b and the lower connecting portion 41b. Here, the upper pole tip 45a, the upper connecting portion 4
An assembly of the upper magnetic pole 5b and the upper magnetic pole 49 corresponds to “at least one magnetic layer” in the present invention, and a part of the recording gap layer 9 (a part behind the TH0 position) and the insulating film 4
The aggregate of the insulating layers 2 and 46 and the insulating layers 43 and 48 corresponds to the “insulating layer” in the present invention.

Finally, an overcoat layer 50 made of alumina and having a thickness of about 30 μm is formed by, for example, a sputtering method so as to cover the entire surface. Thereafter, the slider is machined to form an air bearing surface (ABS) of the recording head and the reproducing head, thereby completing the thin-film magnetic head.

In the present embodiment, the upper magnetic pole 49 is
The position of the front edge surface 22 is formed so as to coincide with the TH0 position and to be ahead of the position of the step surface 21 of the upper pole tip 45a. Therefore, as in the case of FIG. 29 in the third embodiment, if the intersection 24 between the step surface 21 of the upper pole tip 45a and the side edge surface 23 of the tip 27a (1) is a sharp right angle, Even if it is rounded, the side edge surface 23 of the tip portion 27a (1)
And the edge surface 22 of the connecting portion 27c (2) of the upper magnetic pole 49,
A sharp right angle is always formed, and the width W1 of the tip 27a (1) does not increase near the TH0 position. Therefore, as in the case of the third embodiment, it is possible to guarantee an accurate design value width W1 over the entire throat height TH, so that the recording track width on the recording medium can be accurately controlled. Thus, the occurrence of the sidelight phenomenon can be effectively prevented. In this description, in FIG. 29, the upper magnetic pole 27c is replaced with the upper magnetic pole 49, and the upper pole tip 27a is replaced with the upper pole tip 45a.

In the present embodiment, a connecting portion 27c (2) that extends at a right angle is located immediately behind the TH0 position of the tip portion 27a (1) of the upper pole tip 45a, and is located immediately behind the step surface 21. Since the intermediate portion 27a (2) is present, a sufficient magnetic volume is secured by these. Therefore, as in the case of the third embodiment, it is possible to effectively prevent the magnetic flux generated in the yoke portion 27c (1) from being saturated before reaching the tip portion 27a (1) of the upper pole tip 27a. Thus, it is possible to secure sufficient overwrite characteristics.

In this embodiment, since the upper pole tip 45a can be formed on a flat portion, a photoresist pattern can be formed by photolithography with high precision, and the tip of the upper pole tip 45a can be formed. The width of the portion 27a (1) can be reduced with an accuracy of 0.5 to 0.25 μm. Further, since the upper magnetic pole 49 can also be formed on the flat portion after the CMP polishing, high-precision patterning is possible for the same reason.

In this embodiment, the thick insulating film 4 made of alumina or the like is provided between the lower magnetic pole 7 and the thin-film coil 43.
2 and the thick insulating film 46 made of alumina or the like is formed between the recording gap layer 7 and the thin film coil 47, so that the dielectric strength between the thin film coil 43 and the lower magnetic pole 7 and the thin film The dielectric strength between the coils 43 and 47 can be increased, and the leakage of magnetic flux from the thin film coils 43 and 47 can be reduced.

[Fifth Embodiment] Next, FIGS.
With reference to FIG. 8, a method of manufacturing a composite thin film magnetic head as a method of manufacturing a thin film magnetic head according to a fifth embodiment of the present invention will be described. The thin-film magnetic head according to the present embodiment is embodied by the method for manufacturing a thin-film magnetic head according to the present embodiment, and will be described together. 36 to 38, (a) shows a cross section perpendicular to the air bearing surface, and (b) shows a cross section of the magnetic pole portion parallel to the air bearing surface. In these drawings, the same parts as those in the above embodiments are denoted by the same reference numerals.

In the method of manufacturing the thin-film magnetic head according to the present embodiment, the steps up to the step of forming the lower magnetic pole 7 in FIG. 36 are the same as those in FIG.
3 to the middle of FIG. 3, and the description is omitted.

In the present embodiment, when the formation of the lower magnetic pole 7 is completed as shown in FIG. 36, a lower pole tip 61a and a lower connecting portion 61b are formed on the lower magnetic pole 7 next. Here, the lower pole tip 41a is formed such that its tip on the air bearing surface side is near the MR (GMR) height zero position, and at the same time, the opposite side of the air bearing surface is the throat height zero position. To do. Here, an aggregate of the lower magnetic pole 7, the lower pole tip 61a, and the lower connecting portion 61b corresponds to one of "at least two magnetic layers" in the present invention.

Next, an insulating layer 62 made of an insulating material, for example, alumina and having a thickness of 3.0 to 4.0 μm is formed on the entire surface by sputtering, and then the surface is flattened by, for example, CMP to form a lower pole tip 61a. And lower connection 6
The surface of 1b is exposed.

Next, as shown in FIG. 37, the film thickness of the insulating material such as alumina is reduced to 0.1 by sputtering.
A recording gap layer 9 of 2 to 0.3 μm is formed. Subsequently, the recording gap layer 9 is patterned by photolithography to form an opening 9a for connecting the upper magnetic pole and the lower magnetic pole.

Next, on the recording gap layer 9, an upper pole tip 63a and an upper connecting portion 63b for magnetically connecting the upper magnetic pole and the lower magnetic pole are formed. At this time, the upper connection portion 63b is formed so as to overlap with and contact the lower connection portion 61b. On the other hand, the upper pole tip 63a is formed to extend rearward from the air bearing surface longer than the lower pole tip 61a. As in the case of the third embodiment (FIG. 28, etc.), the upper pole tip 63a has an intermediate portion 27a (2) for securing a magnetic volume and a tip portion for defining a track width. 27a (1) and a step surface 21 at these connecting portions. The planar shape of the upper pole tip 63a is a shape as shown in FIG. 28, FIG. 30, FIG. 31, or FIG. Further, the step surface 21 of the upper pole tip 63a is positioned slightly behind the position of the rear edge surface of the lower pole tip 61a (that is, the TH0 position).

Subsequently, using the upper pole tip 63a as a mask, the surrounding recording gap layer 9 and lower pole tip 61a are etched in a self-aligned manner to form a trim structure.

Next, for example, copper (Cu) is formed on the recording gap layer 9 in the concave region formed between the upper pole tip 63a and the upper connecting portion 63b by, for example, electrolytic plating.
1st layer thin film coil 6 for inductive recording head
4 is formed in a thickness of 1.5 to 2.5 μm. At this time, at the same time, the area behind the upper connection portion 63b (the area on the right side in the figure)
Next, a coil connection portion 64C for connecting the thin film coil 64 to a second layer thin film coil described later is formed.

Next, as shown in FIG. 38, an insulating layer 65 having a thickness of 3.0 to 4.0 μm made of an insulating material such as alumina is formed on the entire surface by a sputtering method, and then, for example, a CMP method. The surface of the upper pole tip 63a and the surface of the upper connection portion 63b are exposed.

Subsequently, the insulating layer 65 is selectively etched to form an opening 65a reaching the coil connection portion 64C.

Next, a second-layer thin-film coil 66 of, for example, copper (Cu) for an induction type recording head having a thickness of 1.5 to 2.5 μm is formed on the insulating layer 65 by, for example, electrolytic plating. Form. At this time, at the same time, a coil connection portion 66C that contacts the coil connection portion 64C via the opening 65a is formed.

Next, after a photoresist layer 67 is formed by high-precision photolithography so as to cover the thin film coil 66 and the coil connection portion 64C, the surface of the photoresist layer 67 is flattened and the thin film coil 6 is formed.
For insulation between layers 6, heat treatment is performed at a temperature of, for example, 250 ° C.

Next, using the same material as the upper pole tip 45a, for example, the upper magnetic pole 68 is selectively formed to a thickness of about 3 to 4 μm by a method such as an electrolytic plating method. At this time, part of the upper magnetic pole 68 overlaps with part of the upper pole tip 63a, and
The position of the edge surface 22 on the front side (air bearing surface side) is the position of the rear edge of the lower pole tip 61a (ie,
(TH0 position). Also,
The rear end of the upper magnetic pole 68 is set to reach the upper connecting portion 63b. Thus, the upper magnetic pole 68 is magnetically connected to the upper pole tip 63a and magnetically connected to the lower magnetic pole 7 via the upper connecting portion 63b and the lower connecting portion 61b. Here, the upper pole tip 6
3a, an assembly of the upper connection portion 63b and the upper magnetic pole 68 corresponds to "at least one magnetic layer" in the present invention,
Part of the recording gap layer 9 (part behind the TH0 position), the insulating films 62 and 65, and the photoresist layer 6
The assembly of No. 7 corresponds to the “insulating layer” in the present invention.

Finally, an overcoat layer 69 made of alumina and having a thickness of about 30 μm is formed by, for example, a sputtering method so as to cover the entire surface. Thereafter, the slider is machined to form an air bearing surface (ABS) of the recording head and the reproducing head, thereby completing the thin-film magnetic head.

In this embodiment, the same operation and effect as those in the third and fourth embodiments can be obtained.
That is, it is possible to control the width of the recording track on the recording medium accurately, effectively prevent the occurrence of the side write phenomenon, and secure sufficient overwrite characteristics.

In the present embodiment, since the upper pole tip 63a can be formed on a flat portion, a photoresist pattern can be formed with high precision by photolithography, and the tip of the upper pole tip 63a can be formed. The width of the portion 27a (1) can be miniaturized with an accuracy of 0.5 to 0.25 μm.

Although the present invention has been described with reference to some embodiments, the present invention is not limited to these embodiments, and various modifications are possible. For example, in each of the above-described embodiments and the modifications thereof, a method of manufacturing a composite type thin-film magnetic head has been described. The present invention can also be applied to a thin film magnetic head having an inductive magnetic transducer for both reading and writing. Also, the present invention
The present invention can also be applied to a thin film magnetic head having a structure in which the stacking order of the write element and the read element is reversed.

[0130]

As described above, the method of manufacturing a thin-film magnetic head according to any one of claims 1 to 12, or the method of manufacturing a thin-film magnetic head according to any one of claims 13 to 24. According to this, at least one of the two magnetic layers has a thickness of ± 0.5 μm with respect to the edge of the insulating layer closer to the recording medium from the recording medium facing surface facing the recording medium. A first magnetic layer portion extending to a predetermined position within the range and having a constant width that defines the width of the recording track; and a range of plus / minus 0.5 μm with respect to the above-mentioned edge of the insulating layer. Is magnetically connected to the first magnetic layer portion at a predetermined position, has a larger width and area than the first magnetic layer portion, and has a step in the width direction at a connection portion with the first magnetic layer portion. Second magnetic layer for forming And the step surface of the second magnetic layer portion in the connection portion is formed so as to form a plane orthogonal to the extending direction of the first magnetic layer portion. The width of the first magnetic layer portion can be accurately formed by suppressing the influence of unnecessary reflected light from the underlayer in the photolithography process at the time of formation, and the magnetic flux generated by the thin-film coil generates the first magnetic layer. Saturation in the second magnetic layer portion before flowing into the magnetic layer portion can be suppressed. Therefore, there is an effect that sufficient overwrite characteristics can be secured while the width of the first magnetic layer portion is reduced to, for example, a submicron region.

According to the method of manufacturing a thin film magnetic head of the present invention, at least a part of the second magnetic layer portion is disposed on the slope of the insulating layer. Therefore, even if the second magnetic layer portion is formed on the above-described slope, an adverse effect of an exposure state in a photolithography process for forming the first magnetic layer portion occurs. Thus, even if the corners of the steps in the width direction in the connection portion are relatively large rounded, it is possible to avoid a situation where the substantial width of the first magnetic layer portion varies. In other words, the width of the recording magnetic pole formed so as to reach the slope can be stabilized, which has been difficult in the past.

According to the thin-film magnetic head of the ninth aspect or the method of manufacturing the thin-film magnetic head of the twenty-first aspect, the third magnetic layer portion extends beyond the connection portion and is part of the first magnetic layer portion. Since the third magnetic layer portion in the overlapped portion has an edge surface on the side closer to the recording medium perpendicular to the extending direction of the first magnetic layer portion, the connecting portion Even if the corner of the step in the width direction is rounded, the width of the first magnetic layer portion that defines the recording track width of the recording medium is unaffected by the influence from the above-mentioned orthogonal portion to the tip portion. Is exactly constant over time. Therefore, according to the present embodiment, there is an effect that the recording track width of the recording medium can be accurately controlled.

According to the thin-film magnetic head of the tenth aspect or the method of manufacturing the thin-film magnetic head of the twenty-second aspect, the position of the end surface of the third magnetic layer portion is set to the recording medium in the insulating layer. The width of the first magnetic layer portion is accurately constant over the entire range of the so-called throat height, so that the width of the recording track of the recording medium can be more accurately adjusted. It has the effect of being able to control.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view for explaining one step in a method of manufacturing a thin-film magnetic head according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view for explaining a step following the step shown in FIG.

FIG. 3 is a cross-sectional view for explaining a step following the step shown in FIG. 2;

FIG. 4 is a cross-sectional view for explaining a step following the step shown in FIG. 3;

FIG. 5 is a cross-sectional view for explaining a step following the step shown in FIG. 4;

FIG. 6 is a cross-sectional view for explaining a step following the step shown in FIG. 5;

FIG. 7 is a cross-sectional view for explaining a step following the step shown in FIG. 6;

FIG. 8 is a plan view illustrating a planar structure of a completed thin-film magnetic head.

9 is a plan view illustrating a planar structure of an upper magnetic pole in the thin-film magnetic head illustrated in FIG.

FIG. 10 is an enlarged plan view of an upper magnetic pole for describing an operation of the thin-film magnetic head shown in FIG. 8;

FIG. 11 is an enlarged plan view of an upper magnetic pole for explaining an operation in a comparative example with respect to the thin-film magnetic head shown in FIG. 8;

FIG. 12 is a diagram showing overwrite characteristics of the thin-film magnetic head shown in FIG. 8 and a conventional thin-film magnetic head.

FIG. 13 is a plan view illustrating a modification of the upper magnetic pole of the thin-film magnetic head according to the first embodiment of the present invention.

FIG. 14 is a plan view illustrating another modification of the upper magnetic pole of the thin-film magnetic head according to the first embodiment of the present invention.

FIG. 15 is a plan view illustrating still another modification of the upper magnetic pole of the thin-film magnetic head according to the first embodiment of the present invention.

FIG. 16 is a cross-sectional view for explaining one step in the method of manufacturing the thin-film magnetic head according to the second embodiment of the present invention.

FIG. 17 is a sectional view for illustrating a step following the step shown in FIG. 16;

FIG. 18 is a sectional view for illustrating a step following the step shown in FIG. 17;

FIG. 19 is a sectional view illustrating a modification of the thin-film magnetic head according to the second embodiment of the invention.

FIG. 20 is a plan view illustrating a planar structure of an upper pole and an upper pole tip of the thin-film magnetic head according to the second embodiment of the present invention.

FIG. 21 is an enlarged plan view illustrating a planar structure of an upper pole tip illustrated in FIG. 20;

FIG. 22 is a plan view showing a modification of the upper pole tip shown in FIG.

FIG. 23 is a plan view illustrating a modification of the upper magnetic pole and the upper pole tip shown in FIG.

FIG. 24 is an enlarged plan view illustrating a planar structure of the upper pole tip illustrated in FIG. 23;

25 is a plan view illustrating another modification of the upper magnetic pole and the upper pole tip illustrated in FIG.

FIG. 26 is a plan view illustrating a modification of the upper magnetic pole and the upper pole tip in the thin-film magnetic head of the present invention.

FIG. 27 is a plan view illustrating another modification of the upper magnetic pole and the upper pole tip in the thin-film magnetic head of the present invention.

FIG. 28 is a plan view illustrating a planar structure of an upper pole and an upper pole tip of a thin-film magnetic head according to a third embodiment of the present invention.

FIG. 29 is an enlarged plan view of main parts of an upper magnetic pole and an upper pole tip shown in FIG. 28;

FIG. 30 is a plan view illustrating a modification of the upper pole and the upper pole tip of the thin-film magnetic head according to the third embodiment of the present invention.

FIG. 31 is a plan view illustrating another modification of the upper pole and the upper pole tip of the thin-film magnetic head according to the third embodiment of the present invention.

FIG. 32 is a plan view illustrating still another modification of the upper pole and the upper pole tip of the thin-film magnetic head according to the third embodiment of the present invention.

FIG. 33 is a cross-sectional view for explaining one step in the method of manufacturing the thin-film magnetic head according to the fourth embodiment of the present invention.

FIG. 34 is a sectional view following FIG. 33;

FIG. 35 is a sectional view following FIG. 34;

FIG. 36 is a cross-sectional view for explaining one step in the method of manufacturing the thin-film magnetic head according to the fifth embodiment of the present invention.

FIG. 37 is a sectional view following FIG. 36;

FIG. 38 is a sectional view following FIG. 37;

FIG. 39 is a cross-sectional view for explaining one step in the conventional method of manufacturing a thin-film magnetic head.

40 is a cross-sectional view for explaining a step following the step shown in FIG. 39.

FIG. 41 is a cross-sectional view for explaining a step following the step shown in FIG. 40.

FIG. 42 is a cross-sectional view illustrating a structure of a conventional thin-film magnetic head.

FIG. 43 is a cross-sectional view showing a cross section parallel to an air bearing surface in a conventional thin film magnetic head.

FIG. 44 is a plan view showing the structure of a conventional thin-film magnetic head.

FIG. 45 is a plan view showing a structure of an upper magnetic pole in a conventional thin-film magnetic head.

FIG. 46 is a plan view of an upper magnetic pole for describing a problem in miniaturizing the upper magnetic pole in a conventional thin-film magnetic head.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Insulating layer, 3 ... Lower shield layer, 4, 6 ...
Shield gap film, 5 ... MR film, 7 ... Lower magnetic pole, 8 ...
Insulating layer, 9 ... recording gap layer, 10, 12, 29, 3
5, 43, 47, 64, 66 ... thin film coil, 11, 1
3, 36, 67: photoresist layer, 17, 27c, 3
7, 49, 68,..., Upper magnetic pole, 17a, yoke part, 17
b: middle part, 17c: tip part, 18, 31, 38, 5
0, 69: overcoat layer, 20: air bearing surface, 21: step surface, 22: edge surface, 23: side edge surface, 25
... insulating film pattern, 27a, 45a, 63a ... upper pole tip, 27b ... magnetic path forming pattern, 27a (1) ... tip, 27a (2) ... middle, 27c (1) ... yoke, 2
7c (2) ... connection part, 28, 42, 46 ... insulating film, 30,
44, 48, 62, 65: insulating layer, 41a, 61a: lower pole tip, 41b, 61b: lower connecting portion, 45
b, 63b: upper connection portion; TH: throat height.

Claims (4)

[Claims] 1. A recording gap layer; an insulating film pattern disposed in a predetermined region of the recording gap layer near a recording medium so as to be in contact with the surface of the recording gap layer; First and second magnetic poles having two air poles having an air bearing surface facing each other and facing each other via the recording gap layer, and being magnetically connected to each other in a back gap region opposite to the air bearing surface. And a thin-film coil portion disposed between the first and second magnetic layers, wherein the first magnetic layer has a fixed width portion that defines a recording track width of the recording medium. A magnetic pole tip portion extending from the air bearing surface to a predetermined position on the insulating film pattern so as to be in contact with the recording gap layer and the insulating film pattern; A thin film configured to include a magnetic pole connection portion disposed in the back gap region so as to be in contact with the second magnetic layer, and a yoke portion for magnetically connecting the magnetic pole tip portion and the magnetic pole connection portion. A magnetic head, further comprising: an insulating film covering an inner surface of a concave space surrounded by the recording gap layer and the insulating film pattern, the magnetic pole tip portion, and the magnetic pole connection portion; The edge of the pattern on the recording medium side defines a reference position with respect to the air bearing surface, and the surface of the tip of the magnetic pole opposite to the recording gap layer and the end surface of the insulating film are flush with each other. A thin-film magnetic head characterized by being flattened. 2. The semiconductor device according to claim 1, further comprising: an insulating layer disposed so as to embed the thin-film coil portion in the recessed space covered by the insulating film. The surface of the insulating layer also includes the tip of the magnetic pole and the magnetic pole. A surface of the connection portion opposite to the recording gap layer,
2. The thin-film magnetic head according to claim 1, wherein the thin-film magnetic head is flattened so as to be flush with an end face of the insulating film. 3. A step of forming a recording gap layer, and a step of forming an insulating film pattern in a predetermined area of the recording gap layer near a recording medium so as to be in contact with the surface of the recording gap layer. A first and a second magnetic layer including two magnetic poles having an air bearing surface facing the recording medium and facing each other with the recording gap layer interposed therebetween, forming a back gap region opposite to the air bearing surface; And forming a thin-film coil portion between the first and second magnetic layers, and forming the first magnetic layer. An air bearing having a constant width portion defining a recording track width of the recording medium, and being in contact with the recording gap layer and the insulating film pattern; Forming a magnetic pole tip portion over a predetermined position on the insulating film pattern; forming a magnetic pole coupling portion in the back gap region so as to be in contact with the second magnetic layer; Forming a yoke portion for magnetically connecting the magnetic pole connection portion to the magnetic pole connection portion, further comprising: the recording gap layer and the insulating film pattern; the magnetic pole tip portion; Forming an insulating film so as to cover an inner surface of the concave space surrounded by the magnetic pole coupling portion; and a surface of the magnetic pole tip portion opposite to the recording gap layer, at least an end surface of the insulating film. Flattening so as to form the same plane. In the step of forming the insulating film pattern, the recording medium of the insulating film pattern is formed. Method of manufacturing a thin film magnetic head is characterized in that the edge of the side to form the insulating layer pattern to define a reference position with respect to the air bearing surface. 4. The method according to claim 1, further comprising: forming an insulating layer in the concave space covered with the insulating film to bury the thin-film coil portion. In the flattening step, the surface of the insulating layer also includes 4. The flattening of the magnetic pole tip portion and the magnetic pole connection portion so as to be flush with a surface opposite to the recording gap layer and an end surface of the insulating film. Of manufacturing a thin film magnetic head.